Coil Assembly and Method of Manufacturing the Same

Abstract

The present invention provides a coil assembly and a manufacturing method thereof. The coil assembly includes: an insulating board; a first wiring provided on a first surface of the insulating board and including a first spiral wiring; and a second wiring provided on a second surface of the insulating board and electrically connected to the first wiring, wherein the second wiring includes a second spiral wiring extending from the first spiral wiring, and the first wiring and the second wiring have different cross-sectional shapes.

Description

[0001] This application claims the priority and benefits of Korean Patent Application No. 10-2017-0142701, filed with the Korean Intellectual Property Office on October 30, 2017, and Korean Patent Application No. 10-2018-0002810, filed with the Korean Intellectual Property Office on January 9, 2018. The entire disclosure of the Korean patent applications is incorporated herein by reference for all purposes. Technical Field

[0002] The present disclosure relates to a coil assembly and a method of manufacturing the same. Background Art

[0003] Portable terminals have been implemented with systems for wirelessly receiving power to charge the battery of the portable terminal or to implement functions such as radio frequency identification (RFID), near field communication (NFC), and magnetic secure transmission (MST) as examples.

[0004] Such functions are typically performed by various coils. As a result, a portable terminal may be provided with multiple coils. Summary of the Invention

[0005] The Summary of the Invention is provided to introduce in a simplified form selected concepts, which are further described in the Detailed Description below. The Summary of the Invention is not intended to define the key features or essential features of the claimed subject matter, nor is it intended to assist in determining the scope of the claimed subject matter.

[0006] In one general aspect, a coil assembly includes: an insulating board; a first wiring disposed on a first surface of the insulating board and including a first spiral wiring; and a second wiring disposed on a second surface of the insulating board and electrically connected to the first wiring, wherein the second wiring includes a second spiral wiring extending from the first spiral wiring, and the first wiring and the second wiring have different cross-sectional shapes.

[0007] The first wiring may be formed such that a width of a bonding surface of the first wiring bonded to the insulating board is narrower than a width of a relative surface of the bonding surface of the first wiring, and the second wiring may be formed such that a width of a bonding surface of the second wiring bonded to the insulating board is greater than or equal to a width of a relative surface of the bonding surface of the second wiring.

[0008] The first wiring may be bonded to the insulating board through an adhesive layer, and the second wiring may be directly bonded to the insulating board.

[0009] The coil assembly may include a connection conductor configured to penetrate the insulating plate, and the first wiring and the second wiring may be electrically connected to each other through the connection conductor.

[0010] The first wiring may include a lead portion configured to be separated from the first spiral wiring, and the second wiring may include a connection wiring extending radially outward from the second spiral wiring, and the connection wiring may be connected to the lead portion.

[0011] The first wiring may include an insertion groove formed at a position facing the connection wiring, and at least a portion of the connection wiring may be disposed in the insertion groove.

[0012] The connection wiring may branch into a plurality of paths.

[0013] The line width of the connection wiring may be greater than the line width of the first wiring or the second spiral wiring.

[0014] The first wiring may include a connection portion configured to be separated from the first spiral wiring, the second wiring may include an arc-shaped wiring configured to be separated from the second spiral wiring, and the second spiral wiring and the arc-shaped wiring may be electrically connected to each other through the connection portion.

[0015] The second wiring may include: a connection wiring extending radially outward from the second spiral wiring; lead portions extending from the first spiral wiring and the connection wiring, respectively; and connection pads included at ends of the lead portions.

[0016] The coil assembly may include a protection member configured to cover the second wiring, wherein the connection pads include regions where the lead portions are exposed outward from the protection member through pad holes formed in the protection member.

[0017] The coil assembly may further include a metal layer stacked on the lead portions exposed through the pad holes of the protection member.

[0018] The second spiral wiring may be formed in an arc shape.

[0019] The second wiring may be formed of a metal thin film wiring formed by printing a conductive material on the insulating plate.

[0020] The coil assembly may include: a first coil wiring constituted by the first wiring and the second wiring, and a second coil wiring disposed to be stacked with the first coil wiring, and the first coil wiring and the second coil wiring may each perform any one of functions of transmitting and receiving power for wireless charging, radio frequency identification (RFID), near field communication (NFC), and magnetic secure transmission (MST).

[0021] The second coil wiring may be located at a position adjacent to the first coil wiring.

[0022] The thickness of the second wiring may be equal to or less than the thickness of the first wiring.

[0023] The line width of the second spiral wiring may be equal to or less than the line width of the first spiral wiring.

[0024] In one general aspect, a coil assembly includes: an insulating plate; and coil wiring including a first wiring disposed on a first surface of the insulating plate and a second wiring disposed on a second surface of the insulating plate, wherein the first wiring includes an insertion groove formed at a position facing the second wiring, and at least a part of the second wiring is disposed in the insertion groove.

[0025] The coil wiring may include spiral wiring, and the spiral wiring may be disposed to be distributed in the first wiring and the second wiring.

[0026] The line width of the spiral wiring of the second wiring may be narrower than the line width of the spiral wiring of the first wiring.

[0027] The spiral wiring of the second wiring may be disposed at a position corresponding to a central region formed by the spiral wiring of the coil wiring through the first wiring.

[0028] In one general aspect, a method of manufacturing a coil assembly includes: bonding a first wiring to a first surface of an insulating plate using an adhesive member; printing a conductive material on the second surface of the insulating plate and in a through hole to form a second wiring and a connecting conductor; and electrically connecting the first wiring to the second wiring through the connecting conductor to form the coil assembly.

[0029] A first protective member may be attached to the surface of the first wiring and a second protective member may be attached to the surface of the second wiring.

[0030] The first wiring and the second wiring may have different cross-sectional shapes. Description of the Drawings

[0031] In the following detailed description taken in conjunction with the accompanying drawings, the above and other aspects, features, and other advantages of the present disclosure will be more clearly understood. In the drawings:

[0032] Figure 1 is a perspective view schematically showing an example of an electronic device.

[0033] Figure 2 shows Figure 1 of the electronic device along Figure 1A cross-sectional view taken along line II-II’;

[0034] Figure 3 is a schematic plan view showing an example of a coil assembly of an electronic device;

[0035] Figure 4 is an exploded perspective view of an example of a coil assembly;

[0036] Figure 5 is a cross-sectional view of the electronic device taken along Figure 3 line V-V’;

[0037] Figure 6A and 6B is a cross-sectional view of the electronic device taken along Figure 3 line VI-VI’;

[0038] Figure 7 and Figure 8 is a view showing an example of a manufacturing method of a coil assembly;

[0039] Figure 9 is an exploded perspective view schematically showing an example of a coil assembly;

[0040] Figure 10 is a schematic plan view showing an example of a coil assembly;

[0041] Figure 11 is an exploded plan view showing an example of a coil assembly;

[0042] Figure 12 is a schematic plan view showing an example of a coil assembly;

[0043] Figure 13 is an exploded perspective view schematically showing an example of a coil assembly;

[0044] Figure 14 is a schematic plan view showing an example of a coil assembly;

[0045] Figure 15 is an exploded perspective view of an example of a coil assembly;

[0046] Figure 16A and 16B is a view showing an example of a process for manufacturing a first wiring;

[0047] Figure 17 is an exploded perspective view schematically showing an example of a coil assembly; and

[0048] Figure 18 is a perspective view schematically showing an example of a coil assembly.

[0049] In all the figures and the detailed description, the same reference numerals indicate the same elements. The figures may not be drawn to scale, and for clarity, illustration, and convenience, the relative dimensions, proportions, and depictions of elements in the figures may be exaggerated. Detailed Description

[0050] The following detailed description is provided to assist the reader in obtaining a comprehensive understanding of the methods, apparatuses, and / or systems described herein. However, various changes, variations, and equivalents of the methods, apparatuses, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the order of operations described herein is merely exemplary and is not limited to the order set forth herein, but rather changes that will be apparent after understanding the disclosure of this application may be made, except for operations that must occur in a specific order. Additionally, descriptions of features known in the art may be omitted for increased clarity and conciseness.

[0051] The features described herein may be implemented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein are provided only to illustrate some of the many possible ways of implementing the methods, apparatuses, and / or systems described herein that will be apparent after understanding the disclosure of this application.

[0052] Throughout the specification, it will be understood that when an element such as a layer, region, or wafer (substrate) is described as "on," "connected to," or "coupled to" another element, the element may be directly "on," "connected to," or "coupled to" the other element, or there may be other elements intervening therebetween. In contrast, when an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element, there may be no intervening elements or layers therebetween. The same reference numerals always indicate the same elements. As used herein, the term "and / or" includes any one of the associated listed items and all combinations of two or more of them.

[0053] It will be apparent that, although the terms "first," "second," and "third," etc. may be used herein to describe various components, assemblies, regions, layers, and / or portions, these components, assemblies, regions, layers, and / or portions should not be construed as limited by these terms. These terms are only used to distinguish one component, assembly, region, layer, or portion from another. Thus, a first component, assembly, region, layer, or portion discussed below may be referred to as a second component, assembly, region, layer, or portion without departing from the teachings of the embodiments.

[0054] For ease of description, spatial relative terms such as "above", "upper", "below", and "lower" can be used herein to describe the relationship of one element to another as shown in the accompanying drawings. It will be understood that the spatial relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. For example, if the device in the drawings is flipped, an element described as "above" or "upper" another element or feature will then be positioned "below" or "lower" another element or feature. Thus, the term "above" can include both upward and downward orientations depending on the specific orientation of the drawing. The device can be positioned in other ways (rotated 90 degrees or in other orientations), and corresponding interpretations can be made for the spatial relative descriptors used herein.

[0055] The terms used herein describe only specific embodiments and the present disclosure is not limited thereto. As used herein, unless the context clearly indicates otherwise, the singular forms are also intended to include the plural forms. It will be further understood that when used in this specification, the terms "comprises" and / or "comprising" enumerate the presence of the stated features, integers, steps, operations, components, elements, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, elements, and / or groups thereof.

[0056] Note that the use of the term "may" herein with respect to examples or embodiments (e.g., what may be included or implemented with respect to an example or embodiment) means that there is at least one example or embodiment that includes or implements such a feature, but not all examples and embodiments are limited thereto.

[0057] Hereinafter, embodiments of the present disclosure will be described with reference to schematic diagrams showing embodiments of the present disclosure. In the drawings, for example, due to manufacturing techniques and / or tolerances, variations in the shapes shown can be estimated. Therefore, the embodiments of the present disclosure should not be construed as limited to the specific shapes of the regions shown herein to include shape changes due to manufacturing. The following embodiments can also be constituted by one embodiment or a combination of embodiments.

[0058] The following description of the present disclosure can have various configurations and only the required configurations are presented herein, but are not limited thereto.

[0059] The features of the examples described herein can be combined in various ways that will be apparent after understanding the disclosure of the present application. In addition, although the examples described herein have various configurations, other configurations that will be apparent after understanding the disclosure of the present application are feasible.

[0060] When describing various examples, a wireless charging device can commonly refer to, for example, a power transmitter that transmits power and a power receiver that receives and stores power therein.

[0061] Figure 1 is a perspective view schematically showing an example of an electronic device, Figure 2 is a cross-sectional view of the electronic device taken along line Figure 1 II-II’ of.

[0062] Referring to Figure 1 and Figure 2 , the electronic device (which may be a wireless charger) may be a charging device 20 that wirelessly transmits power, or a portable terminal 10 that wirelessly receives power and stores the received power.

[0063] The portable terminal 10 may include a battery 12 and a power receiver 100. The power receiver 100 receives power and supplies the received power to the battery 12 and charges the battery 12 using the received power.

[0064] The battery 12 may be a rechargeable and dischargeable secondary battery, and may be attached to and detached from the portable terminal 10, but is not limited thereto.

[0065] The power receiver 100 may be accommodated in a housing (or case) 11 of the portable terminal 10, and may be directly attached to the inner surface of the housing 11 or may be arranged to be maximally adjacent to the inner surface of the housing 11. However, the position of the battery is not limited thereto, and the battery may be positioned away from the surface of the housing 11.

[0066] The power receiver 100 may include a magnetic part 102 and a coil assembly 110.

[0067] The magnetic part 102 may have a flat plate shape (or sheet shape), and may be disposed on one surface of the coil assembly 110 to be fixedly attached to the coil assembly 110. The magnetic part 102 may be arranged to effectively form a magnetic path for the magnetic field generated by the coil wiring of the coil assembly 110. To this end, the magnetic part 102 may be formed of a material capable of easily forming a magnetic path, and may be formed of, for example, a ferrite sheet.

[0068] In an example, as needed, a metal sheet is included between the magnetic part 102 and the battery 12 to shield electromagnetic waves or leakage magnetic flux. The metal sheet may be formed of aluminum, but the material of the metal sheet is not limited thereto.

[0069] In an example, the power receiver 100 may include an adhesive part 104 interposed between the coil assembly 110 and the magnetic part 102 such that the coil assembly 110 and the magnetic part 102 are firmly and fixedly adhered to each other.

[0070] The bonding part 104 can be disposed between the coil assembly 110 and the magnetic part 102, and can bond the magnetic part 102 and the coil assembly 110 to each other. Such a bonding part 104 can be formed using an adhesive sheet or an adhesive tape, and can also be formed by applying an adhesive or a resin having an adhesive property to the surfaces of the coil assembly 110 or the magnetic part 102.

[0071] The bonding part 104 can contain ferrite powder, so that the bonding part 104 can have magnetism together with the magnetic part 102.

[0072] The charging device 20 can be configured to charge the battery 12 of the portable terminal 10. To this end, the charging device 20 can include a voltage converter 22 and a power transmitter 200 located in the housing 21.

[0073] The voltage converter 22 converts alternating current (AC) power supplied from an external power source into direct current (DC) power, and reconverts the DC power into an AC voltage having a specific frequency to supply the AC voltage to the power transmitter 200.

[0074] When an AC voltage is applied to the power transmitter 200, the magnetic field around the power transmitter 200 can change. Accordingly, the power receiver 100 of the portable terminal 10 (which can be disposed adjacent to the power transmitter 200) can be applied with a voltage according to the change in the magnetic field, so that the battery 12 can be charged.

[0075] The power transmitter 200 can be constructed in a manner similar to that of the power receiver 100 described above. Therefore, a detailed description of the power transmitter 200 will be omitted.

[0076] Hereinafter, an example of constructing the coil assembly 110 of the power receiver 100 will be described in detail.

[0077] Figure 3 is a plan view schematically showing Figure 2 an example of the coil assembly, Figure 4 is Figure 3 an exploded perspective view of the example of the coil assembly shown in Figure 3 Here, for ease of explanation, Figure 4 the state in which the protective member 180 of

[0078] In addition, Figure 5 is a cross-sectional view taken along the V-V' line of Figure 3 and Figure 6A and Figure 6B is a cross-sectional view taken along the VI-VI' line of Figure 3 Hereinafter,

[0079] Referring to Figures 3 to 6B, according to each example, the coil assembly 110 may include an insulating plate 120 and coil wirings 130 formed on opposite surfaces of the insulating plate 120.

[0080] The insulating plate 120 may be an insulating substrate having circuit wirings or conductive patterns formed on its opposite surfaces. As an example, an insulating film such as a polyimide film may form the material of the insulating plate 120. However, the material of the insulating plate 120 is not limited thereto, and the insulating plate 120 may be formed of various materials as long as the thickness of the insulating plate 120 is thin and a metal thin film can be printed or attached to the opposite surfaces of the insulating plate 120.

[0081] The coil wirings 130 may include a first wiring 140 disposed on a first surface of the insulating plate 120 and a second wiring 150 disposed on a second surface of the insulating plate 120. Here, the first surface and the second surface of the insulating plate 120 refer to the opposite surfaces of the insulating plate 120 disposed in opposite directions. The first wiring 140 and the second wiring 150 may be mounted in a portable terminal having a thin form factor. Such a coil structure may provide high power transfer efficiency, which may significantly reduce the size of, for example, the coil assembly.

[0082] The first wiring 140 may include: a first spiral wiring 141 formed in a spiral shape to have multiple turns; and a lead portion 143. Here, the lead portion 143 refers to the portion that connects the two ends of the first spiral wiring 141 to the connection pad 138.

[0083] The lead portion 143 may be divided into a first lead portion 143a and a second lead portion 143b.

[0084] The first lead portion 143a may extend from the first spiral wiring 141. In addition, the second lead portion 143b may not be directly connected to the first spiral wiring 141, but may be disposed to be separated from the first spiral wiring 141 and may be connected to the first spiral wiring 141 through the second wiring 150.

[0085] As a non-limiting example, a pressed coil formed by a pressing process on a metal plate may be used as the first wiring 140. However, the configuration is not limited thereto, and there are also various examples having various other configurations. For example, a flat coil (flat standing coil) coated with an insulating coating may be used as the first wiring 140, or a general insulating wire may also be used as the first wiring 140.

[0086] The first wiring 140 may also be configured as part of a circuit wiring formed by etching a metal plate such as a copper foil. In this example, the first wiring 140 may be manufactured by patterning a copper clad laminate (CCL), but is not limited thereto.

[0087] In addition, asFigure 4 and Figure 5 As shown in Figure 5 , the first wiring 140 according to the example may include an insertion groove 145. A part or all of the connection wiring 153 described below may be inserted and disposed in the insertion groove 145. Accordingly, the insertion groove 145 may be formed in a region facing the connection wiring 153, and may be formed in a groove form that reduces the thickness of the first wiring 140.

[0088] The insertion groove 145 may have a depth that is the same as or similar to the thickness of the connection wiring 153. In addition, since the connection wiring 153 and the insulating plate 120 are inserted and disposed in the insertion groove 145, the width of the insertion groove 145 may be greater than the width of the connection wiring 153.

[0089] Since the connection wiring 153 is disposed to extend in a direction crossing the first spiral wiring 141 of the first wiring 140, the insertion groove 145 may be formed in all turns of the first spiral wiring 141 constituting the first wiring 140.

[0090] Although not shown, according to the example, the insertion groove 145 may be selectively formed in a region of the first wiring 140 facing the second wiring 150 in addition to the above positions.

[0091] In an example where the insertion groove 145 is not formed, a part of the connection wiring 153 provided in the coil assembly protrudes from the insulating plate 120. However, since the coil assembly in the example may include the insertion groove 145, when the connection wiring 153 is completely inserted into the insertion groove 145, the thickness of the coil assembly may be defined as the thicknesses of the first wiring 140, the insulating plate 120, and the protection member 180. In addition, even if the connection wiring 153 protrudes partially outward from the insertion groove, since the thickness of the coil assembly only increases by the protruding thickness of the connection wiring 153, the thickness of the coil assembly can be significantly reduced.

[0092] The first wiring 140 may be attached to the insulating plate 120 through an adhesive layer 160 ( Figure 7 or Figure 8 ). Although an adhesive tape may be used as the adhesive layer 160, various types of adhesive members may also be used as long as the first wiring 140 can be firmly bonded to the insulating plate 120 by a method such as forming an adhesive layer by coating a liquid adhesive.

[0093] The second wiring 150 may be disposed on the second surface of the insulating plate 120 and may be connected to the first wiring 140. To this end, a connection conductor 125 ( Figure 4 ) that electrically connects the first wiring 140 and the second wiring 150 to each other may be disposed in the insulating plate 120. The connection conductor 125 may be formed by forming a through hole 121 in the insulating plate 120 ( Figure 7 or Figure 8) and is formed by filling a conductive material in the through hole 121.

[0094] Hereinafter, in the description of the example, unless otherwise described, the connection between the first wiring 140 and the second wiring 150 means that the first wiring 140 and the second wiring 150 can be connected to each other through the connection conductor 125 included in the insulating board 120.

[0095] The second wiring 150 may include a second spiral wiring 151 and a connection wiring 153.

[0096] The second spiral wiring 151 may be formed in a spiral shape and may be disposed at a position corresponding to the central region of the first spiral wiring 141 of the first wiring 140. Here, the central region (the central portion of the first spiral wiring 141) refers to the region where no wiring is provided. In addition, the position corresponding to the central region refers to the position facing the inside of the central region of the first spiral wiring 141 or the position facing the boundary of the central region of the first spiral wiring 141, between which the insulating board 120 is interposed.

[0097] One end of the second spiral wiring 151 may be connected to the connection wiring 153, and the other end of the second spiral wiring 151 may be connected to the end disposed at the central side of the first spiral wiring 141 through the connection conductor 125.

[0098] In addition, when the second spiral wiring 151 is projected onto the first surface of the insulating board 120, the first spiral wiring 141 and the second spiral wiring 151 may be disposed so as not to overlap each other except for a part connected to the connection conductor 125.

[0099] In the example, the second spiral wiring 151 may have a plurality of turns. However, the second spiral wiring 151 is not limited thereto and may also be formed in one turn. In addition, as in the following example, the second spiral wiring 151 may be formed in an arc shape instead of a complete turn.

[0100] The line width of the second spiral wiring 151 according to the example may be different from the line width of the first wiring 140. More specifically, in the example, the line width of the second spiral wiring 151 may be narrower than the line width of the first wiring 140.

[0101] Since the magnetic flux is concentrated in the central region of the coil wiring 130, eddy currents will be concentrated on the wiring (such as the second spiral wiring) near the central region. In addition, the eddy currents will increase as the size (e.g., width) of the wiring increases.

[0102] However, in the example where the line width of the second spiral wiring 151 is narrower than the line width of the first spiral wiring 141, since the width of the wiring is significantly reduced, the occurrence of eddy currents can be significantly suppressed. As a result, the loss caused by eddy currents can be significantly reduced.

[0103] In a non-limiting example, the second spiral wiring 151 may not be formed as the second wiring 150, but may be formed as a part of the first wiring 140.

[0104] However, since the line width of the second spiral wiring 151 can be narrow, there are limitations when forming the second spiral wiring 151 together with the first wiring 140 by a pressing process.

[0105] Therefore, in the coil assembly according to the example, the first wiring 140 can be manufactured to have a line width that can be formed by a pressing process, and a part that is not easily manufactured by the pressing process can be formed as the second wiring 150 by a printing method.

[0106] According to the example, the winding direction of the second spiral wiring 151 can be formed in the same direction as the winding direction of the first wiring 140. In addition, an end portion provided in the center of the second spiral wiring 151 can be connected to the first wiring 140, and an end portion provided on the outer side of the second spiral wiring 151 can be connected to the connection wiring 153.

[0107] To this end, an extension wiring 148 extending a predetermined distance toward the center of the first spiral wiring 141 can be provided at an end portion of the first spiral wiring 141 provided on the center side to face the end portion of the second spiral wiring 151 provided on the center side.

[0108] Such a configuration can be a configuration for forming, for example, a second spiral wiring 151 having two or more turns. Therefore, in an example where the second spiral wiring 151 is formed with three or more turns, the extension wiring 148 can protrude a longer length.

[0109] The connection wiring 153 can be provided in a form intersecting the first spiral wiring 141 of the first wiring 140 in the radial direction. One end of the connection wiring 153 can be connected to the second spiral wiring 151, and the other end of the connection wiring 153 can be connected to the second lead portion 143b of the first wiring 140 from the outside of the first spiral wiring 141 through the connection conductor 125.

[0110] Therefore, the second lead portion 143b of the first wiring 140 can be electrically connected to the first spiral wiring 141 through the second wiring 150.

[0111] Since the second wiring 150 can be formed by methods such as printing or plating as described below, the second wiring 150 can have a thickness thinner than that of the first wiring 140. Therefore, in an example where the connection wiring 153 does not have a sufficient width, the loss occurring in the connection wiring 153 will increase.

[0112] To prevent these losses, according to an example, the connection wiring 153 may have a line width wider than that of the second spiral wiring 151 or the first wiring 140. For example, the connection wiring 153 may have a width equal to twice the width of the lead portion 143. However, the connection wiring 153 is not limited thereto, and in an example where the losses occurring in the connection wiring 153 are not significant, the connection wiring 153 may have the same or a similar width as the width of the lead portion 143 or the first wiring 140.

[0113] The second wiring 150 constructed as described above may be formed by printing a conductive material on the insulating board 120. In the process of forming the second wiring 150, the connection conductor 125 may be formed together with the second wiring 150 by filling a conductive material in a through hole (formed in the insulating board 120).

[0114] A material in which resin and conductive fillers are mixed may be used as the conductive material for forming the second wiring 150. For example, conductive epoxy resin may be used. In this example, the second wiring 150 may be formed using a plurality of conductive fillers and a resin for fixing the plurality of conductive fillers. However, the example is not limited thereto.

[0115] Therefore, the second wiring 150 may be formed as a metal thin film wiring to have a thickness thinner than that of the first wiring 140 formed as a pressed coil or a flat coil.

[0116] The second wiring 150 may include at least one plating layer 150b ( Figure 5 ). In this example, the second wiring 150 may be divided into a conductive layer 150a ( Figure 5 ) that can be formed by printing a conductive material and a plating layer 150b formed on the surface of the conductive layer 150a. In this example, the conductive layer 150a may be formed using a copper (Cu) material, and the plating layer 150b may be formed using a gold (Au) or nickel (Ni) material. However, the compositions of the conductive layer 150a and the plating layer 150b are not limited thereto. In addition, in the example, the plating layer 150b may be formed as a multi-layer.

[0117] Since the second wiring 150 can be formed by printing and plating processes, the second wiring 150 may have a thickness thinner than that of the first wiring 140. However, if necessary, the second wiring 150 may also be formed to have the same thickness or line width as that of the first wiring 140 by stacking a plurality of plating layers.

[0118] As described above, in the example, the first wiring 140 and the second wiring 150 may be manufactured by different methods. Therefore, the first wiring 140 and the second wiring 150 may have different cross-sectional shapes.

[0119] In an example where the first wiring 140 is formed as a pressed coil, as Figure 6AAs shown in [the figure], the cross-section of the first wiring 140 may be formed such that the width of the bonding surface of the first wiring 140 bonded to the insulating board 120 is narrower than the width of the opposite surface of the bonding surface (i.e., the surface of the first wiring 140 attached to the protection member 180). The shape of the pressed coil will be described in more detail in the manufacturing method to be described below.

[0120] Similarly, in an example where the first wiring 140 is formed by etching a metal plate (e.g., copper foil), as Figure 6B shown in [the figure], the two side surfaces of the cross-section of the first wiring 140 may be formed to be concave, and the width of the bonding surface of the first wiring 140 bonded to the insulating board 120 may be narrower than the width of the opposite surface of the bonding surface (i.e., the surface of the first wiring 140 attached to the protection member 180). Such a shape may be naturally formed in the process of removing unnecessary portions of the metal plate by an etching method. This will also be described in more detail in the manufacturing method to be described below.

[0121] Since the second wiring 150 may be formed by a printing method, the width of the bonding surface of the second wiring 150 bonded to the insulating board 120 may be equal to or greater than the width of the opposite surface of the bonding surface.

[0122] Therefore, in an example, the cross-section of the first wiring 140 may be formed such that the width of the bonding surface bonded to the insulating board 120 is narrower than the width of the opposite surface of the bonding surface, and the cross-section of the second wiring 150 may be formed such that the width of the bonding surface bonded to the insulating board 120 is equal to or greater than the width of the opposite surface of the bonding surface.

[0123] The coil assembly according to the example may include connection pads 138 ( Figure 3 ).

[0124] The connection pads 138 may be respectively provided at the ends of the lead portions 143. The connection pads 138 may be in contact with external components and may be electrically connected to the external components. In an example, the connection pads 138 may be provided on the first surface of the insulating board 120 in the shape of square patches. However, the connection pads 138 are not limited thereto, but may be formed on the second surface of the insulating board 120, or may also be formed in various shapes such as in a circular shape or a polygonal shape as examples.

[0125] In addition, in an example, the coil assembly may include a protection member 180. The protection member 180 may cover the first wiring 140 and the second wiring 150, and may be bonded to, for example, the opposite surface of the insulating board 120 to protect the coil wiring 130 from external environmental factors.

[0126] Various members such as an insulating film or an insulating tape may be used as the protection member 180 as long as they can be easily bonded to the insulating board 120 and have electrical insulation properties.

[0127] Since the connection pad 138 can be an area in contact with an external component, the protection member 180 can be partially removed from the connection pad 138. As a result, at least a part of the connection pad 138 can be exposed outward from the protection member 180.

[0128] Since the above-described exemplary coil assembly can have the second wiring 150 disposed in the insertion groove 145 formed in the first wiring 140, the thickness of the coil assembly can be significantly reduced. As a result, the coil assembly can be easily mounted in a thin portable terminal.

[0129] In addition, in the coil wiring 130 of the coil assembly, the spiral wirings 141 and 151 can be respectively disposed to be distributed in the first wiring 140 and the second wiring 150, and the first wiring 140 and the second wiring 150 are respectively disposed on opposite surfaces of the insulating plate 120. Therefore, in the process of manufacturing the first wiring 140 by a pressing process and forming the second wiring 150 by printing, the inductance of the entire spiral wiring can be adjusted by adjusting the length of the second wiring 150. Therefore, the inductance can be adjusted during the manufacturing process.

[0130] Next, with reference to Figure 7 and 8 will be further described Figure 3 the manufacturing method of the coil assembly shown in Figure 7 shows an example of a manufacturing method using a pressed coil as the first wiring 140. Figure 8 is a cross-sectional view showing an example of a manufacturing method of etching a metal plate and using the etched metal plate as the first wiring 140. In Figure 7 and Figure 8 the second wiring 150 represents the connection wiring 153.

[0131] Referring to Figure 7 in the example, the manufacturing method of the coil assembly may first include an operation of preparing the first wiring 140.

[0132] The first wiring 140 can be prepared by the following steps: preparing a metal plate P with a carrier film C attached to the second surface of the metal plate P (operation S01), and then pressing the metal plate P using a pressing die M (operation S02). In this example, due to the structure of the pressing die M, the cross-section of the first wiring 140 can be formed such that the width of the second surface of the first wiring 140 is greater than the width of the first surface of the first wiring 140.

[0133] If the first wiring 140 is prepared, the first surface of the first wiring 140 can be bonded to the first surface of the insulating plate 120 (operation S03). In this example, an adhesive layer 160 can be interposed between the first surface (bonding surface) of the first wiring 140 and the insulating plate 120.

[0134] In addition, the connection conductor 125 and the conductive layer 150a can be formed by printing a conductive material on the second surface of the insulating plate 120 and in the through holes 121, and the plating layer 150b can be formed by performing a plating process. As a result, the second wiring 150 can be completed.

[0135] Next, the coil assembly can be completed by removing the carrier film C attached to the second surface of the first wiring 140 and then attaching the protection member 180 to the surface of the second wiring 150 and the second surface of the first wiring 140 respectively (operation S04).

[0136] As Figure 8 shown, in the example of etching the metal plate P to be used as the first wiring 140, the metal plate P with the insulating film 180a attached to the second surface thereof can be prepared (operation S001), and then the first wiring 140 can be prepared by removing the unnecessary portions of the metal plate P through an etching process (operation S002).

[0137] In this example, since etching is more effectively performed on the first surface of the metal plate P (which is more likely to come into contact with the etchant than the second surface of the metal plate P on which the insulating film 180a is attached), the cross section of the first wiring 140 can be formed such that the width of the second surface is greater than the width of the first surface.

[0138] If the first wiring 140 is prepared, the first surface of the first wiring 140 can be bonded to the first surface of the insulating plate 120 (operation S003). In this example, the adhesive layer 160 can be interposed between the first surface of the first wiring 140 and the insulating plate 120.

[0139] Next, the connection conductor 125 and the conductive layer 150a can be formed by printing a conductive material on the second surface of the insulating plate 120 and in the through holes 121, and the plating layer 150b can be formed by performing a plating process. Thus, the second wiring 150 can be completed.

[0140] Next, the coil assembly can be completed by attaching the protection member 180 to the surface of the second wiring 150 (operation S004).

[0141] In Figure 8 the shown example, the insulating film 180a can be used as the protection member 180 for protecting the first wiring 140 without performing a separate process ( Figure 4 ). Therefore, as in the example of Figure 7 , the process of removing the carrier film C from the first wiring 140 and attaching the protection member 180 again can be omitted.

[0142] In the example of the manufacturing method of the above coil assembly, the second wiring 150 and the connection conductor 125 can be formed and manufactured through the following steps: The first wiring 140 prepared by a pressing process or an etching process is bonded to the first surface of the insulating board 120, and a conductive material is printed on the second surface of the insulating board 120 and in the through holes. Therefore, compared with a typical coil assembly using an FPCB (flexible printed circuit board), the coil assembly can be manufactured very easily, and its manufacturing cost can be greatly reduced.

[0143] In addition, in the example of the manufacturing method, the manufacturing methods of the first wiring 140 and the second wiring 150 can be different from each other. As a result, the first wiring 140 and the second wiring 150 can have different cross-sectional shapes.

[0144] Specifically, the cross-section of the first wiring 140 can be formed such that the width of the bonding surface (i.e., the surface of the first wiring 140 bonded to the insulating board 120) is narrower than the width of the opposite surface of the bonding surface of the first wiring 140, and the cross-section of the second wiring 150 can be formed such that the width of the bonding surface of the second wiring 150 is equal to or greater than the width of the opposite surface of the bonding surface of the second wiring 150.

[0145] In addition, since the first wiring 140 can be attached to the insulating board 120 by preparing a metal plate P and then processing the metal plate P, an adhesive layer 160 can be interposed between the first wiring 140 and the insulating board 120.

[0146] On the other hand, since the second wiring 150 can be formed by directly printing a conductive material on the insulating board 120, the adhesive layer 160 is not interposed between the second wiring 150 and the insulating board 120, and the second wiring 150 can be directly bonded to the insulating board 120.

[0147] Therefore, the bonding structure of the first wiring 140 can be different from the bonding structure of the second wiring 150.

[0148] The examples are not limited to the above examples, and various modifications can be made.

[0149] Figure 9 is an exploded perspective view schematically showing an example of a coil assembly (such as Figure 4 of the coil assembly), but the example is not limited thereto. In the examples described below, for ease of explanation, the protective member 180 (for example, Figure 4 ) is omitted, but the protective member 180 may or may not be included in different examples.

[0150] Referring to Figure 9 , in the example, the coil assembly may include a first insulating board 120a and a second insulating board 120b.

[0151] The first insulating plate 120a can be constructed in a manner similar to the insulating plate 120 described in any of the examples above with respect to, for example, Figures 3 to 8 The first wiring 140 can be disposed on the first surface of the first insulating plate 120a, and the second spiral wiring 151 of the second wiring 150 can be disposed on the second surface of the first insulating plate 120a.

[0152] The second insulating plate 120b can be disposed to be stacked on the first insulating plate 120a. In addition, the second spiral wiring 151 of the second wiring 150 can be disposed on the first surface of the second insulating plate 120b. As a result, the second spiral wiring 151 of the second wiring 150 can be disposed between the first insulating plate 120a and the second insulating plate 120b.

[0153] The connecting wiring 153 of the second wiring 150 can be disposed on the second surface of the second insulating plate 120b. Therefore, in order to electrically connect the connecting wiring 153 and the second spiral wiring 151 to each other, the second insulating plate 120b can include a connecting conductor 125.

[0154] In the example, the coil assembly can be manufactured by the following steps: bonding the first wiring 140 prepared by a pressing process to the first surface of the first insulating plate 120a, forming the second spiral wiring 151 by printing a conductive material on the second surface of the first insulating plate 120a, stacking the second insulating plate 120b on the second spiral wiring 151, and then printing the connecting wiring 153 on the second insulating plate 120b.

[0155] As described above, in a non-limiting example, the second wiring 150 can be disposed to be distributed between a plurality of insulating plates 120a and 120b. The second spiral wiring 151 and the connecting wiring 153 can be formed by printing a conductive material on the first insulating plate 120a and the second insulating plate 120b.

[0156] Figure 10 is a plan view schematically showing an example of the coil assembly, Figure 11 shows Figure 10 is an exploded plan view of the coil assembly shown in, but the example is not limited thereto.

[0157] Referring to Figure 10 and Figure 11 , in the example coil assembly, in addition to the first spiral wiring 141 and the lead portion 143, the first wiring 140 can further include a connecting portion 142. In addition, the second spiral wiring 151 of the second wiring 150 can include an arc-shaped wiring 152, and the arc-shaped wiring 152 may not be directly connected to, for example, the connecting wiring 153.

[0158] Although the arc-shaped wiring 152 can be configured as part of the second spiral wiring 151, it can also be arranged to be separated outward from the second spiral wiring 151 in a form surrounding the second spiral wiring 151, and can be electrically connected to the second spiral wiring 151 through the connection part 142 included in the first wiring 140.

[0159] Such a configuration can be a configuration for forming the second spiral wiring 151 with two turns. Therefore, in an example where the second spiral wiring 151 is formed with three or more turns, the arc-shaped wiring 152 or the connection part 142 can be included.

[0160] In an example, the connection wiring 153 of the second wiring 150 can have the same width as the lead part 143 of the first wiring 140. Thus, the width of the connection wiring 153 can be varied in various forms.

[0161] Figure 12 is a plan view schematically showing an example of a coil assembly (such as Figure 4 the coil assembly), but the example is not limited thereto.

[0162] Referring to Figure 12 , in the example coil assembly, the second spiral wiring 151 of the second wiring 150 may not form a complete turn, but may be formed in an arc shape. Thus, the second spiral wiring 151 can be varied in various shapes as long as it can be used as part of a spiral coil together with the first spiral wiring 141.

[0163] In addition, the connection wiring 153 of the second wiring 150 is also shown as being branched to have multiple paths to have Litz wire characteristics. In this example, since the connection wiring 153 can have the form of a Litz wire, the connection wiring 153 can provide an effect similar to that of a Litz wire.

[0164] Figure 13 is an exploded perspective view schematically showing an example of a coil assembly.

[0165] Referring to Figure 13 , the example coil assembly may include a plurality of coil wirings 130a and 130b.

[0166] In an example, the coil assembly may include a first coil wiring 130a provided on opposite surfaces of the third insulating plate 120c and a second coil wiring 130b provided on opposite surfaces of the fourth insulating plate 120d. In addition, a separate insulating member 120e may be provided between the first coil wiring 130a and the second coil wiring 130b.

[0167] The first coil wiring 130a and the second coil wiring 130b can each be in accordance with the above Figure 4a structure configuration identical to that of the coil wiring 130 and can be set to be stacked together. Here, the identical structure basically refers to a structure in which the first wiring and the second wiring are set to be distributed on opposite surfaces of an insulating plate, and the first wiring and the second wiring together form a spiral coil.

[0168] However, the first coil wiring 130a and the second coil wiring 130b are not limited to this, and the first coil wiring 130a and the second coil wiring 130b can also be formed to have a structure of the coil wiring according to the Figure 10 or Figure 12 example shown in, and in other examples, the first coil wiring 130a and the second coil wiring 130b can also be formed according to different structures.

[0169] In addition, the first coil wiring 130a and the second coil wiring 130b can be horizontally arranged on an insulating plate, or the first coil wiring 130a can be arranged on the central area of the second coil wiring 130b. Thus, the second coil wiring 130b can be arranged at various positions as long as these positions are around the first coil wiring 130a or very close to the first coil wiring 130a.

[0170] As a non-limiting example, the first coil wiring 130a and the second coil wiring 130b can each perform at least one function among power transmission and reception for wireless charging, radio frequency identification (RFID), near field communication (NFC), and magnetic secure transmission (MST).

[0171] In a non-limiting example, the first coil wiring 130a can be used for power transmission and reception for wireless charging, and the second coil wiring 130b can be used for any one of, for example, RFID, NFC, and MST.

[0172] In addition, various variations are possible. For example, the first coil wiring 130a can be used for NFC, and the second coil wiring 130b can be used for MST.

[0173] Although the example shows a coil assembly including two coil wirings 130a and 130b, in the example, a third coil wiring and a fourth coil wiring can also be additionally arranged in the same way.

[0174] In addition, although an example showing that the two coil wirings 130a and 130b have the same size is shown, the coil wirings can also have different sizes. For example, the second coil wiring 130b can be arranged in the central area of the first coil wiring 130a.

[0175] Figure 14 is a plan view schematically showing an example of the coil assembly, Figure 15 is Figure 14Exploded perspective view of the exemplary coil assembly shown. For ease of explanation, Figure 14 shows a state without Figure 15 the protective member 180.

[0176] In the example, the coil assembly can be constructed in a manner similar to the way of the coil assembly shown in Figure 3 and Figure 4 . These examples are not limited thereto. Therefore, repeated detailed descriptions of such components will be omitted.

[0177] Referring to Figure 14 and Figure 15 , the coil assembly may have connection pads 1381 and lead portions 1431 that may be included in the second wiring 150. Accordingly, the first wiring 140 may include only the first spiral wiring 141, and the second wiring 150 may include the second spiral wiring 151, connection wiring 153, lead portions 1431, and connection pads 1381.

[0178] According to the example, the lead portion 1431 refers to the wiring that connects the first spiral wiring 141 and the connection wiring 153 to the connection pad 1381, respectively.

[0179] The lead portion 1431 and the connection pad 1381 may be formed by printing a conductive material on the insulating board 120 in a manner similar to the second spiral wiring 151 or the connection wiring 153.

[0180] Therefore, the lead portion 1431 and the connection pad 1381 may be formed together with the second spiral wiring 151 or the connection wiring 153 in a first process (e.g., operation S03 in Figure 7 ) and a second process (e.g., operation S04 in Figure 7 ), wherein, in the first process, the first surface of the first wiring 140 is bonded to the first surface of the insulating board 120, and in the second process, the connection conductor 125 and the conductive layer 150a are formed by printing a conductive material on the second surface of the insulating board 120 and in the through holes 121, and the plating layer 150b is formed by performing a plating process.

[0181] Furthermore, according to the example, the connection pad 1381 may be defined as the area exposed to the outside of the protective member 180 through the pad hole 180b formed in the protective member 180 at the end of the lead portion 1431. Therefore, the connection pad 1381 may be constructed as a part of the lead portion 1431.

[0182] However, the connection pad 1381 is not limited thereto. A metal layer may be additionally stacked on an end portion of the lead portion 1431, and a portion where the metal layer is formed may also be used as the connection pad 1381. Such a configuration may be achieved by attaching the protection member 180 to the second surface of the insulating board 120 where the lead portion 1431 is formed and then coating or filling a conductive material in the pad hole 180b formed in the protection member 180.

[0183] The metal layer may be formed as a single layer or multiple layers, and may be selectively formed using materials such as copper (Cu), gold (Au), or nickel (Ni) as examples. However, the configuration of the present disclosure is not limited thereto. The coil assembly according to the example may be manufactured by the following operations: an operation of bonding the first wiring 140 prepared by a pressing process or an etching (e.g., photolithography) method to the first surface of the insulating board 120, an operation of forming the connection conductor 125, the second spiral wiring 151, the connection wiring 153, the lead portion 1431, and the connection pad 1381 by printing a conductive material on the second surface of the insulating board 120, and an operation of attaching the protection member 180 to the second surface of the insulating board 120 to expose the connection pad 1381.

[0184] In the coil assembly configured as described above, the first wiring 140 may include only the first spiral wiring 141, and the remaining wiring (e.g., the second wiring) may be formed by printing a conductive material on the insulating board 120. Therefore, the first wiring 140 may be simply formed in a spiral shape. This will be described in more detail below.

[0185] Figure 16A and Figure 16B are views showing an example of a process of manufacturing the first wiring, and show an example of a process of co-manufacturing a plurality of first wirings 140 (such as Figure 4 of the coil assembly), but the example is not limited thereto. For example, Figure 16A shows an example of a process of manufacturing the first wiring 140 shown in the above Figure 4 , Figure 16B shows an example of a process of manufacturing the first wiring 140 such as Figure 15 shown in.

[0186] In the example, the first wiring 140 may be formed by patterning a copper clad laminate (CCL) or by performing a pressing process on a metal plate as described above. Therefore, in Figure 16A and Figure 16B , P1 may be a copper clad laminate or a metal plate. In addition, in Figure 16A and Figure 16B , the first wiring 140 may be a metal pattern remaining on the copper clad laminate or may be a pressed coil pressed from a metal plate.

[0187] Reference Figure 16A and Figure 16B , Figure 16A the first wiring 140 shown in may include a first spiral wiring 141 and a lead portion 143. In addition, Figure 16B the first wiring 140 shown in may include only the first spiral wiring 141.

[0188] Therefore, Figure 16A the entire area occupied by one of the first wirings 140 shown in may be larger than Figure 16B the area occupied by one of the first wirings 140 shown in. Thus, in an example where a plurality of first wirings 140 are made of a material P1 (copper-clad laminate or metal plate) having the same dimensions as those shown in Figure 16A and 16B since the first wiring 140 shown in requires fewer manufacturing processes, the manufacturing time and cost can be reduced. Figure 16B In addition, since the first wiring 140 shown in includes only the first spiral wiring 141, various types of coil components can be manufactured by manufacturing a plurality of first wirings 140 in the same shape (e.g., standard specifications) and then adding second wirings 150 of various shapes. Therefore, coil components having leads with different positions and shapes can be manufactured by differently constructing only the second wiring 150 using the same first wiring 140 without having to remanufacture the entire coil component.

[0189] In addition, since Figure 16B the first wiring 140 shown in includes only the first spiral wiring 141, various types of coil components can be manufactured by manufacturing a plurality of first wirings 140 in the same shape (e.g., standard specifications) and then adding second wirings 150 of various shapes. Therefore, coil components having leads with different positions and shapes can be manufactured by differently constructing only the second wiring 150 using the same first wiring 140 without having to remanufacture the entire coil component.

[0190] As described above, in the example, the size of the first wiring 140 can be significantly reduced and the first wiring 140 can be standardized. Therefore, the process of manufacturing the coil component can be simplified and its manufacturing cost can be reduced.

[0191] Figure 17 is an exploded perspective view schematically showing an example of a coil component, where, for ease of explanation, the protective member 180 ( Figure 15 ) is omitted, but the protective member 180 may be included in other examples. In the example, the coil component may be constructed in a manner similar to that of the coil component shown in, for example, Figure 9 . Therefore, a detailed description of such a component will be omitted.

[0192] In an example of the coil component, similar to the coil component shown in Figure 15 , a connection pad 1381 and a lead portion 1431 may be included in the second wiring 150. Therefore, the first wiring 140 may include only the first spiral wiring 141, and the second wiring 150 may include a second spiral wiring 151, a connection wiring 153, a lead portion 1431, and a connection pad 1381.

[0193] In addition, the first wiring 140 may be disposed on the first surface of the first insulating plate 120a, and the second spiral wiring 151 of the second wiring 150 may be disposed on the second surface of the first insulating plate 120a and the first surface of the second insulating plate 120b. In addition, the connection wiring 153, the lead portion 1431, and the connection pad 1381 of the second wiring 150 may be disposed on the second surface of the second insulating plate 120b.

[0194] Therefore, in order to electrically connect the connection wiring 153 and the second spiral wiring 151 to each other, the second insulating plate 120b may include a connection conductor 125. In an example where a protection member ( Figure 15 in 180) is formed, a pad hole may be formed in the protection member ( Figure 15 in 180) to expose the connection pad 1381.

[0195] The coil assembly according to the example may be manufactured by the following operations: an operation of bonding the first wiring 140 prepared by a pressing process or an etching (e.g., photolithography) method to the first surface of the first insulating plate 120a, an operation of forming the second spiral wiring 151 by printing a conductive material on the second surface of the first insulating plate 120a, an operation of stacking the second insulating plate 120b on the second spiral wiring 151 and then printing the connection conductor 125, the connection wiring 153, the lead portion 1431, and the connection pad 1381 on the second insulating plate 120b, and an operation of attaching the protection member 180 to expose the connection pad 1381.

[0196] Figure 18 is a perspective view schematically showing an example of the coil assembly.

[0197] The example coil assembly may include a first coil wiring 130a and a second coil wiring 130b. The first coil wiring 130a and the second coil wiring 130b may each include a first wiring 140 disposed on the first surface of the insulating plate 120 and a second wiring 150 disposed on the second surface of the insulating plate 120.

[0198] In addition, both the first wiring 140 of the first coil wiring 130a and the first wiring 140 of the second coil wiring 130b may include only the first spiral wiring 141, and the second wiring 150 may include the second spiral wiring 151, the connection wiring 153, the lead portion 1431, and the connection pad 1381.

[0199] In a non-limiting example, the first coil wiring 130a and the second coil wiring 130b may each perform at least one function such as transmission and reception of power for wireless charging, radio frequency identification (RFID), near field communication (NFC), and magnetic secure transmission (MST).

[0200] For example, the first coil wiring 130a can be used to transmit and receive power for wireless charging, and the second coil wiring 130b can be used for any one of, for example, RFID, NFC, and MST.

[0201] In addition, various variations can be implemented in various examples. In a non-limiting example, the first coil wiring 130a can be used for NFC, and the second coil wiring 130b can be used for MST.

[0202] Although the example shows a coil assembly including two coil wirings 130a and 130b, in other examples, at least a third coil wiring and a fourth coil wiring can also be additionally provided in the same manner.

[0203] In the example, the lead portions 1431 of the first coil wiring 130a and the second coil wiring 130b can be arranged in the same direction. However, the configuration of the example is not limited to this. The lead portions 1431 of the first coil wiring 130a and the second coil wiring 130b can also be arranged in different directions. For example, the connection pads 1381 of the first coil wiring 130a and the connection pads 1381 of the second coil wiring 130b can be arranged in opposite directions.

[0204] In the above example, although an example in which the coil wiring is used to transmit and receive power for wireless charging is described as an example, in other examples, the coil wiring can also be used as an antenna. In a non-limiting example, the coil wirings can each be used as an antenna that performs at least one function of radio frequency identification (RFID), near field communication (NFC), and magnetic secure transmission (MST).

[0205] As described above, according to various examples, a coil assembly can be manufactured by bonding a first wiring to a first surface of an insulating board and printing a conductive material on a second surface of the insulating board and in a through hole to form a second wiring and a connection conductor. Therefore, compared with a typical coil assembly using an FPCB, the coil assembly can be manufactured very easily, and its manufacturing cost can be greatly reduced.

[0206] In addition, since the second wiring can be disposed in the insertion groove formed in the first wiring, the thickness of the coil assembly can be significantly reduced. As a result, the coil assembly can be easily mounted in a thin portable terminal.

[0207] While the present disclosure includes specific examples, it will be apparent after understanding the disclosure of this application that various changes in form and detail may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein will be considered only in a descriptive sense and not for purposes of limitation. The description of a feature or aspect in each example will be considered applicable to similar features or aspects in other examples. Suitable results may be obtained if the described techniques are performed in a different order, and / or if components in the described systems, architectures, devices, or circuits are combined in a different manner, and / or replaced or augmented by other components or their equivalents. Accordingly, the scope of the present disclosure is not limited by the specific embodiments, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents will be construed as being included in the present disclosure.

Claims

1. A coil assembly, comprising: Insulating board; A first wiring, disposed on a first surface of the insulating board and including a first spiral wiring; And A second wiring, disposed on a second surface of the insulating board and electrically connected to the first wiring, Wherein, the second wiring includes a second spiral wiring extending from the first spiral wiring, and The first wiring and the second wiring have different cross-sectional shapes, The first wiring is formed such that a width of a bonding surface of the first wiring bonded to the insulating board is narrower than a width of a relative surface of the bonding surface of the first wiring, and The second wiring is formed such that a width of a bonding surface of the second wiring bonded to the insulating board is greater than or equal to a width of a relative surface of the bonding surface of the second wiring, and a thickness of the second wiring is equal to or less than a thickness of the first wiring, A line width of the second spiral wiring is equal to or less than a line width of the first spiral wiring, The first wiring and the second wiring are manufactured by different methods, The first wiring is manufactured by a pressing process or a photolithography process, The second wiring is manufactured by a printing process of a conductive material, The first wiring is bonded to the insulating board through an adhesive layer, and the second wiring is directly bonded to the insulating board, Wherein, the adhesive layer is formed by using either a method of using an adhesive tape or a method of coating a liquid adhesive.

2. The coil assembly according to claim 1, further comprising a connection conductor arranged to penetrate the insulating plate, wherein, The first wiring and the second wiring are electrically connected to each other through the connecting conductor.

3. The coil assembly according to claim 1, wherein, The first wiring includes a lead portion disposed to be separated from the first spiral wiring, and The second wiring includes a connecting wiring extending radially outward from the second spiral wiring, and the connecting wiring is connected to the lead portion.

4. The coil assembly according to claim 3, wherein, The first wiring includes an insertion groove formed at a position facing the connecting wiring, and At least a part of the connecting wiring is disposed in the insertion groove.

5. The coil assembly according to claim 3, wherein, The connecting wiring branches into a plurality of paths.

6. The coil assembly according to claim 3, wherein, A line width of the connecting wiring is greater than a line width of the first wiring or the second spiral wiring.

7. The coil assembly according to claim 3, wherein, The first wiring includes a connecting portion disposed to be separated from the first spiral wiring, The second wiring includes an arc-shaped wiring disposed to be separated from the second spiral wiring, and The second spiral wiring and the arc-shaped wiring are electrically connected to each other through the connecting portion.

8. The coil assembly according to claim 1, wherein, The second wiring further includes: A connecting wiring extending radially outward from the second spiral wiring; Lead portions respectively extending from the first spiral wiring and the connecting wiring; and A connecting pad included at an end of the lead portion.

9. The coil assembly according to claim 8, further comprising a protection member arranged to cover the second wiring, wherein, The connecting pad includes an area where the lead portion is exposed outward from the protection member through a pad hole formed in the protection member.

10. The coil assembly according to claim 9, wherein the coil assembly further comprises a metal layer stacked on the lead portion exposed through the pad hole of the protection member.

11. The coil assembly according to claim 1, wherein, The second spiral wiring is formed in an arc shape.

12. The coil assembly according to claim 1, wherein, The second wiring is formed of a metal thin film wiring formed by printing a conductive material on the insulating board.

13. The coil assembly according to claim 1, the coil assembly further comprising: A first coil wiring, constituted by the first wiring and the second wiring; And A second coil wiring, disposed to be stacked with the first coil wiring, Among them, the first coil wiring and the second coil wiring each perform any one of functions of transmitting and receiving power for wireless charging, radio frequency identification, near field communication, and magnetic secure transmission.

14. The coil assembly according to claim 13, wherein, The second coil wiring is located at a position adjacent to the first coil wiring.

15. A coil assembly, comprising: Insulating plate; And Coil wiring, including a first wiring provided on a first surface of the insulating plate and a second wiring provided on a second surface of the insulating plate, The first wiring includes a first spiral wiring, and the second wiring includes a second spiral wiring, Among them, the first wiring further includes an insertion groove formed at a position facing the second wiring, and At least a part of the second wiring is disposed in the insertion groove, The first wiring is formed such that the width of the bonding surface of the first wiring bonded to the insulating plate is narrower than the width of the opposite surface of the bonding surface of the first wiring, and The second wiring is formed such that the width of the bonding surface of the second wiring bonded to the insulating plate is greater than or equal to the width of the opposite surface of the bonding surface of the second wiring, The thickness of the second wiring is equal to or less than the thickness of the first wiring, The line width of the second spiral wiring is equal to or less than the line width of the first spiral wiring, The first wiring and the second wiring are manufactured by different methods, The first wiring is manufactured by a pressing process or a photolithography process, The second wiring is manufactured by a printing process of a conductive material, The first wiring is bonded to the insulating plate through an adhesive layer, and the second wiring is directly bonded to the insulating plate, Among them, the adhesive layer is formed by any one of methods of using an adhesive tape or coating a liquid adhesive.

16. The coil assembly according to claim 15, wherein, The second spiral wiring of the second wiring is disposed at a position corresponding to the central region of the first spiral wiring of the first wiring.

17. A method of manufacturing a coil assembly, comprising: The first wiring is formed by a pressing process or a photolithography process, Bond the first wiring to the first surface of the insulating plate using an adhesive member; Print a conductive material on the second surface of the insulating plate and in the through holes to form the second wiring and the connecting conductor; And Electrically connect the first wiring to the second wiring through the connecting conductor to form the coil assembly, The first wiring includes a first spiral wiring, and the second wiring includes a second spiral wiring, The thickness of the second wiring is equal to or less than the thickness of the first wiring, The line width of the second spiral wiring is equal to or less than the line width of the first spiral wiring, The first wiring and the second wiring are manufactured by different methods, The first wiring is bonded to the insulating plate through an adhesive layer, and the second wiring is directly bonded to the insulating plate, Among them, the adhesive layer is formed by any one of methods of using an adhesive tape or coating a liquid adhesive.

18. The method according to claim 17, further comprising attaching a first protective member to the surface of the first wiring and attaching a second protective member to the surface of the second wiring.

19. The method according to claim 17, wherein The first wiring and the second wiring have different cross-sectional shapes.

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