Manufacturing method for a microelectronic component arrangement and microelectronic component arrangement

Abstract

Manufacturing method for a microelectronic component arrangement (100) comprising the steps: A) Providing a sensor (2) with a first surface (21) and a second surface (22) opposite the first surface (21) and at least one side surface (23), wherein the first surface (21) has at least one detection surface (6) at least in some regions; B) applying a sacrificial material (8) to the first surface (21) of the sensor (2), wherein the at least one detection surface (6) is at least partially covered by the sacrificial material (8) and the sacrificial material (8) extends to the side surface (23) of the sensor (2); C) providing a carrier (1) with a mounting surface (11); D) electrically connecting the sensor (2) to the carrier (1), wherein the first surface (21) of the sensor (2) and the mounting surface (11) of the carrier (1) are spaced apart from one another by a distance (A); E) removing the sacrificial material (8), whereby the detection surface (6) is at least partially free of the sacrificial material (8).

Description

[0001] The present invention relates to a manufacturing method for a microelectronic component arrangement and a corresponding microelectronic component arrangement. State of the art

[0002] Microelectronic component assemblies, particularly media sensors, comprise a housing with an opening, wherein the opening in the housing allows access from the ambient atmosphere to a measuring element of the media sensor. The media sensors are glued or arranged on a carrier using a surface facing away from the housing. To protect the measuring elements from the ingress of water or dirt during the separation process of these packages, the openings in the housing are laminated with an adhesive film before the strip separation.

[0003] However, with the increasing miniaturization of such media sensor packages, manufacturing processes that do not require encapsulation are required. The problem here is that without encapsulation, the sensitive measuring elements cannot be effectively protected from environmental influences. This problem can be addressed, in particular, by using touch protection frames or by flip-chip mounting of the media sensor on a carrier, with the measuring element or detection surface facing the mounting surface. However, with flip-chip mounting, a gap (or "standoff") forms between the detection surface of the media sensor and the mounting surface of the carrier. This gap makes the detection surface freely accessible from the outside and can be damaged or contaminated, particularly during further processing.

[0004] DE 10 2009 057 697 A1 describes a method for producing electrode layers for chemical media sensors.

[0005] US 2014 / 0 264 653 A1 describes a manufacturing process for microelectronic components.

[0006] US 2013 / 0 193 530 A1 describes micromechanical or microelectronic component arrangements. Disclosure of the invention

[0007] The present invention provides a manufacturing method for a microelectronic component arrangement according to claim 1 and a corresponding microelectronic component arrangement according to claim 12.

[0008] Preferred further training is the subject of the respective subclaims. Advantages of the invention

[0009] The present invention enables subsequent access to a sensor's detection surface, for example, after separation or surface mounting. Using the manufacturing method for the microelectronic component described here, the detection surface is cost-effectively protected from damage or contamination before commissioning.

[0010] Although the manufacturing method for a microelectronic component arrangement described here is described with reference to a sensor and a carrier, it is self-evident that the manufacturing method described here is also applicable to the manufacture of microelectronic component arrangements comprising a plurality of sensors arranged on a carrier.

[0011] According to a preferred embodiment, the sacrificial material is removed during an additional annealing step or a selective etching process. This allows the sacrificial material to be removed simply and cost-effectively, while the detection area can be free of the sacrificial material. The additional annealing step can, for example, be carried out in a temperature range of 180°C to 200°C for 60 minutes. During the annealing step, the sacrificial material decomposes, for example, into the gas phase and can, in particular, be removed or pumped out of a process chamber.

[0012] According to a further preferred embodiment, the sacrificial material comprises a thermally decomposable polymer. The thermally decomposable polymer can, in particular, be a TDP (thermally decomposable polymer). Thus, the sacrificial material can be removed particularly efficiently after the sensor has been electrically connected to the mounting surface of the carrier, while materials used for electrically connecting the sensor to the carrier are not damaged.

[0013] According to a further preferred embodiment, the sacrificial material comprises a chemically decomposable material. This allows for a cost-effective selective etching process to be used to remove the sacrificial material.

[0014] According to a further preferred embodiment, the carrier comprises a laminate substrate or an integrated circuit. Thus, the manufacturing method described here can be applied to a wide range of carriers.

[0015] According to a further preferred development, the carrier comprises at least two through-contacts, wherein the through-contacts extend from the mounting surface to a surface opposite the mounting surface, and further solder balls are arranged on the surface, wherein the further solder balls are each in contact with the through-contacts at least in some areas. Thus, the microelectronic component arrangement can be further assembled using the additional solder balls by means of surface mounting. Furthermore, a plurality of through-contacts with corresponding additional solder balls on the surface is conceivable.

[0016] According to a further preferred development, the additional solder balls are arranged on the mounting surface. Thus, the additional solder balls allow the microelectronic component assembly to be further assembled using flip-chip assembly. In flip-chip assembly, the additional solder balls are configured such that the sensor of the microelectronic component assembly is vertically spaced from another carrier after flip-chip assembly.

[0017] According to a further preferred development, the sacrificial material is structured by photolithography. Structuring is preferably carried out by photolithography before the sensor is electrically connected to the mounting surface of the carrier. In other words, the sacrificial material is structured by photolithography before flip-chip assembly. In particular, structuring can be carried out such that the sacrificial material extends to the side surfaces of the sensor and is flush with the side surfaces. Alternatively, the sacrificial material can be flushed to flanks or edges of the side surface of the sensor during a singulation process of the carrier between two adjacent sensors, wherein the sacrificial material can be continuous at least between two sensors before the singulation process.Furthermore, the sacrificial material is structured in such a way that the detection surface can be completely covered by the sacrificial material. Furthermore, the detection surface can be further protected from high temperatures and etching media, for example, by silicon nitride passivation before the sacrificial material is applied. Silicon nitride passivation is particularly used in sensors used for pressure measurement.

[0018] According to a preferred embodiment, the electrical connection is made using solder balls and a mechanically stabilizing material. For example, the mechanically stabilizing material can be understood as an underfill material. In particular, the underfill material serves to provide a stable electrical connection while taking into account the different thermal expansion coefficients of the sensor and the substrate.

[0019] According to a further preferred embodiment, the electrical connection is achieved by a material-to-material bonding process. This allows for a particularly time-saving electrical connection. Furthermore, the material-to-material bonding process eliminates the need for additional underfill material.

[0020] According to a further preferred development, the bonding process is based on an ICA or NCA process. The ICA process (Isotropic-Conductive Adhesive) is based on an isotropic conductive adhesive. The NCA process (Non-Conductive Adhesive) is based on a non-conductive adhesive and uses so-called stud bumps, which can in particular comprise a gold wire, for electrical contact. This allows for time-saving electrical connection, with the temperatures required for curing generally being lower than with soldering, thus reducing the thermal load on the microelectronic component arrangement.

[0021] The features of the manufacturing process for the microelectronic component arrangement described here also apply accordingly to the microelectronic component arrangement and vice versa. Short description of the drawings

[0022] Further features and advantages of the present invention are explained below using embodiments with reference to the figures.

[0023] They show: Fig. 1 is a schematic vertical cross-sectional view for explaining a microelectronic component arrangement and a corresponding manufacturing method according to a first embodiment of the present invention; Fig. 2 is a schematic vertical cross-sectional view for explaining a microelectronic component arrangement and a corresponding manufacturing method according to a second embodiment of the present invention; Fig. 3 is a schematic plan view of a first surface of a sensor for explaining a manufacturing method of the microelectronic component arrangement; Fig. 4 is a further schematic plan view for explaining the manufacturing method of the microelectronic component arrangement; Fig. 5 a further schematic vertical cross-sectional view for explaining the manufacturing method of the microelectronic component arrangement according to Fig. 4; and Fig. 6 is a flowchart for explaining a sequence of the manufacturing process. Embodiments of the invention

[0024] In the figures, the same reference symbols denote the same or functionally identical elements.

[0025] Fig. 1 shows a schematic vertical cross-sectional view for explaining a microelectronic component arrangement and a corresponding manufacturing method according to a first embodiment of the present invention.

[0026] In Fig. 1, reference numeral 100 denotes a microelectronic component arrangement with a sensor 2, wherein the sensor 2 has a detection surface 6. Furthermore, in the Fig. 1 shows a carrier 1 with a mounting surface 11, wherein the sensor 2 is mounted on the carrier 1 by means of a mounting and connecting device such that the detection surface 6 is opposite the mounting surface 11 and an access 5 to the detection surface 6 is present between the detection surface 6 and the mounting surface 11, wherein the detection surface 6 is exposed at least in regions by the access 5 and the access 5 is at least in regions free of a material of the mounting and connecting device.

[0027] The assembly and connection device can be based on solder balls 7 and a mechanically stabilizing material 4. Alternatively, the assembly and connection device can be based on a material-to-material bonding process.

[0028] The Fig. The microelectronic component arrangement 100 shown in Figure 1 can be manufactured using a manufacturing method. A sensor 2 is provided with a surface 21 and a second surface 22 opposite the first surface 21, as well as at least one side surface 23, wherein the first surface 21 has a detection surface 6 at least in some regions. The detection surface 6 can, for example, have a quadrangular shape and be arranged centrally on the first surface 21. The detection surface 6 can be provided in particular for detecting pressure, humidity, and / or gases and can be part of a measuring element of the sensor 2. In other words, the sensor 2 described here can be a media sensor.

[0029] In a next step of the manufacturing method, a sacrificial material 8 is applied to the first surface 21 of the sensor 2, wherein the detection area 6 is at least partially covered by the sacrificial material and the sacrificial material 8 extends to at least one of the side surfaces 23 of the sensor 2. For example, in this method step, the sacrificial material 8 can cover the entire first surface 21 of the sensor 2, wherein the sacrificial material 8 can be structured by means of photolithography such that the sacrificial material 8 extends to two opposite side surfaces 23 and is flush with the edges or flanks of the side surfaces 23. In particular, the structuring by means of photolithography can expose regions that can be provided for electrically connecting the sensor to the mounting surface 11 of the carrier 1.

[0030] In a next process step, a carrier 1 with a mounting surface 11 is provided.

[0031] In a subsequent method step, the sensor 2 is electrically connected to the carrier 1, wherein the first surface 21 of the sensor 2 and the mounting surface 11 of the carrier 1 are spaced apart by a distance A - represented by the double arrow in the Fig. 1 - and in a final process step the sacrificial material 8 is removed, wherein the detection surface 6 becomes at least partially free of the sacrificial material 8.

[0032] In the Fig. 1, reference numeral 8 denotes the sacrificial material, which may be present in the access 5 before removal. This means that after removal of the sacrificial material 8, the access 5 and the detection surface 6 may be at least partially free of the material of the assembly and connection device. Fig. The microelectronic component assembly 100 shown in Figure 1 is based on electrical connection using solder balls 7 and a mechanically stabilizing material 4. Alternatively, the electrical connection can also be achieved using a material-to-material bonding process. ICA or NCA processes can be used for this purpose, in particular.

[0033] The carrier 1 with the mounting surface 11 can comprise an integrated circuit, wherein the electrical connection can be made by means of solder balls 7 or alternatively by the cohesive adhesive methods described here.

[0034] The carrier 1 can comprise at least two electrical through-contacts or vias 15. The through-contacts 15 extend from the mounting surface 11 to a surface 12 opposite the mounting surface 11. Further solder balls 7' are arranged on the surface 12, wherein the further solder balls 7' are in contact with the through-contacts 15 at least in some areas. As shown in

[0035] Fig. 1, the through contacts 15 and the additional solder balls 7' are laterally spaced from the sensor 2. The additional solder balls 7' on the surface 12 allow the microelectronic component arrangement 100 to be further installed in a simple manner.

[0036] Fig. 2 shows a schematic cross-sectional view for explaining a microelectronic component arrangement and a corresponding manufacturing method according to a second embodiment of the present invention.

[0037] The Fig. The microelectronic component arrangement 100 shown in Figure 2 is based on the Fig. 1, with the difference that the additional solder balls 7' are arranged on the mounting surface 11 of the carrier 1 and thus no through-contacts are required. In other words, the solder balls 7' and the sensor 2 are as in Fig. 2, are arranged on the mounting surface 11, with the solder balls each laterally spaced from the sensor 2. Thus, the microelectronic component assembly 100 can be further assembled using flip-chip assembly. Furthermore, vertical integration of the microelectronic component assembly 100 can be simplified.

[0038] Fig. 3 shows a schematic plan view of a first surface of a sensor for explaining a manufacturing method of the microelectronic component arrangement.

[0039] In Fig. 3, reference numeral 21 denotes the first surface of the sensor 2 and reference numerals 23 denote corresponding side surfaces of the sensor 2. As in the Fig. 2, the detection surface 6 can have a quadrangular shape and be formed centrally on the first surface 21. Furthermore, it is conceivable that the surface 21 has a plurality of detection surfaces 6, whereby in particular the sensitivity of the sensor 2 can be increased. The detection surface 6 can in particular be a component of a measuring element of the sensor 2. The arrangement of the solder balls 7 can be as in Fig. 2, parallel to two opposite side surfaces 23 of the sensor 2. An area intended for forming the gap 5 is preferably free of locations intended for electrically connecting the sensor 2 to the mounting surface 11 of the carrier 1. In other words, the areas, or the area to which the sacrificial material 8 is applied, are free of electrical connection points.

[0040] Fig. 4 shows a further schematic plan view for explaining the manufacturing method of the microelectronic component arrangement.

[0041] The Fig. 4 is based on the Fig. 3 shows a plan view of the first surface 21 of the sensor 2, with the difference that the sacrificial material 8, which can be structured by photolithography, covers the detection surface 6. Furthermore, the sacrificial material 8 is structured such that the sacrificial material 8 is flush with the side surfaces 23 of the sensor 2. For example, the sacrificial material can be strip-shaped, with the ends of the strip being flush with the side surfaces 23 of the sensor 2. Alternatively, it would be conceivable for the sacrificial material to be structured such that the sacrificial material is cross-shaped. In this case, the solder balls 7 are preferably formed accordingly in the corner regions of the first surface 21 of the sensor 2.

[0042] The sacrificial layer material 8 is at least partially removed from the detection surface 6 in a later process step.

[0043] Fig. 5 shows a further schematic vertical cross-sectional view for explaining the manufacturing method of the microelectronic component arrangement according to Fig. 4.

[0044] Fig. 5 shows a schematic side view of the sensor 2 before the flip-chip mounting of the sensor 2 onto the mounting surface 11 of the carrier 1. As in Fig. 5, the solder balls 7 are designed such that after the substrate 2 has been applied to the mounting surface 11 of the carrier 1, the first surface 21 of the sensor 2 and the mounting surface 11 of the carrier 1 are spaced apart from one another by a distance A (cf. Fig. 1).

[0045] Fig. 6 shows a flowchart for explaining a procedure of the manufacturing method.

[0046] As in the Fig. 6, the manufacturing method for the microelectronic component arrangement 100 comprises steps A to E, after which, in step A, a sensor 2 is provided with a first surface 21 and a second surface 22 opposite the first surface 21, as well as at least one side surface 23, wherein the first surface 21 has a detection surface 6 at least in some regions. In a next step B, a sacrificial material 8 is applied to the first surface 21 of the sensor 2, wherein the detection surface 6 is at least partially covered by the sacrificial material 8 and the sacrificial material 8 extends to the side surface 23 of the sensor 2. In step C, a carrier 1 with a mounting surface 11 is further provided. Thereafter, in step D, the sensor 2 is electrically connected to the carrier 1, wherein the first surface 21 of the sensor 2 and the mounting surface 11 of the carrier 1 have a distance A from one another.Subsequently, in step E, the sacrificial material 8 is removed, whereby the detection surface 6 becomes at least partially free of the sacrificial material 8.

[0047] In other words, the selective removal of the sacrificial material 8 occurs after flip-chip assembly. The electrical connection can be made by means of flip-chip assembly with the solder balls 7 and the mechanically stabilizing material 4 or by a material-to-material bonding process.

[0048] Furthermore, steps A to E run in the manner described in Fig. 6 shown order.

[0049] The design of the sacrificial layer 8 up to the side surface 23 serves, for example, to enable access for the removal of the sacrificial layer 8 in the applied state of the sensor 2 on the carrier 1. This arrangement thus enables lateral access to the sacrificial material, even after underfilling, as is the case in the Fig. 1 and Fig. 2 is shown.

Claims

[1] Manufacturing method for a microelectronic component arrangement (100) comprising the steps: A) Providing a sensor (2) with a first surface (21) and a second surface (22) opposite the first surface (21) and at least one side surface (23), wherein the first surface (21) has at least one detection surface (6) at least in some regions; B) applying a sacrificial material (8) to the first surface (21) of the sensor (2), wherein the at least one detection surface (6) is at least partially covered by the sacrificial material (8) and the sacrificial material (8) extends to the side surface (23) of the sensor (2); C) providing a carrier (1) with a mounting surface (11); D) electrically connecting the sensor (2) to the carrier (1), wherein the first surface (21) of the sensor (2) and the mounting surface (11) of the carrier (1) are spaced apart from one another by a distance (A); E) removing the sacrificial material (8), whereby the detection surface (6) is at least partially free of the sacrificial material (8). [2] Manufacturing method according to claim 1, wherein the removal of the sacrificial material (8) takes place during an additional annealing step or a selective etching process. [3] Manufacturing method according to one of the preceding claims, wherein the sacrificial material (8) comprises a thermally decomposable polymer. [4] Manufacturing method according to one of the preceding claims, wherein the sacrificial material (8) comprises a chemically decomposable material. [5] Manufacturing method according to one of the preceding claims, wherein the carrier (1) comprises a laminate substrate or an integrated circuit. [6] Manufacturing method according to claim 5, wherein the carrier (1) comprises at least two through-contacts (15), wherein the through-contacts (15) extend from the mounting surface (11) to a surface (12) opposite the mounting surface (11) and further solder balls (7') are arranged on the surface (12), wherein the further solder balls (7') are each in contact with the through-contacts (15) at least in some areas. [7] Manufacturing method according to one of claims 5 or 6, wherein the further solder balls (7') are arranged on the mounting surface (11). [8] Manufacturing method according to one of the preceding claims, wherein the sacrificial material (8) is structured by means of photolithography. [9] Manufacturing method according to one of the preceding claims, wherein the electrical connection is carried out by means of solder balls (7) and a mechanically stabilizing material (4). [10] Manufacturing method according to one of claims 1 to 8, wherein the electrical connection is carried out by a material-to-material adhesive process. [11] Manufacturing method according to claim 10, wherein the cohesive bonding process is based on an ICA or NCA process. [12] Microelectronic component arrangement (100) comprising: a sensor (2), wherein the sensor (2) has at least one detection surface (6); a carrier (1) with a mounting surface (11); wherein the sensor (2) is mounted on the carrier (1) by means of a mounting and connecting device such that the detection surface (6) is opposite the mounting surface (11) and the sensor (2) and the carrier (1) are electrically connected, and an access (5) to the detection surface (6) is provided between the detection surface (6) and the mounting surface (11), wherein the detection surface (6) is exposed at least in regions by the access (5) and the access (5) is at least in regions free of a material of the assembly and connection device. [13] Microelectronic component assembly (100) according to claim 12, wherein the assembly and connection means is based on solder balls and a mechanically stabilizing material. [14] Microelectronic component arrangement (100) according to claim 12, wherein the assembly and connection device is based on a material-to-material adhesive process.

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