Power apparatus and electronic speed control module thereof

Abstract

The present application relates to the technical field of power. Disclosed are a power apparatus and an electronic speed control module thereof. The electronic speed control module in the present application comprises a PCB; several transistors, which are arranged spaced apart along an edge of the PCB; and a module housing, which is sleeved outside the PCB, wherein the side of each transistor that faces the module housing is connected to a ceramic substrate, and heat conduction is formed between the ceramic substrate and an inner wall of the module housing and is used for conducting out the heat generated by the transistors. In the present application, the heat generated by a power device is transferred out of a housing by using a ceramic substrate, such that the efficiency of heat dissipation is high, and the power device is also insulated from the housing.

Description

Power unit and its electric control module Technical Field

[0001] The present application relates to the field of power technology, and in particular to a power device and an electric adjustment module thereof. Background Art

[0002] Currently, most new energy vehicles on the market use IGBT (Insulated Gate Bipolar Transistor) or other MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) power components, which have a concentrated heat dissipation surface. However, for air-cooled motor controllers, this concentrated heat dissipation surface is a disadvantage. Electric aircraft motor controllers can use airflow during flight for air cooling, while liquid cooling adds additional weight to the coolant. Therefore, air cooling is often used for lightweight design. Using a decentralized heat dissipation mode can obtain a larger heat dissipation area, thereby improving heat dissipation efficiency, while also taking into account the insulation treatment of high-voltage components.

[0003] Summary of the Invention

[0004] The purpose of this application is to provide a power device and its electric adjustment module. This application uses a ceramic substrate to transfer the heat generated by the power device to the outside of the casing, with high heat dissipation efficiency, while insulating the power device and the casing.

[0005] To solve the above technical problems, the present application provides an electronically controlled module, comprising: a PCB board; a plurality of transistors, the transistors being spaced apart along the edge of the PCB board; and a module housing, the module housing being sleeved over the PCB board, wherein the transistors are connected to a ceramic substrate on the side facing the module housing, and the ceramic substrate and the inner wall of the module housing form a heat conduction structure for dissipating the heat generated by the transistors.

[0006] The present application provides a power device, including a motor module and the above-mentioned electric control module.

[0007] Optionally, thermal conductive silicone grease is coated between the ceramic substrate and the inner wall of the module housing.

[0008] Optionally, the transistor is vertically placed on an edge of the PCB board and a heat dissipation surface of the transistor is perpendicular to a plane of the PCB board.

[0009] Optionally, the ceramic substrate is partially coated with copper foil, and the heat dissipation surface of the transistor is welded to the copper-clad portion of the ceramic substrate.

[0010] Optionally, the PCB board is a regular hexagonal structure, and the transistors are centrally symmetrical with the center of the PCB board as the origin.

[0011] Optionally, it includes a plurality of heat sinks, the module housing presents a regular hexagonal structure, the module housing (3) surrounds the PCB board, the outer side of the module housing is surrounded by the plurality of heat sinks, and the outer edges of the plurality of heat sinks present a circular structure.

[0012] Optionally, the ceramic substrate has a thickness of at least 0.9 mm.

[0013] Optionally, the transistor is a silicon carbide MOSFET.

[0014] Optionally, the transistor includes a pair of high-voltage pins, a gap is provided on the edge of the PCB board to form an air groove, and the pair of high-voltage pins are welded on both sides of the gap.

[0015] This application utilizes a ceramic substrate to transfer the heat generated by the power device to the outside of the housing, which has a high heat dissipation efficiency and at the same time insulates the power device and the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] FIG1 is a schematic diagram showing the structure of an electric adjustment module according to an embodiment of the present application;

[0017] FIG2 is a schematic diagram showing the structure of the PCB board of the electronic adjustment module according to an embodiment of the present application. DETAILED DESCRIPTION

[0018] The following embodiments further illustrate the technical solutions of the present application. It is understood that the specific embodiments described herein are merely for the purpose of explaining the present application. It should also be noted that, for ease of description, only portions relevant to the present application are shown in the accompanying drawings, not all of them.

[0019] In the description of this application, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed or detachable connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application in specific contexts.

[0020] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0021] [Corrected as of 08.07.2024 according to Rule 26] The following describes an embodiment of the present application with reference to the accompanying drawings. As shown in Figures 1 and 2, the electronic control module of the embodiment of the present application includes: a PCB board 1, a plurality of transistors 2 and a module housing 3, wherein the transistors 2 are arranged at intervals along the edge of the PCB board 1, and the module housing 3 is sleeved on the outside of the PCB board 1, wherein the transistor 2 is connected to a ceramic substrate (not shown in the figure) on the side facing the module housing 3, and the ceramic substrate and the inner wall of the module housing 3 form a heat conduction to conduct heat generated by the transistor 2.

[0022] Specifically, the transistors 2 are spaced apart at the edge of the PCB (Printed Circuit Board) 1 to reduce the heat generated in the middle of the power board, allowing the motor corresponding to the electric control module to be assembled close to the middle of the power board, reducing the overall assembly difficulty and assembly volume. Preferably, the transistors 2 are placed vertically at the edge of the PCB 1, and the heat dissipation surface of the transistors 2 is perpendicular to the plane of the PCB 1. The heat dissipation surface is the side facing the module housing 3. The heat dissipation surface may be the side where the wafer of the transistor 2 as a power semiconductor is located, or the side where the metal heat dissipation surface of the packaged insulated dual-gate transistor 2 is located, or the side with the largest area of ​​the transistor 2, and the heat dissipation surface faces the periphery of the PCB 1. Furthermore, the ceramic substrate is partially coated with copper foil, and the heat dissipation surface of the transistor 2 is welded to the copper-clad portion of the ceramic substrate, thereby achieving a heat conduction effect between the heat dissipation surface of the transistor 2 and the copper-clad portion of the ceramic substrate, eliminating the need for thermal grease and reducing costs. The embodiment of the present application utilizes the ceramic substrate to dissipate the heat generated by the power device, and at the same time utilizes the insulation effect of the ceramic substrate to insulate the power device from the housing.

[0023] Furthermore, thermally conductive silicone grease is applied between the ceramic substrate and the inner wall of the module housing 3 to enhance thermal conductivity. Furthermore, the PCB 1 has a regular hexagonal structure, and the transistors 2 are arranged symmetrically around the center of the PCB 1. The electronically controlled module includes several heat sinks 4. The module housing 3 has a regular hexagonal structure, surrounding the PCB 1. The outer side of the module housing 3 is surrounded by the heat sinks 4, and the outer edges of the heat sinks 4 are circular to match the circular structure of the motor. The regular hexagonal design of the PCB 1 effectively reduces the weight of the heat sink housing, facilitating the lightweight design of the power system. In this embodiment, the transistors 2 are divided into six groups of identical components. With the center of the PCB 1 as the origin, the transistors 2 are evenly distributed along the six edges of the PCB 1 in a 60° fan-shaped arrangement, adjacent to each other, with the center of the PCB 1 as the origin. This creates a centrally symmetrical layout of the transistors 2. This centrally symmetrical layout ensures consistent current loop impedance across the three phases of the electronically controlled module.

[0024] The thickness of the ceramic substrate is at least 0.9 mm to ensure the best insulation effect. Preferably, transistor 2 preferably uses silicon carbide MOSFET. Compared with ordinary transistors, silicon carbide MOSFET has higher voltage resistance and thermal conductivity, fast switching speed, and low switching loss, which can increase the switching speed and reduce motor heating. The use of silicon carbide MOSFET can select a higher voltage platform. Under the same power, the bus current and three-phase current can be reduced, thereby reducing the corresponding wiring harness weight. In addition, the increase in voltage can also speed up the charging speed.

[0025] Furthermore, transistor 2 includes a pair of high-voltage pins. A gap is provided on the edge of PCB 1 to form an air slot, and the high-voltage pins are soldered to either side of the gap. The center-to-center spacing between the two high-voltage pins is 5.04mm. Due to the need for connection pads on PCB 1, the actual creepage clearance is only 2.5mm. By creating air slots, a creepage clearance of over 4mm can be achieved while maintaining the controller's IP67 protection rating.

[0026] The present invention also provides a power device, including a motor module and the electric control module of the above embodiment. The electric control module of the power device of the present invention utilizes a ceramic substrate to dissipate heat generated by the power device, thereby improving heat dissipation efficiency and insulating the power device from the housing.

[0027] The above embodiments are merely illustrative of the principles and effects of this application. Anyone skilled in the art may modify or alter the above embodiments without departing from the objectives of this application. Therefore, all equivalent modifications or alterations made by persons skilled in the art without departing from the objectives disclosed herein are intended to be covered by the claims of this application.

Claims

1. An electric adjustment module, characterized in that: include: A PCB board (1); a plurality of transistors (2), the transistors (2) being arranged at intervals along the edge of the PCB board (1); and a module housing (3), the module housing (3) being sleeved outside the PCB board (1), wherein the transistors (2) are connected to a ceramic substrate on the side facing the module housing (3), and the ceramic substrate and the inner wall of the module housing (3) form heat conduction for conducting heat generated by the transistors (2).

2. The electric adjustment module according to claim 1, characterized in that: Thermal conductive silicone grease is coated between the ceramic substrate and the inner wall of the module housing (3).

3. The electric adjustment module according to claim 1, characterized in that: The transistor (2) is vertically placed on the edge of the PCB board (1) and the heat dissipation surface of the transistor (2) is perpendicular to the plane of the PCB board (1).

4. The electric adjustment module according to claim 1, characterized in that: The ceramic substrate is partially coated with copper foil, and the heat dissipation surface of the transistor (2) is welded to the copper-clad portion of the ceramic substrate.

5. The electric adjustment module according to claim 1, characterized in that: The PCB board (1) is a regular hexagonal structure, and the transistor (2) is centrally symmetrical with the center of the PCB board (1) as the origin.

6. The electric adjustment module according to claim 5, characterized in that: It comprises a plurality of heat sinks (4), the module housing (3) presents a regular hexagonal structure, the module housing (3) surrounds the PCB board (1), the outer side of the module housing (3) is surrounded by the plurality of heat sinks, and the outer edges of the plurality of heat sinks present a circular structure.

7. The electric adjustment module according to claim 1, characterized in that: The ceramic substrate has a thickness of at least 0.9 mm.

8. The electric adjustment module according to claim 1, characterized in that: The transistor (2) is a silicon carbide MOSFET.

9. The electric adjustment module according to claim 1, characterized in that: The transistor (2) comprises a pair of high-voltage pins, a gap is provided on the edge of the PCB board (1) to form an air groove, and the pair of high-voltage pins are welded on both sides of the gap.

10. A power device, characterized in that: It comprises a motor module and an electric adjustment module as claimed in any one of claims 1 to 9.

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