Environmentally controlled transport modules and handling systems

Abstract

This document provides methods and apparatus for processing substrates. In one embodiment, the apparatus includes a loading and locking chamber coupled to a transfer chamber. The transfer chamber is coupled to a heat treatment chamber, and the substrate is transferred between the loading and locking chamber, the transfer chamber, and the heat treatment chamber. In other embodiments, a processing platform having a loading and locking chamber, a transfer chamber, and a heat treatment chamber is disclosed. A method for measuring the oxygen concentration in the loading and locking chamber via evacuation of the transfer chamber is also described herein.

Description

[0001] background Technical Field

[0002] Embodiments of the present disclosure generally relate to substrate processing and transfer apparatus. More particularly, embodiments described herein relate to environmentally controlled transfer modules and processing systems. Background Art

[0003] Reliably producing sub-half-micron and smaller features is a key technical challenge for the next generation of very large scale integration (VLSI) and ultra large scale integration (ULSI) of semiconductor devices. However, the ever-shrinking dimensions of VLSI and ULSI technologies have placed greater demands on processing capabilities as the limits of circuit technology are pushed.

[0004] In advanced node devices, metal and barrier materials are often used in contact integration schemes. However, oxidation of various materials (e.g., metals and dielectrics) utilized in contact integration schemes can lead to adhesion problems and de-wetting of contact structure materials. Oxidation of various materials can also increase contact resistance. Therefore, poor adhesion of contact structures and increased contact resistance can lead to poor device performance leading to device failure.

[0005] Therefore, there is a need in the art for improved apparatus and methods for preventing oxidation of device structures during various stages of device fabrication. Summary of the invention

[0006] In one embodiment, a substrate processing apparatus includes a factory interface, a substrate transfer module for generating a substantially inert environment at about atmospheric pressure. The substrate transfer module includes a load lock chamber, a purge gas port, and a transfer chamber, the load lock chamber coupled to the factory interface, the load lock chamber having a chamber body defining a processing volume and a purge gas port in fluid communication with the processing volume, and the transfer chamber coupled to the load lock chamber. A processing module is also coupled to the substrate transfer module, wherein the processing module includes a plurality of processing chambers.

[0007] In another embodiment, a substrate processing apparatus includes a factory interface, and the factory interface includes a first transfer chamber having a first robot, the first robot being disposed in the first transfer chamber. The apparatus also includes a substrate transfer module for generating a substantially inert environment at about atmospheric pressure. The substrate transfer module includes a load lock chamber and a second transfer chamber, the load lock chamber being coupled to the first transfer chamber, the second transfer chamber having a second robot disposed in the second transfer chamber, wherein the second transfer chamber is coupled to the load lock chamber. The apparatus also includes a process module coupled to the substrate transfer module, wherein the process module includes a process chamber, and the process chamber is coupled to the second transfer chamber.

[0008] In another embodiment, a substrate processing apparatus includes a factory interface, and the factory interface includes a first transfer chamber and a plurality of front-opening standard chambers, the first transfer chamber having a first robot disposed in the first transfer chamber, and the plurality of front-opening standard chambers coupled to the first transfer chamber. The apparatus also includes a substrate transfer module for generating a substantially inert environment at approximately atmospheric pressure. The substrate transfer module includes an atmospheric pressure load lock chamber and a second transfer chamber, the atmospheric pressure load lock chamber coupled to the first transfer chamber, the second transfer chamber having a second robot disposed in the second transfer chamber, wherein the second transfer chamber is coupled to the load lock chamber. The apparatus also includes a processing module coupled to the substrate transfer module, wherein the processing module includes a laser thermal treatment chamber, and the laser thermal treatment chamber is coupled to the second transfer chamber.

[0009] In another embodiment, a substrate transfer apparatus includes a load lock chamber for generating a substantially inert environment at about atmospheric pressure. The load lock chamber includes a chamber body defining a processing volume, a pedestal disposed in the processing volume, a cover coupled to the chamber body opposite the pedestal, a purge gas port disposed through the cover, and an exhaust port disposed in the chamber body adjacent to the pedestal and opposite the purge gas port. The apparatus also includes a transfer chamber for generating a substantially inert environment at about atmospheric pressure, the transfer chamber coupled to the load lock chamber. The transfer chamber includes a chamber body defining a transfer volume, a robot disposed in the transfer volume, a plurality of purge gas ports disposed in the chamber body, and an exhaust port disposed in the chamber body opposite the plurality of purge gas ports.

[0010] In another embodiment, a substrate processing apparatus includes a load lock chamber for generating a substantially inert environment at about atmospheric pressure. The load lock chamber includes a chamber body defining a processing volume, a pedestal disposed in the processing volume, a fluid conduit disposed in the pedestal, a plurality of grooves formed along a periphery of the pedestal, and a plurality of lift pins disposed in the processing volume, each lift pin being adjacent to one of the plurality of grooves. The apparatus also includes a cover coupled to the chamber body opposite the pedestal, a diffuser plate coupled to the cover at a central region of the cover, wherein a portion of a bottom surface of the cover tapers radially outwardly from the diffuser plate, a purge gas port disposed through the diffuser plate, and an exhaust port disposed in the chamber body adjacent to the pedestal and opposite to the purge gas port.

[0011] In another embodiment, a substrate transfer apparatus includes a transfer chamber for generating a substantially inert environment at about atmospheric pressure, the transfer chamber coupled to a load lock chamber. The transfer chamber includes a chamber body defining a transfer volume, an optically transparent cover coupled to the chamber body, and a robot disposed in the transfer volume, wherein a blade of the robot is made of quartz. The apparatus also includes a plurality of purge gas ports disposed in the chamber body, a plurality of diffusers extending from the purge gas ports, an exhaust port disposed in the chamber body opposite the plurality of purge gas ports, an exhaust conduit coupled to the exhaust port, and an oxygen sensor in fluid communication with the transfer volume through the exhaust conduit and the exhaust port.

[0012] In another embodiment, the platform device includes a first factory interface, a second factory interface coupled to the first factory interface, and a tunnel chamber disposed between the first factory interface and the second factory interface, wherein the tunnel chamber includes a transfer chamber and a plurality of load lock chambers. The device also includes a first transfer module coupled to the first factory interface, a processing module coupled to the first transfer module, a central transfer chamber coupled to the second factory interface, and a plurality of processing chambers coupled to the central transfer chamber, wherein at least one of the plurality of processing chambers is coupled to the central transfer chamber via the second transfer module.

[0013] In one embodiment, the platform device includes a first factory interface, a transfer module coupled to the first factory interface, a processing module coupled to the transfer module, a second factory interface, and a central transfer chamber coupled to the second factory interface. The device also includes a tunnel chamber disposed between the first factory interface and the central transfer chamber, wherein the tunnel chamber includes a transfer chamber and a plurality of load lock chambers. The device also includes a plurality of processing chambers coupled to the central transfer chamber.

[0014] In one embodiment, a substrate processing method includes: transferring a substrate from a first chamber to a second chamber, isolating an environment of the second chamber from an environment of the first chamber, removing an oxidant from the environment of the second chamber, and cooling the substrate in the second chamber. The method also includes: opening a slit valve between the first chamber and the second chamber, evacuating the environment of the first chamber, and analyzing the first chamber effluent to determine an oxygen concentration of the environment of the second chamber.

[0015] In one embodiment, a substrate transfer method includes transferring a substrate from a transfer chamber to a load lock chamber, closing a slit valve between the transfer chamber and the load lock chamber to isolate an environment of the load lock chamber from an environment of the transfer chamber, removing an oxidant from the environment of the load lock chamber, and cooling the substrate in the load lock chamber. The method also includes opening the slit valve between the transfer chamber and the load lock chamber, evacuating the environment of the transfer chamber during opening of the slit valve, and analyzing the transfer chamber effluent to determine an oxygen concentration of the environment of the load lock chamber during cooling of the substrate.

[0016] In one embodiment, a substrate transfer method includes transferring a substrate from a processing chamber to a transfer chamber, transferring the substrate from the transfer chamber to a load lock chamber, and closing a slit valve between the transfer chamber and the load lock chamber to isolate an environment of the load lock chamber from an environment of the transfer chamber. The method also includes removing an oxidant from an environment of the load lock chamber, cooling the substrate in the load lock chamber, opening the slit valve between the transfer chamber and the load lock chamber, evacuating the environment of the transfer chamber during opening the slit valve, and analyzing the transfer chamber effluent to determine an oxygen concentration of the environment of the load lock chamber during cooling of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The manner in which the above-described detailed features of the disclosure briefly summarized above can be understood in detail, as well as a more specific description of the disclosure, can be obtained by reference to the embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate only exemplary embodiments and are not to be construed as limiting the scope of the disclosure, as the disclosure may admit to other equally effective embodiments.

[0018] Figure 1 A schematic plan view of a processing system according to embodiments described herein is shown.

[0019] Figure 2 A schematic perspective view of a substrate transfer module according to embodiments described herein is shown.

[0020] Figure 3 A schematic perspective view of a transfer chamber according to embodiments described herein is shown.

[0021] Figure 4Illustration according to the embodiments described herein Figure 3 Schematic partial perspective view of a transfer chamber.

[0022] Figure 5 A schematic cross-sectional view of a load lock chamber is shown according to embodiments described herein.

[0023] Fig. 6A Illustration according to the embodiments described herein Figure 5 Schematic partial perspective view of a load lock chamber.

[0024] Figure 6B Illustration according to the embodiments described herein Fig. 6A Schematic cross-sectional view of the lift rods of the load lock chamber.

[0025] Figure 6C Illustration according to the embodiments described herein Fig. 6A Schematic cross-sectional view of substrate support features of a load lock chamber.

[0026] Figure 7 A schematic plan view of a processing system according to embodiments described herein is shown.

[0027] Figure 8 A schematic plan view of a processing system according to embodiments described herein is shown.

[0028] Fig. 9 A schematic diagram of a processing platform according to embodiments described herein is shown.

[0029] Fig.10 A schematic diagram of a processing platform according to embodiments described herein is shown.

[0030] Fig.11 Illustrated are operations of a method for transferring a substrate and measuring oxygen concentration in a load lock chamber according to embodiments described herein.

[0031] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further description. DETAILED DESCRIPTION

[0032] Methods and apparatus for processing substrates are provided herein. In one embodiment, the apparatus includes an environmentally controlled load lock chamber coupled to a transfer chamber. The transfer chamber may be coupled to a thermal processing chamber, and in this case the substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal processing chamber. In other embodiments, a processing platform having an environmentally controlled load lock chamber, a transfer chamber, and a thermal processing chamber is disclosed. A method of measuring oxygen concentration in a load lock chamber by analyzing exhaust from the transfer chamber is also described herein.

[0033] Figure 1 A schematic plan view of a processing system 100 according to an embodiment described herein is illustrated. The processing system 100 includes a factory interface 102, a substrate transfer module 104, and a processing module 106. The factory interface 102 includes a factory interface (FI) transfer chamber 110, and the FI transfer chamber is configured to connect to one or more front opening unified pods (FOUPs) 108. In one embodiment, the FI transfer chamber 110 has a single robot disposed in the FI transfer chamber, and the robot transfers substrates between FUOPs 108 and the substrate transfer module 104. In another embodiment, the FI transfer chamber 110 has multiple robots (e.g., two robots) disposed in the FI transfer chamber 110. In this embodiment, each robot transfers a substrate from one of the FOUPs 108 to a dedicated portion of the substrate transfer module 104.

[0034] The substrate transfer module 104 includes one or more load lock chambers 112 and one or more transfer chambers 114. In the illustrated embodiment, the substrate transfer module 104 includes two load lock chambers 112 and two transfer chambers 114, however, it is contemplated that a greater or lesser number of load lock chamber 112 and transfer chamber 114 pairs may be utilized in the processing system 100.

[0035] Each load lock chamber 112 is coupled to the FI transfer chamber 110 on a first side of the load lock chamber 112, and each transfer chamber 114 is coupled to a corresponding load lock chamber 112 on a second side of the load lock chamber 112, the second side of the load lock chamber 112 being opposite to the first side of the load lock chamber 112. The first side of each transfer chamber 114 is coupled to the corresponding load lock chamber 112. The transfer chamber 114 has a robot disposed in the transfer chamber 114, and the transfer chamber 114 is in operable communication with the load lock chamber 112. For example, a substrate can be transferred between the transfer chamber 114 and the load lock chamber 112.

[0036] The processing module 106 includes one or more processing chambers 116, each of which is coupled to a respective transfer chamber 114 at a second side of the transfer chamber 114, the second side of the transfer chamber 114 being opposite to the first side of the transfer chamber 114. In the illustrated embodiment, the processing module 106 includes two processing chambers 116, however, it is contemplated that a greater number of processing chambers may be utilized in the processing module 106. It should be noted that the chambers may be coupled in a non-linearly aligned configuration, such as in Figure 1 Thus, connections may be made at locations and sides of the chamber that are not necessarily opposite.

[0037] In one embodiment, the processing chamber 116 is a thermal processing chamber, such as a rapid thermal processing chamber. In certain embodiments, the processing chamber 116 is a laser thermal processing chamber. An example of a laser thermal processing chamber is the ASTRA 1000 available from Applied Materials, Inc., Santa Clara, CA. TM Thermal processing tool. In an alternative embodiment, the processing chamber 116 is a lamp-based thermal processing chamber. Examples of lamp-based thermal processing chambers include and VULCAN TM Rapid thermal processing tools are available from Applied Materials, Inc., Santa Clara, CA. It is also contemplated that other tools from other manufacturers may be advantageously implemented in accordance with the embodiments described herein. In addition to the embodiments described above, it is also contemplated that the processing chamber 116 may be an etch chamber, a deposition chamber, or a cleaning chamber, depending on the desired embodiment.

[0038] In operation, substrates to be processed are transferred to the factory interface 102 via the FOUPs 108. A robot in the FI transfer chamber 110 removes the substrates from the FOUP 108 and transfers the substrates to the load lock chamber 112. A robot disposed in the transfer chamber 114 takes the substrates from the load lock chamber 112 and transfers the substrates to the processing chamber 116 where the substrates are processed. After processing, the robot in the transfer chamber 114 takes the substrates from the processing chamber 116 and transfers the substrates to the load lock chamber 112. The robot in the FI transfer chamber 110 then takes the substrates from the load lock chamber 112 and returns the substrates to the FOUP 108.

[0039] In embodiments where the processing chamber 116 is a thermal processing chamber, the substrate may be transferred to the factory interface 102 after cooling in the load lock chamber 112. The chambers are isolated from each other at appropriate times by using sealing doors (not shown) between the chambers, which are opened at appropriate times for the passage of substrates between the chambers.

[0040] Figure 2 A schematic perspective view of a substrate transfer module 104 according to an embodiment described herein is illustrated. The illustrated substrate transfer module 104 includes a first load lock chamber 202 coupled to a first transfer chamber 204 and a second load lock chamber 206 coupled to a second transfer chamber 208. The first load lock chamber 202 and the first transfer chamber 204 define one of the substrate transfer modules 104, and the second load lock chamber 206 and the second transfer chamber 208 define the other of the substrate transfer modules 104. Thus, the illustrated embodiment shows a pair of substrate transfer modules 104. The first and second load lock chambers 202, 206 and the first and second transfer chambers 204, 208 are similar to the embodiment described with respect to Figure 1 The load lock chamber 112 and the transfer chamber 114 are depicted.

[0041] The load lock chamber 112 includes a chamber body 210 defining a processing volume (not shown) that is sized to accommodate substrates therein. The chamber body 210 may be sized to accommodate substrates having different diameters, such as 200 mm diameter, 300 mm diameter, or 450 mm diameter, among other sizes. The chamber body 210 is formed of a metal material, such as aluminum, stainless steel, and combinations thereof. In one embodiment, the chamber body 210 is made of aluminum billet.

[0042] The first slit valve 212 formed in the body 210 is sized to accommodate the passage of the substrate through the first slit valve 212. The first slit valve 212 is configured to interface with the factory interface 102 ( Figure 1 ) is coupled to the main body 210 and a first slit valve door 214 is coupled to the main body 210 adjacent to the first slit valve 212. In operation, the first slit valve door 214 opens and closes the first slit valve 212 to enable access to the load lock chamber 112 by a robot disposed in the factory interface 102. The load lock chamber 112 also includes a second slit valve (not shown) disposed in the chamber main body 210 opposite to the first slit valve 212. A second slit valve door 216 is coupled to the main body 210 adjacent to the second slit valve to open and close the second slit valve. A second slit valve (about Figure 5 ). A purge gas conduit 218 is also coupled to the chamber body 210 and is in fluid communication with the processing volume.

[0043] exist Figure 2 In an embodiment, the transfer chamber 114 is directly coupled to the load lock chamber 112, including a chamber body 220, a robot 224 disposed in the chamber body 220, and a cover 222. The chamber body 220 is formed of a metal material, such as aluminum, stainless steel, and combinations thereof. In certain embodiments, similar to the load lock chamber 112, the chamber body 220 is manufactured from an aluminum billet. The robot 224 is configured to transfer a substrate, such as the illustrated substrate 230, between the load lock chamber 112 and the processing chamber 116. Therefore, the reach of the robot is sufficient to extend into the load lock chamber 112 and the processing chamber 116 to position and retrieve the substrate for transfer operations.

[0044] A cover 222 is removably coupled to the top of the chamber body 220. In one embodiment, the cover 222 is formed of an optically clear or primarily optically clear material to enable viewing of the interior of the transfer chamber 114. In one embodiment, the cover 222 is formed of a polymeric material such as polycarbonate or the like. Although not shown, a plurality of through holes are formed in the body 220 of the transfer chamber 114 to enable the substrate 230 to pass through the body. A plurality of local center finding (LCF) sensors 226, 228 are also coupled to the chamber body 220. The LCF sensors are coupled to the through holes to observe the substrate passing into and out of the transfer chamber 114.

[0045] The first LCF sensor 226 is coupled to the chamber body 220 adjacent to the load lock chamber 112 and is configured to detect the position of the substrate 230 when the substrate 230 is transferred from the load lock chamber 112 to the transfer chamber 114. The second LCF sensor 228 is coupled to the chamber body 220 opposite to the first LCF sensor 226 adjacent to the processing chamber 116. Similar to the first LCF sensor 226, the second LCF sensor is configured to detect the position of the substrate 230 when the substrate 230 is transferred from the transfer chamber 114 to the processing chamber 116. Each of the LCF sensors 226 and 228 also detects the position of the substrate during transfer from the transfer chamber 114 to the load lock chamber 112 and during transfer from the processing chamber 116 to the transfer chamber 114, respectively.

[0046] Figure 3A schematic perspective view of a transfer chamber 114 according to an embodiment described herein is illustrated. The chamber body 220 includes a top surface 302 supporting an LCF sensor 226, an LCF sensor 228, and a cover 222. The cover 222 has a plurality of handles 304 attached to the cover 222 to enable efficient removal of the cover 222 from the chamber body 220. By utilizing an optically transparent material of the cover 222, it is contemplated that additional viewing holes formed in the chamber body 220 are unnecessary, thereby simplifying the chamber body manufacturing process. In addition, if maintenance is required, the cover 222, which may be coupled to the chamber body 220 by threaded fasteners or the like, may be easily removed, thereby reducing downtime and improving work efficiency. The cover 222 may be coupled to the chamber body 220 by a suitable fastening and sealing system. In one embodiment, the cover 222 may be fixed to the chamber body 220 by a plurality of screws 316, and the cover 222 may be unscrewed to remove the cover 222. A sealing member (not shown) may be disposed between the cover 222 and the chamber body 220 to provide a vacuum seal when the transfer chamber 114 is under operating pressure.

[0047] The process chamber port adapter 306 is coupled to the chamber body 220 on a surface of the chamber body 220, which is coupled to the process chamber 116 (not shown). In one embodiment, the port adapter 306 is coupled to the chamber body 220 by a plurality of fasteners, such as bolts or the like. The mounting plate 308 is coupled to the port adapter 306 to enable the transfer chamber 114 to be securely coupled to the process chamber 116. The mounting plate 308 is removably coupled to the port adapter 306 and can be replaced with a different adapter plate if it is desired to use a substrate transfer module 104 with a different type of process chamber.

[0048] The slit valve 310 is an opening formed in and extending through each of the chamber body 220, the port adapter 306, and the mounting plate 308. Similar to other slit valves described herein, the slit valve 310 is sized to accommodate the passage of the substrate 230. The slit valve 310 is opened and closed by a slit valve door 312 that is coupled to the chamber body 220 or the port adapter 306, depending on the desired implementation.

[0049] Figure 4 Illustration according to the embodiments described herein Figure 31 is a schematic partial perspective view of the transfer chamber 114. The cover 222 is disassembled and partially cut away to more clearly illustrate various aspects of the interior of the transfer chamber 114. The chamber body 220 includes a first bottom plate 402 and a second bottom plate 420. In one embodiment, the first bottom plate 402 is part of the chamber body 220. In an alternative embodiment, the first bottom plate 402 is an insert that is removably coupled to the chamber body 220. The second bottom plate 420 is also coupled to the chamber body 220. In one embodiment, the second bottom plate 420 is formed of the same material as the first bottom plate 402 and the chamber body 220. The second bottom plate 420 can also be an insert that is fastened to the chamber body 220. The second bottom plate 420 is annular in shape, with the manipulator 224 extending through an opening. The actuator (not shown) can be a rotary actuator or a z-θ actuator, and the actuator located outside the chamber body 220 is coupled to the manipulator 224 through an opening in the second bottom plate 420. The first bottom plate 402 is also annular in shape and surrounds the second bottom plate 420 .

[0050] An exhaust port 404 is formed in the bottom plate 402 adjacent to the second slit valve door 216. The exhaust port 404 may be centered relative to the second slit valve door 216 (i.e., positioned such that the center of the exhaust port 404 is located on a bisector of the slit valve door 216 and is perpendicular to the slit valve door 216) or may be offset from the center of the second slit valve door 216. The exhaust port 404 extends through the bottom plate and provides fluid communication between the volume of the transfer chamber 114 within the chamber body 220 and an exhaust device (not shown).

[0051] A plurality of purge gas ports 406, 408 are formed in the first bottom plate 402 adjacent to the slit valve door 312. The first purge gas port 406 is disposed in the first bottom plate 402 at an azimuth angle of between about 90° and about 180° to the exhaust port 404 in a first direction. A second purge gas port 408 (shown in phantom) is disposed in the first bottom plate 402 at an azimuth angle of between about 90° and about 180° to the exhaust port 404 in a second direction opposite to the first direction. More generally, the purge gas ports 406, 408 are disposed through the first bottom plate 402 opposite to the exhaust port. The azimuth displacement of the first and second purge gas ports 406, 408 from the exhaust port 404 may be the same in opposite directions, or may be different.

[0052] An optional exhaust port 414 may be provided in the first bottom plate 402 opposite the exhaust port 404. The optional exhaust port 414 may be utilized if it is desired to exhaust a larger volume of fluid flow from the transfer chamber 114. In an alternative embodiment, the exhaust port 404 may be provided in the first bottom plate 402 at the location of the optional exhaust port 414, and the purge gas ports 406, 408 may be provided in an orientation similar to that shown, adjacent to the second slit valve door 216 instead of adjacent to the slit valve door 312. In other words, the transfer chamber 114 may have one or two exhaust ports 404 (and 414), the exhaust ports may be located adjacent to the slit valve door 216 or the slit valve door 312 or both, and the purge gas ports 406, 408 may be located adjacent to the slit valve door 216 or the slit valve door 312. Additionally, it should be noted that the transfer chamber 114 may have one, two, three, or four purge gas ports 406, which may be located near the slit valve door 216 or the slit valve door 312, or both.

[0053] A plurality of diffusers 410, 412 are coupled to the first base plate 402 in the first purge gas port 406 and the second purge gas port 408, respectively. The diffusers 410, 412 extend from the purge gas ports 406, 408 at a plane above the first base plate 402. Each of the purge gas ports 406, 408 is fluidly coupled to a purge gas source (not shown), and the purge gas ports 406, 408 enable the introduction of a purge gas into the transfer chamber 114. Suitable examples of purge gases include inert gases, such as nitrogen, helium, and argon, or the like.

[0054] In operation, the transfer chamber 114 may be evacuated from atmospheric pressure to a low pressure between about 2 Torr and about 5 Torr. Subsequently, a purge gas may be introduced into the transfer chamber 114. The purge gas is delivered through the purge gas ports 406, 408, wherein the purge gas is deflected throughout the transfer chamber 114 by diffusers 410, 412. The purge gas may be delivered through the purge gas ports 406, 408 at a rate between about 10 standard liters per minute (slm) and about 200 slm, such as between about 50 slm and about 90 slm. It is contemplated that the environment within the transfer chamber 114 may reach an oxygen concentration of less than about 0.1 parts per million (ppm) when purged according to the embodiments described herein.

[0055] In general, the transfer chamber 114 may be maintained at about atmospheric pressure. In one embodiment, a purge gas may be utilized to remove non-inert or unwanted gases from the transfer chamber 114. In another embodiment, a purge gas may be utilized to pressurize the transfer chamber 114 to slightly above atmospheric pressure. In this embodiment, the environment within the transfer chamber 114 may be maintained at a pressure between about 1 pound per square inch (psi) and about 10 psi, such as about 5 psi above atmospheric pressure. By maintaining the transfer chamber environment at a slightly positive pressure, it is believed that maintenance of an inert and clean environment within the transfer chamber 114 may be achieved by ensuring that any gas leaks in the chamber flow to the exterior of the chamber, thereby preventing intrusion of ambient gases into the chamber. In this manner, a substantially inert environment may be obtained. In one embodiment, a substantially inert environment is substantially free of oxidants, such as oxygen, air, CO2, water vapor, or the like.

[0056] The robot 224 rotates about a central axis and has an arm 416 that enables the substrate to be transferred in the X and Y directions. The arm 416 is coupled to a blade 418 that supports the substrate 230 during transfer. The blade 418 may be made of a material such as quartz. By utilizing quartz, the blade is able to support the substrate 230 after processing in the processing chamber 116, when the substrate 230 may have a temperature greater than about 500° C. In one embodiment, the portion of the arm 416 coupled to the blade 418 may be made of an alloy material such as 60) is manufactured to minimize stress on the blade 418 due to thermal expansion.

[0057] In addition to the embodiments described above, the transfer chamber 114 may be actively cooled to facilitate cooling of the substrate 230 after processing in the process chamber 116. In this embodiment, the fluid may flow through channels formed in the body 220 or by introducing a cooled purge gas into the transfer chamber 114 through the purge gas ports 406, 408. It is believed that by cooling the transfer chamber 114, the time for the substrate 230 to cool during post-processing in the load lock chamber 112 may be reduced.

[0058] Figure 5A schematic cross-sectional view of a load lock chamber 112 according to embodiments described herein is shown. The load lock chamber 112 includes a chamber body 210 defining an inner volume 502. A substrate support 508 is disposed within the inner volume 502 and a plurality of fluid conduits 510 are disposed within the substrate support 508. The fluid conduits 510 may traverse the base in a spiral path, a circumferential path, a serpentine path, or other tortuous path. The fluid conduits 510 are disposed adjacent to a substrate supporting surface 509 of the substrate support 508 to provide the fluid conduits 510 in proximity to the substrate in contact with the substrate supporting surface 509. Such proximity improves the efficiency of heat transfer between the substrate and the fluid circulating through the fluid conduits 510. In one embodiment, the distance between the outer diameter of each fluid conduit 510 and the substrate supporting surface is about 0.1 mm to about 5 mm, such as about 1 mm.

[0059] Fluid conduit 510 is also fluidly coupled to a cooling fluid source 512. Suitable cooling fluids include water, water-based glycol mixtures, perfluoropolyethers (e.g., fluid), oil-based heat transfer fluid, liquid metal (e.g., gallium or gallium alloy), or other similar fluid. In one embodiment, the substrate support 508 may be maintained at a temperature between about 10°C and about 30°C, such as about 20°C during cooling of the substrate 230. Optionally, a heater 516 may also be disposed in the inner volume 502 if heating of the substrate 230 is desired. The heater 516 may be a ceramic heater or the like, or may be a resistive heater disposed within the substrate support 508 or otherwise in thermal contact with (e.g., adjacent to) the substrate support 508. Figure 5 In the embodiment of FIG. 5 , the optional heater 516 is shown adjacent to the substrate support 508 in a recess 511 that surrounds the substrate support 508. The recess 511 opens into the inner volume 502 such that the substrate support 508 has a pedestal shape. Alternatively, the substrate support 508 may be a plate that contacts the sidewall 513 of the load lock 112, and the optional heater 516 and recess 511 may be separated from the inner volume 502 by the substrate support 508.

[0060] The lid 506 is coupled to the chamber body 210 opposite the substrate support 508. The lid 506 can be made of a metal material similar to or the same as the material selected for the chamber body 210. The diffuser plate 504 can be coupled to and disposed in a central region of the lid 506. The diffuser plate 504 is in fluid communication with the inner volume 502 and the purge gas conduit 218. The purge gas conduit 218 is coupled to a purge gas source 514, and the purge gas conduit extends through the diffuser plate 504 near the inner volume 502.

[0061] The bottom surface 534 of the lid 506 extends radially inward from the chamber body 210 to the diffuser plate 504. A portion 536 of the bottom surface 534 of the lid 506 tapers radially outward from the diffuser plate 504. It is believed that the shape of the lid bottom surface 534, combined with the delivery of the purge gas through the lid 506 and diffuser plate 504, provides improved distribution of the purge gas throughout the interior volume 502.

[0062] In operation, for most substrate cooling operations, the load lock chamber 112 is maintained at substantially atmospheric pressure. However, the composition of the environment in the internal volume 502 is controlled to be a substantially inert environment. To ensure a substantially inert environment (i.e., an environment that is substantially free of oxidants or reductants, for example, an O2 concentration of less than 1 ppm), the load lock chamber 112 is evacuated from about atmospheric pressure to a low pressure between about 2 Torr and about 5 Torr. Subsequently, the internal volume 502 is purged using an inert gas such as nitrogen, helium, or argon or the like. In one embodiment, the flow rate of the purge gas during the purge of the internal volume 502 is between about 2 slm and about 100 slm, for example, about 50 slm. Due to the purge, the pressure is raised to about atmospheric pressure or slightly above atmospheric pressure, for example, between about 1 psi and about 10 psi above atmospheric pressure, for example, about 5 psi.

[0063] The second slit valve 518 is disposed in the chamber body 210 opposite to the first slit valve 212. The first slit valve 212 and the second slit valve 518 are disposed along the same plane. The second slit valve 518 is disposed adjacent to the transfer chamber 114 and is opened and closed by the second slit valve door 216. As described above, the exhaust port 404 of the transfer chamber 114 is disposed near the second slit valve door 518.

[0064] It is generally desirable to maintain the inner volume 502 in a substantially oxygen-free environment during substrate transfer and substrate cooling in the load lock chamber 112. The environment of the load lock inner volume 502 may be monitored by analyzing exhaust from the transfer chamber 114 obtained from the exhaust port 404 when the second slit valve door 216 is opened. The exhaust port 404 is adjacent to the second slit valve door 216 to allow gas from the load lock chamber 112 to flow through the second slit valve 518 into the exhaust port 404 when the second slit valve door 216 is opened.

[0065] The transfer chamber 114 includes an exhaust conduit 520 coupled to and in fluid communication with the exhaust port 404. The exhaust conduit 520 is in fluid communication with an exhaust outlet 532. A pump 530 is coupled to the exhaust conduit 520 between the exhaust outlet 532 and the exhaust port 404, and a check valve 528 is disposed in the exhaust conduit 520 between the pump 530 and the exhaust port 404. During pumping of the transfer chamber 114, gas flows through the exhaust port to the exhaust outlet 532.

[0066] The oxygen sensor 522 is in fluid communication with the exhaust conduit 520 via a first conduit 524 and a second conduit 526. The oxygen sensor 522 has a pump disposed in the oxygen sensor 522, and may draw exhaust gas from the exhaust conduit 520 via the first conduit 524 for sampling. Alternatively, the oxygen sensor 522 may rely on a differential pressure across the check valve 528 to flow gas through the oxygen sensor 522, thus eliminating the need for a separate pump in the oxygen sensor 522. The first conduit 524 is coupled to the exhaust conduit 520 between the exhaust port 404 and the check valve 528. The second conduit 526 extends from the oxygen sensor 522 to the exhaust conduit 520 between the check valve 528 and the pump 530.

[0067] In operation, pump 530 draws gas from the transfer chamber environment to exhaust outlet 532, which also contains fluid from the load lock chamber environment when second slit valve 518 is opened. During evacuation of transfer chamber 114, oxygen sensor 522 draws a sample volume of the exhaust fluid, analyzes the oxygen in the exhaust, and returns the exhaust to exhaust conduit 520. Suitable examples of oxygen sensors that may be implemented in accordance with embodiments described herein include the Model 3100 O2 Analyzer available from Neutronics, Inc. of Exton PA. It is also contemplated that other O2 analyzers from other manufacturers capable of detecting oxygen concentrations of less than about 1 ppm may be utilized in accordance with embodiments described herein.

[0068] Fig.11 The operations of a method 1100 for transferring a substrate and measuring oxygen concentration in a load lock chamber according to embodiments described herein are illustrated. At operation 1110, a substrate 230 is transferred from a processing chamber 116 to a transfer chamber 114. At operation 1120, the substrate 230 is transferred to a load lock chamber 112.

[0069] At operation 1130, the load lock chamber environment is isolated from the transfer chamber environment by closing the second slit valve 518. Oxygen is removed from the load lock chamber 112 by purging the load lock environment at operation 1140. At operation 1150, the substrate 230 is cooled in an oxygen-deficient, oxidant-deficient, and / or substantially inert environment. It is believed that by enabling the transfer and cooling of the substrate in a substantially inert and oxygen-free environment, subsequent contact structure formation processes may be improved.

[0070] At operation 1160, the second slit valve 518 between the load lock chamber 112 and the transfer chamber 114 is opened. At operation 1170, the transfer chamber environment is evacuated during the opening of the second slit valve 518. At operation 1180, the transfer chamber effluent is analyzed to determine the oxygen concentration of the load lock chamber environment during substrate cooling. It is also contemplated that the oxygen concentration of the internal volume 502 of the transfer chamber 114 may be analyzed using an oxygen sensor.

[0071] Thus, it is possible to determine whether the substrate 230 is cooled in a substantially inert environment. If the oxygen sensor 522 determines that the oxygen concentration is too great, such as greater than about 1 ppm, data may be generated indicating that the substrate 230 was exposed to oxygen, at which point an operator of the processing system 100 may determine what remedial action, if any, to implement.

[0072] Fig. 6A Illustration according to the embodiments described herein Figure 5 FIG. 5 is a schematic partial perspective view of a load lock chamber of FIG. 500 with the lid 506 removed for clarity. The chamber body 210 includes a sidewall 628 that at least partially surrounds the substrate support 508. In one embodiment, the sidewall 628 may be made of the same material used to form the chamber body 210. In another embodiment, the sidewall 628 may be a process accessory that is separable from the chamber body 210. Examples of suitable materials for making the sidewall 628 include aluminum, stainless steel, and combinations thereof, or various ceramic materials in the case of a process accessory.

[0073] An exhaust port 626 is formed in the sidewall 628, and the exhaust port 626 is in fluid communication with the internal volume 502. The exhaust port 626 is also in fluid communication with a pump or exhaust device (not shown). In operation, the load lock chamber 112 can be evacuated to a pressure between about 2 Torr and about 5 Torr via the exhaust port 626 to remove all or substantially all oxygen that may be present in the internal volume 502. A purge gas, such as nitrogen or the like, is delivered to the internal volume 502, and the pressure is raised to about atmospheric pressure or slightly above atmospheric pressure. In one embodiment, the purge gas raises the pressure within the internal volume 502 to between about 1 psi and about 10 psi above atmospheric pressure. It is believed that the use of a slightly positive pressure reduces or eliminates the probability of oxygen entering the load lock chamber 112 during substrate cooling.

[0074] The load lock chamber 112 also includes a plurality of lift pins 602. The plurality of lift pins 602 are spaced apart around the perimeter of the substrate support 508. In the illustrated embodiment, three lift pins 602 are shown, however, it is also contemplated that a greater number of lift pins may be utilized. The substrate support 508 has recesses 604 formed in the substrate support 508 that are sized to accommodate the lift pins 602 that extend laterally toward the center of the substrate support 508. The recesses 604 thus extend radially from the edge of the substrate support toward the center of the substrate support. Similar to the lift pins 602, the recesses 604 are spaced apart around the perimeter of the substrate support 508. In one embodiment, the recesses 604 and lift pins 602 are disposed at corresponding locations around the perimeter of the substrate support 508. In another embodiment, the recesses 604 have a semicircular shape, however, it is contemplated that other shapes may be utilized to accommodate the lift pins 602.

[0075] In one embodiment, the lift pins 602 and the groove 604 are disposed adjacent to the chamber body 210 on a side that is perpendicular to the side having the slit valve doors 214, 216 coupled thereto. In one embodiment, one of the lift pins 602 is disposed opposite the other two lift pins 602. The position of the lift pins 602 relative to the substrate support 508 and the substrate transfer path allows the substrate 230 to be supported by the lift pins 602 and the substrate support 508 without changing the transfer path of the substrate 230.

[0076] Figure 6B Illustration according to the embodiments described herein Fig. 6A Schematic cross-sectional view of one lift bar 602 of a load lock chamber 112 of FIG. Each lift bar 602 includes a shaft 606, a first extension portion 608 coupled to and extending from the shaft 606, and a second extension portion 610 coupled to and extending from the shaft 606. At least one of the first extension portion 608 and the second extension portion 610 is attached to the shaft 606 at a position between a first end of the shaft 606 and a second end of the shaft 606. The first extension portion 608 may be attached to the shaft 606 between the first end and the second end, while the second extension portion 610 is attached to the second end of the shaft 606.

[0077] Each of the first extension portion 608 and the second extension portion 610 extends laterally from the axis 606, for example at a 90° angle to the axis 606. Each of the extension portions 608, 610 can extend at a 90° angle to the axis 606, or at another angle similar to that capable of supporting a substrate. For example, the second extension portion 610 can form a 90° angle with the axis 606, while the first extension portion 608 extends laterally away from the axis 606 and the second extension portion 610. In addition, each of the first extension portion 608 and the second extension portion 610 is shown as a straight member extending straight away from the axis 606, but one or more of the extension portions 608, 610 can be non-linear. For example, one or more of the first extension portion 608 and the second extension portion 610 can be an inclined member having a first portion at an angle to the axis 606 and a second portion at an angle to the first portion.

[0078] The shaft 606 is disposed radially outward from the edge of the substrate support 508, and the first extension 608 and the second extension 610 extend radially inward from the shaft 606. In one embodiment, the first extension 608 and the second extension 610 extend radially inward from the outer edge of the substrate support 508.

[0079] The first extension portion 608 and the second extension portion 610 are spaced apart by a distance 620, which is suitable for accommodating the positioning and support of the substrate 230 on the first extension portion. In one embodiment, the distance 620 is between about 10 millimeters (mm) and about 30 mm, for example, about 20 mm. The first extension portion 608 includes a top surface 612, and the top surface 612 has a first support ball 616 disposed therein. Similar to the first extension portion 608, the second extension portion 610 has a top surface 614, and the top surface 614 has a second support ball 618 disposed in the top surface 614. The first support ball 616 and the second support ball 618 are coupled to the top surface 612, the top surface 614, respectively, and extend above the top surface 612, the top surface 614. When the substrate 230 is supported by the lifting rod 602, the substrate 230 contacts the support balls 616, the support balls 618 and rests on the support balls 616, the support balls 618. Examples of suitable materials for making support balls 616, 618 include various ceramic materials, such as silicon nitride or silicon carbide. Although support balls 616, 618 are described herein as being spherical, it is contemplated that support balls 616, 618 may be oval pads, rounded rectangles, protrusions from top surface 612, top surface 614, or the like.

[0080] Look back Fig. 6A, the substrate support 508 also includes a plurality of contact balls 622 disposed in a top surface of the substrate support 508. The contact balls 622 are spaced apart so that the substrate 230 is evenly supported during the cooling process in the load lock chamber 112. Similar to the support balls 616, 618, the contact balls 622 are made of one or more ceramic materials such as silicon nitride or silicon carbide.

[0081] In operation, the lift pins 602 are raised to the loading / unloading position where the first extension 608 is disposed above the top surface of the substrate support 508. When transferring a substrate from the factory interface 102, an unprocessed substrate is placed on the second extension 610. A processed substrate from the processing chamber 116 is placed on the first extension 608 by the robot 224 of the transfer chamber 114. The lift pins 602 are retracted from the loading / unloading position to the processing position where the first extension 608 is disposed in the recess 604 and the substrate is supported by the contact ball 622 to cool the processed substrate.

[0082] After the processed substrate is sufficiently cooled, the lift pins 602 are extended from the processing position to the loading / unloading position while the substrate is placed on the lift pins 602. The processed substrate supported by the first extension 608 is retrieved by a robot from the factory interface 102. An unprocessed substrate supported by the second extension 610 is retrieved by the robot 224 and transferred through the transfer chamber 114 to the processing chamber 116. Thus, the load lock chamber 112 provides improved efficiency in transferring and cooling substrates in an environment without or substantially without oxygen.

[0083] Figure 6C Illustration according to the embodiments described herein Fig. 6A 6. A schematic cross-sectional view of a substrate support 508 and a contact ball 622 is shown in FIG. 6. The contact ball 622, coupled to a base, such as by a press fit or the like, extends a distance 624 above a top surface of the substrate support 508. In one embodiment, the distance 624 is between about 0.01 inches and about 0.03 inches. It is contemplated that the distance 624 may be varied to affect the cooling rate of the substrate 230. For example, a smaller distance 624 may provide a faster cooling rate of the substrate 230, while a larger distance 624 may provide a slower cooling rate.

[0084] Figure 7A schematic plan view of a processing system 700 according to an embodiment described herein is illustrated. The processing system 700 includes a factory interface 702, a substrate transfer module 704, and a processing module 706. The factory interface 702 includes a plurality of FOUPs 708 and a FI transfer chamber 710. The substrate transfer module 704 includes a plurality of load lock chambers 712 and a transfer chamber 714. The load lock chambers 712 are coupled to the FI transfer chambers 710, and the transfer chambers 714 are coupled to the load lock chambers 712. In one embodiment, the transfer chamber 714 is a single chamber 716 having a plurality (such as 2) of transfer robots disposed in the single chamber 716. In one embodiment, the load lock chamber 712 and the transfer chamber 714 are similar to the load lock chamber 112 and the transfer chamber 114, respectively.

[0085] The processing module 706 includes a plurality of processing chambers 718, such as thermal processing chambers. In one embodiment, the processing chamber 718 is a rapid thermal processing chamber such as a laser thermal processing chamber. In other embodiments, the processing chamber 718 may be a deposition chamber, an etching chamber, a cleaning chamber, or the like, depending on the desired embodiment. By utilizing a transfer chamber 714 having a single chamber 716, substrates may be transferred between robots in the transfer chamber 714 to improve substrate transfer efficiency.

[0086] Figure 8 A schematic plan view of a processing system 800 according to an embodiment described herein is illustrated. The processing system 800 includes a factory interface 802, a substrate transfer module 804, and a processing module 806. The factory interface 802 includes a plurality of FOUPs 808 and a FI transfer chamber 810. The substrate transfer module 804 includes a load lock chamber 812 and a plurality of transfer chambers 814. In one embodiment, the load lock chamber 812 and the plurality of transfer chambers 814 are similar to the load lock chamber 112 and the transfer chamber 114, respectively.

[0087] The load lock chamber 812 is disposed between the transfer chambers 814 and is accessible to the robots of each transfer chamber 814. The load lock chamber 812 is coupled to the factory interface 802 and takes substrates from the FI transfer chamber 810. The transfer chamber 814 takes substrates from the centrally disposed load lock chamber 812 and transfers the substrates to the processing module 806.

[0088] Similar to the processing module 706, the processing module 806 includes a plurality of processing chambers 818, such as thermal processing chambers. In one embodiment, the processing chambers 818 are rapid thermal processing chambers, such as laser thermal processing chambers. In other embodiments, the processing chambers 818 may be deposition chambers, etching chambers, cleaning chambers, or the like, depending on the desired embodiment.

[0089] Fig. 9 A schematic diagram of a processing platform 900 according to embodiments described herein is shown. It is contemplated that the platform 900 is modular in nature and can be rearranged to best suit processing capabilities. It is also contemplated that various chambers and components can be removed from or added to the platform 900 to enable mass application of a particular process on a single platform.

[0090] The platform 900 includes a first factory interface 902 having a plurality of FOUPs 936 coupled to the first factory interface 902. A plurality of substrate transfer modules 914 are coupled to the first factory interface 902. The substrate transfer modules 914 include a load lock chamber 916 and a transfer chamber 918. In one embodiment, the load lock chamber 916 is similar to the load lock chamber 112. In another embodiment, the transfer chamber 918 is similar to the transfer chamber 114. The platform 900 also includes a processing module 920. The processing module 920 includes a first processing chamber 922 and a second processing chamber 924. In one embodiment, the first processing chamber 922 and the second processing chamber 924 are similar to the processing chamber 116.

[0091] The platform 900 further includes a second factory interface 904 having a plurality of FOUPs 934 coupled to the second factory interface 904. The central transfer chamber 926 is coupled to the second factory interface 904 via a plurality of load lock chambers 938. A plurality of process chambers 928, 930, 932 are coupled to the central transfer chamber 926 and are disposed around the central transfer chamber 926. In one embodiment, the process chamber 928 is directly coupled to the central transfer chamber 926. The process chambers 930 and 932 are coupled to the central transfer chamber by separate substrate transfer modules 914.

[0092] The placement of the processing chamber relative to the transfer chamber and the factory interface may be improved by utilizing the substrate transfer module 914. Improved substrate environmental management and efficient substrate transfer may be obtained by utilizing the substrate transfer module 914 to facilitate increased platform flexibility.

[0093] The platform 900 also includes a tunnel chamber 906. The tunnel chamber 906 is disposed between the first factory interface 902 and the second factory interface 904. The tunnel chamber 906 includes a first load lock chamber 908, a transfer chamber 912, and a second load lock chamber 910. The first load lock chamber 908 is disposed between the first factory interface 902 and the transfer chamber 912 of the tunnel chamber 906. In one embodiment, the load lock chambers 908, 910 are similar to the load lock chamber 112. Similarly, the transfer chamber 912 is similar to the transfer chamber 114. The second load lock chamber 910 is disposed between the second factory interface 904 and the transfer chamber 912 of the tunnel chamber 906. Thus, the tunnel chamber 906 enables substrates to be transferred between the first factory interface 902 and the second factory interface 904.

[0094] By coupling the factory interface 902, the factory interface 904 with the tunnel chamber 906, the substrates do not have to be returned to the FOUPs 936 after being processed in the process module 920. Instead, the substrates can be transferred through the tunnel chamber 906 to one or more of the processing chambers 928, 930, and 932 for subsequent processing operations. In one example, the processing chambers 928, 930, and 932 can be any of a deposition chamber, an etching chamber, a cleaning chamber, or other chamber types having various other processing capabilities. Therefore, subsequent processing operations can be performed on the thermally treated substrates without exposing the substrates to oxygen during the multiple stage transfers.

[0095] Fig.10 A schematic diagram of a processing platform 1000 according to embodiments described herein is shown. It is contemplated that the platform 1000 is modular in nature and can be rearranged to best suit processing capabilities. It is also contemplated that various chambers and components can be removed from or added to the platform 1000 to enable a wide range of application-specific processes on a single platform.

[0096] The platform 1000 includes a first factory interface 1002 having a plurality of FOUPs 1036 coupled to the first factory interface 1002. A plurality of substrate transfer modules 1014 are coupled to the first factory interface 1002. The substrate transfer modules 1014 include a load lock chamber 1016 and a transfer chamber 1018. In one embodiment, the load lock chamber 1016 is similar to the load lock chamber 112. In another embodiment, the transfer chamber 1018 is similar to the transfer chamber 114. The platform 10100 also includes a processing module 1020. The processing module 1020 includes a first processing chamber 1022 and a second processing chamber 1024. In one embodiment, the first processing chamber 1022 and the second processing chamber 1024 are similar to the processing chamber 116.

[0097] The platform 1000 further includes a second factory interface 904 having a plurality of FOUPs 1034 coupled to the second factory interface 904. The central transfer chamber 1026 is coupled to the second factory interface 1004 via a plurality of load lock chambers 1032. A plurality of process chambers 1028, 1030 are coupled to the central transfer chamber 1026 and are disposed around the central transfer chamber 1026. In one embodiment, the process chambers 1028, 1030 are directly coupled to the central transfer chamber 1026.

[0098] The platform 1000 also includes a tunnel chamber 1006. The tunnel chamber 1006 is disposed between the first factory interface 902 and the central transfer chamber 1026. The tunnel chamber 1006 includes a first load lock chamber 1008, a transfer chamber 1012, and a second load lock chamber 1010. The first load lock chamber 1008 is disposed between the first factory interface 1002 and the transfer chamber 1012 of the tunnel chamber 1006. In one embodiment, the load lock chambers 1008, 1010 are similar to the load lock chamber 112. Similarly, the transfer chamber 1012 is similar to the transfer chamber 114.

[0099] The second load lock chamber 1010 is disposed between the central transfer chamber 1026 and the transfer chamber 1012 of the tunnel chamber 1006. Thus, the tunnel chamber 1006 enables substrates to be transferred between the first factory interface 902 and the central transfer chamber 1026. With the arrangement of the platform 1000, similar efficiencies as those obtained using the platform 900 can also be obtained.

[0100] In one embodiment, a substrate processing apparatus includes a factory interface, a substrate transfer module for generating a substantially inert environment at about atmospheric pressure. The substrate transfer module includes a load lock chamber and a transfer chamber, the load lock chamber coupled to the factory interface, the load lock chamber having a chamber body defining a processing volume and a purge gas port in fluid communication with the processing volume, and the transfer chamber coupled to the load lock chamber. The processing module is also coupled to the substrate transfer module, wherein the processing module includes a plurality of processing chambers.

[0101] In one embodiment, the factory interface further includes a plurality of front opening standard bays coupled to the factory interface.

[0102] In one embodiment, the substrate transfer module includes a pair of load lock chambers.

[0103] In one embodiment, the substrate transfer module includes a pair of transfer chambers.

[0104] In one embodiment, the load lock chamber includes an exhaust port in fluid communication with the processing volume.

[0105] In one embodiment, a load lock chamber includes a susceptor disposed in a processing volume, wherein the susceptor has a plurality of cooling fluid conduits formed therein.

[0106] In one embodiment, a load lock chamber has a first slit valve formed in the chamber body adjacent to a factory interface, and a first slit valve door coupled to the chamber adjacent to the first slit valve.

[0107] In one embodiment, the load lock chamber has a second slit valve formed in the chamber adjacent to the transfer chamber, and a second slit valve door coupled to the chamber adjacent to the second slit valve.

[0108] In one embodiment, each processing chamber is a rapid thermal processing chamber.

[0109] In one embodiment, each rapid thermal processing chamber is a laser thermal processing chamber.

[0110] In one embodiment, each laser thermal processing chamber operates at about atmospheric pressure.

[0111] In one embodiment, a substrate processing apparatus includes a factory interface, and the factory interface includes a first transfer chamber, the first transfer chamber having a first robot disposed in the first transfer chamber. The apparatus also includes a substrate transfer module for generating a substantially inert environment at about atmospheric pressure. The substrate transfer module includes a load lock chamber and a second transfer chamber, the load lock chamber is coupled to the first transfer chamber, the second transfer chamber has a second robot disposed in the second transfer chamber, wherein the second transfer chamber is coupled to the load lock chamber. The apparatus also includes a process module coupled to the substrate transfer module, wherein the process module includes a process chamber, and the process chamber is coupled to the second transfer chamber.

[0112] In one embodiment, the processing chamber is a laser thermal processing chamber.

[0113] In one embodiment, the processing chamber is a deposition chamber.

[0114] In one embodiment, the processing chamber is an etch chamber.

[0115] In one embodiment, a load lock chamber includes a chamber body defining a processing volume, a purge gas port in fluid communication with the processing volume, and an exhaust port in fluid communication with the processing volume.

[0116] In one embodiment, a load lock chamber includes a susceptor disposed in a processing volume, and the susceptor has a plurality of cooling fluid conduits formed therein.

[0117] In one embodiment, a substrate processing apparatus includes a factory interface, and the factory interface includes a first transfer chamber and a plurality of front-opening standard chambers, the first transfer chamber having a first robot disposed in the first transfer chamber, and the plurality of front-opening standard chambers are coupled to the first transfer chamber. The apparatus also includes a substrate transfer module for generating a substantially inert environment at approximately atmospheric pressure. The substrate transfer module includes an atmospheric pressure load lock chamber and a second transfer chamber, the atmospheric pressure load lock chamber is coupled to the first transfer chamber, the second transfer chamber having a second robot disposed in the second transfer chamber, wherein the second transfer chamber is coupled to the loading lock chamber. The apparatus also includes a processing module coupled to the substrate transfer module, wherein the processing module includes a laser thermal treatment chamber, and the laser thermal treatment chamber is coupled to the second transfer chamber.

[0118] In one embodiment, the second transfer chamber includes a chamber body, an exhaust port disposed in the chamber body, and an exhaust conduit coupled to the chamber body, the exhaust conduit extending from the exhaust port.

[0119] In one embodiment, an oxygen sensor is in fluid communication with the exhaust conduit.

[0120] In one embodiment, a substrate transfer apparatus includes a load lock chamber for generating a substantially inert environment at about atmospheric pressure. The load lock chamber includes a chamber body defining a processing volume, a pedestal disposed in the processing volume, a cover coupled to the chamber body opposite the pedestal, a purge gas port disposed through the cover, and an exhaust port disposed in the chamber body adjacent to the pedestal and opposite the purge gas port. The apparatus also includes a transfer chamber for generating a substantially inert environment at about atmospheric pressure, the transfer chamber coupled to the load lock chamber. The transfer chamber includes a chamber body defining a transfer volume, a robot disposed in the transfer volume, a plurality of purge gas ports disposed in the chamber body, and an exhaust port disposed in the chamber body opposite the plurality of purge gas ports.

[0121] In one embodiment, the load lock chamber further includes a first slit valve formed in the load lock chamber body and a second slit valve formed in the load lock chamber body opposite to the first slit valve.

[0122] In one embodiment, the load lock chamber further includes a first slit valve door coupled to the load lock chamber body adjacent to the first slit valve, and a second slit valve door coupled to the load lock chamber body adjacent to the second slit valve.

[0123] In one embodiment, the load lock chamber further includes a plurality of lifting pins disposed about the base, wherein a plurality of recesses are formed in the base adjacent to the lifting pins.

[0124] In one embodiment, each of the plurality of lifting rods includes a shaft, a first extension portion coupled to and extending from the shaft, and a second extension portion coupled to and extending from the shaft, wherein the second extension portion is disposed adjacent to and spaced apart from the first extension portion.

[0125] In one embodiment, the first extension portion is separated from the second extension portion by a distance between about 10 mm and about 30 mm.

[0126] In one embodiment, a support ball is coupled to each of the first extension portion and the second extension portion.

[0127] In one embodiment, the support balls are made of silicon nitride material.

[0128] In one embodiment, the base has a plurality of fluid conduits formed therein.

[0129] In one embodiment, the top surface of the pedestal has a plurality of contact balls of silicon nitride material disposed therein.

[0130] In one embodiment, the transfer chamber body includes an optically transparent cover coupled to the chamber body.

[0131] In one embodiment, the optically transparent cover is made of a polycarbonate material.

[0132] In one embodiment, each of the plurality of purge gas ports has a diffuser extending from the purge gas port.

[0133] In one embodiment, the transfer chamber exhaust port is disposed in the transfer chamber adjacent to a region where the load lock chamber is coupled to the transfer chamber.

[0134] In one embodiment, a substrate processing apparatus includes a load lock chamber for generating a substantially inert environment at about atmospheric pressure. The load lock chamber includes a chamber body defining a processing volume, a pedestal disposed in the processing volume, a fluid conduit disposed in the pedestal, a plurality of grooves formed along a periphery of the pedestal, and a plurality of lift pins disposed in the processing volume, each lift pin being adjacent to one of the plurality of grooves. The apparatus also includes a cover coupled to the chamber body opposite the pedestal, a diffuser plate coupled to the cover at a central region of the cover, wherein a portion of a bottom surface of the cover extends radially outwardly from the diffuser plate in a tapered manner, a purge gas port disposed through the diffuser plate, and an exhaust port disposed in the chamber body adjacent to the pedestal and opposite to the purge gas port.

[0135] In one embodiment, the chamber body is manufactured from an aluminum billet.

[0136] In one embodiment, the device further includes a first slit valve disposed in the side wall of the chamber body, a first slit valve door coupled to the chamber body adjacent to the first slit valve, a second slit valve disposed in the side wall of the chamber body opposite to the first slit valve, and a second slit valve door coupled to the chamber body adjacent to the second slit valve.

[0137] In one embodiment, a substrate transfer apparatus includes a transfer chamber for generating a substantially inert environment at about atmospheric pressure, the transfer chamber being coupled to a load lock chamber. The transfer chamber includes a chamber body defining a transfer volume, an optically transparent cover coupled to the chamber body, and a robot disposed in the transfer volume, wherein a blade of the robot is made of quartz. The apparatus also includes a plurality of purge gas ports disposed in the chamber body, a plurality of diffusers extending from the purge gas ports, an exhaust port disposed in the chamber body opposite the plurality of purge gas ports, an exhaust conduit coupled to the exhaust port, and an oxygen sensor in fluid communication with the transfer volume through the exhaust conduit and the exhaust port.

[0138] In one embodiment, the oxygen sensor has an oxygen concentration sensitivity of less than about 1 part per million oxygen.

[0139] In one embodiment, the oxygen sensor is coupled to the exhaust conduit via a first conduit and a second conduit.

[0140] In one embodiment, the platform device includes a first factory interface, a second factory interface coupled to the first factory interface, and a tunnel chamber disposed between the first factory interface and the second factory interface, wherein the tunnel chamber includes a transfer chamber and a plurality of load lock chambers. The device also includes a first transfer module coupled to the first factory interface, a processing module coupled to the first transfer module, a central transfer chamber coupled to the second factory interface, and a plurality of processing chambers coupled to the central transfer chamber, wherein at least one of the plurality of processing chambers is coupled to the central transfer chamber by the second transfer module.

[0141] In one embodiment, the first transfer module and the second transfer module include a load lock chamber and a transfer chamber.

[0142] In one embodiment, the load lock chamber and the transfer chamber create a substantially inert environment at about atmospheric pressure.

[0143] In one embodiment, a load lock chamber is coupled between the first factory interface and the transfer chamber.

[0144] In one embodiment, a transfer chamber is coupled between the load lock chamber and the process module.

[0145] In one embodiment, the processing module includes a laser thermal processing chamber.

[0146] In one embodiment, the process module includes a lamp-based thermal processing chamber.

[0147] In one embodiment, a first processing chamber of the plurality of processing chambers comprises a deposition chamber.

[0148] In one embodiment, a second processing chamber of the plurality of processing chambers comprises an etch chamber.

[0149] In one embodiment, a third processing chamber of the plurality of processing chambers comprises a cleaning chamber.

[0150] In one embodiment, the platform device includes a first factory interface, a transfer module coupled to the first factory interface, a processing module coupled to the transfer module, a second factory interface, and a central transfer chamber coupled to the second factory interface. The device also includes a tunnel chamber disposed between the first factory interface and the central transfer chamber, wherein the tunnel chamber includes a transfer chamber and a plurality of load lock chambers. The device also includes a plurality of processing chambers coupled to the central transfer chamber.

[0151] In one embodiment, a transfer module includes a load lock chamber and a transfer chamber.

[0152] In one embodiment, the transfer module creates a substantially inert environment at about atmospheric pressure.

[0153] In one embodiment, a load lock chamber is coupled between the first factory interface and the transfer chamber.

[0154] In one embodiment, a transfer chamber is coupled between the load lock chamber and the process module.

[0155] In one embodiment, the processing module includes a laser thermal processing chamber.

[0156] In one embodiment, the process module includes a lamp-based thermal processing chamber.

[0157] In one embodiment, a first processing chamber of the plurality of processing chambers is a deposition chamber.

[0158] In one embodiment, the second processing chamber of the plurality of processing chambers is an etching chamber.

[0159] In one embodiment, a tunnel chamber transfer chamber is disposed between the plurality of tunnel chambers and the load lock chamber.

[0160] In one embodiment, a substrate processing method includes transferring a substrate from a first chamber to a second chamber, isolating an environment of the second chamber from an environment of the first chamber, removing oxygen from the environment of the second chamber, and cooling the substrate in the second chamber. The method also includes opening a slit valve between the first chamber and the second chamber, evacuating the environment of the first chamber, and analyzing the first chamber effluent to determine an oxygen concentration of the environment of the second chamber.

[0161] In one embodiment, the environment of the first chamber is maintained at approximately normal pressure during substrate transfer.

[0162] In one embodiment, the environment of the second chamber is maintained at approximately atmospheric pressure during substrate transfer.

[0163] In one embodiment, the environment of the first chamber is maintained under vacuum during the substrate transfer.

[0164] In one embodiment, the environment of the second chamber is maintained under vacuum during substrate transfer.

[0165] In one embodiment, removing oxygen from the environment of the second chamber includes purging the environment of the second chamber using an inert gas.

[0166] In one embodiment, the inert gas is nitrogen.

[0167] In one embodiment, the environment of the second chamber is maintained above normal pressure during cooling of the substrate.

[0168] In one embodiment, the pressure of the environment of the second chamber during cooling of the substrate is between about 1 psi and about 10 psi above atmospheric pressure.

[0169] In one embodiment, a substrate processing method includes transferring a substrate from a transfer chamber to a load lock chamber, closing a slit valve between the transfer chamber and the load lock chamber to isolate an environment of the load lock chamber from an environment of the transfer chamber, removing oxygen from the environment of the load lock chamber, and cooling the substrate in the load lock chamber. The method also includes opening the slit valve between the transfer chamber and the load lock chamber, evacuating the environment of the transfer chamber during opening of the slit valve, and analyzing the transfer chamber effluent to determine an oxygen concentration of the environment of the load lock chamber during cooling of the substrate.

[0170] In one embodiment, the environment of the transfer chamber is maintained at normal pressure during substrate transfer.

[0171] In one embodiment, the environment of the load lock chamber is maintained at normal pressure during substrate transfer.

[0172] In one embodiment, the environment of the transfer chamber is maintained under vacuum during substrate transfer.

[0173] In one embodiment, the environment of the load lock chamber is maintained under vacuum during substrate transfer.

[0174] In one embodiment, removing oxygen from the environment of the load lock chamber includes purging the environment of the load lock chamber using nitrogen gas.

[0175] In one embodiment, the pressure of the environment of the load lock chamber during cooling of the substrate and purging is between about 1 psi and about 10 psi above atmospheric pressure.

[0176] In one embodiment, the oxygen concentration of the environment of the load lock chamber during cooling of the substrate is less than about 1 ppm.

[0177] In one embodiment, a substrate transfer method includes: transferring a substrate from a processing chamber to a transfer chamber, transferring the substrate from the transfer chamber to a load lock chamber, and closing a slit valve between the transfer chamber and the load lock chamber to isolate an environment of the load lock chamber from an environment of the transfer chamber. The method also includes removing oxygen from an environment of the load lock chamber, cooling the substrate in the load lock chamber, opening the slit valve between the transfer chamber and the load lock chamber, evacuating the environment of the transfer chamber during opening the slit valve, and analyzing the transfer chamber effluent to determine an oxygen concentration of the environment of the load lock chamber during cooling of the substrate.

[0178] In one embodiment, the processing chamber is a laser thermal processing chamber.

[0179] In one embodiment, the environment of each of the process chamber, the transfer chamber, and the load lock chamber is maintained at about normal pressure during substrate transfer.

[0180] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope of the invention is to be determined by the claims that follow.

Claims

1. A substrate processing device, comprising: Factory interface; A substrate conveying module, the substrate conveying module comprising: a load lock chamber coupled to the factory interface, wherein the load lock chamber comprises: a chamber body defining a processing volume; an exhaust port and a purge gas port in fluid communication with the processing volume; and a susceptor disposed in the processing volume, wherein the susceptor has a plurality of cooling fluid conduits formed therein; a transfer chamber directly coupled to the load lock chamber, the transfer chamber having a chamber body defining a transfer volume and an oxygen sensor in fluid communication with the transfer volume, the transfer chamber and the load lock chamber being configured to create a substantially inert environment at about atmospheric pressure; and A process module is coupled to the substrate transfer module, wherein the process module includes a plurality of process chambers.

2. The apparatus of claim 1, wherein the factory interface further comprises: A plurality of front-opening standard cabins are coupled to the factory interface. 3 . The apparatus of claim 1 , wherein the substrate transfer module further comprises a second load lock chamber. The apparatus of claim 1 , wherein the substrate transfer module further comprises a second transfer chamber. 5 . The apparatus of claim 1 , wherein the load lock chamber has a first slit valve formed in the chamber body adjacent to the factory interface, and a first slit valve door coupled to the chamber body adjacent to the first slit valve. 6 . The apparatus of claim 5 , wherein the load lock chamber has a second slit valve formed in the chamber body adjacent to the transfer chamber, and a second slit valve door coupled to the chamber body adjacent to the second slit valve.

7. The apparatus of claim 6, wherein the second transfer chamber comprises: Chamber body; an exhaust port, the exhaust port being disposed in the chamber body; as well as An exhaust conduit is coupled to the chamber body and extends from the exhaust port.

8. A substrate processing device, comprising: Factory interface; A substrate conveying module, the substrate conveying module comprising: a load lock chamber coupled to the factory interface, the load lock chamber having a chamber body defining a processing volume and a purge gas port in fluid communication with the processing volume; as well as a transfer chamber directly coupled to the load lock chamber, the transfer chamber having a chamber body defining a transfer volume and an oxygen sensor in fluid communication with the transfer volume, the transfer chamber and the load lock chamber being configured to create a substantially inert environment at about atmospheric pressure; and A process module is coupled to the substrate transfer module, wherein the process module includes a plurality of process chambers, wherein each of the process chambers is a rapid thermal processing chamber.

9. The apparatus of claim 8, wherein each of the rapid thermal processing chambers is a laser thermal processing chamber.

10. The apparatus of claim 9, wherein each of the laser thermal processing chambers operates at approximately atmospheric pressure.

11. A substrate processing device, comprising: A factory interface, wherein the factory interface comprises: a first transfer chamber, the first transfer chamber having a first robot disposed in the first transfer chamber; A substrate conveying module, the substrate conveying module comprising: a load lock chamber coupled to the first transfer chamber; and a second transfer chamber having a second robot disposed therein, the second transfer chamber being directly coupled to the load lock chamber, the second transfer chamber having a chamber body defining a transfer volume and an oxygen sensor in fluid communication with the transfer volume, the second transfer chamber and the load lock chamber being configured to create a substantially inert environment at about atmospheric pressure; and A process module is coupled to the substrate transfer module, wherein the process module includes a process chamber, wherein the process chamber is coupled to the second transfer chamber, and wherein the process chamber is selected from the group consisting of a laser thermal processing chamber, a deposition chamber, and an etching chamber.

12. The apparatus of claim 11, wherein the load lock chamber comprises: a chamber body defining a processing volume; a purge gas port in fluid communication with the processing volume; as well as An exhaust port is in fluid communication with the processing volume.

13. A substrate processing device, comprising: A factory interface, wherein the factory interface comprises: a first transfer chamber, the first transfer chamber having a first robot disposed in the first transfer chamber; A substrate conveying module, the substrate conveying module comprising: a load lock chamber coupled to the first transfer chamber, wherein the load lock chamber comprises: a chamber body defining a processing volume; a purge gas port in fluid communication with the processing volume; an exhaust port in fluid communication with the processing volume; and a susceptor disposed in the processing volume, wherein the susceptor has a plurality of cooling fluid conduits formed therein; a second transfer chamber having a second robot disposed therein, the second transfer chamber being directly coupled to the load lock chamber, the second transfer chamber having a chamber body defining a transfer volume and an oxygen sensor fluidly coupled to the transfer volume, the second transfer chamber and the load lock chamber being configured to create a substantially inert environment at about atmospheric pressure; and A process module is coupled to the substrate transfer module, wherein the process module includes a process chamber, wherein the process chamber is coupled to the second transfer chamber.

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