Semiconductor packaging apparatus

Abstract

An electronic device includes a piezoelectric module, a sensing module, and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening that penetrates the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a semiconductor packaging apparatus, and more particularly, to a semiconductor packaging apparatus including a piezoelectric module. BACKGROUND

[0002] In an electronic device having a touch panel, such as a fingerprint recognition module, a switch bottom or a vibration motor can be used to provide vibration feedback to a user touching the touch panel. However, the relatively large thickness of the switch bottom or the vibration motor can hinder miniaturization of the electronic device. SUMMARY

[0003] In some embodiments, an electronic device includes a piezoelectric module, a sensing module, and a buffering element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening through the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffering element is disposed between the piezoelectric module and the sensing module.

[0004] In some embodiments, an electronic device includes a piezoelectric module, a sensing module, and a connecting element. The piezoelectric module includes a substrate and a piezoelectric element. The piezoelectric element is disposed on the substrate. The sensing module is disposed over the piezoelectric module. The connecting element is disposed between the piezoelectric module and the sensing module. The sensing module is configured to move in a direction toward the piezoelectric element to deform the piezoelectric element.

[0005] In some embodiments, an electronic device includes a piezoelectric module, a sensing module, and a connecting element. The piezoelectric element is disposed on the substrate. The sensing module is disposed over the piezoelectric module. The connecting element is disposed between the piezoelectric module and the sensing module. The connecting element electrically connects the sensing module and the substrate of the piezoelectric module. BRIEF DESCRIPTION OF DRAWINGS

[0006] Figure 1A A cross-sectional view of an electronic device according to some embodiments of the present disclosure is illustrated.

[0007] Figure 1B A cross-sectional view of an electronic device according to some embodiments of the present disclosure is illustrated.

[0008] Figure 2 A cross-sectional view of an electronic device according to some embodiments of the present disclosure is illustrated.

[0009] Figure 3 A cross-sectional view of an electronic device according to some embodiments of the present disclosure is illustrated.

[0010] Figure 4A ,Figure 4B and Figure 4C Different variations of interconnect structures disposed between a sensing module and a substrate are illustrated.

[0011] Figure 5A Figure 5B and Figure 5C Methods for manufacturing a sensing module according to some embodiments of the disclosure are illustrated.

[0012] Figure 6A Figure 6B and Figure 6C Methods for manufacturing an electronic device according to some embodiments of the disclosure are illustrated.

[0013] Figure 7A Figure 7B and Figure 7C Methods for manufacturing an electronic device according to some embodiments of the disclosure are illustrated. Figure 8A Figure 8B and Figure 8C Methods for manufacturing an electronic device according to some embodiments of the disclosure are illustrated.

[0014] The same or like elements are denoted by the same reference numerals throughout the several views and the detailed description. The present invention will be readily understood by the following detailed description in conjunction with the accompanying drawings. DETAILED DESCRIPTION

[0015] Figure 1A A cross-sectional view of an electronic device 1A according to some embodiments of the disclosure is illustrated. The electronic device 1A includes a substrate 10, a piezoelectric element 11, a buffer element 16, and a sensing module 100.

[0016] The substrate 10 can include, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass fiber-based copper foil laminate. The substrate 10 can include an interconnect structure, such as a redistribution layer (RDL) or a ground element. The substrate 10 defines an opening 10h that penetrates the substrate 10.

[0017] ​​​​The piezoelectric element 11 is disposed on and across the opening 10h of the substrate 10. The opening 10h can accommodate deformation of the piezoelectric element 11. The piezoelectric element 11 includes electrodes 11a and 11b electrically connected to the carrier 12 and the substrate 10, respectively. In some embodiments, the piezoelectric element 11 includes a sensor configured to generate a voltage or a potential difference across the electrodes 11a and 11b when deformed or pressed. In some embodiments, the piezoelectric element 11 includes an actuator configured to physically change shape or vibrate when an external electric field is applied. For example, the piezoelectric element 11 can provide haptic feedback and / or audio feedback. In some embodiments, the piezoelectric element 11 includes lead zirconate titanate (PZT). In some embodiments, the substrate 10 and the piezoelectric element 11 can also be referred to as a piezoelectric module.

[0018] The sensing module 100 is disposed above the substrate 10 and the piezoelectric element 11. The sensing module 100 includes the carrier 12, the electronic component 13, the encapsulant 14, and the cover 15. The sensing module 100 can be spaced apart from the piezoelectric element 11 to enable movement of the sensing module 100.

[0019] The carrier 12 is disposed above the substrate 10 and the piezoelectric element 11. The carrier 12 can be, for example, a soft or flexible substrate. The carrier 12 can include interconnect structures, such as an RDL or ground elements. The carrier 12 is electrically connected to the conductive contacts 10c on the substrate 10 by the bond wires 17.

[0020] The electronic component 13 is disposed on the carrier 12. In some embodiments, the electronic component 13 includes a sensing die including a light-emitting device and / or a light detector. For example, the electronic component 13 can include a light-emitting diode (LED), a laser diode, or another device that can include one or more semiconductor layers. For example, the electronic component 13 can include a PIN diode (a diode including a p-type semiconductor region, an intrinsic semiconductor region, and an n-type semiconductor region) or a photodiode or a phototransistor.

[0021] The encapsulant 14 is disposed on the carrier 12 to cover the electronic component 13. In some embodiments, the encapsulant 14 includes an epoxy. In some embodiments, the encapsulant 14 includes glass.

[0022] The cover 15 is disposed on the encapsulant 14. The cover 15 is formed from or includes an optically transparent material (e.g., optically transparent to wavelengths of light emitted by the electronic component 13 or to wavelengths of light that the electronic component 13 is configured to detect). The cover 15 allows light emitted or received by the electronic component 13 to pass through.

[0023] A cushioning element 16 is disposed between the substrate 10 and the sensing module 100. In some embodiments, the cushioning element 16 includes or is made of an elastic or flexible material that can provide cushioning between the sensing module 100 and the substrate 10 when the piezoelectric element 11 is deformed or pressed. For example, the cushioning element 16 can include an elastomer or other suitable polymer. The substrate 10, the carrier 12, and the cushioning element 16 define a space to house the piezoelectric element 11. The sensing module 100 can be configured to move toward and bend or deform the piezoelectric element 11.

[0024] In some comparative electronic devices, a switch bottom or a vibration motor can be used to provide vibration feedback. However, the relatively large thickness (e.g., 1 to 2 millimeters) of the switch bottom or the vibration motor hinders miniaturization of the electronic device. According to some embodiments of the electronic device 1A as shown in Figure 1A According to some embodiments of the electronic device 1A as shown in

[0025] Figure 1B A cross-sectional view of an electronic device IB according to some embodiments of the disclosure is illustrated. The electronic device IB is similar to the electronic device 1A as shown in Figure 1A except that the piezoelectric element 11 is pre-pressed or bent (e.g., by the sensing module 100) as shown in Figure 1A except that the piezoelectric element 11 is pre-pressed or bent (e.g., by the sensing module 100) as shown in Figure 1B except that the piezoelectric element 11 is pre-pressed or bent (e.g., by the sensing module 100) as shown in

[0026] Figure 2 A cross-sectional view of an electronic device 2 according to some embodiments of the disclosure is illustrated. The electronic device 2 is similar to the electronic device 1A as shown in Figure 1A except that the piezoelectric element 11 is pre-pressed or bent (e.g., by the sensing module 100) as shown in Figure 2 except that the piezoelectric element 11 is pre-pressed or bent (e.g., by the sensing module 100) as shown in Figure 1A except that the piezoelectric element 11 is pre-pressed or bent (e.g., by the sensing module 100) as shown in

[0027] Substrate 20 includes a planar (or base) portion 20a and a dam structure 20b. Planar portion 20a bounds an opening 20h. Dam structure 20b is disposed between planar portion 20a of substrate 20 and sensing module 100. In some embodiments, planar portion 20a is integrally formed with dam structure 20b. Dam structure 20b and / or planar portion 20a can be electrically conductive. In some embodiments, substrate 20 can be a ceramic substrate. In some embodiments, dam structure 20b includes interconnect structures therein to enable electrical connection between sensing module 100 and planar portion 20a of substrate 20.

[0028] Adhesive 26 is disposed between sensing module 100 and dam structure 20b. Adhesive 26 includes or is made of an elastic or flexible material that can provide cushioning between sensing module 100 and dam structure 20b when piezoelectric element 11 is deformed or pressed. Adhesive 26 can be a cushioning element. Adhesive 26 can be an electrically conductive cushioning layer. Adhesive 26 can be a connecting element. In some embodiments, adhesive 26 can be or include an electrically conductive adhesive, an anisotropic conductive film (ACF), polymer core balls covered by a metal layer, or other suitable electrically conductive material. In some embodiments, the Young’s modulus of dam structure 20b of substrate 20 is greater than the Young’s modulus of adhesive 26. Sensing module 100, dam structure 20b, and the cushioning element (e.g., adhesive 26) can bound a space that accommodates piezoelectric element 11.

[0029] Figure 3 A cross-sectional view of an electronic device 3 according to some embodiments of the disclosure is illustrated. Electronic device 3 is similar to electronic device 1A illustrated in Figure 1A except that, as illustrated in Figure 3 except that, as illustrated in Figure 1A cushioning element 16 illustrated in is replaced by a substrate 30 and an adhesive 36.

[0030] Substrate 30 is disposed between substrate 10 and sensing module 100. Substrate 30 can include, for example, a flexible printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass fiber-based copper foil laminate. Substrate 30 can include interconnect structures, such as an RDL or a ground element. Substrate 30 is electrically connected to substrate 10 by electrically conductive contacts 30c. In some embodiments, electrically conductive contacts 30c can be encapsulated by underfill 30u. Substrate 30 bounds an opening 30h that penetrates substrate 30. In some embodiments, the width of opening 30h of substrate 30 is greater than the width of opening 10h of substrate 10.

[0031] Adhesive 36 is disposed between sensing module 100 and substrate 30. Adhesive 36 is made of or contains an elastic or flexible material that can provide cushioning between sensing module 100 and substrate 30 when piezoelectric element 11 is deformed or pressed. In some embodiments, adhesive 36 may be or contain a conductive adhesive, ACF, polymer core spheres covered by a metal layer, or other suitable conductive material. In some embodiments, the Young's modulus of substrate 30 is greater than the Young's modulus of adhesive 36.

[0032] Figure 4A and Figure 4B A comparative example illustrating the interconnect structure disposed between the sensing module 100 and the substrate 10 is provided, and Figure 4C This describes the interconnect structure disposed between the sensing module 100 and the substrate 10 according to some embodiments of the present disclosure.

[0033] like Figure 4A As shown, the sensing module 100 and the substrate 10 are connected via a circuit board 40a sandwiched by two conductive epoxy resin layers 40a1. However, in the manufacturing process... Figure 4A During the process of creating the interconnect structure shown, conductive epoxy resin may leak out and flow toward the piezoelectric element 11, which could cause undesirable electrical connections (e.g., short circuits) between the interconnect structure and the piezoelectric element 11. To prevent the leakage of conductive epoxy resin, additional space may be implemented between the interconnect structure and the piezoelectric element 11, which would increase the size of the interconnect structure and the manufacturing cost.

[0034] like Figure 4B As shown, the sensing module 100 is connected to the substrate 10 via a circuit board 41a sandwiched between two conductive films 41a1. In some embodiments, the conductive films 41a1 may be or contain pressure-sensitive adhesive (PSA) or ACF. However, manufacturing such a structure involves separating a single conductive film into multiple conductive films, which can be challenging. Furthermore, ensuring the desired alignment between the conductive films 41a1 and the circuit board 41a is also challenging.

[0035] like Figure 4C As shown, the sensing module 100 is connected to a conductive contact 42 and an underfill 42u of the substrate 10. In some embodiments, the conductive contact 42 comprises a polymer core covered by a metal layer. The conductive contact 42 is covered or encapsulated by the underfill 42u. In some embodiments, the underfill 42u comprises epoxy resin, molding compound (e.g., epoxy molding compound or other molding compound), polyimide, phenolic compound or material, material containing silicone dispersed therein, or combinations thereof. The underfill 42u prevents undesirable electrical connections (e.g., short circuits) between the conductive contact 42 and the piezoelectric element 11, without...Figure 4A The additional space shown in

[0036] Figure 5A 、 Figure 5B and Figure 5C illustrate a method of manufacturing a sensing module 100 as shown in Figure 1A 、 Figure 1B 、 Figure 2 and Figure 3 illustrate a method of manufacturing an electronic device IB as shown in

[0037] Referring to Figure 5A , a carrier 12 is provided. An electronic component 13 (e.g., a sensing die) is disposed on the carrier 12. In some embodiments, the electronic component 13 can be electrically connected to the carrier 12 by flip-chip or wire bonding techniques.

[0038] Referring to Figure 5B , a package 14 is formed on the carrier 12 to cover or encapsulate the electronic component 13. In some embodiments, the package 14 can be formed by a molding technique such as transfer molding or compression molding.

[0039] Referring to Figure 5C , a cover (or cover plate) 15 is disposed on the package to form the sensing module 100. The cover 15 includes or is formed of an optically transparent material. The cover 15 allows light emitted or received by the electronic component 13 to pass through.

[0040] Figure 6A 、 Figure 6B and Figure 6C illustrate a method of manufacturing an electronic device IB as shown in Figure 1B illustrate a method of manufacturing an electronic device IB as shown in

[0041] Referring to Figure 6A , a substrate 10 is provided and an opening 10h is formed to penetrate the substrate 10. In some embodiments, the opening 10h can be formed by mechanical drilling, laser drilling, or other suitable processes.

[0042] Referring to Figure 6BA piezoelectric element 11, including electrodes 11a and 11b, is disposed on the substrate 10 and across the opening 10h. A buffer layer 16 is disposed on the substrate 10 and adjacent to the piezoelectric element 11. Conductive material is then applied to the electrodes 11a and 11b of the piezoelectric element 11 to achieve electrical connection. In some embodiments, the conductive material is or includes silver paste.

[0043] Referring to Figure 6C , a sensing module 100 is disposed on the piezoelectric element 11 and the buffer element 16. The sensing module 100 is electrically connected to the conductive contacts 10c on the substrate 10 by bond wires 17 to form an electronic device IB as shown in Figure 1B . As shown in Figure 6C , the piezoelectric element 11 is not deformed or pressed by the sensing module 100. In other embodiments, the piezoelectric element 11 can be pre-pressed by the sensing module 100 as shown in FIG. 1A. In some embodiments, whether to pre-press the piezoelectric element 11 can be selected by implementing appropriate thickness for the buffer element 16.

[0044] Figure 7A , Figure 7B and Figure 7C describes a method for manufacturing an electronic device according to some embodiments of the disclosure. While some processes, operations or stages are described below with respect to each of a plurality of components, any of those processes, operations or stages can be selectively performed with respect to one of the plurality of components, or some number between one and the full plurality of components.

[0045] Referring to Figure 7A , a substrate 20 is provided. The substrate 20 includes a planar portion 20a and a dam structure 20b. An opening 20h is formed through the planar portion 20a of the substrate 20. In some embodiments, the opening 20h can be formed by mechanical drilling, laser drilling, or other suitable process.

[0046] Referring to Figure 7B , a piezoelectric element 11, including electrodes 11a and 11b, is disposed on the planar portion 20a of the substrate 20 and across the opening 20h. An adhesive 26 is applied on the dam structure 20b of the substrate 20. Conductive material is then applied to the electrodes 11a and 11b of the piezoelectric element 11 to achieve electrical connection. In some embodiments, the conductive material is or includes silver paste.

[0047] Referring to Figure 7C , a sensing module 100 is disposed on the piezoelectric element 11 and the dam structure 20b of the substrate 20. The sensing module 100 is electrically connected to the substrate 20 by the adhesive 26. As shown in Figure 7C , the piezoelectric element 11 is not deformed or pressed by the sensing module 100. In other embodiments, the piezoelectric element 11 can be pre-pressed by the sensing module 100 to form an electronic device IB as shown inFigure 2 The electronic device 2 as shown in

[0048] Figure 8A 、 Figure 8B and Figure 8C A method for manufacturing an electronic device according to some embodiments of the disclosure is described. While some processes, operations, or stages are described below with respect to each of a plurality of components, any of those processes, operations, or stages can be selectively performed with respect to one of the plurality of components, or some number between one and the full plurality of components.

[0049] Referring to Figure 8A , a substrate 10 is provided and an opening 10h is formed to penetrate the substrate 10. In some embodiments, the opening 10h can be formed by mechanical drilling, laser drilling, or other suitable process. A substrate 30 is disposed on the substrate 10 and electrically connected to the substrate 10 by a conductive contact 30c. An opening 30h is formed to penetrate the substrate 30. In some embodiments, the opening 30h can be formed by mechanical drilling, laser drilling, or other suitable process. In some embodiments, the width of the opening 30h is greater than the width of the opening 10h. In some embodiments, an underfill 30u can be disposed to cover or encapsulate the conductive contact 30c.

[0050] Referring to Figure 8B , a piezoelectric element 11 including an electrode 11a and an electrode 11b is disposed on the substrate 10 and across the opening 10h. An adhesive 36 is applied on the substrate 30. A conductive material is then applied to the electrode 11a and the electrode 11b of the piezoelectric element 11 to achieve electrical connection. In some embodiments, the conductive material is or includes silver paste.

[0051] Referring to Figure 8C , a sensing module 100 is disposed on the piezoelectric element 11 and the substrate 30. The sensing module 100 is electrically connected to the substrate 10 by the adhesive 36 and the substrate 30. As Figure 8C shown in Figure 3 , the piezoelectric element 11 is not deformed or pressed by the sensing module 100. In other embodiments, the piezoelectric element 11 can be pre-pressed by the sensing module 100 to form an electronic device 3 as shown in

[0052] As used herein, the terms “conductive,” “electrically conductive,” and “electrical conductivity” refer to the ability to transfer electrical current. Conductive materials generally indicate those materials that exhibit little or zero opposition to the flow of electrical current. One measure of electrical conductivity is Siemens per meter (S / m). Generally, conductive materials are those having an electrical conductivity greater than about 10 4 S / m (e.g., at least 10 5 S / m or at least 10 6A material having an electrical conductivity of at least 1 S / m. The electrical conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.

[0053] As used herein, the terms“substantially,”“generally,”“approximately,” and“about” are used to describe and account for small variations. When employed in connection with a description of an event or circumstance, the terms can refer to instances where the event or circumstance explicitly occurs, as well as instances where the event or circumstance is approximately or nearly the same as occurring. For example, when used in connection with a numerical value, the terms can refer to a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, two numerical values can be considered“substantially” the same or equal if the difference between the two values is less than or equal to ±10% of the average of the values, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example,“substantially” parallel can refer to a range of angular variation less than or equal to ±10° from 0°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example,“substantially” perpendicular can refer to a range of angular variation less than or equal to ±10° from 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0054] In some embodiments, two surfaces can be considered coplanar or substantially coplanar if the displacement between the two surfaces is small, such as no greater than 1 pm, no greater than 5 pm, or no greater than 10 pm.

[0055] As used herein, the singular terms“a,”“an,” and“the” can include plural referents unless the context clearly dictates otherwise. In some descriptions of embodiments, components are described as being“on” or“above” other components. Such components can directly contact one another, or one or more intervening components can also be present.

[0056] Additionally, amounts, ratios, and other numerical values are sometimes presented herein in a range format. It is to be understood that such range format is used for convenience and brevity and should be understood as having been followed by the language "and / or". Therefore, for example, a range of "2 to 10" indicates that "2" and "10" and any and all subranges therebetween (e.g., 2 to 4, 2 to 5, 5 to 10, 5 to 10, etc.) are contemplated for use in this instance.

[0057] While the disclosure has been described and illustrated with reference to specific embodiments thereof, these descriptions and illustrations are not intended to be limiting. Those skilled in the art will understand that various modifications can be made to the embodiments without departing from the true spirit and scope of the disclosure, which is defined by the appended claims. The descriptions and illustrations may not necessarily be to scale. Differences in art reproduction and actual equipment can occur as a result of the manufacturing process. Other embodiments of the disclosure can not be specifically described herein. The descriptions and illustrations shall not be construed as limiting the disclosure. Modifications can be made to adapt a particular situation, material, composition of matter, method, or process to the objective, spirit and scope of the disclosure. All such modifications are intended to be within the scope of the claims. Although the methods disclosed herein have been described with reference to particular operations performed in a particular order, it will be understood that these operations can be combined, sub-divided, or re-ordered to form equivalent methods without departing from the teachings of the present disclosure. Accordingly, unless specifically indicated otherwise, the order and grouping of operations is not a limitation of the present disclosure.

Claims

1. An electronic device comprising: a piezoelectric module comprising: a substrate defining an opening through the substrate; and a piezoelectric element disposed on the substrate and across the opening of the substrate; a sensing module disposed over the piezoelectric module; and a conductive contact disposed between the substrate and the sensing module, wherein the sensing module comprises: a cap comprising an optically transparent material; and a sensing die disposed under the cap and spaced apart from the cap, wherein the cap is optically transparent to a wavelength of light emitted by the sensing die or to a wavelength of light that the sensing die is configured to detect, and wherein the piezoelectric element comprises a first electrode in contact with the sensing module, and the first electrode is higher in position than the conductive contact, with reference to the substrate.

2. The electronic device of claim 1, wherein the conductive contact is encapsulated by an underfill, wherein a length of the underfill is less than a length of the substrate in a direction parallel to an upper surface of the substrate.

3. The electronic device of claim 2, wherein the first electrode is higher in position than the underfill, with reference to the substrate.

4. The electronic device of claim 1, wherein the sensing module further comprises: a carrier, wherein the die is disposed on the carrier, the die comprising a light emitter or a light detector; and an encapsulant disposed on the carrier to encapsulate the die and comprising glass, wherein the encapsulant spaces apart the cap from the sensing die, and wherein a sidewall of the encapsulant, a sidewall of the cap, and a sidewall of the carrier are coplanar.

5. The electronic device of claim 1, further comprising a flexible circuit board electrically connecting the sensing module to the substrate.

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