A superconducting tape packaging structure and preparation method thereof

Abstract

The present invention relates to the field of material packaging, and in particular to a superconducting tape packaging structure and a preparation method thereof. The present invention provides a superconducting tape packaging structure, comprising a first packaging part and a second packaging part; the first packaging part comprises a first ReBCO tape layer and a first packaging layer fixedly connected in sequence; the second packaging part comprises a second ReBCO tape layer and a second packaging layer fixedly connected in sequence; the first packaging part is fixedly connected to the second ReBCO tape layer of the second packaging part through the first ReBCO tape layer to form a superconducting tape packaging structure. The present invention also provides a preparation method for a superconducting tape packaging structure, by combining the first ReBCO tape layer of the first packaging part and the second ReBCO tape layer in the second packaging part, a superconducting tape packaging structure is prepared. A superconducting tape packaging structure and a preparation method thereof provided by the present invention solve the technical problem that the connection resistance of the superconducting tape packaging structure in the prior art is too high, which reduces the practicality of the superconducting tape.

Description

Technical Field

[0001] The present invention relates to the field of material packaging, and in particular to a superconducting tape packaging structure and a preparation method thereof. Background Art

[0002] Superconducting materials have zero resistance, complete anti-magnetism and flux quantization and other physical properties that conventional materials do not have, and they play an irreplaceable role in cutting-edge fields such as electricity, medical care, and transportation. The three inherent critical parameters of superconducting materials are critical current, critical temperature, and critical magnetic field. Superconducting materials will only be in a superconducting state when the three critical conditions are met at the same time. Among them, the critical current refers to the maximum current that can pass in the superconducting state, which is the most important indicator for measuring the current carrying capacity of superconducting wires. Since the discovery of superconductivity in 1911, related research in the field of superconductivity has developed rapidly, and a number of practical superconducting materials with high current carrying capacity, high chemical stability and easy industrial production have also emerged, including: low-temperature superconducting material niobium alloy wire and high-temperature superconducting material copper oxide compounds, etc. The above copper oxide compounds are represented by Bi-Sr-Ca-Cu-O and Re-Ba-Cu-O compounds (ReBCO). Among them, ReBCO has the advantages of high critical temperature, high current carrying capacity, high irreversible field and cheap production raw materials. By depositing this material in the form of a thin film on a textured flexible metal substrate, a "coated conductor", i.e., the second generation of high-temperature superconducting tape, can be obtained.

[0003] During the preparation and application of the second generation of high temperature superconducting tapes, the superconducting tapes have undergone complex stress strain, bending, twisting, stretching, etc. In order to solve the above problems, an effective technical route is packaging reinforcement technology, which can not only improve the mechanical properties of the tape, but also further improve the electrical properties, such as transient and steady-state current capacity. However, to achieve large-scale application of superconducting tapes, joint technology is one of the key technologies. The connection resistance, critical current and mechanical performance indicators of the joint largely determine the practicality of the joint technology. For conventionally packaged high temperature superconducting tapes, the joint technology usually adopts three methods: brazing, mechanical crimping and silver diffusion. The joints obtained by these methods inevitably have a higher joint resistance, generally reaching tens of nano-ohms or higher. Therefore, the connection resistance of the superconducting tape packaging structure in the prior art is too high, which reduces the practicality of the superconducting tape and becomes a technical problem that needs to be solved urgently by technicians in this field. Summary of the invention

[0004] In view of this, the present invention provides a superconducting tape packaging structure and a preparation method thereof, which solves the technical problem in the prior art that the connection resistance of the superconducting tape packaging structure is too high, thereby reducing the practicability of the superconducting tape.

[0005] The present invention provides a superconducting tape packaging structure, comprising a first packaging part and a second packaging part which are fixedly connected;

[0006] The first packaging part comprises a first ReBCO tape layer and a first packaging layer which are fixedly connected in sequence;

[0007] The second packaging portion comprises a second ReBCO tape layer and a second packaging layer that are fixedly connected in sequence;

[0008] The first packaging part is fixedly connected to the second ReBCO tape layer of the second packaging part through the first ReBCO tape layer to form a superconducting tape packaging structure.

[0009] Preferably, the first ReBCO tape layer and the second ReBCO tape layer each include a first copper-plated layer, a superconducting layer, a buffer layer, a base tape layer, and a second copper-plated layer that are fixedly connected in sequence;

[0010] The second copper-plated layer of the first ReBCO tape layer is fixedly connected to the first packaging layer;

[0011] The second copper-plated layer of the second ReBCO tape layer is fixedly connected to the second packaging layer;

[0012] The first copper-plated layer in the first ReBCO tape layer and the first copper-plated layer in the second ReBCO tape layer are fixedly connected to form the superconducting tape packaging structure.

[0013] Preferably, the first packaging portion further includes a first solder coating layer;

[0014] The second copper-plated layer of the first ReBCO tape layer is fixedly connected to the first packaging layer through the first solder coating layer.

[0015] Preferably, the second packaging portion further includes a second solder coating layer;

[0016] The second copper-plated layer of the second ReBCO tape layer is fixedly connected to the second packaging layer through the second solder coating layer.

[0017] Preferably, the first encapsulation layer and the second encapsulation layer both include a third metal layer and a fourth metal layer that are fixedly connected;

[0018] The third metal layer of the first packaging layer is fixedly connected to the first solder coating layer;

[0019] The third metal layer of the second packaging layer is fixedly connected to the second solder coating layer.

[0020] Preferably, the third metal layer is made of brass.

[0021] Preferably, the third metal layer is a third metal layer made of stainless steel.

[0022] Preferably, the fourth metal layer is made of red copper.

[0023] The present invention also provides a method for preparing a superconducting tape packaging structure, comprising the following steps:

[0024] Step 1: fix the first ReBCO tape layer and the first packaging layer on the pay-off device respectively, and roll the first ReBCO tape layer and the first packaging layer into the tin furnace by using the coil unwinding method;

[0025] Step 2: welding the first ReBCO tape layer and the first packaging layer in the tin furnace to form a first packaging part;

[0026] Step 3: taking out of the oven and winding the first packaging part on a winding reel;

[0027] Step 4: fix the second ReBCO tape layer and the second packaging layer on the pay-off device respectively, and roll the second ReBCO tape layer and the second packaging layer into the tin furnace by using the coil unwinding method;

[0028] Step 5: welding the second ReBCO tape layer and the second packaging layer in the tin furnace to form a second packaging part;

[0029] Step 6: taking out of the oven and winding the second packaging part on the winding reel;

[0030] Step 7: Combine the first ReBCO tape layer in the first packaging part and the second ReBCO tape layer in the second packaging part to prepare a superconducting tape packaging structure.

[0031] Preferably, after step 1 and before step 2, the method further comprises coating a solder flux on the surface of the first ReBCO strip layer to form a first solder coating layer;

[0032] After step 4 and before step 5, the method further includes coating flux on the surface of the second ReBCO tape layer to form a second solder coating layer.

[0033] The present invention provides a superconducting tape packaging structure, wherein the first packaging part includes a first ReBCO tape layer and a first packaging layer fixedly connected in sequence; the second packaging part includes a second ReBCO tape layer and a second packaging layer fixedly connected in sequence. When preparing the joint, the first ReBCO tape layer in the first packaging part and the second ReBCO tape layer in the second packaging part are fixedly connected to form a superconducting tape packaging structure, that is, the first packaging part with a single-sided packaging structure and the unpackaged side of the second packaging part are combined. The present invention is different from the previous superconducting tape packaging by brazing or double-sided packaging. The single-sided packaging can make the packaging joint have a smaller thickness, but at the same time maintain good mechanical properties to meet the needs in the superconducting equipment manufacturing project. When preparing the joint, by combining the unpackaged side of the superconducting tape, a joint with a lower resistance value can be obtained, which can be better used in large-scale power equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0035] Figure 1 A first structural schematic diagram of a superconducting tape packaging structure provided by the present invention;

[0036] Figure 2 A second structural schematic diagram of a superconducting tape packaging structure provided by the present invention;

[0037] Figure 3 A schematic diagram of an assembly process of a superconducting tape packaging structure provided by an embodiment of the present invention;

[0038] Among them, the first packaging part 1, the second packaging part 2, the first packaging layer 1a, the first ReBCO tape layer 1b, the second packaging layer 2a, the second ReBCO tape layer 2b, the first copper plating layer 3, the superconducting layer 4, the buffer layer 5, the base tape layer 6, the second copper plating layer 7, the first solder coating layer / the second solder coating layer 8, the flux 9, the tin furnace 10 and the winding reel 11. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] See also Figure 1 , an embodiment of the present invention provides a superconducting tape packaging structure, comprising a first packaging part 1 and a second packaging part 2 fixedly connected;

[0041] The first packaging part 1 comprises a first ReBCO tape layer 1b and a first packaging layer 1a which are fixedly connected in sequence;

[0042] The second encapsulation part 2 comprises a second ReBCO tape layer 2b and a second encapsulation layer 2a which are fixedly connected in sequence;

[0043] The first ReBCO tape layer 1 b of the first packaging part 1 and the second ReBCO tape layer 2 b of the second packaging part 2 are fixedly connected to form a superconducting tape packaging structure.

[0044] An embodiment of the present invention provides a superconducting tape packaging structure, wherein the first packaging part 1 includes a first ReBCO tape layer 1b and a first packaging layer 1a fixedly connected in sequence; the second packaging part 2 includes a second ReBCO tape layer 2b and a second packaging layer 2a fixedly connected in sequence. When preparing the joint, the first ReBCO tape layer 1b in the first packaging part 1 and the second ReBCO tape layer 2b in the second packaging part 2 are fixedly connected to form a superconducting tape packaging structure, that is, the side with the first packaging part 1 and the second packaging part 2 that are not packaged is packaged on one side. The embodiment of the present invention is different from the previous superconducting tape packaging by brazing or double-sided packaging. Through single-sided packaging, the packaging joint can have a smaller thickness, but at the same time maintain good mechanical properties to meet the needs in the superconducting equipment manufacturing project. When preparing the joint, by combining the unpackaged side of the superconducting tape, a joint with a lower resistance value can be obtained, which can be better used in large-scale power equipment.

[0045] For further information, see Figure 2 , the first ReBCO tape layer 1b and the second ReBCO tape layer 2b each include a first copper-plated layer 3, a superconducting layer 4, a buffer layer 5, a base tape layer 6 and a second copper-plated layer 7 which are fixedly connected in sequence;

[0046] The second copper-plated layer 7 of the first ReBCO tape layer 1 b is fixedly connected to the first encapsulation layer 1 a ;

[0047] The second copper-plated layer 7 of the second ReBCO tape layer 2b is fixedly connected to the second encapsulation layer 2a;

[0048] The first copper-plated layer 3 in the first ReBCO tape layer 1 b and the first copper-plated layer 3 in the second ReBCO tape layer 2 b are fixedly connected to form a superconducting tape packaging structure.

[0049] Furthermore, the first packaging part 1 also includes a first solder coating layer 8;

[0050] The second copper-plated layer 7 in the first ReBCO tape layer 1 b is fixedly connected to the first encapsulation layer 1 a via the first solder coating layer 8 .

[0051] Furthermore, the second packaging part 2 also includes a second solder coating layer 8;

[0052] The second copper-plated layer 7 in the second ReBCO tape layer 2 b is fixedly connected to the second encapsulation layer 2 a via a second solder coating layer 8 .

[0053] Further, the first encapsulation layer 1a and the second encapsulation layer 2a both include a third metal layer and a fourth metal layer that are fixedly connected;

[0054] The third metal layer of the first packaging layer is fixedly connected to the first solder coating layer;

[0055] The third metal layer of the second packaging layer is fixedly connected to the second solder coating layer.

[0056] Furthermore, the third metal layer is made of brass.

[0057] Furthermore, the third metal layer is made of stainless steel.

[0058] Furthermore, the fourth metal layer is made of red copper.

[0059] Further, such as Figure 3 As shown, an embodiment of the present invention also provides a method for preparing a superconducting tape packaging structure, comprising the following steps:

[0060] Step 1: fix the first ReBCO tape layer 1b and the first packaging layer 1a on the unwinding device respectively, and roll the first ReBCO tape layer 1b and the first packaging layer into the tin furnace 10 by using the coil unwinding method;

[0061] Step 2: soldering the first ReBCO tape layer 1b and the first packaging layer 1a in a tin furnace 10 to form a first packaging portion 1;

[0062] Step 3: Take out of the oven and wind the first packaging part 1 into the winding reel 11;

[0063] Step 4: fix the second ReBCO tape layer 2b and the second packaging layer 2a on the unwinding device respectively, and roll the second ReBCO tape layer 2b and the second packaging layer 2a into the tin furnace 10 by using the coil unwinding method;

[0064] Step 5: welding the second ReBCO tape layer 2b and the second packaging layer 2a in a tin furnace 10 to form a second packaging portion 2;

[0065] Step 6: Take out of the oven and wind the second packaging part 2 into the winding reel 11;

[0066] Step 7: Combine the first ReBCO tape layer 1b of the first packaging part 1 and the second ReBCO tape layer 2b of the second packaging part 2 to prepare a superconducting tape packaging structure.

[0067] Furthermore, after step 1 and before step 2, the method further includes coating a soldering flux 9 on the surface of the first ReBCO tape layer 1 b to form a first solder coating layer;

[0068] After step 4 and before step 5, the process further includes coating a solder flux 9 on the surface of the second ReBCO tape layer 2 b to form a second solder coating layer.

[0069] It should be noted that a clamping knife is installed in the tin furnace 10 to scrape off the excess solder on the surface of the first packaging part 1 and the second packaging part 2 to ensure that the surface is smooth.

[0070] The above descriptions are only preferred embodiments of the present invention. It should be pointed out that professionals in this technical field can implement various modifications to these embodiments without departing from the technical principles of the present invention, and these modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A superconducting tape packaging structure, characterized in that: It includes a first packaging part and a second packaging part that are fixedly connected; The first packaging part comprises a first ReBCO tape layer and a first packaging layer which are fixedly connected in sequence; The second packaging portion comprises a second ReBCO tape layer and a second packaging layer that are fixedly connected in sequence; The first packaging part is fixedly connected to the second ReBCO tape layer of the second packaging part through the first ReBCO tape layer to form a superconducting tape packaging structure; The first encapsulation part having a single-sided encapsulation structure is combined with an unencapsulated side of the second encapsulation part; The first ReBCO tape layer and the second ReBCO tape layer each include a first copper-plated layer, a superconducting layer, a buffer layer, a base tape layer, and a second copper-plated layer that are fixedly connected in sequence; The second copper-plated layer of the first ReBCO tape layer is fixedly connected to the first packaging layer; The second copper-plated layer of the second ReBCO tape layer is fixedly connected to the second packaging layer; The first copper-plated layer in the first ReBCO tape layer and the first copper-plated layer in the second ReBCO tape layer are fixedly connected to form the superconducting tape packaging structure; The first packaging portion further includes a first solder coating layer; The second copper-plated layer of the first ReBCO strip layer is fixedly connected to the first packaging layer through the first solder coating layer; The second packaging portion further includes a second solder coating layer; The second copper-plated layer of the second ReBCO strip layer is fixedly connected to the second packaging layer through the second solder coating layer; The first encapsulation layer and the second encapsulation layer both include a third metal layer and a fourth metal layer that are fixedly connected; The third metal layer of the first packaging layer is fixedly connected to the first solder coating layer; the third metal layer of the second packaging layer is fixedly connected to the second solder coating layer.

2. A superconducting tape packaging structure according to claim 1, characterized in that: The third metal layer is made of brass.

3. A superconducting tape packaging structure according to claim 1, characterized in that: The third metal layer is made of stainless steel.

4. A superconducting tape packaging structure according to claim 1, characterized in that: The fourth metal layer is made of red copper.

5. A method for preparing a superconducting tape packaging structure, characterized in that: The following steps are involved: Step 1: fix the first ReBCO tape layer and the first packaging layer on the pay-off device respectively, and roll the first ReBCO tape layer and the first packaging layer into the tin furnace by using the coiled tape unwinding method; Step 2: welding the first ReBCO tape layer and the first packaging layer in the tin furnace to form a first packaging part; Step 3: taking out of the oven and winding the first packaging part on a winding reel; Step 4: fix the second ReBCO tape layer and the second packaging layer on the pay-off device respectively, and roll the second ReBCO tape layer and the second packaging layer into the tin furnace by using the coil unwinding method; Step 5: welding the second ReBCO tape layer and the second packaging layer in the tin furnace to form a second packaging part; Step 6: taking out of the oven and winding the second packaging part on the winding reel; Step 7: combining the first ReBCO tape layer of the first packaging part and the second ReBCO tape layer of the second packaging part, combining the first packaging part with a single-sided packaging structure and the unpackaged side of the second packaging part, to prepare a superconducting tape packaging structure; After step 1 and before step 2, the method further includes coating a solder flux on the surface of the first ReBCO strip layer to form a first solder coating layer; After step 4 and before step 5, the method further includes coating flux on the surface of the second ReBCO tape layer to form a second solder coating layer.

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