Imaging Sensor Assembly

Abstract

The image sensor assembly for an imaging device of the present invention incorporates numerous features that reduce weight and allow for integration into the objective lens focusing mechanism of the imaging device. The image sensor, image display, and optionally, image intensifier and / or power supply are integrated directly into the imaging module housing. A flex circuit attached to the module housing can incorporate electromagnetic interference filtering, grounding circuitry, and power supply. An objective snout attached to the module housing allows for direct connection to the objective lens focusing mechanism. The image sensor assembly may use components recycled from existing image sensor assemblies to reduce waste and costs.

Description

[Background technology]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of earlier-filed and co-pending U.S. Provisional Patent Application No. 63 / 431,211, filed December 8, 2022, the entire contents of which are incorporated herein by reference.

[0002] This application is directed to the field of imaging. In particular, this application is directed to the field of military and commercial image correction devices and improved image sensor assemblies for such devices.

[0003] Typically, night vision and other imaging devices have been limited to architectures that result in heavy and, in some cases, cumbersome products. Mounting them on a human head, which may already be wearing other heavy equipment, such as a combat helmet, can result in distraction, physiological neck strain, and / or injury. Simply put, wearing the devices can result in injury or discomfort. Such injury and / or distraction can have serious adverse effects on the pilot or operator of the mission-critical imaging device.

[0004] Previous attempts to reduce the weight of imaging devices have focused on either removing unnecessary components to reduce the weight of individual devices or using lightweight materials to reduce the weight of components, but there is a limit to what can be removed from the existing architecture, and the trade-off is often that lighter materials are less robust.

[0005] The proposed imaging assembly is used as part of an improved imaging device, integrating components and functions to modify the system architecture to make the imaging device lighter. [Brief explanation of the drawings]

[0006] [Figure 1a]1 illustrates an external view of one embodiment of an imaging assembly. [Figure 1b] 1 illustrates a cross-sectional view of one embodiment of an imaging assembly. [Figure 1c] 10 shows a cross-sectional view of another embodiment of an imaging assembly. [Figure 2] 1 shows a flowchart of one exemplary embodiment of a method for utilizing off-the-shelf imaging assembly components in the imaging assembly. DETAILED DESCRIPTION OF THE INVENTION

[0007] Certain terminology has been used in this description for the purposes of brevity, clarity, and understanding. Such terminology is used solely for descriptive purposes and is intended to be broadly construed, without unnecessary limitations being applied thereto beyond the requirements of the prior art. The various systems and methods described herein may be used alone or in combination with other systems and methods. Various equivalents, alternatives, and modifications are contemplated within the scope of the appended claims. Each limitation in the appended claims is intended to invoke construction under 35 U.S.C. 112, sixth paragraph, only if the respective limitation expressly recites the words "means for" or "step for."

[0008] 1a-1c includes a mechanical objective snout 120 attached to an improved imaging module 110. The imaging module 110 includes a module housing 130. An image sensor 111 is disposed within the module housing 130. The image sensor 111 can be any type of image intensifier or imaging sensor known in the art for use in night vision devices or other image correction devices. As a non-limiting example, in the embodiment shown in FIG. 1b, the image sensor 111 is a photocathode sensor. As a non-limiting example, in the embodiment shown in FIG. 1c, the image sensor 111 is a camera sensor. It should be further understood that whenever this application refers solely to night vision devices, references to all image correction devices are included.

[0009] 1a-1c has a hollow configuration with sidewalls extending between an open distal end and a proximal end connected to the module housing. This configuration allows the objective snout 120 to function as a guide along which the objective lens subassembly, or a portion thereof (not shown), can slide back and forth to adjust focus from infinity to a near focus. In various embodiments, the means for moving the objective lens subassembly is mechanical, electrical, magnetic, or a combination thereof.

[0010] The objective snout 120 includes at least one objective focus screw opening 123 through its sidewall for at least one focus screw (not shown). During assembly, the objective lens subassembly is inserted into the open distal end of the objective snout 120, followed by the focus screw. After the focus screw(s) are installed, the objective lens subassembly can be rotated for focus adjustment. While the illustrated embodiment uses a screw, other retention mechanisms, such as a pin or other retention mechanisms known in the art, can also be used. This allows the image sensor assembly 100 to be an integral part of the objective focus mechanism for achieving focus in certain embodiments.

[0011] The objective snout 120 also serves as the female sealing surface of the objective lens subassembly. The objective snout 120 acts as an environmental seal against moisture, water, or other contaminants, ensuring that the objective lens subassembly and imaging sensor 111 are properly purged. A seal is formed when the male component of the objective lens subassembly is inserted into the objective snout 120. The male component of the objective lens subassembly may include a structure similar to an O-ring seal, although other embodiments are contemplated. Thus, the objective snout 120 becomes a second feature that demonstrates that the image sensor assembly 100 can be part of an objective lens focus mechanism.

[0012] The image sensor assembly 100 also includes a diopter (eyepiece) focusing feature. At least one grip retaining flange 121, in the form of a flange extending around the periphery of the objective snout 120, provides a surface against which a diopter adjustment grip (not shown) can be held. The diopter adjustment grip slides over the periphery of the objective snout 120 against the grip retaining flange 121. A grip retaining ring (not shown) then slides over the objective snout 120 behind the diopter adjustment grip and is held in place against the objective snout 120 by at least one grip retaining screw in at least one grip retaining screw opening 122. While the illustrated embodiment uses screws, other retention mechanisms, such as pins or other retention mechanisms known in the art, could also be used. The diopter grip is thus sandwiched between the grip retaining flange 121 and the retaining ring. The remainder of the diopter adjustment mechanism, such as a screw that moves the eyepiece back and forth, may be located elsewhere in the imaging device.

[0013] As the diopter grip rotates, it loads against the grip retention flange 121 or the retainer ring, depending on the direction of rotation, causing the image sensor assembly 100 to slide in and out to provide diopter focus for the imaging device. Thus, the diopter adjustment features are now integrated into the image sensor assembly 100, and the image sensor assembly 100 becomes an integral part of the diopter adjustment mechanism of the imaging device by including interface features for locking the diopter focus ring to the image sensor assembly 100.

[0014] In various embodiments, the mechanical objective snout 120 may be connected to the module housing 130 or may be integrally formed with the module housing 130 .

[0015] Image sensor assembly 100 also includes at least one seal feature. In the embodiment shown in Figures 1a and 1b, the at least one seal feature includes two seal grooves 114 on module housing 130 for retaining two seals 140, thereby sealing the diopter side of the imaging device from the external environment. These seals may be O-rings or other seals known in the art.

[0016] The image sensor assembly 100 also includes at least one detent 118. In this embodiment, the detent 118 is a slotted “racetrack” oval shape on the module housing 130; however, other configurations may be used depending on the desired size, orientation, and axis of movement of the image sensor assembly 100 within the imaging device. When the image sensor assembly 100 is attached to the imaging device, a protrusion, such as, but not limited to, a screw or pin, may enter the slot from another assembly within the imaging device. Movement of the image sensor assembly 100 relative to the protrusion is limited by the constraint of the detent 118. In embodiments in which the image sensor assembly 100 has a cylindrical configuration, the detent 118 prevents the image sensor assembly 100 from over-rotating about its longitudinal axis within the imaging device. This ensures an uninterrupted electrical connection between the image sensor assembly 100 and the imaging device. The detent 118 may also prevent the image sensor assembly 100 from being overextended linearly along the longitudinal axis. This prevents the image sensor assembly 100 from moving too far during diopter adjustment and either damaging the purge on the diopter side or clogging other assemblies.

[0017] Power can be supplied to the image sensor assembly 100 in a variety of modes without changing the specific design of the image sensor assembly 100. In one embodiment, at least one power opening 117 passes through the module housing 130, allowing at least one wire (not shown) to pass through the module housing 130 as well. These wires can be routed anywhere in the imaging device. The simplest approach is to provide an opening in another assembly within the imaging device. The diameter of the at least one power opening 117 is such that the wire can slide back and forth.

[0018] In the embodiment shown in FIG. 1a, the at least one flex circuit 112 may be attached to the exterior surface of the module housing 130 by adhesive or other means available to those skilled in the art. In various embodiments, the various structures and functions of the at least one flex circuit 112, described below, may be divided among multiple interconnected or separate flex circuits 112. Ground and positive wires (not shown) may be attached to the flex circuit 112 by soldering or other means available to those skilled in the art. If grounding to the imaging module 110 is required for electromagnetic interference (EMI) shielding, a ground wire (not shown) may be spliced ​​at one end to the ground circuit of the flex circuit 112 and soldered at the other end to at least one ground post 115. In certain other embodiments, the ground post 115 may be replaced by a conductive ground plating that at least partially covers the imaging module 110. The splice may be performed in a variety of ways, from at least one EMI pad 113e on the flex circuit 112 to simply splicing directly to the ground wire.

[0019] Another option is to route the ground and positive wires through the ground and positive solder pads 113a and 113b, respectively. If EMI is not a concern, these solder pads 113a and 113b can be plated or otherwise applied directly to the exterior surface of the module housing 130. Even if EMI is a concern, other embodiments can include applying a conductive plating to the module housing 130 if the module housing 130 is made from a non-conductive polymer material.

[0020] Alternatively, electrical pads 113c and 113d may be provided by flex circuit 112. In certain embodiments, electrical pads 113c and 113d may provide a moving surface for making electrical contact with other assemblies of an imaging device to power imaging module 110. In various embodiments, the contact may be a roller contact, a spring-loaded plunger contact, a leaf spring connect, other methods known to those skilled in the art, or any combination thereof. In such embodiments, electrical pads 113c and 113d extend along module housing 130 or flex circuit 112 at least as far as image sensor assembly 100 is intended to move within the imaging device along its longitudinal axis to ensure uninterrupted contact.

[0021] In certain embodiments, another electrical pad 113 may be used for external gain adjustment. This electrical pad 113 may be located on the flex circuit 112 and connected to wires (not shown) extending from at least one power supply 116 to provide external gain adjustment. Additional contact and / or solder pads 113 may be added by one skilled in the art as needed for additional functionality.

[0022] An optional external EMI filter 119 may be used in embodiments intended for high-EMI environments. This EMI filter 119 may be turned off in embodiments intended for low-EMI environments. The optional EMI filter 119 may be formed on the flex circuit 112 attached to the imaging module 110. As noted above, the ground and positive wires may be soldered to the flex circuit 112, and in this case, to the EMI filter 119. Note that FIG. 1a shows separate pads 113a and 113b for wires from the power supply 116 and separate pads 113c and 113d for interfacing with other parts of the device. However, in certain embodiments, solder pad 113a or 113b, electrical pad 113c or 113d, and optional EMI pad 113e may be combined into one strip or bus on the flex circuit 112 as a composite pad 113 that functions as a ground.

[0023] Image sensor assembly 100 also includes at least one purge opening 124. In the embodiment shown in FIG. 1a, purge opening 124 is provided on the objective side of image sensor assembly 100, penetrating the sidewall of objective snout 120, to provide a means for removing atmospheric moisture from the space between the objective lens subassembly and image sensor 111. This space is then filled with a dry, inert gas. Purging is performed after the objective lens subassembly is installed and is necessary to prevent moisture from condensing on image sensor 111 and affecting visual performance. As a result, the objective side of image sensor assembly 100 is purged independently from the opposing eyepiece side of image sensor assembly 100 using a second purge opening 124. In other embodiments, purge opening 124 accesses a shared volume within image sensor assembly 100, allowing both the objective side and eyepiece side to be purged simultaneously.

[0024] Image sensor assembly 100 also provides a means for ensuring collimation of the imaging device. Seal groove 114 may be fitted with seal 140 or similar centering mechanisms known in the art. These may act as springs that allow the optical and mechanical axes of image sensor assembly 100 to be centered or otherwise positioned relative to other assemblies within the imaging device. This allows for optical collimation of the imaging device.

[0025] The imaging module 110 further includes an image display 150 for displaying an image from the image sensor 111. As a non-limiting example, in the embodiment shown in FIG. 1b, the image display 150 is a phosphor screen used in conjunction with a photocathode sensor. As a non-limiting example, in the embodiment shown in FIG. 1c, the image display 150 is a digital screen used in conjunction with a camera. In certain embodiments, the image display 150 can be integrated with the image sensor 111 or bonded to the image sensor 111 in an integrated or sealed combination. In one non-limiting example, the photocathode sensor and phosphor screen are combined as a sealed unit. If desired, in certain embodiments, an image intensifier 160 can be interconnected with the image sensor 111 and the image display 150 to amplify the detected image so that it appears more easily or is more perceptible on the image display 150.

[0026] In various embodiments, image display 150 may also include at least one display input / output port 151. Display input / output port 151 may be used for a variety of tasks, including, but not limited to, receiving images and other information from image sensor 111 and other elements, and transmitting images and other information from image display 150. Image display 150 may also include user controls 152, such as, but not limited to, adjusting image display 150, power control, and control of image sensor 111. In various embodiments, image sensor 111 may also include at least one sensor input / output port 153. Sensor input / output port 153 may be used for a variety of tasks, including, but not limited to, transmitting images and other information from image sensor 111, and receiving images and other information from other elements.

[0027] In certain embodiments, the image sensor assembly 100 includes additional elements such as, but not limited to, an optical filter element on the input of the image sensor assembly 100, a feature for mounting at least one camera or display on the output of the image sensor assembly 100, and additional circuitry between the seal grooves 114.

[0028] In certain embodiments, imaging module 110 utilizes components removed and reused from an existing standard imaging module. Such reused components may include image sensor 111, image display 150, image intensifier 160, power supply 116, and necessary electrical contacts. The components removed from the standard imaging module may be retained or encapsulated by module housing 130. Other embodiments may include components of standard imaging module 110 removed from an existing imaging device and reassembled within module housing 130 using the following method 200 shown in FIG. 2 .

[0029] Certain embodiments may also include a method 200 for utilizing components of a pre-fabricated assembly in the image sensor assembly 100 described herein by removing and reusing these elements from a pre-fabricated assembly in the imaging module 110. In certain embodiments, the pre-fabricated assembly is an ANVIS night vision imaging assembly or other similar module.

[0030] At optional block 202, the method 200 removes a pre-fabricated assembly from an existing imaging device.

[0031] At block 204, the method 200 removes the image sensor 111, the image display 150, and optionally the image intensifier 160 and / or the power supply 116 from the prefabricated assembly.

[0032] At block 206, the method 200 removes and discards the remaining components of the prefabricated assembly, including, but not limited to, the assembly housing, the photocathode glass, and the access glass.

[0033] At optional block 208, the method 200 cleans the image sensor 111, the image display 150, the image intensifier 160, and / or the power supply .

[0034] At optional block 210, the method 200 attaches, coats, or otherwise connects at least one insulating material to the image sensor 111, the image display 150, the image intensifier 160, and / or the power supply .

[0035] At block 212, the method 200 reassembles the image sensor 111, image display 150, and optionally the image intensifier 160, and / or power supply 116 into the module housing 130 to create the module 110 described above.

[0036] The above description uses certain terminology for the purposes of brevity, clarity, and understanding. Such terminology is used for descriptive purposes and is intended to be broadly interpreted, so that no unnecessary limitations beyond the requirements of the prior art are to be inferred therefrom. The various structures, systems, and method steps described herein may be used alone or in combination with other structures, systems, and method steps. Various equivalents, alternatives, and modifications are contemplated within the scope of the appended claims.

Claims

1. 1. An imaging assembly comprising: an imaging module including an image sensor within a module housing; an objective snout connected at a proximal end to the module housing; An imaging assembly, wherein the open distal end of the objective snout is configured to receive an objective lens subassembly.

2. 10. The assembly of claim 1, wherein the image sensor is an image sensor recycled from an existing imaging module.

3. The assembly of claim 1 , wherein the imaging module further comprises at least one flex circuit attached to the module housing.

4. The assembly of claim 3 , wherein the at least one flex circuit includes at least one pad.

5. The assembly of claim 3 , wherein the at least one flex circuit includes an EMI filter.

6. The assembly of claim 1 , wherein the module housing includes at least one pad, the at least one pad comprising a conductive plating on an exterior surface of the module housing.

7. The assembly of claim 6 , wherein the module housing comprises a non-conductive polymer material.

8. The assembly of claim 1 , wherein the imaging module further comprises at least one image display.

9. The assembly of claim 8 , further comprising at least one image amplifier interconnecting said image sensor and said at least one image display.

10. The assembly of claim 1 , further comprising at least one seal groove extending about a periphery of the outer surface of the module housing.

11. The assembly of claim 1 , further comprising at least one ground post extending from an outer surface of the module housing.

12. The assembly of claim 1 , wherein the imaging module further comprises at least one power source.

13. 13. The assembly of claim 12, wherein the at least one power supply is at least one power supply recycled from an existing imaging module.

14. The assembly of claim 1 , wherein the imaging module includes at least one power opening through the module housing.

15. The assembly of claim 1 , wherein the imaging module includes at least one detent.

16. The assembly of claim 1 , wherein the objective snout has a hollow configuration with a sidewall extending between the open distal end and the proximal end.

17. The assembly of claim 1 , wherein the objective snout includes at least one grip-retaining flange extending about a periphery of the objective snout.

18. 18. The assembly of claim 17, further comprising at least one grip retaining screw opening extending through a sidewall of the objective snout.

19. The assembly of claim 1 , wherein the objective snout includes at least one objective focus screw opening extending through a sidewall of the objective snout.

20. The assembly of claim 1 , wherein the objective snout includes at least one purge opening extending through a sidewall of the objective snout.

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