Thermomanagement Modul

Abstract

Thermal management module (1), in particular for an electrically powered motor vehicle, comprising at least one module carrier (2), with at least one connection flange (5,5',5'',5'''), wherein - the at least one module support (2) is formed from a first and a second cover plate (3,3') which close off the at least one module support (2) at the top and bottom, - at least one first channel plate (4) is arranged between the first and second cover plate (3,3'), wherein the at least one first channel plate (4) enables at least one internal fluid guidance, - which have at least one first channel plate (4) channels (10) and the first and second cover plates (3, 3') each have at least one opening (11), - at least one second channel plate (4') is arranged between the first cover plate (3) and the second cover plate (3'), - the first channel plate (4) and the at least second channel plate (4') have channels (10) of the same shape or channels (10) of different shapes, and - the channels (10) formed in the first channel plate (4) and the at least second channel plate (4') form at least a first and a second heat-exchanging fluid guide (16, 17) which enable heat exchange with each other, characterized by that turbulence-generating structures (18) are arranged in at least one of the first and second heat-exchanging fluid channels (16, 17).

Description

[0001] The invention relates to a thermal management module, in particular for an electrically powered motor vehicle, according to the preamble of the independent patent claim.

[0002] Previous thermal management modules use a component carrier, which serves as the central component and houses the components installed in the thermal management module. This carrier may also include channels for fluid flow.

[0003] DE 10 2021 203 031 A1 shows a thermal management module comprising a component carrier on which components such as a heat exchanger, sensors, collecting tanks, and valve devices are arranged. The component carrier may also include channels for fluid flow. The component carrier has a complex design and is, for example, molded from a plastic or formed as a forged or cast component. Any fluid-carrying channels can only be manufactured using complex cores or by constructing a complex, multi-part component.

[0004] WO 2020 / 174705 A1 shows a thermal management module for a heat pump system with a compact integrated structure of refrigerant control elements, wherein refrigerant channels are formed by stacked laminated metal plates with recesses.

[0005] US 2022 / 0388374 A1 shows a refrigerant distribution block with a structure of individual plates stacked one above the other in which fluid channels are formed, with additional elements such as valves and a compressor being arranged on the refrigerant distribution block.

[0006] CN 217197694 U shows a fluid distribution block with fluid channels, which is constructed from various plates stacked on top of each other.

[0007] WO 2022 / 210382 A1 shows a fluid distribution unit with a plate-shaped fluid distribution block having openings and fluid channels and formed by plates provided with recesses stacked on top of one another.

[0008] The present invention therefore addresses the problem of forming a thermal management module that includes a module carrier made of simply shaped components and thus creates a load-bearing, cost-effective and easy-to-manufacture module carrier on which all necessary components can be mounted.

[0009] The thermal management module according to the invention with the features of the independent patent claim has the advantage that, by using simple sheet metal components produced by punching, embossing and / or a jet cutting process, a module carrier is formed which, on the one hand, is simple in design and inexpensive to produce and, on the other hand, creates a solid and stable base for functionally accommodating components of the thermal management module.

[0010] So-called thermal management modules are devices designed to transport and distribute heat, particularly in electric vehicles. Electric vehicles, in particular, rely on particularly efficient thermal management within the vehicle, as any heat loss also reduces the vehicle's range. Therefore, simply constructed thermal management modules that still fulfill all the necessary technical functions are particularly in demand.

[0011] These thermal management modules typically contain a variety of components such as pumps, valves, and heat exchangers. In addition, such a thermal management module typically contains a variety of sensors, particularly pressure and temperature sensors, which generate sensor data. The heat exchanger can, for example, be a chiller or indirect condenser for heat exchange between a refrigerant and a coolant. However, other types of heat exchangers are also conceivable for transferring heat from one fluid flowing into the thermal management module to another fluid. A coolant can be used as the fluid, for example, water and an antifreeze such as glycol. However, low-viscosity oil is also conceivable as a coolant.The thermal management module can also include one or more refrigerants, for example well-known refrigerants such as R1234yf, R134a but also gaseous refrigerants such as carbon dioxide (R744), propane (R290) or butane (R600).

[0012] The thermal management module according to the invention consists of at least one module carrier which contains at least one connection flange. The components required for the operation of the thermal management module are mounted on the module carrier. These can be, for example, valve devices which regulate the inflow and outflow of fluids through the thermal management module, or sensors which can be used to measure pressures and temperatures in the fluid circuits, or pumps which can be used to convey coolants, or collectors which can serve as reservoirs for coolants or refrigerants, or heat exchangers which can be used to exchange heat between fluids. For example, a chiller can act as a heat exchanger to exchange heat between a refrigeration circuit and a cooling circuit, or a so-called internal heat exchanger can be used to recover heat from the return flow of a cooling circuit.

[0013] The components can be mounted on connection flanges located on the module carrier. Connection to the connection flanges requires different sealing and fastening requirements for each component. Since the connections are not formed directly on the module carrier, but rather via attachable connection flanges, the connection flanges can be customized to the components and reused multiple times, even with different thermal management modules.

[0014] This allows more than one connection flange to be arranged on the module carrier. In particular, it is particularly advantageous to provide the necessary number of connection flanges required to accommodate all components. However, connecting a component is also conceivable without the use of a connection flange, for example, if the necessary connection requirements can be met directly by the module carrier itself. A heat exchanger could also be mounted directly to the module carrier. The assembly itself could be carried out using self-tapping screws, for example. The module carrier only needs to have suitable holes for this purpose. The seal between the heat exchanger and the module carrier must be ensured by suitable sealing surfaces and sealants.

[0015] The module carrier features internal fluid guides to enable suitable fluidic connection of the components mounted on the module carrier and to implement appropriate interconnections of fluid circuits with the valve devices. The type of interconnection and design of the fluid guides depends on the specific application of the thermal management module and is specified accordingly for each type of thermal management module to be manufactured.

[0016] However, it is also conceivable for the thermal management module to be constructed from several module carriers that are firmly connected to one another. This could result in a particularly flexible thermal management module design or other properties, such as the creation of a predetermined breaking point.

[0017] A module carrier is formed from a first and a second cover plate and at least one channel plate arranged between them. The cover plates close off the module carrier at the top and bottom and thus delimit it. The cover plates also serve as receptacles for connection flanges and for the direct mounting of components. The at least one connection flange is arranged on the first or second cover plate. More than one channel plate can also be arranged. The channel plates form internal fluid guides in the module carrier and thus enable the distribution of fluids within the thermal management module. The channel plates and cover plates can be firmly connected to one another. Preferably, several channel plates are arranged between the cover plates. The side surfaces of the cover plates and channel plates form the side surfaces of the module carrier, so that the module carrier is spatially delimited by the cover plates and the side surfaces of the individual plates.

[0018] To join the cover and channel plates together, the use of a soldering process such as vacuum soldering or the soldering process known under the brand name Nocolok is conceivable. Pre-soldered sheets are particularly preferred for this purpose; depending on the soldering process used, these sheets only need to be coated with a solder flux to enable a defined solder joint. However, it is also conceivable that the cover and channel plates could be joined using an adhesive process. For this purpose, an adhesive layer is applied to the cover and / or channel plate, and the composite is securely bonded using heat. The adhesive layer can be applied to a laminated film or as a liquid adhesive.

[0019] At least the first cover plate and the channel plates are made of a sheet metal material. This is preferably aluminum, especially a material with solderable properties. However, it is also conceivable for a cover plate or channel plate to be made of a plastic.

[0020] Particularly advantageously, the cover plates and channel plates are made of a predominantly flat sheet. "Predominantly flat" means that the vast majority of the surface is aligned in one plane, and any local elevations that serve a special function do not affect the flatness of the sheets.

[0021] The cover plates are particularly advantageously stacked one on top of the other with their entire surface. This means that the flat sheets, each one completely overlapping at least towards one side of the sheet, form a single level of the module carrier. The stack with the successive individual layers thus forms the structural unit of the at least one module carrier. The outer edges of the sheets form the outer surface of the at least one module carrier. This advantageous design is not impaired if individual sheets, for example one of the cover plates, projects beyond the stack in terms of surface area. This can create a fastening option using a type of flange, for example by having the cover plate project all the way around or only partially. Appropriate fastening holes can be made in the sheet.The overhanging sheet always completely covers at least one of the sheets stacked below. A overhanging sheet could also be conceivable in the middle of the stack; even several sheets stacked one above the other could have an overhang, thus forming a particularly stable flange.

[0022] The first and second cover plates have at least one opening. The cover plates preferably have the number of openings required for the supply and discharge of the fluids to be distributed in the thermal management module. Components and / or connection flanges are provided at these openings. Connection points for connecting hose lines that distribute fluids to other components in the vehicle to the thermal management module can also be provided. The openings can be round or have a shape adapted to the connection flange, deviating from the circular cross-section.

[0023] The channel plates can have channels formed in the sheet metal. These can be produced, for example, by punching or by a jet cutting process such as laser or waterjet cutting, or by other mechanical processing. The channels are distributed across the channel plates as required and can take on various shapes.

[0024] The channels form fluid guides through the stack structure and the cover plates, connecting the openings in the cover plates to the cooling and refrigeration circuits required for the vehicle's operation. Depending on the required operating mode, valve devices arranged in the thermal management module can also be directly coupled to various fluid circuits or indirectly coupled via heat exchangers. Very complex channel layouts are conceivable.

[0025] The channel plates can be of a similar shape. The number of channel plates determines the height of the fluid flow and thus the flow cross-section. However, the channel plates can also have different channel geometries across the stack height. This makes it conceivable to design fluid flow paths that extend over multiple levels or even intersect. Varying cross-sections can also be created, which can be achieved when using gaseous refrigerants, which expand during condensation, for example, and thus require a larger cross-section along the fluid flow path.

[0026] It is also conceivable that the channels in the channel plates are shaped and arranged in such a way that the fluid guides formed thereby achieve heat exchange between two fluids. This can then, for example, realize the function of an internal heat exchanger within the module carrier and thus replace a separate externally mounted heat exchanger. In this way, two fluid guides could be designed directly adjacent within a plane, with only a thin separating wall between them. In this way, heat exchange between these two fluid guides can be achieved. If a first fluid is now guided through the first fluid guide, this heat can be transferred to the second fluid in the second fluid guide.Depending on the application, the first and second fluids are taken from the same fluid circuit and thus represent the same fluid, just at different temperature levels, as would be the case with an internal heat exchanger, for example. However, heat exchange between two different fluids is also conceivable.

[0027] In a further advantageous embodiment, a channel can be formed in one or more channel plates which does not serve to conduct fluid. This channel can be filled with a vacuum, air, or another gas. The channel is therefore not connected to a component which can conduct fluid, in particular not to an opening in a cover plate which is equipped with a fluid connection or connection flange. A channel formed in this way can have a heat-insulating effect and thus advantageously thermally separate two fluid guides in the channel plates. In this way, a first fluid with a higher temperature level can be advantageously thermally separated from a second fluid with a lower temperature level. Undesired heat transfer can thus be avoided.

[0028] Instead of being arranged side by side, the two fluid guides could also be arranged at different levels, i.e., one above the other. It would also be conceivable for the fluid guides to run side by side and one above the other, thus enabling advantageous heat exchange. If the fluid guides are also arranged offset from each other in such a configuration, a particularly advantageous internal heat exchanger could be realized.

[0029] Turbulence-generating structures could be incorporated into the channels to improve heat transfer by generating turbulence. Separate, appropriately shaped sheet metal inserts could be used for this purpose. It would also be conceivable to create turbulence beneficial for heat transfer by appropriately designing the channels or by imprinting turbulence-generating structures into the sheets that enclose the fluid guides, which could be the cover plates or differently shaped channel plates.

[0030] The sheets used for the cover plates and channel plates can have a thickness of 1 mm to 7 mm. In a particularly preferred embodiment, the sheet thickness can be in the range of 2 mm to 4 mm. Such a sheet thickness can still be easily processed using conventional punching machines, without the need for special machines that can process thicker sheets. In particular, sheets that can be delivered rolled up on a reel by the sheet manufacturer can then also be used. This saves storage space and significantly simplifies processing and transport. Furthermore, with a sheet thickness of 4 mm, for example, a sufficiently high fluid flow in the module carrier can be achieved with just a few channel sheets.

[0031] Components such as heat exchangers or connecting flanges can be arranged directly at the openings in the cover plates. These connecting flanges are firmly connected to the cover plate and can have the functional surfaces required to accommodate the components, such as sealing surfaces for O-ring seals or connecting threads or screw threads for fastening the components. The connecting flanges are machined, pre-formed components, or made from solid material. The connecting flanges are preferably made of a metallic or plastic material. If the connecting flanges are to be soldered to the cover plate, a solderable metallic material must be used. A connecting flange made of plastic or metal can also be glued to the cover plate. One or more connecting flanges can also be connected to the module carrier using other mechanical connections such as screws.Which type of connection is used depends on the specific design of the thermal management module.

[0032] In another embodiment, it is also conceivable that, to produce the module carrier, the connecting flanges are provided in a composite with the cover plates and the channel plates and then soldered or glued together as a complete unit. In another embodiment, it would even be conceivable to also include the heat exchangers that have not yet been soldered and then join the entire assembly, including the module carrier, connecting flanges, and heat exchanger, together in a soldering process in a soldering furnace.

[0033] The second cover plate could also be made of plastic and glued or screwed to the last channel plate. This allows the simple structure of the module carrier and the simple design of the channels in the module carrier to be combined with a more complex plastic component that allows for the assembly of numerous components. Such a plastic component could, for example, also contain the coolant manifold.

[0034] In a further embodiment according to the invention, the cover plates can have either an inward-facing or outward-facing collar at the openings. With such a collar on an opening, for example in the case of an outward-facing collar, a centering option for the connecting flange or sealing surfaces for sealing the connecting flange and / or components to be mounted can be created. The collar creates a vertically longer contact surface for an O-ring seal, for example, for which the pure plate thickness of the cover plate would not be sufficient. An opening formed by the stack of cover plate and channel plate cannot usually be used due to the increased demands on the surface of the sealing surface for seals. The collar thus offers a simple way of creating such functional surfaces. An inward-facing collar can be used as a functional sealing surface.For example, in such a configuration, it would be conceivable to use the collar to seal a gasket-equipped mounting stud of a heat exchanger mounted directly on the channel plate. The collar could also be used to position the cover plate relative to the channel plate.

[0035] In a further embodiment of the invention, the cover plates can have alignment elements. These alignment elements can be used to position and align connecting flanges or components to be mounted on the cover plate. The alignment elements can be formed by stamping, toxing, punching, or other forming processes. It would also be conceivable to attach pins as additional components to the cover plate using a type of riveting or welding process to form alignment elements. In a particularly advantageous manner, for example, using a collar on an opening and one or two alignment elements, a connecting flange or a component can be arranged in an absolutely defined manner on the cover plate and thus on the module carrier.

[0036] A method for manufacturing a thermal management module provides a first cover plate and stacks at least a first and a second channel plate onto the first cover plate, and closes the stack with a second cover plate. At least a first and a second connection flange are also arranged on the first cover plate in the region of a first and a second opening.

[0037] The raw module carrier formed by stacking is then either soldered or glued in a furnace. In the case of soldering, the sheets of the cover and channel plates were pre-coated with a flux if necessary. The flux can be applied selectively to the areas where soldering is to take place. In the case of glueing, the sheets of the cover and channel plates were pre-coated with an adhesive in the form of an adhesive film or an adhesive coating. The heat input bonds the composite to form a ready-to-assemble module carrier, to which the remaining components of the thermal management module can be mounted. These could be, for example, a sensor and a valve device. In addition, a heat exchanger can also be mounted on the cover plate opposite the flanges. It is conceivable that heat exchangers are also arranged on the first cover plate and connecting flanges on the second cover plate.The possible variations and application examples cannot be presented exhaustively here.

[0038] Further advantageous embodiments of the invention are described in the following figures. These show: Fig. 1 a thermal management module according to the invention, Fig. 2 the module carrier of a thermal management module according to the invention in exploded view without attached components, Fig. 3 a thermal management module according to the invention in a sectional view, Fig. 4 an exemplary channel plate with heat-exchanging fluid guides.

[0039] The Fig. 1 shows an embodiment of a thermal management module 1 according to the invention. The thermal management module consists of a module carrier 2, on which the various functional components of the thermal management module 1 are mounted. The module carrier 2 consists of a first cover plate 3 and several channel plates 4, 4' and is closed off with a second cover plate 3'. The cover plates 3, 3' and channel plates 4, 4' are stacked on top of one another and form a composite. The cover plates 3, 3' and channel plates 4, 4' are formed from flat metal sheets containing openings and channels. The openings, which are not visible in this figure, enable the connection of connection flanges 5, 5', 5'', 5''' arranged on the module carrier 2, as well as directly arranged components, such as heat exchangers 8, 8'.

[0040] Components such as sensors 9, valve devices 7, and collectors 6 are mounted on the connecting flanges 5, 5', 5'', 5'''. A connecting flange 5, 5', 5'', 5''' can also serve as a connection point for a coolant or refrigerant line to convey the fluids to the rest of the vehicle. The connecting flanges 5, 5', 5'', 5''' are designed in such a way that the components to be attached to them can be accommodated precisely and tightly. This allows the connecting flanges 5, 5', 5'', 5''' to be used in other versions of a thermal management module 1 and to be manufactured cost-effectively in large quantities. The connecting flanges 5, 5', 5'', 5''' and also the cover plates 3, 3' and channel plates 4, 4' can be soldered or glued together. It is also conceivable that individual components or a single connecting flange 5.5', 5'', 5''' is also mounted by another mechanical connection, in particular by screwing.For this purpose, the module carrier 2 can have predetermined openings or holes into which self-tapping screws can then be screwed.

[0041] The heat exchangers 8, 8' are in the Fig. 1, the heat exchanger 8, 8' is arranged on the cover plate 3' opposite the connecting flanges 5, 5', 5'', 5'''. However, any other arrangement of the connecting flanges 5, 5', 5'', 5''' and heat exchangers 8, 8' on the cover plates 3, 3' is also conceivable. The multitude of possible combinations cannot be exhaustively presented here.

[0042] The Fig. 2 shows the module carrier of a thermal management module 1 according to the invention in an exploded view. The components mounted on the module carrier 2, such as heat exchangers 8, 8', valve devices 7, pumps, collectors 6 and sensors 9, are not shown. The module carrier consists of a first cover plate 3 which has a plurality of openings 11. These openings 11 serve as connection points for directly mounted components or for connection flanges 5, 5', 5'', 5'''. The connection flanges 5, 5', 5'', 5''' are positioned on the first cover plate 3 and then soldered and / or glued as a whole to the module carrier 2. The aim is to create suitable connection points on the cover plate 3 made from sheet metal, for example for valve devices 7, pumps, sensors 9, collectors 6. Once the module carrier 2 has been completely soldered or glued, the components can be mounted on these connecting flanges 5, 5', 5'', 5''' with the required tightness and strength.The connecting flanges 5, 5', 5'', 5''' therefore provide additional functional surfaces, necessary fastening threads, and screw threads. The connecting flanges 5, 5', 5'', 5''' can be pre-formed and machined components or machined from a solid material. The connecting flanges can be extruded aluminum profiles, or forged or sintered parts. The connecting flanges 5, 5', 5'', 5''' are preferably made of a metallic material, and in the case of soldering, also of a solderable metallic material. However, it is also conceivable for a connecting flange 5, 5', 5'', 5''' to be made of a plastic material and glued to the cover plate 3.

[0043] The advantage of using connection flanges for components is that the connection flange for a component can be used in differently designed module carriers. This allows components that are used in the same way in different thermal management modules, such as valves or sensors, to be used universally. The differently shaped cover plate simply receives the appropriate connection flange, and the component can be mounted. This makes the connection flange particularly advantageous for large-scale production.

[0044] Channel plates 4, 4' are arranged beneath the first cover plate 3. As many channel plates 4, 4' can be used as necessary to achieve the desired function. The channel plates 4, 4' are closed off on the opposite side of the first cover plate 3 by the second cover plate 3'. This forms a stack that yields the module carrier 2. The cover plates 3, 3' and channel plates 4, 4' can be soldered and / or glued. Channels 10 formed in the channel plates 4, 4' thus form fluid-tight fluid guides, which can fluidically connect components arranged on the module carrier 2 through further channels 10 or openings 11 in the channel plates 4, 4' and cover plates 3, 3'. In the simplest case, the channel plates are of the same shape, so that the number of stacked channel plates determines the height of the fluid guide in the channels 10.However, it is also conceivable that channel plates with different channels 10 are formed in the stack, thus creating complex fluid guides across multiple levels within the module carrier 2. The channel plates 4, 4' can be made of sheet metal that is punched or formed accordingly using a tool. For large quantities, a punching tool is used, but for smaller quantities, cutting using a jet tool such as a laser or waterjet cutter could also be used. This enables cost-effective production of the corresponding channel plates in any situation. The layered structure and the secure connection of the stack by soldering or gluing creates a flexibly designed module carrier 2 that is highly rigid and cost-effective to manufacture. The sheets used can have a sheet thickness of 1 mm to 7 mm.In a particularly preferred embodiment, the sheets have a sheet thickness of 2 mm to 4 mm.

[0045] The Fig. 3 shows a thermal management module 1 according to the invention in a sectional view. The section is through the module carrier 2, showing the exemplary structure of the module carrier 2 and the positioning of the connecting flanges 5, 5', 5'', 5''' and the assembly of the heat exchangers 8, 8'. The first cover plate 3 has at least one opening 11'. The opening has an outwardly directed collar 13. This collar serves here to position the connecting flange 5'. In addition, the first cover plate 3 has alignment elements 14, 14', which can also be used to position a connecting flange 5, 5', 5'', 5'''. In combination with a collar 13 or another alignment element 14, 14', the position of a connecting flange 5' can thus be precisely fixed. The alignment elements 14, 14' can be formed by embossing, punching, toxing, pushing, or another forming operation. The channel plates 4, 4' can have a projection 20.

[0046] The second cover plate 3' can have an inwardly directed collar 12 at the opening 11. This can serve to position the cover plate 3' relative to a channel plate 4, 4' and / or form a sealing surface 15. Since the cover plate 3' is formed from a sheet metal and the wall formed by the opening 11 in the sheet metal is not sufficiently large to serve as a contact surface for a seal, for example, for the fluid-tight assembly of a heat exchanger 8, 8', a sufficient sealing surface 15 can thus be created cost-effectively.

[0047] The Fig.4 shows an exemplary channel plate 4, 4' provided with multiple channels 10. Two of the channels form a first heat-exchanging fluid guide 16 and a second heat-exchanging fluid guide 17. The fluid guides 16, 17 are designed here such that they run alongside one another and are guided in a zigzag pattern toward one another. This ensures good heat exchange. A wall that is as thin as possible between the two heat-exchanging fluid guides 16, 17 ensures good heat transfer. The wall is designed such that a fluid-tight seal between the heat-transferring first and second fluid guides 16, 17 is possible. Other designs are possible and cannot be exhaustively illustrated here.

[0048] In this configuration, turbulence-generating structures 18 are also shown, which can be inserted as separate components into the heat-transferring fluid guides 16, 17 or can also be formed in the channel plates 4, 4' or cover plates 3, 3'. List of reference symbols 1 thermal management module 2 module carriers 3.3' cover plate 4.4' channel plate 5.5', 5'', 5''' connecting flanges 6 collectors 7 Valve device 8.8' heat exchanger 9 Sensor 10, 10' channel 11 Opening 12 Internal waistband 13 Outer waistband 14.14' alignment element 15 Sealing surface 16 first heat-exchanging fluid guide 17 second heat-exchanging fluid guide 18 Turbulence-generating structure 19 outdoor areas 20 overhang

Claims

[1] Thermal management module (1), in particular for an electrically driven motor vehicle, comprising at least one module carrier (2), with at least one connecting flange (5, 5', 5'', 5'''), wherein - the at least one module carrier (2) is formed from a first and a second cover plate (3, 3') which close off the at least one module carrier (2) at the top and bottom, - at least one first channel plate (4) is arranged between the first and second cover plates (3, 3'), wherein the at least one first channel plate (4) enables at least one internal fluid guide, - the at least one first channel plate (4) has channels (10) and the first and second cover plates (3, 3') each have at least one opening (11), - at least one second channel plate (4') is arranged between the first cover plate (3) and the second cover plate (3'), - the first channel plate (4) and the at least second channel plate (4') have identically shaped channels (10) or differently shaped channels (10), and - the channels (10) formed in the first channel plate (4) and the at least second channel plate (4') form at least one first and one second heat-exchanging fluid guide (16, 17) which enable heat exchange with one another, characterized by , that turbulence-generating structures (18) are arranged in at least one of the first and second heat-exchanging fluid guides (16, 17). [2] Thermal management module (1) according to claim 1, characterized by that the at least one first channel plate (4) and / or the first cover plate (3) and / or the second cover plate (3') consists of a substantially flat sheet metal and is punched. [3] Thermal management module (1) according to claim 1 or 2, characterized bythat the at least one first channel plate (4) and the first cover plate (3) and the second cover plate (3') are stacked on top of each other over their entire surface and the circumferential outer edges of the plates (4, 3, 3') form the outer surfaces (19) of the at least one module carrier (2). [4] Thermal management module (1) according to claim 2 or 3, characterized by that the at least one first channel plate (4) and / or the first cover plate (3) and / or the second cover plate (3') has a sheet thickness of 1 mm to 7 mm, particularly preferably of 2 mm to 4 mm. [5] Thermal management module (1) according to claim 2, characterized by that the second cover plate (3') is a plastic component. [6] Thermal management module (1) according to claim 1, characterized by that the first cover plate (3), the first channel plate (4) and the at least second channel plate (4') and the second cover plate (3') are connected to one another in a fluid-tight manner, in particular soldered or glued. [7] Thermal management module (1) according to claim 1, characterized by that in the at least first channel plate (4) a channel (10') is formed which does not form a fluid guide and thus has a heat-insulating effect. [8] Thermal management module (1) according to one of claims 1 to 7, characterized by that the at least one connecting flange (5, 5', 5'', 5''') is firmly connected to the first or second cover plate (3, 3'), in particular glued or soldered. [9] Thermal management module (1) according to one of claims 1 to 8, characterized by that the first and / or the second cover plate (3, 3') has an inwardly or outwardly directed collar (12, 13) on the at least one opening (11). [10] Thermal management module (1) according to one of claims 1 to 9, characterized by that the first and / or the second cover plate (3, 3') has at least one alignment element (14). [11] Thermal management module (1) according to claim 10, characterized bythat the inwardly or outwardly directed collar (12,13) ​​positions the first or at least the second channel plate (4,4') or the at least one connecting flange (5, 5', 5'', 5''').

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