Multilayer substrates and their electronic mounting

Abstract

Conventional substrate manufacturing processes face several challenges, including technical bottlenecks in areas such as cost reduction, the production of large substrates, and especially ensuring surface flatness. [Solution] The present invention provides a laminated substrate structure comprising a first bonding layer, a second bonding layer, and an adhesive layer. The first bonding layer comprises a plurality of adjacent first bonding substrates and a plurality of first bonding gaps located between the first bonding substrates; the second bonding layer comprises a plurality of adjacent second bonding substrates and a plurality of second bonding gaps located between the second bonding substrates. The adhesive layer is positioned between the first bonding layer and the second bonding layer and defines a first adhesive surface and a second adhesive surface, connecting the first bonding layer and the second bonding layer. At least some of the first bonding gaps and second bonding gaps do not overlap along the first adhesive surface, the second adhesive surface, or the projection direction of both perpendicular to the adhesive layer.

Description

[Technical Field]

[0001] This invention relates to a substrate structure, which can be applied to electronic packaging, and more particularly to a multilayer substrate structure for semiconductor packages and its electronic packaging. [Background technology]

[0002] As electronic products become smaller, more powerful, and more integrated, the demand for multilayer substrates (MLs) is increasing. However, conventional substrate manufacturing processes face several challenges. For example, achieving cost reduction requires a considerable manufacturing scale, which necessitates the production of large substrates. However, producing large substrates is difficult, and there are technical bottlenecks, particularly in ensuring surface flatness. Secondly, in subsequent manufacturing processes (e.g., packaging), differences in thermal expansion coefficients between materials can easily lead to warping and deformation of the MLs, affecting the yield rate. In existing technologies, the most common manufacturing process uses substrates of a single dimension, but this method does not effectively reduce manufacturing costs. [Overview of the Initiative] [Problems that the invention aims to solve]

[0003] The object of the present invention is to provide a laminated substrate and exemplary embodiments of one or more laminated substrates, all of which illustrate that the laminated substrate of the present invention is a large, bonded composite substrate that can effectively reduce manufacturing costs.

[0004] The objective of the present invention is to provide a laminated substrate in which multiple bonded substrates are bonded to a large composite substrate, and the surface of the laminated substrate of the present invention has high flatness.

[0005] The laminated substrate of the present invention can be cut into multiple small substrates and applied to electronic packaging. [Means for solving the problem]

[0006] To achieve the above objectives, the present invention provides a laminated substrate structure comprising a first bonding layer, a second bonding layer, and an adhesive layer. The first bonding layer comprises a plurality of adjacent first bonding substrates and a plurality of first bonding gaps located between the first bonding substrates; the first bonding substrates define corresponding first and second surfaces. The second bonding layer comprises a plurality of adjacent second bonding substrates and a plurality of second bonding gaps located between the second bonding substrates; the second bonding substrates define corresponding first and second surfaces. The adhesive layer is positioned between the first and second bonding layers and defines a first adhesive surface and a second adhesive surface. The first adhesive surface of the adhesive layer is connected to the second surface of the first bonding substrate, and the second adhesive surface of the adhesive layer is connected to the first surface of the second bonding substrate, thus connecting the first and second bonding layers. At least some of the first and second bonding gaps do not overlap along the first adhesive surface, the second adhesive surface, or the projection direction of both perpendicular to the adhesive layer.

[0007] In one embodiment, a plurality of first bonding substrates and a plurality of second bonding substrates each define one or more peripheries, and at least one or more peripheries of one of the first bonding substrates approach one or more peripheries of the corresponding second bonding substrate.

[0008] In one embodiment, the first bonding substrate and / or the second bonding substrate include an inorganic material, an organic material, or a combination thereof.

[0009] In one embodiment, the first bonding substrate, the second bonding substrate, or both, include crystalline or amorphous silicon dioxide, glass, ceramic, compound semiconductor material, polyimide, or a combination of one or more of the above materials.

[0010] In one embodiment, the first bonded substrate and the second bonded substrate are made of the same material.

[0011] In one embodiment, the thermal conductivity of the first bonded substrate, the second bonded substrate, or both is 1.0 W / m².* It is K or greater.

[0012] In one embodiment, the elastic modulus of the first bonded substrate, the second bonded substrate, or both is 50 GPa or higher.

[0013] In one embodiment, the laminated substrate further includes one or more first electrical layer structures, the first electrical layer structures being arranged on the first surface of the first bonding substrate.

[0014] In one embodiment, the laminated substrate further includes one or more second electrical layer structures, the second electrical layer structures being arranged on the second surface of the second junction substrate.

[0015] In one embodiment, the first bonding substrate of the first bonding layer defines a first thickness, and the first surfaces of two adjacent first bonding substrates define a height difference along a direction perpendicular to the first surface of the first bonding substrate. This height difference is 1 / 10 or less of the first thickness of the two adjacent first bonding substrates, or the height difference is 10 μm or less.

[0016] In one embodiment, the first bonding substrate of the first bonding layer defines a first thickness, and the second surfaces of two adjacent first bonding substrates define a height difference along a direction perpendicular to the second surface of the first bonding substrate. This height difference is 1 / 10 or less of the first thickness of the two adjacent first bonding substrates, or the height difference is 10 μm or less.

[0017] In one embodiment, the second bonding substrate of the second bonding layer defines a second thickness, and the first surfaces of two adjacent second bonding substrates define a height difference along a direction perpendicular to the first surface of the second bonding substrate. This height difference is 1 / 10 or less of the second thickness of the two adjacent second bonding substrates, or the height difference is 10 μm or less.

[0018] In one embodiment, the second bonding substrate of the second bonding layer defines a second thickness, and the second surfaces of two adjacent second bonding substrates define a height difference along a direction perpendicular to the second surface of the second bonding substrate. This height difference is 1 / 10 or less of the second thickness of the two adjacent second bonding substrates, or the height difference is 10 μm or less.

[0019] In one embodiment, a plurality of first bonding substrates in the first bonding layer jointly define a polished surface, and the polished surface is formed by simultaneously polishing or burnishing the surfaces of these first bonding substrates.

[0020] In one embodiment, a plurality of second bonding substrates in the second bonding layer jointly define a polished surface, and the polished surface is formed by simultaneously polishing or burnishing the surfaces of these second bonding substrates.

[0021] In one embodiment, the first bonding substrate defines a first thickness, and the second bonding substrate defines a second thickness. The second thickness is 0.8 times or more and 1.25 times or less of the first thickness.

[0022] In one embodiment, the first thickness and the second thickness are average thicknesses.

[0023] In one embodiment, the adhesive layer of the laminated substrate includes an inorganic material, an organic material, or a combination thereof.

[0024] In one embodiment, the adhesive layer of the laminated substrate includes crystalline or amorphous silicon dioxide (SiO2), glass, ceramic, epoxy resin, polyimide, or a combination of one or more of the above materials.

[0025] In one embodiment, the adhesive layer of the laminated substrate includes glass frit, glass powder, glass paste, or a combination of one or more of the above materials.

[0026] In one embodiment, the thermal conductivity of the adhesive layer of the laminated substrate is equal to or higher than the thermal conductivity of the first bonding substrate, the second bonding substrate, or both.

[0027] In one embodiment, the ratio of the thermal conductivity of the adhesive layer to the thermal conductivity of the first bonding substrate, the second bonding substrate, or both is 1:2 or more.

[0028] In one embodiment, the laminated substrate further includes a plurality of through holes, the plurality of through holes penetrating the first bonding substrate, the adhesive layer, and the corresponding second bonding substrate.

[0029] In one embodiment, the laminated substrate further includes a plurality of conductive materials, which are arranged in at least some of the through holes, and electrically connect the first surface of the first bonded substrate and the second surface of the second bonded substrate.

[0030] In one embodiment, the adhesive layer of the laminated substrate includes a thermal conductive layer, or a thermal conductive layer, which includes a conductive thermal conductive material, thermal conductive particles, or a combination thereof, and the thermal conductive layer is insulated from the conductive material in the through-hole.

[0031] In one embodiment, the heat-conducting layer is provided on at least one side of the first bonding layer or the second bonding layer, and the heat-conducting layer includes a metal layer or a metal material.

[0032] In one embodiment, the adhesive layer of the laminated substrate includes a thermal conductive layer, or a thermal conductive layer, and the thermal conductive layer includes a non-conductive thermal conductive material, thermal conductive particles, or a combination thereof.

[0033] In one embodiment, the heat-conducting layer includes carbon nanotubes, graphene, or a combination thereof.

[0034] In one embodiment, the heat-conducting layer is provided on at least one side of the first bonding layer or the second bonding layer and includes silicon carbide (SiC) heat-conducting particles, silicon (Si) heat-conducting particles, or a combination thereof.

[0035] In one embodiment, the adhesive layer defines the thickness of the adhesive layer, the first bonded substrate defines a first thickness, and the thickness of the adhesive layer is 1 / 10 or less of the first thickness of the corresponding first bonded substrate.

[0036] In one embodiment, the adhesive layer defines the thickness of the adhesive layer, the second bonding substrate defines the second thickness, and the thickness of the adhesive layer is 1 / 10 or less of the second thickness of the corresponding second bonding substrate.

[0037] In one embodiment, the adhesive layer defines the thickness of the adhesive layer, the first bonded substrate defines the first thickness, the second bonded substrate defines the second thickness, and the thickness of the adhesive layer is 1 / 10 or less of the first thickness of the corresponding first bonded substrate and the second thickness of the second bonded substrate.

[0038] In one example, the thickness of the adhesive layer is 50 μm or less.

[0039] In one embodiment, the thickness of the adhesive layer is 10 μm or less.

[0040] In one embodiment, the laminated substrate further includes a gap-filling material, which is placed in at least a portion of the first and second bonding gaps.

[0041] In one embodiment, the gap filler includes an inorganic material, an organic material, or a combination thereof.

[0042] In one embodiment, the gap filler includes crystalline or amorphous silicon dioxide (SiO2), glass, ceramic, epoxy resin, polyimide, or a combination of one or more of the above materials.

[0043] In one embodiment, the elastic modulus of the gap filler is smaller than the elastic modulus of the corresponding first bonding substrate, or smaller than the elastic modulus of the second bonding substrate.

[0044] In one embodiment, the gap filler between the first surfaces of two adjacent first bonding substrates defines a height difference along a direction perpendicular to the first surfaces of the first bonding substrates, and the height difference is 1 / 10 or less of the thickness of the two adjacent first bonding substrates.

[0045] In one embodiment, the gap filler between the second surfaces of two adjacent first bonding substrates defines a height difference along a direction perpendicular to the second surfaces of the first bonding substrates, and the height difference is 1 / 10 or less of the thickness of the two adjacent first bonding substrates.

[0046] In one embodiment, the gap filler between the first surfaces of two adjacent first bonding substrates defines a height difference along a direction perpendicular to the first surfaces of the first bonding substrates, and the height difference is 10 μm or less.

[0047] In one embodiment, the gap filler between the second surfaces of two adjacent first bonding substrates defines a height difference along a direction perpendicular to the second surfaces of the first bonding substrates, and the height difference is 10 μm or less.

[0048] In one embodiment, the gap filler between the first surfaces of two adjacent second bonding substrates defines a height difference along a direction perpendicular to the first surfaces of the second bonding substrates, and the height difference is 1 / 10 or less of the thickness of the two adjacent first bonding substrates.

[0049] In one embodiment, the gap filler between the second surfaces of two adjacent second bonding substrates defines a height difference along a direction perpendicular to the second surfaces of the second bonding substrates, and the height difference is 1 / 10 or less of the thickness of the two adjacent first bonding substrates.

[0050] In one embodiment, the gap filler between the first surfaces of two adjacent second bonding substrates defines a height difference along a direction perpendicular to the first surfaces of the second bonding substrates, and the height difference is 10 μm or less.

[0051] In one embodiment, the gap filler between the second surfaces of two adjacent second bonding substrates defines a height difference along a direction perpendicular to the second surfaces of the second bonding substrates, and the height difference is 10 μm or less.

[0052] In one embodiment, a plurality of first bonding substrates of the first bonding layer and the gap filler jointly define a polished surface, and this polished surface is formed at the same time by a polishing or buffing process.

[0053] In one embodiment, a plurality of second bonding substrates of the second bonding layer and the gap filler jointly define a polished surface, and this polished surface is formed at the same time by a polishing or buffing process.

[0054] In one embodiment, the thickness of the gap filler corresponds to the thickness of the corresponding first bonded substrate or second bonded substrate.

[0055] In one embodiment, the laminated substrate defines a plurality of bonding units. Each bonding unit is formed by being surrounded by a portion of a first bonding gap, a portion of a second bonding gap, or both, and the inside of the bonding unit does not have a first bonding gap or a second bonding gap. Furthermore, each bonding unit includes one or more cut units.

[0056] In one embodiment, the area of ​​at least one joint unit is 5000 mm². 2 That's all.

[0057] In one embodiment, the area of ​​at least one cutting unit is 5000 mm². 2 That's all.

[0058] In one embodiment, at least one first bonded substrate has a difference in area that spans both sides of a corresponding second bonded gap of 10% or less.

[0059] In one embodiment, the first bonded substrate defines a first thermal expansion coefficient, the second bonded substrate defines a second thermal expansion coefficient, and the difference between the first and second thermal expansion coefficients is 5 ppm / K or less.

[0060] In one embodiment, the adhesive layer defines a third thermal expansion coefficient, and the difference between the first thermal expansion coefficient and the third thermal expansion coefficient of the first bonded substrate is 30 ppm / K or less.

[0061] In one embodiment, the adhesive layer defines a third thermal expansion coefficient, and the difference between the first thermal expansion coefficient and the third thermal expansion coefficient of the first bonded substrate is 10 ppm / K or less.

[0062] In one embodiment, the laminated substrate further includes a gap filler, which is placed in at least a portion of the first and second bonding gaps. The gap filler defines a fourth thermal expansion coefficient, and the difference between the first and fourth thermal expansion coefficients of the first bonding substrate is 30 ppm / K or less.

[0063] In one embodiment, the gap filler and the adhesive layer are made of the same material.

[0064] In one embodiment, a plurality of first joint gaps define a first width, and a plurality of second joint gaps define a second width, and the first width, the second width, or both are 50 μm or more.

[0065] The present invention relates to electronic packaging, and includes a part of the laminated substrate, the laminated substrate defines a plurality of bonding units, each bonding unit is formed surrounded by a portion of a first bonding gap and a portion of a second bonding gap, and does not have a first bonding gap and a second bonding gap within the bonding unit itself. Furthermore, each bonding unit includes one or more cut units. The electronic packaging includes a part of the laminated substrate and includes at least one or more cut units.

[0066] In one embodiment, the area of ​​one or more bonding units is 5000 mm². 2 That's all.

[0067] In one embodiment, the area of ​​one or more cutting units is 5000 mm². 2 That's all. [Effects of the Invention]

[0068] In summary, the laminated substrate of the present invention includes a structure of two bonding layers, and the two bonding layers are bonded by different bonding substrates. Furthermore, there is a bonding gap between the bonding substrates of each bonding layer, and the physical strength of the laminated substrate is improved by offsetting the bonding gaps of each bonding layer. In addition, the bonding gaps between each bonding substrate provide a cutting position during subsequent substrate processing, thereby providing convenience in processing. [Brief explanation of the drawing]

[0069] [Figure 1A] This figure shows one embodiment of the present invention. [Figure 1B] This figure shows one embodiment of the present invention. [Figure 1C] This figure shows one embodiment of the present invention. [Figure 1D] This figure shows one embodiment of the present invention. [Figure 1E] This figure shows one embodiment of the present invention. [Figure 1F] This figure shows one embodiment of the present invention. [Figure 1G] This figure shows one embodiment of the present invention. [Figure 2A] This figure shows another embodiment of the present invention. [Figure 2B] This figure shows another embodiment of the present invention. [Figure 2C] This figure shows another embodiment of the present invention. [Figure 3A] This figure shows the relative relationship between each bonding substrate and gap-filling material of the present invention. [Figure 3B] This figure shows the relative relationship between each bonding substrate and gap-filling material of the present invention. [Figure 4A] This figure shows another embodiment of the present invention. [Figure 4B] This figure shows another embodiment of the present invention. [Figure 5A] This diagram shows the manufacturing process for Figure 4A of the present invention. [Figure 5B] This diagram shows the manufacturing process for Figure 4A of the present invention. [Figure 5C] This diagram shows the manufacturing process for Figure 4A of the present invention. [Figure 6A] This figure shows the manufacturing process of the present invention as shown in Figure 4B. [Figure 6B] This figure shows the manufacturing process of the present invention as shown in Figure 4B. [Figure 6C] This figure shows the manufacturing process of the present invention as shown in Figure 4B. [Figure 7A] This figure shows another embodiment of the present invention. [Figure 7B] This figure shows another embodiment of the present invention. [Figure 8A] This figure shows another embodiment of the present invention. [Figure 8B] This figure shows another embodiment of the present invention. [Figure 9] This figure shows the electronic implementation of the present invention. [Figure 10A] This figure shows one embodiment of the present invention and an electronic packaging system that applies it. [Figure 10B] This figure shows one embodiment of the present invention and an electronic packaging system that applies it. [Figure 11A] This figure shows another embodiment of the present invention. [Figure 11B] This figure shows another embodiment of the present invention. [Figure 12A] Figures 11A and 11B show electronic packaging that includes part of the present invention. [Figure 12B] Figures 11A and 11B show electronic packaging that includes part of the present invention. [Modes for carrying out the invention]

[0070] The following describes a better embodiment of the laminated structure of the present invention with reference to the drawings, and the same elements are denoted by the same reference numerals.

[0071] The advantages and features of the present invention and the structures that realize the present invention will be clearly described in the following embodiments with reference to the drawings. However, the present invention can be embodied in several different forms and should not be construed as being limited to the following embodiments. On the contrary, the embodiments disclosed below are provided to clarify and complete this specification and to fully convey the scope of the claims of the present invention to those skilled in the art, and the present invention is limited only to the claims. For this reason, the embodiments do not describe in detail conventional components, operations and techniques to avoid obscuring the technical features of the present invention. Throughout the specification, elements that are the same or approximate are denoted by the same or approximate reference numerals. Throughout the specification, when one element is connected to another element, it is stated that the element is "mechanically connected directly or indirectly" to the other element, or "electrically connected" to the other element, and further permits the insertion of one or more intermediate elements between them. Furthermore, it should be understood that in this specification, the terms "include" or "contain" specify the above features, integers, steps, operations, elements and / or assemblies, and do not preclude the presence or addition of one or more other features, integers, steps, operations, elements and / or assemblies, or combinations thereof. The terms "and / or" indicate the possibility of an intersection or union. Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as those commonly understood by those skilled in the art. It should be further understood that terms or terms (e.g., those defined in claims or common dictionaries) should be interpreted as having the same meaning in the description of the technology relating to them, and not as ideal or overly formal meanings unless explicitly defined herein.

[0072] Figures 1A, 1B, and 1C show embodiments of the laminated substrate 1 of the present invention. The laminated substrate 1 comprises a first bonding layer 10, a second bonding layer 20, and an adhesive layer 30. The first bonding layer 10 includes a plurality of adjacent first bonding substrates 101 and a plurality of first bonding gaps G10 (G10X, G10Y) located between these first bonding substrates 101. Each first bonding substrate 101 defines a corresponding first surface S1 and a second surface S2. The second bonding layer 20 includes a plurality of adjacent second bonding substrates 201 and a plurality of second bonding gaps G20 (G20X, G20Y) located between these second bonding substrates 201. Each second bonding substrate 201 defines a corresponding first surface S3 and a second surface S4. The adhesive layer 30 connects the first bonding layer 10 and the second bonding layer 20, and the adhesive layer 30 defines a first adhesive surface BS1 and a second adhesive surface BS2. The first adhesive surface BS1 of the adhesive layer 30 is connected to the second surface S2 of the first bonding substrate 101, and the second adhesive surface BS2 of the adhesive layer 30 is connected to the first surface S3 of the second bonding substrate 201. That is, the adhesive layer 30 connects the first bonding layer 10 and the second bonding layer 20 by connecting the first surface S3 of each second bonding substrate 201 to the corresponding second surface S2 of the first bonding substrate 101. The adhesive layer 30 can be positioned continuously or discontinuously between the first bonding layer 10 and the second bonding layer 20 and defines a planar direction (consisting of direction X and direction Y). At least some of the first bonding gaps (G10X, G10Y) and at least some of the second bonding gaps (G20X, G20Y) are offset from each other so as to be projected along the first adhesive surface BS1, the second adhesive surface BS2, or the direction Z of both perpendicular to the adhesive layer 30. The first bonding substrate 101 and the second bonding substrate 201 each define one or more peripheral edges 10E, 20E. The first bonding layer 10 and the second bonding layer 20 each define a contour, and the aforementioned contour is composed of corresponding peripheral edges 10E, 20E. As the contours of the first bonding layer 10 and the contours of the second bonding layer 20 approach each other, one or more peripheral edges 10E of the first bonding substrate 101 approach one or more peripheral edges 20E of the corresponding second bonding substrate 201, thereby improving the maximization of usable area. The laminated substrate 1 further defines a plurality of bonding units U.Each joining unit U is formed by being surrounded by a portion of a first joining gap G10 (G10X, G10Y), a portion of a second joining gap G20 (G20X, G20Y), or both, and does not have the first joining gap G10 and the second joining gap G20 within each joining unit U. In some embodiments, the first joining gap G10 (G10X, G10Y), the second joining gap G20 (G20X, G20Y), or both each define a width, and this width is 50 μm or more. Each joining unit U includes one or more cut units Usub, and in Figure 1A, each joining unit U includes a single cut unit Usub. As shown in Figure 1D or Figure 1E, each joining unit U includes multiple cut units Usub. In some embodiments, the area of ​​at least one joining unit U is 5000 mm². 2 That concludes the explanation. In some embodiments, the area of ​​one or more cutting units Usub is 5000 mm². 2 This concludes the explanation. The planar sizes of the first bonding substrate 101 and the second bonding substrate 201 of the present invention can be changed according to the demand, and the planar areas of two adjacent first bonding substrates 101 or two adjacent second bonding substrates 201 may be different. However, one of the objectives of the present invention is to bring the contours of the first bonding layer 10 and the second bonding layer 20 closer to each other by the bonding method. Furthermore, two adjacent bonding units U can be separated by a cutting method, and the cut positions can be located in the first bonding gap G10 and the second bonding gap G20, and the cut positions can be located on the first bonding substrate 101 or the second bonding substrate 201 close to the first bonding gap G10 and the second bonding gap G20.

[0073] In some embodiments, the laminated substrate 1 further includes gap-filling materials 41 and 42; see Figure 1F. The gap-filling materials 41 and 42 are placed in at least some of the first bonding gaps G10 (G10X, G10Y) and the second bonding gaps G20 (G20X, G20Y). The gap-filling materials 41 and 42 and the adhesive layer 30 may be made of the same material, but are not limited to this.

[0074] In the embodiments shown in Figures 1A to 1F, the projection of the second bonding substrate 201 in a direction perpendicular to the first surface S3 direction of the second bonding substrate 201 overlaps with at least a portion of the multiple (at least two) first bonding substrates 101. Therefore, the projections of the first bonding gaps (G10X, G10Y) and second bonding gaps (G20X, G20Y) contained in the first bonding layer 10 and second bonding layer 20 formed by bonding the multiple first bonding substrates 101 and the multiple second bonding substrates 201 are offset from each other in a direction perpendicular to the first surface S3 direction of the second bonding substrate 201.

[0075] Furthermore, please refer to Figure 1G. In one embodiment, one first bonding substrate 101a in the first bonding layer 10 is provided spanning four corresponding second bonding substrates 201. In this embodiment, when the second bonding gaps G20Y1 and G20X1 of the second bonding layer 20 are projected onto the position of the first bonding substrate 101a along a direction perpendicular to the direction of the first surface S3 or second surface S4 of the second bonding substrate 201 of the second bonding layer 20, the first bonding substrate 101a is divided into four areas (101a1, 101a2, 101a3 and 101a4), the areas of which are approximately the same, for example, the difference in area between the four areas is 10% or less, but is not limited to this.

[0076] Furthermore, Figure 2A shows another embodiment of the present invention. In this embodiment, the first bonding layer includes four first bonding substrates 101 having the same planar area; the second bonding layer includes four second bonding substrates 201 having the same planar area; after bonding the four first bonding substrates 101, first bonding gaps G10X, G10Y are formed, and the four second bonding substrates 201 are formed in second bonding gaps G20X, G20Y, with gap-filling materials 41, 42 placed in the first bonding gaps G10X, G10Y and the second bonding gaps G20X, G20Y, respectively. Next, refer to Figure 2B, where a bonding unit U is defined in the first bonding layer 10, and a plurality of cut units Usub are defined within the bonding unit U. A cut line is defined between two adjacent joint units U, and the cut line can be located in the first joint gap G10X, G10Y and / or the second joint gap G20X, G20Y, and is close to the first joint gap G10X, G10Y and / or the second joint gap G20X, G20Y, but does not have to be in the same position as them.

[0077] Refer to Figure 3A. The first bonding substrate 101 defines a first thickness T1, and the second bonding substrate 201 defines a second thickness T2. In some embodiments, the first thickness T1 is between 0.8 and 1.25 times the second thickness T2. In other embodiments, the second thickness T2 is between 0.8 and 1.25 times the first thickness T1. The first thickness T1 and the second thickness T2 are the average thicknesses of the first bonding substrate 101 and the second bonding substrate 201. In some embodiments, a height difference h11 is defined between two adjacent first bonding substrates 101 along a direction Z perpendicular to the first surface S1, where the height difference h11 is equal to 1 / 10 of the first thickness T1 of either of the two adjacent first bonding substrates 101, or the height difference h11 is 1 / 10 or less of the first thickness T1 of either of the two adjacent first bonding substrates 101, or the height difference h11 is 10 μm or less. In some embodiments, a height difference h12 is defined between two adjacent first bonding substrates 101 along a direction Z perpendicular to the second surface S2, and the height difference h12 is equal to 1 / 10 of the first thickness T1 of either of the two adjacent first bonding substrates 101, or the height difference h12 is 1 / 10 or less of the first thickness T1 of either of the two adjacent first bonding substrates 101, or the height difference h12 is 10 μm or less. In some embodiments, a height difference h21 is defined between two adjacent second bonding substrates 201 along a direction Z perpendicular to the first surface S3, and the height difference h21 is equal to 1 / 10 of the second thickness T2 of either of the two adjacent second bonding substrates 201, or the height difference h21 is 1 / 10 or less of the second thickness T2 of either of the two adjacent second bonding substrates 201, or the height difference h21 is 10 μm or less. In some embodiments, a height difference h22 is defined between the second surfaces S4 of two adjacent second bonding substrates 201 along a direction Z perpendicular to the second surface S4, wherein the height difference h22 is equal to 1 / 10 of the second thickness T2 of either of the two adjacent second bonding substrates 201, or the height difference h22 is 1 / 10 or less of the second thickness T2 of either of the two adjacent second bonding substrates 201, or the height difference h22 is 10 μm or less.In some embodiments, the adhesive layer 30 defines a thickness T3, and the thickness T3 is less than or equal to 1 / 10 of the first thickness T1 of the first bonding substrate 101 and / or less than or equal to 1 / 10 of the second thickness T2 of the second bonding substrate 201. Alternatively, the thickness T3 is 50 μm or less, or the thickness T3 is 10 μm or less.

[0078] In some embodiments, a height difference is defined along the direction Z perpendicular to the first surface S1 of the first bonding substrate 101 adjacent to the gap filling material 41, and this height difference is less than or equal to 1 / 10 of the first thickness T1 of the adjacent first bonding substrate 101, or the height difference is 10 μm or less. In some embodiments, a height difference is defined along the direction Z perpendicular to the second surface S2 of the first bonding substrate 101 adjacent to the gap filling material 41, and this height difference is less than or equal to 1 / 10 of the first thickness T1 of the adjacent first bonding substrate 101, or the height difference is 10 μm or less. In some embodiments, a height difference is defined along the direction Z perpendicular to the first surface S3 of the second bonding substrate 201 adjacent to the gap filling material 42, and this height difference is less than or equal to 1 / 10 of the second thickness T2 of the adjacent second bonding substrate 201, or the height difference is 10 μm or less. In some embodiments, the gap filling material 42 defines a height difference along the direction Z perpendicular to the second surface S4 of the adjacent second bonding substrate 201, and this height difference is less than or equal to 1 / 10 of the second thickness T2 of the adjacent second bonding substrate 201, or the height difference is 10 μm or less. Also, in some embodiments, the thicknesses of the gap filling materials 41 and 42 correspond to the first thickness T1 and the second thickness T2 of the corresponding first bonding substrate 101 or second bonding substrate 201. Further, refer to FIG. 3B. In some embodiments, the outer surfaces (i.e., the first surface S1) of two adjacent first bonding substrates 101 together define a polished surface S GD 10. The outer surfaces (i.e., the second surface S4) of two adjacent second bonding substrates 201 also define a polished surface S GD 20. The polished surfaces S GD 10, S GD20 further includes gap-filling materials 41 and 42, respectively. In order to reduce the height difference between the adjacent first bonding substrate 101, the adjacent second bonding substrate 201, and the corresponding gap-filling materials 41 and 42, and to bring these height differences closer to zero, the first bonding substrate 101, the second bonding substrate 201, and the gap-filling materials 41 and 42 of the bonding gap are flattened by a polishing or grinding process, and the polished surface S GD 10, S GD The flatness of the 20 is improved. High flatness significantly reduces the risk to product quality and yield due to excessive steps when the first bonded substrate 101 and / or the second bonded substrate 201 undergo the path and design process.

[0079] In some embodiments, the first junction substrate and / or the second junction substrate include inorganic materials, organic materials, or combinations thereof. For example, the first junction substrate and / or the second junction substrate include crystalline or amorphous silicon dioxide, glass, ceramics, compound semiconductor materials, polyimide, or combinations of one or more of the above materials. In some embodiments, the first junction substrate and the second junction substrate are made of the same material. In some embodiments, the first junction substrate and / or the second junction substrate have a load of 1.0 W / m². * A thermal conductivity of K or higher is defined. In some embodiments, the first bonding substrate and / or the second bonding substrate have an elastic modulus of 50 GPa (Gigapascal) or higher. In some embodiments, the first bonding substrate has a defined first thermal expansion coefficient, and the second bonding substrate has a defined second thermal expansion coefficient, with the difference between the first and second thermal expansion coefficients being 5 ppm / K or less. In some embodiments, the adhesive layer 30 has a defined third thermal expansion coefficient, with the difference between the first and third thermal expansion coefficients being 30 ppm / K or less, or 10 ppm / K or less. In some embodiments, the gap-filling materials 41 and 42 have a defined fourth thermal expansion coefficient, with the difference between the first and fourth thermal expansion coefficients being 30 ppm / K or less. The above thermal expansion coefficients are within a temperature range of 25°C to 400°C, and the setting of these values ​​is intended to reduce the risk of warping.

[0080] In some embodiments, the adhesive layer 30 includes an inorganic material, an organic material, or a combination thereof. For example, the adhesive layer 30 may be crystalline or amorphous silicon dioxide, glass, ceramic, epoxy resin, polyimide, or a combination of one or more of the above materials. Alternatively, the adhesive layer 30 may be glass frit, glass powder, glass paste, or a combination of one or more of the above materials. The addition of inorganic materials is used to alter the relevant properties of the adhesive layer 30, such as reducing the coefficient of thermal expansion (CTE), improving strength, and moisture resistance. In some embodiments, the thermal conductivity of the adhesive layer 30 is greater than that of the first bonding substrate 101 and the second bonding substrate 201. Furthermore, the thermal conductivity of the adhesive layer 30 is greater than twice that of the first bonding substrate 101 and the second bonding substrate 201.

[0081] In some embodiments, the gap-filling materials 41 and 42 include inorganic materials, organic materials, or combinations thereof. For example, the gap-filling materials 41 and 42 are crystalline or amorphous silicon dioxide, glass, ceramics, epoxy resins, polyimides, or combinations of one or more of the above materials. The addition of inorganic materials is used to alter the relevant properties of the gap-filling materials 41 and 42, such as reducing the coefficient of thermal expansion, or improving strength and moisture resistance. In some embodiments, the elastic modulus of the gap-filling materials 41 and 42 is smaller than the elastic modulus of the corresponding first bonding substrate 101 or second bonding substrate 201, thereby reducing the risk of warping of the laminated substrate.

[0082] Refer to Figure 4A. The laminated substrate 2 further includes one or more first electrical layer structures 50 provided on the first bonding layer 10 opposite to the adhesive layer 30, and the laminated substrate 2 further includes one or more second electrical layer structures 60 provided on the second bonding layer 20 opposite to the adhesive layer 30. In some embodiments, the laminated substrate 2 includes only the first electrical layer structure 50 or only the second electrical layer structure 60. In other embodiments, the laminated substrate 2 includes both the first electrical layer structure 50 and the second electrical layer structure 60. In Figure 4A, the first electrical layer structure 50 and the second electrical layer structure 60 cover a gap-filling material 41 and a gap-filling material 42, respectively, which are placed between two adjacent first bonding substrates 101 and between two adjacent second bonding substrates 201. In Figure 4A, the laminated substrate 2 further includes a plurality of conductive holes 70, which penetrate the first bonding substrate 101, the adhesive layer 30, and the second bonding substrate 201, connecting the first surface S1 of the first bonding substrate 101 and the second surface S4 of the second bonding substrate 201, and electrically connecting the first electrical layer structure 50 and the second electrical layer structure 60. See Figure 4B. The structure of the laminated substrate 2A is similar to that of the laminated substrate 2 in Figure 4A, the difference being that the first electrical layer structure 50 and the second electrical layer structure 60 are located only on the outer surface of the first bonding substrate 10T and the adjacent outer surface of the second bonding substrate 20T, but do not cover the gap-filling materials 41A and 42A, i.e., the gap-filling materials 41A and 42A are exposed on the outer surfaces of the first electrical layer structure 50 and the second electrical layer structure 60.

[0083] Figures 5A, 5B, and 5C show an example of the manufacturing process for the laminated substrate 2 of Figure 4A. As shown in Figure 5A, the first bonding layer 10 and the second bonding layer 20 are joined by an adhesive layer 30, gap-filling materials 41 and 42 are placed between the bonding substrates, and then the first electrical layer structure 50 and the second electrical layer structure 60 are fabricated or placed on the outer surfaces of the first bonding layer 10 and the second bonding layer 20. The order of fabrication or placement is not limited. In this embodiment, the second electrical layer structure 60 is fabricated or placed first. As shown in Figure 5B, multiple through-holes 70v are obtained by performing a drilling process on the substrate structure of Figure 5A. The through-holes 70v penetrate the first bonding substrate 101, the adhesive layer 30, and the second bonding substrate 201. See also Figure 5C. Next, conductive material 70m is placed in some of the through-holes 70v shown in Figure 5B to form these conductive holes 70, thereby connecting the first surface S1 of the first bonding substrate 101 and the second surface S4 of the second bonding substrate 201, and further electrically connecting to the second electrical layer structure 60. After placing the conductive material 70m in the through-holes 70v, the first electrical layer structure 50 is manufactured or placed on the first surface S1 of the first bonding substrate 101, and is electrically connected to the second electrical layer structure 60 by these conductive holes 70. It should be noted that the above process is just one example of a process for placing conductive holes 70, and is not limited thereto. For example, in another process, conductive holes 70 may be formed in the first and second bonding layers first, and then the first electrical layer structure 50 and / or the second electrical layer structure 60 may be manufactured or placed.

[0084] Figures 6A, 6B, and 6C show an example of the manufacturing process for the laminated substrate 2A in Figure 4B. Please refer to Figure 6A. The second surface S4 of the second bonding layer 20 has a second electrical layer structure 60A and a plurality of conductive holes 70A2. These conductive holes 70A2 connect the first surface S3 and the second surface S4 of the second bonding substrate 201 and electrically connect to the second electrical layer structure 60A. Subsequently, the first surface S3 of the second bonding layer 20 is placed on the adhesive layer 30A, and gap-filling material 42A is placed between the plurality of second bonding substrates 201. The order in which the adhesive layer 30A and the gap-filling material 42A are placed is not restricted. Subsequently, a plurality of through holes 70A3v corresponding to these conductive holes 70A2 are formed in the adhesive layer 30A. As shown in Figure 6B, by placing conductive material 70A3m in at least some of the through holes 70A3v formed in Figure 6A, a plurality of conductive holes 70A3 are formed, and these conductive holes 70A3 are electrically connected to the corresponding conductive holes 70A2 and communicate with one surface of the second bonding layer 20 opposite to the adhesive layer 30A. See also Figure 6C. The first electrical layer structure 50A and the first bonding layer 10 having a plurality of conductive holes 70A1 are bonded in Figure 6B, and the adhesive layer 30A is on the opposite side of the surface of the second bonding layer 20. The first electrical layer structure 50A is located on the first surface S1 of the first bonding layer 10. These conductive holes 70A1 communicate the first surface S1 and the second surface S2 of the first bonding substrate 101 and are electrically connected to the first electrical layer structure 50A. Since the conductive holes 70A1 of the first bonding layer 10 are electrically connected to the conductive holes 70A3 in Figure 6B, they are formed in the conductive holes 70A of the laminated substrate 2A in Figure 4B.

[0085] In some embodiments, the adhesive layer of the laminated substrate is a thermal conductive layer, or includes a thermal conductive layer. The thermal conductive layer includes a conductive or non-conductive thermal conductive material and / or thermal conductive particles. See Figures 7A and 7B. The adhesive layer is a composite adhesive structure 30X, which includes an adhesive layer 30 and thermal conductive layers 31 and 32 disposed on both sides of the adhesive layer 30, with thermal conductive layer 31 disposed between the adhesive layer 30 and the first bonded substrate 101, and thermal conductive layer 32 disposed between the adhesive layer 30 and the second bonded substrate 201. The thermal conductive layers 31 and 32 may be pre-disposed on both the upper and lower sides of the adhesive layer 30, or pre-disposed on the first bonded substrate 101 and the second bonded substrate 201. The laminated substrate 3A in Figure 7B has a structure similar to the laminated substrate 3 in Figure 7A, the difference being that in the composite adhesive structure 30X of the laminated substrate 3, the heat conductive layers 31 and 32 are pre-placed on both the upper and lower sides of the adhesive layer 30, so the adhesive layer 30 covers the positions of the corresponding gap-filling materials 41 and 42. In the composite adhesive structure 30XA of the laminated substrate 3A, the heat conductive layers 31A and 32A are pre-placed on the corresponding first bonding substrate 101 and second bonding substrate 201, so the adhesive layer 30 does not cover the positions of the gap-filling materials 41 and 42. The heat conductive layers 31, 32, 31A, and 32A in Figures 7A and 7B are non-conductive heat conductive materials and / or heat conductive particles, such as carbon nanotubes and / or graphene, and / or multiple silicon carbide (SiC) and / or silicon (Si) thermal conductive particles.

[0086] Please refer to Figures 8A and 8B. The structures of the laminated substrate 3C and the laminated substrate 3D are similar to the laminated substrates 3 and 3A in Figures 7A and 7B, respectively. The thermal conductive layers 31C, 32C, 31D, and 32D of the laminated substrate 3C and the laminated substrate 3D are conductive thermal conductive material and / or thermal conductive particles, or conductive thermal conductive material and / or thermal conductive particles. Since the thermal conductive layers 31C, 32C and 31D, 32D do not come into contact with the conductive holes 70A, the thermal conductive layers 31C, 32C and 31D, 32D are insulated from the conductive holes 70A. The thermal conductive layers 31C, 32C and 31D, 32D are metal layers or contain multiple metal particles.

[0087] Furthermore, please refer to Figure 4A. The laminated substrate 2 is further cut into multiple cut units Usub to be produced. Please also refer to Figure 9. Figure 9 shows an electronic assembly 400, which includes a conductive plate 90 and a part of the laminated substrate 2 (one or more cut units Usub obtained by cutting the laminated substrate 2) placed on the conductive plate 90. In this embodiment, the electrical layer of the laminated substrate 2 is a single-layer electrical layer. Furthermore, please refer to Figure 10A. In one embodiment, the electrical layer structures 50R and 60R of the laminated substrate 4 are redistribution layer (RDL) structures, the laminated substrate 4 can be cut into cut units Usub, and one or more cut units Usub are placed on the conductive plate 90 to produce an electronic assembly as shown in Figure 10B.

[0088] The laminated substrate of the present invention can be further applied as follows. Please refer to Figure 11A. Laminated substrate 5A includes two laminated substrates 2 joined by an adhesive layer 80A, where the second electrical layer structure 60 of the second bonding layer 20 / second bonding substrate 201 of one laminated substrate 2 and the first electrical layer structure 50 of the first bonding layer 10 / first bonding substrate 101 of the other laminated substrate 2 are electrically connected by a plurality of conductive holes 70y. For various embodiments and materials of the adhesive layer 80A, please refer to the description of the adhesive layer 30. In another embodiment, the laminated substrate 5B of Figure 11B includes two laminated substrates 4 joined by an adhesive layer 80B, where the second electrical layer structure 60R of the second bonding layer 20 / second bonding substrate 201 of one laminated substrate 4 and the first electrical layer structure 50R of the first bonding layer 10 / first bonding substrate 101 of the other laminated substrate 4 are electrically connected by a plurality of conductive holes 70z.

[0089] Furthermore, please refer to Figure 12A. The electronic assembly 600 in this embodiment includes a conductive plate 90 and a part of the laminated substrate 5A (one or more cut units Usub obtained by cutting the laminated substrate 5A) that is placed on the conductive plate 90. Also, the electronic assembly 700 in Figure 12B includes a conductive plate 90 and a part of the laminated substrate 5B (one or more cut units Usub obtained by cutting the laminated substrate 5B) that is placed on the conductive plate 90. In this embodiment, the first electrical layer structure 50R and the second electrical layer structure 60R are redistribution layer (RDL) structures, and the line widths are arranged from smallest to largest. In addition, the conductive holes 70z are electrically connected to at least two electrical layer structures 60R and 50R of the laminated substrate 5B, or two opposing surfaces of the two laminated substrates 5B are connected, but are not limited to this.

[0090] In summary, the laminated substrate of the present invention provides a large-dimensional substrate, and since the laminated substrate can be cut into small-dimensional cut units, it becomes a "small, high-performance substrate" used in various advanced packaging applications. In current technology, some high-performance substrates are limited by the size of the substrate, making it difficult to manufacture large-area conductive circuits and resulting in high manufacturing costs. Therefore, the present invention forms a large bonded substrate by offset bonding of substrates, performs patterned circuit manufacturing processes on this bonded substrate, and then divides it as needed, thereby achieving both high-performance substrate manufacturing and cost reduction.

[0091] As described above, various embodiments of the present invention are described in the specification for illustrative purposes and various modifications are possible without departing from the scope and spirit of the invention. Therefore, it should be understood that these various embodiments do not limit the true scope and spirit of the invention.

[0092] The above are illustrative and not limiting. All equivalent modifications or changes made without departing from the spirit and scope of the present invention should be included in the claims. [Industrial applicability]

[0093] This invention achieves both high-performance substrate manufacturing and cost reduction by forming a large bonded substrate through offset bonding of substrates, performing patterned circuit manufacturing processes on this bonded substrate, and then dividing it as needed. [Explanation of symbols]

[0094] 1, 2, 2A, 3, 3A, 3C, 3D, 4, 5A, 5B laminated board 10 1st bonding layer 10T, 101, 101a 1st bonding board Area 101a1~101a4 10E, 20E Peripheral 20 Second bonding layer 20T, 201 2nd bonding board 30, 30A, 80A, 80B adhesive layer 30X, 30XA composite adhesive structure 31, 31A, 31C, 31D, 32, 32A, 32C, 32D Heat conductive layer 41, 41A, 42, 42A Gap-filling material 400, 600 Electronic Packaging 50, 50A, 50R, 60, 60A, 60R Electrical layer structure 70, 70A, 70A1~70A3, 70y, 70z conductive hole 70m, 70A3m conductive material 70v, 70A3v through hole 90 conductive plate BS1, BS2 adhesive surface G10, G10X, G10Y, G20, G20X, G20Y, G20X1, G20Y1 Joint gap h11, h12, h21, h22 Height difference S1~S4 surface S GD 10, S GD 20 Polished surface T1~T3 Thickness U-joint unit Usub Cut Unit X, Y, Z direction

Claims

1. The first bonding substrate includes a plurality of adjacent first bonding substrates and a plurality of first bonding gaps located between the first bonding substrates, and each of the first bonding substrates includes a first bonding layer that defines a corresponding first surface and a second surface. The second bonding substrate includes a plurality of adjacent second bonding substrates and a plurality of second bonding gaps located between the second bonding substrates, and each of the second bonding substrates includes a second bonding layer defining a corresponding first surface and a second surface. The device comprises an adhesive layer disposed between the first bonding layer and the second bonding layer, and defining a first adhesive surface and a second adhesive surface, The first adhesive surface of the adhesive layer is connected to the second surface of each of the first bonded substrates, and the second adhesive surface of the adhesive layer is connected to the first surface of each of the second bonded substrates, so that the first bonded layer and the second bonded layer are connected. A laminated substrate characterized in that at least a portion of the first bonding gap and the second bonding gap do not overlap along the projection direction of the first bonding surface, the second bonding surface, or both, which are perpendicular to the adhesive layer.

2. The laminated substrate according to claim 1, characterized in that each of the plurality of first bonding substrates and the plurality of second bonding substrates defines one or more peripheries, and one or more of the peripheries of one of the first bonding substrates approaches one or more of the corresponding peripheries of the second bonding substrate.

3. The laminated substrate according to claim 1, characterized in that the first bonding substrate, the second bonding substrate, or both, include silicon dioxide, glass, ceramic, compound semiconductor material, polyimide, or a combination of one or more of the above materials.

4. The thermal conductivity of the first bonding substrate and / or the second bonding substrate is 1.0 W / m². ＊ The laminated substrate according to claim 1, characterized in that it is K or higher.

5. The laminated substrate according to claim 1, characterized in that the elastic modulus of the first bonding substrate, the second bonding substrate, or both is 50 GPa or more.

6. The laminated substrate according to claim 1, characterized in that the first bonding substrate of the first bonding layer defines a first thickness, and the first surface, the second surface, or both of two adjacent first bonding substrates define a height difference along a direction perpendicular to the first surface, the second surface, or both of the first bonding substrates, wherein the height difference is 1 / 10 or less of the first thickness of the two adjacent first bonding substrates, or the height difference is 10 μm or less.

7. The laminated substrate according to claim 1, characterized in that the second bonding substrate of the second bonding layer defines a second thickness, and the first surface, the second surface, or both of two adjacent second bonding substrates define a height difference along a direction perpendicular to the first surface, the second surface, or both of the second bonding substrates, wherein the height difference is 1 / 10 or less of the second thickness of the two adjacent second bonding substrates, or the height difference is 10 μm or less.

8. The laminated substrate according to claim 1, characterized in that the first bonding substrate defines a first thickness, the second bonding substrate defines a second thickness, and the second thickness is 0.8 times or more the first thickness and 1.25 times or less the first thickness.

9. The laminated substrate according to claim 1, characterized in that the thermal conductivity of the adhesive layer is equal to or greater than the thermal conductivity of the first bonded substrate and the second bonded substrate.

10. The laminated substrate according to claim 9, characterized in that the ratio of the thermal conductivity of the adhesive layer to the thermal conductivity of the first bonding substrate or the second bonding substrate is 1:2 or greater.

11. The laminated substrate according to claim 1, characterized in that the adhesive layer defines the thickness of the adhesive layer, the first bonding substrate defines a first thickness, the second bonding substrate defines a second thickness, the thickness of the adhesive layer is 1 / 10 or less of the first thickness of the corresponding first bonding substrate, the thickness of the adhesive layer is 1 / 10 or less of the second thickness of the corresponding second bonding substrate, or 1 / 10 or less of the sum of the first and second thicknesses.

12. The laminated substrate according to claim 1, characterized in that the adhesive layer defines the thickness of the adhesive layer, and the thickness of the adhesive layer is 50 μm or less.

13. The laminated substrate according to claim 1, further comprising a gap-filling material, wherein the gap-filling material is disposed in at least a portion of the first bonding gap and the second bonding gap.

14. The laminated substrate according to claim 1, characterized in that the elastic modulus of the gap filler is smaller than the elastic modulus of the corresponding first bonding substrate, or smaller than the elastic modulus of the second bonding substrate.

15. The laminated substrate according to claim 1, wherein the laminated substrate further defines a plurality of bonding units, each bonding unit is formed by being surrounded by a portion of the first bonding gap and a portion of the second bonding gap, the first bonding gap and the second bonding gap are excluded from within the bonding unit, and each bonding unit includes one or more cut units.

16. The laminated substrate according to claim 1, characterized in that at least one of the first bonded substrates has an area difference of 10% or less that spans both sides of any of the corresponding second bonded gaps.

17. The laminated substrate according to claim 1, characterized in that the first bonding substrate defines a first thermal expansion coefficient, the second bonding substrate defines a second thermal expansion coefficient, and the difference between the first thermal expansion coefficient and the second thermal expansion coefficient is 5 ppm / K or less.

18. The laminated substrate according to claim 1, characterized in that a plurality of first bonding gaps define a first width, a plurality of second bonding gaps define a second width, and the first width, the second width, or both are 50 μm or more.

19. Including a part of the laminated substrate described in claim 1, The aforementioned laminated substrate defines a plurality of bonding units, each bonding unit is formed by being surrounded by a portion of the first bonding gap and a portion of the second bonding gap, the inside of the bonding unit excludes the first bonding gap and the second bonding gap, each bonding unit includes one or more cut units, and a portion of the laminated substrate includes at least one or more cut units, characterized in that it is an electronic packaging assembly.

20. One or more of the aforementioned joining units are 5000 mm ２ The electronic mounting method according to claim 19, characterized in that the above area is defined.

21. One or more of the aforementioned cutting units are 5000 mm ２ The electronic mounting method according to claim 19, characterized in that the above area is defined.

Images