Heat dissipation coating structure for transfer printing and hot pressing of housing of portable electronic device

Abstract

A heat dissipation coating structure for a portable electronic device shell transfer hot pressing forming includes: a front shell or a rear shell suitable for the portable electronic device, characterized in that: a high heat dissipation material is transferred on an unformed plasticized flat plate to form a printed flat plate with a heat dissipation coating; the printed flat plate is placed in a mold for hot pressing forming, and the temperature is increased to about 300-900 degrees Celsius according to the material and thickness. After the printed flat plate is softened, it is thermoplastically formed through the mold, and pressure is maintained in the mold cavity to prevent rebound deformation; thus, a 3D front shell or a rear shell is formed, and at the same time, the heat dissipation coating on the surface is hot pressed, so that the heat dissipation coating structure is perpendicular to the shell surface, forming a compact pressed heat dissipation layer, thereby improving the thermal conductivity.

Description

Technical Field

[0001] The invention relates to a structure of a portable electronic device, in particular to a heat dissipation coating structure with a dense structure formed by transfer printing and hot pressing on a shell. Background Art

[0002] Portable electronic devices currently on the market may overheat locally after being used for a long time. This phenomenon not only causes the performance of the electronic device to be reduced, but also causes the body to become hot or crash.

[0003] Secondly, because the appearance of portable electronic devices currently requires too thin thickness, there is no space reserved for heat convection in traditional heat transfer methods (using fans to obtain convection), so only "heat conduction" and "heat radiation" can be used. Currently, most portable electronic devices on the market use high thermal conductivity materials such as graphite sheets and copper foils attached near the heat source to achieve the purpose of heat dissipation and cooling. From the large-screen mobile phones of brands such as Meizu, Xiaomi, and Huawei on the market, there is no significant heat dissipation and cooling effect, and the local temperature is still high. This phenomenon not only causes the performance of electronic equipment to decrease, but also causes the body to become hot or crash, and even makes consumers feel that the temperature is too high or even burns the user, and consumers often complain during use.

[0004] Considering the above shortcomings of portable electronic devices currently on the market, the main reasons are as follows: Figure 1 As shown, the portable electronic device 10 currently available on the market usually combines a rear shell 11 with a front shell 12, and a circuit board 13 and a battery 15 are arranged between the rear shell 11 and the front shell 12, the circuit board 13 has a core component 14, and the front shell 12 is provided with a display module 16 and a touch panel 17; however, after the portable electronic device 10 is used for a long time, the heat emitted by the heat source of the electronic component (such as the core component 14, the battery 15), such as the waste heat generated by the operation of the core component 14 (such as a high-performance CPU), cannot be transmitted in an effective manner, resulting in local overheating. This phenomenon not only brings consumers an unpleasant user experience of excessively high touch temperature, but also limits the computing speed of the portable electronic device, and even the phenomenon of slow crashes often occurs.

[0005] Further investigation shows that most of the portable electronic devices currently on the market use a graphite sheet 20 or copper foil with high thermal conductivity materials attached to the back shell 11 by adhesive, in an attempt to dissipate the heat emitted by the heat source of the electronic component (e.g., core component 14, battery 15) through the back shell 11 to achieve the purpose of heat dissipation; but in fact, because the concept of thermal conductivity and temperature uniformity is not taken into account, the waste heat cannot be evenly distributed on the housing of the portable electronic device, so there is no significant heat dissipation effect. For example, the local temperature around the core component 14 remains high, causing the body to become hot or crash, and the efficiency of the core component 14 can only be passively reduced by software, which brings consumers a bad user experience. Moreover, the means of attaching graphite sheets or copper foils, in addition to the problem of cutting waste, attaching graphite sheets 20 or copper foil with high thermal conductivity materials by adhesive is inconvenient in the production because the housing is not a flat sheet but has arc edges or irregular shapes, and the adhesion is not very stable, resulting in poor product reliability, which in turn affects its heat dissipation performance and service life.

[0006] In addition, the inventor previously used electroplating, coating or spraying processes to make a heat dissipation coating on the housing. However, it was found that the use of electroplating, coating or spraying to make a heat dissipation coating on the housing, in addition to the problems mentioned above of attaching by adhesive, has a complex process and environmental issues, yield issues, and cost issues, so it is not perfect, so there is still room for improvement.

[0007] Therefore, in view of the above problems, the inventors have actively conceived how to conveniently and effectively combine the heat dissipation coating on the housing of the portable electronic device, which is the problem to be solved by the present invention. Summary of the invention

[0008] The main technical problem to be solved by the present invention is to overcome the above-mentioned defects of the prior art and provide a heat dissipation coating structure for the shell of a portable electronic device by transfer hot pressing, which has a compact pressed heat dissipation layer, thereby improving the thermal conductivity; it has the function of conveniently and effectively combining the heat dissipation coating inside the portable electronic device, achieving production automation and good heat dissipation coating combination quality; it has the function of dissipating the heat generated by the heat source of the portable electronic device through the heat dissipation coating structure, which is different from the method of attaching heat dissipation film on the market, overcoming the maximum heat dissipation area under the complex product structure, and then making the heat dissipated by the heat source such as the chip and the battery be evenly distributed in the entire cavity through the heat dissipation coating structure, and then heat exchange with the outside world, the relative core temperature is significantly reduced, and the problem of local overheating of the shell will not be caused, which can solve the heat dissipation problem of the portable electronic device.

[0009] The technical solution adopted by the present invention to solve the technical problem is:

[0010] A heat dissipation coating structure for a portable electronic device shell transfer hot pressing forming includes: a front shell and a rear shell suitable for the portable electronic device, wherein the front shell and the rear shell are correspondingly combined into a component, and predetermined electronic components are arranged in the cavities of the rear shell and the front shell, and on the top surface of the front shell, characterized in that: a high heat dissipation material is transferred on an unformed plasticized flat plate to form a printed flat plate with a heat dissipation coating; the printed flat plate is placed in a mold for heat pressing forming, heated to about 300-900 degrees Celsius, and after the printed flat plate is softened, it is thermoplastically formed through the mold, and pressure-maintaining and shaping is performed in the mold cavity to prevent rebound deformation; thus, a 3D front shell or rear shell is formed, and at the same time, the heat dissipation coating on the surface is hot pressed to form a heat dissipation coating structure combined with the front shell or the rear shell, and the heat dissipation coating structure is formed in the vertical direction of the shell surface to form a compact pressed heat dissipation layer, thereby improving the heat dissipation efficiency.

[0011] According to the above-mentioned features, the plasticized plate is a plastic plate or a glass plate made of one of plastic or glass materials.

[0012] According to the above-mentioned characteristics, the plasticized plate is made of any one of PC, PMMA, and plastic composite plate, which is heated to about 300 degrees Celsius by hot pressing in the mold.

[0013] According to the above-mentioned features, the glass plate is composed of a heat-pressable glass plate, which is heated to about 600-900 degrees Celsius by heat pressing in a mold.

[0014] The working principle of the present invention is as follows: the heat emitted by the chip heat source is evenly distributed in the entire cavity through the heat dissipation coating structure of the front shell, and then the heat dissipation coating structure of the rear shell exchanges heat with the outside world, which can significantly reduce the core temperature of the chip and will not cause the body to overheat or crash. The performance of the electronic equipment can be fully utilized to provide consumers with a better human-computer experience.

[0015] With the help of the above-mentioned technical means, the present invention overcomes the problem of combining products with complex structures. It has a densely organized heat dissipation coating structure (pressed heat dissipation layer), thereby improving the thermal conductivity and achieving the maximum heat dissipation area. That is to say, on a shell of the same area, the effective heat dissipation area of ​​the present invention is larger and more densely combined than the existing method of attaching graphite sheets; thereby solving the problem of heat dissipated by the heat source generated by the portable electronic device through the heat dissipation coating structure, and will not cause local overheating of the shell.

[0016] The beneficial effects of the present invention are that it has a compact pressed heat dissipation layer, thereby improving the thermal conductivity; it has the function of conveniently and effectively combining the heat dissipation coating inside the portable electronic device to achieve production automation and good heat dissipation coating combination quality; it has the function of dissipating the heat generated by the heat source of the portable electronic device through the heat dissipation coating structure, which is different from the market's method of attaching heat dissipation films, overcoming the maximum heat dissipation area under complex product structures, and then making the heat emitted by heat sources such as chips and batteries be evenly distributed in the entire cavity through the heat dissipation coating structure, and then heat exchange with the outside world, the relative core temperature is significantly reduced, and the problem of local overheating of the shell will not be caused, which can solve the heat dissipation problem of portable electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0018] Figure 1 The present invention is a structural decomposition diagram of a conventional portable electronic device.

[0019] Figure 2 It is a flow chart of the present invention.

[0020] Figure 3 It is a stereoscopic view of the unformed plasticized flat plate of the present invention.

[0021] Figure 4 It is a stereoscopic diagram of the unformed plasticized flat plate transfer heat dissipation coating of the present invention.

[0022] Figure 5A It is a schematic diagram of placing the printing plate of the present invention into a mold.

[0023] Figure 5B It is a schematic diagram of the hot pressing molding of the printing plate of the present invention in a mold.

[0024] Figure 6 It is a structural cross-sectional view of the heat dissipation coating structure formed by transfer and hot pressing of the rear shell of the present invention.

[0025] Fig. 6A It is a schematic diagram of the transfer hot pressing molding of the present invention to form a dense high-density pressed heat dissipation layer.

[0026] Figure 6B yes Figure 6 6B is an enlarged cross-sectional view.

[0027] Figure 7 It is a cross-sectional view of the front shell of the present invention.

[0028] Fig. 7A yes Figure 7 7A is an enlarged cross-sectional view.

[0029] Figure 8 It is a cross-sectional view of a preferred embodiment of the present invention.

[0030] Description of the numbers in the figure:

[0031] 10A Portable electronic devices

[0032] 11 Back cover

[0033] 12 Front shell

[0034] 13 Circuit Board

[0035] 14 Core Components

[0036] 15. Battery

[0037] 16 Display module

[0038] 17 Touch Panel

[0039] 18 Cavity

[0040] 19 Components

[0041] 20A Printed Plate

[0042] 21 Plasticizing plate

[0043] 22 High heat dissipation material

[0044] 22a Heat dissipation coating

[0045] 30 Heat dissipation coating structure

[0046] 30a Lamination heat dissipation layer

[0047] 40 Mould

[0048] 41 First Mold

[0049] 42 Second mold

[0050] 43 Cavity DETAILED DESCRIPTION

[0051] First, see Figure 8As shown, the shell transfer hot pressing forming heat dissipation coating structure of the portable electronic device 10A of the present invention includes a rear shell 11 combined with a front shell 12, and the front shell 12 and the rear shell 11 are correspondingly combined into a component 19, and a predetermined electronic component is provided in the cavity 18 of the rear shell 11 and the front shell 12, and on the top surface of the front shell 12. In this embodiment, the electronic component includes a circuit board 13 and a battery 15 arranged between the rear shell 11 and the front shell 12, and the circuit board 13 has a core component 14. The electronic component also includes a display module 16 and a touch panel 17 arranged on the top surface of the front shell 12. However, the above-mentioned structure is the main component of the portable electronic device, which belongs to the prior art (Prior Art) and is not the purpose of this patent, so it is not necessary to repeat it.

[0052] Then as Figure 2-Figure 8 As shown, the main features of the present invention are: a high heat dissipation material 22 is transferred onto an unformed plasticized flat plate 21 to form a printed flat plate 20A with a heat dissipation coating 22a; the printed flat plate 20A is placed in a mold 40 for hot pressing, the temperature varies depending on the material and thickness, the plastic flat plate is heated to about 300 degrees Celsius, and the glass flat plate is heated to about 300-900 degrees Celsius, after the printed flat plate 20A softens, it is thermoplastically formed through the mold 40, and pressure is maintained in the mold cavity to prevent rebound deformation; in this way, a 3D front shell 12 or rear shell 11 is formed, and at the same time, the heat dissipation coating 22a on the surface is hot pressed to form a heat dissipation coating structure 30 combined with the front shell 12 or rear shell 11, and the heat dissipation coating structure 30 forms a densely organized high-density pressed heat dissipation layer 30a in the vertical direction of the surface of the front shell 12 or rear shell 11, which has the effect of improving thermal conductivity.

[0053] In this embodiment, the high heat dissipation material 22 includes: a combination of bamboo charcoal, carbon tubes, various types of graphite, graphene microsheets, graphene, carbon balls, carbon fibers, boron nitride, aluminum nitride, mica, silicon dioxide, titanium dioxide, silicon carbide, zinc oxide, germanium oxide, thermally conductive metal particles (silver, copper, etc.); and a heat dissipation coating formed by mixing with a combination of thinner, ethyl acetate, anhydrous ethanol, alcohols, ketones, esters or distilled water or the aforementioned mixed solvents.

[0054] The present invention is to transfer a high heat dissipation material 22 onto an unformed plasticized plate 21 to form a printed plate 20A having a heat dissipation coating 22a; in this embodiment, the high heat dissipation material 22 is printed on the plasticized plate 21 by screen printing, gravure printing, etc., so that Figure 4 As shown, the heat dissipation coating 20a can be printed evenly on the surface of the plasticized plate 21.

[0055] In this embodiment, the hot pressing mold 40 includes a first mold 41 and a second mold 42, and a mold cavity 43 disposed between the first mold 41 and the second mold 42, wherein the mold cavity 43 is configured to match the shape of the front shell 12 or the rear shell 11, such as Figure 5A As shown, the printing plate 20A is first placed between the first mold 41 and the second mold 42, and then Figure 5B Thermoforming is performed as shown.

[0056] In this embodiment, the plasticized plate 21 is a plastic plate or a glass plate made of one of plastic or glass materials. If the plasticized plate 21 is a plastic plate, it may be made of any one of PC, PMMA, plastic composite plate, etc. According to the characteristics of the plastic plate material, it is heated to about 300 degrees Celsius in the mold 40 by hot pressing. Furthermore, if the plasticized plate 21 is a glass plate, it is made of a glass plate that can be hot-pressed and formed, and it is heated to about 600-900 degrees Celsius in the mold 40 by hot pressing.

[0057] The present invention uses the process forming principle of transfer hot pressing technology to form the heat dissipation coating structure 30. As far as the technical field of heat dissipation coating belongs to, in order to combine the "heat dissipation coating" with the front shell 12 or the back shell 11 of the portable electronic device which is extremely thin and irregular in appearance, many technical difficulties must be overcome, and it is not easy to complete by directly transferring or replacing the conventional means. Therefore, as far as the present invention is concerned, in order to combine the "heat dissipation coating" with the front shell 12 or the back shell 11 by transfer hot pressing molding, it is necessary to Figure 2 As shown, it includes at least several steps:

[0058] Step 1 (S1): providing an unformed plasticized plate 21; Figure 3 shown.

[0059] Step 2 (S2): a high heat dissipation material 22 is transferred onto the plasticized plate 21 to form a printed plate 20A having a heat dissipation coating 22a; Figure 4 shown.

[0060] Step 3 (S3): The printed plate 20A is placed in a mold 40 for hot pressing. The temperature varies depending on the material and thickness. The plastic plate is heated to about 300 degrees Celsius, and the glass plate is heated to about 600-900 degrees Celsius. After the printed plate 20A softens, it is thermoplastically formed by the mold 40, and the mold cavity 43 is pressure-maintained to prevent springback deformation. Figure 5A , Figure 5B shown.

[0061] Step 4 (S4): A 3D front shell 12 or rear shell 11 is formed, and the heat dissipation coating 22a on the surface is pressed by heat to form a heat dissipation coating structure 30 combined with the front shell 12 or rear shell 11, and the heat dissipation coating structure 30 is perpendicular to the surface of the front shell 12 or rear shell 11 (Z-axis direction) to form a compact pressed heat dissipation layer 30a. Figure 6-Figure 7 shown.

[0062] According to the above description, the present invention needs to transfer the "heat dissipation coating" to the front shell 12 or the rear shell 11 by hot pressing and molding, which must include at least the above four steps. One of the important steps is to use the mold 40 for hot pressing and molding. After the printed plate 20A is softened, it is thermoformed by the mold 40, and the mold cavity 43 is pressed and molded to prevent rebound deformation. In this way, not only the printed plate 20A is formed into the shape of the front shell 12 or the rear shell 11, but also during the hot pressing and molding, such as Figure 6A-6B As shown, the heat dissipation coating 22a is formed from the original higher thickness (t1) into a compact pressed heat dissipation layer 30a, that is, the higher thickness (t1) of the heat dissipation coating 22a originally transferred is hot pressed to form a compact pressed heat dissipation layer 30a with a lower thickness (t2). This is a heat dissipation coating 22a formed by transfer of the high heat dissipation material 22, which has the characteristics and advantages of being evenly distributed on the plasticized flat plate 21. However, due to the material characteristics of the heat dissipation coating 22a, it presents a loose structure. Therefore, the present invention first uses transfer technology to form a uniformly distributed heat dissipation coating 22a on the plasticized flat plate 21, and then, while using hot pressing molding, the uniformly distributed heat dissipation coating 22a is formed into a compact pressed heat dissipation layer 30a, so the two complement each other and have a good thermal conductivity effect.

[0063] In the technical solution of the present invention, the heat dissipation coating 20a is transferred and molded with the front shell 12 or the rear shell 11 to form a heat dissipation coating structure 30 (having a pressed heat dissipation layer 30a), such as Figure 6 or Figure 7 As shown, the heat dissipation coating structure 30 is formed with the front shell 12 and the rear shell 11 by transfer hot pressing, so its bonding is better than that of the prior art methods such as attachment or spraying. Compared with the prior art method of attaching graphite sheets or copper foils, the present invention overcomes the bonding problem under the complex product structure and achieves the maximum heat dissipation area. That is to say, on a shell with the same area, the effective heat dissipation area of ​​the present invention is larger than that of the prior art method of attaching graphite sheets or copper foils and has better adhesion.

[0064] The above-mentioned hot pressing molding of the present invention is based on the rear shell 11 as an embodiment, and its structure after molding is as follows Figure 6 As shown, but not limited to; Figure 7The front shell 12 is shown as an example. The shape of the front shell 12 is more irregular than that of the rear shell 11. However, the heat dissipation coating structure 30 formed by transfer hot pressing has the characteristics that the edge or corner position can achieve a perfect transfer hot pressing effect even at a small angle and a large depth. Its bonding is better than the existing technology methods such as attachment or spraying. Therefore, the present invention can be implemented in either the front shell 12 or the rear shell 11, and of course, the front shell 12 and the rear shell 11 can also be implemented at the same time.

[0065] Based on the above composition, Figure 8 As shown, the front shell 12 and the rear shell 11 form a heat dissipation system corresponding to each other, and the heat dissipation coating structure 30 (with a pressed heat dissipation layer 30a) of the front shell 12 evenly distributes the heat in the entire cavity 18, and then the heat dissipation coating structure 30 of the rear shell 11 exchanges heat with the outside world. Therefore, the waste heat generated by the heat source of the electronic component (such as the core component 14, the battery 15) during operation is not only dissipated by the heat dissipation coating structure 30 located in the rear shell 11, but also evenly distributed on the housing composed of the rear shell 11 and the front shell 12 by the heat dissipation coating structure 30 located in the front shell 12, so that the local temperature around the heat source of the electronic component (such as the core component 14, the battery 15) is reduced, so that the waste heat can be efficiently conducted to the outside, and has a significant heat dissipation effect. Therefore, compared with the prior art, the present invention does have unexpected technical effects and possesses inventive creativity.

[0066] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any simple modification, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

[0067] In summary, the present invention fully meets the needs of industrial development in terms of structural design, practicality and cost-effectiveness, and the disclosed structure also has an unprecedented innovative structure with novelty, creativity and practicality, which meets the requirements of relevant invention patents, so an application is filed in accordance with the law.

Claims

1. A heat dissipation coating structure for a portable electronic device shell by transfer printing and hot pressing, comprising: A front shell and a rear shell suitable for a portable electronic device, wherein the front shell and the rear shell are correspondingly combined into a component, and predetermined electronic components are arranged in the cavity of the rear shell and the front shell, and on the top surface of the front shell, characterized in that: A high heat dissipation material is transferred onto an unformed plasticized plate to form a printed plate with a heat dissipation coating; the printed plate is placed in a mold for hot pressing and heated to about 300-900 degrees Celsius. After the printed plate softens, it is thermoplastically formed through the mold, and pressure is maintained in the mold cavity to prevent springback deformation; thus, a 3D front shell or rear shell is formed, and at the same time, the heat dissipation coating on the surface is hot pressed to form a heat dissipation coating structure attached to the front shell or rear shell, and the heat dissipation coating structure is perpendicular to the surface of the shell to form a compact pressed heat dissipation layer.

2. The heat dissipation coating structure for a portable electronic device shell transfer hot pressing molding according to claim 1, characterized in that: The mold comprises a first mold and a second mold, and a mold cavity arranged between the first mold and the second mold, and the mold cavity is formed to match the shape of the front shell or the rear shell.

3. The heat dissipation coating structure for the housing of a portable electronic device according to claim 1 or 2, characterized in that: The plasticized flat plate is a plastic flat plate or a glass flat plate made of one of plastic or glass materials.

4. The heat dissipation coating structure for the housing of a portable electronic device according to claim 3, characterized in that: The plasticized plate is made of any one of PC, PMMA and plastic composite plate, and is heated to about 300 degrees Celsius in a mold by hot pressing.

5. The heat dissipation coating structure for the housing of a portable electronic device according to claim 3, characterized in that: The glass flat plate is composed of a glass plate that can be hot-pressed and is heated to about 600-900 degrees Celsius in a mold by hot pressing.

6. The heat dissipation coating structure for a portable electronic device housing transfer hot pressing molding according to claim 1, characterized in that: The high heat dissipation material includes: a combination of bamboo charcoal, carbon tubes, various types of graphite, graphene microsheets, graphene, carbon balls, carbon fibers, boron nitride, aluminum nitride, mica, silicon dioxide, titanium dioxide, silicon carbide, zinc oxide, germanium oxide, and thermally conductive metal particles; and a heat dissipation coating mixed with a combination of thinner, ethyl acetate, anhydrous ethanol, alcohols, ketones, esters, or distilled water or the aforementioned mixed solvents.

Images