Socket Connector

Abstract

To provide a technique for reducing a height of a socket connector even in a case where there is a protrusion protruding upward from a peripheral wall in a socket connector of a type covering a connection target object with a cover member.SOLUTION: A socket connector 3 comprises: an insulation resin housing 8 formed by projecting a peripheral wall 11 upward from a peripheral edge of a bottom plate 10; a plurality of contacts 9 held by the bottom plate 10; an upper cover member 6 which is disposed at an upper side of a semiconductor package 2 stored in the housing 8 and electrically contacts the semiconductor package 2 to the plurality of contacts 9 by pushing the semiconductor package 2 downward; and a block 22 and a block 23 protruding upward from the peripheral wall 11. Release holes 50C in which the block 22 and the block 23 can be inserted are formed at positions opposed with the block 22 and the block 23 in a vertical direction in the upper cover member 6.SELECTED DRAWING: Figure 13

Description

[Technical field]

[0001] The present invention relates to a socket connector. [Background technology]

[0002] As shown in FIG. 16 of the present application, Patent Document 1 discloses a socket connector 100 for mounting an LGA (Land Grid Array) type semiconductor module on a circuit board. The socket connector 100 includes an insulating resin housing 102 having a recess 101 for accommodating a semiconductor module, and a plurality of contact components 104 assembled in a bottom surface 103 of the recess 101. The housing 102 is rectangular in plan view, and four module guide columns 105 are formed at its four corners. The four module guide columns 105 perform the functions of temporarily holding the semiconductor module and positioning the semiconductor module relative to the socket connector 100. In addition, paragraph 0039 of Patent Document 1 describes that a module-holding cover is attached to the top of the socket connector 100, so that the semiconductor module is pressed into the recess 101 of the socket connector 100 to electrically connect the semiconductor module to the plurality of contact components 104. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2011-165512 A Summary of the Invention [Problem to be solved by the invention]

[0004] The configuration of Patent Document 1 above still has room for improvement in terms of reducing the height.

[0005] An object of the present invention is to provide a technology that achieves a low profile for a socket connector of the type that holds down an object to be connected with a cover member, even when the socket connector has a protruding portion that protrudes above the surrounding wall. [Means for solving the problem]

[0006] According to an aspect of the present invention, there is provided a socket connector comprising: a housing made of insulating resin having a peripheral wall protruding upward from the periphery of a bottom plate; a plurality of contacts held by the bottom plate; a cover member arranged above a connection object contained in the housing and holding the connection object downward to electrically contact the connection object with the plurality of contacts; and a protrusion protruding above the peripheral wall, wherein a hole or notch into which the protrusion can be inserted is formed in the cover member at a position vertically opposite the protrusion. The protruding portion is formed with a guide inclined surface that guides the connection object when the connection object is accommodated in the housing. The housing is rectangular in plan view, and the peripheral wall includes a first side wall and a second side wall opposing each other across the bottom plate, the first side wall is configured to be elastically deformable in a first direction in which the first side wall and the second side wall oppose each other, and the protrusion is provided on the first side wall so as to be displaceable in the first direction. The connection object accommodated in the housing is pressed against the second side wall by the elastic restoring force of the first side wall, thereby positioning the connection object in the first direction relative to the housing. Each contact includes a contact fixing portion fixed to the bottom plate, a contact contact portion capable of contacting the connection object by protruding upward from the upper surface of the bottom plate, and an elastically deformable contact connecting portion connecting the contact fixing portion and the contact contact portion so that the contact contact portion can be displaced in the vertical direction, and each contact is configured so that the contact contact portion is displaced downward as it approaches the second side wall. The contact connection portion is formed in a U-shape that opens toward the second side wall. The cover member includes at least two board fixing portions that are fixed so as not to move in the vertical direction relative to the board on which the socket connector is mounted, and the hole or notch is formed in a position that does not overlap with a straight line connecting the at least two board fixing portions in a planar view. The at least two substrate fixing portions include two substrate fixing portions disposed on opposite sides of the bottom plate in a plan view. The at least two substrate fixing portions include two first substrate fixing portions arranged on opposite sides of the bottom plate in a planar view, and two second substrate fixing portions arranged on opposite sides of the bottom plate in a planar view, and a first straight line connecting the two first substrate fixing portions and a second straight line connecting the two second substrate fixing portions are perpendicular to each other. The cover member includes at least three board fixing portions that are fixed so as not to move in the vertical direction relative to the board on which the socket connector is mounted, and the hole or notch is formed in a position that does not overlap with any straight line connecting two of the at least three board fixing portions when viewed in a plane. Effect of the Invention

[0007] According to the present invention, in a socket connector in which a connection object is held down by a cover member, even if there is a protruding portion that protrudes above the peripheral wall, the socket connector can have a low height. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of an information processing device according to a first embodiment. [Diagram 2] FIG. 1 is an exploded perspective view of an information processing device according to a first embodiment. [Diagram 3] FIG. 1 is an exploded perspective view of the information processing device as viewed from a different angle (first embodiment). [Figure 4] Fig. 1 is a perspective view of a connector body according to a first embodiment. [Diagram 5]FIG. 11 is a perspective view of the connector body as viewed from a different angle (first embodiment). [Figure 6] FIG. 6 is an enlarged view of part A in FIG. 5 (first embodiment). [Figure 7] Fig. 7 is a cross-sectional view taken along line VII-VII in Fig. 6 (first embodiment). [Figure 8] 1 is a perspective view of a contact according to a first embodiment; [Figure 9] Fig. 7 is a cross-sectional view taken along line IX-IX in Fig. 6 (first embodiment). [Figure 10] 1 is a perspective view of a connector body accommodating a semiconductor package (first embodiment); [Figure 11] Fig. 11 is a cross-sectional perspective view taken along line XI-XI of Fig. 10 (first embodiment). [Figure 12] Fig. 11 is a cross-sectional view taken along line XI-XI of Fig. 10 (first embodiment). [Figure 13] 1 is a cross-sectional view showing a state in which a semiconductor package is held down by a cover member (first embodiment). [Figure 14] FIG. 1 is a plan view of a socket connector according to a first embodiment. [Figure 15] 13 is a plan view of the socket connector (second embodiment). [Figure 16] FIG. 1B is a simplified diagram of FIG. 1A of Patent Document 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] (First embodiment) A first embodiment of the present invention will be described below with reference to Fig. 1 to Fig. 14. Fig. 1 shows a perspective view of an information processing device 1. Figs. 2 and 3 show exploded perspective views of the information processing device 1. As shown in Figs. 1 to 3, the information processing device 1 includes a semiconductor package 2 (object to be connected), a socket connector 3, and a substrate 4. The socket connector 3 connects the semiconductor package 2 to the substrate 4 mechanically and electrically.

[0010] As shown in FIGS. 2 and 3, the socket connector 3 includes a connector body 5, an upper cover member 6 (a cover member), and a lower cover member 7. The upper cover member 6 (a cover member) is a connector body 5, an upper cover member 6 (a cover member), and a lower cover member 7.

[0011] The upper cover member 6 and the lower cover member 7 are joined to each other using bolts (not shown), thereby sandwiching the semiconductor package 2, the connector body 5, and the substrate 4 therebetween.

[0012] The connector body 5 is configured in a rectangular plate shape in a plan view.

[0013] Hereinafter, the thickness direction of the connector body 5 is defined as the up-down direction. The up-down direction includes the top and bottom. The top is the direction in which the connector body 5 is viewed from the board 4. The bottom is the direction in which the board 4 is viewed from the connector body 5. The upper cover member 6, the semiconductor package 2, the connector body 5, the board 4, and the lower cover member 7 are arranged downward in this order.

[0014] Furthermore, the connector body 5 is rectangular in plan view, and a direction parallel to the long sides of the connector body 5 is defined as the longitudinal direction, and a direction parallel to the short sides of the connector body 5 is defined as the transverse direction. However, if the connector body 5 is square in plan view, a direction parallel to one of the sides of the connector body 5 may be defined as the longitudinal direction for convenience, and a direction parallel to the side adjacent to that side may be defined as the transverse direction for convenience.

[0015] The longitudinal direction includes the longitudinal inward direction and the longitudinal outward direction. The longitudinal inward direction is a direction approaching the longitudinal center of the connector body 5. The longitudinal outward direction is a direction away from the longitudinal center of the connector body 5.

[0016] Similarly, the lateral direction includes the lateral inward and lateral outward directions. The lateral inward direction is the direction toward the center of the connector body 5 in the lateral direction. The lateral outward direction is the direction away from the center of the connector body 5 in the lateral direction.

[0017] The up-down direction, the vertical direction, and the horizontal direction defined above are merely directions defined for the convenience of explanation, and do not limit the actual posture of the information processing device 1 or the socket connector 3.

[0018] (Semiconductor Package 2) The semiconductor package 2 is typically an LGA (Land Grid Array) type. However, the semiconductor package 2 may be a BGA (Ball Grid Array) type. As shown in FIGS. 2 and 3, the semiconductor package 2 is formed in a rectangular plate shape in a plan view. The semiconductor package 2 has an upper surface 2A and a lower surface 2B. As shown in FIG. 3, a plurality of lands 2C are formed on the lower surface 2B of the semiconductor package 2. The semiconductor package 2 is a specific example of an object to be connected. The object to be connected is not limited to a semiconductor package and may be another electronic component.

[0019] (Substrate 4) Returning to FIG. 2, the substrate 4 is a rigid substrate such as a paper phenol substrate or a glass epoxy substrate. However, the substrate 4 may be a flexible substrate. The substrate 4 has an upper surface 4A and a lower surface 4B. The connector body 5 of the socket connector 3 is mounted on the upper surface 4A, typically by reflow. A plurality of lands 4C are formed on the upper surface 4A. The substrate 4 is formed with two vertical through holes 4D spaced apart from each other in the vertical direction so as to sandwich the plurality of lands 4C in the vertical direction, and two horizontal through holes 4E spaced apart from each other in the horizontal direction so as to sandwich the plurality of lands 4C in the horizontal direction.

[0020] (Socket connector 3) As shown in FIGS. 2 and 3, the socket connector 3 is composed of the connector body 5, the upper cover member 6, and the lower cover member 7, as described above.

[0021] Figures 4 and 5 show perspective views of the connector body 5. As shown in Figures 4 and 5, the connector body 5 includes a housing 8 and a plurality of contacts 9 held in the housing 8. Note that some of the plurality of contacts 9 are omitted from illustration in Figures 4 and 5.

[0022] 4, the housing 8 is made of insulating resin and includes a bottom plate 10 and a peripheral wall 11 surrounding the bottom plate 10.

[0023] The bottom plate 10 is a rectangular flat plate in a plan view, and has an upper surface 10A and a lower surface 10B. A plurality of contact accommodating portions 12 are formed in the bottom plate 10. The plurality of contact accommodating portions 12 accommodate the plurality of contacts 9, respectively.

[0024] The peripheral wall 11 protrudes upward from the peripheral edge of the bottom plate 10. The peripheral wall 11 includes two lateral side walls 13 and two longitudinal side walls 14.

[0025] The two lateral side walls 13 are portions of the peripheral wall 11 that extend in the lateral direction. The two lateral side walls 13 include a movable-side lateral side wall 15 (first side wall) and a fixed-side lateral side wall 16 (second side wall). The movable-side lateral side wall 15 and the fixed-side lateral side wall 16 face each other in the vertical direction with the bottom plate 10 in between.

[0026] The two vertical side walls 14 are portions of the peripheral wall 11 that extend along the vertical direction. The two vertical side walls 14 include a movable-side vertical side wall 17 (first side wall) and a fixed-side vertical side wall 18 (second side wall). The movable-side vertical side wall 17 and the fixed-side vertical side wall 18 face each other in the horizontal direction with the bottom plate 10 in between.

[0027] Therefore, the fixed-side horizontal sidewall 16 and the fixed-side vertical sidewall 18 are connected to each other so as to form an L-shape in plan view. Similarly, the movable-side horizontal sidewall 15 and the movable-side vertical sidewall 17 are connected to each other so as to form an L-shape in plan view.

[0028] The fixed-side horizontal sidewall 16 is a flat plate whose thickness direction coincides with the vertical direction. An inclined surface 16B is formed on the vertically inner edge of the upper surface 16A of the fixed-side horizontal sidewall 16, which slopes downward as it approaches the vertically inner side. A notch 16C is formed in the horizontal center of the fixed-side horizontal sidewall 16. The notch 16C may be omitted. The fixed-side horizontal sidewall 16 has an inner surface 16D that faces inward in the vertical direction.

[0029] The fixed-side vertical side wall 18 is a flat plate whose thickness direction coincides with the horizontal direction. An inclined surface 18B is formed on the horizontally inner edge of the upper surface 18A of the fixed-side vertical side wall 18, which slopes downward as it approaches the horizontally inward direction. A notch 18C is formed in the vertical center of the fixed-side vertical side wall 18. The notch 18C may be omitted. The fixed-side vertical side wall 18 has an inner surface 18D that faces inward in the horizontal direction.

[0030] Next, referring to Fig. 5, the movable-side lateral side wall 15 is a flat plate whose thickness direction coincides with the vertical direction. An inclined surface 15B is formed on the vertically inner edge of the upper surface 15A of the movable-side lateral side wall 15, which is inclined downward as it approaches the vertically inner edge. A notch 15C is formed in the horizontal center of the movable-side lateral side wall 15. The inclined surface 15B and Cutout 15C may be omitted.

[0031] The movable-side vertical side wall 17 is a flat plate whose thickness direction coincides with the horizontal direction. An inclined surface 17B is formed on the horizontally inner edge of the upper surface 17A of the movable-side vertical side wall 17, which slopes downward as it approaches the horizontally inner edge. A notch 17C is formed in the vertical center of the movable-side vertical side wall 17. The inclined surface 17B and the notch 17C may be omitted.

[0032] The heights of the upper surface 16A of the fixed-side horizontal side wall 16, the upper surface 18A of the fixed-side vertical side wall 18 shown in FIG. 4, the upper surface 15A of the movable-side horizontal side wall 15, and the upper surface 17A of the movable-side vertical side wall 17 shown in FIG. 5 are all equal to each other.

[0033] Still referring to FIG. 5, the movable-side lateral side wall 15 has two elastic pieces 20. The two elastic pieces 20 are arranged apart in the lateral direction. Each elastic piece 20 is a double-supported beam that can elastically deform in the vertical direction. Therefore, it can be said that the movable-side lateral side wall 15 can elastically deform in the vertical direction. Each elastic piece 20 is formed by providing a slit extending in the horizontal direction between the bottom plate 10 and the movable-side lateral side wall 15 and making the elastic piece thin. Each elastic piece 20 is made of insulating resin and is molded integrally with the housing 8. Each elastic piece 20 may be a cantilever beam instead of being a double-supported beam.

[0034] Similarly, the movable-side vertical side wall 17 has two elastic pieces 21. The two elastic pieces 21 are arranged apart in the vertical direction. Each elastic piece 21 is a double-supported beam that can elastically deform in the horizontal direction. Therefore, it can be said that the movable-side vertical side wall 17 can elastically deform in the horizontal direction. Each elastic piece 21 is formed by providing a slit extending in the horizontal direction between the bottom plate 10 and the movable-side vertical side wall 17 and making the elastic piece thin. Each elastic piece 21 is made of insulating resin and is molded integrally with the housing 8. Each elastic piece 21 may be a cantilever beam instead of being a double-supported beam.

[0035] A block 22 (protruding portion) is formed at the center in the longitudinal direction of each elastic piece 20. Each block 22 is formed so as to protrude upward and vertically inward from each elastic piece 20. Each block 22 is made of insulating resin and is molded integrally with each elastic piece 20. However, each block 22 may be made of metal. In this case, each block 22 is attached to the corresponding elastic piece 20 by insert molding or press fitting.

[0036] Similarly, a block 23 (protruding portion) is formed in the center of each elastic piece 21 in the longitudinal direction. Each block 23 is formed so as to protrude upward and laterally inward from each elastic piece 21. Each block 23 is made of insulating resin and is molded integrally with each elastic piece 21. However, each block 23 may be made of metal. In this case, each block 23 is attached to the corresponding elastic piece 21 by insert molding or press fitting.

[0037] Next, each block 22 and each block 23 will be described with reference to Figures 5 to 7. However, since the two blocks 23 have the same shape as shown in Figure 5, only one block 23, i.e., the block 23 closer to the movable-side lateral side wall 15, will be described, and the description of the other will be omitted.

[0038] Additionally, each block 22 protrudes vertically inward from the corresponding elastic piece 20, whereas each block 23 protrudes horizontally inward from the corresponding elastic piece 21. That is, each block 22 has the same shape as each block 23, except that the direction of protrusion is different from that of each block 23, and therefore a description of each block 22 will be omitted.

[0039] 6, the block 23 protrudes upward from the peripheral wall 11. The block 23 protrudes upward from the upper surface of the peripheral wall 11. The block 23 protrudes upward from the movable-side vertical side wall 17. The block 23 protrudes upward from the upper surface 17A of the movable-side vertical side wall 17. The block 23 protrudes upward from the elastic piece 21.

[0040] As shown in FIG. 7, the block 23 includes a positioning pressing portion 30 and an accommodation guide portion 31 disposed above the positioning pressing portion 30.

[0041] The positioning pressing portion 30 has a pressing surface 30A facing inward in the horizontal direction. The pressing surface 30A is a surface perpendicular to the horizontal direction. The pressing surface 30A is generally located lower than the upper surface 17A of the movable-side vertical side wall 17.

[0042] The storage guide portion 31 protrudes upward from the positioning pressing portion 30. The storage guide portion 31 protrudes upward from the peripheral wall 11. The storage guide portion 31 protrudes upward from the upper surface of the peripheral wall 11. The storage guide portion 31 protrudes upward from the movable-side vertical side wall 17. The storage guide portion 31 protrudes upward from the upper surface 17A of the movable-side vertical side wall 17. The storage guide portion 31 protrudes upward from the positioning pressing portion 30 located below the upper surface 17A of the movable-side vertical side wall 17, and protrudes above the upper surface 17A of the movable-side vertical side wall 17 beyond the upper surface 17A of the movable-side vertical side wall 17. The storage guide portion 31 has a guide inclined surface 31A that inclines downward as it moves inward in the lateral direction. The lower end of the guide inclined surface 31A and the lower end of the inclined surface 18B are at the same position in the vertical direction. The distance in the vertical direction from the lower end to the upper end of the inclined surface 31A is defined as a distance 31B. The storage guide portion 31 has an upper end 31C. The guide inclined surface 31A extends obliquely from a position below the upper surface 17A of the movable-side vertical side wall 17 to a position above the upper surface 17A of the movable-side vertical side wall 17.

[0043] 4, the contacts 9 are made of metal and are formed by punching and bending a metal plate plated with copper or a copper alloy, for example. The contacts 9 include a plurality of vertical contacts 40 and a plurality of horizontal contacts 41.

[0044] Each vertical contact 40 and each horizontal contact 41 has the same shape. Each vertical contact 40 and each horizontal contact 41 have different orientations in a plan view. That is, each vertical contact 40 is arranged to extend in the vertical direction. Each horizontal contact 41 is arranged to extend in the horizontal direction. Only two of the multiple contacts 9 correspond to the horizontal contacts 41, and the remaining contacts 9 correspond to the vertical contacts 40.

[0045] Fig. 8 shows a perspective view of each contact 9. Fig. 9 shows a cross-sectional view taken along line IX-IX in Fig. 6.

[0046] 8 and 9, each contact 9 includes a contact fixing portion 42 fixed to the bottom plate 10, a contact contact portion 43 that protrudes upward from the upper surface 10A of the bottom plate 10 to be able to contact the semiconductor package 2, an elastically deformable contact connecting portion 44 that connects the contact fixing portion 42 and the contact contact portion 43 so that the contact contact portion 43 is displaceable in the up-down direction, and a solder portion 45 that is soldered to the substrate 4. The solder portion 45, the contact fixing portion 42, the contact connecting portion 44, and the contact contact portion 43 are connected in this order.

[0047] 9 shows a state in which the contacts 9 are accommodated in the corresponding contact accommodating portions 12 of the bottom plate 10. As shown in FIG 9, the contact fixing portions 42 are fixed to the bottom plate 10 by being press-fitted into the inner surfaces of the corresponding contact accommodating portions 12.

[0048] The contact contact portion 43 is formed in a U-shape that opens downward, and when the contact connection portion 44 is in an unloaded state, it protrudes upward from the upper surface 10A of the bottom plate 10. When the contact connection portion 44 is in an unloaded state, the amount of upward protrusion of the contact contact portion 43 with respect to the upper surface 10A of the bottom plate 10 as the reference is defined as a protrusion amount 43H.

[0049] The contact connection portion 44 is formed in a U-shape opening in the vertical or horizontal direction in a side view.

[0050] The contact connection portion 44 of each vertically oriented contact 40 is formed in a U-shape that opens in the vertical direction in a side view. Specifically, the contact connection portion 44 of each vertically oriented contact 40 is formed in a U-shape that opens toward the fixed-side horizontal sidewall 16 shown in Fig. 5. Therefore, as shown by the two-dot chain line in Fig. 9, the contact contact portion 43 of each vertically oriented contact 40 is displaced downward while approaching the fixed-side horizontal sidewall 16.

[0051] On the other hand, the contact connecting portion 44 of each horizontal contact 41 is formed in a U-shape opening in the horizontal direction in a side view. Specifically, the contact connecting portion 44 of each horizontal contact 41 is formed in a U-shape opening toward the fixed-side vertical sidewall 18 shown in Fig. 4. Therefore, the contact contact portion 43 of each horizontal contact 41 is displaced downward while approaching the fixed-side vertical sidewall 18.

[0052] Returning to FIG. 7, the vertical distance from the upper end of contact portion 43 to the upper end of pressing surface 30A is defined as distance 30B.

[0053] The distance 30B is an important dimension for positioning and temporarily holding the semiconductor package 2 by sandwiching the semiconductor package 2 laterally between the positioning pressing portion 30 and the fixed-side vertical sidewall 18. If the distance 30B is too short, the semiconductor package 2 cannot be stably sandwiched between the positioning pressing portion 30 and the fixed-side vertical sidewall 18, and the above-mentioned positioning function and temporary holding function cannot be stably performed. Therefore, it is considered that the longer the distance 30B, the more preferable it is.

[0054] The distance 31B is an important dimension for guiding the semiconductor package 2 to the inside of the peripheral wall 11. If the distance 31B is too short, the guiding effect of the accommodation guide portion 31 deteriorates, and the workability of sandwiching the semiconductor package 2 between the positioning pressing portion 30 and the fixed-side vertical side wall 18 deteriorates. Therefore, it is considered preferable that the distance 31B is as long as possible.

[0055] The protrusion amount 43H is an important dimension for achieving a wiping effect between the contact contact portion 43 and the land 2C of the semiconductor package 2. If the protrusion amount 43H is too small, the wiping effect is deteriorated, and the contact stability between the land 2C of the semiconductor package 2 and the contact 9 is deteriorated. In addition, if the protrusion amount 43H is too small, the contact stability is also deteriorated because the amount of change in the contact force of the contact contact portion 43 with the land 2C corresponding to the component dimensional variation of the contact 9 becomes large. Therefore, a large protrusion amount 43H is basically preferable.

[0056] Next, the upper cover member 6 and the lower cover member 7 will be described with reference to FIGS.

[0057] The upper cover member 6 is disposed above the semiconductor package 2 accommodated in the housing 8, and presses the semiconductor package 2 downward to bring the semiconductor package 2 into electrical contact with the multiple contacts 9. The upper cover member 6 is a specific example of a cover member.

[0058] The lower cover member 7 is disposed below the substrate 4, and is joined to the upper cover member 6 by bolting.

[0059] Therefore, in this embodiment, by joining the upper cover member 6 and the lower cover member 7 to each other with the semiconductor package 2, the connector body 5, and the substrate 4 sandwiched between the upper cover member 6 and the lower cover member 7, the upper cover member 6 holds the semiconductor package 2 downward. However, instead of this, if the substrate 4 has sufficient rigidity, it is also possible to omit the lower cover member 7 and fasten the upper cover member 6 to the substrate 4.

[0060] The upper cover member 6 is made of metal and is formed by punching and bending a stainless steel plate, for example. The upper cover member 6 includes a cover body 50 and two legs 51.

[0061] The cover body 50 includes a package contact portion 50A and a peripheral wall facing portion 50B.

[0062] The package contact portion 50A faces the upper surface 2A of the semiconductor package 2 in the vertical direction and comes into surface contact with the upper surface 2A of the semiconductor package 2 when the semiconductor package 2 is fitted into the socket connector 3.

[0063] The peripheral wall facing portion 50B is a portion that faces the peripheral wall 11 of the housing 8 in the up-down direction, and surrounds the package contact portion 50A in an annular shape.

[0064] The package contact portion 50A is formed so as to be recessed downward from the peripheral wall facing portion 50B.

[0065] Furthermore, escape holes 50C (holes) into which each of the storage guide parts 31 can be inserted are formed in the peripheral wall facing part 50B at positions facing the four storage guide parts 31 in the up-down direction. Each escape hole 50C is formed so as to penetrate the peripheral wall facing part 50B in the up-down direction.

[0066] The two legs 51 each protrude laterally outward from the cover body 50. A bolt fastening hole 51A is formed in the vertical center of each leg 51. The bolt fastening hole 51A has an inner peripheral edge 51B (substrate fixing portion). Each bolt fastening hole 51A corresponds to each horizontal through hole 4E of the substrate 4.

[0067] The lower cover member 7 is made of metal, and is formed by punching and bending, for example, a stainless steel plate.

[0068] Four bolt fastening holes 7A are formed in the lower cover member 7. The four bolt fastening holes 7A correspond to the two vertical through holes 4D and the two horizontal through holes 4E of the base plate 4, respectively.

[0069] Next, a method of using the socket connector 3 will be described.

[0070] (Mounting process) First, to mount the connector body 5 on the upper surface 4A of the substrate 4, an appropriate amount of cream solder is supplied to the multiple lands 4C of the substrate 4 shown in FIG. 2, and then the connector body 5 is mounted on the upper surface 4A of the substrate 4 by reflow.

[0071] (Mating process) Next, in order to fit the semiconductor package 2 into the connector body 5, as shown in Fig. 10, the semiconductor package 2 is accommodated inside the peripheral wall 11 of the connector body 5. Specifically, the semiconductor package 2 is pressed against the inner surface 16D of the fixed-side horizontal side wall 16 and the inner surface 18D of the fixed-side vertical side wall 18, and the semiconductor package 2 is pushed down. Then, the peripheral edge of the lower surface 2B of the semiconductor package 2 shown in Fig. 11 slides downward on the guide slope 31A of the accommodation guide portion 31 of each block 22 while contacting the guide slope 31A, thereby displacing each block 22 outward in the vertical direction. At the same time, the peripheral edge of the lower surface 2B of the semiconductor package 2 slides downward on the guide slope 31A while contacting the guide slope 31A of the accommodation guide portion 31 of each block 23, thereby displacing each block 23 outward in the horizontal direction. As a result, the semiconductor package 2 transitions from a state in which it is in contact with the guide inclined surfaces 31A of the accommodation guide portions 31 of each block 22 to a state in which it is in contact with the pressing surfaces 30A of the positioning pressing portions 30 of each block 22. Similarly, the semiconductor package 2 transitions from a state in which it is in contact with the guide inclined surfaces 31A of the accommodation guide portions 31 of each block 23 to a state in which it is in contact with the pressing surfaces 30A of the positioning pressing portions 30 of each block 23.

[0072] 12, in the horizontal direction, due to the elastic restoring force of each elastic piece 21 of the movable-side vertical sidewall 17, the pressing surface 30A of the positioning pressing portion 30 of each block 23 comes into surface contact with the side surface 2D of the semiconductor package 2 and presses the semiconductor package 2 inward in the horizontal direction, i.e., toward the fixed-side vertical sidewall 18. This pressing force is received by the inner surface 18D of the fixed-side vertical sidewall 18 via the semiconductor package 2. As a result, the semiconductor package 2 is sandwiched in the horizontal direction between the pressing surface 30A of the positioning pressing portion 30 of each block 23 and the inner surface 18D of the fixed-side vertical sidewall 18 to be temporarily held, and is positioned in the horizontal direction with respect to the connector body 5.

[0073] 5, in the vertical direction, due to the elastic restoring force of each elastic piece 20 of the movable-side lateral sidewall 15, the pressing surface 30A of the positioning pressing portion 30 of each block 22 comes into surface contact with the side surface 2D of the semiconductor package 2 and presses the semiconductor package 2 inward in the vertical direction, i.e., toward the fixed-side lateral sidewall 16. This pressing force is received by the inner surface 16D of the fixed-side lateral sidewall 16 via the semiconductor package 2. As a result, the semiconductor package 2 is temporarily held by being sandwiched in the vertical direction between the pressing surface 30A of the positioning pressing portion 30 of each block 22 and the inner surface 16D of the fixed-side lateral sidewall 16, and is positioned in the vertical direction with respect to the connector body 5.

[0074] In the temporarily held state described above, the semiconductor package 2 abuts against the contact contact portions 43 of the contacts 9 in the vertical direction, as shown in FIG. 12, and the contact connection portions 44 of the contacts 9 have not yet elastically deformed.

[0075] Next, referring to FIG. 1 to FIG. 3, the upper cover member 6 is disposed above the semiconductor package 2, and the lower cover member 7 is disposed below the substrate 4. Then, the upper cover member 6 and the lower cover member 7 are joined to each other by bolt fastening. As a result, the two legs 51 approach the substrate 4, and as shown in FIG. 12 and FIG. 13, the package contact portion 50A of the cover body 50 of the upper cover member 6 presses the semiconductor package 2 downward. Then, as shown in FIG. 13, the lower surface 2B of the semiconductor package 2 reaches the upper surface 10A of the bottom plate 10, and the contact contact portion 43 of each contact 9 shown in FIG. 9 is displaced downward by the protrusion amount 43H as shown by the two-dot chain line. At this time, the contact contact portion 43 is displaced in the vertical direction or horizontal direction as described above, so that each land 2C formed on the lower surface 2B of the semiconductor package 2 and the contact contact portion 43 of each contact 9 rub against each other, and a so-called wiping effect is exhibited. At this time, the frictional forces generated between each contact 9 and the semiconductor package 2 act in a direction toward the fixed-side horizontal side wall 16 or the fixed-side vertical side wall 18. Therefore, the semiconductor package 2 does not move vertically or horizontally due to the above-mentioned frictional forces, and the wiping effect is sufficiently exhibited.

[0076] Here, as shown in FIG. 13, each accommodation guide portion 31 is inserted into the corresponding relief hole 50C. Specifically, the upper end 31C of each accommodation guide portion 31 is located in the internal space of the corresponding relief hole 50C. If the relief hole 50C is not formed, it is necessary to separate the peripheral wall facing portion 50B sufficiently from the board 4 in a state in which the semiconductor package 2 is fitted into the connector body 5 so that the upper end 31C of each accommodation guide portion 31 does not physically interfere with the peripheral wall facing portion 50B. Therefore, by forming the relief hole 50C in the peripheral wall facing portion 50B, even if the peripheral wall facing portion 50B is close to the board 4, the upper end 31C of each accommodation guide portion 31 does not physically interfere with the peripheral wall facing portion 50B, thereby realizing a low profile of the socket connector 3. In reality, the low profile of the socket connector 3 can be realized by the plate thickness of the upper cover member 6.

[0077] However, there are other methods for realizing a low-profile socket connector 3. That is, since the block 23 protruding above the peripheral wall 11 prevents the socket connector 3 from being low-profile, the socket connector 3 can be easily low-profile by lowering the block 23 itself. Specifically, it is conceivable to reduce one or more of the protruding amount 43H, the distance 30B, and the distance 31B shown in FIG. 7 so that the upper end 31C of the accommodation guide portion 31 is located below the upper surface 17A of the movable-side vertical side wall 17. However, as described above, the protruding amount 43H, the distance 30B, and the distance 31B each have their own technical significance, and it is difficult to reduce these dimensions solely for the purpose of reducing the height. Therefore, by providing the aforementioned relief hole 50C in the peripheral wall facing portion 50B as shown in FIG. 13, it can be evaluated that the low-profile socket connector 3 and the individual technical significances related to the protruding amount 43H, the distance 30B, and the distance 31B can be simultaneously achieved.

[0078] Fig. 14 shows a plan view of the socket connector 3. As shown in Fig. 14, none of the four escape holes 50C formed in the peripheral wall facing portion 50B of the cover body 50 of the upper cover member 6 is formed at a position that does not overlap with a straight line L that connects the center points of the inner peripheral edges 51B of the two bolt fastening holes 51A formed in the two leg portions 51 of the upper cover member 6. In other words, none of the two blocks 22 and the two blocks 23 is formed at a position that does not overlap with the straight line L. According to the above configuration, the following effects are achieved.

[0079] That is, when the upper cover member 6 is used to press the semiconductor package 2 downward, the upper cover member 6 is curved upward so that the package contact portion 50A protrudes upward. In order to reliably press the semiconductor package 2 downward using the upper cover member 6, the rigidity of the portion P along the straight line L must be secured in order to suppress the above-mentioned bending deformation. Therefore, by forming all of the four escape holes 50C at positions that do not overlap with the straight line L, the rigidity of the portion P is not impaired, and the semiconductor package 2 can be reliably pressed downward using the upper cover member 6 without increasing the plate thickness of the upper cover member 6.

[0080] The first embodiment has been described above. The above embodiment has the following features.

[0081] 1 to 14, the socket connector 3 includes a housing 8 made of insulating resin and having a peripheral wall 11 protruding upward from the periphery of a bottom plate 10, a plurality of contacts 9 held by the bottom plate 10, an upper cover member 6 (cover member) arranged above a semiconductor package 2 (connection object) accommodated in the housing 8 and pressing the semiconductor package 2 downward to electrically contact the semiconductor package 2 with the plurality of contacts 9, and blocks 22 and 23 (protruding portions) protruding upward from the peripheral wall 11. At positions of the upper cover member 6 facing the blocks 22 and 23 in the vertical direction, escape holes 50C (holes) into which the blocks 22 and 23 can be inserted are formed. According to the above configuration, in the socket connector 3 of the type in which the upper cover member 6 presses down the semiconductor package 2, even if there are blocks 22 and 23 protruding upward from the peripheral wall 11, the socket connector 3 can be made low-profile.

[0082] 13, in the above embodiment, the upper cover member 6 is formed with the escape holes 50C into which the blocks 22 and 23 can be inserted. However, instead of this, the upper cover member 6 may be formed with cutouts into which the blocks 22 and 23 can be inserted. Also, with the semiconductor package 2 pressed downward, the blocks 22 and 23 do not necessarily have to be inserted into the corresponding escape holes 50C. Even in this case, the clearance in the vertical direction between the blocks 22 and 23 and the upper cover member 6 can be set so small that it is virtually unmanageable, and thus the socket connector 3 can be similarly made low-profile.

[0083] 12, the blocks 22 and 23 are formed with guide inclined surfaces 31A that guide the semiconductor package 2 when the semiconductor package 2 is accommodated in the housing 8. According to the above configuration, the workability when the semiconductor package 2 is accommodated in the housing 8 is good.

[0084] As shown in Fig. 5, the housing 8 is rectangular in plan view. The peripheral wall 11 includes a movable-side vertical sidewall 17 (first sidewall) and a fixed-side vertical sidewall 18 (second sidewall) that face each other with the bottom plate 10 in between. The movable-side vertical sidewall 17 is configured to be elastically deformable in the lateral direction (first direction) in which the movable-side vertical sidewall 17 and the fixed-side vertical sidewall 18 face each other. The block 23 is provided on the movable-side vertical sidewall 17, so that it is displaceable in the lateral direction. With the above configuration, the block 23 can be displaced in the lateral direction with a simple configuration.

[0085] 12, the semiconductor package 2 accommodated in the housing 8 is pressed against the fixed vertical side wall 18 by the elastic restoring force of the movable vertical side wall 17, thereby positioning the semiconductor package 2 in the lateral direction relative to the housing 8. According to the above configuration, the positioning of the semiconductor package 2 with respect to the housing 8 can be achieved with a simple configuration.

[0086] 8 and 9, each contact 9 includes a contact fixing portion 42 fixed to the bottom plate 10, a contact contact portion 43 that protrudes upward from the upper surface 10A of the bottom plate 10 and can contact the semiconductor package 2, and an elastically deformable contact connecting portion 44 that connects the contact fixing portion 42 and the contact contact portion 43 so that the contact contact portion 43 can be displaced in the up-down direction. Each vertical contact 40 is configured so that the contact contact portion 43 displaces downward while approaching the fixed-side horizontal sidewall 16. According to the above configuration, when the semiconductor package 2 is pressed downward, the frictional force that the semiconductor package 2 receives from the multiple contacts 9 acts to press the semiconductor package 2 against the fixed-side horizontal sidewall 16, so that the frictional force is received by the fixed-side horizontal sidewall 16 and the semiconductor package 2 does not move in the vertical direction. The same applies to each horizontal contact 41.

[0087] 9, the contact connecting portion 44 of each vertical contact 40 is formed in a U-shape that opens toward the fixed-side horizontal sidewall 16. According to the above-described configuration, it is possible to realize a simple configuration in which the contact contact portion 43 displaces downward while approaching the fixed-side horizontal sidewall 16.

[0088] 14, the upper cover member 6 includes inner peripheral edges 51B (board fixing portions) of two bolt fastening holes 51A that are fixed immovably in the vertical direction relative to the board 4 on which the socket connector 3 is mounted. None of the relief holes 50C are formed in positions that do not overlap with a straight line L that connects the two inner peripheral edges 51B in a plan view. With the above configuration, the rigidity of the portion P along the straight line L is not impaired by the relief holes 50C. The upper cover member 6 may include three or more bolt fastening holes 51A.

[0089] 14, inner peripheral edges 51B of the two bolt fastening holes 51A are disposed on opposite sides of the bottom plate 10 in a plan view. According to the above configuration, the portion P along the straight line L passes above the semiconductor package 2, so that the semiconductor package 2 can be forcefully pressed downward.

[0090] Second embodiment Next, a second embodiment of the present invention will be described with reference to Fig. 15. Below, the differences between this embodiment and the first embodiment will be mainly described, and overlapping descriptions will be omitted.

[0091] In the above first embodiment, as shown in FIG. 14, the upper cover member 6 includes a cover main body 50 and two legs 51, and the two legs 51 are arranged so as to sandwich the cover main body 50 in the horizontal direction.

[0092] In contrast, in this embodiment, the upper cover member 6 further includes two second leg portions 52 as shown in FIG. 15. The two second leg portions 52 are arranged to sandwich the cover body 50 in the vertical direction. A bolt fastening hole 52A is formed in each of the two second leg portions 52. Each bolt fastening hole 52A has an inner peripheral edge 52B (second board fixing portion). In a plan view, a straight line M connecting the centers of the inner peripheral edges 52B of the two bolt fastening holes 52A is perpendicular to the straight line L. According to the above configuration, the upper cover member 6 can be fastened to the lower cover member 7 using the two bolt fastening holes 52A in addition to the two bolt fastening holes 51A, so that the posture of the upper cover member 6 around the straight line L as the rotation axis is stable.

[0093] 15, the four escape holes 50C formed in the peripheral wall facing portion 50B of the cover body 50 of the upper cover member 6 are formed at positions that do not overlap with either the straight line L connecting the centers of the inner peripheral edges 51B of the two bolt fastening holes 51A formed in the two legs 51 of the upper cover member 6 or the straight line M connecting the centers of the inner peripheral edges 52B of the two bolt fastening holes 52A formed in the two second legs 52. In other words, the two blocks 22 and the two blocks 23 are formed at positions that do not overlap with either the straight line L or the straight line M. According to the above configuration, the rigidity of the portion P along the straight line L and the portion Q along the straight line M is not impaired, so that the semiconductor package 2 can be reliably pressed downward without increasing the plate thickness of the upper cover member 6.

[0094] The second embodiment of the present invention has been described above, and the second embodiment has the following features.

[0095] The upper cover member 6 includes two inner peripheral edges 51B (first substrate fixing portions) arranged on opposite sides of the bottom plate 10 in a plan view, and two inner peripheral edges 52B (second substrate fixing portions) arranged on opposite sides of the bottom plate 10 in a plan view. A straight line L (first straight line) connecting the two inner peripheral edges 51B and a straight line M (second straight line) connecting the two inner peripheral edges 52B are perpendicular to each other. With the above configuration, the posture of the upper cover member 6 is stable when the semiconductor package 2 is pressed downward.

[0096] In addition, when the upper cover member 6 has three or more substrate fixing parts that are fixed to the substrate 4 so as not to be movable in the vertical direction, it is preferable that all the escape holes 50C are formed so as not to overlap any straight line connecting two of the three or more substrate fixing parts. For example, as shown in FIG. 15, the upper cover member 6 has one escape hole 50C formed so as to overlap a straight line N connecting the two nearest substrate fixing parts (the inner peripheral edge 51B and the inner peripheral edge 52B). These two substrate fixing parts correspond to two adjacent sides of the bottom plate 10. In this case, it is preferable to form the escape hole 50C a little more outward in the horizontal direction or outward in the vertical direction so as to avoid the straight line N. [Explanation of symbols]

[0097] 1. Information processing device 2. Semiconductor package (connection object) 2A Top 2B Bottom side 2C Land 2D side 3 Socket Connector 4. Board 4A Top 4B Bottom side 4C Land 4D Vertical through hole 4E Horizontal through hole 5 Connector body 6 Upper cover member (cover member) 7 Lower cover member 7A Bolt fastening hole 8. Housing 9. Contact 10 Bottom plate 10A top 10B Bottom 11 Peripheral wall 12 Contact receiving section 13 Horizontal side wall 14 Vertical side wall 15 Movable side horizontal side wall (first side wall) 15A top 15B Slope 15C Cutout 16 Fixed side horizontal side wall (second side wall) 16A Top 16B Slope 16C Cutout 16D inner surface 17 Movable vertical side wall (first side wall) 17A Top 17B Slope 17C Cutout 18 Fixed vertical side wall (second side wall) 18A top 18B Slope 18C Cutout 18D Inner surface 20 Elastic piece 21 Elastic piece 22 Block (protruding part) 23 Block (protruding part) 30 Positioning and pressing part 30A Pressing surface 30B distance 31 Accommodation Information Department 31A Guide inclined surface 31B distance 31C top end 40 Vertical Contacts 41 Horizontal Contact 42 Contact fixing part 43 Contact contact part 43H Overhang amount 44 Contact connection part 45 Soldering section 50 Cover body 50A Package Contact 50B Peripheral wall opposing part 50C Relief hole (hole) 51 Legs 51A Bolt fastening hole 51B Inner periphery (substrate fixing portion, first substrate fixing portion) 52 Second leg 52A Bolt fastening hole 52B Inner periphery (substrate fixing portion, second substrate fixing portion) L Straight line (first straight line) M Line (Second Line) N straight line P part Q part

Claims

1. a housing made of insulating resin and having a peripheral wall protruding upward from the peripheral edge of a bottom plate; a plurality of contacts held by the base plate; a cover member disposed above the connection object accommodated in the housing and pressing down on the connection object to electrically contact the connection object with the plurality of contacts; A protruding portion protruding upward from the peripheral wall; Equipped with a hole or a notch into which the protrusion can be inserted is formed in the cover member at a position facing the protrusion in the up-down direction; The housing is rectangular in plan view, The peripheral wall includes a first side wall and a second side wall opposed to each other with the bottom plate therebetween, The first side wall is configured to be elastically deformable in a first direction in which the first side wall and the second side wall face each other. Socket connector.

2. 2. The socket connector according to claim 1, The protrusion has a guide inclined surface that guides the connection object when the connection object is accommodated in the housing. Socket connector.

3. 3. The socket connector according to claim 1, The protrusion is provided on the first side wall and is displaceable in the first direction. Socket connector.

4. A socket connector according to any one of claims 1 to 3, the connection object accommodated in the housing is pressed against the second side wall by an elastic restoring force of the first side wall, thereby positioning the connection object in the first direction relative to the housing; Socket connector.

5. A socket connector according to any one of claims 1 to 4, each contact includes a contact fixing portion fixed to the bottom plate, a contact contact portion protruding upward from an upper surface of the bottom plate to be capable of contacting the connection object, and an elastically deformable contact connecting portion connecting the contact fixing portion and the contact contact portion such that the contact contact portion is displaceable in the up-down direction; Each contact is configured such that the contact portion is displaced downwardly while approaching the second sidewall. Socket connector.

6. 6. The socket connector according to claim 5, The contact connection portion is formed in a U-shape that opens toward the second side wall. Socket connector.

7. 7. A socket connector according to any one of claims 1 to 6, the cover member includes at least two board fixing portions that are fixed to the board on which the socket connector is mounted so as not to move in a vertical direction, the hole or the notch is formed at a position that does not overlap with a straight line connecting the at least two substrate fixing parts in a plan view; Socket connector.

8. 8. The socket connector according to claim 7, the at least two substrate fixing portions include two substrate fixing portions disposed on opposite sides of the bottom plate in a plan view, Socket connector.

9. 8. The socket connector according to claim 7, the at least two substrate fixing portions include two first substrate fixing portions arranged on opposite sides of the bottom plate in a plan view, and two second substrate fixing portions arranged on opposite sides of the bottom plate in a plan view, a first straight line connecting the two first substrate fixing parts and a second straight line connecting the two second substrate fixing parts are perpendicular to each other; Socket connector.

10. 7. A socket connector according to any one of claims 1 to 6, the cover member includes at least three board fixing portions that are fixed to the board on which the socket connector is mounted so as not to move in the vertical direction, the hole or the notch is formed at a position that does not overlap any straight line connecting two of the at least three substrate fixing portions in a plan view; Socket connector.

11. A housing made of insulating resin having a peripheral wall protruding upward from the peripheral edge of a bottom plate; a plurality of contacts held by the base plate; a cover member disposed above the connection object accommodated in the housing and pressing down on the connection object to electrically contact the connection object with the plurality of contacts; A protruding portion protruding upward from the peripheral wall; Equipped with The cover member has a hole or a notch formed at a position facing the protruding portion in the up-down direction, into which the protruding portion can be inserted.

1. A socket connector, comprising: the cover member includes at least two board fixing portions that are fixed to the board on which the socket connector is mounted so as not to move in a vertical direction, the hole or the notch is formed at a position that does not overlap with a straight line connecting the at least two substrate fixing parts in a plan view; Socket connector.

12. 12. The socket connector of claim 11, the at least two substrate fixing portions include two substrate fixing portions disposed on opposite sides of the bottom plate in a plan view, Socket connector.

13. 12. The socket connector of claim 11, the at least two substrate fixing portions include two first substrate fixing portions arranged on opposite sides of the bottom plate in a plan view, and two second substrate fixing portions arranged on opposite sides of the bottom plate in a plan view, a first straight line connecting the two first substrate fixing parts and a second straight line connecting the two second substrate fixing parts are perpendicular to each other; Socket connector.

14. A housing made of insulating resin having a peripheral wall protruding upward from the peripheral edge of a bottom plate; a plurality of contacts held by the base plate; a cover member disposed above the connection object accommodated in the housing and pressing down on the connection object to electrically contact the connection object with the plurality of contacts; A protruding portion protruding upward from the peripheral wall; Equipped with The cover member has a hole or a notch formed at a position facing the protruding portion in the up-down direction, into which the protruding portion can be inserted.

1. A socket connector, comprising: the cover member includes at least three board fixing portions that are fixed to the board on which the socket connector is mounted so as not to move in the vertical direction, the hole or the notch is formed at a position that does not overlap any straight line connecting two of the at least three substrate fixing portions in a plan view; Socket connector.

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