Laser spectrometer and dual-station laser processing equipment and method

Abstract

The present invention provides a laser spectrometer, including a laser light source, two laser optical paths and a scanning head, and a scanning head is provided at the end of each laser optical path; the two laser optical paths are switched by controlling the mechanical rotation angle of a single-axis galvanometer. The present invention also provides a double-station laser processing device and method, including a laser spectrometer and a double-station transmission system; the double-station transmission system includes two processing tables corresponding to the scanning head, as well as a loading module, a loading transfer module, a unloading transfer module and a unloading module; when the laser is incident on the corresponding scanning head through one of the laser optical paths and laser processing is performed on one of the processing tables, the unloading transfer module and the loading transfer module complete the transfer and preparation of the processed products and products to be processed on the other processing table. The present invention determines the production efficiency by "optical path switching speed + laser processing speed", improves the production capacity compared with traditional technologies, and ensures processing accuracy and stability.

Description

Technical Field

[0001] The present invention belongs to the technical field of laser processing, and in particular relates to a laser spectrometer and double-station laser processing equipment and method. Background Art

[0002] There are two types of laser spectrometry technologies: energy spectrometry and time-sharing spectrometry. Chinese invention patent CN204855952U discloses a time-sharing spectrometry optical path, which includes a focusable laser collimator, a 45-degree reflector seat, a high-speed motor seat, and a fiber coupling seat. This spectrometry technology belongs to time-sharing spectrometry. Since fiber coupling is used in the optical path, it is difficult to debug the optical path, and the coupling efficiency cannot reach 100%. In addition, the reliability of the optical path is poor. In the case of high power or optical path jitter, there is a risk of burning out the fiber coupling head.

[0003] Existing silicon wafer laser processing equipment generally uses one laser to correspond to one galvanometer for processing. The processing speed of the equipment depends on the laser engraving processing time and the silicon wafer transmission time. Since the transmission of silicon wafers can only be done mechanically, when a single workstation is processing, the next silicon wafer must wait until the silicon wafer on the processing station is processed before it can be transmitted to the right place. This has become a shortcoming that limits the improvement of laser processing efficiency. The shortcoming of silicon wafer transmission time makes it difficult to further improve the equipment's production capacity. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a laser spectrometer and a double-station laser processing equipment and method, which can improve the processing efficiency and have good stability.

[0005] The technical solution adopted by the present invention to solve the above technical problems is: a laser spectrometer, including a laser light source, a laser light path and a scanning head, characterized in that: the device also includes a single-axis galvanometer system;

[0006] There are two laser light paths, and a scanning head is provided at the end of each laser light path. Each scanning head corresponds to a processing table, and the scanning head includes a processing galvanometer and a field lens.

[0007] The two laser light paths are switched by controlling the mechanical rotation angle of the single-axis galvanometer in the single-axis galvanometer system.

[0008] According to the above device, the two laser light paths are both reflected by the total reflection lens group.

[0009] According to the above device, a beam expander is provided between each laser light path and the corresponding scanning head.

[0010] A double-station laser processing equipment, the processing equipment comprises the laser beam splitting device, and also comprises a double-station transmission system and a control system;

[0011] The double-station transmission system includes two processing tables corresponding to the scanning heads, and a transmission device; the transmission device includes a loading module, a loading transfer module, a unloading transfer module and an unloading module; the loading module is used to transfer the products to be processed, the loading transfer module is used to transfer the products to be processed from the loading module to the two processing tables in turn, and the unloading transfer module is used to transfer the processed products from the two processing tables to the unloading module in turn;

[0012] The control system is used to control the timing of the actions of the laser spectrometer and the dual-station transmission system, thereby completing the following actions: when the laser is incident on the corresponding scanning head through one of the laser light paths and laser processing is performed on one of the processing tables, the unloading transfer module and the loading transfer module complete the transfer and preparation of the processed products and products to be processed on the other processing table.

[0013] According to the above equipment, there is only one set of conveying devices, the end of the loading module is only provided with a material taking position, and the front end of the unloading module is only provided with a material receiving position;

[0014] The feeding transfer module comprises a feeding rotating shaft, two feeding connecting arms connected to the feeding rotating shaft, and a product fixing device is arranged at the end of the feeding connecting arm; the position of the feeding rotating shaft and the angle between the two feeding connecting arms are such that: when the end of one feeding connecting arm is located on the processing table, the end of the other feeding connecting arm is located on the material taking position; the feeding rotating shaft is controlled by the control system to reciprocate and step rotation;

[0015] The material unloading transfer module includes a material unloading rotating shaft, two material unloading connecting arms connected to the material unloading rotating shaft, and a product fixing device is provided at the end of the material unloading connecting arm; the position of the material unloading rotating shaft and the angle between the two material unloading connecting arms are such that: when the end of one material unloading connecting arm is located on the processing table, the end of the other material unloading connecting arm is located on the material receiving position; the material unloading rotating shaft is controlled by the control system to reciprocate and step rotation.

[0016] According to the above equipment, each of the processing tables is a rotary processing table, including a rotating part and a driving part. The driving part is used to drive the rotating part to rotate in steps and circulate between the loading position, the processing position and the unloading position, and is matched with the loading transfer module, the scanning head and the unloading transfer module respectively; a product fixing device is provided on the rotary processing table.

[0017] According to the above equipment, the feeding rotating shaft is arranged at the midpoint of the feeding position connecting line of the two processing tables, and the material taking position is located on the center line of the feeding position connecting line of the two processing tables, and the angle between the two feeding connecting arms is 90 degrees;

[0018] The material unloading rotating axis is arranged at the midpoint of the material unloading position line of the two processing tables, and the material receiving position is located on the center line of the material unloading position line of the two processing tables, and the angle between the two material unloading connecting arms is 90 degrees.

[0019] According to the above equipment, the product is a silicon wafer used to prepare solar cells.

[0020] The processing method implemented by the dual-station laser processing equipment is characterized in that: the processing tables are the first processing table and the second processing table, the laser light path corresponding to the first processing table is the first laser light path, and the laser light path corresponding to the second processing table is the second laser light path;

[0021] The method comprises the following steps:

[0022] The laser light emitted by the laser light source is transmitted through the first laser optical path to perform laser processing on the product to be processed on the first processing table; at the same time, the unloading transfer module transfers the processed product from the second processing table to the unloading module, and then the loading transfer module transfers the product to be processed from the loading module to the second processing table;

[0023] When the laser processing work on the first processing table is completed, the preparation work of the product to be processed on the second processing table has been completed. At this time, the mechanical rotation angle of the single-axis galvanometer in the single-axis galvanometer system is controlled to switch the laser optical path;

[0024] The laser light emitted by the laser light source is transmitted through the second laser optical path to perform laser processing on the product to be processed on the second processing table; at the same time, the unloading transfer module transfers the processed product from the first processing table to the unloading module, and then the loading transfer module transfers the product to be processed from the loading module to the first processing table;

[0025] When the laser processing work on the second processing table is completed, the preparation work of the product to be processed on the first processing table has been completed. At this time, the mechanical rotation angle of the single-axis galvanometer in the single-axis galvanometer system is controlled to switch the laser optical path;

[0026] The cycle repeats itself.

[0027] According to the above method, there is only one group of the conveying device, the end of the loading module is only provided with a material taking position, and the front end of the unloading module is only provided with a material receiving position; the loading transfer module includes a loading rotating shaft, a first loading connecting arm and a second loading connecting arm connected to the loading rotating shaft, and the ends of the two loading connecting arms are respectively provided with product fixing devices; the unloading transfer module includes a unloading rotating shaft, a first unloading connecting arm and a second unloading connecting arm connected to the unloading rotating shaft, and the ends of the two unloading connecting arms are respectively provided with product fixing devices;

[0028] When the material unloading transfer module transfers the processed product from the second processing table to the unloading module, under the forward rotation of the unloading rotating shaft, the second unloading connecting arm moves from the second processing table to the unloading module, and the first unloading connecting arm moves from the unloading module to the first processing table to wait; when the material unloading transfer module transfers the processed product from the first processing table to the unloading module, under the reverse rotation of the unloading rotating shaft, the first unloading connecting arm moves from the first processing table to the unloading module, and the second unloading connecting arm moves from the unloading module to the second processing table to wait;

[0029] When the loading transfer module transfers the product to be processed from the loading module to the second processing table, under the forward rotation of the loading rotating shaft, the second loading connecting arm moves from the loading module to the second processing table, and the first loading connecting arm moves from the first processing table to the loading module to wait; when the loading transfer module transfers the product to be processed from the loading module to the first processing table, under the reverse rotation of the loading rotating shaft, the first loading connecting arm moves from the loading module to the first processing table, and the second loading connecting arm moves from the second processing table to the loading module to wait.

[0030] According to the above method, each of the processing tables is a rotary processing table, including a rotating part and a driving part. The driving part is used to drive the rotating part to rotate in steps and circulate between the loading position, the processing position and the unloading position, and is matched with the loading transfer module, the scanning head and the unloading transfer module respectively; a product fixing device is provided on the rotary processing table.

[0031] The beneficial effects of the present invention are:

[0032] 1. The laser spectrometer switches two independent laser light paths by controlling the mechanical rotation angle of the single-axis galvanometer, thereby guiding the laser to different light paths and finally realizing laser spectrometry without affecting the performance of each laser light path itself. The mechanical rotation angle has high control accuracy and fast speed, thereby improving the overall processing speed and processing accuracy of the laser spectrometer.

[0033] 2. The dual-station laser processing equipment of the present invention is improved in two parts, namely, the laser spectrometer and the station, which not only improves the speed of laser optical path switching, but also sets dual stations on the same transmission line to perform separate processing according to the laser optical path time difference, and transforms the traditional production mode in which the production efficiency is determined by "silicon wafer transmission speed + laser processing speed" into a mode in which the production efficiency is determined by "optical path switching speed + laser processing speed". Since the optical path switching speed is much faster than the silicon wafer transmission speed, the shortcoming of the slow silicon wafer transmission speed is avoided, and the single-wafer processing speed can be increased by 20%, thereby increasing the production capacity of the laser processing equipment by about 20%. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic structural diagram of a laser spectrometer according to an embodiment of the present invention.

[0035] 2 is a schematic diagram of a silicon wafer processing method according to an embodiment of the present invention, wherein a is a schematic diagram of laser processing on a first processing station through a first laser optical path, and b is a schematic diagram of laser processing on a second processing station through a second laser optical path.

[0036] Figure 3 It is a schematic structural diagram of a laser processing device according to an embodiment of the present invention.

[0037] Figure 4 It is a structural schematic diagram of a double-station transmission system according to an embodiment of the present invention.

[0038] In the figure: 100-laser light source, 101-first total reflection mirror, 102-single-axis galvanometer system, 103-second total reflection mirror, 104-third total reflection mirror, 105-fourth total reflection mirror, 106-first scanning head, 107-second scanning head, 108-first beam expander, 109-second beam expander, 201-first processing table, 202-second processing table;

[0039] 1-laser spectrometer, 301-loading module, 302-loading transfer module, 303-unloading transfer module, 304-unloading module, 4-workbench, 5-loading position, 6-processing position, 7-unloading position; 3021-loading rotating axis, 3022-first loading connecting arm, 3023-second loading connecting arm, 3031-unloading rotating axis, 3032-first unloading connecting arm, 3033-second unloading connecting arm. DETAILED DESCRIPTION

[0040] The present invention is further described below in conjunction with specific examples and drawings.

[0041] The present invention only takes the processing of silicon wafers used to prepare solar cells as an example to illustrate the structure of the present invention. The present invention is applicable to all fields that use lasers to process a single product.

[0042] like Figure 1 As shown, the present invention provides a laser spectrometer, including a laser light source 100, a laser optical path and a scanning head. The device also includes a single-axis galvanometer system 102; the laser optical path is two-way, and a scanning head is provided at the end of each laser optical path. Each scanning head corresponds to a processing table, and the scanning head includes a processing galvanometer and a field lens; the two laser optical paths are switched by controlling the mechanical rotation angle of the single-axis galvanometer in the single-axis galvanometer system 102.

[0043] The single-axis galvanometer system 102 includes a single-axis galvanometer and a matching marking card. The principle of the single-axis galvanometer is to drive the reflector to deflect through a motor. In this technical solution, there are two positions. In the first position, the light path does not pass through the reflector. In the second position, the light path is reflected by the reflector to change the light path.

[0044] As shown in Figure 2 to Figure 3 As shown, in this embodiment, the laser light emitted by the laser light source 100 is reflected by the first total reflection mirror 101. When the laser light is not reflected by the single-axis galvanometer system 102, it directly passes through the first laser light path formed by the second total reflection mirror 103 and the first beam expander 108 to reach the first scanning head 106, and the silicon wafer on the first processing table 201 is processed, and the second processing table 202 is prepared; when the single-axis galvanometer system 102 is deflected to a predetermined position, the laser light is reflected by the first total reflection mirror 101, and then reflected by the single-axis galvanometer of the single-axis galvanometer system 102 to the second laser light path formed by the third total reflection mirror 104, the fourth total reflection mirror 105 and the second beam expander 109, and reaches the second scanning head 107, and the silicon wafer on the second processing table 202 is processed, and the first processing table 201 is prepared. The single-axis galvanometer system 102 continuously deflects between the two positions, and the laser light is continuously guided to the first laser light path and the second laser light path in chronological order.

[0045] Using a single-axis galvanometer as a time-sharing and light-splitting device, the laser is guided to different laser optical paths by precisely controlling the deflection angle of the single-axis galvanometer. The transmission of the laser in the laser optical path all uses a total reflection lens, the optical path transmission is stable, and the laser power loss is very small. In more detail, the mechanical rotation angle of the single-axis galvanometer can be precisely positioned between 0-45°, and the laser can be guided to multiple corresponding laser optical paths by precisely controlling the mechanical rotation angle of the single-axis galvanometer.

[0046] The use of a beam expander is a preferred solution. According to the calculation formula for laser focusing, the larger the incident beam diameter, the smaller the focused spot. Specifically, it is set before the scanning head to achieve the control of the spot size. Specifically, the magnification of the first beam expander 108 can be the same as the magnification of the second beam expander 109, and the two laser optical paths achieve the same laser processing effect. The magnifications of the first beam expander 108 and the second beam expander 109 can also be different, and the two optical paths can achieve different processing effects.

[0047] The processing galvanometer in the scanning head is used for processing workpieces. By setting the scanning path, various graphics such as straight lines and arcs can be processed. After precise calibration, the positioning accuracy of the processing galvanometer is better than 10μm, the processing speed can reach more than 30m / s, and the processing range is only limited by the field mirror.

[0048] In the laser spectrometer of the present invention, the single-axis galvanometer system 102 is only used for spectrometry, and the processing path of the workpiece processing is realized by the processing galvanometer. Since the total time required for the single-axis galvanometer to respond and complete the action is 0.1s, its control accuracy is better than 10μrad, and the repeatability accuracy is better than 10μrad. A single optical path uses two reflectors to adjust the alignment of the laser. The laser has low power loss and high stability during the transmission process; by adjusting the pitch and yaw angles of the reflectors, the laser can be strictly incident vertically on the center of the galvanometer. Combining the high repeatability accuracy of the single-axis galvanometer and the high stability of the full-mirror laser transmission system, a high repeatability accuracy of 5μm can be achieved. After precise calibration of the processing galvanometer, the final laser processing positioning accuracy is better than 10μm, the repeatability accuracy is better than 5μm, and the scanning speed can reach more than 30m / s. The entire optical path system can achieve high-speed and high-precision processing.

[0049] By using the above-mentioned laser spectrometer and reasonably designing the processing sequence, it can be achieved that when one laser light path is processing, the workpiece corresponding to another laser light path is ready at the processing position. This can save the time waiting for the workpiece transmission when processing a single light path and improve production capacity.

[0050] Based on the above ideas, the present invention also provides a dual-station laser processing equipment, specifically, under the laser beam splitting device, two laser processing stations are set, corresponding to the first laser light path and the second laser light path, respectively, for fixing the silicon wafer and completing the processing of the silicon wafer here. It also includes a silicon wafer conveying device, which is used to convey the silicon wafer to the two laser processing stations respectively, and convey the processed silicon wafers to the next process respectively.

[0051] like Figure 3 and Figure 4 As shown, the processing equipment includes the laser spectrometer 1, and also includes a double-station transmission system and a control system. The double-station transmission system includes two processing tables corresponding to the scanning head, and a transmission device; the transmission device includes a loading module 301, a loading transfer module 302, a unloading transfer module 303 and a unloading module 304; the loading module 301 is used to transfer the silicon wafers to be processed, the loading transfer module 302 is used to transfer the silicon wafers to be processed from the loading module 301 to the two processing tables in turn, and the unloading transfer module 303 is used to transfer the processed silicon wafers from the two processing tables to the unloading module 304 in turn.

[0052] The control system is used to control the timing of the actions of the laser spectrometer 1 and the dual-station transmission system, thereby completing the following actions: when the laser is incident on the corresponding scanning head through one of the laser light paths and laser processing is performed on one of the processing tables, the unloading transfer module and the loading transfer module complete the transfer and preparation of the processed silicon wafers and the silicon wafers to be processed on the other processing table.

[0053] As a preferred solution, there is only one set of conveying devices, and only one material taking position is provided at the end of the loading module 301, and only one material receiving position is provided at the front end of the unloading module 304. This can save half of the space in the width direction. The loading module 301 and the unloading module 304 are preferably belt conveyor modules.

[0054] The loading transfer module 302 includes a loading rotation shaft 3021, two loading connection arms connected to the loading rotation shaft 3021, namely a first loading connection arm 3022 and a second loading connection arm 3023. The ends of the loading connection arms are provided with silicon wafer fixing devices, such as suction cups or grippers, for adsorbing silicon wafers. The position of the loading rotation shaft 3021 and the angle between the two loading connection arms are such that: when the end of one loading connection arm is located on the processing table, the end of the other loading connection arm is located on the material taking position; the loading rotation shaft 3021 is driven by a driving device, such as a servo motor, and is controlled by the control system to reciprocate and step rotation.

[0055] The material transfer module 303 includes a material unloading rotating shaft 3031, two material unloading connecting arms connected to the material unloading rotating shaft 3031, namely a first material unloading connecting arm 3032 and a second material unloading connecting arm 3033. The ends of the material unloading connecting arms are provided with silicon wafer fixing devices, such as suction cups or grippers, for adsorbing silicon wafers. The position of the material unloading rotating shaft 3031 and the angle between the two material unloading connecting arms are such that: when the end of one material unloading connecting arm is located on the processing table, the end of the other material unloading connecting arm is located on the material receiving position; the material loading rotating shaft 3021 is driven by a driving device, such as a servo motor, so as to realize reciprocating stepping rotation.

[0056] Each of the processing tables is a rotating processing table, including a rotating part and a driving part. The driving part is used to drive the rotating part to rotate in steps and circulate between the loading position 5, the processing position 6 and the unloading position 7, and respectively match the loading transfer module 302, the scanning head and the unloading transfer module 303; the rotating processing table is provided with a silicon wafer fixing device, such as a suction cup.

[0057] In this embodiment, two processing tables are arranged in parallel with each other. The loading rotating shaft 3021 is arranged at the midpoint of the line connecting the loading positions 5 of the two processing tables, and the material taking position is located on the center line of the line connecting the loading positions 5 of the two processing tables, and the angle between the two loading connecting arms is 90 degrees; the unloading rotating shaft 3031 is arranged at the midpoint of the line connecting the unloading positions 7 of the two processing tables, and the material receiving position is located on the center line of the line connecting the unloading positions 7 of the two processing tables, and the angle between the two unloading connecting arms is 90 degrees. In more detail, the loading module 301 and the unloading module 304 are on the same straight line, and the first processing table 201 and the second processing table 202 are symmetrically arranged on both sides of the straight line.

[0058] The silicon wafer processing method implemented by the dual-station laser processing equipment is as follows: the processing tables are the first processing table 201 and the second processing table 202, the laser light path corresponding to the first processing table 201 is the first laser light path, and the laser light path corresponding to the second processing table 202 is the second laser light path.

[0059] The method comprises the following steps:

[0060] The laser emitted by the laser light source 100 is transmitted through the first laser optical path to perform laser processing on the silicon wafer to be processed on the first processing table 201; at the same time, the unloading transfer module 303 transfers the processed silicon wafer from the second processing table 202 to the unloading module 304, and then the loading transfer module 302 transfers the silicon wafer to be processed from the loading module 301 to the second processing table 202.

[0061] When the laser processing work on the first processing table 201 is completed, the preparation work for the silicon wafer to be processed on the second processing table 202 is completed. At this time, the mechanical rotation angle of the single-axis galvanometer in the single-axis galvanometer system 102 is controlled to switch the laser light path.

[0062] The laser emitted by the laser light source 100 is transmitted through the second laser optical path to perform laser processing on the silicon wafer to be processed on the second processing table 202; at the same time, the unloading transfer module 303 transfers the processed silicon wafer from the first processing table 201 to the unloading module 304, and then the loading transfer module 302 transfers the silicon wafer to be processed from the loading module 301 to the first processing table 201.

[0063] When the laser processing work on the second processing table 202 is completed, the preparation work for the silicon wafer to be processed on the first processing table 201 is completed. At this time, the mechanical rotation angle of the single-axis galvanometer in the single-axis galvanometer system 102 is controlled to switch the laser optical path.

[0064] The cycle repeats itself.

[0065] To further refine, the conveying device has only one group. When the unloading transfer module 303 transfers the processed silicon wafers from the second processing table 202 to the unloading module 304, under the forward rotation of the unloading rotating shaft 3031, the second unloading connecting arm 3033 moves from the second processing table 202 to the unloading module 304, and the first unloading connecting arm 3032 moves from the unloading module 304 to the first processing table 201 to wait; when the unloading transfer module 303 transfers the processed silicon wafers from the first processing table 201 to the unloading module 304, under the reverse rotation of the unloading rotating shaft 3031, the first unloading connecting arm 3032 moves from the first processing table 201 to the unloading module 304, and the second unloading connecting arm 3033 moves from the unloading module 304 to the second processing table 202 to wait.

[0066] When the loading transfer module 302 transfers the silicon wafer to be processed from the loading module 301 to the second processing table 202, under the forward rotation of the loading rotating shaft 3021, the second loading connecting arm 3023 moves from the loading module 301 to the second processing table 202, and the first loading connecting arm 3022 moves from the first processing table 201 to the loading module 301 to wait; when the loading transfer module 302 transfers the silicon wafer to be processed from the loading module 301 to the first processing table 201, under the reverse rotation of the loading rotating shaft 3021, the first loading connecting arm 3022 moves from the loading module 301 to the first processing table 201, and the second loading connecting arm 3023 moves from the second processing table 202 to the loading module 301 to wait.

[0067] Furthermore, each of the processing tables is a rotating processing table, including a rotating part and a driving part, the driving part is used to drive the rotating part to rotate in steps and circulate between the loading position 5, the processing position 6 and the unloading position 7, respectively matching the loading transfer module 302, the scanning head and the unloading transfer module 303; a silicon wafer fixing device is provided on the rotating processing table.

[0068] In more detail, the driving part is a driving device such as a DD motor, which is fixed on the workbench 4 with the driving end facing upward. The rotating part is a cross-shaped rotating bracket, the middle part of which is fixed to the driving end of the driving part, and a suction cup assembly is provided upward at the free end. The rotating part can rotate in 90-degree steps driven by the driving part. During the rotation process, the free end can pass through the loading position 5, the processing position 6, and the unloading position 7 in sequence, and can stay at the above positions to perform loading, processing and unloading operations. Among them, the loading position 5 is arranged close to the loading module 301, the processing position 6 is arranged directly below the first scanning head 106 or the second scanning head 107 of the laser spectrometer, and the unloading position 7 is arranged close to the unloading module 304.

[0069] The present invention changes the traditional production method that determines production efficiency by "silicon wafer transmission speed + laser processing speed" to "optical path switching speed + laser processing speed" to determine production efficiency. The optical path switching speed is much faster than the silicon wafer transmission speed. The scheme of the present invention greatly improves the processing rate and can increase the production capacity of laser processing equipment by about 20%. At the same time, the laser spectrometer ensures the accuracy and stability of laser processing.

[0070] The above embodiments are only used to illustrate the design ideas and features of the present invention, and their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly. The protection scope of the present invention is not limited to the above embodiments. Therefore, any equivalent changes or modifications made based on the principles and design ideas disclosed by the present invention are within the protection scope of the present invention.

Claims

1. A dual-station laser processing equipment, Features: The processing equipment includes a laser spectrometer, a double-station transmission system and a control system; The laser spectrometer comprises a laser light source, a laser optical path and a scanning head, and the device also comprises a single-axis galvanometer system; the laser optical path comprises two paths, and a scanning head is provided at the end of each laser optical path, and each scanning head corresponds to a processing table, and the scanning head comprises a processing galvanometer and a field lens; the two laser optical paths are switched by controlling the mechanical rotation angle of the single-axis galvanometer in the single-axis galvanometer system; the two laser optical paths are both reflected by a total reflection lens group; a beam expander is provided between each laser optical path and the corresponding scanning head; The double-station transmission system includes two processing tables corresponding to the scanning heads, and a transmission device; the transmission device includes a loading module, a loading transfer module, a unloading transfer module and an unloading module; the loading module is used to transfer the products to be processed, the loading transfer module is used to transfer the products to be processed from the loading module to the two processing tables in turn, and the unloading transfer module is used to transfer the processed products from the two processing tables to the unloading module in turn; The control system is used to control the timing of the laser beam splitting device and the double-station transmission system, so as to complete the following actions: when the laser is incident on the corresponding scanning head through one of the laser light paths and laser processing is performed on one of the processing stations, the unloading transfer module and the loading transfer module complete the transfer and preparation of the processed products and products to be processed on the other processing station; There is only one set of conveying devices, the end of the loading module is only provided with a material taking position, and the front end of the unloading module is only provided with a material receiving position; The feeding transfer module comprises a feeding rotating shaft, two feeding connecting arms connected to the feeding rotating shaft, and a product fixing device is arranged at the end of the feeding connecting arm; the position of the feeding rotating shaft and the angle between the two feeding connecting arms are such that: when the end of one feeding connecting arm is located on the processing table, the end of the other feeding connecting arm is located on the material taking position; the feeding rotating shaft is controlled by the control system to reciprocate and step rotation; The material unloading transfer module includes a material unloading rotating shaft, two material unloading connecting arms connected to the material unloading rotating shaft, and a product fixing device is provided at the end of the material unloading connecting arm; the position of the material unloading rotating shaft and the angle between the two material unloading connecting arms are such that: when the end of one material unloading connecting arm is located on the processing table, the end of the other material unloading connecting arm is located on the material receiving position; the material unloading rotating shaft is controlled by the control system to reciprocate and step rotation.

2. The dual-station laser processing equipment according to claim 1, Features: Each of the processing tables is a rotary processing table, including a rotating part and a driving part. The driving part is used to drive the rotating part to rotate in steps and circulate between the loading position, the processing position and the unloading position, and is matched with the loading transfer module, the scanning head and the unloading transfer module respectively; a product fixing device is provided on the rotary processing table.

3. The dual-station laser processing equipment according to claim 2, Features: The feeding rotating shaft is arranged at the midpoint of the feeding position line of the two processing tables, and the material taking position is located on the center line of the feeding position line of the two processing tables, and the angle between the two feeding connecting arms is 90 degrees; The material unloading rotating axis is arranged at the midpoint of the material unloading position line of the two processing tables, and the material receiving position is located on the center line of the material unloading position line of the two processing tables, and the angle between the two material unloading connecting arms is 90 degrees.

4. The dual-station laser processing equipment according to claim 1, Features: The product is a silicon wafer used to prepare solar cells.

5. A processing method implemented by using the dual-station laser processing equipment according to claim 1, Features: Assume that the processing tables are the first processing table and the second processing table, the laser light path corresponding to the first processing table is the first laser light path, and the laser light path corresponding to the second processing table is the second laser light path; The method comprises the following steps: The laser light emitted by the laser light source is transmitted through the first laser optical path to perform laser processing on the product to be processed on the first processing table; at the same time, the unloading transfer module transfers the processed product from the second processing table to the unloading module, and then the loading transfer module transfers the product to be processed from the loading module to the second processing table; When the laser processing work on the first processing table is completed, the preparation work of the product to be processed on the second processing table has been completed. At this time, the mechanical rotation angle of the single-axis galvanometer in the single-axis galvanometer system is controlled to switch the laser optical path; The laser light emitted by the laser light source is transmitted through the second laser optical path to perform laser processing on the product to be processed on the second processing table; at the same time, the unloading transfer module transfers the processed product from the first processing table to the unloading module, and then the loading transfer module transfers the product to be processed from the loading module to the first processing table; When the laser processing work on the second processing table is completed, the preparation work of the product to be processed on the first processing table has been completed. At this time, the mechanical rotation angle of the single-axis galvanometer in the single-axis galvanometer system is controlled to switch the laser optical path; This cycle repeats itself; The conveying device has only one group, the end of the loading module is only provided with a material taking position, and the front end of the unloading module is only provided with a material receiving position; the loading transfer module includes a loading rotating shaft, a first loading connecting arm and a second loading connecting arm connected to the loading rotating shaft, and the ends of the two loading connecting arms are respectively provided with product fixing devices; the unloading transfer module includes a unloading rotating shaft, a first unloading connecting arm and a second unloading connecting arm connected to the unloading rotating shaft, and the ends of the two unloading connecting arms are respectively provided with product fixing devices; When the material unloading transfer module transfers the processed product from the second processing table to the unloading module, under the forward rotation of the unloading rotating shaft, the second unloading connecting arm moves from the second processing table to the unloading module, and the first unloading connecting arm moves from the unloading module to the first processing table to wait; when the material unloading transfer module transfers the processed product from the first processing table to the unloading module, under the reverse rotation of the unloading rotating shaft, the first unloading connecting arm moves from the first processing table to the unloading module, and the second unloading connecting arm moves from the unloading module to the second processing table to wait; When the loading transfer module transfers the product to be processed from the loading module to the second processing table, under the forward rotation of the loading rotating shaft, the second loading connecting arm moves from the loading module to the second processing table, and the first loading connecting arm moves from the first processing table to the loading module to wait; when the loading transfer module transfers the product to be processed from the loading module to the first processing table, under the reverse rotation of the loading rotating shaft, the first loading connecting arm moves from the loading module to the first processing table, and the second loading connecting arm moves from the second processing table to the loading module to wait.

6. The processing method according to claim 5, Features: Each of the processing tables is a rotary processing table, including a rotating part and a driving part. The driving part is used to drive the rotating part to rotate in steps and circulate between the loading position, the processing position and the unloading position, and is matched with the loading transfer module, the scanning head and the unloading transfer module respectively; a product fixing device is provided on the rotary processing table.

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