Systems and apparatus for controlling fluid flow
The system addresses the challenges of advanced semiconductor processes by utilizing a compact apparatus for controlling fluid flow, featuring a valve, flow restrictor, and pressure sensor, to achieve precise and efficient fluid control.
WO2025085381A1 Publication Date: 2025-04-24ICHOR SYSTEMS INC
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Patent Information
- Application Number
- PCT/US2024/051291
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-07-29
- Filing Date
- 2024-10-14
- Publication Date
- 2025-04-24
AI Technical Summary
Technical Problem
Existing mass flow control systems in semiconductor fabrication face challenges in achieving increased performance, a wider range of flow capabilities, and more compact designs to meet the demands of advanced semiconductor processes.
Method used
The system incorporates a fluid supply, an apparatus for controlling flow that includes a body with a flow path, a valve with a seat and closure member, a flow restrictor, and a pressure sensor, allowing for precise control of fluid flow and pressure measurement within a minimized volume.
Benefits of technology
This configuration enables accurate and efficient control of fluid flow, supporting the demands of advanced semiconductor processes while minimizing physical space, thereby enhancing performance and flexibility.
✦ Generated by Eureka AI based on patent content.
Abstract
Systems for processing articles are essential for semiconductor fabrication. These systems employ a variety of apparatuses for controlling flow. In one implementation, an apparatus for controlling flow may utilize a body having a flow path extending from an inlet to an outlet. A valve, a flow restrictor, and a pressure sensor are operably coupled to the flow path. The valve incorporates first and second actuators which enable control of mass flow rates of fluid flowing through the flow path.
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