Packaging material for electronic product and preparation method of packaging material
A technology for packaging materials and electronic products, applied in the field of packaging, can solve problems such as performance crossover and storage constraints, and achieve the effects of improving adaptability and toughness, widening use space, and improving tear strength and elongation at break.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2016-08-24
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
technical field
[0001] The invention belongs to the field of packaging, and relates to a packaging material for electronic products and a preparation method thereof. Background technique
[0002] Packaging materials refer to the materials used to make packaging containers, packaging decoration, packaging printing, packaging and transportation to meet product packaging requirements, including metal, plastic, glass, ceramics, paper, bamboo, wild mushrooms, natural fibers, Main packaging materials such as chemical fibers and composite materials, and auxiliary materials such as coatings, adhesives, strapping tapes, decorations, and printing materials. Polyvinyl chloride is widely used. In terms of packaging materials, it can manufacture packaging films, shrink films, composite films and transparent sheets, as well as containers and turnover boxes, as well as packaging coatings. When used in the packaging of electronic products, the requirements for the ductility and tear resis...
Examples
Embodiment 1
[0033] Step 1: Take 40 parts of polyvinyl chloride, 2 parts of polyethylene terephthalate, 7 parts of polyethylene glycol diacrylate, 5 parts of polyfluoroethylene propylene, and starch octenyl succinate by weight. 1 part, 6 parts of styrene-butadiene rubber, 2 parts of polyaspartic acid ester polyurea resin, 9 parts of polyvinyl alcohol phthalate, 5 parts of polyethylene glycol succinate, the above-mentioned ingredients in Stir at 120°C for 40 minutes;
[0034] Step 2: Extrude the material stirred in step 1 with a twin-screw extruder. The head temperature of the twin-screw extruder is 160°C. ℃, the temperature in the second zone is 175 ℃, the temperature in the third zone is 200 ℃, the temperature in the fourth zone is 210 ℃, granulate after extrusion;
[0035] Step 3: The granulated material is calendered, cooled, and prepared as a packaging material for electronic products.
Embodiment 2
[0037] Step 1: Take 20 parts of polyvinyl chloride, 5 parts of polyethylene terephthalate, 3 parts of polyethylene glycol diacrylate, 2 parts of polyfluoroethylene propylene, and starch octenyl succinate by weight. 4 parts, 3 parts of styrene-butadiene rubber, 6 parts of polyaspartate polyurea resin, 3 parts of polyvinyl alcohol phthalate, 2 parts of polyethylene glycol succinate, the above ingredients in Stir at 110°C for 20 minutes;
[0038] Step 2: Extrude the material stirred in step 1 with a twin-screw extruder. The head temperature of the twin-screw extruder is 150°C. ℃, the temperature in the second zone is 185 ℃, the temperature in the third zone is 190 ℃, the temperature in the fourth zone is 205 ℃, granulate after extrusion;
[0039] Step 3: The granulated material is calendered, cooled, and prepared as a packaging material for electronic products.
Embodiment 3
[0041] Step 1: Take 25 parts of polyvinyl chloride, 4 parts of polyethylene terephthalate, 4 parts of polyethylene glycol diacrylate, 4 parts of polyfluoroethylene propylene, and starch octenyl succinate by weight. 3 parts, 4 parts of styrene-butadiene rubber, 5 parts of polyaspartate polyurea resin, 4 parts of polyvinyl alcohol phthalate, 3 parts of polyethylene glycol succinate, the above ingredients in Stir at 120°C for 40 minutes;
[0042] Step 2: Extrude the material stirred in step 1 with a twin-screw extruder. The head temperature of the twin-screw extruder is 160°C. ℃, the temperature in the second zone is 175 ℃, the temperature in the third zone is 200 ℃, the temperature in the fourth zone is 210 ℃, granulate after extrusion;
[0043] Step 3: The granulated material is calendered, cooled, and prepared as a packaging material for electronic products.