A method for manufacturing a circuit board by combining a metal foil circuit and a wire circuit

Abstract

The present application relates to a kind of metal foil circuit and the method for making circuit board of wire circuit composite, specifically, copper foil is pasted on the film with adhesive of pad window punched, circuit is formed by die cutting or etching metal foil, parallel wire is pasted on another film with adhesive, or pasted on another film with adhesive after punching, form multiple parallel wire arrangement wire circuit, two kinds of circuit are pasted together face to face, form two kinds of circuit are sandwiched in the middle by two films with adhesive, and metal foil circuit and wire composite circuit board are made, the present application adopts two films with adhesive to clamp and paste two kinds of circuit, i.e., metal foil circuit and parallel arrangement wire circuit, so that parallel relatively thick main wire circuit and circuit of solder element are simultaneously sandwiched between two films, low-cost high-load high-efficiency circuit manufacturing is realized.

Description

Technical Field

[0001] The present invention relates to the field of circuit boards, and in particular to a method for manufacturing a circuit board by combining a metal foil circuit and a conductor circuit. Background Art

[0002] In order to achieve high conductivity and maintain a small voltage drop, the circuit boards in the light strip industry either use double-sided circuit boards and set a main conductor circuit from beginning to end on one side of the circuit to minimize the voltage drop. The main conductor circuit can be etched or wired, but this double-sided board structure often requires three layers of adhesive film to make, or two layers of adhesive film and a layer of solder mask ink to make, resulting in a complicated production process and high cost. Or when using circuit boards to make light strips, after soldering LED lights and other components on a single-sided board, positive and negative main conductors are added next to them. The main conductors and the circuit board are connected by manually twisting them one by one and connecting them with a small wire for conduction. This method has extremely high labor costs and is very inefficient.

[0003] In order to overcome the above-mentioned shortcomings, the metal foil circuit and the wire circuit are composited to produce a circuit board in the present invention. Two layers of adhesive films are used to clamp and align the two circuits that are bonded to the same layer, namely the metal foil circuit and the parallel arranged wire circuit. The parallel and relatively thick main wire circuit and the welding component circuit are sandwiched between the two layers of film at the same time, realizing low-cost, high-load and high-efficiency circuit production of light strips. Summary of the Invention

[0004] The present invention relates to a method for manufacturing a circuit board by combining a metal foil circuit and a conductor circuit. Specifically, copper foil is pasted on an adhesive film with a solder pad window punched out, a circuit is formed by die-cutting or etching the metal foil, parallel conductors are pasted on another adhesive film, or on another adhesive film after punching, to form a conductor circuit with multiple parallel conductors, and the two circuits are laminated together face to face, so that the two circuits are sandwiched between two layers of adhesive films to produce a metal foil circuit and conductor composite circuit board. The present invention adopts two layers of adhesive films to clamp and align the two circuits laminated on the same layer, namely the metal foil circuit and the parallel conductor circuit, so that the parallel relatively thick main conductor circuit and the soldering component circuit are sandwiched between the two layers of films at the same time, thereby realizing low-cost, high-load and high-efficiency circuit production.

[0005] According to the present invention, a method for manufacturing a circuit board by combining a metal foil circuit and a conductor circuit is provided, comprising: pasting copper foil on an adhesive film with a solder pad window punched out, forming a circuit by die-cutting or etching the metal foil, pasting parallel conductors on another adhesive film, or pasting them on another punched adhesive film to form a conductor circuit with multiple parallel conductors, pasting the two circuits together face to face, and pressing them tightly, wherein the metal foil circuit and the parallel conductor circuit are sandwiched between two layers of adhesive films, wherein the metal of the parallel conductors does not contact the metal of the metal foil circuit, or a portion of the metal of the metal foil circuit overlaps and contacts a portion of the metal of the parallel circuit, or the entire metal surface of the parallel circuit overlaps and contacts the metal of the metal foil circuit, and pads for soldering are provided on one side or both sides of the circuit board, thereby manufacturing a metal foil circuit and conductor composite circuit board.

[0006] According to the present invention, a composite circuit board of metal foil circuit and wire circuit is provided, comprising: an adhesive film with a solder pad window; a metal foil circuit; a parallel wire circuit; and an adhesive bottom film. The characteristic of the invention is that the metal foil circuit and the parallel wire circuit are sandwiched by two layers of adhesive films, the metal foil circuit and the parallel wire circuit maintain a certain distance and do not touch, or a part of the metal of the metal foil circuit overlaps and contacts with a part of the metal of the parallel wire circuit, or one side of the entire metal of the parallel wire circuit overlaps and contacts with a part of the metal of the metal foil circuit, the parallel wires are round wires or flat wires, the parallel wires are single wires or twisted wires, the adhesive bottom film is an adhesive film without holes, or an adhesive film with a solder pad window, there are solder pads for soldering on one side of the circuit board, or there are solder pads for soldering on both sides, the parallel wires and the metal foil circuit are firmly connected and conducted by soldering tin, soldering elements, or soldering metal conductors, or are conducted by conductive adhesive bonding, or are conducted by conductive ink connection, or are conducted by direct contact.

[0007] According to a preferred embodiment of the present invention, the metal foil circuit and wire circuit composite circuit board is characterized in that the film is a PET film, or a PI film, or a PEN film, or a glass fiber cloth.

[0008] According to a preferred embodiment of the present invention, the metal foil circuit and wire circuit composite circuit board is characterized in that the wire is a copper wire, or a copper-clad aluminum wire, or a copper-clad iron wire, or an aluminum wire.

[0009] According to a preferred embodiment of the present invention, the metal foil circuit and wire circuit composite circuit board is characterized in that the metal foil is copper foil or copper-aluminum composite foil.

[0010] The details of one or more embodiments of the invention are set forth in the accompanying drawings and the detailed description below. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The features, objects and advantages of the present invention will become more apparent by reading this specification in conjunction with the following drawings, a brief description of which follows.

[0012] Figure 1 This is a planar diagram of metal foil pasted on an adhesive film with a pad window punched out.

[0013] Figure 2 This is a schematic diagram of the cross section of the metal foil pasted on the adhesive film with the pad window punched out.

[0014] Figure 3 A schematic diagram of a planar circuit made of metal foil.

[0015] Figure 4 A schematic cross-sectional view of a metal foil circuit.

[0016] Figure 5 This is a planar diagram of a wire circuit made by pasting parallel wires on adhesive film.

[0017] Figure 6 FIG. 1 is a schematic plan view of a metal foil circuit and wire circuit composite circuit board according to a preferred embodiment of the present invention.

[0018] Figure 7 Schematic cross-sectional view of a metal foil circuit and wire circuit composite circuit board according to a preferred embodiment of the present invention.

[0019] Figure 8 This is a schematic plan view of a composite circuit board of a metal foil circuit and a wire circuit, in which a portion of the metal of the metal foil circuit and a portion of the metal of the parallel wire circuit overlap and contact each other, which is another preferred embodiment of the present invention.

[0020] Figure 9 This is a schematic cross-sectional view of a composite circuit board of a metal foil circuit and a wire circuit, in which a portion of the metal of the metal foil circuit and a portion of the metal of the parallel wire circuit overlap and contact each other, according to another preferred embodiment of the present invention. DETAILED DESCRIPTION

[0021] The present invention will be described in detail below by taking preferred embodiments as examples.

[0022] However, those skilled in the art should understand that the following descriptions are merely examples and descriptions of some preferred embodiments and do not impose any limitations on the claims of the present invention.

[0023] Paste the metal foil on the adhesive film 1 with the pad window 1.1 punched out (such as Figure 1 、 Figure 2As shown), a metal foil is cut with a die-cutting machine, the metal foil is cut through, the die-cutting depth is controlled so that the film 1 is not damaged, and the unnecessary metal foil portion is removed. The remaining metal foil forms a metal foil circuit 2, and a metal foil circuit (as shown) is made. Figure 3 、 Figure 4 shown).

[0024] Alternatively, the metal foil is pasted on the adhesive film 1 with the pad window 1.1 punched out (eg Figure 1 、 Figure 2 As shown), baked and cured, and then using the traditional circuit board manufacturing process, screen printing anti-corrosion circuit ink on the metal foil surface, baked and cured, and then screen printing anti-corrosion circuit ink on the pad window 1.1 on the adhesive film 1 side to cover the pad window 1.1, baked and cured, and removing the unnecessary metal foil part by etching, and then removing the screen printed anti-corrosion circuit ink to make as shown Figure 3 、 Figure 4 The metal foil circuit shown.

[0025] Paste the parallel wires 3 on the bottom adhesive film 4 to make Figure 5 The multiple parallel wire circuits shown are, alternatively, parallel wires 3 are pasted on a punched and glued bottom film 4.

[0026] The metal foil circuit 2 and the parallel wire circuit 3 prepared above are face to face, pasted and pressed together, and compacted. The metal foil circuit 2 and the parallel wire circuit 3 are sandwiched between the film 1 and the film 4. The metal foil circuit 2 and the parallel wire circuit 3 form a certain gap and do not contact each other. According to the design, one side of the circuit board has a soldering pad for welding, or both sides of the circuit board have a soldering pad for welding, so that a metal foil circuit and wire circuit composite circuit board (such as Figure 6 、 Figure 7 As shown), the parallel wires and the metal foil circuit are firmly connected and conducted by soldering tin, soldering components, or soldering metal conductors, or by conductive adhesive bonding.

[0027] Of course, according to the design requirements, a part of the metal circuit of the metal foil circuit 2 and a part of the metal circuit of the parallel wire circuit 3 can be overlapped and contacted together (such as Figure 8 、 Figure 9 As shown), the entire metal side of the parallel wire circuit 3 and a portion of the metal circuit of the metal foil circuit 2 can also be overlapped and contacted together.

[0028] The metal foil circuit and wire circuit composite circuit board of the present invention adopts two layers of adhesive films to clamp and align two circuits that are attached to the same layer, namely the metal foil circuit and the parallel arranged wire circuit, so that the parallel relatively thick main wire circuit and the welding component circuit are clamped between the two layers of film at the same time, realizing low-cost, high-load and high-efficiency circuit production.

[0029] The present invention has been described in detail above with reference to the accompanying drawings, using a specific embodiment of a method for fabricating a circuit board by combining a metal foil circuit and a conductive wire circuit. However, those skilled in the art should understand that the foregoing description is merely illustrative and describes some specific embodiments and does not limit the scope of the present invention, particularly the scope of the claims.

Claims

1. A method for manufacturing a circuit board by combining a metal foil circuit and a conductor circuit, comprising: The metal foil is pasted on an adhesive film with a pad window punched out, and the metal foil is die-cut or etched to remove the unnecessary metal foil part, and the remaining metal foil forms a metal foil circuit; the parallel wires are pasted on another adhesive film, or on another adhesive film after punching, to form a wire circuit with multiple parallel wires; the metal foil circuit and the wire circuit are laminated together face to face and compacted, and the metal foil circuit and the parallel wire circuit are sandwiched between two layers of adhesive films, and the two layers of adhesive films are directly pasted together, and the parallel wire metal and the metal foil circuit metal do not touch each other. The parallel wires and the metal foil circuit are firmly connected and conductive by welding components or welding metal conductors, or by conductive adhesive adhesion; or the metal of the parallel wires and the metal foil circuit is such that a part of the metal of the metal foil circuit and a part of the metal of the parallel circuit overlap and contact, or the entire metal surface of the parallel circuit overlaps and contact the metal of the metal foil circuit. One side or both sides of the circuit board have pads for welding, and thus a metal foil circuit and wire composite circuit board is made.

2. A metal foil circuit and wire circuit composite circuit board, comprising: Adhesive film with solder pad window; Metal foil circuits; parallel wire circuits; The bottom layer of the film with adhesive; It is characterized in that the metal foil circuit and the parallel wire circuit are sandwiched by the adhesive film with the solder pad window and the bottom adhesive film, a part of the metal of the metal foil circuit overlaps and contacts with a part of the metal of the parallel wire circuit, or one side of the entire metal of the parallel wire circuit overlaps and contacts with a part of the metal of the metal foil circuit, the parallel wires are round wires or flat wires, the parallel wires are single wires or twisted wires, the bottom adhesive film is an adhesive film without holes, or an adhesive film with a solder pad window, there are solder pads for welding on one side of the circuit board, or there are solder pads for welding on both sides, the parallel wires and the metal foil circuit are firmly connected and conducted by welding elements or welding metal conductors, or by bonding with conductive glue, or by connecting with conductive ink, or by direct contact; wherein, the adhesive film with the solder pad window and the bottom adhesive film are directly pasted together by crimping.

3. A metal foil circuit and wire circuit composite circuit board according to claim 2, characterized in that: The film is a PET film, a PI film, a PEN film, or a glass fiber cloth.

4. The metal foil circuit and wire circuit composite circuit board according to claim 2, characterized in that: The conductive wire is a copper wire, a copper-clad aluminum wire, a copper-clad iron wire, or an aluminum wire.

5. The metal foil circuit and wire circuit composite circuit board according to claim 2, characterized in that: The metal foil is copper foil or copper-aluminum composite foil.

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