Nail decoration method

Abstract

To provide a nail decoration method capable of shortening a time required in decorating nails.SOLUTION: A nail decoration method includes: a top gel layer removal process; a color gel layer removal process; a first base gel layer working process for cutting a first base gel layer G11 coated on a front surface of a nail plate 11 so as to thin the whole first base gel layer; a rough surface working process for performing rough-surface working on a gap area GAP on the front surface of the nail plate 11 and a front surface of the first base gel layer G11; and a base gel coating process for coating a base gel so as to cover the gap area GAP on the front surface of the nail plate 11 and the whole front surface of the first base gel layer G11 after the rough surface working process.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a method for decorating nails. [Background technology]

[0002] If a nail decorated by sequentially applying base gel, color gel, and top gel to the surface of the nail is left for a long period of time, a gap will form between the cuticle and the decorative portion of the nail plate as the nail grows, resulting in a poor appearance. In this case, it is common to remove all of the base gel, color gel, and top gel from the decorative portion of the nail plate and then re-decorate the nail by sequentially applying the base gel, color gel, and top gel to the surface of the nail. Here, a method for removing the base gel, color gel, and top gel has been proposed, including, for example, a step of removing the top gel and color gel from a gel nail in which the base gel, color gel, and top gel are sequentially applied to the surface of the nail, leaving the base gel; a step of applying a gel dissolving agent to the base gel and then applying a cuticle remover to the base gel; and a step of removing the base gel remaining on the surface of the nail by applying the tip of a pusher at a predetermined angle to the surface of the nail (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-93966 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in a decoration method in which the base gel, color gel, and top gel are all removed and then the base gel, color gel, and top gel are applied again to the surface of the nail in that order, the time required to decorate the nail as a whole increases, and there is a risk that the person receiving the treatment will be tied up in the treatment for a longer period of time than expected.

[0005] The present invention has been made in view of the above circumstances, and has as its object to provide a nail decoration method that can shorten the time required to decorate nails. [Means for solving the problem]

[0006] In order to achieve the above object, the nail decoration method according to the present invention comprises: a top gel layer removing step of removing at least a portion of the first top gel layer formed on the surface of the nail plate; a color gel layer removing step of removing the second color gel layer formed on the surface of the nail plate, or removing the second color gel layer together with the first top gel layer remaining in the top gel layer removing step; a first base gel layer processing step of thinning the entire first base gel layer by cutting the first base gel layer applied to the surface of the nail plate; a roughening step of roughening at least a gap region between the edge of the first base gel layer on the surface of the nail plate on the cuticle side and the cuticle; After the roughening process, a base gel application process is performed to apply a base gel to cover the gap area between the edge of the first base gel layer on the surface of the nail plate on the cuticle side and the cuticle, and the entire surface of the first base gel layer. A color gel application step of applying a color gel to the surface of the second base gel layer; The method includes a top gel application process in which, after the color gel applied to the surface of the second base gel layer is hardened to form a second color gel layer, a top gel is applied to the surface of the second color gel layer. [Effects of the Invention]

[0007] According to the present invention, nails can be re-decorated without removing all of the base gel layer, so the time required for decorating the nails can be shortened compared to when the nails are re-decorated after removing all of the base gel layer. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1A is a schematic plan view of a human finger, and FIG. 1B is a schematic cross-sectional view of a human finger. [Figure 2] 1A is a schematic cross-sectional view of a person's finger immediately after nail decoration, and FIG. 1B is a schematic cross-sectional view of a person's finger after the nail has grown after the nail decoration. [Figure 3] 1 is a perspective view showing an example of a grinding tool according to a first embodiment. [Figure 4] 1A is a schematic plan view illustrating the top gel layer removal process and the color gel layer removal process according to embodiment 1, and FIG. 1B is a schematic cross-sectional view of a person's finger after the top gel layer removal process and the color gel layer removal process according to embodiment 1. [Figure 5] (A) is a schematic plan view for explaining the base gel layer processing step according to embodiment 1, and (B) is another schematic plan view for explaining the base gel layer processing step according to embodiment 1. [Figure 6] (A) is a schematic plan view for explaining the base gel layer processing process according to embodiment 1, and (B) is a schematic cross-sectional view of a person's finger after the base gel layer processing process according to embodiment 1. [Figure 7] 1A is a schematic plan view for explaining the base gel application process according to embodiment 1, and FIG. 1B is a schematic cross-sectional view of a person's finger after the base gel application process according to embodiment 1. FIG. [Figure 8] 1A is a schematic cross-sectional view of a person's finger after a color gel application process according to embodiment 1, and FIG. 1B is a schematic cross-sectional view of a person's finger after a top gel application process according to embodiment 1. FIG. [Figure 9] FIG. 10 is a perspective view showing an example of a grinding tool according to a second embodiment. [Figure 10] (A) is a schematic plan view for explaining the two-layer gel layer removal process according to embodiment 2, and (B) is a schematic cross-sectional view of a person's finger after the two-layer gel layer removal process according to embodiment 2. [Figure 11](A) is a schematic plan view for explaining the base gel layer processing process according to embodiment 2, and (B) is a schematic cross-sectional view of a person's finger after the base gel layer removal process according to embodiment 2. DETAILED DESCRIPTION OF THE INVENTION

[0009] (Embodiment 1) A nail decoration method according to one embodiment of the present invention will be described in detail below with reference to the drawings. As shown in FIGS. 1(A) and 1(B), a human finger 1 has a nail plate 11. The nail matrix 20 is the portion that forms the nail plate 11. The posterior nail fold 14 is the portion of skin that secures the nail root 11a of the nail plate 11. The lateral nail fold 22 is the portion of skin that contacts the lateral nail edge 21 of the nail plate 11. The cuticle 15 is the portion of skin that extends from the posterior nail fold 14 toward the nail plate 11. The cuticle keratin 16 is the keratinous portion interposed between the cuticle 15 and the nail plate 11. The nail bed 19 is the portion to which the nail plate 11 is in close contact. The hyponychium 17 is fixed to the back side of the nail plate 11. The hyponychic keratin 18 is continuous with the hyponychic 17 and covers the area closer to the tip of the nail (hereinafter referred to as the "free edge") than the area where the hyponychic 17 is fixed on the back side of the nail plate 11 (hereinafter referred to as the "yellow line"). The area where the lateral nail edge 21 of the nail plate 11 intersects with the yellow line is the stress point SP where stress tends to concentrate. The free edge of the nail plate 11 also has a lower moisture content than areas other than the free edge of the nail plate 11.

[0010] As shown in FIG. 2(A), a nail is decorated by forming a gel layer G1 consisting of a first base gel layer G11, a first color gel layer G12, and a first top gel layer G13 on the surface of a nail plate 11. If the nail is left for a long time, the nail grows as shown by arrow AR1, and a gap area GAP1 is formed between the cuticular keratin 16 and the gel layer G1 in the nail plate 11 as shown in FIG. 2(B). The nail decoration method according to this embodiment is a method used to re-decorate the nail plate 11 when a gap area GAP is formed between the cuticular keratin 16 and the gel layer G1 in the nail plate 11 as shown in FIG. 2(B).

[0011] Next, the nail decoration direction according to this embodiment will be described in detail. In the nail decoration method according to this embodiment, first, a top gel layer removal step is performed to remove the first top gel layer G13 formed on the nail plate 11 using a grinding tool 100. As the grinding tool 100, for example, as shown in FIG. 3, a cylindrical file 101 is attached to the tip of a mandrel 102, and the file 101 rotates around an axis (rotation axis) J2 that coincides with the central axis of the mandrel 102. For example, this grinding tool 100 is one having a cylindrical carbide bit attached to the tip, the file 101 having coarse protrusions. Here, the file 101 is brought into contact with the surface of the first top gel layer G11 while rotating around the rotation axis J2 at a rotation speed of approximately 10,000 rpm. Then, the file 101 is repeatedly moved in one direction while maintaining contact with the surface of the first top gel layer G13, thereby removing at least a portion of the first top gel layer G13. Here, it is preferable to grind a portion of the surface of the first top gel layer G13 to such an extent that the surface gloss of the first top gel layer G13 is lost, which makes it easier to perform processing using the file 101 of the grinding tool 100 in the subsequent steps.

[0012] Next, a color gel layer removal step is performed using the grinding tool 100 to remove the first color gel layer G12 formed on the nail plate 11. Here, if the first top gel layer G13 remains, the remaining portion of the first top gel layer G13 is removed together with the first color gel layer G12. Here, as shown in FIG. 4(A), the first color gel layer G12 is divided into nine regions A1, A2, ..., A9 by imaginary lines connecting two stress points SP, imaginary lines connecting ends P11 and P12 of the boundary portion with the cuticle 15 on the surface of the nail plate 11 and a central portion CP between the stress points SP, and two imaginary lines extending along the longitudinal direction of the nail plate 11 and dividing the width direction of the nail plate 11 into approximately three equal parts. The nine regions are cut in the order of A1 → A2 → A1 → A3, A4 → A5 → A4 → A6, A7 → A8 → A7 → A9 to remove the first color gel layer G12. The nine regions A1, A2, ..., A9 are not limited to those described above. For example, the first color gel layer G12 may be divided into nine regions by two imaginary lines dividing the first color gel layer G12 into three equal parts in the direction from the cuticle 15 toward the tip of the nail plate 11 (i.e., in the Z-axis direction) and two imaginary lines extending along the longitudinal direction of the nail plate 11 and dividing the width of the nail plate 11 into three equal parts. It is preferable to rotate the file 101 around the rotation axis J2 at a rotation speed of approximately 10,000 rpm while contacting the surface of the first color gel layer G12 with the regions A1, A2, ..., A9 in that order. When cutting the regions A1, A4, and A7, the file 101 is brought into contact with the portion P1 shown in Figure 3 . When cutting the regions A2, A5, and A8, the file 101 is brought into contact with the portions P2 and P3 shown in Figure 3 . Furthermore, when cutting areas A3, A6, and A9, the file 101 is brought into contact with the portion P4 in FIG. 3. This allows the amount of wear to be uniform throughout the file 101. When cutting areas A1, A4, and A7, the file 101 is repeatedly moved in one direction within areas A1, A4, and A7, for example, about 10 times, while the portion P1 of the file 101 is in contact with the areas A1, A4, and A7. When cutting areas A2, A5, and A8, the file 101 is repeatedly moved in one direction within areas A2, A5, and A8, for example, about 5 times, while the portion P2 and P3 of the file P101 are in contact with the areas A2, A5, and A8.Furthermore, when cutting areas A3, A6, and A9, portion P4 of file P101 is repeatedly moved in one direction within areas A3, A6, and A9, for example, about five times, while in contact with areas A3, A6, and A9. In other words, the number of repeated movements in areas A1, A4, and A7 is preferably about twice the number of repeated movements in the other areas A2, A3, A5, A6, A8, and A9. By repeating this series of operations, the first color gel layer G12 is removed.

[0013] 4(B), the length of the nail plate 11 is adjusted by cutting the tip of the nail plate 11 along, for example, the imaginary plane CL1. As a result, as shown in FIG. 5(A), only the first base gel layer G11 remains between a position shifted in the +Z direction from the cuticle 15 of the nail plate 11 by the gap region GAP1 to the edge of the nail plate 11 on the +Z direction side.

[0014] Next, a first base gel layer processing step is performed in which the first base gel layer G11 applied to the surface of the nail plate 11 is cut to thin the entire first base gel layer G11. In this first base gel layer processing step, as shown in Fig. 5(B), the file 101 is rotated around the rotation axis J2 at a rotation speed of approximately 10,000 rpm, and the portion P1 of the file 101 shown in Fig. 3 is moved in the directions indicated by arrows (1) to (5) in Fig. 5(B) while being in contact with the first base gel layer G11. Then, for a normal nail plate 11, the file 101 is brought into contact with the first base gel layer G11 in the order of (1) → (2) → (3) → (4) → (5), thereby cutting the first base gel layer G11 in order from the relatively thicker portions. For example, if the nail plate 11 has a curved tip, it is preferable to bring the file 101 into contact with the first base gel layer G11 in the order of (4) → (3) → (2) → (1) → (5). Then, the angle between the rotation axis J2 of the file 101 and the surface of the nail plate 11 is reduced, and the portions P1, P2, and P3 of the file 101 shown in Fig. 3 are brought into contact with the end of the first base gel layer G11 on the cuticle 15 side and moved as shown by the arrows in Fig. 6(A), thereby thinning the end of the first base gel layer G11 on the cuticle 15 side. As a result, as shown in FIG. 6(B), the first base gel layer G11 is cut to reduce the overall thickness of the first base gel layer G11, forming a sloped region TP in which the thickness of the applied first base gel layer G11 increases from the edge of the applied first base gel layer G11 on the surface of the nail plate 11 toward the cuticle 15, i.e., the -Z direction, toward the tip of the nail plate 11, i.e., the +Z direction. This results in a smooth, continuous boundary between the nail plate 11 and the first base gel layer G11, with only one thin layer of the first base gel layer G11 remaining on the nail plate 11. Here, the file 101 is rotated around the rotation axis J2 at a relatively low speed of approximately 6000 rpm and brought into contact with the surface of the first base gel layer G11. The file 101 is then repeatedly moved away from the cuticle 15 on the nail plate 11, thereby forming the sloped region TP. At this time, it is preferable that the portion P2 of the file 101 in FIG. 3 be brought into contact with the gap region GAP of the nail plate 11 and the first base gel layer G11.Here, when the file 101 is brought into contact with the end of the first base gel layer G11 on the nail cuticle 15 side, it is preferable to set the angle between the rotation axis J2 of the file 101 and the tangent direction at the point where the file 101 comes into contact at the boundary between the first base gel layer G11 and the nail plate 11 to about 45 degrees. It is also preferable to bring the file 101 into contact with the gap region GAP in the nail plate 11, move it from the gap region GAP toward the first base gel layer G11, remove it from the first base gel layer G11, and then bring it into contact with the gap region GAP again, repeating this process.

[0015] Next, a so-called cuticle treatment is performed as appropriate to remove a portion of the cuticle keratin 16. Here, the cuticle keratin 16 is removed using, for example, a metal pusher and cuticle nippers. When using a metal pusher and cuticle nippers, the tip of the metal pusher is placed against the surface of the nail plate 11 at an angle (preferably at an angle of about 45 degrees), and the metal pusher is pushed up toward the cuticle 15. The cuticle keratin 16 that has been rolled up by the metal pusher is then scraped off using a care bit, and then removed using the cuticle nippers.

[0016] Next, a roughening process is performed to roughen the gap area GAP between the edge of the first base gel layer G11 on the surface of the nail plate 11 in the -Z direction and the nail cuticle 15. At this time, it is preferable to bring portions P2 and P3 of the file 101 (see FIG. 3) into contact with the gap area GAP on the nail plate 11 and the first base gel layer G11. This allows for an anchoring effect when the base gel is applied to the surface of the first base gel layer G11, including the gap area GAP and the sloped area TP. During this roughening process, any remaining cuticle keratin may be removed by cutting using a care bit.

[0017] Next, a base gel application process is performed in which a base gel is applied to cover the gap region GAP between the edge of the first base gel layer G11 on the -Z direction side and the nail cuticle 15 on the surface of the nail plate 11, as well as the entire surface of the first base gel layer G11 including the inclined region TP. Here, the base gel may contain, for example, an ultraviolet-curable resin. The base gel applied to the nail plate 11 is then cured by irradiating it with ultraviolet light, thereby forming a second base gel layer G21 that covers the entire surface of the nail plate 11, as shown in Figures 7(A) and 7(B).

[0018] Next, a color gel application process is performed in which color gel is applied to the surface of the second base gel layer G21. Here, the color gel may contain, for example, a UV-curable resin. Then, the color gel applied to the second base gel layer G21 is cured by irradiating it with UV light, thereby forming a second color gel layer G22 on the second base gel layer G21, as shown in FIG. 8(A).

[0019] Next, a top gel application process is performed to apply a top gel to the surface of the second color gel layer G2. Here, the top gel may contain, for example, an ultraviolet-curable resin. The color gel applied to the second color gel layer G2 is then cured by irradiating it with ultraviolet light, forming a second top gel layer G23 on the second color gel layer G22, as shown in FIG. 8(A). This allows the gap area GAP between the cuticle 15 and the gel layer G1 in the nail plate 11 to be covered again with the gel layer G1.

[0020] As described above, according to the nail decoration method of this embodiment, the nail plate 11 can be re-decorated without removing all of the first base gel layer G11, thereby reducing the time required to decorate the nail plate 11 compared to re-decorating the nail plate 11 after removing all of the first base gel layer G11.

[0021] Furthermore, according to the nail decoration method of this embodiment, the first base gel layer G11 is not entirely removed each time the nail plate 11 is decorated, which prevents the nail plate 11 from being damaged or becoming excessively thin.

[0022] Furthermore, according to the nail decoration method of this embodiment, the rotation speed of the mandrel 102 of the cutting tool 100 used to remove the first base gel layer G11, the first color gel layer G12, and the first top gel layer G13 is set to a rotation speed between 6,000 rpm and 10,000 rpm, which is included in the so-called medium-speed rotation range to low-speed rotation range. This suppresses heat generation due to friction between the mandrel 102 and the first base gel layer G11, the first color gel layer G12, or the first top gel layer G13, thereby improving the safety of the treatment recipient. In other words, by setting the rotation speed of the mandrel 102 to the above-mentioned rotation speed, it is possible to prevent the treatment recipient from feeling excessive heat due to the heat of the friction.

[0023] (Embodiment 2) The nail decoration method according to this embodiment differs from the nail decoration method according to the embodiment in that a two-layer gel layer removal process is performed using a grinding tool having a carbide bit to remove the first color gel layer and the first top gel layer formed on the first color gel layer together.

[0024] In the nail decoration method according to this embodiment, a two-layer gel layer removal process is first performed using a grinding tool 2100 to simultaneously remove the first color gel layer G12 formed on the nail plate 11 and the first top gel layer G13 formed on the first color gel layer G12. The grinding tool 2100 may, for example, be a grinding tool 2100 shown in FIG. 9 , which has a cylindrical carbide bit 2101 attached to its tip end with a coarse file projection, and which rotates around an axis (rotation axis) J22 that coincides with the central axis of the carbide bit 2101. Furthermore, the lengths L21 of the portions P21, P22, P23, and P24 in the direction of the rotation axis J22 are equal to each other. Furthermore, the lengths L22 of the portions P22 and P23 in the direction of the rotation axis J22 are also equal to each other.

[0025] In this two-layer gel layer removal process, the carbide bit 2101 is rotated around the rotation axis J22 at a rotation speed of approximately 10,000 rpm and brought into contact with the surface of the first top gel layer G13. Here, as shown in Fig. 10(A), the first top gel layer G13 and the first color gel layer G12 are divided into nine regions A1, A2, ..., A9 by two imaginary lines that divide the first top gel layer G13 and the first color gel layer G12 equally into thirds in the direction from the cuticle 15 toward the tip of the nail plate 11, i.e., in the Z-axis direction, and two imaginary lines that extend along the longitudinal direction of the nail plate 11 and divide the width direction of the nail plate 11 into approximately thirds. The nine regions are cut in the order of A1 → A2 → A1 → A3, A4 → A5 → A4 → A6, A7 → A8 → A7 → A9 to remove the first top gel layer G13 and the first color gel layer G12. Specifically, when cutting regions A1, A4, and A7, portion P21 of the carbide bit 2101 shown in FIG. 9 is moved repeatedly in one direction within regions A1, A4, and A7 while in contact with regions A1, A4, and A7. Once the first top gel layer G13 and first color gel layer G12 in regions A1, A4, and A7 have been removed, cutting of other regions begins. When cutting regions A2, A5, and A8, portions P22 and P23 of the carbide bit 2101 shown in FIG. 9 are moved repeatedly in one direction within regions A2, A5, and A8 while in contact with regions A2, A5, and A8. Once the first top gel layer G13 and first color gel layer G12 in regions A2, A5, and A8 have been removed, cutting of other regions begins. Furthermore, when cutting regions A3, A6, and A9, portion P24 of the carbide bit 2101 shown in FIG. 9 is moved repeatedly in one direction within regions A3, A6, and A9 while in contact with the regions. Once the first top gel layer G13 and first color gel layer G12 in regions A3, A6, and A9 have been removed, cutting begins on the other regions. This series of operations is repeated to remove the first top gel layer G13 and first color gel layer G12. Then, portions P22 and P25 of the carbide bit 2101 are moved repeatedly along the boundary between regions A7, A8, and A9 and the gap region GAP1 from the end of the boundary in the +X direction toward the end in the -X direction, smoothing out any unevenness at the boundary.

[0026] 10(B), the length of the nail plate 11 is adjusted by cutting the tip of the nail plate 11 along, for example, the imaginary plane CL1. As a result, as shown in FIG. 11(A), only the first base gel layer G11 remains between a position shifted in the +Z direction from the cuticle 15 of the nail plate 11 by the gap region GAP1 to the edge of the nail plate 11 on the +Z direction side.

[0027] Next, a first base gel layer processing step is performed in which the first base gel layer G11 applied to the surface of the nail plate 11 is cut to make the thickness of the entire first base gel layer G11 uniform. In this first base gel layer processing step, the carbide bit 2101 is brought into contact with the surface of the first base gel layer G11 while rotating around the rotation axis J22 at a rotation speed of approximately 10,000 rpm. Here, as shown in FIG. 11(A), when the first base gel layer G11 is divided into nine regions A1, A2, ..., A9 by two imaginary lines that divide the nail plate 11 into approximately thirds in the Z-axis direction and two imaginary lines that extend along the longitudinal direction of the nail plate 11 and divide the nail plate 11 into approximately thirds in the width direction, the nine regions A1, A2, ..., A9 are cut in order. Specifically, first, portions P22 and P23 of the carbide bit 2101 shown in FIG. 9 are brought into contact with regions A2, A5, and A8 and repeatedly moved in one direction within regions A2, A5, and A8 to uniform the thicknesses of regions A2, A5, and A8. Next, portion P21 of the carbide bit 2101 shown in FIG. 9 is brought into contact with regions A1, A4, and A7 and repeatedly moved in one direction within regions A1, A4, and A7 to uniform the thicknesses of regions A1, A4, and A7. Then, portion P24 of the carbide bit 2101 shown in FIG. 9 is brought into contact with regions A3, A6, and A9 and repeatedly moved in one direction within regions A3, A6, and A9 to uniform the thicknesses of regions A3, A6, and A9. Then, with parts P22 and P25 of the carbide bit 2101 in contact with the boundary between areas A7, A8, and A9 and the gap area GAP1, the thickness of areas A7, A8, and A9 is reduced by repeatedly moving the carbide bit 2101 along the boundary from the end of the boundary on the +X side toward the end on the -X side.

[0028] Next, the carbide bit 2101 is rotated around the rotation axis J22 at a relatively low speed of about 6000 rpm and brought into contact with the surface of the first base gel layer G11. Here, the nine regions A1, A2, ..., A9 shown in FIG. 11(A) are cut in the following order: A1 → A2 → A1 → A3, A4 → A5 → A4 → A6, A7 → A8 → A7 → A9. In cutting the regions A1 and A4, the portion P21 of the carbide bit 2101 shown in FIG. 9 is repeatedly moved in one direction within the regions A1 and A4 while in contact with the regions A1 and A4. In cutting the region A7, the portion P21 of the carbide bit 2101 is repeatedly moved in one direction within the region A1 and A4 while in contact with the region extending from approximately the center of the gap region GAP in the Z-axis direction to the region A7. This eliminates the step at the boundary between the first base gel layer G11 and the gap region GAP1, resulting in a so-called "blended" state. Once the first base gel layer G11 in regions A1, A4, and A7 has been polished to a certain extent, the cutting process moves on to other regions. Furthermore, in the cutting process of regions A2 and A5, portions P22 and P23 of the carbide bit 2101 shown in FIG. 9 are repeatedly moved in one direction within regions A2 and A5 while in contact with regions A2 and A5. In the cutting process of region A8, portion P21 of the carbide bit 2101 is repeatedly moved in one direction within the region including from approximately the center of the gap region GAP in the Z-axis direction to region A8 while in contact with the region including from approximately the center of the gap region GAP in the Z-axis direction to region A8. Once the first base gel layer G11 in regions A2, A5, and A8 has been polished to a certain extent, the cutting process moves on to other regions. 9 is brought into contact with the areas A3 and A6, and is repeatedly moved in one direction within the areas A3 and A6. In cutting the area A9, the carbide bit 2101 is brought into contact with the area from approximately the center of the gap area GAP in the Z-axis direction to the area A9, and is repeatedly moved in one direction within the area from approximately the center of the gap area GAP in the Z-axis direction to the area A9.Then, once the first base gel layer G11 in areas A3, A6, and A9 has been polished to a certain extent, the cutting process moves on to other areas. This series of operations is repeated to uniform the thickness of the first base gel layer G11. Then, with portions P22 and P25 of the carbide bit 2101 in contact with the boundary between areas A7, A8, and A9 and the gap region GAP1, the carbide bit is repeatedly moved along the boundary from the end on the +X direction side of the boundary toward the end on the -X direction side. In this way, the first base gel layer G11 is cut to reduce the overall thickness of the first base gel layer G11 while forming the inclined region TP shown in FIG. 11(B). This results in a smooth, continuous boundary between the nail plate 11 and the first base gel layer G11, with only a thin layer of the first base gel layer G11 remaining on the nail plate 11. In other words, the boundary between the nail plate 11 and the first base gel layer G11 blends in nicely, and a thin layer of the first base gel layer G11 remains.

[0029] Next, a so-called cuticle treatment is performed as appropriate to remove a portion of the cuticle keratin 16. Here, the cuticle keratin 16 is removed using, for example, a metal pusher and cuticle nippers. When using a metal pusher and cuticle nippers, the tip of the metal pusher is placed against the surface of the nail plate 11 at an angle (preferably at an angle of about 45 degrees), and the metal pusher is pushed up toward the cuticle 15. The cuticle keratin 16 that has been rolled up by the metal pusher is then scraped off using a care bit, and then removed using the cuticle nippers.

[0030] Next, a roughening process is performed using the grinding tool 100 described in the first embodiment to roughen the gap area GAP on the surface of the nail plate 11 between the edge of the first base gel layer G11 on the -Z direction side and the nail cuticle 15. During this process, the file 101 is rotated around the rotation axis J2 at a relatively low speed of approximately 6000 rpm, while portions P2 and P3 of the file 101 (see FIG. 3) are brought into contact with the gap area GAP on the nail plate 11 and the first base gel layer G11. This allows for an anchoring effect when the base gel is applied to the surface of the first base gel layer G11, including the gap area GAP and the inclined area TP. During this roughening process, any remaining cuticle keratin may be removed by cutting using a care bit.

[0031] Thereafter, a base gel application process is performed in which a base gel is applied to cover the gap region GAP between the edge of the first base gel layer G11 on the surface of the nail plate 11 on the -Z direction side and the nail cuticle 15, as well as the entire surface of the first base gel layer G11 including the inclined region TP, as described in Embodiment 1. Next, a color gel application process is performed in which a color gel is applied to the surface of the second base gel layer G21 formed by curing the base gel as described in Embodiment 1. Subsequently, a top gel application process is performed in which a top gel is applied to the surface of the second color gel layer G2 formed by curing the color gel as described in Embodiment 1. This allows the gap region GAP between the nail cuticle 15 and the gel layer G1 on the nail plate 11 to be covered again with the gel layer G1.

[0032] As described above, the nail decoration method of this embodiment also allows the nail plate 11 to be re-decorated without removing all of the first base gel layer G11, thereby reducing the time required to decorate the nail plate 11 compared to re-decorating the nail plate 11 after removing all of the first base gel layer G11.

[0033] Although the embodiments of the present invention have been described above, the present invention is not limited to the configurations of the above-described embodiments. For example, other types of grinding tools may be used as the grinding tool 100. Furthermore, the base gel, color gel, and top gel are not limited to those formed from ultraviolet curable resin.

[0034] In the embodiment, after the applied base gel is cured to form the second base gel layer G21, a second base gel layer processing step may be performed in which the surface of the second base gel layer G21 is cut so that the thickness distribution of the second base gel layer G21 becomes a predetermined thickness distribution. In this case, it is preferable to cut the second base gel layer G21 by rotating the file 101 around the rotation axis J2 at a relatively low speed of about 6000 rpm and bringing it into contact with the surface of the second base gel layer G21.

[0035] In the embodiment, an example has been described in which the roughening process roughens the gap region GAP1 between the edge of the first base gel layer G11 on the surface of the nail plate 11 on the -Z direction side and the nail cuticle 15. However, this is not limited to this, and the roughening process may roughen not only the gap region GAP1 but also the surface of the first base gel layer G11 including the inclined region TP.

[0036] Although the embodiments and modifications of the present invention have been described above, the present invention is not limited to these. The present invention includes any combination of the embodiments and modifications, and any combination to which appropriate modifications have been made. [Industrial Applicability]

[0037] The present invention is suitable for nail decoration carried out in nail salons and the like. [Explanation of symbols]

[0038] 1: finger, 11: nail plate, 11a: nail root, 14: posterior nail fold, 15: nail cuticle, 16: nail cuticle keratin, 17: hyponychium, 18: hyponychium keratin, 19: nail bed, 20: nail matrix, 21: lateral nail plate edge, 22: lateral nail fold, 100: grinding tool, 101: file, 102: mandrel, CP: intersection, G11: first base gel layer, G12: first color gel layer, G13: first top gel layer, G21: second base gel layer, G22: second color gel layer, G23: second top gel layer, GA1, GA2: gap area, J2: rotation axis, SP: stress point

Claims

1. a top gel layer removing step of removing at least a portion of the first top gel layer formed on the surface of the nail plate; a color gel layer removing step of removing the first color gel layer formed on the surface of the nail plate, or removing the first color gel layer together with the first top gel layer remaining in the top gel layer removing step; a first base gel layer processing step of thinning the entire first base gel layer by cutting the first base gel layer applied to the surface of the nail plate; a roughening step of roughening at least a gap region between the edge of the first base gel layer on the surface of the nail plate on the cuticle side and the cuticle; After the roughening process, a base gel application process is performed to apply a base gel to cover the gap area between the edge of the first base gel layer on the surface of the nail plate on the cuticle side and the cuticle, and the entire surface of the first base gel layer. A color gel application process in which a second base gel layer is formed by hardening the applied base gel, and then a color gel is applied to the surface of the second base gel layer; and a top gel application step of applying a top gel to the surface of the second color gel layer after the second color gel layer is formed by hardening the color gel applied to the surface of the second base gel layer. Nail decoration methods.

2. In the color gel layer removal step, the first color gel layer is divided into nine regions by two imaginary lines that divide the portion of the surface of the nail plate where the first color gel layer is formed into thirds in the direction from the cuticle to the tip of the nail plate, an imaginary line that connects the center portions between the ends of the boundary portion with the cuticle on the surface of the nail plate and the stress point, and two imaginary lines that extend along the longitudinal direction of the nail plate and divide the width direction of the nail plate into thirds. The nine regions are cut in order to remove the first color gel layer. The nail decoration method according to claim 1.

3. In the color gel layer removal step, the first color gel layer is divided into nine regions by an imaginary line connecting two stress points, an imaginary line connecting the ends of the boundary portion with the cuticle on the surface of the nail plate and the central portion between the stress points, and two imaginary lines extending along the longitudinal direction of the nail plate and dividing the width direction of the nail plate into thirds. The nine regions are cut in order to remove the first color gel layer. The nail decoration method according to claim 1.

4. In the first base gel layer processing step, a grinding tool having a rotating cylindrical file is used, and the rotating file is repeatedly brought into contact with the gap region and then moved in a direction away from the nail cuticle to the first base gel layer. The nail decoration method according to any one of claims 1 to 3.

5. a two-layer gel layer removal step of collectively removing a first color gel layer formed on the surface of the nail plate and a first top gel layer formed on the first color gel layer; a first base gel layer processing step of cutting the first base gel layer applied to the surface of the nail plate to make the thickness of the entire first base gel layer uniform; a roughening step of roughening at least a gap region between the edge of the first base gel layer on the surface of the nail plate on the cuticle side and the cuticle; After the roughening process, a base gel application process is performed to apply a base gel to cover the gap area between the edge of the first base gel layer on the surface of the nail plate on the cuticle side and the cuticle, and the entire surface of the first base gel layer. A color gel application process in which a second base gel layer is formed by hardening the applied base gel, and then a color gel is applied to the surface of the second base gel layer; and a top gel application step of applying a top gel to the surface of the second color gel layer after the second color gel layer is formed by hardening the color gel applied to the surface of the second base gel layer. Nail decoration methods.

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