Substrate processing equipment

Abstract

This invention provides a substrate processing apparatus. It suppresses the generation of particulate matter while limiting the movement of a cover caused by the internal pressure of the processing space. The substrate processing apparatus of this embodiment is a substrate processing apparatus that processes substrates under high pressure, and includes a pressure vessel, a cover, and a locking mechanism. The pressure vessel has an opening. The cover seals the opening. The locking mechanism limits the movement of the cover in the opening direction caused by the internal pressure of the pressure vessel. Furthermore, the locking mechanism includes an abutting member, a moving mechanism, and a rolling member. The abutting member abuts against a side of one of the plurality of surfaces of the cover that is opposite to the sealing surface. The moving mechanism moves the abutting member in a direction along the abutting surface. The rolling member is provided on the abutting surface of the abutting member that abuts against the cover or the pressure vessel.

Description

Technical Field

[0001] The disclosed embodiments relate to a substrate processing apparatus for removing liquid attached to a surface of a substrate using a processing fluid in a supercritical state. Background Art

[0002] Conventionally, there is known a supercritical drying process in which, after the surface of a substrate such as a semiconductor wafer is treated with a liquid, the substrate, whose surface is wetted by the liquid, is brought into contact with a supercritical fluid to dry the substrate.

[0003] The supercritical drying process is performed under a high-pressure environment. Therefore, in some cases, a substrate processing apparatus that performs the supercritical drying process is provided with a locking mechanism for preventing the lid of the pressure container from moving due to the internal pressure of the pressure container.

[0004] For example, Patent Document 1 discloses a locking mechanism that, after closing the opening of a pressure container with a cover, moves a locking plate to abut against the cover, thereby restricting movement of the cover caused by the internal pressure of the pressure container.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2013-131729 Summary of the invention

[0008] Problem that the invention aims to solve

[0009] However, in the above-mentioned prior art, when the locking plate is moved to contact the cover, the cover or the pressure container and the locking plate may rub against each other and generate particles. This problem is a common problem of substrate processing devices that process substrates under high pressure environments, and the processing performed under high pressure environments is not limited to supercritical drying processing.

[0010] An object of one aspect of the embodiment is to provide a substrate processing apparatus capable of suppressing generation of particles while limiting movement of a cover body caused by internal pressure of a processing space.

[0011] Solutions for solving problems

[0012] A substrate processing device in one form of an embodiment is a substrate processing device that processes a substrate under a high-pressure environment, and is provided with a pressure container, a cover body, and a locking mechanism. The pressure container has an opening. The cover body blocks the opening. The locking mechanism limits the movement of the cover body in the opening direction caused by the internal pressure of the pressure container. In addition, the locking mechanism includes an abutment member, a moving mechanism, and a rolling member. The abutment member abuts against an abutted surface that is a surface on the side opposite to the sealing surface among a plurality of surfaces of the cover body. The moving mechanism moves the abutment member in a direction along the abutted surface. The rolling member is provided on the abutment surface of the abutment member that abuts against the cover body or the pressure container.

[0013] Effects of the Invention

[0014] According to one aspect of the embodiment, it is possible to suppress the generation of particles while restricting the movement of the cover body due to the internal pressure of the pressure container. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic cross-sectional view of the substrate processing system according to the embodiment as viewed from above.

[0016] Figure 2 The flowchart shows the sequence of a series of substrate processing executed in the substrate processing system according to the embodiment.

[0017] Figure 3 It is a diagram showing a configuration example of a liquid processing unit.

[0018] Figure 4 It is a schematic perspective view showing a structural example of a drying unit.

[0019] Figure 5A is a schematic cross-sectional view of the junction area.

[0020] Figure 5B is a schematic cross-sectional view of the junction area.

[0021] Figure 6 It is a schematic cross-sectional view showing a structural example of a locking mechanism.

[0022] Fig. 7A This is a diagram illustrating the operation of the locking mechanism.

[0023] Figure 7B This is a diagram illustrating the operation of the locking mechanism.

[0024] Figure 7C This is a diagram illustrating the operation of the locking mechanism.

[0025] Fig.7D This is a diagram illustrating the operation of the locking mechanism.

[0026] Fig. 8AIt is a diagram showing a configuration example of a lock mechanism according to a modified example.

[0027] Figure 8B It is a diagram showing a configuration example of a lock mechanism according to a modified example.

[0028] Description of Reference Numerals

[0029] W, wafer; 1, substrate processing system; 4, conveying module; 5, processing module; 18, drying unit; 31, processing container; 31a, processing space; 31b, opening; 31e, first through hole; 31f, second through hole; 33, cover body; 42, locking member; 42a, cover body side abutment surface; 42b, through hole side abutment surface; 43, lifting mechanism; 45a, 45b, rolling member; 46a, 46b, recessed portion; 47a, 47b, force-applying member; 50, locking mechanism. DETAILED DESCRIPTION

[0030] Hereinafter, the form of the substrate processing device for implementing the present application (hereinafter referred to as "embodiment") is described in detail with reference to the accompanying drawings. In addition, the substrate processing device of the present application is not limited to the embodiment. In addition, each embodiment can be appropriately combined within the scope that the processing content is not contradictory. In addition, in each of the following embodiments, the same reference numerals are marked on the same parts, and repeated descriptions are omitted.

[0031] 〔1. Structure of substrate processing system〕

[0032] First, refer to Figure 1 The configuration of the substrate processing system according to the embodiment will be described. Figure 1 This is a schematic cross-sectional view of the substrate processing system according to the embodiment as viewed from above. In addition, in order to make the positional relationship clear, mutually orthogonal X-axis, Y-axis and Z-axis are defined below, and the positive direction of the Z-axis is set as the vertical upward direction.

[0033] like Figure 1 As shown, the substrate processing system 1 includes an import / export station 2 and a processing station 3. The import / export station 2 and the processing station 3 are disposed adjacent to each other.

[0034] (For input / output station 2)

[0035] The loading / unloading station 2 includes a carrier placement unit 11 and a conveying unit 12. A plurality of carriers C for accommodating a plurality of semiconductor wafers W (hereinafter referred to as "wafers W") in a horizontal state are placed on the carrier placement unit 11.

[0036] The conveying section 12 is provided adjacent to the carrier placing section 11. Inside the conveying section 12, a conveying device 13 and a delivery section 14 are arranged.

[0037] The transport device 13 includes a wafer holding mechanism for holding the wafer W. The transport device 13 can move in the horizontal and vertical directions and rotate about a vertical axis, and transports the wafer W between the carrier C and the delivery unit 14 using the wafer holding mechanism.

[0038] (For processing station 3)

[0039] The processing station 3 is provided adjacent to the conveying unit 12. The processing station 3 includes a conveying module 4 and a plurality of processing modules 5.

[0040] (For conveying module 4)

[0041] The transport module 4 includes a transport area 15 and a transport device 16. The transport area 15 is, for example, a rectangular parallelepiped area extending along the arrangement direction (X-axis direction) of the input / output station 2 and the processing station 3. The transport device 16 is disposed in the transport area 15.

[0042] The transport device 16 includes a wafer holding mechanism for holding the wafer W. The transport device 16 can move in the horizontal and vertical directions and rotate about a vertical axis, and transports the wafer W between the delivery unit 14 and the plurality of processing modules 5 using the wafer holding mechanism.

[0043] The plurality of processing modules 5 are arranged adjacent to the conveying area 15 on both sides of the conveying area 15. Specifically, the plurality of processing modules 5 are arranged on one side (positive Y-axis side) and the other side (negative Y-axis side) of the conveying area 15 in a direction (Y-axis direction) orthogonal to the arrangement direction (X-axis direction) of the input / output station 2 and the processing station 3.

[0044] Each processing module 5 includes a liquid processing unit 17 , a drying unit 18 , and a supply unit 19 .

[0045] The liquid processing unit 17 performs a cleaning process for cleaning the upper surface of the wafer W as the pattern formation surface. In addition, the liquid processing unit 17 performs a liquid film forming process for forming a liquid film on the upper surface of the wafer W after the cleaning process. The structure of the liquid processing unit 17 will be described below.

[0046] The drying unit 18 performs supercritical drying on the wafer W after the liquid film forming process. Specifically, the drying unit 18 dries the wafer W by bringing the wafer W after the liquid film forming process into contact with the processing fluid in a supercritical state. The structure of the drying unit 18 will be described later.

[0047] The supply unit 19 supplies the treatment fluid to the drying unit 18. Specifically, the supply unit 19 includes: a supply device group including a flow meter, a flow regulator, a back pressure valve, a heater, etc.; and a housing that accommodates the supply device group. In this embodiment, the supply unit 19 supplies CO2 as the treatment fluid to the drying unit 18.

[0048] The liquid processing unit 17, the drying unit 18, and the supply unit 19 are arranged along the conveying area 15 (i.e., along the X-axis direction). Among the liquid processing unit 17, the drying unit 18, and the supply unit 19, the liquid processing unit 17 is arranged at a position closest to the input / output station 2, and the supply unit 19 is arranged at a position farthest from the input / output station 2.

[0049] The drying unit 18 includes a processing area 181 for performing supercritical drying and a delivery area 182 for delivering wafers W between the transfer module 4 and the processing area 181 . The processing area 181 and the delivery area 182 are arranged along the transfer area 15 .

[0050] Specifically, of the processing area 181 and the delivery area 182, the delivery area 182 is arranged on the side closer to the liquid processing unit 17 than the processing area 181. That is, in each processing module 5, the liquid processing unit 17, the delivery area 182, the processing area 181, and the supply unit 19 are arranged along the transport area 15 in this order.

[0051] (For control device 6)

[0052] The substrate processing system 1 includes a control device 6 . The control device 6 is, for example, a computer, and includes a control unit 61 and a storage unit 62 .

[0053] The control unit 61 includes a microcomputer and various circuits including a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), an input / output port, etc. The CPU of the microcomputer reads out and executes a program stored in the ROM to control the conveying devices 13 and 16, the liquid processing unit 17, the drying unit 18, and the supply unit 19.

[0054] The program may be recorded on a computer-readable recording medium or installed from the recording medium to the storage unit 62 of the control device 6. Examples of the computer-readable recording medium include a hard disk (HD), a floppy disk (FD), a compact disk (CD), a magneto-optical disk (MO), and a memory card.

[0055] The storage unit 62 can be implemented by, for example, a semiconductor memory element such as a RAM or a flash memory, or a storage device such as a hard disk or an optical disk.

[0056] 〔2. Substrate processing flow〕

[0057] Next, refer to Figure 2 and Figure 3 A flow of a series of substrate processing in the above-mentioned substrate processing system 1 will be described. Figure 2 1 is a flowchart showing the sequence of a series of substrate processing performed in the substrate processing system 1 of the embodiment. Figure 2 The series of substrate processing shown is performed under the control of the control unit 61 .

[0058] like Figure 2 As shown, in the substrate processing system 1, first, an input process is performed (step S101). In the input process, the conveying device 13 (see Figure 1 ) takes out the wafer W from the carrier C and places it on the delivery section 14. Next, the transport device 16 (see Figure 1 ) takes out the wafer W from the delivery section 14 and inputs it into the liquid processing unit 17.

[0059] Next, in the substrate processing system 1, the liquid processing unit 17 performs a cleaning process (step S102). The liquid processing unit 17 removes particles, natural oxide films, etc. from the upper surface of the wafer W by supplying various processing liquids to the upper surface of the wafer W as the pattern formation surface.

[0060] Next, in the substrate processing system 1, a liquid film forming process is performed in the liquid processing unit 17 (step S103). The liquid processing unit 17 forms a liquid film of the IPA liquid on the upper surface of the wafer W by supplying liquid IPA (hereinafter referred to as "IPA liquid") to the upper surface of the wafer W after the cleaning process.

[0061] After the wafer W after the liquid film forming process is transported by the transport device 16 to the handover area 182 of the drying unit 18 disposed in the same processing module 5, it is transported from the handover area 182 to the processing area 181. Thereafter, in the substrate processing system 1, a supercritical drying process is performed in the processing area 181 (step S104). In the supercritical drying process, the drying unit 18 dries the wafer W after the liquid film forming process by bringing the wafer W after the liquid film forming process into contact with the processing fluid in a supercritical state.

[0062] Next, in the substrate processing system 1, an output process is performed (step S105). In the output process, first, the wafer W after the supercritical drying process is transported from the processing area 181 to the delivery area 182. After that, the transport device 16 takes out the wafer W after the supercritical drying process from the delivery area 182 and transports it to the delivery portion 14. After that, the transport device 13 takes out the wafer W after the supercritical drying process from the delivery portion 14 and transports it to the carrier C. If the output process is completed, a series of substrate processes for one wafer W are completed.

[0063] [3. Structure of liquid processing unit]

[0064] Next, refer to Figure 3 The structure of the liquid processing unit 17 will be described. Figure 3 1 is a diagram showing a configuration example of the liquid processing unit 17. The liquid processing unit 17 is configured as a single-wafer cleaning device that cleans wafers W one by one by spin cleaning, for example.

[0065] like Figure 3 As shown, the liquid processing unit 17 holds the wafer W substantially horizontally by using a wafer holding mechanism 25 disposed in an outer chamber 23 forming a processing space, and rotates the wafer holding mechanism 25 around a vertical axis to rotate the wafer W. In addition, the liquid processing unit 17 causes the nozzle arm 26 to enter above the rotating wafer W, and supplies the chemical solution and the rinse liquid in a predetermined order from the chemical solution nozzle 26a provided at the top end of the nozzle arm 26, thereby performing a cleaning process on the upper surface of the wafer W.

[0066] In the liquid processing unit 17, a chemical solution supply path 25a is also formed inside the wafer holding mechanism 25. The lower surface of the wafer W is also cleaned by the chemical solution or the rinse liquid supplied from the chemical solution supply path 25a.

[0067] In the cleaning process, for example, SC1 solution (a mixture of ammonia and hydrogen peroxide) as an alkaline chemical solution is first used to remove particulates and organic pollutants, and then deionized water (hereinafter referred to as "DIW") is used as a rinse solution to perform rinsing cleaning. Then, a natural oxide film is removed using a dilute hydrofluoric acid solution (hereinafter referred to as "DHF") as an acidic chemical solution, and then DIW is used to perform rinsing cleaning.

[0068] The various chemical solutions are received by the outer chamber 23 and the inner cup 24 disposed in the outer chamber 23, and are discharged from the drain port 23a provided at the bottom of the outer chamber 23 and the drain port 24a provided at the bottom of the inner cup 24. In addition, the atmosphere in the outer chamber 23 is exhausted from the exhaust port 23b provided at the bottom of the outer chamber 23.

[0069] The liquid film forming process is performed after the rinsing process in the cleaning process. Specifically, the liquid processing unit 17 rotates the wafer holding mechanism 25 while supplying IPA liquid to the upper and lower surfaces of the wafer W. As a result, the DIW remaining on both sides of the wafer W is replaced with IPA. Afterwards, the liquid processing unit 17 gently stops the rotation of the wafer holding mechanism 25.

[0070] The wafer W after the liquid film forming process is held with the liquid film of the IPA liquid formed on its upper surface, and is handed over to the conveying device 16 by a handover mechanism (not shown) provided to the wafer holding mechanism 25, and is output from the liquid processing unit 17. The liquid film formed on the wafer W is prevented from falling down due to evaporation (gasification) of the liquid on the upper surface of the wafer W during the transportation of the wafer W from the liquid processing unit 17 to the drying unit 18 and during the input operation to the drying unit 18.

[0071] 〔4. Structure of drying unit〕

[0072] Next, refer to Figure 4 The structure of the drying unit 18 will be described. Figure 4 It is a schematic perspective view showing a structural example of the drying unit 18 .

[0073] like Figure 4 As shown, the drying unit 18 includes a processing container 31 , a holding body 32 , and a cover body 33 .

[0074] The processing container 31 is a pressure container capable of forming a high pressure environment of, for example, 16 MPa to 20 MPa. The processing container 31 is disposed in the processing area 181 (see Figure 1 ), the supercritical drying process is performed in the processing space 31a inside the processing container 31. A portion is formed on the side of the processing container 31 facing the interface area 182 to separate the processing space 31a and the interface area 182 (see Figure 1 ) opening 31b connected.

[0075] The holding body 32 holds the wafer W in the horizontal direction. The cover body 33 supports the holding body 32. The cover body 33 is connected to a moving mechanism (not shown) and moves horizontally between the processing area 181 and the delivery area 182 together with the holding body 32 by the moving mechanism. By moving to the processing area 181, the holding body 32 is arranged in the processing space 31a of the processing container 31, and the cover body 33 blocks the opening 31b of the processing space 31a.

[0076] The processing container 31 is provided with a supply unit 35 and a discharge unit 37. The supply unit 35 is connected to a supply pipe 101 through which a processing fluid supplied to the processing space 31a flows. The supply pipe 101 is connected to a supply device group of the supply unit 19. The discharge unit 37 is connected to a separate exhaust pipe 102 through which a processing fluid discharged from the processing space 31a flows.

[0077] The supply unit 35 is provided on the side surface of the processing container 31 opposite to the side where the opening 31b is formed. In addition, the discharge unit 37 is provided on the bottom surface of the processing container 31. Figure 4 , one supply unit 35 and one discharge unit 37 are respectively shown, but the number of the supply units 35 and the discharge units 37 is not particularly limited.

[0078] The processing space 31a is provided with a supply manifold 38 and a discharge manifold 40. The supply manifold 38 is connected to the supply unit 35 to supply the processing fluid to the processing space 31a. The discharge manifold 40 is connected to the discharge unit 37 to discharge the processing fluid from the processing space 31a.

[0079] The supply header 38 is provided with a plurality of supply ports 38a along the length direction (Y-axis direction) of the supply header 38. The plurality of supply ports 38a are open toward the opening 31b. The discharge header 40 is provided with a plurality of discharge ports 40a along the length direction (Y-axis direction) of the discharge header 40. The plurality of discharge ports 40a are open upward.

[0080] The drying unit 18 supplies the treatment fluid to the treatment space 31a from the multiple supply ports 38a of the supply manifold 38, and discharges the treatment fluid in the treatment space 31a through the multiple discharge ports 40a of the discharge manifold 40. A regulating valve for adjusting the discharge amount of the treatment fluid from the treatment space 31a is provided in the discharge path of the treatment fluid, and the discharge amount of the treatment fluid is adjusted by the regulating valve so that the pressure in the treatment space 31a is adjusted to the desired pressure. Thus, the supercritical state of the treatment fluid is maintained in the treatment space 31a. Hereinafter, the treatment fluid in the supercritical state is recorded as "supercritical fluid".

[0081] In the processing space 31a, a laminar flow of the supercritical fluid flowing in a predetermined direction is formed around the wafer W. The laminar flow of the supercritical fluid flows, for example, from the supply manifold 38 above the wafer W along the upper surface of the wafer W toward the upper portion of the opening 31b. Furthermore, the laminar flow of the supercritical fluid changes its direction to the downward side above the opening 31b, passes near the opening 31b, and flows toward the exhaust manifold 40.

[0082] In this laminar flow example, inside the processing space 31 a , a laminar flow of the supercritical fluid passes through an opening 32 a formed between the wafer W and the cover 33 in the holder 32 .

[0083] The IPA liquid on the pattern forming surface (upper surface) of the wafer W gradually dissolves in the supercritical fluid by contacting the supercritical fluid under high pressure (eg, 16 MPa), and is eventually replaced by the supercritical fluid. Thus, the gaps between the patterns are filled with the supercritical fluid.

[0084] Thereafter, the drying unit 18 reduces the pressure of the processing space 31a from the high pressure state to the atmospheric pressure, thereby causing the supercritical fluid that has filled the gaps between the patterns to change into a normal processing fluid, that is, a gas state.

[0085] In this manner, the drying unit 18 replaces the IPA liquid on the pattern forming surface with the supercritical fluid and then returns the supercritical fluid to a processing fluid in a gas state, thereby removing the IPA liquid from the pattern forming surface and drying the pattern forming surface.

[0086] The viscosity of supercritical fluid is lower than that of liquid (such as IPA liquid), and the ability to dissolve liquid is also high. In addition, there is no interface between supercritical fluid and liquid or gas in equilibrium. Therefore, by performing supercritical drying treatment, the liquid can be dried without being affected by surface tension. In other words, the pattern can be suppressed from falling during the drying process.

[0087] In addition, in the embodiment, IPA liquid is used as the liquid for preventing drying, and CO2 is used as the processing fluid, but a liquid other than IPA can be used as the liquid for preventing drying, and a fluid other than CO2 can be used as the processing fluid.

[0088] like Figure 4 As shown, the processing container 31 includes a first protrusion 31c and a second protrusion 31d that protrude toward the cover opening direction side (here, the negative direction side of the X axis) relative to the opening 31b. The first protrusion 31c protrudes from the lower part of the opening 31b toward the negative direction side of the X axis, and the second protrusion 31d protrudes from the upper part of the opening 31b toward the negative direction side of the X axis.

[0089] The first protrusion 31c is formed with a plurality of (here, two) first through holes 31e that communicate the upper surface and the lower surface of the first protrusion 31c. In addition, the second protrusion 31d is formed with a plurality of (here, two) second through holes 31f that communicate the upper surface and the lower surface of the second protrusion 31d at positions respectively opposite to the plurality of first through holes 31e.

[0090] The drying unit 18 includes a plurality of (two in this example) locking members 42 (an example of a contact member). The locking members 42 are respectively inserted into a plurality of first through holes 31 e formed in the first protruding portion 31 c.

[0091] Here, refer to Figure 5A and Figure 5B The operation of the locking member 42 will be described. Figure 5A and Figure 5B is a schematic cross-sectional view of the interface region 182. In addition, Figure 5A It shows the state where the retaining body 32 and the cover body 33 are arranged in the junction area 182. Figure 5B The state in which the holding body 32 and the cover body 33 are arranged in the processing area 181 is shown.

[0092] like Figure 5A As shown, the lock member 42 is connected to a lifting mechanism 43 (an example of a moving mechanism) for lifting the lock member 42 .

[0093] like Figure 5B As shown, the drying unit 18 first uses a moving mechanism (not shown) to move the holding body 32 and the cover 33, and seals the processing space 31a using the cover 33. Thereafter, the drying unit 18 uses the lifting mechanism 43 to raise the locking member 42, and sets the locking member 42 to a state where it penetrates the second through hole 31f formed in the second protrusion 31d.

[0094] The locking member 42 presses the cover 33 toward the processing space 31a against the internal pressure of the supercritical fluid supplied to the processing space 31a. Thus, the processing space 31a can be kept sealed by the cover 33.

[0095] [5. Structure of the locking mechanism]

[0096] Reference Figure 6 The specific structure of the lock mechanism including the lock member 42 and the lifting mechanism 43 will be described. Figure 6 It is a schematic cross-sectional view showing a structural example of a locking mechanism.

[0097] like Figure 6 As shown, the locking mechanism 50 includes the above-mentioned locking member 42 and the lifting mechanism 43 , and uses the locking member 42 to restrict the movement of the cover 33 in the opening direction (X-axis negative direction) caused by the internal pressure of the processing container 31 .

[0098] The lifting mechanism 43 includes: a support portion 43a that supports the locking member 42 from below; and a lifting portion 43b that moves the support portion 43a in the vertical direction (Z-axis direction). In addition, the lifting mechanism 43 includes a connecting portion 43c that connects the support portion 43a and the locking member 42. The connecting portion 43c has, for example, a suspended structure, and connects the locking member 42 so that it can swing relative to the support portion 43a.

[0099] When the locking member 42 is lifted in the vertical direction by the lifting mechanism 43, it passes through the vicinity of the inner surfaces 31e1 and 31e2 of the first through hole 31e, the abutted surface 33a which is the surface on the side opposite to the sealing surface among the multiple surfaces of the cover body 33, and the inner surfaces 31f1 and 31f2 of the second through hole 31f. In addition, the sealing surface is the surface on the processing space 31a side among the multiple surfaces of the cover body 33, that is, the surface that seals the processing space 31a.

[0100] The abutted surface 33a of the cover body 33 is a plane along the vertical direction, that is, a vertical surface. Similarly, the inner surfaces 31e1, 31e2 of the first through hole 31e and the inner surfaces 31f1, 31f2 of the second through hole 31f are also vertical surfaces. In addition, hereinafter, the inner surfaces 31e1, 31f1 are described as the first inner surfaces 31e1, 31e2, and the inner surfaces 31e2, 31f2 are described as the second inner surfaces 31e2, 31e2.

[0101] The processing container 31, the cover 33, and the locking member 42 are made of metal. Therefore, when the locking member 42 is raised or lowered, the processing container 31, the cover 33, or the locking member 42 may be cut due to friction between the cover 33 or the processing container 31 and the locking member 42, thereby possibly generating particles.

[0102] Therefore, in the locking mechanism 50 of the embodiment, rolling members 45a and 45b are provided on the abutting surface of the locking member 42 that abuts against the cover 33 or the processing container 31. When the locking member 42 is raised or lowered, the rolling members 45a and 45b provided to the locking member 42 abut against the cover 33 or the processing container 31 instead of the locking member 42, so that "friction" can be suppressed and the generation of particles can be reduced.

[0103] The rolling members 45a and 45b are, for example, balls or rollers made of resin. The rolling member 45a is provided on a cover body side contact surface 42a which is a contact surface with the contacted surface 33a of the cover body 33 among the multiple surfaces of the lock member 42 .

[0104] Specifically, a recessed portion 46 a is formed on the cover-side contact surface 42 a of the lock member 42 , and the rolling member 45 a is accommodated in the recessed portion 46 a .

[0105] An urging member 47a is provided in the recessed portion 46a. The urging member 47a is, for example, a coil spring or a leaf spring, and urges the rolling member 45a toward the outside of the recessed portion 46a.

[0106] The rolling member 45a is accommodated in the recessed portion 46a in a state where a part of the rolling member 45a protrudes from the recessed portion 46a due to the urging force of the urging member 47a.

[0107] In addition, the rolling member 45b is arranged on a surface on the side opposite to the cover body side abutment surface 42a among the multiple surfaces of the locking member 42, and serves as a through-hole side abutment surface 42b that abuts against the first inner surface 31e1 of the first through-hole 31e and the first inner surface 31f1 of the second through-hole 31f.

[0108] Specifically, a recessed portion 46 b is formed on the through-hole side contact surface 42 b of the lock member 42 , and the rolling member 45 b is accommodated in the recessed portion 46 b .

[0109] An urging member 47b is provided in the recessed portion 46b. The urging member 47b is, for example, a coil spring or a leaf spring, and urges the rolling member 45b toward the outside of the recessed portion 46b.

[0110] The rolling member 45b is accommodated in the recessed portion 46b in a state where a part of the rolling member 45b protrudes from the recessed portion 46b due to the urging force of the urging member 47b.

[0111] The openings of the recesses 46a and 46b may be slightly smaller than the rolling member 45a so that the rolling members 45a and 45b urged by the urging members 47a and 47b do not fly out of the recesses 46a and 46b. The rolling members 45a and 45b are rotatably accommodated in the recesses 46a and 46b.

[0112] In addition, if Figure 6 As shown, the through-hole side contact surface 42b is inclined in a direction (X-axis positive direction) opposite to the opening direction of the cover body 33 relative to the moving direction (Z-axis direction) of the locking member 42 by the lifting mechanism 43 when the locking member 42 is not in contact with the cover body 33 and the processing container 31. The rolling member 45b, the recessed portion 46b and the biasing member 47b are formed on the upper portion of the through-hole side contact surface 42b.

[0113] In addition, the cover body side contact surface 42a includes a first surface 42a1 parallel to the through hole side contact surface 42b and a second surface 42a2 connected to the first surface 42a1. The second surface 42a2 is located at a position closer to the top end side of the locking direction than the first surface 42a1 in the locking direction (Z-axis positive direction) in which the locking member 42 in a state of not contacting the cover body 33 and the processing container 31 is moved in a direction of contacting the cover body 33 in the moving direction (Z-axis direction) of the locking member 42 by the lifting mechanism 43. Specifically, in the present embodiment, the second surface 42a2 is connected to the second surface 42a2 at a position higher than the first surface 42a1. The second surface 42a2 is inclined toward the opening direction (X-axis negative direction) of the cover body 33 relative to the moving direction (Z-axis direction) of the locking member 42 by the lifting mechanism 43 when the cover body side contact surface 42a is not contacting the cover body 33 and the processing container 31.

[0114] The rolling member 45 a , the recessed portion 46 a , and the urging member 47 a are provided at a boundary portion between the first surface 42 a 1 and the second surface 42 a 2 in the cover-side contact surface 42 a .

[0115] Furthermore, resin members 48a and 48b are provided at the upper end of the second surface 42a2 and the lower end of the through-hole side contact surface 42b, respectively.

[0116] [6. Action of the locking mechanism]

[0117] Next, refer to Figure 7A to Figure 7D Next, the operation of the above-mentioned locking mechanism 50 will be described. Figure 7A to Figure 7D 1 is an operation diagram for explaining the locking mechanism 50. The drying unit 18 executes the operation according to the control of the control unit 61. Figure 7A to Figure 7D Action shown.

[0118] In a state where the locking member 42 is not in contact with the cover 33 and the processing container 31 ( Figure 6 In the state shown in FIG. 1 , the rolling member 45a provided on the cover body side contact surface 42a protrudes to the maximum extent toward the contacted surface 33a of the cover body 33 and the second inner surface 31e2, 31f2 of the processing container 31. Fig. 7A As shown, by raising the lock member 42 by the lifting mechanism 43, first, the rolling member 45a comes into contact with the processing container 31. Specifically, the rolling member 45a comes into contact with the second inner surface 31e2 of the first through hole 31e.

[0119] Afterwards, if Figure 7B As shown, the rolling member 45a contacts the second inner surface 31e2 of the first through hole 31e, and the locking member 42 rises. At this time, the rolling member 45a receives resistance in the cover opening direction (negative direction of the X axis) from the second inner surface 31e2, and the locking member 42 starts to stand up.

[0120] Next, if Figure 7C As shown in FIG. 1 , if the locking member 42 is further raised, the rolling member 45a contacts the abutted surface 33a of the cover body 33. In addition, as the locking member 42 is further raised, the rolling member 45b provided on the through-hole side abutting surface 42b contacts the first inner surface 31f1 of the second through-hole 31f. In this state, the first surface 42a1 of the cover side abutting surface 42a and the through-hole side abutting surface 42b form a plane along the vertical direction, that is, a vertical plane.

[0121] Afterwards, if supercritical drying is started, Fig.7D As shown, the cover 33 moves in the cover opening direction (negative direction of the X axis) due to the internal pressure of the processing container 31. At this time, the rolling member 45a is pushed by the cover 33, and the rolling member 45a overcomes the force of the force member 47a and moves in the cover opening direction (negative direction of the X axis), so that it is completely accommodated in the recess 46a. As a result, the cover side contact surface 42a of the locking member 42 abuts against the abutted surface 33a of the cover 33. Similarly, the rolling member 45b overcomes the force of the force member 47b and moves in the cover opening direction (negative direction of the X axis), so that it is completely accommodated in the recess 46b. As a result, the through hole side contact surface 42b of the locking member 42 abuts against the first inner surface 31e1 of the first through hole 31e and the first inner surface 31f1 of the second through hole 31f. As a result, the movement of the cover 33 in the cover opening direction caused by the internal pressure of the processing container 31 is limited by the locking mechanism 50.

[0122] On the other hand, when the supercritical drying process is completed and the internal pressure of the process container 31 decreases, the rolling member 45a protrudes toward the outside of the recess 46a due to the force of the force member 47a, and the rolling member 45b protrudes toward the outside of the recess 46b due to the force of the force member 47b. Figure 7C Status shown.

[0123] Then, as the locking member 42 descends, the rolling member 45a contacts the contacted surface 33a of the cover 33 and the second inner surface 31e2 of the processing container 31, and the rolling member 45b contacts the first inner surface 31f1 of the processing container 31 while rolling down. Then, the locking mechanism 50 returns to the original position. Figure 6 Status shown.

[0124] Thus, the locking mechanism 50 of the embodiment is provided with a rolling member 45a on the cover body side contact surface 42a in the locking member 42. The rolling member 45a rolls as the locking member 42 rises, in other words, contacts the second inner surface 31e2 without generating friction. Therefore, according to the locking mechanism 50 of the embodiment, the generation of particles when the locking member 42 rises or falls can be suppressed. In addition, the rolling member 45a is made of resin, so even if friction occurs, there is no need to worry about the processing container 31 or the cover body 33 being cut. In other words, it is difficult to generate metal particles.

[0125] In addition, in the locking mechanism 50 of the embodiment, the rolling member 45a (an example of the rolling member on the cover body side) is accommodated in the recessed portion 46a in a state where a part of it protrudes from the recessed portion 46a due to the force of the force applying member 47a. And, when the rolling member 45a is pressed by the cover body 33, it moves in the cover opening direction (X-axis negative direction) by overcoming the force of the force applying member 47a, and is thus completely accommodated in the recessed portion 46a. Therefore, the cover body side contact surface 42a of the locking member 42 can be brought into contact with the contacted surface 33a of the cover body 33 without friction.

[0126] In addition, the locking mechanism 50 of the embodiment is also provided with a rolling member 45b (an example of a through-hole side rolling member) on the through-hole side contact surface 42b of the locking member 42. The rolling member 45b contacts the first inner surface 31f1 while rolling as the locking member 42 descends, in other words, without generating friction. Therefore, according to the locking mechanism 50 of the embodiment, the generation of particles when the locking member 42 descends can be suppressed.

[0127] In addition, the through-hole side contact surface 42b of the locking member 42 is inclined in the direction opposite to the cover opening direction (X-axis negative direction) relative to the moving direction (Z-axis direction) of the locking member 42 by the lifting mechanism 43, that is, in the cover 33 side, when the locking member 42 is not in contact with the cover 33 and the processing container 31. In addition, when the rolling member 45a is in contact with the cover 33 or the processing container 31, the through-hole side contact surface 42b stands up due to the resistance force received from the cover 33 or the processing container 31, thereby contacting the first inner surface 31f1 of the second through-hole 31f. As a result, when the locking member 42 is raised and lowered, the through-hole side contact surface 42b of the locking member 42 is difficult to contact the first inner surfaces 31e1 and 31f1 of the processing container 31, so that the generation of particles caused by the friction between them can be suppressed.

[0128] In addition, a resin member 48b (an example of a through-hole side resin member) is provided at the lower end of the through-hole side contact surface 42b which is most likely to contact the processing container 31, so that even if the through-hole side contact surface 42b contacts the processing container 31 (first inner surface 31e1) when the locking member 42 is raised or lowered, there is no worry that the processing container 31 will be cut. In other words, metal particles are less likely to be generated.

[0129] In addition, the second surface 42a2 of the cover body side contact surface 42a is inclined toward the cover opening direction (X-axis negative direction) relative to the moving direction (Z-axis direction) of the locking member 42 by the lifting mechanism 43 when the cover body side contact surface 42a is not in contact with the cover body 33 and the processing container 31. Therefore, when the locking member 42 is raised or lowered, even if the contacted surface 33a of the cover body 33 flies out toward the cover opening direction (X-axis negative direction) side relative to the second inner surface 31e2, 31f2 of the processing container 31, it is difficult for the locking member 42 to contact the cover body 33. In addition, a resin member 48a (an example of a cover body side resin member) is provided at the upper end of the second surface 42a2, so even if the second surface 42a2 contacts the cover body 33, there is no worry that the cover body 33 will be cut. In other words, it is difficult to generate metal particles.

[0130] In addition, the second surface 42a2 does not need to be inclined in the direction opposite to the opening direction of the cover body 33 (the positive direction of the X axis). Therefore, the second surface 42a2 may be parallel to the moving direction (the Z axis direction) of the locking member 42 by the lifting mechanism 43 when the cover body side contact surface 42a is not in contact with the cover body 33.

[0131] 〔7. Exhaust structure in the interface area〕

[0132] Next, return Figure 5A and Figure 5B , the exhaust structure of the junction area 182 is described. Figure 5A and Figure 5B As shown, the interface area 182 is covered by a housing 821. The housing 821 accommodates the cover body 33 and the retaining body 32.

[0133] The first exhaust pipe 201 for circulating the atmosphere gas exhausted from the housing 821 is connected to the housing 821. In addition, the second exhaust pipe 202 is connected to the second through hole 31f via a buffer 223. The buffer 223 is a box-shaped member having an internal space larger than the internal space of the second through hole 31f. The second exhaust pipe 202 is connected to a pump (not shown) to exhaust the atmosphere gas in the housing 821 via the buffer 223.

[0134] The second exhaust pipe 202 and the buffer 223 are provided for exhausting the moving space of the locking member 42, specifically, the first through hole 31e, the second through hole 31f, and the space between the first protrusion 31c and the second protrusion 31d. As described above, the locking mechanism 50 of the embodiment suppresses the generation of particles by taking measures such as setting rolling members 45a, 45b for the locking member 42, but it is also conceivable that the rolling members 45a, 45b are cut and generate particles. Even if such particles are generated, the second exhaust pipe 202 and the buffer 223 are used to exhaust the moving space of the locking member 42 in a concentrated manner, so that the particles can be efficiently discharged to the outside of the intersection area 182. As a result, the waiting time for the start of the next supercritical treatment before the number of particles decreases, for example, is reduced, and the productivity is improved.

[0135] In addition, during the supercritical drying process, the processing container 31 is in a high temperature state of, for example, about 100 degrees, and an ascending airflow is generated in the second through hole 31f. Assuming that the second exhaust pipe 202 is directly connected to the second through hole 31f, it is possible that the exhaust airflow and the ascending airflow collide to cause airflow turbulence. In contrast, by providing the buffer 223, the exhaust airflow and the ascending airflow do not collide directly, so it is difficult to generate airflow turbulence. Therefore, the particles can be discharged to the outside more efficiently.

[0136] As described above, the drying unit 18 of the embodiment is a substrate processing device for processing a wafer W (an example of a substrate) under a high pressure environment, and includes a processing container 31 (an example of a pressure container), a cover 33, and a locking mechanism 50. The processing container 31 has an opening 31b. The cover 33 blocks the opening 31b. The locking mechanism 50 restricts the movement of the cover 33 in the opening direction caused by the internal pressure of the processing container 31. In addition, the locking mechanism 50 includes a locking member 42 (an example of a contact member), a lifting mechanism 43 (an example of a moving mechanism), and rolling members 45a, 45b. The locking member 42 is in contact with the contacted surface 33a, which is a surface on the side opposite to the sealing surface among the multiple surfaces of the cover 33. The lifting mechanism 43 moves the locking member 42 in the direction along the contacted surface 33a. The rolling members 45a, 45b are provided on the contacting surfaces 42a, 42b of the locking member 42 that are in contact with the cover 33 or the processing container 31.

[0137] Thus, according to the drying unit 18 of the embodiment, it is possible to suppress the generation of particles while restricting the movement of the cover 33 caused by the internal pressure of the processing container 31 .

[0138] [8. Modifications]

[0139] The above-mentioned substrate processing system 1 can be preferably implemented in various forms other than the above-mentioned embodiment. Therefore, other embodiments of the substrate processing system 1 will be described below.

[0140] In the above embodiment, the locking mechanism 50 has an example of a structure in which the locking member 42 is inserted through the first through hole 31e and the second through hole 31f respectively formed on the upper and lower sides of the processing container 31 via the cover 33 to restrict the movement of the cover 33 in the opening direction. However, the structure of the locking mechanism is not limited to the above example.

[0141] Fig. 8A and Figure 8B 2 is a diagram showing a structural example of a locking mechanism of a modified example. Fig. 8A As shown, the drying unit 18A of the modified example includes a processing container 31A, a holding body 32A, and a cover body 33A. The processing container 31A has an opening 31Ab at the top. The cover body 33A is arranged above the processing container 31A and is moved in the vertical direction by a moving mechanism not shown. The holding body 32A is provided on the processing container 31A side of the cover body 33A, and the wafer W is held horizontally by the holding body 32A.

[0142] The processing container 31A is provided with a supply unit 35A, through which the processing fluid is supplied to the processing space 31Aa, and a discharge unit 37A is provided in the processing container 31A, through which the processing fluid is discharged from the processing space 31Aa.

[0143] The lock mechanism 50A includes a lock member 42A formed in a bifurcated shape and a moving mechanism 43A that moves the lock member 42A in the horizontal direction (ie, along the abutted surface 33Aa of the cover body 33A).

[0144] The opposing surfaces of the two branches of the locking member 42A are a cover-side abutting surface 42Aa abutting against the abutted surface 33Aa of the cover 33A and a container-side abutting surface 42Ab abutting against the bottom surface 31Ac of the processing container 31A.

[0145] The lid side contact surface 42Aa is provided with a recessed portion 46Aa, inside which a rolling member 45Aa and a biasing member 47Aa are provided. Similarly, the container side contact surface 42Ab is provided with a recessed portion 46Ab, inside which a rolling member 45Ab and a biasing member 47Ab are provided.

[0146] like Figure 8BAs shown, in the drying unit 18A, first, after the cover 33A is lowered by the moving mechanism (not shown) to close the opening 31Ab of the processing container 31A, the moving mechanism 43A moves the locking member 42A in the horizontal direction (X-axis negative direction). As a result, the rolling members 45Aa and 45Ab respectively contact the abutted surface 33Aa of the cover 33A and the bottom surface 31Ac of the processing container 31A and roll, and the locking member 42A moves.

[0147] After that, by supplying the processing fluid to the processing space 31Aa via the supply unit 35A, the pressure of the processing space 31Aa rises, and the cover 33A moves upward due to the internal pressure of the processing container 31A. As a result, the rolling members 45Aa and 45Ab overcome the forces of the force-applying members 47Aa and 47Ab and are completely accommodated in the recesses 46Aa and 46Ab, and the abutted surface 33Aa of the cover 33A abuts against the cover-side abutting surface 42Aa of the locking member 42A, and the bottom surface 31Ac of the processing container 31A abuts against the container-side abutting surface 42Ab of the locking member 42A. As a result, the movement of the cover 33A in the cover opening direction (Z-axis positive direction) caused by the internal pressure of the processing container 31A is restricted by the locking mechanism 50A.

[0148] In this way, the locking mechanism 50A may be configured to restrict movement of the cover 33A in the opening direction by clamping the cover 33A and the processing container 31A from the cover 33A side and the processing container 31A side using the bifurcated locking member 42A.

[0149] Further effects and variations can be easily derived by those skilled in the art. Therefore, the broader aspects of the present invention are not limited to the specific detailed and representative embodiments shown and described above. Therefore, various changes can be made without departing from the spirit or scope of the concept of the invention defined by the appended claims and their equivalents.

Claims

1. A substrate processing device, which is a substrate processing device for processing a substrate under a high pressure environment, characterized in that: The substrate processing device comprises: a pressure vessel having an opening; a cover body that blocks the opening; and a locking mechanism that limits the movement of the cover body in the opening direction caused by the internal pressure of the pressure container, The locking mechanism comprises: an abutting member that abuts against an abutted surface that is a surface on the side opposite to the sealing surface among the plurality of surfaces of the cover body; a moving mechanism that moves the abutting member in a direction along the abutted surface; as well as A rolling member is provided on a contact surface of the contact member that contacts the cover body or the pressure container.

2. The substrate processing device according to claim 1, characterized in that: The abutment member further comprises: a recessed portion formed on the abutting surface for accommodating the rolling member; and a force applying member disposed in the recessed portion, the force applying member applying force to the rolling member toward the outside of the recessed portion, The rolling member is received in the recessed portion with a portion thereof protruding from the recessed portion due to the force of the urging member, and when pressed by the cover body, the rolling member moves in the cover opening direction against the force of the urging member, thereby being completely received in the recessed portion.

3. The substrate processing device according to claim 1 or 2, characterized in that: The pressure container has a through hole, which is provided on the side closer to the lid opening direction than the opening, and the abutment member can pass through the through hole. The rolling member comprises: a cover body side rolling member provided to a cover body side abutting surface as an abutting surface abutting against the cover body; and The through-hole side rolling member is provided on a surface opposite to the cover body side contact surface and is a through-hole side contact surface that contacts the inner surface of the through-hole.

4. The substrate processing device according to claim 3, characterized in that: The contact member is supported so as to be swingable relative to the moving mechanism, The abutment surface on the through hole side is inclined in a direction opposite to the opening direction relative to the moving direction of the abutment member performed by the moving mechanism when the abutment member is not in abutment with the cover body and the pressure container, and stands up due to the resistance force received from the cover body or the pressure container and abuts against the inner surface of the through hole when the rolling member on the cover body side is in contact with the cover body or the pressure container.

5. The substrate processing device according to claim 4, characterized in that: The cover side abutment surface comprises: a first surface parallel to the through-hole side abutting surface; and The second surface is located closer to the top end side of the locking direction than the first surface in the locking direction of the movement direction of the abutment member performed by the moving mechanism to move the abutment member in a state of not abutting the cover body and the pressure container toward abutting the cover body, and is parallel to the moving direction or inclined toward the opening direction relative to the moving direction when the abutment surface on the cover body side is not abutting the cover body and the pressure container.

6. The substrate processing device according to claim 5, characterized in that: The cover-side rolling member is provided at a boundary portion between the first surface and the second surface.

7. The substrate processing device according to claim 3, characterized in that: The substrate processing device comprises: a buffer connected to the through hole, the buffer having an internal space larger than an internal space of the through hole; and An exhaust path is connected to the buffer and exhausts the atmosphere gas in the through hole through the buffer.

8. The substrate processing device according to claim 5 or 6, characterized in that: The abutment member further comprises: a cover-side resin member provided to the top end portion of the second surface in the locking direction; and A through-hole side resin member is provided to a base end portion of the through-hole side abutment surface in the locking direction.

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