Dry film resist

JP2024175491AInactive Publication Date: 2024-12-18MITSUBISHI PAPER MILLS LTD
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Patent Information

Application Number
JP2023093321
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-06-06
Publication Date
2024-12-18
Estimated Expiration
Not applicable · inactive patent
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Abstract

To provide a positive dry film resist that excels in reproducibility of etching patterns and laminating capability onto a substrate, ensures high compatibility of components contained in a photosensitive resist layer, and prevents the occurrence of separation or deposition of components in the coating film.SOLUTION: A dry film resist has a support film (A). On the support film (A), disposed are a resol-modified xylene formaldehyde resin (b) at least containing a constitutional unit (I) represented by the general formula (1) and a specific constitutional unit (II), and a positive photosensitive resist layer (C) containing quinonediazide sulfonate (c). (In the general formula (1), X independently represent -CH2- or -CH2-O-CH2-. If the resin (b) contains a plurality of constitutional units (II), the moieties m in each constitutional unit (II) may be the same or different).SELECTED DRAWING: None
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Citation Information

Cited By

  • Dry film resist

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