Two-pack curable composition set, cured product, and electronic device

A two-component curing composition set with controlled reaction dynamics and specific ratios ensures minimal side reactions, preventing cracking and maintaining high thermal conductivity in electronic components exposed to temperature cycles.

JP2025123753APending Publication Date: 2025-08-25DENKA CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
JP2024019405
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-02-13
Publication Date
2025-08-25

AI Technical Summary

Technical Problem

Two-component curing compositions used for thermally conductive materials in electronic components face issues with cracking and reduced thermal conductivity upon exposure to high and low temperatures due to uncontrolled side reactions and volatilization, despite being designed for equal vinyl and hydrosilyl group ratios.

Method used

A two-component curing composition set with specific conditions, including a first part containing vinyl-modified organopolysiloxane and a second part containing hydrosilyl-modified organopolysiloxane, along with a reaction retarder and addition reaction catalyst, where the ratio of storage modulus after 8 and 14 hours is controlled to 1.5 or less, ensuring minimal side reactions and maintaining high thermal conductivity.

Benefits of technology

The composition set prevents cracking and maintains high thermal conductivity even under repeated high and low temperature cycles, enhancing the reliability and adhesion of the cured product for electronic components.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2025123753000001
    Figure 2025123753000001
  • Figure 2025123753000002
    Figure 2025123753000002
  • Figure 2025123753000003
    Figure 2025123753000003
Patent Text Reader

Abstract

To provide a two-pack curable composition set that prevents occurrence of cracks and enables maintenance of high thermal conductivity even under repeated exposure to high and low temperatures.SOLUTION: A two-pack curable composition set comprises a first agent including a vinyl-modified organopolysiloxane A, and a second agent including a hydrosilyl-modified organopolysiloxane B, where at least one of the first agent and the second agent includes a reaction retarder C, and at least one of the first agent and the second agent includes an addition reaction catalyst D. The vinyl-modified organopolysiloxane A, the hydrosilyl-modified organopolysiloxane B, the reaction retarder C, and the addition reaction catalyst D contained in the first agent and the second agent are mixed and subjected to continuous dynamic viscoelasticity measurement while maintained at 150°C, such that a ratio G'(14) / G'(8), which is a ratio of a storage modulus G'(14) after 14 hours to a storage modulus G'(8) after 8 hours, is 1.5 or less.SELECTED DRAWING: None
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Two-component curable composition set, thermally conductive cured product and electronic apparatus

    JP2023064230A