Stepped slot connector to enable low-profile platforms

Abstract

The present invention relates to a stepped slot connector for enabling low-profile platforms. One embodiment relates to a memory module connector comprising a housing defining a stepped slot configured to receive a memory module. Another embodiment comprises a memory module defining a stepped slot configured to receive a memory module, the memory module comprising a printed circuit board and a plurality of components mounted on the printed circuit board, wherein the stepped slot in the memory module connector is configured such that at least one of the plurality of components mounted on the printed circuit board is positioned within the stepped slot. Additional embodiments are described and claimed.

Description

Technical Field

[0001] Embodiments generally relate to input / output interfaces used in electronic devices, including connectors for high-density computer platforms. Background Art

[0002] Computer systems often include a board, such as a motherboard, that includes input / output interfaces, such as connectors (also known as sockets), for coupling devices, such as memory cards, to the board. Memory cards, such as DIMMs (dual in-line memory modules), can include multiple memory chips and other components, such as resistors, positioned on their surfaces. DIMM cards can be formed to include multiple conductive fingers extending to their leading edge for making electrical connections between the card and the connector when the leading edge is inserted into a connector on the board. As computing systems become more complex, the spacing on and above the motherboard becomes limited. BRIEF DESCRIPTION OF THE DRAWINGS

[0003] The embodiments are described by way of example with reference to the accompanying drawings, wherein like reference numerals may refer to similar elements throughout.

[0004] Figure 1 Illustrated are views of a connector and a card for insertion into the connector in accordance with certain embodiments.

[0005] Figure 2 Certain aspects of a connector according to certain embodiments are illustrated.

[0006] Figure 3 Certain aspects of the connector are illustrated before a card is inserted therein, in accordance with certain embodiments.

[0007] Figure 4 FIG. 1 illustrates a method including contact structures according to some embodiments. Figure 3 connector.

[0008] Figure 5 Illustrated is a diagram including a card inserted therein according to some embodiments. Figure 4 connector.

[0009] Figure 6 A flow diagram illustrating operations in accordance with certain embodiments is shown.

[0010] Figure 7 An electronic system according to some embodiments is illustrated. DETAILED DESCRIPTION

[0011] References in the specification to "an embodiment," "certain embodiments," "an embodiment," etc., indicate that the described embodiment may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include that particular feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Certain embodiments relate to connectors for coupling a card to a substrate such as a PCB (printed circuit board) (e.g., a motherboard). Embodiments include apparatus and methods.

[0012] Certain embodiments relate to a connector structure for coupling a card, such as a memory module, to a board, including forming a connector that includes a stepped structure into which the memory card can be positioned. In certain embodiments, the stepped structure enables at least a portion of certain components mounted on the card to be positioned within the height of the connector. This structure enables the card to have a smaller height, thereby creating more space within a computing system.

[0013] Figure 1 A view of a connector 10 configured to accept a memory card 20, such as a dual in-line memory module (DIMM), and couple it to a board is illustrated. The connector 10 includes an elongated housing 12 including tower regions 14 at end regions. The housing 12 can be configured to surround a central slot 16 defining a card edge region into which the card 20 can be positioned. The slot 16 of the connector 10 can include a stepped structure, as in Figure 2-3 As can be seen more clearly in the view shown in FIG. Casing 12 may be formed from any suitable material including, but not limited to, polymers such as polyamide.

[0014] Figure 1 Arrow 38 is shown indicating the direction of insertion of card 20 into slot 16, with card edge 28 (bottom portion of card 20) being inserted into slot 16. Connector 10 includes contacts (at the bottom of slot 16) extending into slot 16 for engaging fingers 22 on the card. Figure 1-2 ). The tower sections 14 may each include an ejector 18 configured to latch onto and eject the card 20.

[0015] The memory card 20 may include volatile memory, which may include storage media that requires power to maintain the state of data stored by the media. Non-limiting examples of volatile memory may include various types of random access memory (RAM), such as dynamic random access memory (DRAM) or static random access memory (SRAM). One specific type of DRAM that may be used in the memory module is synchronous dynamic random access memory (SDRAM). In certain embodiments, the DRAM of the memory component may comply with standards promulgated by the Joint Electron Device Engineering Council (JEDEC), such as JESD79F for DDR SDRAM, JESD79-2F for DDR2 SDRAM, JESD79-3F for DDR3 SDRAM, JESD79-4A for DDR4 SDRAM, JESD209 for Low Power DDR (LPDDR), JESD209-2 for LPDDR2, JESD209-3 for LPDDR3, and JESD209-4 for LPDDR4 (these standards are available at www.jedec.org).

[0016] There are many types of connectors used to couple memory cards to boards, including JEDEC DDRx connectors based on the following standards: This standard includes, for example, the DDR4 260-pin SODIMM connector performance standard and the DDR4 288-pin U / R / LR DIMM (Unregistered / Registered / Reduced Load DIMM) connector performance standard. This standard (and similar standards) may be referred to as a DDR-based standard, and the communication interface of a storage device that implements this standard may be referred to as a DDR-based interface.

[0017] In some embodiments, the card 20 includes a printed circuit board (PCB) 42 having a plurality of components positioned thereon, including, but not limited to, a memory chip 24 and a resistor 26. The card 20 may include a plurality of conductive fingers 22 formed in the PCB 42 and extending from a location at or near the front edge 28 of the card 20 and extending a short distance upward along the card 20, as shown. Figure 1 The card 20 may also include a key area 44 extending upward from the front edge.

[0018] The area on the card 20 from the front edge to the bottom edge of the component (e.g. Figure 126) is considered a keep out zone where no components are mounted on PCB 42. This allows leading edge 28 of card 20 and the area adjacent to leading edge 28 to be inserted into connector 10 without any components mounted on PCB 42 interfering with connector 10. Such interference, such as physical contact between connector 10 and components (e.g., resistor 26), may result in card 20 not being properly positioned in connector 10 or other problems such as components or connector 10 being damaged. Figure 1 In the embodiment shown in FIG, the height of the keep-out area is indicated by the letter x.

[0019] In some embodiments, by forming connector 10 to include a stepped structure extending into slot 16, some or all of certain features on the surface of card 10 can be positioned within slot 16 in connector 10 rather than being positioned entirely above and outside of connector 10. Figure 2 1 is an enlarged view of certain features on a portion of connector 10. As noted above, connector 10 may include a stepped structure extending into slot 16. Figure 2 As shown in the figure, the shell 12 of the connector 10 can define a stepped structure in the groove 16 and include: a first vertical plate portion 30, extending downward from the upper surface portion 32 of the shell 12; a tread portion 34, extending from the vertical plate portion 30; and a second vertical plate portion 35, extending downward from the tread portion 34 toward the bottom portion of the groove 16. Figure 2 Also shown are contact openings 36 in the housing 12 positioned between adjacent stepped portions. Figure 2 (not shown) is positioned into the contact opening 36.

[0020] exist Figure 3 , which shows a stepped structure in the slot 16 defined by the housing 12, Figure 3 The diagram shows a schematic diagram of a circuit diagram of a connector 10. Figure 2 A cross-sectional view of the plane defined by the dashed line AA'. Figure 2 As described, Figure 3 Shown is a surface 30 that serves as an upper riser portion of the stepped structure positioned between an upper surface 32 that serves as an upper tread portion and an intermediate surface 34 that serves as an intermediate tread portion at a level below the level of the upper surface 32 . Figure 3 Also shown is a lower surface 35 extending to a bottom surface 37, which serves as a lower riser portion. The bottom surface 37 serves as a lower tread portion of the trough 16. In some embodiments, the stepped structure may include tread portions that are parallel to each other, riser portions that are parallel to each other, and riser portions that are perpendicular to the tread portions. Figure 3As shown in the embodiment illustrated in FIG, both sides of slot 16 can have riser and tread surfaces of the same size and shape extending from the top of slot 16 to the bottom of slot 16. In other embodiments, the shapes and sizes of the various surfaces on either side of the slot can differ from one another depending on, for example, the configuration of a card being inserted into the connector. Additionally, the shapes and sizes of the various surfaces defining slot 16 can differ from those illustrated.

[0021] Figure 4 Along the Figure 2 The cross-sectional view through the contact opening 36 in the plane defined by the dashed line BB' in FIG. Figure 2 Certain features of connector 10 further include contact structure 40. Region 30a is the portion of housing 12 within slot 16 that extends downwardly from upper surface 32 into slot 16 in a plane defined by dashed line BB'. Figure 4 The dashed lines in the groove 16 in FIG. 3 illustrate the surface defining the groove 16 in the region adjacent to the contact opening 36, including: region 30b (dashed line), which is the lower portion of the riser portion 30; tread surface 34 (dashed line); and lower riser surface 35 (dashed line), which extends to the bottom of the groove 16. In some embodiments, a portion of the contact opening 36 may extend to the upper surface 32, such as Figure 2-4 As shown in the figure. Figure 3-4 As shown in , a lower portion of the slot 16 may be defined by a central portion of the housing 12 .

[0022] Figure 5 Pictured Figure 4 The connector includes the memory module card 20 positioned therein. In the illustrated embodiment, portions of the resistor components 26 on both sides of the PCB 42 may be positioned within the stepped structure of the slot 16. The contact structure 40 engages the fingers 26 ( Figure 1 ) to transmit electrical signals to and from the card 20. Figure 5 As seen in the illustrated embodiment, when viewed from along surface 12a (see Figure 4 ) When the upper portion 40a is moved toward a position between the surfaces 12a and 12b of the housing 12, insertion of the card 20 causes the contact structure 40 to move outward within the contact opening 36. Figure 4-5 The contact structure 40 shown in FIG. 1 extends to a terminal portion 41 extending from the bottom of the housing 12. The terminal 41 may include solder for coupling to a substrate such as a motherboard. Although a surface mount structure is shown, embodiments may include a variety of connection structures for coupling to a substrate, including but not limited to surface mount, press fit, and through-hole mechanisms.

[0023] In certain embodiments, a connector including a stepped structure within the card insertion slot enables the use of a card having a smaller height, which has a smaller keep-out area. The card can be formed with a smaller keep-out area because at least some components can be positioned closer to the leading edge of the connector and within the stepped area of ​​the slot in the connector. For example, in certain embodiments, the keep-out area extends a distance of approximately 2.8 mm from the leading edge of the card. In more traditional connector and card structures, a keep-out area distance of, for example, 4 mm can be utilized because no portion of the components mounted on the card is positioned within the slot in the connector. Accordingly, the use of connectors according to certain embodiments enables the card to have a height that is approximately 1.2 mm less than a conventional card height in which no portion of the components on the card is positioned within the slot in the connector.

[0024] Embodiments also include methods for processing a device including positioning one or more connectors on a substrate. Figure 6 A flowchart illustrating operations according to certain embodiments includes forming a PCB for use in a computing system. Block 50 provides a connector comprising a structure including a card slot having a stepped configuration into which at least a portion of a component on the card can be positioned. Block 52 couples the connector to a substrate, such as a motherboard. The connector can be coupled using any suitable connection mechanism, including, but not limited to, a solder connection. Block 54 positions a card, such as a DIMM, into the connector such that at least a portion of the component on the card is positioned within the stepped configuration of the connector. Depending on the size of the component and the slot, a portion or the entire component may fit below the vertical level of the upper surface of the housing defining the upper end of the stepped slot.

[0025] An assembly including components formed as described in the above embodiments may find application in various electronic components. Figure 7 Schematically illustrates one example of an electronic system environment in which aspects of the described embodiments may be embodied. Other embodiments need not include Figure 7 All features specified in , but can include Figure 6 Replaceable features not specified in . Figure 7 System 70 may include at least one die, such as CPU 62 , positioned in a package substrate 64 , which is then coupled to a substrate, such as a printed circuit board (PCB) 60 .

[0026] like Figure 7 The system 70 shown in FIG includes three connectors 10 including stepped slots in which cards are received. The connectors may be used to couple memory such as DIMMs to the PCB 60. Although Figure 7Three connectors 10 are shown, but other numbers of connectors and other components are possible. The connector 10 can be configured and formed according to embodiments such as those described above, including, for example, a slot having a stepped structure into which at least a portion of a component mounted on the card (such as a resistor) can be positioned.

[0027] The system 70 may further include one or more controllers 80a, 80b, ..., 80n for various components, which may also be disposed on the PCB 60. The system 70 may be formed with additional components, including, but not limited to, storage 82, a display 84, and a network connection 86. The system 70 may include any suitable computing device, including, but not limited to, a mainframe, a server, a personal computer, a workstation, a laptop, a tablet, a netbook, a handheld computer, a handheld gaming device, a handheld entertainment device (e.g., an MP3 (Moving Picture Experts Group Layer-3 Audio) player), a PDA (personal digital assistant), a watch, a fitness device, a smartphone or other telephone device (wireless or wired), a network appliance, a virtualization device, a storage controller, a network controller, a router, and the like.

[0028] The various features of the embodiments described above can be implemented with respect to other embodiments including apparatus and method embodiments. The order of certain operations as described in the embodiments can also be modified. The details in the examples can be used anywhere in one or more embodiments.

[0029] In this description, various features are grouped together for the purpose of streamlining the disclosure. This method of disclosure should not be interpreted as reflecting an intention that the claimed embodiments of the present invention require more features than are expressly recited in each claim. Rather, as the claims reflect, inventive subject matter may lie in less than all features of a single disclosed embodiment. Accordingly, the claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment.

[0030] Although certain exemplary embodiments are described herein and shown in the accompanying drawings, it is to be understood that such embodiments are illustrative only and not restrictive, and that the embodiments are not limited to the specific constructions and arrangements shown and described, as modifications may occur to one of ordinary skill in the art. For example, in certain embodiments, the surface of the tank 16 and the topography of the housing 12 may vary from those illustrated in the drawings and described above.

[0031] Unless expressly specified otherwise, the terms "a" and "an" mean "one or more." Terms such as "first," "second," and the like may be used herein and do not necessarily denote any particular order, quantity, or importance, but are used to distinguish one element from another. Terms such as "upper," "lower," "top," "bottom," and the like may be used for descriptive purposes only and should not be construed as limiting.

[0032] Unless otherwise expressly specified, devices that communicate with each other need not be in continuous communication with each other. Additionally, devices that communicate with each other may communicate directly or indirectly through one or more intermediaries. The description of an embodiment with several components that communicate with each other does not mean that all such components are required. Embodiments can be made, used, and incorporated in a variety of positions and orientations.

[0033] The foregoing description of various embodiments of the present invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations are possible in light of the above teachings. It is intended that the scope of the present invention be limited not by this detailed description, but rather by the claims appended hereto. Example

[0034] The following examples relate to various embodiments. Details in the examples may be used anywhere in one or more embodiments.

[0035] Example 1 is a memory module connector including a housing defining a stepped slot configured to receive a memory module.

[0036] In Example 2, the subject matter of Example 1 can optionally include wherein the stepped trench is sized to accommodate at least a portion of a component mounted on the memory module.

[0037] In Example 3, the subject matter of any of Examples 1-2 can optionally include: wherein the shell includes an upper surface defining a first tread portion, an intermediate surface defining a second tread portion, a first riser portion extending between the first tread portion and the second tread portion, a third tread portion defining a lower surface in the stepped groove, and a second riser portion extending from the second tread portion to the third tread portion.

[0038] In Example 4, the subject matter of Example 3 can optionally include: wherein the first tread portion is parallel to the second tread portion.

[0039] In Example 5, the subject matter of any of Examples 3-4 can optionally include: wherein the third tread portion is parallel to the first tread portion and the second tread portion.

[0040] In Example 6, the subject matter of any of Examples 3-5 can optionally include wherein the first riser portion is parallel to the second riser portion.

[0041] In Example 7, the subject matter of any of Examples 3-6 can optionally include: wherein the first tread portion is perpendicular to the first riser portion.

[0042] In Example 8, the subject matter of any of Examples 3-7 can optionally include wherein the first tread portion is perpendicular to the first riser portion, wherein the second tread portion is perpendicular to the second riser portion, and wherein the third tread portion is perpendicular to the second riser portion.

[0043] Example 9 is a device comprising: a memory module connector of any one of Examples 1-8; and a memory module comprising a printed circuit board and a plurality of components mounted on the printed circuit board; wherein the stepped groove in the memory module connector is configured so that at least one of the plurality of components mounted on the printed circuit board is positioned in the stepped groove.

[0044] In Example 10, the subject matter of Example 9 can optionally include wherein the plurality of components comprises a memory chip and a resistor.

[0045] In Example 11, the subject matter of any of Examples 9-10 can optionally include wherein the at least one component positioned in the stepped trench comprises a resistor.

[0046] In Example 12, the subject matter of any of Examples 9-11 can optionally include: wherein the memory chip comprises a dynamic random access memory (DRAM) chip.

[0047] In Example 13, the subject matter of any of Examples 9-12 may optionally include: a connector comprising a housing, wherein the stepped slot includes an upper end defined by an upper surface of the housing, wherein each of at least one component positioned in the stepped slot includes a first portion positioned below the upper end of the stepped slot and a second portion positioned above the upper end of the stepped slot.

[0048] Example 14 is a connector including a housing, the housing including a surface defining a card edge area, the surface including a stepped structure, the stepped structure including: an upper tread portion, an intermediate tread portion, an upper riser portion between the upper tread portion and the intermediate tread portion, a lower tread portion, and a lower riser portion positioned between the intermediate tread portion and the lower tread portion.

[0049] Example 15 is an apparatus including the subject matter of Example 14, further comprising a memory card positioned in the card edge region, the memory card including a component mounted on the printed circuit board, the component positioned such that at least a portion of the component is positioned between the upper riser portion and the printed circuit board in the card edge region.

[0050] In Example 16, the subject matter of Example 15 can optionally include: wherein the portion of the component is positioned at a vertical level below a vertical level of the upper tread portion.

[0051] In Example 17, the subject matter of any of Examples 15-16 can optionally include wherein the component as a whole is positioned at a vertical level below a vertical level of the upper tread portion.

[0052] In Example 18, the subject matter of any one of Examples 15-17 can optionally include wherein the component comprises a resistor, and wherein the memory card further comprises a plurality of memory chips and resistors mounted on a printed circuit board.

[0053] In Example 19, the subject matter of any one of Examples 15-18 can optionally include wherein the component comprises a resistor.

[0054] In Example 20, the subject matter of Example 18 can optionally include wherein the memory chip comprises a dynamic random access memory (DRAM) chip.

[0055] In Example 21, the subject matter of any of Examples 14-20 can optionally include: wherein the upper tread portion is parallel to the intermediate tread portion.

[0056] In Example 22, the subject matter of any of Examples 14-21 can optionally include wherein the lower tread portion is parallel to the upper tread portion and the intermediate tread portion.

[0057] In Example 23, the subject matter of any of Examples 14-22 can optionally include wherein the upper riser portion is parallel to the lower riser portion.

[0058] In Example 24, the subject matter of any of Examples 14-23 can optionally include: wherein the upper portion is perpendicular to the upper riser portion.

[0059] In Example 25, the subject matter of any of Examples 14-24 can optionally include wherein the upper tread portion is perpendicular to the upper rise portion, wherein the intermediate tread portion is perpendicular to the intermediate rise portion, and wherein the lower tread portion is perpendicular to the intermediate rise portion.

[0060] Example 26 is a method comprising: providing a memory module comprising a printed circuit board and a plurality of components mounted on the printed circuit board; providing a connector comprising a stepped slot configured to receive the memory module; and positioning the memory module in the connector such that at least one component mounted on the printed circuit board is positioned in the slot.

[0061] In Example 27, the subject matter of Example 26 may optionally include: wherein each of the at least one component positioned in the stepped trench is positioned such that: the first surface is below an upper end of the stepped trench defined by an upper surface of the memory module, and the second surface is above the upper end of the stepped trench.

[0062] In Example 28, the subject matter of any one of Examples 26-27 may optionally include: the memory module includes a housing defining a stepped trough structure, the stepped trough structure including an upper tread portion, an intermediate tread portion, an upper riser portion between the upper tread portion and the intermediate tread portion, a lower tread portion, and a lower riser portion positioned between the intermediate tread portion and the lower tread portion, and each of at least one component positioned in the stepped trough is positioned so that the component is positioned between the printed circuit board and the upper riser portion.

[0063] In Example 29, the subject matter of any of Examples 26-28 can optionally include wherein the plurality of components comprises a plurality of memory chips and a plurality of resistors, and wherein at least some of the plurality of resistors are positioned in a stepped trench.

[0064] Example 30 is an apparatus comprising means for performing the method as described in any preceding example.

Claims

1. A device comprising: A memory module connector comprising a housing defining a stepped slot configured to receive a memory module; A memory module comprising a printed circuit board and a plurality of components mounted on the printed circuit board; wherein the stepped slot in the memory module connector is configured such that at least one component of the plurality of components mounted on the printed circuit board is positioned in the stepped slot; and wherein the stepped slot includes an upper end defined by an upper surface of the housing, wherein each of the at least one component positioned in the stepped slot includes a first portion positioned below the upper end of the stepped slot and a second portion positioned above the upper end of the stepped slot, wherein the housing includes: the upper surface defining a first tread portion, an intermediate surface defining a second tread portion, a first riser portion extending between the first tread portion and the second tread portion, a third tread portion defining a lower surface in the stepped groove, and a second riser portion extending from the second tread portion to the third tread portion, wherein the first tread portion is parallel to the second tread portion, The first tread portion is perpendicular to the first riser portion, the second tread portion is perpendicular to the second riser portion, and the third tread portion is perpendicular to the second riser portion.

2. The apparatus of claim 1, wherein the plurality of components include memory chips and resistors. 3 . The apparatus of claim 2 , wherein the at least one component positioned in the stepped trench comprises a resistor.

4. The apparatus of claim 2, wherein the memory chip comprises a dynamic random access memory (DRAM) chip.

5. A memory module connector, comprising: Tower areas separated by a central area; Each of the tower sections includes an upper surface having a height greater than a height of an upper surface of the central section; the central region including first and second elongated sides and a slot therebetween, the memory module being positionable in the slot, the slot including a stepped structure having a greater width at an upper portion thereof than at a lower portion thereof; as well as a plurality of contact structures positioned along the first and second elongated sides and facing the slot, the contact structures positioned in a single row along the first elongated side and in a single row along the second elongated side; wherein the trough is at least partially defined by an upper tread portion, an intermediate tread portion, an upper riser portion between the upper tread portion and the intermediate tread portion, and a lower riser portion, the intermediate tread portion being positioned between the upper tread portion and the lower riser portion, The upper tread portion is perpendicular to the upper riser portion and parallel to the middle tread portion.

6. A method for positioning a memory module in a connector, comprising: providing a memory module including a printed circuit board and a plurality of components mounted on the printed circuit board; providing a connector including a stepped slot configured to receive the memory module; as well as positioning the memory module in the connector so that at least one of the components mounted on the printed circuit board is positioned in the slot, wherein each of the at least one component positioned in the stepped slot is positioned such that: a first surface is below an upper end of the stepped slot defined by an upper surface of the memory module, and a second surface is above the upper end of the stepped slot, The memory module includes a shell defining a stepped slot structure, the stepped slot structure including an upper tread portion, an intermediate tread portion, an upper riser portion between the upper tread portion and the intermediate tread portion, a lower tread portion, and a lower riser portion positioned between the intermediate tread portion and the lower tread portion, and each of the at least one component positioned in the stepped slot is positioned so that the component is positioned between the printed circuit board and the upper riser portion. 7 . The method of claim 6 , wherein the plurality of components comprises a plurality of memory chips and a plurality of resistors, and wherein at least some of the plurality of resistors are positioned in the stepped trench.

8. An apparatus for positioning a memory module in a connector, comprising means for performing the steps of the method according to any one of claims 6 to 7.

9. A computer readable medium comprising instructions which, when executed by a processor, perform the method according to any one of claims 6 to 7.

10. A computer program product comprising instructions which, when executed by a processor, cause the processor to perform the method according to any one of claims 6 to 7.

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