Suction mechanism, article manufacturing device, semiconductor manufacturing device

Abstract

To solve the problem in which: there has been demanded a die bonder that, when replacing a tool that adsorbs a workpiece, such as a collet and a lead frame holding body, can mount the tool in a state in which leak is prevented without requiring an excessive burden on attachment adjustment work.SOLUTION: A semiconductor manufacturing device comprises an adsorption mechanism comprising: a tool that can suck and adsorb a workpiece; a tool holder that includes a suction path; and a positioning unit that, when the tool holder holds the tool, determines the relative position of the tool with respect to the tool holder. The positioning unit includes at least one convex part that is arranged on at least one of the tool and the tool holder, is formed of elastic material, and has a tapered surface, and at least one concave part that is arranged in the other of the tool and the tool holder and can be fitted to the convex part.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to an apparatus and method for mounting, for example, a semiconductor chip on a lead frame or the like. [Background technology]

[0002] There are various types of electronic devices, and many of them include, for example, a semiconductor package in which a semiconductor chip is mounted on a lead frame, and a circuit package in which an electronic component such as a semiconductor chip is mounted on a circuit board. Semiconductor packages and circuit packages are manufactured, for example, by the following procedure. First, a large number of integrated circuits are formed on a semiconductor wafer, and the semiconductor wafer is cut in a dicing process to divide it into semiconductor chips (dies). Then, in a bonding process, electronic components such as semiconductor chips (dies) are bonded to a lead frame or a circuit board. The device used in this bonding process is a die bonding device, so-called a die bonder. A die bonder is a device that mounts electronic components on a lead frame or a board and bonds them using a bonding material such as solder, gold, or resin, but in some cases, it can also be used to mount and bond another electronic component on an already bonded electronic component.

[0003] For example, when an electronic component is bonded to the surface of a substrate or the like using a die bonder, a suction nozzle called a collet is used to pick up and suck the electronic component, and transport it to a predetermined position for bonding. The bonding material is then heated to perform bonding. The collet may be used only to pick up and transport the electronic component, or may also be used to apply a pressing force to the electronic component during bonding. A collet is a holder that has suction holes and sucks in air to suck and hold the electronic component, and a collet that is suited to the size and shape of the electronic component to be sucked is used.

[0004] In such a die bonder, when changing the type of electronic component to be bonded, it is necessary to replace the collet with one of a size and shape suitable for the new electronic component. Even when continuously bonding the same type of electronic component, it is necessary to replace the collet with a new one at appropriate times to prevent the collet from wearing out and damaging the surface of the electronic component, or to prevent dirt from adhering to the collet and contaminating the surface of the electronic component. Therefore, in the field of die bonders, devices that can replace tools such as collets are known.

[0005] For example, Patent Document 1 discloses a bonding head in which a collet is detachably held by fitting into a collet holder. A through slit (through opening) is formed in the collet holder, and a retaining pin is attached to the through slit. The collet is retained in the collet holder by engaging the retaining pin with a retaining groove of the collet.

[0006] Patent Document 2 discloses a semiconductor manufacturing device that includes a collet replacement unit for replacing collets, the collet replacement unit being provided with an opening / closing arm having a claw structure and a collet clamp unit. The collet holder is provided with a clearance for the claws, and the device attaches and detaches the collet to and from the collet holder by controlling the opening / closing arm. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 10-135251 [Patent Document 2] JP 2018-206843 A Summary of the Invention [Problem to be solved by the invention]

[0008] In order to pick up electronic components by suction, to transport electronic components while suctioning and holding them, and to apply sufficient pressing force to electronic components during bonding, the collet must be able to suction the electronic components with sufficient suction force during these operations. If air leaks occur in the suction path to the suction hole, sufficient suction force cannot be obtained. However, with conventional die bonders, air leaks can occur and suction force can decrease when the collet is replaced.

[0009] For example, in the bonding head described in Patent Document 1, a collet and a collet holder, both of which are rigid bodies, are fitted together to form an air suction path. When fitting the collet and the collet holder, if the collet and the collet holder are not properly aligned, the fitting surface may come into contact with the non-fitting surface and be damaged, or the corners of the fitting structure may come into contact with the smooth surface and the fitting parts may scratch each other. If the machining accuracy of the corners or fitting surfaces that constitute the fitting parts is insufficient, damage due to contact may occur during the fitting operation. Therefore, when the collet is replaced, the airtightness of the fitting surface may become insufficient, causing air leaks and making it difficult to perform the bonding operation.

[0010] The semiconductor manufacturing device described in Patent Document 2 also had the same problem. That is, when the opening and closing arm is operated to engage the collet and the collet holder while the alignment is insufficient, the engaging surface may come into contact with the non-engaging surface and be damaged, or the corners of the engaging structure may come into contact with the smooth surface and the engaging portions may scratch each other. If the machining accuracy of the corners or the engaging surface that constitute the engaging portion is insufficient, damage due to contact may occur during the engaging operation. Therefore, when the collet is replaced, the airtightness of the engaging surface may become insufficient, causing air leaks and making it difficult to carry out the bonding operation.

[0011] In addition, in die bonders, the lead frame to which the electronic components are bonded may be held by a lead frame holder using suction. When changing the type of lead frame, the lead frame holder must be replaced, and in that case, the same air leak problem as with the above-mentioned collet replacement may occur.

[0012] Therefore, there was a need for a die bonder that could install tools while suppressing leakage when replacing tools that adsorb the workpiece, such as collets or lead frame holders, without placing an excessive burden on the alignment work at the time of installation. [Means for solving the problem]

[0013] One aspect of the present invention is a tool holder that is capable of adsorbing a workpiece by suction, a tool holder having a suction path, and a positioning unit that determines a relative position of the tool with respect to the tool holder when the tool holder holds the tool, the positioning unit being configured to determine the relative position of the tool and the tool holder. Our At least one protrusion having a tapered surface and formed of an elastic material is disposed on one side of the tool and the tool holder. Among them, the convex portion is not provided At least one recessed portion is disposed on the side of the protruding portion and is engageable with the protruding portion. a position restriction portion disposed on one of the tool and the tool holder and configured to suppress deformation of the protrusion; The adsorption mechanism is characterized by comprising: Effect of the Invention

[0014] According to the present invention, it is possible to provide a die bonder that can mount a tool while suppressing leakage when replacing a tool that adsorbs a workpiece, such as a collet or a lead frame holder, without placing an excessive burden on the alignment work at the time of installation. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is a schematic perspective view of a die bonder according to an embodiment. [Diagram 2]FIG. 2 is a schematic cross-sectional view showing a lead frame holding mechanism of the die bonder according to the first embodiment. [Diagram 3] FIG. 2 is a perspective view of a suction mechanism according to the first embodiment. [Figure 4] FIG. 2 is a cross-sectional view of the suction mechanism according to the first embodiment. [Diagram 5] (a) is a cross-sectional view showing a state before a collet is attached to a collet holder in the suction mechanism of embodiment 1. (b) is a cross-sectional view showing a state in which a collet is attached (held) in a collet holder in the suction mechanism of embodiment 1. (c) is a cross-sectional view showing a state in which a collet has adsorbed a semiconductor chip in the suction mechanism of embodiment 1. [Figure 6] FIG. 4 is a top view of the collet and the collet holder according to the first embodiment, as viewed from the Z direction. [Figure 7] (a) The collet is moved above the semiconductor chip, (b) the collet has adsorbed the semiconductor chip, and (c) the collet has picked up the semiconductor chip. [Figure 8] (a) is a top view of one of the mating parts as viewed from the Z direction, (b) is a cross-sectional view showing the state of the convex part and the concave part before mating. [Figure 9] (a) A cross-sectional view showing the state before mating. (b) A diagram showing the state where the collet (convex portion) and the position regulating portion are in contact. (c) A diagram showing the state where the collet (convex portion) and the collet holder (concave portion) are close to each other. (d) A diagram showing the state where the collet (convex portion) and the collet holder (concave portion) are in contact. (e) A diagram showing the state where mating is completed. [Figure 10] 13 is a top view of a collet and a collet holder according to a first modified example of the first embodiment, as viewed from the Z direction. FIG. [Figure 11] (a) A cross-sectional view showing a state before mating in a second modified example of embodiment 1. (b) A diagram showing a state in which a collet (convex portion) and a collet holder (concave portion) are in contact with each other in the second modified example of embodiment 1. (c) A diagram showing a state in which mating is completed in the second modified example of embodiment 1. [Figure 12](a) A cross-sectional view showing a state before mating in a third modified example of embodiment 1. (b) A view showing a state in which the collet (convex portion) and the collet holder (concave portion) are in contact with each other in the third modified example of embodiment 1. (c) A view showing a state in which mating is completed in the third modified example of embodiment 1. [Figure 13] (a) A cross-sectional view showing a state before mating in a fourth modified example of embodiment 1. (b) A diagram showing a state in which the collet (convex portion) and the collet holder (concave portion) are in contact in the fourth modified example of embodiment 1. (c) A diagram showing a state in which mating is completed in the fourth modified example of embodiment 1. (d) A plan view of the convex portion in the fourth modified example of embodiment 1. [Figure 14] FIG. 11 is a schematic plan view showing a lead frame holding mechanism according to the second embodiment. [Figure 15] FIG. 11 is a schematic cross-sectional view showing a lead frame holding mechanism according to the second embodiment. [Figure 16] FIG. 13 is a top view of a collet and a collet holder according to a fifth modified example of the first embodiment, as viewed from the Z direction. [Figure 17] FIG. 13 is a top view of a collet and a collet holder according to a sixth modified example of the first embodiment, as viewed from the Z direction. [Figure 18] FIG. 13 is a top view of a collet and a collet holder according to a seventh modified example of the first embodiment, as viewed from the Z direction. [Figure 19] FIG. 13 is a top view of a collet and a collet holder according to an eighth modified example of the first embodiment, as viewed from the Z direction. [Figure 20] FIG. 23 is a top view of a collet and a collet holder according to a ninth modified example of the first embodiment, as viewed from the Z direction. [Figure 21] FIG. 23 is a top view of a collet and a collet holder according to a tenth modified example of the first embodiment, as viewed from the Z direction. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A suction mechanism, an article manufacturing apparatus, a semiconductor manufacturing apparatus, and the like according to embodiments of the present invention will be described with reference to the drawings. In the drawings referred to in the following description of the embodiments, elements denoted by the same reference numbers have the same or similar functions unless otherwise specified.

[0017] [Embodiment 1] Fig. 1 is a schematic perspective view for explaining a die bonder according to an embodiment. The die bonder 100 as a semiconductor manufacturing device picks up a semiconductor chip 11 (die) as a workpiece, transports it to an island portion 42 provided on a lead frame 41 as a mounting member, places it there, and performs bonding. Note that Fig. 1 is a schematic diagram in which a portion of the die bonder 100 is extracted for the convenience of explaining the present invention, and some mechanical and electrical elements such as a housing, a fixed base, and a power supply that are provided to fulfill the function of a practical device are not shown.

[0018] (Die bonder configuration) The die bonder 100 includes a wafer support device 14 , a collet 21 , a collet holder 22 , a bonding arm 23 , a transport unit 24 , a camera 31 for the supply unit, a camera 32 for the island unit, and a control unit 200 . The control unit 200 is a computer for controlling the operation of the die bonder 100, and includes a CPU, a ROM, a RAM, an I / O port, and the like.

[0019] The programs for executing various processes according to the present embodiment may be stored in a ROM together with other programs, or may be loaded into the RAM from an external source via a network, or may be loaded into the RAM via a recording medium on which the programs are recorded.

[0020] The I / O port is connected to an external device or a network, and can input and output data required for bonding between an external computer, for example. The I / O port is also connected to a monitor or input device (not shown), and can display information on the operation status of the die bonder to an operator and can receive commands from the operator.

[0021] The control unit 200 is connected to components including the bonding arm 23, the transport unit 24, the supply unit camera 31, and the island unit camera 32, and controls these components using control signals.

[0022] The wafer support device 14 is a device that supports a semiconductor wafer 13 that has been diced (divided) into a large number of semiconductor chips 11. In the wafer support device 14, a predetermined area on which the semiconductor wafer 13 is placed is called a supply section 12, and the semiconductor chips 11 for die bonding are supplied from the supply section 12.

[0023] The collet 21 (tool) has a suction portion capable of suctioning the semiconductor chip 11 (workpiece). Specifically, the lower end surface of the collet 21 is provided with suction holes capable of vacuum suction, and the semiconductor chip 11 can be suctioned by bringing the lower end surface close to or in contact with the semiconductor chip 11 and suctioning through the suction holes. Furthermore, by releasing the vacuum suction after suction, the semiconductor chip 11 that was being suctioned can be released.

[0024] The collet holder 22 (tool holder) is a holding mechanism that detachably holds the collet 21 (tool). The collet 21 that is compatible with the size and shape of the semiconductor chip 11 to be attracted is attached to the collet holder 22. As will be described in detail later, in the die bonder 100 of this embodiment, the collet 21 is held by the collet holder 22 by magnetic force.

[0025] A suction path is provided in the collet holder 22, and when the collet holder 22 holds the collet 21, the suction holes of the collet 21 are connected to the suction path of the collet holder 22. By supplying negative pressure from a vacuum pump or the like to the suction holes of the collet 21 via this suction path, the collet 21 can suction the semiconductor chip 11. As will be described in detail later, the die bonder 100 of this embodiment includes a flexible member for airtightly connecting the suction holes of the collet 21 to the suction path of the collet holder 22 when the collet holder 22 holds the collet 21 by magnetic force.

[0026] The collet holder 22 is connected to a bonding arm 23, and the bonding arm 23 has a movable mechanism for adjusting the position and posture of the collet holder 22. For example, when picking up a semiconductor chip 11 from the supply unit 12, the bonding arm 23 adjusts the height of the collet holder 22 so that the lower end surface of the collet 21 approaches or abuts on the semiconductor chip 11 to be picked up. Also, when bonding the semiconductor chip 11 to the island portion 42 of the lead frame 41, the bonding arm 23 adjusts the position and posture of the collet holder 22 so that the semiconductor chip 11 adsorbed by the collet 21 approaches or abuts on the island portion 42. Furthermore, the position and posture of the collet holder 22 may be adjusted so that the semiconductor chip 11 is pressed against the island portion 42 with an appropriate force.

[0027] The bonding arm 23 is connected to a transport unit 24, and the transport unit 24 can move the bonding arm 23 so that the collet 21 can freely move between the supply unit 12 of the wafer support device 14 and the island portion 42 of the lead frame 41. The transport unit 24 can move the bonding arm 23 in each of the X, Y, and Z directions and in the θ direction around the Z axis.

[0028] The supply unit camera 31 is a camera capable of capturing an image of the vicinity of the supply unit 12. The supply unit camera 31 transmits image data to the control unit 200 in order to confirm the position and orientation of the semiconductor chip 11 placed on the supply unit 12 and to confirm the position and orientation of the collet 21 when picking up the semiconductor chip 11. When the die bonder 100 performs a pick-up operation, the control unit 200 controls the position and orientation of the collet 21 using the image data transmitted from the supply unit camera 31.

[0029] The island portion camera 32 is a camera capable of capturing an image of the vicinity of the island portion 42 of the lead frame 41. The island portion camera 32 transmits image data to the control unit 200 in order to confirm the position and orientation of the island portion 42 and to confirm the position and orientation of the collet 21 when bonding the semiconductor chip 11. The control unit 200 controls the position and orientation of the collet 21 using the image data transmitted from the island portion camera 32 when the die bonder 100 performs a bonding operation.

[0030] (Die bonding method) Before describing each part of the die bonder 100 in more detail, an outline of a die bonding method using the die bonder 100 will be given.

[0031] First, in preparation for starting die bonding, a semiconductor chip 11 as a work is placed on a supply unit 12. Also, a lead frame 41 as a member to be attached is set on a lead frame holder 40 (described later with reference to FIG. 2) as a member to be attached.

[0032] Thereafter, the control unit 200 of the die bonder 100 causes the supply unit camera 31 to capture an image of the semiconductor chip 11 to be picked up, confirms the position and orientation of the semiconductor chip 11, and drives the transport unit 24 and bonding arm 23 to move the collet 21.

[0033] As shown in Fig. 7(a), collet 21 is positioned above semiconductor chip 11, and then collet 21 is lowered as shown in Fig. 7(b) to bring the lower end face close to or into contact with semiconductor chip 11, and semiconductor chip 11 is sucked by suction through the suction holes. Then, collet 21 is raised as shown in Fig. 7(c) to pick up semiconductor chip 11. At this time, control unit 200 can feedback-control the operations of transport unit 24, bonding arm 23, suction mechanism, etc. based on image data captured by supply unit camera 31.

[0034] Furthermore, the control unit 200 causes the island unit camera 32 to capture an image of the island unit 42 (predetermined position) where bonding is to be performed, and confirms its position and orientation. Then, the control unit 200 drives the transport unit 24 and the bonding arm 23 to move the collet 21, which has adsorbed the semiconductor chip 11, above the island unit 42, for example, along the path indicated by the arrow in FIG.

[0035] Then, collet 21 is lowered to bring semiconductor chip 11 into contact with or close to island portion 42, and suction is stopped, whereby semiconductor chip 11 can be placed on island portion 42. Thereafter, the bonding material is heated to bond semiconductor chip 11 to lead frame 41. Note that control unit 200 may control bonding arm 23 so that collet 21 presses semiconductor chip 11 against lead frame 41 during bonding. At that time, control unit 200 can feedback-control the operations of transport unit 24, bonding arm 23, suction mechanism, heating mechanism, etc., based on image data captured by island portion camera 32.

[0036] After completing the bonding of one semiconductor chip through the above procedure, the die bonder 100 sequentially picks up another semiconductor chip and bonds it to a predetermined island part. Note that the object of die bonding is not limited to the island part of the lead frame, and for example, a first semiconductor chip may be die bonded to a second semiconductor chip mounted on a lead frame.

[0037] (Lead frame holding mechanism) Next, a mechanism for holding lead frame 41 as a mounting member will be described. Fig. 2 is a schematic cross-sectional view of the holding mechanism taken along the YZ plane direction in Fig. 1. 2, the lead frame 41 is held by a lead frame holder 40. The lead frame holder 40 has a rail portion 40b that surrounds the periphery of the lead frame 41 and a receiving portion 40a that supports the bottom surface of the lead frame 41, and holds the lead frame 41 in a detachable manner.

[0038] The rail portion 40b is a position restricting portion that restricts the position of the lead frame 41 in a horizontal plane to fall within a predetermined range. For example, when the lead frame 41 is set on the lead frame holder 40 in an area not shown in Fig. 1 and moved to the position shown in Fig. 1, the position of the lead frame 41 is restricted so that the island portion 42 does not shift beyond the size of the semiconductor chip 11. Specifically, for example, the position and shape of the rail portion 40b are determined so that a clearance of about 0.5 mm remains even if the lead frame is at the maximum size within the dimensional tolerance in the Y direction.

[0039] (Adsorption mechanism) Next, a suction mechanism for picking up a semiconductor chip 11 as a workpiece will be described with reference to Figures 3 to 6, 8, 9, etc. In the die bonder of this embodiment, a dedicated collet is prepared for each type of workpiece (semiconductor chip), and a collet appropriate for the workpiece to be bonded is selected and attached to the collet holder to constitute the suction mechanism.

[0040] 3 is a perspective view of the suction mechanism, which includes a collet 21, a collet holder 22, and a bonding arm 23. The collet holder 22 detachably holds the collet 21, and FIG.

[0041] The bonding arm 23 is provided with a Z-direction actuator 121 for moving the collet 21 and the collet holder 22 in the Z direction. The Z-direction actuator 121 can perform movement in the Z direction and feedback control of the pressing load during bonding under the control of the control unit 200. When performing operations such as picking up, placing, and bonding the semiconductor chip 11, the Z-direction actuator 121 is operated to raise and lower the collet. At this time, the operation of the Z-direction actuator is controlled by feedback of the pressing load so that the semiconductor chip 11 is not deformed or damaged, and a force greater than a predetermined load is not applied.

[0042] Fig. 4 is a schematic cross-sectional view of collet 21 and collet holder 22 cut along bent line BB shown in Fig. 3, i.e., a path passing through convex portion 102c, suction path 108, and convex portion 102a. Fig. 6 is a top view of collet 21 and collet holder 22 as viewed from the Z direction.

[0043] Collet 21 includes, as its components, collet base 103, protrusions 102a, 102b, 102c, seating surfaces 104a, 104b, 104c, position restricting portions 117a, 117b, 117c, and workpiece suction portion 106, which are integrated together. Collet 21 is provided with suction path 108 penetrating the inside, and suction hole 109 for sucking semiconductor chip 11 is disposed at the lower end of suction path 108.

[0044] Collet holder 22 includes recesses 112a, 112b, 112c, magnet 113, and seats 114a, 114b, and 114c as integral components. Collet holder 22 is provided with suction path 116 penetrating the inside, and suction path 116 is connected to a negative pressure application mechanism (such as a vacuum pump or a control valve) (not shown).

[0045] The magnet 113 of the collet holder 22 and the collet base 103 are arranged to face each other, and the collet base 103 is made of a ferromagnetic material. When the collet 21 is attached to the collet holder 22, the collet base 103 is subjected to an attractive force by the magnetic force of the magnet 113, and the collet 21 is detachably held by the collet holder 22. Note that in this embodiment, the mechanism for detachably holding the collet using magnetic force is not limited to this configuration, and for example, a magnet may be provided on the collet side, and the collet holder may be made of a ferromagnetic material. Alternatively, a first magnet may be provided on one of the collet and the collet holder, and a second magnet may be provided on the other, and the first magnet and the second magnet may be arranged so that their opposite magnetic poles face each other.

[0046] The strength of the holding force when the collet holder holds the collet is set so that the collet can be stably held during the series of bonding operations, but no excessive external force needs to be applied when removing the collet, and a magnet with a magnetic force according to the setting is used. This is to make it easier to attach and detach the collet when replacing it, and to prevent unexpected damage caused by excessive external force.

[0047] 6, magnets 113 are arranged symmetrically around suction path 116 so that the necessary holding force is applied uniformly to each part of the collet and collet holder. However, the magnets may be arranged in an exception manner as long as the necessary holding force is applied uniformly. Although a permanent magnet is used for magnet 113, an electromagnet may also be used if implementation is possible.

[0048] In the suction mechanism of this embodiment, an elastically deformable flexible member 115 is disposed between collet 21 and collet holder 22. In the example of Fig. 4, flexible member 115 is fixed to a recess in collet holder 22, but it may be fixed to the collet 21 side, or it may be sandwiched between collet holder 22 and collet 21 without being fixed to either collet holder 22 or collet 21.

[0049] 6, flexible member 115 is an annular member, and when viewed in a plan view from the Z direction, has a circular ring shape surrounding the periphery of suction path 108 of collet 21 and the periphery of suction path 116 of collet holder 22. Note that the shape of the ring when viewed in a plan view is not limited to a circular ring and may be a ring of another shape, but from the viewpoint of stability and reproducibility of elastic deformation, a symmetrical shape is preferable, and among these, a circular ring is particularly desirable.

[0050] The flexible member 115 elastically deforms so as to come into close contact with both the upper end surface of the collet 21 and the lower end surface of the collet holder 22 when the collet 21 is held by the collet holder 22 with a holding force that does not require an excessively large external force for removal. In other words, the flexible member 115 is formed of a material that can easily elastically deform with the holding force of the above-mentioned degree and can airtightly connect the suction path 108 and the suction path 116 (connecting the two and sealing them from the atmosphere). For this reason, the flexible member 115 can contain, for example, any of the materials rubber, porous resin, and magnetic fluid. In addition, the annular flexible member 115 is preferably arranged in a concentric shape with the suction path 116 as the center. This is because the flexible member 115 can be uniformly elastically deformed in the suction direction even with a weak suction force.

[0051] (How to attach the collet) Next, a method of mounting the collet 21 in the collet holder 22 will be described with reference to FIGS. 5(a) to 5(c), 6, and so on. 5(a) to 5(c) are schematic cross-sectional views of collet 21 and collet holder 22 cut along bent line BB shown in Fig. 3, i.e., a path passing through convex portion 102c, suction path 108, and convex portion 102a. For ease of illustration, the dimensions and shapes of each part are not drawn to scale.

[0052] Fig. 5(a) shows a state before collet 21 is attached to collet holder 22, and Fig. 5(b) shows a state in which collet 21 is attached (held) in collet holder 22. Also, Fig. 5(c) shows a state in which collet 21 held by collet holder 22 adsorbs semiconductor chip 11.

[0053] The convex portions 102a, 102b, and 102c of the collet 21 and the concave portions 112a, 112b, and 112c of the collet holder 22 act as positioning mechanisms that can fit together. That is, as shown in FIG. 5(b), when the collet holder 22 holds the collet 21, they fit together and restrain each other, so that the collet holder 22 can hold the collet 21 without rattling. In this embodiment, three pairs of fitting portions each consisting of a pair of a convex portion and a concave portion are provided, but an appropriate number of pairs can be provided taking into consideration positioning accuracy, mechanical strength, spatial margin, manufacturing cost, and the like. However, in order to stabilize the posture when held, it is desirable to arrange the positioning mechanisms symmetrically around the suction path.

[0054] Magnet 113 (magnet) provided in collet holder 22 and collet base 103 (ferromagnetic body) provided in collet 21 act as holding means for detachably holding the collet in the collet holder by magnetic force. That is, when collet 21 is aligned with and brought close to collet holder 22, collet base 103 is subjected to an attractive force by the magnetic force of magnet 113, and collet 21 is held in collet holder 22. When replacing the collet, it is possible to remove the collet from the collet holder by applying an external force greater than the attractive force of the magnet (holding force of the holding means).

[0055] The attractive force of the magnet (holding force of the holding means) must be set to a strength that will prevent the collet from rattling due to weight or inertia when the semiconductor chip 11 (workpiece) is picked up or transported by suction, as shown in Fig. 5(c). However, the attractive force of the magnet (holding force of the holding means) is not necessarily the stronger the better, and it is best to set it within a range that does not require an excessively large external force when removing the collet from the collet base.

[0056] 5(b), it is preferable to set the positional relationship between magnet 113 and collet base 103 so that magnet 113 and collet base 103 face each other with a small gap between them when collet holder 22 holds collet 21. This is because if magnet 113 and collet base 103 are positioned so that they come into contact with each other, there is a possibility that magnet 113 will be worn down when the collet is attached or detached.

[0057] For this reason, when the collet is attached, as shown in Fig. 5(b), the lower surface of collet holder 22 and the upper surface of collet base 103 are spaced apart by distance L2. By ensuring distance L2 as a clearance, a positional relationship in which magnet 113 and collet base 103 do not come into contact with each other can be realized. In order to ensure distance L2, seating surfaces 104a, 104b, and 104c of collet 21 are provided at positions higher than the upper surface of collet base 103. Then, when attached, seating surfaces 104a, 104b, and 104c of collet 21 come into contact with seating surfaces 114a, 114b, and 114c of collet holder 22.

[0058] In this embodiment, as shown in Figs. 3 and 6, three pairs of collet side seating surfaces and collet holder side seating surfaces are arranged equiangularly and equidistantly around the suction path. However, the embodiment of the present invention is not limited to this, and an appropriate number and shape of collet side seating surfaces and collet holder side seating surfaces can be provided taking into consideration positioning accuracy, mechanical strength, spatial margin, manufacturing cost, etc. In addition, in order to ensure the distance L2, the seating surfaces 104a to 104c are configured to protrude from the upper surface of the collet base 103 in this embodiment, but the seating surfaces 114a to 114c of the collet holder 22 may be configured to protrude from the lower surface of the collet holder 22. In addition, the seating surfaces do not necessarily have to be installed near the positioning mechanism (the convex portions 102a to 102c, the concave portions 112a to 112c), and may be arranged at a distance.

[0059] Next, a description will be given of flexible member 115. Flexible member 115 is a member for air-tightly connecting suction hole 109 (suction path 108) of collet 21 and suction path 116 of collet holder 22 from the outside air when collet holder 22 holds collet 21 by magnetic force.

[0060] The flexible member 115 of this embodiment has a base that fits into an annular groove provided in the collet holder 22, and an annular inclined surface with one end connected to the base (protruding from the base) so as to be inclined with respect to the Z direction. The inclination direction of the annular inclined surface is set so that the tip of the ring opens toward the collet, that is, as shown in FIG. 5(b), the inner diameter D1 (annular diameter) on the side in contact with the collet is larger than the inner diameter D2 (annular diameter) on the collet holder side. In other words, the annular inclined surface is inclined in a direction such that the inner diameter D2 on the side connected to the base (the collet base side in the example of FIG. 5(b)) is smaller and the inner diameter D1 on the opposite tip side not connected to the base is larger.

[0061] When the collet 21 is not attached to the collet holder 22, as shown in Fig. 5(a), it protrudes by L1 in the Z direction from the lower surface of the collet holder 22. Here, L1 is set to be larger than the above-mentioned L2.

[0062] When collet 21 is attached to collet holder 22, flexible member 115 is elastically deformed by the holding force of the holding means, as shown in Fig. 5(b). That is, the inclined surface protrudes by L2 in the Z direction from the bottom surface of collet holder 22, and the bottom end deforms so as to come into close contact with the top surface of collet base 103. The top surface of flexible member 115 is also brought into close contact with collet holder 22 by the holding force of the holding means. As a result of the elastic deformation, the inclination of the inclined surface with respect to the Z direction increases, and inner diameter D1 becomes larger than before collet 21 was attached.

[0063] Flexible member 115, which is in close contact with both collet holder 22 and collet 21, constitutes an airtight connection portion that connects suction path 116 (suction hole 109) of collet 21 and suction path 116 of collet holder 22 and seals them from the atmosphere.

[0064] As shown in FIG. 5(c), when the semiconductor chip 11 (workpiece) is held by using the collet 21, the suction path is evacuated and the semiconductor chip 11 (workpiece) is adsorbed at the suction hole 109. However, in this embodiment, the elastically deformable flexible member 115 is interposed, so that the suction path is excellent in airtightness. In the conventional method of directly abutting the rigid collet and the collet holder to connect the suction path, air leakage may occur from a small gap, and it was necessary to repeatedly adjust the attachment when attaching the collet. In contrast, in this embodiment, the flexible member 115 is elastically deformed by the holding force of the holding mechanism using magnetic force, and it is in close contact with both the collet and the collet holder to connect the suction path, so there is no need to repeatedly adjust the attachment of the collet. Moreover, in this embodiment, the relative positions of the collet and the collet holder are fixed by the above-mentioned positioning mechanism, so that there is no risk of unexpected twisting of the flexible member 115 after the collet is attached, causing leakage. In addition, according to this embodiment, leakage can be prevented with a small and lightweight structure. A compact and lightweight structure makes it possible to perform advanced position control.

[0065] In addition, when carrying out the present invention, for example, a doughnut-shaped flexible member with a circular cut surface can be used. However, in this embodiment, since the flexible member 115 is composed of a base and a slope as described above, the sealing performance when the suction path is evacuated can be particularly excellent. That is, due to the internal and external pressure difference generated when the suction path is evacuated, the upper surface and side of the base are pressed more strongly against the groove of the collet holder, and the tip of the slope opposite the base is pressed more strongly against the upper surface of the collet. In this way, the flexible member of this embodiment is not only tightly attached by the holding force of the magnetic force, but also the atmospheric pressure acts in a direction that further improves the adhesion, so that the sealing performance when evacuating is particularly excellent.

[0066] (Regarding fitting parts) In this embodiment, the configuration of the fitting mechanism consisting of the convex parts 102a to 102c and the concave parts 112a to 112c is devised so that the alignment accuracy required at the stage of FIG. 5(a) can be relaxed when attaching the collet to the collet holder. Furthermore, as shown in FIG. 6, the position regulating parts 117a to 117c are arranged so as to ensure the alignment accuracy required for the fitting mechanism. This will be described with reference to FIG. 8(a) to FIG. 8(b), FIG. 9(a) to FIG. 9(e), etc. In the following description, when matters common to each of the convex parts 102a to 102c are described, these may be collectively referred to as the convex part 102. Similarly, when it is not necessary to distinguish each of the concave parts 112a to 112c individually, these may be collectively referred to as the concave part 112. Similarly, when there is no need to distinguish between the position regulating portions 117a to 117c, they may be collectively referred to as position regulating portion 117.

[0067] Fig. 8(a) is a top view of one of the three fitting mechanisms, i.e., the convex portion 102c, the concave portion 112c, and the position restricting portion 117c, in a state before they are fitted together, as viewed from the Z direction. Fig. 8(b) is a cross-sectional view showing the state before the convex portion 102c and the concave portion 112c are fitted together. As shown in Fig. 3, the other two fitting mechanisms are provided at different positions on the collet base, but the shapes of the convex portion, the concave portion, and the position restricting portion that constitute the fitting mechanism are the same as those shown in Figs. 8(a) and 8(b).

[0068] As illustrated in Fig. 8(b), the convex portion 102 has a pin shape with a maximum outer diameter of d2 when not engaged. The convex portion 102 is provided with a slit 105 (slit 105c in the case of the convex portion 102c) of a predetermined depth extending from the tip to the base. When looking at the pin-shaped convex portion 102 from the tip towards the base, the tip is a flat surface with a diameter of d1, passes through a tapered surface 107 connected to the flat surface, reaches the body portion with the maximum outer diameter, and the outer diameter decreases on the base side of the body portion. Note that the depth of the slit 105 is desirably at least the depth from the tip to the body portion so as to enable appropriate elastic deformation to be described later. In the example of Fig. 8(b), an example reaching further to the base side than the body portion is shown.

[0069] The concave portion 112 is a through hole and has a shape in which semicircles are joined to both ends of a rectangle as shown in Fig. 8(a) when viewed from the Z direction. When the longitudinal length of the concave portion 112 is L and the lateral length is D when viewed from the Z direction, the convex portion 102 and the concave portion 112 are configured to satisfy the following relational expression (1). d1 < D < d2 < L ··· (Relational expression 1)

[0070] As described above, the convex portion 102 has a pin shape with a slit in the center. However, since it is formed of an elastic material, when engaging with the concave portion 112 having an inner diameter of D in the lateral direction, it can elastically deform in a direction in which the maximum outer diameter becomes smaller than d2.

[0071] As shown in Fig. 8(a), the position regulating portion 117 is installed on the collet 21 so as to face each other along the longitudinal direction of the concave portion 112 and sandwich the collet holder 22. In the example of Fig. 8(a), an example in which the length of the position regulating portion is approximately the same as the longitudinal length L of the concave portion 112 is shown. The dimension of the position regulating portion 117 in the Z direction may be larger or smaller than the dimension of the convex portion 102 in the Z direction. With reference to Figs. 9(a) to 9(e), the fitting process will be described using the convex portion 102c and the concave portion 112c as an example. As shown in Fig. 9(a), it is assumed that the centers of the convex portion 102c and the concave portion 112c are displaced by ΔX2 (off-centered) before starting the fitting.

[0072] As shown in Fig. 9(b), when the fitting operation is started and the collet 21 and the collet holder 22 are relatively moved so as to approach each other in the Z direction, since the centers of the convex portion 102c and the concave portion 112c are displaced, the tapered surface 118 of the position regulating portion 117c contacts the outer peripheral edge of the collet holder 22. Further, when the collet 21 is brought closer to the collet holder 22, while the tapered surface 118 and the outer peripheral edge slide, a force acts in the direction (horizontal direction) in which the centers of the convex portion 102c and the concave portion 112c coincide, and the collet holder 22 is inserted into the position regulating portion 117.

[0073] Further, as shown in Fig. 9(c), when the fitting operation is continued and the collet 21 and the collet holder 22 are relatively moved so as to approach each other in the Z direction. Then, since the centers of the convex portion 102c and the concave portion 112c are displaced, as shown in Fig. 9(d), the tapered surface 107 of the convex portion 102c contacts the opening edge of the concave portion 112c.

[0074] Furthermore, when the collet is brought closer to the collet holder, while the tapered surface 107 and the opening edge slide, a force acts in the direction (horizontal direction) in which the centers of the convex portion 102c and the concave portion 112c coincide, and the convex portion 102c is inserted into the concave portion 112c.

[0075] Then, as shown in Fig. 9(e), when the convex portion 102c is elastically deformed so that the maximum outer diameter of the body portion of the convex portion 102c becomes equal to the inner diameter of the concave portion 112c, the core misalignment is eliminated and the fitting is completed.

[0076] In the present embodiment, as shown in Formula 1, by setting d1 < D and providing the tapered surface 107 connecting to the flat surface at the tip of the convex portion 102, the positional displacement between the convex portion 102 and the concave portion 112 can be absorbed.

[0077] Here, if the allowable amount of the positional displacement that can be absorbed is ΔX, ΔX can be expressed by the following Formula 2. ΔX = D - d1 ··· (Formula 2)

[0078] By providing the tapered surface 118 that also connects to the flat surface at the tip to the position regulating portion 117, it is possible to absorb the positional deviation between the position regulating portion 117 and the collet holder 22. Here, if the allowable amount of positional deviation that can be absorbed between the position regulating portion 117 and the collet holder 22 is ΔX2, ΔX2 can be expressed by the following mathematical formula 3. ΔX2 = Wo - W ··· (mathematical formula 3) By setting the values of Wo and W such that ΔX2 is larger than ΔX, it is possible to increase the allowable amount of positional deviation that can be absorbed by providing the position regulating portion 117.

[0079] Also, as shown in mathematical formula 1, by setting D < d2, the convex portion 102 can be elastically deformed and the convex portion 102 can be fitted into the concave portion 112 without play.

[0080] Also, as shown in mathematical formula 1, by setting d2 < L, there is a margin (play) in the X direction. Therefore, for example, in FIG. 8(a), even if the convex portion 102c and the concave portion 112c are misaligned in the X direction, the fitting operation can be performed without hindrance.

[0081] In other words, in the case of the convex portion 102c and the concave portion 112c, regarding the X direction in which the slit 105c extends in a plan view, if the misalignment is ΔY or less as shown in the following mathematical formula 4, they can be smoothly fitted. ΔY < L - d2 ··· (mathematical formula 4)

[0082] As shown in FIG. 9(c), in the state where the fitting is completed, the amount of deformation M in the fitted state where the convex portion 102 is elastically deformed is represented by the following mathematical formula 5. M = d2 - D ··· (mathematical formula 5)

[0083] Here, if the spring constant when both sides of the slit are elastically deformed is k, the relationship between the force F in the direction of elastic deformation (Y direction in the case of the convex portion 102c), the spring constant k, and the amount of deformation M in the fitted state is represented by the following mathematical formula 6. F = k × M ··· (mathematical formula 6)

[0084] When it is desired to increase the rigidity of the fitting mechanism, the spring constant k may be increased or the amount of deformation M in the fitted state may be increased. However, d2, D, and the spring constant k vary due to machining errors during manufacturing and the like. After considering these factors, it is necessary to determine d2 and D and to determine the amount of deformation M in the fitted state. Furthermore, it is advisable to comprehensively determine the spring constant k and the amount of deformation M in the fitted state in consideration of the frictional resistance during the fitting operation and the like.

[0085] Since the convex portion 102 is formed of an elastic deformation member, when the amount of deformation exceeds a certain magnitude, the shape cannot be restored by elastic deformation, and the function of the fitting mechanism is impaired. The relationship between the maximum allowable deformation amount N of the convex portion 102 for maintaining the fitting function and the deformation amount M in the fitted state is expressed by the following mathematical formula 7. M < N ··· (Mathematical formula 7)

[0086] Here, when an external force acts on the collet holder 22 with the collet 21 and the collet holder 22 positioned, the convex portion 102 deforms by an amount greater than or equal to the deformation amount M in the fitted state. The movable amount L by which the convex portion 102 can move with the collet 21 and the collet holder 22 positioned is expressed by the following mathematical formula 8 because the position restricting portion 117 restricts the relative positions of the collet 21 and the collet holder 22. L = Wi - W ··· (Mathematical formula 8)

[0087] If the movable amount L is smaller than the maximum deformation amount N, the deformation amount of the convex portion 102 will fall within the range where elastic deformation is possible, and it is possible to prevent the fitting function from being impaired even if an unexpected external force acts on the convex portion 102. That is, it is advisable to determine the dimensions of W1 and W so as to satisfy the relationship expressed by the following mathematical formula 9. Wi - W < N ··· (Mathematical formula 9)

[0088] In the present embodiment, as shown in FIG. 6, three sets of fitting mechanisms including convex portions 102a to 102c, concave portions 112a to 112c, and position restricting portions 117a to 117c are arranged equiangularly so as to surround the periphery of the magnet 113, the flexible member 115, and the suction path 116.

[0089] Among these, the convex portion 102a and the convex portion 102b are arranged along the Y direction, and the respective slits 105a and slits 105b are also oriented along the Y direction. The corresponding recesses 112a and 112b are also arranged along the Y direction, and the longitudinal direction of each oblong hole is oriented along the Y direction. Furthermore, the corresponding position restricting portion 117a and the position restricting portion 117b are also arranged along the Y direction, and the respective position restricting surfaces are oriented along the Y direction. That is, the position restricting force acts in the same direction in these two fitting structures. Furthermore, the convex portion 102c and the corresponding recess 112c are arranged so that the longitudinal direction of the slit 105c and the oblong hole are along the X direction. Furthermore, the convex portion 102c and the corresponding position restricting portion 117c are arranged so that the slit 105c and the restricting surface of the position restricting portion are along the X direction. That is, the direction of the position restricting force is perpendicular to that of the previous two fitting structures.

[0090] With this arrangement, the positions in the X direction and the rotation direction around the Z axis are determined by convex portion 102a, concave portion 112a, and position regulation portion 117a, and convex portion 102b, concave portion 112b, and position regulation portion 117b, and the position in the Y direction is determined by convex portion 102c, concave portion 112c, and position regulation portion 117c. In this way, in the three fitting mechanisms, by aligning the short sides of the respective long holes through the sliding of the tapered surfaces and the action of elastic deformation, it is possible to determine the positions in three directions as a whole, the X direction, the Y direction, and the rotation direction around the Z axis.

[0091] As described above, according to this embodiment, even if the positions of the convex portion and the concave portion are slightly misaligned, the fitting mechanism automatically aligns them, so that the collet can be attached to the collet holder without excessive strain for the alignment work. Furthermore, since the fitting mechanism of this embodiment is not a part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion and is worn down, no leakage will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet when the collet is attached to the collet holder, the position restriction portion functions to prevent the elastic deformation member that aligns it from deforming beyond the elastic deformation limit.

[0092] (First Modification) Next, a first modified example of the first embodiment will be described with reference to Fig. 10. In the first modified example, the directions in which the convex portions 102a, 102b, the concave portions 112a, 112b, and the position restricting portions 117a, 117c are arranged when viewed in a plan view from the Z direction are different from the basic shape of the first embodiment described with reference to Fig. 6.

[0093] That is, in the basic form, slits 105a of convex portion 102a and slits 105b of convex portion 102b are both arranged along the Y direction. In addition, the longitudinal direction of recess 112a and the longitudinal direction of recess 112b are also both arranged along the Y direction.

[0094] In contrast, in the first modification example, the slit 105a of the convex portion 102a and the slit 105b of the convex portion 102b are arranged in directions different from each other by 120 degrees. Also, the longitudinal directions of the concave portions 112a and 112b are arranged in directions different from each other by 120 degrees. That is, the slits 105a, 105b, and 105c are arranged at intervals of 120 degrees around the communication hole. Similarly, the longitudinal directions of the concave portions 112a, 112b, and 112c are arranged at intervals of 120 degrees around the communication hole. Similarly, the longitudinal directions of the position restricting portions 117a, 117b, and 117c are arranged at intervals of 120 degrees around the communication hole.

[0095] Also in this modification example, even if the positions of the convex portion and the concave portion are slightly deviated, the alignment is automatically performed by the sliding of the tapered surface of the fitting mechanism and the action of elastic deformation. Therefore, the collet can be attached to the collet holder without imposing an excessive burden on the alignment work. The fitting mechanism of this modification example can be easily aligned when there is a tendency to cause misalignment in the rotational direction around the Z axis before attaching the collet to the collet holder. And, since the fitting mechanism of this modification example is not a part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides and wears against the edge or the inner surface of the concave portion during fitting, no leakage occurs in the suction path. Further, even if an unexpected external force acts on the collet in a state where the collet is attached to the collet holder, it is possible to prevent the elastic deformation member that performs alignment from deforming beyond the elastic deformation limit amount.

[0096] (Second Modification Example) Next, a second modification example of Embodiment 1 will be described with reference to FIGS. 11(a) to 11(c). In the second modification example, as shown in FIG. 11(a), the inner diameter of the concave portion 112 is configured to change depending on the position in the Z direction. That is, W1 < W2, and the relationship with the maximum outer diameter of the convex portion 102 is W2 < d2.

[0097] In this modified example, if the convex portion 102 and the concave portion 112 are misaligned, the tapered surface 107 slides against the inner edge of the concave portion 112 as shown in FIG. 11(b), and the convex portion 102 and the concave portion 112 move relative to each other in a direction that eliminates the misalignment.

[0098] During the engagement, the body portion of the convex portion 102 with the maximum outer diameter elastically deforms to fit the inner diameter W1 of the concave portion. However, when the engagement is completed as shown in FIG. 11(b), the body portion of the convex portion 102 with the maximum outer diameter reaches the portion with the inner diameter W2, and the elastic deformation of the convex portion 102 is alleviated.

[0099] Even in this modified example, even if the positions of the convex and concave portions are slightly misaligned, the alignment is automatically achieved by the sliding and elastic deformation of the tapered surfaces of the mating mechanism, so that the collet can be attached to the collet holder without placing excessive strain on the alignment work.

[0100] In addition, in this modification, when an unexpected external force is applied in a direction to remove the collet after it is attached to the collet holder, the tapered surface 107R at the bottom of the convex portion 102 comes into contact with the step portion of the inner diameter of the concave portion 112, and the elastic force of the convex portion 102 acts in a direction to maintain the engagement. In other words, it can be said that a restraining portion that restrains the body portion of the convex portion is provided on the inner surface of the concave portion. In this way, since the engagement mechanism acts in a direction that assists the holding of the collet by the magnetic force, the stability of the holding of the collet by the collet holder during the die bonding operation is increased. Furthermore, since the engagement mechanism of this modification is not a part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion during engagement and is worn out, no leak will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while the collet is attached to the collet holder, the position regulating portion functions to prevent the elastically deformable member that performs the alignment from being deformed beyond the elastic deformation limit.

[0101] (Third Modification) Next, a third modified example of the first embodiment will be described with reference to Fig. 12(a) to Fig. 12(c). In the third modified example, the protrusions 102 are not provided with slits, and are formed using an elastic material with a smaller elastic modulus than the basic shape. In this modified example as well, the maximum outer diameter of the body of the protrusions 102 is set to be larger than the inner diameter of the recesses 112.

[0102] In this modified example, if the convex portion 102 and the concave portion 112 are misaligned, the tapered surface 107 slides against the inner edge of the concave portion 112 as shown in FIG. 12(b), and the convex portion 102 and the concave portion 112 move relative to each other in a direction that eliminates the misalignment. When the fitting is completed as shown in FIG. 12( c ), the body of the protrusion 102 is compressed in the radial direction, and the outer diameter of the protrusion 102 becomes equal to the inner diameter of the recess 112 .

[0103] In this modified example, even if the positions of the convex portion and the concave portion are slightly misaligned, the collet can be attached to the collet holder without excessive burden for the alignment work because the sliding and elastic deformation of the tapered surface of the fitting mechanism automatically aligns the collet. Furthermore, since the fitting mechanism of this modified example is not a part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion during fitting and is worn down, no leakage will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the position restriction part functions to prevent the elastic deformation member that aligns the collet from deforming beyond the elastic deformation limit.

[0104] (Fourth Modification) Next, a fourth modified example of the first embodiment will be described with reference to Fig. 13(a) to Fig. 13(d). In the fourth modified example, the shape of the protrusion 102 is changed, and a biasing portion is provided in the recess 112 for elastically biasing and restraining the protrusion 102 during fitting.

[0105] As shown in the side view of Fig. 13(a) and the plan view of Fig. 13(d), the protrusion 102 of this modification is a so-called D-cut pin-shaped protrusion obtained by cutting a part of a circle into a D-shape in plan view. A groove 105k is formed in the flat side surface of the protrusion 102. A gap is provided in the inner surface of the recess 112, and a steel ball 202 is disposed so as to protrude from the gap, and the steel ball 202 is biased by a leaf spring 201 toward the gap. When the protrusion 102 is fitted, the steel ball 202 biased by the leaf spring 201 engages with the groove 105k and acts as a restraining portion.

[0106] In this modified example, if the convex portion 102 and the concave portion 112 are misaligned, the tapered surface 107 slides against the inner edge of the concave portion 112 as shown in FIG. 13(b), and the convex portion 102 and the concave portion 112 move relative to each other in a direction that eliminates the misalignment. When the fitting is completed as shown in FIG. 13(c), the hard ball 202 provided in the recess 112 engages with the groove 105k, and the protrusion 102 is restrained by the recess 112.

[0107] In this modified example, even if the positions of the convex and concave parts are slightly misaligned, the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism, so that the collet can be attached to the collet holder without excessive burden for the alignment work. Furthermore, since the fitting mechanism of this modified example is not a part of the airtight seal surface of the suction path, even if the tapered surface of the convex part slides against the edge or inner surface of the concave part during fitting and is worn down, no leakage will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the elastic deformation member that aligns it can be prevented from deforming beyond the elastic deformation limit.

[0108] (Fifth Modification) Next, a fifth modified example of the first embodiment will be described with reference to Fig. 16. In the fifth modified example, the number of position regulating parts 117 provided is reduced to two. As shown in FIG. 16, the position restricting portion 117 of this modification is provided in two places: a position restricting portion 117a corresponding to the convex portion 102a and the concave portion 112a, and a position restricting portion 117c corresponding to the convex portion 102c and the concave portion 112c.

[0109] Since the position restricting portion 117a can restrict the position in the X direction, it is possible to prevent the elastically deformable members of the convex portion 102a and the convex portion 102b from being deformed beyond the elastic deformation limit. In addition, the convex portion 102a and the concave portion 112a and the convex portion 102b and the concave portion 112b can be fitted together after the position restricting portion 117a absorbs the positional deviation in the X direction during the fitting operation. Since the position restricting portion 117c can restrict the position in the Y direction, it is possible to prevent the elastically deformable members of the convex portion 102c from being deformed beyond the elastic deformation limit. In addition, the convex portion 102c and the concave portion 112c can be fitted together after the position restricting portion 117c absorbs the positional deviation in the Y direction during the fitting operation.

[0110] In this modified example, even if the positions of the convex and concave parts are slightly misaligned, the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism, so that the collet can be attached to the collet holder without excessive burden for the alignment work. Furthermore, since the fitting mechanism of this modified example is not a part of the airtight seal surface of the suction path, even if the tapered surface of the convex part slides against the edge or inner surface of the concave part during fitting and is worn down, no leakage will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the elastic deformation member that aligns it can be prevented from deforming beyond the elastic deformation limit.

[0111] (Sixth Modification) Next, a sixth modified example of the first embodiment will be described with reference to Fig. 17. In the sixth modified example, the number of position regulating parts 117 provided is reduced to two. 17, the position restricting portion 117 in this modification is provided with two position restricting portions: a position restricting portion 117a corresponding to the convex portion 102a and the concave portion 112a, and a position restricting portion 117c corresponding to the convex portion 102c and the concave portion 112c. The position restricting portion 117a is disposed at a position away from the convex portion 102 and the concave portion 112.

[0112] Since the position restricting portion 117a can restrict the position in the X direction, it is possible to prevent the elastic deformation members of the protrusions 102a and 102b from being deformed beyond the elastic deformation limit amount. Furthermore, the position restriction portion 117a absorbs the positional deviation in the X direction during the fitting operation, and then the convex portion 102a and the concave portion 112a and the convex portion 102b and the concave portion 112b can be fitted together. The position restriction portion 117c can restrict the position in the Y direction, and therefore can prevent the elastic deformation member of the convex portion 102c from being deformed beyond the elastic deformation limit. Furthermore, the position restriction portion 117c absorbs the positional deviation in the Y direction during the fitting operation, and then the convex portion 102c and the concave portion 112c can be fitted together.

[0113] In this modified example, even if the positions of the convex and concave parts are slightly misaligned, the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism, so that the collet can be attached to the collet holder without excessive burden for the alignment work. Furthermore, since the fitting mechanism of this modified example is not a part of the airtight seal surface of the suction path, even if the tapered surface of the convex part slides against the edge or inner surface of the concave part during fitting and is worn down, no leakage will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the elastic deformation member that aligns it can be prevented from deforming beyond the elastic deformation limit.

[0114] (Seventh Modification) Next, a seventh modified example of the first embodiment will be described with reference to Fig. 18. In the seventh modified example, the number of position regulating parts 117 provided is reduced to two. 18, the position restricting portion 117 in this modification is provided with two position restricting portions: a position restricting portion 117a corresponding to the convex portion 102a and the concave portion 112a, and a position restricting portion 117c corresponding to the convex portion 102c and the concave portion 112c. The position restricting portion 117a is disposed at a position away from the convex portion 102a and the concave portion 112a.

[0115] Since the position restricting portion 117a can restrict the position in the X direction, it is possible to prevent the elastically deformable members of the convex portion 102a and the convex portion 102b from being deformed beyond the elastic deformation limit. In addition, the convex portion 102a and the concave portion 112a and the convex portion 102b and the concave portion 112b can be fitted together after the position restricting portion 117a absorbs the positional deviation in the X direction during the fitting operation. Since the position restricting portion 117c can restrict the position in the Y direction, it is possible to prevent the elastically deformable members of the convex portion 102c from being deformed beyond the elastic deformation limit. In addition, the convex portion 102c and the concave portion 112c can be fitted together after the position restricting portion 117c absorbs the positional deviation in the Y direction during the fitting operation.

[0116] In this modified example, even if the positions of the convex and concave parts are slightly misaligned, the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism, so that the collet can be attached to the collet holder without excessive burden for the alignment work. Furthermore, since the fitting mechanism of this modified example is not a part of the airtight seal surface of the suction path, even if the tapered surface of the convex part slides against the edge or inner surface of the concave part during fitting and is worn down, no leakage will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the elastic deformation member that aligns it can be prevented from deforming beyond the elastic deformation limit.

[0117] (Eighth Modification) Next, an eighth modified example of the first embodiment will be described with reference to Fig. 19. In the eighth modified example, a position restricting portion 117 is provided so as to correspond to the recess 112 having the biasing portion shown in the fourth modified example. 19, position restriction portions 117 in this modification are disposed in three locations: position restriction portion 117a corresponding to convex portion 102a and concave portion 112a, position restriction portion 117b corresponding to convex portion 102b and concave portion 112b, and position restriction portion 117c corresponding to convex portion 102c and concave portion 112c. However, since the elastic deformation direction of the biasing portion in the fitted state is unidirectional, position restriction portions 117 are disposed to restrict deformation in one direction corresponding to the deformation direction of the biasing portion.

[0118] Position restricting portion 117a and position restricting portion 117b can restrict the position in the X direction, and therefore can prevent the elastic deformation members of recesses 112a and 112b from deforming beyond their elastic deformation limits. Position restricting portion 117c can restrict the position in the Y direction, and therefore can prevent the elastic deformation members of recesses 112c from deforming beyond their elastic deformation limits.

[0119] In this modified example, even if the positions of the convex and concave parts are slightly misaligned, the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism, so that the collet can be attached to the collet holder without excessive burden for the alignment work. Furthermore, since the fitting mechanism of this modified example is not a part of the airtight seal surface of the suction path, even if the tapered surface of the convex part slides against the edge or inner surface of the concave part during fitting and is worn down, no leakage will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the elastic deformation member that aligns it can be prevented from deforming beyond the elastic deformation limit.

[0120] (Ninth Modification) Next, a ninth modification of the first embodiment will be described with reference to Fig. 20. In the ninth modification, the number of position regulating parts 117 provided is reduced to two. 20, the position restricting portion 117 in this modified example is provided with two portions, a position restricting portion 117a and a position restricting portion 117c. The position restricting portion 117a is disposed at a position away from the convex portion 102a and the concave portion 112a, and the position restricting portion 117c is disposed at a position away from the convex portion 102c and the concave portion 112c.

[0121] Since the position restricting portion 117a can restrict the position in the X direction, it is possible to prevent the elastically deformable members of the convex portion 102a and the convex portion 102b from being deformed beyond the elastic deformation limit. In addition, the convex portion 102a and the concave portion 112a and the convex portion 102b and the concave portion 112b can be fitted together after the position restricting portion 117a absorbs the positional deviation in the X direction during the fitting operation. Since the position restricting portion 117c can restrict the position in the Y direction, it is possible to prevent the elastically deformable members of the convex portion 102c from being deformed beyond the elastic deformation limit. In addition, the convex portion 102c and the concave portion 112c can be fitted together after the position restricting portion 117c absorbs the positional deviation in the Y direction during the fitting operation.

[0122] In this modified example, even if the positions of the convex and concave parts are slightly misaligned, the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism, so that the collet can be attached to the collet holder without excessive burden for the alignment work. Furthermore, since the fitting mechanism of this modified example is not a part of the airtight seal surface of the suction path, even if the tapered surface of the convex part slides against the edge or inner surface of the concave part during fitting and is worn down, no leakage will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the elastic deformation member that aligns it can be prevented from deforming beyond the elastic deformation limit.

[0123] (Tenth Modification) Next, a tenth modified example of the first embodiment will be described with reference to Fig. 21. In the tenth modified example, a position restriction portion 117 is provided at one location in consideration of the deformation direction of the recess 112 having the biasing portion shown in the fourth modified example.

[0124] 21, in the position restricting portion 117 of this modified example, a protrusion is provided on the collet 21 so as to restrict deformation in one direction corresponding to the deformation direction of the biasing portion. The protrusion is disposed away from the collet holder 22 by a distance that is smaller than the elastic deformation limit of the elastic fitting portion. Since the position restricting portion 117 can restrict the position in the X direction, it is possible to prevent the elastic deformation member of the recess 112 from deforming beyond its elastic deformation limit. Since the position restricting portion 117 can restrict the position in the Y direction, it is possible to prevent the elastic deformation member of the recess 112 from deforming beyond its elastic deformation limit.

[0125] In this modification, even if the positions of the convex portion and the concave portion are slightly misaligned, the collet can be attached to the collet holder without excessive burden for the alignment work because the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism. Furthermore, since the fitting mechanism of this modification is not a part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion during fitting and is worn out, no leakage will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while the collet is attached to the collet holder, the elastic deformation member that performs the alignment can be prevented from deforming beyond the elastic deformation limit. In addition, although the projection shape is cylindrical in FIG. 21, it is not necessarily required to be cylindrical, and it may be formed into any three-dimensional shape such as a rectangular parallelepiped. In addition, although a cutout shape that matches the projection shape is provided in the collet holder 22 in FIG. 21, it is not necessarily required to form such a shape.

[0126] [Embodiment 2] A second embodiment of the present invention will be described with reference to the drawings. However, detailed descriptions of parts common to the first embodiment will be omitted as much as possible. 1, the die bonder according to the second embodiment also includes elements such as a wafer support device, a collet, a collet holder, a bonding arm, a transport unit, a camera for the supply unit, a camera for the island unit, a control unit, etc. In the die bonder according to the second embodiment, the suction mechanism for picking up the semiconductor chip may be the same as or different from that of the first embodiment, but the lead frame holding mechanism for holding the lead frame has a different configuration from that of the first embodiment.

[0127] In the lead frame holding mechanism in the first embodiment (see FIG. 2), rail portions 40b are provided on lead frame holder 40 to regulate the position of lead frame 41. However, since it is necessary to secure a certain degree of clearance in consideration of the dimensional tolerance of the lead frame, the position of lead frame 41 may vary slightly.

[0128] Therefore, in the second embodiment, in order to hold the lead frame easily and without rattling, the lead frame holder is provided with suction holes to attract the lead frame. Also, the lead frame holder is held by the holder holder by magnetic force, and the suction path of the lead frame holder and the suction path of the holder holder are connected by a flexible member that can be airtightly connected. When replacing the lead frame holder depending on the type of lead frame to be handled, the lead frame holder can be attached to the holder holder in a state where leakage is suppressed without requiring excessive burden for installation adjustment work.

[0129] In other words, the die bonder of embodiment 2 is a semiconductor manufacturing apparatus in which a leadframe holder (tool) capable of adsorbing a leadframe (workpiece) is removably held by a holder holder (tool holder) using magnetic force, and the suction path is equipped with a flexible member capable of airtightly connecting the suction path.

[0130] In the die bonder according to the second embodiment, a dedicated lead frame holder is prepared for each type of lead frame. When bonding is performed, a lead frame holder according to the type of lead frame is selected and attached to a holder holder to form a lead frame holding mechanism.

[0131] Fig. 14 is a schematic plan view for explaining that the holder holder of the die bonder according to embodiment 2 is capable of holding lead frame holders of a plurality of types. Fig. 15 is a schematic cross-sectional view of the lead frame holding mechanism of embodiment 2, which is a YZ cross-sectional view taken along a line passing through convex portion 71a and convex portion 71c shown in Fig. 14.

[0132] 14 is a schematic diagram showing a large-sized lead frame 51 and a small-sized lead frame 61 that are handled by the die bonder of this embodiment. A dedicated lead frame holder 50 is prepared in advance for the large-sized lead frame 51, and a dedicated lead frame holder 60 is prepared in advance for the small-sized lead frame 61. When performing die bonding work, a lead frame holder corresponding to the lead frame is selected and attached to a holder holder 70. For ease of explanation, only two types of lead frame holders, the lead frame holder 50 and the lead frame holder 60, are shown in FIG. 14, but the lead frame holders that can be attached to the die bonder are not limited to these two types.

[0133] 15 shows a state in which the lead frame holder 50 is attached to the holder holder 70 and the lead frame 51 is adsorbed onto the lead frame holder 50. A large number of islands 52 for bonding semiconductor elements are arranged on the lead frame 51.

[0134] The lead frame holder 50 is provided with a suction path 53 for attracting the lead frame 51, and recesses 72a, 72b, and 72c, which are formed in a base made of a ferromagnetic material. The suction path 53 penetrates the base in the Z direction, and the upper end of the suction path 53 serves as a suction hole for attracting the lead frame 51.

[0135] The holder 70 is provided with, and is integrated with, protrusions 71a, 71b, 71c, a magnet 74, and a position regulating portion 77. The holder 70 is provided with a suction path 73 penetrating the inside, and the suction path 73 is connected to a negative pressure application mechanism (such as a vacuum pump or a control valve) (not shown).

[0136] The recesses 72a, 72b, and 72c of the leadframe holder 50 and the protrusions 71a, 71b, and 71c of the holder holder 70 function as a positioning mechanism that can fit into one another. That is, as shown in Fig. 15, when the holder holder 70 holds the leadframe holder 50, they fit into and restrain each other, so that the holder holder 70 can hold the leadframe holder 50 without rattling. In this embodiment, three pairs of protrusions, recesses, and position restricting portions are provided, but an appropriate number of pairs can be provided in appropriate positions taking into consideration positioning accuracy, mechanical strength, spatial margin, manufacturing costs, etc.

[0137] The convex portions 71a to 71c, the recessed portions 72a to 72c, and the position regulating portions 77a to 77c of this embodiment form an engagement mechanism similar to the convex portions 102a to 102c, the recessed portions 112a to 112c, and the position regulating portions 117a to 117c of the first embodiment.

[0138] That is, the tops of the protrusions 71a to 71c connect with the tapered surfaces, and the maximum outer diameters of the bodies of the protrusions 71a to 71c in the non-engaged state are set to be larger than the inner diameters of the recesses 72a to 72c. Also, by providing the position restricting portion 77 with a tapered surface 78 that connects with the flat surface at the tip, it is possible to absorb any misalignment between the position restricting portion 77 and the lead frame holder 50.

[0139] Therefore, even if the positions of the convex and concave portions are slightly misaligned when the lead frame holder 50 is attached to the holder holder 70, the fitting mechanism automatically aligns them, allowing the lead frame holder 50 to be attached without placing an excessive burden on the alignment work. Furthermore, the position restriction portion 77 keeps the deformation amount of the convex portion 71 within the range of elastic deformation, preventing the fitting function from being impaired even if an unexpected external force acts on the convex portion 71.

[0140] When the leadframe holder 50 is attached to the holder holder 70, the base of the leadframe holder 50 is subjected to an attractive force by the magnetic force of the magnet 74, and the leadframe holder 50 is detachably held by the holder holder 70. Note that in this embodiment, the mechanism for detachably holding the leadframe holder 50 using magnetic force is not limited to this configuration, and for example, a magnet may be provided on the leadframe holder side, and the holder holder may be formed of a ferromagnetic material. Alternatively, a first magnet may be provided on one of the leadframe holder and the holder holder, and a second magnet may be provided on the other, with the first and second magnets arranged so that their opposite magnetic poles face each other.

[0141] The strength of the holding force with which the holder holder 70 holds the leadframe holder 50 is set so that the leadframe holder 50 can be stably held during bonding work, but so that excessive external force does not need to be applied when removing the leadframe holder 50. A magnet with a magnetic force according to the setting is used. This is to facilitate the attachment and detachment work when replacing the leadframe holder 50, and to prevent unexpected damage caused by excessive external force. A permanent magnet is used for the magnet 74, but an electromagnet may also be used if it can be mounted.

[0142] 15, in the leadframe holding mechanism of this embodiment, a flexible member 75 made of an elastic material is disposed between the leadframe holder 50 and the holder holder 70. In the example of Fig. 15, the flexible member 75 is fixed to a recess in the holder holder 70, but it may also be fixed to the leadframe holder 50 side, or it may be sandwiched between them without being fixed to either the holder holder 70 or the leadframe holder 50.

[0143] The flexible member 75 is an annular member, and when viewed in a plan view from the Z direction, has a circular ring shape surrounding the periphery of the suction path 53 of the lead frame holder 50 and the periphery of the suction path 73 of the holder holder 70. Note that the shape of the ring when viewed in a plan view is not limited to a circular ring and may be a ring of another shape, but a circular ring is preferable from the viewpoint of stability and reproducibility of elastic deformation.

[0144] When the leadframe holder 50 is held by the holder holder 70 with the holding force as described above, the flexible member 75 elastically deforms so as to come into close contact with both the lower end surface of the leadframe holder 50 and the upper end surface of the holder holder 70. In other words, the flexible member 75 is formed of an elastic material that is elastically deformed by the holding force as described above and can airtightly connect the suction path 53 and the suction path 73 (connecting the two and sealing them from the outside air). The flexible member 75 can include, for example, any of the following materials: rubber, porous resin, or magnetic fluid.

[0145] As shown in FIG. 15, when the lead frame (workpiece) is held by using the lead frame holder 50, the suction path is evacuated and the lead frame (workpiece) is adsorbed through the suction hole. In this embodiment, the flexible member 75, which is elastically deformable, is interposed, so that the suction path is excellent in airtightness. In this embodiment, the flexible member 75 is elastically deformed by the holding force of the holding mechanism using magnetic force, and is in close contact with both the lead frame holder and the holder holder to connect the suction path, so that there is no need to repeatedly adjust the attachment of the lead frame holder. Moreover, in this embodiment, the relative positions of the lead frame holder and the holder holder are fixed by the above-mentioned positioning mechanism, so that the flexible member 75 does not unexpectedly twist after the lead frame holder is attached, and thus no leaks occur. If a flexible member is used as in this embodiment, the airtightness during evacuation can be particularly excellent.

[0146] As described above, according to this embodiment, even if the positions of the convex and concave parts of the fitting mechanism are slightly misaligned, the fitting mechanism automatically aligns them, so that the lead frame holder can be attached to the holder holder without excessive burden for the alignment work. Furthermore, since the fitting mechanism of this embodiment is not a part of the airtight seal surface of the suction path, even if the tapered surface of the convex part slides against the edge or inner surface of the concave part during fitting and is worn down, no leakage will occur in the suction path. Furthermore, even if an unexpected external force acts, the elastic deformation function, which is important for positioning, is not impaired.

[0147] [Other embodiments] The present invention is not limited to the above-described embodiments and modifications, and many modifications and combinations are possible within the technical concept of the present invention. For example, a die bonder may be provided with both a semiconductor element suction mechanism as in the first embodiment and a lead frame suction mechanism as in the second embodiment.

[0148] In addition, in the first embodiment, a convex portion is provided on the collet and a concave portion is provided on the collet holder as a positioning mechanism that defines the relative positions of the collet and the collet holder, but the opposite may be true, with a concave portion provided on the collet and a convex portion provided on the collet holder. Alternatively, convex portions and concave portions may be provided on both the collet and the collet holder. Depending on the arrangement of the convex portions and concave portions, a position regulating portion may be provided on either or both of the collet and the collet holder.

[0149] In addition, in the second embodiment, a convex portion is provided on the holder holder and a concave portion is provided on the leadframe holder as a positioning mechanism for defining the relative position of the leadframe holder and the holder holder, but the opposite may be true, with a concave portion provided on the holder holder and a convex portion provided on the leadframe holder. Alternatively, convex portions and concave portions may be provided on both the leadframe holder and the holder holder. A position regulating portion may be provided on either the collet or the collet holder, or on both, according to the arrangement of the convex portions and concave portions.

[0150] In the embodiment, the convex portion made of an elastic material has a tapered surface, but the concave portion may have a tapered surface. In other words, as long as a sliding surface that acts in a direction to eliminate misalignment when the convex portion is inserted into the concave portion can be configured, the tapered surface can be provided only on the convex portion, only on the concave portion, or on both.

[0151] Furthermore, the workpiece that the collet adheres to is not limited to a semiconductor element (semiconductor chip), but may be, for example, an electronic component such as a resistor element or a capacitor. The die bonder according to the present invention can be widely used in a manufacturing method of a semiconductor for die-bonding a semiconductor chip, as well as a manufacturing method of an article for mounting an electronic component or the like on a circuit board or the like. [Explanation of symbols]

[0152] 11···Semiconductor chip / 14···Wafer support device / 21···Collet / 22···Collet holder / 24···Transport section / 40···Lead frame holder / 41···Lead frame / 50···Lead frame holder / 51···Lead frame / 53···Suction path / 60···Lead frame holder / 61···Lead frame / 70···Holder holder / 71a, 71b, 71c···Convex portion / 72a, 72b, 72c···Concave portion / 73···Suction path / 74···Magnet / 75·· Flexible member / 77···Position control portion / 100···Die bonder / 102a, 102b, 102c···Convex portion / 103···Collet base / 105a, 105b, 105c···Slit / 105k···Groove / 107···Tapered surface / 108···Suction path / 109···Suction hole / 112a, 112b, 112c···Concave portion / 113···Magnet / 115···Flexible member / 116···Suction path / 117a, 117b, 117c···Position control portion / 118···Tapered surface / 200···Control portion

Claims

1. A tool that can pick up a workpiece by suction, a tool holder having a suction passage; a positioning portion that determines a relative position of the tool with respect to the tool holder when the tool holder holds the tool, The positioning portion is At least one protrusion, which is disposed on one of the tool and the tool holder and is made of an elastic material and has a tapered surface; at least one recessed portion that is disposed on one of the tool and the tool holder on which the protrusion is not provided and that is capable of engaging with the protrusion; a position restriction portion that is disposed in one of the tool and the tool holder and that suppresses deformation of the protrusion, The adsorption mechanism is characterized by the above.

2. The convex portion has a slit formed therein, the slit extending from the top to a predetermined depth, When viewed in a plan view, the length of the recess along the extension direction of the slit is greater than the length of the recess along a direction perpendicular thereto. The suction mechanism according to claim 1 .

3. In a plan view, in a direction perpendicular to the direction in which the slit extends, When the protrusion is not engaged with the recess, the length of the protrusion is greater than the length of the recess, When the protrusion is engaged with the recess, the length of the protrusion is equal to the length of the recess.

3. The suction mechanism according to claim 2.

4. The positioning portion has a plurality of the protrusions and the recesses, and the protrusions include a plurality of protrusions having the same extending direction of the slits in a plan view.

4. The suction mechanism according to claim 2 or 3.

5. The recess includes a restraining portion that restrains the protrusion when the recess is engaged with the protrusion.

5. The suction mechanism according to claim 1, wherein the suction mechanism is a suction mechanism.

6. The positioning portion is disposed in at least three locations.

6. The suction mechanism according to claim 1, wherein the suction mechanism is a suction mechanism.

7. a holding means for removably holding the tool in the tool holder by magnetic force; a flexible member capable of airtightly connecting the tool and the suction path when the tool holder holds the tool by magnetic force.

7. The suction mechanism according to claim 1, wherein the suction mechanism is a suction mechanism.

8. The flexible member has a base and an inclined surface having one end connected to the base.

8. The suction mechanism according to claim 7.

9. The inclined surface is annular in plan view, and is inclined in a direction such that the ring diameter on the side connected to the base is small and the ring diameter on the side not connected to the base is large.

9. The suction mechanism according to claim 8.

10. The flexible member includes any one of rubber, porous resin, and magnetic fluid.

10. The suction mechanism according to claim 7, wherein the suction mechanism is a suction device.

11. The holding means includes a magnet fixed to one of the tool and the tool holder, and a ferromagnetic body fixed to the other.

11. A suction mechanism according to any one of claims 7 to 10.

12. the holding means includes a first magnet fixed to one of the tool and the tool holder, and a second magnet fixed to the other, the first magnet and the second magnet being arranged such that different magnetic poles face each other.

11. A suction mechanism according to any one of claims 7 to 10.

13. The workpiece is an electronic component and the tool is a collet.

13. A suction mechanism according to any one of the preceding claims.

14. An adsorption mechanism according to claim 13; a mounting member holding portion for holding a mounting member, The collet sucks the electronic component and places it at a predetermined position on the workpiece. An apparatus for manufacturing an article, comprising:

15. An adsorption mechanism according to claim 13; a lead frame holder for holding a lead frame, the collet sucks the first semiconductor chip, places it on the lead frame or a second semiconductor chip mounted on the lead frame, and bonds them; A semiconductor manufacturing apparatus comprising:

16. A tool capable of adsorbing a workpiece by suction; a tool holder having a suction passage; a positioning portion that determines a relative position of the tool with respect to the tool holder when the tool holder holds the tool, The positioning portion is At least one protrusion, which is disposed on one of the tool and the tool holder and is made of an elastic material and has a tapered surface; at least one recessed portion that is disposed on one of the tool and the tool holder on which the protrusion is not provided and that is capable of engaging with the protrusion; the workpiece is a lead frame, and the tool is a lead frame holder; The adsorption mechanism is characterized by the above.

17. An adsorption mechanism according to claim 16; a transport unit that transports the first semiconductor chip, the conveying unit conveys the first semiconductor chip, places it on the lead frame held by the lead frame holder or a second semiconductor chip mounted on the lead frame, and bonds the first semiconductor chip to the lead frame. A semiconductor manufacturing apparatus comprising:

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