Dry film resist
JP2024175491AInactive Publication Date: 2024-12-18MITSUBISHI PAPER MILLS LTD
Patent Information
- Application Number
- JP2023093321
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-06-06
- Publication Date
- 2024-12-18
- Estimated Expiration
- Not applicable · inactive patent
Abstract
To provide a positive dry film resist that excels in reproducibility of etching patterns and laminating capability onto a substrate, ensures high compatibility of components contained in a photosensitive resist layer, and prevents the occurrence of separation or deposition of components in the coating film.SOLUTION: A dry film resist has a support film (A). On the support film (A), disposed are a resol-modified xylene formaldehyde resin (b) at least containing a constitutional unit (I) represented by the general formula (1) and a specific constitutional unit (II), and a positive photosensitive resist layer (C) containing quinonediazide sulfonate (c). (In the general formula (1), X independently represent -CH2- or -CH2-O-CH2-. If the resin (b) contains a plurality of constitutional units (II), the moieties m in each constitutional unit (II) may be the same or different).SELECTED DRAWING: None
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Citation Information
Cited By
Dry film resist
JP2025012688A
