Wafer transport system and wafer transport method

Abstract

The wafer transfer system and method provided by this invention include a reaction chamber, a transfer chamber, and a loading chamber arranged sequentially, with valves between each chamber. A robotic arm is installed in the transfer chamber for transferring wafer-carrying trays between the reaction chamber and the loading chamber. A sealing door is provided on the loading chamber. The loading chamber includes a wafer cassette and a lifting device for driving the cassette to move vertically. The cassette supports at least two trays spaced apart vertically. The cassette is structured such that trays can be moved into or out from a first side facing the valve and a second side facing the sealing door. The wafer transfer system provided by this invention allows for wafer loading and unloading operations on the wafer cassette simultaneously with the processing, thereby improving the transfer efficiency of the wafer transfer system and eliminating the need for operators to handle the wafer cassettes, thus better meeting the future demand for transferring larger trays.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more specifically, to a wafer transport system and a wafer transport method. Background Technology

[0002] When using semiconductor processing equipment, wafers are typically transferred from the atmospheric environment to a vacuum reaction chamber for processing, and then transferred out of the reaction chamber after the processing is completed. This transfer process requires a wafer transfer system consisting of a transfer chamber, a loading and unloading chamber, and corresponding transfer devices.

[0003] Figure 1 A cross-sectional view of an existing wafer transport system. (e.g.) Figure 1 As shown, the wafer transfer system is used to transfer wafers into the reaction chamber 101, which includes a transfer chamber 102, a loading chamber 107, and a carrier device. The reaction chamber 101, transfer chamber 102, and loading chamber 107 are connected in series and isolated from each other by valves (110a, 110b), allowing each chamber to maintain a vacuum state and be independently controlled. The carrier device includes a positioning plate 105 and a wafer cassette lifting device 104. The positioning plate 105 is located within the loading chamber 107 and connected to the wafer cassette lifting device 104, supporting the wafer cassette 108. The wafer cassette 108 is used to load a certain number (typically 5) of trays 109 in layers, with each tray 109 carrying multiple wafers. The wafer cassette lifting device 104 drives the positioning plate 105 to move vertically. A robotic arm 103 is provided in the transfer chamber 102 to transfer the tray 109 between the loading and unloading chamber 107 and the reaction chamber 101.

[0004] The workflow of the aforementioned chip transmission system is as follows: Figure 2As shown, the loading / unloading chamber 107 is first brought to atmospheric pressure, and the sealing door 106 of the loading / unloading chamber 107 is opened. A cassette 108 containing multiple trays 109 is placed on the positioning plate 105. Then, the sealing door 106 is closed, and the loading / unloading chamber 107 is evacuated to a vacuum state. When transferring the trays 109, the cassette lifting device 104 first drives the cassette 108 to a suitable height so that the height of one tray 109 is aligned with the valve 110b. Then, the robot arm 103 extends into the loading / unloading chamber 107 through the valve 110b and removes the tray 109 from the cassette 108. It then transfers the tray 109 to the reaction chamber 101 through the valve 110a. After the process is completed, the robot arm 103 removes the tray 109 from the reaction chamber 101 and places it back onto the cassette 108. In this way, the vertical lifting motion of the tablet cassette 108 is coordinated with the horizontal extension and retraction motion of the robotic arm to sequentially transfer the various trays 109 on the tablet cassette 108 into the reaction chamber 101 for processing. Once all the trays 109 on the tablet cassette 108 have completed their processing, the reaction chamber 101 stops processing and awaits the operator to replace the tablet cassette 108.

[0005] The aforementioned chip transmission system inevitably suffers from the following problems in practical applications:

[0006] Firstly, due to the structural limitations of the wafer cassette 108, the tray 109 can only be loaded or removed from the front opening of the wafer cassette 108. When placing the wafer cassette 108 into the loading chamber 107, the front opening of the wafer cassette 108 should be aligned with the gate valve 110b to allow the robot arm 103 to perform wafer loading and unloading operations. Therefore, during processing, the operator cannot change the wafer cassette 108 to perform wafer loading and unloading operations. In this situation, the operation of the above-mentioned wafer transfer system is in serial mode, that is, when the operator changes the wafer cassette 108, the reaction chamber 101 is in a waiting state and cannot perform processing. Although this idle time of the reaction chamber 101 can be alleviated by increasing the number of trays 109 loaded on a single wafer cassette 108, the number of trays 109 loaded on the wafer cassette 108 is limited by the weight of the trays 109, usually not exceeding 5, resulting in low transfer efficiency of the wafer transfer system and significant waste of the processing capacity of the reaction chamber 101. For example, under normal circumstances, the process time for a single tray 109 is approximately 40 minutes, the total transfer time for a single tray 109 is 2 minutes, and the total time for each loading and unloading of the wafer cassette 108 is 7 minutes (including the time for filling the loading chamber 107 with atmospheric pressure and evacuating it). If each wafer cassette 108 loads 5 trays 109, then the transfer efficiency η of the above wafer transfer system is 92.2%.

[0007] Secondly, in order to accommodate more wafers in a single tray 109, the mainstream tray diameter has increased from 330mm to 380mm, and is likely to expand to 450mm in the future. The weight of a single tray has also increased from 1.1kg for the 330mm tray to 2.2kg for the 380mm tray. In this case, if the method of accommodating 5 trays 109 per wafer cassette 108 is continued, the weight of a wafer cassette 108 filled with trays 109 will increase from approximately 10kg to approximately 17kg, which exceeds the reasonable carrying capacity of operators. On the other hand, reducing the wafer cassette capacity would reduce the transmission efficiency of the wafer transfer system. Therefore, this wafer transfer system cannot meet the future demand for transferring larger-sized trays. Summary of the Invention

[0008] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a wafer transfer system and wafer transfer method, which can perform wafer pick-and-place operations on wafer cassettes while performing the process, thereby not only improving the transfer efficiency of the wafer transfer system, but also eliminating the need for operators to move wafer cassettes, thus better meeting the future needs of transferring larger pallets.

[0009] To achieve the objectives of this invention, a wafer transport system is provided, comprising a reaction chamber, a transport chamber, and a loading chamber arranged sequentially, with a valve between each chamber. A robotic arm is installed in the transport chamber for transporting a wafer-carrying tray between the reaction chamber and the loading chamber. A sealing door is provided on the loading chamber. The loading chamber includes a wafer cassette and a lifting device for driving the cassette to move vertically. The wafer cassette supports at least two trays spaced apart vertically. The wafer cassette is structured such that the trays can be moved into or out from a first side of the cassette facing the valve and a second side facing the sealing door, respectively.

[0010] The tray includes: a base plate connected to the lifting device; two side columns disposed opposite to each other on the upper surface of the base plate, with the space between the two side columns corresponding to the door valve and the sealing door, respectively; and at least two layers of positioning block groups disposed at intervals along the vertical direction, each layer of positioning block group including two positioning blocks, the two positioning blocks being disposed flush with each other on the two side columns to support the tray.

[0011] The tray includes: a base plate connected to the lifting device; two side columns disposed opposite each other on the upper surface of the base plate, with the space between the two side columns corresponding to the door valve and the sealing door respectively; and at least two slots are provided vertically on each side column, with each slot on the two side columns corresponding to each other and flush with each other, for supporting the tray.

[0012] Preferably, each of the positioning blocks has a positioning groove on its surface for supporting the tray; in the same layer of positioning block group, the projection shape and size of the two positioning grooves on the two positioning blocks on the upper surface of the base plate are adapted to the projection shape of the tray on the upper surface of the base plate.

[0013] Preferably, the lifting device includes a lifting shaft, a transmission mechanism, and a rotary motor. The upper end of the lifting shaft is connected to the base plate, and the lower end of the lifting shaft extends vertically downward to the outside of the loading chamber and is connected to the rotary motor through the transmission mechanism. The rotary motor is used to provide rotational power. The transmission mechanism is used to convert the rotational power of the rotary motor into linear motion in the vertical direction and transmit it to the lifting shaft.

[0014] Preferably, the lifting device includes a lifting shaft and a lifting motor, wherein the upper end of the lifting shaft is connected to the base plate, and the lower end of the lifting shaft extends vertically downward to the outside of the loading chamber and is connected to the lifting motor; the lifting motor is used to drive the lifting shaft to move linearly in the vertical direction.

[0015] As another technical solution, the present invention also provides a wafer transfer method, which uses the wafer transfer system provided by the present invention to transfer the tray, the wafer transfer method comprising the following steps:

[0016] S1, fill the loading chamber with atmospheric air;

[0017] S2, open the sealed door, place at least two unprocessed trays into the tray from the second side of the tray, and remove the processed trays;

[0018] S3, close the sealing door and evacuate the loading chamber;

[0019] S4, the lifting device drives the cassette to move up and down, so that one of the unprocessed trays is located at the height of the valve; the robotic arm takes the tray from the first side of the cassette and transfers it into the reaction chamber;

[0020] S5, the reaction chamber begins to process the wafer on the tray. After the process is completed, the robot arm removes the tray from the reaction chamber and transfers it back to the wafer cassette.

[0021] Repeat steps S4 and S5 until all wafers on all the trays have been processed; and while the last tray is being processed in the reaction chamber, perform steps S1-S3.

[0022] Preferably, the cassette support consists of two trays spaced apart in a vertical direction; in step S2, the unprocessed tray is located on the upper layer; and the processed tray is located on the lower layer.

[0023] The present invention has the following beneficial effects:

[0024] The wafer transfer system provided by this invention, by configuring the wafer cassette structure so that the tray can be moved in or out from the first side of the wafer cassette facing the valve and the second side facing the sealing door, allows for wafer loading and unloading operations from the second side of the wafer cassette by opening the sealing door while the process is being carried out. That is, the wafer loading and unloading operations of the tray are carried out in parallel with the process in the reaction chamber. This not only avoids downtime in the reaction chamber and enables continuous production, thereby improving the transfer efficiency of the wafer transfer system, but also eliminates the need for operators to handle the wafer cassette, thus enabling the loading and unloading of larger and heavier trays, and better meeting the future needs for transferring larger trays.

[0025] The wafer transfer method provided by this invention, by employing the wafer transfer system provided by this invention, can not only avoid the idleness of the reaction chamber and achieve continuous production, thereby improving the transfer efficiency of the wafer transfer system, but also eliminates the need for operators to handle wafer cassettes, thus enabling the loading and unloading of larger and heavier pallets, and better meeting the future demand for transferring larger pallets. Attached Figure Description

[0026] Figure 1 A cross-sectional view of an existing wafer transport system;

[0027] Figure 2 A flowchart of an existing chip transfer method;

[0028] Figure 3 A cross-sectional view of a wafer transmission system provided in an embodiment of the present invention;

[0029] Figure 4 This is a diagram showing the internal structure of the loading chamber in an embodiment of the present invention;

[0030] Figure 5 This is a structural diagram of a chip box in a modified embodiment of the present invention; and

[0031] Figure 6 This is a flowchart illustrating the wafer transfer method provided in an embodiment of the present invention. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solutions of the present invention, the wafer transfer system and wafer transfer method provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0033] Figure 3 A cross-sectional view of a wafer transport system provided in an embodiment of the present invention. Please refer to [link / reference]. Figure 3 The wafer transfer system includes a reaction chamber 401, a transfer chamber 402, and a loading chamber 406 arranged sequentially. A gate valve 409a is provided between the reaction chamber 401 and the transfer chamber 402 to isolate them, forming a space where the air pressure can be independently controlled. A gate valve 409b is provided between the transfer chamber 402 and the loading chamber 406 to isolate them, forming a space where the air pressure can be independently controlled. A robotic arm 403 is provided in the transfer chamber 402 for transferring a tray 408 between the reaction chamber 401 and the loading chamber 406; the tray 408 is used to carry wafers. Furthermore, a sealing door 405 is provided on the loading chamber 406, located on the side opposite to the gate valve 409b.

[0034] The loading chamber 406 includes a tablet cassette 407 and a lifting device 404 for driving the tablet cassette 407 to move up and down. The tablet cassette 407 supports two trays 408 spaced apart in a vertical direction. Furthermore, the tablet cassette 407 is structured such that the trays 408 can be positioned from the first side of the tablet cassette 407 directly opposite the valve 409b. Figure 3 The left side of the film box 407 and the second side directly opposite the sealing door 405 ( Figure 3 The film box (right side) is moved in or out.

[0035] The specific implementation method of the tablet box is described in detail below. Figure 4 This is a diagram showing the internal structure of the loading chamber in an embodiment of the present invention. Please refer to [link / reference]. Figure 4 The tablet cassette includes a base plate 501, two side posts 502, and two layers of positioning block assemblies 503. The base plate 501 is horizontally positioned within the loading chamber 406 and connected to the lifting device 404. The two side posts 502 are positioned opposite each other on the upper surface of the base plate 501, with the space between them corresponding to a door valve 409b and a sealing door 405, respectively. For example, in... Figure 4 In this configuration, the front and rear sides of the loading chamber 406 are respectively located on the sealing door 405 and the valve 409b. In this configuration, two side pillars 502 are positioned near the left and right side walls of the loading chamber 406, respectively. The space between the two side pillars 502 corresponds to the valve 409b and the sealing door 405, respectively, allowing the tray 408 to be moved into or out of the cassette. Two layers of positioning block groups 503 are arranged vertically at intervals. Each layer of positioning block group 503 includes two positioning blocks, which are flush with each other and respectively positioned on the two side pillars 502. The tray 408 is placed on the two positioning blocks in the same group of positioning block groups 503.

[0036] Preferably, each positioning block has a positioning groove on its surface for supporting the tray 408, such as... Figure 4As shown, in the same positioning block group, the projection shape and size of the two positioning grooves on the two positioning blocks on the upper surface of the base plate 501 are adapted to the projection shape of the tray 408 on the upper surface of the base plate 501. By means of the two positioning grooves in the same positioning block group, the position of the tray 408 on the positioning blocks can be defined, thereby achieving the positioning function.

[0037] The workflow of the above-described wafer transfer system is described in detail below. Specifically, while the first tray 408 is being processed in the reaction chamber 401, the operator can open the sealing door 405 of the loading chamber 406 and place the second tray 408 onto the upper positioning block of the wafer cassette 407. After the first tray 408 completes its processing, the robot arm 403 transfers it from the reaction chamber 401 back to the lower positioning block of the wafer cassette 407, then removes the second tray 408 from the upper positioning block and transfers it back to the reaction chamber 401 for processing. While the second tray 408 is being processed, the operator can again open the sealing door 405, place the third tray 408 onto the upper positioning block of the wafer cassette 407, and remove the first tray 408 from the lower positioning block. This cycle enables automatic replacement of old and new trays and continuous production in the reaction chamber. In other words, the tray loading and unloading operations are carried out in parallel with the process in the reaction chamber. This not only avoids downtime in the reaction chamber and enables continuous production, thereby improving the transfer efficiency of the wafer transfer system, but also eliminates the need for operators to handle wafer cassettes. This allows for the loading and unloading of larger and heavier trays, thus better meeting the future demand for transferring larger trays.

[0038] The lifting device 404 is used to drive the tray 407 to move up and down. The specific structure of the lifting device 404 includes a lifting shaft, a transmission mechanism, and a rotary motor (not shown in the figure). The upper end of the lifting shaft is connected to the base plate 501, and the lower end of the lifting shaft extends vertically downwards to the outside of the loading chamber 406, and is connected to the rotary motor through the transmission mechanism. The rotary motor provides rotational power; the transmission mechanism converts the rotational power of the rotary motor into linear motion in the vertical direction and transmits it to the lifting shaft. Driven by the lifting device 404, the tray 407 can be raised and lowered to position the unprocessed tray 408 at the height of the gate valve 409b, allowing the robot arm 403 to extend into the loading chamber 406 and retrieve the tray 408. Of course, in practical applications, the lifting device 404 can also adopt any other structure. For example, the lifting device can also include a lifting shaft and a lifting motor. The upper end of the lifting shaft is connected to the base plate 501, and the lower end of the lifting shaft extends vertically downward to the outside of the loading chamber 406 and is connected to the lifting motor. The lifting motor is used to drive the lifting shaft to make linear motion in the vertical direction.

[0039] It should be noted that in this embodiment, the tablet cassette 407 can support two trays 408 spaced apart in the vertical direction, that is, it has two layers of positioning block groups 503. However, the present invention is not limited to this. In practical applications, the tablet cassette can also be used to support three, four or more trays, that is, the number of positioning block groups can be three or more. In this case, the operator can perform tablet loading and unloading operations while processing the last unprocessed tray in the reaction chamber, that is, take out all the processed trays and put in multiple unprocessed trays.

[0040] As a modified embodiment of this example, Figure 5 This is a structural diagram of a wafer cassette in a modified embodiment of the present invention. Please refer to [link / reference]. Figure 5 This variant embodiment differs from the above embodiment only in the structure of the tablet box. Specifically, in this variant embodiment, the tablet box includes a base plate 601 and two side pillars 602. Similar to the above embodiment, the base plate 601 is horizontally disposed within the loading chamber and connected to a lifting device. The two side pillars 602 are disposed opposite each other on the upper surface of the base plate 601, and the space between them corresponds to the door valve and the sealing door, respectively. Furthermore, at least two slots 603 are vertically spaced on each side pillar 602, and the slots 603 on the two side pillars 602 are aligned with each other. The tray 604 is placed on the two slots 603 at the same height on the two side pillars 602. This also allows the tray 604 to be moved into or out of the tablet box from the first side facing the door valve and the second side facing the sealing door, respectively.

[0041] As another technical solution, Figure 6 This is a flowchart illustrating a wafer transfer method provided in an embodiment of the present invention. Please refer to [link / reference]. Figure 6 This invention also provides a wafer transfer method, which uses the wafer transfer system transfer tray described above. The following describes... Figure 3 Taking the wafer transfer system shown in the image as an example, the specific steps of this wafer transfer method are described in detail. Specifically, it includes the following steps:

[0042] S1, fill the loading chamber 406 with atmospheric air to make it in an atmospheric state;

[0043] S2, open the sealing door 405, place the unprocessed tray 408 from the second side (right side) of the tray 407 onto the upper positioning block of the tray 407, and remove the processed tray 408 from the lower positioning block of the tray 407.

[0044] S3, close the sealing door 405 and evacuate the loading chamber 406 to make it a vacuum state;

[0045] S4, the lifting device 404 drives the film box 407 to move up and down so that the unprocessed tray 408 is located at the height of the gate valve 409b; then, the robot arm 403 takes out the unprocessed tray 408 from the first side (left side) of the film box 407 and transfers it into the reaction chamber 401.

[0046] S5, the reaction chamber 401 begins to process the wafer on the tray 408. After the process is completed, the robot arm 403 removes the tray 408 from the reaction chamber 401 and transfers it back to the positioning block on the lower layer of the wafer cassette 407.

[0047] Furthermore, while the tray 408 is being processed in the reaction chamber 401, steps S1-S3 are performed to place the new, unprocessed tray 408 onto the upper positioning block of the cassette 407 and remove the processed tray 408 from the lower positioning block.

[0048] As can be seen from the above, the wafer transfer method provided by the embodiments of the present invention can realize the wafer picking and placing operation of the tray and the process in the reaction chamber in parallel. This not only avoids the idle time of the reaction chamber and realizes continuous production, but also improves the transfer efficiency of the wafer transfer system. Moreover, the operator does not need to move the wafer cassette, so it can realize the loading and unloading of larger and heavier trays, and thus better meet the future needs of transferring larger trays.

[0049] It should be noted that in this embodiment, the cassette 407 can support two trays 408 spaced apart in the vertical direction. However, the present invention is not limited to this. In practical applications, the wafer cassette can also be used to support three, four or more trays. In this case, the above steps S4 and S5 are repeated first until the wafers on all trays have been processed. Then, while the last tray is being processed in the reaction chamber, the above steps S1-S3 are performed.

[0050] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A wafer transfer system, comprising a reaction chamber, a transfer chamber, and a loading chamber arranged sequentially, wherein a valve is provided between each chamber for transferring a wafer from an atmospheric environment to the reaction chamber in a vacuum environment, wherein... A robotic arm is installed within the transfer chamber for transferring a tray carrying wafers between the reaction chamber and the loading chamber; a sealed door is provided on the loading chamber; the loading chamber includes a wafer cassette and a lifting device for driving the wafer cassette to move vertically, the wafer cassette supporting at least two trays spaced apart in a vertical direction; characterized in that... The tablet cassette includes at least two layers of positioning blocks spaced apart in a vertical direction; the tablet cassette is structured such that the tray can be moved into or out from a first side of the tablet cassette facing the valve and a second side facing the sealing door, respectively; wherein the valve includes a first valve and a second valve; and the first valve and the second valve are disposed opposite to each other between the reaction chamber and the transfer chamber, and between the transfer chamber and the loading chamber; After the tray in the reaction chamber completes the process, the first valve and the second valve open in sequence. The robot arm is used to transfer the completed tray from the reaction chamber to the loading chamber, and place it back from the first side of the cassette to a positioning block group of the cassette. The robot arm also takes the unprocessed tray from the first side of the cassette on the other positioning block group and transfers it to the reaction chamber. The sealing door is configured to be opened during processing in the reaction chamber, allowing the tray awaiting processing to be moved from the second side of the cassette into the loading chamber and placed on the other positioning block group of the cassette, and the tray that has completed processing to be removed from the one positioning block group of the cassette and moved out of the loading chamber from the second side of the cassette.

2. The wafer transmission system according to claim 1, characterized in that, The tablet cassette includes: The base plate is connected to the lifting device; Two side posts are disposed opposite to each other on the upper surface of the base plate, and the space between the two side posts corresponds to the door valve and the sealing door, respectively; At least two layers of positioning block groups are arranged at intervals along the vertical direction. Each layer of positioning block group includes two positioning blocks, which are respectively arranged flush with each other on the two side columns to support the tray.

3. The wafer transmission system according to claim 2, characterized in that, A positioning groove is provided on the surface of each positioning block used to support the tray; In the same layer of positioning block group, the projection shape and size of the two positioning grooves on the two positioning blocks on the upper surface of the base plate are adapted to the projection shape of the tray on the upper surface of the base plate.

4. A wafer transfer system, comprising a reaction chamber, a transfer chamber, and a loading chamber arranged sequentially, wherein a valve is provided between each chamber for transferring a wafer from an atmospheric environment to the reaction chamber in a vacuum environment, wherein... A robotic arm is installed within the transfer chamber for transferring a tray carrying wafers between the reaction chamber and the loading chamber; a sealed door is provided on the loading chamber; the loading chamber includes a wafer cassette and a lifting device for driving the wafer cassette to move vertically, the wafer cassette supporting at least two trays spaced apart in a vertical direction; characterized in that the wafer cassette comprises: The base plate is connected to the lifting device; Two side posts are disposed opposite to each other on the upper surface of the base plate, and the space between the two side posts corresponds to the door valve and the sealing door respectively; and at least two slots are provided vertically on each side post, and the slots on the two side posts are aligned with each other to support the tray. The structure of the tablet box is configured such that the tray can be moved into or out from the first side of the tablet box facing the valve and the second side facing the sealing door, respectively; wherein the valve includes a first valve and a second valve; and the first valve and the second valve are disposed opposite to each other between the reaction chamber and the transfer chamber, and between the transfer chamber and the loading chamber. After the tray in the reaction chamber completes its process, the first valve and the second valve open sequentially. The robotic arm is used to transfer the processed tray from the reaction chamber to the loading chamber and place it back into one slot of the cassette from the first side of the cassette. The unprocessed tray in the cassette from the other slot is taken out from the first side of the cassette and transferred to the reaction chamber. The sealing door is configured to be opened during the process in the reaction chamber, allowing the tray awaiting processing to move from the second side of the cassette into the loading chamber and be placed in the other slot of the cassette. The processed tray is taken out from the slot of the cassette and removed from the second side of the cassette from the loading chamber.

5. The wafer transmission system according to claim 2 or 4, characterized in that, The lifting device includes a lifting shaft, a transmission mechanism, and a rotary motor, wherein... The upper end of the lifting shaft is connected to the base plate, and the lower end of the lifting shaft extends vertically downward to the outside of the loading chamber and is connected to the rotary motor through the transmission mechanism. The rotary motor is used to provide rotational power; The transmission mechanism is used to convert the rotational power of the rotary motor into linear motion in the vertical direction and transmit it to the lifting shaft.

6. The wafer transmission system according to claim 2 or 4, characterized in that, The lifting device includes a lifting shaft and a lifting motor, wherein... The upper end of the lifting shaft is connected to the base plate, and the lower end of the lifting shaft extends vertically downward to the outside of the loading chamber and is connected to the lifting motor. The lifting motor is used to drive the lifting shaft to move linearly in the vertical direction.

7. A chip transfer method, characterized in that, The wafer transfer system according to any one of claims 1-6 is used to transfer the tray, and the wafer transfer method includes the following steps: S1, fill the loading chamber with atmospheric air; S2, open the sealed door, place at least two unprocessed trays into the tray from the second side of the tray, and remove the processed trays; S3, close the sealing door and evacuate the loading chamber; S4, the lifting device drives the cassette to move up and down, so that one of the unprocessed trays is located at the height of the valve; the robotic arm takes the tray from the first side of the cassette and transfers it into the reaction chamber; S5, the reaction chamber begins to process the wafer on the tray. After the process is completed, the robot arm removes the tray from the reaction chamber and transfers it back to the wafer cassette. Repeat steps S4 and S5 until all wafers on all the trays have been processed; and while the last tray is being processed in the reaction chamber, perform steps S1-S3.

8. The wafer transfer method according to claim 7, characterized in that, The film box supports two trays spaced apart along the vertical direction; In step S2, the unprocessed tray is located on the upper layer; the processed tray is located on the lower layer.

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