Integrated photolithography-molded photosensitive component, molded photosensitive component and camera module including the same, and preparation method thereof

Abstract

A molded photosensitive component includes a photosensitive component, a circuit board and a molded base. The photosensitive element is electrically connected to the circuit board. The photosensitive component includes a photosensitive element and an isolation rubber layer, the photosensitive element has a photosensitive area and a non-photosensitive area and includes a chip connector, the non-photosensitive area extends integrally to the photosensitive area, and the chip connector is formed in the non-photosensitive area. The isolation rubber layer is integrally formed at a preset position of the photosensitive element by a photolithography process to at least surround the photosensitive area of ​​the photosensitive element. The molded base integrates the circuit board, the photosensitive element and the isolation rubber layer, and forms a light window between the photosensitive element, the molded base and the isolation rubber layer to provide a light path for the photosensitive element.

Description

Technical Field

[0001] The present invention relates to the field of camera modules, and in particular to an integrated photolithography-molded photosensitive component, a molded photosensitive component and a camera module including the same, and a preparation method thereof. Background Art

[0002] In recent years, with the popularization and development of smart devices, they are becoming increasingly thinner and lighter. Accordingly, in order to adapt to the development, camera modules are increasingly required to be multifunctional, integrated, thinner, and miniaturized, so that the volume occupied by the camera module when assembled in smart electronic devices can be reduced accordingly and the imaging requirements of the device for the camera module can be met. Therefore, camera module manufacturers continue to be committed to designing and manufacturing camera modules that meet these requirements.

[0003] Molded packaging technology is a new packaging technology developed based on the traditional COB (Chip on Board) packaging technology. Figure 1A and 1B The circuit board assembly is shown in the figure. In this structure, a molded part 1 is packaged on a circuit board 2 by molding to integrally cover at least a portion of the circuit board and electronic components assembled on the circuit board, such as a photosensitive chip 3, passive electronic components, etc., and a filter 4 is mounted on the top side of the molded part 1, thereby reducing the space independently occupied by the electronic components of the camera module and the matching safety space reserved during the assembly process.

[0004] For the camera module, it includes many relatively fragile but highly sensitive electronic components, especially the photosensitive chip 3. During the molding process, on the one hand, a sealed environment needs to be set for the photosensitive area 31 of the photosensitive chip 3 to prevent the fluid molding material from penetrating into the photosensitive chip and making it ineffective; on the other hand, direct contact between the photosensitive chip 3 and the molding surface of the molding mold should be avoided as much as possible to prevent the photosensitive chip 3 from being damaged due to excessive pressure. Therefore, in the existing molding process, it is usually selected to set an isolation glue layer 5 in the corresponding area of ​​the photosensitive chip 3 to solve the above concerns. Specifically, the isolation glue layer 5 is arranged around and at intervals on the outside of the photosensitive area 31 of the photosensitive chip 3, so as to form a sealed environment for the photosensitive chip 3 through the cooperation between the isolation glue layer 5 and the molding surface. At the same time, the protruding isolation glue layer 5 can effectively avoid direct mechanical contact between the photosensitive chip 3 and the molding surface of the molding mold to protect the photosensitive chip 3.

[0005] However, it is well known that the imaging performance of the camera module depends on the effective photosensitive area of ​​the photosensitive chip 3, that is, the area of ​​the photosensitive area 31. Therefore, in order to improve the pixel requirements of the camera module, the area of ​​the photosensitive area 31 of the photosensitive chip 3 must be enlarged. At the same time, the camera module is required to develop towards the trend of miniaturization, that is, the overall size of the photosensitive chip 3 needs to be reduced. In order to meet these two technical requirements at the same time, the range of the non-photosensitive area 32 of the photosensitive chip will inevitably be continuously reduced, which will cause many problems in forming the isolation glue layer 5.

[0006] More specifically, the isolation glue layer 5 is disposed in the non-photosensitive area 32 of the photosensitive chip 3. However, as the area of ​​the non-photosensitive area 32 decreases, the isolation glue layer 5 has to be laid adjacent to the photosensitive area 31 of the photosensitive element 3, so that in the process of forming the isolation glue layer 5, the possibility of the glue accidentally staining the photosensitive chip 3 is greatly increased. At the same time, due to the reduction in the area of ​​laying the isolation glue layer 32, the shape and size requirements of the isolation glue layer 5 are becoming more and more stringent, especially the thickness requirements of the isolation glue layer 5, which inevitably increases the performance requirements of the equipment for forming the isolation glue layer 5 and the glue material for forming the isolation glue layer, resulting in an increase in process costs.

[0007] In addition, the existing isolation glue layer 5 is formed on the corresponding area of ​​the photosensitive chip 3 by mechanical dispensing after the photosensitive chip 3 is mounted on the circuit board 2. That is to say, in the preparation of the existing camera module, the formation of the isolation glue layer 5 is a separate process that must be performed for each camera module. This operation mode obviously cannot meet the preparation requirements of mass production and has low efficiency. At the same time, the existing dispensing equipment itself has performance defects and low single-unit operation efficiency.

[0008] In addition, due to the performance defects of existing dispensing equipment and the limitations of dispensing materials, it is difficult to ensure the flatness of the isolation glue layer 5. Usually, the top surface of the isolation glue layer 5 is a curved surface. Therefore, when the isolation glue layer 5 is fitted with the molding surface of the molding mold to form a sealed environment, the degree of fit between the flat molding surface and the isolation glue layer 5 with a curved surface is difficult to ensure, which easily leads to molding process errors. In addition, also limited by the dispensing materials, the isolation glue layer 5 is prone to secondary deformation or even collapse when squeezed by the molding surface of the molding mold, so that the glue flows to the photosensitive area 31 of the photosensitive chip 3, causing the photosensitive chip 3 to be contaminated. It should be understood that during the secondary deformation or collapse of the isolation adhesive layer 5, the width of the isolation adhesive layer increases and the height decreases. Usually, the ratio of the height to the width of the isolation adhesive layer after being compressed is less than 1. Therefore, when the isolation adhesive layer 5 is flattened, the widened isolation adhesive layer 5 extends in the non-photosensitive area 31 of the photosensitive chip 5 that has been continuously shrunk, and it is easy to touch the photosensitive area 31 of the photosensitive chip 3, causing the photosensitive chip 3 to be contaminated.

[0009] Furthermore, the filter 4 is another extremely important component in the camera module. The filter 4 filters the infrared light in the light so that the imaging effect is closer to the effect of human eye observation. At the same time, the filter 4 is also a fragile and highly sensitive precision electrical device. Similarly, in the existing camera module, in order to avoid the damage of the filter 4, a buffer rubber layer 6 is set between the filter 4 and the molding part 1, so as to improve the installation environment of the filter 4 through the buffer rubber layer 6 to prevent the filter 4 from being damaged. However, the formation of the buffer rubber layer 6 undoubtedly adds a separate process for the preparation of the camera module, and each camera module must be executed separately. This operation mode is obviously also unable to adapt to the preparation requirements of mass production and has low efficiency. Summary of the invention

[0010] One object of the present invention is to provide an integrated photolithography-molded photosensitive component and a molded photosensitive component and a camera module including the same, and a preparation method thereof, wherein the photosensitive component includes a photosensitive element and an isolation rubber layer, and the isolation rubber layer is integrally molded at a corresponding position of the photosensitive element through a photolithography process, so as to establish a sealed environment for the photosensitive chip during the molding process to prevent the fluid molding material from contaminating the photosensitive chip and at the same time avoid the photosensitive chip from being damaged due to being subjected to greater pressure.

[0011] One object of the present invention is to provide an integrated photolithography-molded photosensitive component and a molded photosensitive component and a camera module including the same and a method for preparing the same, wherein the photosensitive component includes a photosensitive element and an isolation rubber layer, and the isolation rubber layer is integrally molded in a corresponding area of ​​the photosensitive chip through a photolithography process to improve the process performance of the isolation rubber layer and reduce the process difficulty of its preparation.

[0012] Another object of the present invention is to provide an integrated photolithography-molded photosensitive component and a molded photosensitive component and a camera module including the same, and a preparation method thereof, wherein the isolation rubber layer is integrally molded in the corresponding area of ​​the photosensitive element through a photolithography process to adapt to the preparation difficulties of forming the isolation rubber layer caused by the continuous reduction in the area of ​​the non-photosensitive area of ​​the photosensitive element.

[0013] Another object of the present invention is to provide an integrated photolithography-molded photosensitive component and a molded photosensitive component and a camera module including the same and a preparation method thereof, wherein the isolation rubber layer is formed integrally in a preset area of ​​the photosensitive element through a photolithography process, with higher preparation accuracy, thereby effectively avoiding the photosensitive element from being accidentally stained and failing during the formation of the isolation rubber layer.

[0014] Another object of the present invention is to provide an integrated photolithography-molded photosensitive component and a molded photosensitive component and a camera module including the same and a preparation method thereof, wherein the photoresist used to prepare the isolation adhesive layer has more stable performance. Therefore, compared with the prior art, the isolation adhesive layer has more stable physical and chemical properties, so as to have a more stable and relatively high-precision shape feature to meet the requirements of the molding process.

[0015] Another object of the present invention is to provide an integrated photolithography-molded photosensitive component and a molded photosensitive component and a camera module including the same, and a preparation method thereof, wherein the geometric structure of the isolation rubber layer is stable and has a relatively high flatness, so as to effectively avoid the isolation rubber layer from collapsing under pressure during the subsequent process of the isolation rubber layer and the molding surface of the molding mold being tightly fitted to establish a sealed environment for the photosensitive element, thereby effectively preventing the photosensitive element from being contaminated.

[0016] Another object of the present invention is to provide an integrated photolithography-formed photosensitive component and a molded photosensitive component and a camera module including the same and a preparation method thereof, wherein the isolation rubber layer has relatively better thermosetting properties, so that in the subsequent thermosetting forming process of the molded photosensitive component, the deformation amount of the isolation rubber layer is relatively small, so as to effectively ensure the assembly accuracy of the molded photosensitive component, and at the same time avoid the filter element arranged on the molded base from being subjected to uneven force and causing cracks or even ruptures.

[0017] Another object of the present invention is to provide an integrated photolithography-molded photosensitive component and a molded photosensitive component and a camera module including the same, and a preparation method thereof, wherein the isolation rubber layer is integrally molded on the photosensitive element through a photolithography process, so that the shape characteristics of the isolation rubber layer can be adjusted accordingly according to actual needs, and its adjustment performance is stronger and the precision is higher.

[0018] Another object of the present invention is to provide an integrated photolithography-molded photosensitive component and a molded photosensitive component and a camera module including the same, and a preparation method thereof, wherein the photosensitive component is suitable for platemaking batch production, so that while ensuring the preparation yield of the isolation adhesive layer, the preparation efficiency of the photosensitive component, the molded photosensitive component and the camera module can be greatly improved.

[0019] One object of the present invention is to provide an integrated photolithography-molded photosensitive component and a molded photosensitive component and a camera module including the same and a method for preparing the same, wherein, similarly, a buffer rubber layer can be set in batches in the corresponding area of ​​the filter element through a photolithography molding process to improve the preparation accuracy and preparation efficiency of the buffer rubber layer formed on the filter element.

[0020] One object of the present invention is to provide an integrated photolithography-molded photosensitive component and a molded photosensitive component and a camera module including the same and a preparation method thereof, wherein during the process of assembling the filter element, the buffer rubber layer formed on the filter element can be aligned and overlapped with the isolation rubber layer formed on the photosensitive element, thereby providing a better buffering environment for the installation of the filter element to avoid damage or even breakage of the filter element during the assembly process.

[0021] One object of the present invention is to provide an integrated photolithography-molded photosensitive component and a molded photosensitive component and a camera module including the same and a preparation method thereof, wherein the filter element is installed on the top surface of the molded base through the buffer rubber layer, so that the molding quality of the top surface of the molded base will not have a direct impact on the installation of the filter element, so as to optimize the installation conditions of the filter element.

[0022] Another object of the present invention is to provide a camera module, its photosensitive component and packaging method, wherein the step glue can reduce the process difficulty of the molding process, which is not only simple to operate but also can improve the product yield of the camera module.

[0023] Other advantages and features of the present invention will become apparent from the following description, and may be realized by means of the instrumentalities and combinations particularly pointed out in the claims.

[0024] To achieve at least one object of the present invention, the present invention provides a molded photosensitive component, comprising:

[0025] A photosensitive component, the photosensitive component comprising a photosensitive element and an isolation rubber layer, wherein the photosensitive element has a photosensitive area and a non-photosensitive area integrally surrounding the photosensitive area, and the isolation rubber layer is integrally formed in a preset area of ​​the photosensitive element by a photolithography process to surround at least the photosensitive area of ​​the photosensitive chip;

[0026] a circuit board, the photosensitive component being electrically connected to the circuit board; and

[0027] A molded base, wherein the molded base is integrally combined with the circuit board, the photosensitive element and the isolation adhesive layer, and a light window is formed between the photosensitive element, the molded base and the isolation adhesive layer to provide a light path for the photosensitive element.

[0028] In one embodiment of the present invention, the molded photosensitive component also includes a lead, wherein one end of the lead is connected to a chip connector of the photosensitive element, and the opposite end of the lead is connected to a circuit board connector of the circuit board, so as to conduct electricity between the photosensitive element and the circuit board through the lead.

[0029] In one embodiment of the present invention, the isolation glue layer has a height slightly higher than the upward protrusion of the lead to prevent the lead from being squeezed during the molding process.

[0030] In an embodiment of the present invention, the isolation adhesive layer is spaced apart from the photosensitive area of ​​the photosensitive element.

[0031] In one embodiment of the present invention, the isolation adhesive layer is formed between the photosensitive area of ​​the photosensitive element and the chip connector.

[0032] In one embodiment of the present invention, the isolation adhesive layer integrally extends from the outer periphery of the photosensitive region of the photosensitive chip to surround at least the photosensitive region of the photosensitive element.

[0033] In one embodiment of the present invention, the molded photosensitive component further includes a filter element, wherein the filter element is installed on the isolation glue layer.

[0034] In one embodiment of the present invention, a buffer rubber layer is disposed on the periphery of the filter element, wherein the buffer rubber layer corresponds to the isolation layer.

[0035] In an embodiment of the present invention, the buffer glue layer is integrally formed on a corresponding area of ​​the filter element by a photolithography process.

[0036] According to another aspect of the present invention, the present invention also provides a photosensitive component for preparing a molded photosensitive component, which comprises:

[0037] A photosensitive element, the photosensitive element having a photosensitive area, a non-photosensitive area integrally surrounding the photosensitive area, and a chip connector, wherein the chip connector is disposed in the non-photosensitive area of ​​the photosensitive chip; and

[0038] An isolation glue layer, wherein the isolation glue layer is integrally formed in a preset area of ​​the photosensitive element through a photolithography process to at least surround the photosensitive area of ​​the photosensitive element.

[0039] According to another aspect of the present invention, the present invention also provides a molded photosensitive component, which includes:

[0040] A photosensitive component, the photosensitive component comprising a photosensitive element and an isolation rubber layer, wherein the photosensitive element has a photosensitive area and a non-photosensitive area integrally surrounding the photosensitive area, and the isolation rubber layer is integrally formed in a preset area of ​​the photosensitive element by a photolithography process to surround at least the photosensitive area of ​​the photosensitive chip;

[0041] a circuit board, the photosensitive element being electrically connected to the circuit board;

[0042] A molded base, wherein the molded base is integrally combined with the circuit board, the photosensitive element and the isolation adhesive layer, and a light window is formed between the photosensitive element, the molded base and the isolation adhesive layer to provide a light path for the photosensitive element.

[0043] A filter element, wherein the filter element is mounted correspondingly to the isolation adhesive layer.

[0044] In one embodiment of the present invention, the mold base has a step portion, and the filter element is installed on the step portion, so that the filter element is installed relatively sunken.

[0045] In one embodiment of the present invention, a buffer rubber layer is disposed on the periphery of the filter element, wherein the buffer rubber layer corresponds to the isolation layer.

[0046] In an embodiment of the present invention, the buffer glue layer is integrally formed on a corresponding area of ​​the filter element by a photolithography process.

[0047] In one embodiment of the present invention, a light absorbing material is mixed into the photoresist material used to prepare the buffer layer, so that the buffer layer disposed at the periphery of the filter element has the ability to absorb stray light.

[0048] In one embodiment of the present invention, the buffer glue layer is disposed on the periphery of the bottom surface of the filter element, and the buffer glue layer further includes a light absorbing layer, wherein the light absorbing layer is correspondingly disposed on the periphery of the top surface of the filter element.

[0049] According to another aspect of the present invention, the present invention also provides a camera module, wherein the camera module comprises:

[0050] a molded photosensitive component; and

[0051] An optical lens, wherein the molded photosensitive component comprises:

[0052] A photosensitive component, the photosensitive component comprising a photosensitive element and an isolation rubber layer, wherein the photosensitive element has a photosensitive area and a non-photosensitive area integrally surrounding the photosensitive area, and the isolation rubber layer is integrally formed in a preset area of ​​the photosensitive element by a photolithography process to surround at least the photosensitive area of ​​the photosensitive chip;

[0053] a circuit board, the photosensitive element being electrically connected to the circuit board;

[0054] A molded base, wherein the molded base is integrally combined with the circuit board, the photosensitive element and the isolation adhesive layer, and a light window is formed between the photosensitive element, the molded base and the isolation adhesive layer to provide a light path for the photosensitive element.

[0055] A filter element, wherein the filter element is correspondingly mounted on the isolation glue layer; wherein the optical lens is arranged on the top surface of the molded base and is maintained in the light sensing path of the light sensing element.

[0056] According to another aspect of the present invention, the present invention also provides a method for preparing the photosensitive component by plate imposition, wherein the plate imposition preparation method comprises the steps of:

[0057] Forming a photoresist layer on a photosensitive element panel, wherein the photosensitive element panel includes at least two spaced photosensitive regions and at least one non-photosensitive region disposed between the photosensitive regions;

[0058] Forming an isolation glue layer on the corresponding area of ​​the photosensitive element panel by photolithography; and

[0059] The photosensitive element panel is divided to obtain the photosensitive component monomer.

[0060] In one embodiment of the present invention, the step of forming the isolation glue layer by photolithography process further includes:

[0061] Disposing a mask having a preset pattern on the photoresist layer in an overlapping manner;

[0062] irradiating the photoresist layer so that the area of ​​the photoresist layer not covered by the mask is exposed to produce a chemical change; and

[0063] The corresponding area of ​​the optical adhesive layer is removed by developing technology to form the isolation adhesive layer, wherein the isolation adhesive layer has a pattern feature consistent with that of the mask plate.

[0064] In one embodiment of the present invention, the step of removing the corresponding area of ​​the optical adhesive layer to form the isolation adhesive layer by developing technology further includes the following steps:

[0065] The area where the chemical change occurs in the exposed area of ​​the photoresist layer is removed to form the isolation glue layer, wherein the isolation glue layer has a graphic feature consistent with the mask plate.

[0066] In one embodiment of the present invention, the step of removing the corresponding area of ​​the optical adhesive layer to form the isolation adhesive layer by developing technology further includes the following steps:

[0067] The unexposed area of ​​the photoresist layer is removed to form the isolation glue layer, wherein the isolation glue layer has a pattern feature consistent with that of the mask.

[0068] In one embodiment of the present invention, the mask plate has at least one cutting line to form at least one cutting guide at a corresponding position of the isolation glue layer, which is beneficial to the execution of the segmentation step.

[0069] In one embodiment of the present invention, the step of forming an isolation glue layer on the corresponding area of ​​the photosensitive element collage by photolithography process further includes the steps of:

[0070] At least one cutting guide is formed at a corresponding position of the isolation adhesive layer.

[0071] According to another aspect of the present invention, the present invention also provides a method for preparing the filter element assembly by assembling a plate, wherein the method for preparing the filter element by assembling a plate comprises the steps of:

[0072] forming a photoresist layer on a filter element panel;

[0073] Forming a buffer glue layer on the corresponding area of ​​the filter element mosaic by photolithography;

[0074] The filter element panel is divided to obtain the filter element component monomers.

[0075] In one embodiment of the present invention, the step of forming a buffer layer on the corresponding area of ​​the filter element collage by photolithography process further comprises the steps of:

[0076] At least one cutting lead is formed at a preset position of the buffer glue layer.

[0077] Further objects and advantages of the present invention will be fully apparent from an understanding of the following description and the accompanying drawings.

[0078] These and other objects, features and advantages of the present invention will be more fully understood from the following detailed description, accompanying drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0079] Figure 1A It is a stereoscopic schematic diagram of a camera module according to the prior art.

[0080] Figure 1B It is a partially enlarged schematic diagram of an isolation adhesive layer of the camera module in the prior art.

[0081] Figure 2 It is a three-dimensional schematic diagram of a camera module according to a first preferred embodiment of the present invention.

[0082] Figure 3 It is a stereoscopic exploded schematic diagram of the camera module according to the above preferred embodiment of the present invention.

[0083] Figure 4It is a cross-sectional schematic diagram of the camera module according to the above preferred embodiment of the present invention.

[0084] Figure 5 It is a cross-sectional schematic diagram of a modified embodiment of the camera module according to the above preferred embodiment of the present invention.

[0085] Figure 6 It is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above preferred embodiment of the present invention.

[0086] Figure 7 It is a partial enlarged schematic diagram of an isolation adhesive layer of a camera module according to the above preferred embodiment of the present invention.

[0087] Figure 8 It is a schematic diagram of the distribution of a photosensitive element and an isolation rubber layer of a photosensitive component of a camera module according to the above preferred embodiment of the present invention.

[0088] Fig. 9 This is another distribution diagram of a photosensitive element and an isolation rubber layer of a photosensitive component of a camera module according to the above preferred embodiment of the present invention.

[0089] Fig.10 This is another distribution diagram of a photosensitive element and an isolation rubber layer of a photosensitive component of a camera module according to the above preferred embodiment of the present invention.

[0090] Fig.11 It is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above preferred embodiment of the present invention.

[0091] Fig.12 It is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above preferred embodiment of the present invention.

[0092] Fig.13 It is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above preferred embodiment of the present invention.

[0093] Fig.14 It is a cross-sectional schematic diagram of another modified embodiment of the camera module according to the above preferred embodiment of the present invention.

[0094] Fig.15 It is a cross-sectional schematic diagram of a camera module according to a second preferred embodiment of the present invention.

[0095] Figures 16 to 20 It is a schematic diagram of the panel preparation process of the photosensitive component according to the above preferred embodiment of the present invention.

[0096] Figure 21 to Figure 25 It is a schematic diagram of the panel preparation process of the filter element according to the above preferred embodiment of the present invention.

[0097] Fig.26 It is a schematic diagram of an electronic device assembled with the camera module according to the above preferred embodiment of the present invention. DETAILED DESCRIPTION

[0098] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0099] Those skilled in the art should understand that, in the disclosure of the present invention, the orientation or position relationship indicated by the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0100] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the elements may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0101] like Figure 2 As Figure 4 As shown, a camera module according to a first preferred embodiment of the present invention is illustrated, wherein the camera module can be applied to various electronic devices, for example but not limited to smart phones, wearable devices, computer devices, televisions, vehicles, cameras, monitoring equipment, etc. The camera module cooperates with the electronic device to realize functions such as acquisition and reproduction of target images.

[0102] like Figure 2 As shown, the camera module includes a molded photosensitive component 20 and an optical lens 10, wherein the optical lens 10 is maintained in the photosensitive path of the molded photosensitive component 20 to collect image information of the measured target through the optical lens 10. In particular, in this preferred embodiment of the present invention, the camera module is a fixed-focus camera module, that is, the distance between the optical lens 10 and the photosensitive component of the molded photosensitive component 20 is not adjustable. Figure 4As shown, the optical lens 10 is assembled at the corresponding position on the top side of the molded photosensitive component 20 through a lens bearing element 11, wherein, in this preferred embodiment of the present invention, the lens bearing element 11 is implemented as a support barrel 11B, which is a static support structure. That is to say, the function of the support barrel 11B is to limit the optical lens 10 to the top surface of the molded photosensitive component 20, at this time, the relative position relationship between the optical lens 10 and the molded photosensitive component 20 remains constant, that is, the camera module is a fixed-focus camera module.

[0103] It is worth mentioning that in another embodiment of the present invention, the camera module can be implemented as a dynamic focus camera module, that is, the distance between the optical lens 10 and the photosensitive component of the molded photosensitive component 20 can be adjusted, such as Figure 5 As shown. At this time, the lens carrying element 11 is implemented as a driving element 11A, wherein the optical lens 10 is mounted on the driving element 11A, and the driving element 11A is fixed to the top side of the molded base 23. When the driving element 11A is driven, the driving element 11A carries the optical lens 10 to move accordingly along the photosensitive path, so that the distance between the optical lens 10 and the molded photosensitive component 20 changes accordingly, that is, the focal length of the camera module changes. It is worth mentioning that the driving element 11A includes but is not limited to voice coil motors, stepper motors, MEMS, etc.

[0104] Those skilled in the art should know that with the improvement of camera module packaging technology, especially the popularization of molding packaging technology in the field of camera modules, the size of the molded photosensitive component 20 is becoming more and more miniaturized. Therefore, in some embodiments of the present invention, the optical lens 10 can be directly assembled on the top side of the molded photosensitive component 20, such as Figure 6 That is, at this time, the optical lens 10 does not have the lens bearing element 11, but is directly assembled in a "naked lens" manner at the corresponding position on the top side of the molded photosensitive component 20. It should be understood that when the optical lens 10 is assembled in a "naked lens" manner, the size of the camera module can be further reduced, so that the space occupied by the camera module in the electronic device can be further reduced to meet the current development trend of large screen ratios of electronic devices.

[0105] Furthermore, if Figure 2As shown, the molded photosensitive component 20 includes a photosensitive component 21, a circuit board 22, and a molded base 23. The photosensitive component 21 is the photosensitive part of the molded photosensitive component 20, that is, the light of the target to be measured collected by the optical lens 10 undergoes an imaging reaction at the photosensitive component 21 to convert the optical signal of the target to be measured into an electrical signal that can be analyzed and processed. The photosensitive component 21 is mounted on the circuit board 22 to supply power and transmit signals to the photosensitive component 21 through the circuit board 22. The molded base 23 is integrated with the circuit board 22 and the photosensitive component 21 through an integrated molding process, such as a molding process, an injection molding process, etc., so that the molded photosensitive component 20 has a compact and miniaturized structure.

[0106] The circuit board 22 is provided with a chip mounting area 221 and a peripheral area 222, wherein the peripheral area 222 integrally extends outward from the outer periphery of the chip mounting area 221, wherein the chip mounting area 221 has a size adapted to the photosensitive component 21 for mounting the photosensitive component 21. In particular, in this preferred embodiment of the present invention, the chip mounting area 221 and the peripheral area 222 are in the same plane, that is, the circuit board 22 has a relatively high flatness, so as to be suitable for mounting the photosensitive component 21. It should be understood that in other variant embodiments of the present invention, the chip mounting area 221 and the peripheral area 222 may be arranged in a staggered manner, for example, in another embodiment of the present invention, the chip mounting area 221 may be formed concavely on the circuit board 22, so as to lower the installation position of the photosensitive component 21, thereby further compressing the overall size of the camera module, especially the height size. The circuit board 22 also includes a group of circuit board 22 connectors, which are disposed in the peripheral area 222 of the circuit board 22 and are used to conduct electricity between the circuit board 22 and the photosensitive component 21 .

[0107] The photosensitive component 21 includes a photosensitive element 211, and the photosensitive element 211 has a photosensitive area 2111 and a non-photosensitive area 2112, wherein the non-photosensitive area 2112 extends integrally to the outer periphery 2110 of the photosensitive area 2111. The photosensitive element 211 also includes a group of chip connectors 2113, which are arranged in the non-photosensitive area 2112 of the photosensitive element 211 and are used to cooperate with the circuit board 22 connectors arranged on the circuit board 22 to achieve the purpose of conducting the circuit board 22 and the photosensitive element 211 of the photosensitive component 21.

[0108] More specifically, in this preferred embodiment of the present invention, the conduction between the circuit board 22 and the photosensitive element 211 relies on a group of leads 24, wherein each of the leads 24 has a chip connection end 241 and an opposite circuit board connection end 242. After the photosensitive element 211 is mounted on the chip mounting area 221 corresponding to the photosensitive element 211, the chip connection end 241 of the lead 24 is connected to the chip connection part 2113 of the photosensitive element 211, and the opposite circuit board connection end 242 of the lead 24 is connected to the circuit board 22 connection part of the circuit board 22, so as to electrically connect the photosensitive element 211 to the circuit board 22. That is, the photosensitive element 211 is electrically connected to the circuit board 22 by means of the leads 24. It should be understood that in the process of punching the lead 24, the circuit board connection end 242 of the lead 24 can be first connected to the circuit board 22 connection piece of the circuit board 22, and then the lead 24 is extended upward so that the lead 24 is protrudingly arranged relative to the photosensitive element 211, and further, the lead 24 is extended inward and the chip connection end 241 of the lead 24 is connected to the corresponding chip connection piece 2113 of the photosensitive element 211. In the present invention, this extension method of the lead 24 is defined as: lead reverse punching process. Similarly, the chip connection end 241 of the lead 24 can be first connected to the chip connection part 2113 of the photosensitive element 211, and then the lead 24 can be extended outward and downward, and the circuit board connection end 242 opposite to the lead 24 can be connected to the circuit board 22 connection part of the circuit board 22 to electrically connect the photosensitive element 211 and the circuit board 22. In the present invention, this extension method of the lead 24 is defined as: positive punching process.

[0109] It is worth mentioning that, in the present invention, the photosensitive element 211 can be electrically connected to the circuit board 22 by a "positive punching" process, or by a "lead reverse punching" process. However, the arrangement of the lead 24 will affect the relative height change of the lead 24 protrusion, which will have a corresponding impact on the subsequent molding process to form the molding base 23. The specific impact will be described in detail in the subsequent description.

[0110] Furthermore, during the process of performing the molding process to form the molding base 23, the photosensitive element 211 of the photosensitive component 21 is a sensitive and fragile electronic component. Therefore, on the one hand, it is necessary to ensure that the molding material with fluidity during the molding process will not flow into the photosensitive area 2111 of the photosensitive element 211, so as to cause the photosensitive element 211 to be contaminated and fail; on the other hand, during the molding process, the photosensitive element 211 of the photosensitive component 21 cannot withstand excessive pressure to avoid damage to the photosensitive element 211 due to extrusion. That is to say, before performing the molding process to form the molding base 23, on the one hand, a relatively high sealed isolation environment needs to be established for the photosensitive element 211 of the photosensitive component 21, so as to protect at least the photosensitive area 2111 of the photosensitive element 211 from being contaminated by the molding material. On the other hand, the technical solution for establishing a sealed isolation environment should not rely on the cooperation between the photosensitive element 211 itself and the molding mold to prevent the photosensitive element 211 from being damaged due to overload.

[0111] In the prior art, it is usually chosen to lay a layer of glue in the non-photosensitive area 2112 of the photosensitive element 211 to isolate and protect the photosensitive element 211. However, as mentioned in the background technology, with the simultaneous improvement of the requirements for the imaging quality and size of the camera module, the scope of the non-photosensitive area 2112 in the photosensitive element 211 for laying the glue layer is continuously reduced, which inevitably puts higher requirements on the equipment for forming the glue layer and the performance of the glue material for forming the glue layer. To make matters worse, the existing glue layer is formed one by one on each photosensitive element 211 by mechanical dispensing. That is to say, in the prior art, the formation of the glue layer is a separate process that must be performed by each camera module. This operation mode is obviously not able to meet the preparation requirements of mass production and has low efficiency. Not to mention, the existing dispensing equipment itself has performance defects and low single-unit operation efficiency.

[0112] Accordingly, in this preferred embodiment of the present invention, the photosensitive component 21 also includes an isolation rubber layer 212, and the isolation rubber layer 212 is integrally formed in a preset area of ​​the photosensitive element 211 through a photolithography process to achieve the purpose of protecting and isolating the photosensitive element 211. It should be understood that the isolation rubber layer 212 is prepared through a photolithography process. On the one hand, replacing the existing dispensing material with a photoresist with more stable performance and structure can correspondingly improve the physical and chemical properties of the isolation rubber layer 212; on the other hand, replacing the existing dispensing molding process with a photolithography process, all the advantages of the photolithography molding process, such as suitability for batch preparation and high molding precision, can be perfectly integrated into the preparation and assembly process of the camera module.

[0113] More specifically, in this preferred embodiment of the present invention, the isolation rubber layer 212 is formed in the non-photosensitive area 2112 of the photosensitive element 211 through a photolithography molding process, wherein the isolation rubber layer 212 has a closed annular structure to surround at least the photosensitive area 2111 of the photosensitive element 211. In the process of performing a molding process to form the molding base 23, the isolation rubber layer 212 is in contact with the molding surface of the molding mold to isolate at least the photosensitive area 2111 of the photosensitive element 211 located inside the isolation rubber layer 212, and prevent the fluid molding material from flowing into the photosensitive area 2111 of the photosensitive element 211. At the same time, the protruding isolation rubber layer 212 bears the pressure applied by the molding mold, so that the photosensitive element 211 is in a state of being free of force, thereby achieving the purpose of protecting the photosensitive element 211.

[0114] In particular, in this preferred embodiment of the present invention, due to the molding advantages of the photolithography molding process, the specific position of the isolation glue layer 212 in the non-photosensitive area 2112 of the photosensitive element 211 can be adjusted accordingly according to actual needs, and at the same time, there is no need to worry about: in the process of forming the isolation glue layer 212, the photosensitive element 211 is contaminated by the photoresist that forms the isolation glue layer 212.

[0115] like Figure 8 As shown, in this preferred embodiment of the present invention, the isolation glue layer 212 is formed in the non-photosensitive area 2112 of the photosensitive element 211, and is spaced from the photosensitive area 2111 of the photosensitive element 211. That is to say, in this preferred embodiment of the present invention, a certain distance is maintained between the inner side 2120 of the isolation glue layer 212 and the photosensitive area 2111 of the photosensitive element 211, so that there is still a certain distance between the photosensitive area 2111 of the photosensitive element 211 and the subsequent molding base 23. On the one hand, a certain margin is reserved for the molding process processing error to prevent the flowing molding material from contaminating the photosensitive element 211 during the molding process of the molding base 23; on the other hand, the reserved interval provides a certain installation space for the subsequent installation of electronic equipment, especially the installation of the filter element 25. The content of this aspect will be expanded in the subsequent specific description of the filter element 25.

[0116] It is worth mentioning that, in this preferred embodiment of the present invention, the isolation rubber layer 212 cannot cover the chip connector 2113 disposed in the non-photosensitive area 2112 of the photosensitive element 211, because, in the subsequent assembly process, the chip connector 2113 is used to cooperate with the circuit board 22 connector disposed on the circuit board 22 to conduct the photosensitive element 211 and the circuit board 22. That is to say, in this preferred embodiment of the present invention, the isolation rubber layer 212 is disposed in the non-photosensitive area 2112 of the photosensitive element 211, in particular, between the outer periphery 2110 of the photosensitive area 2111 of the photosensitive element 211 and the chip connector 2113, and is spaced from the photosensitive area 2111 of the photosensitive element 211.

[0117] It should be understood that the lead 24 used for conducting the photosensitive element 211 and the circuit board 22 extends outwardly from the protruding part of the isolation glue layer 212. Therefore, in the process of performing the molding process to form the molding base 23, it should be considered whether the lead 24 will have an unnecessary contact with the molding surface of the molding mold, so as to cause the lead 24 to loosen due to pressure or even detach from the circuit board 22 or the photosensitive element 211. Accordingly, in this preferred embodiment of the present invention, the isolation glue layer 212 is configured to have a height dimension slightly higher than the upward protrusion of the lead 24, so as to effectively prevent, during the process of bonding the molding mold and the isolation glue layer 212, contact between the molding surface of the molding mold and the lead 24, so that the lead 24 can remain firmly connected between the circuit board 22 and the photosensitive element 211.

[0118] It is worth mentioning that, as mentioned above, the height of the upward protrusion of the lead 24 is affected by the extension direction of the lead 24, that is, the influence of the wire bonding process. Therefore, preferably, in this preferred embodiment of the present invention, the wire bonding method of the lead 24 is preferably a "reverse bonding" process, that is, in the process of bonding the lead 24, the circuit board connection end 242 of the lead 24 is first connected to the circuit board 22 connector of the circuit board 22, and then, the lead 24 is extended upward so that the lead 24 is protruding relative to the photosensitive element 211, and further, the lead 24 is extended inward and the chip connection end 241 of the lead 24 is connected to the corresponding chip connector 2113 of the photosensitive element 211, as shown in FIG. Figure 7As shown. At this time, the height of the lead 24 protruding upward is lower than that of the "positive punching" process, so the height required for the isolation glue layer 212 can be reduced accordingly, thereby reducing the process difficulty and reducing costs. Of course, in the present invention, the lead 24 can still be implemented using the "positive punching" process, but at this time, the height required for the isolation glue layer 212 will be correspondingly raised.

[0119] like Fig. 9 What is shown is a variant implementation according to the first preferred embodiment of the present invention, wherein in this variant embodiment, the isolation rubber layer 212 is integrally formed in the non-photosensitive area 2112 of the photosensitive element 211 by a photolithography process to surround at least the photosensitive area 2111 of the photosensitive element 211. In particular, the isolation rubber layer 212 integrally extends between the outer periphery 2110 of the photosensitive area 2111 of the photosensitive element 211 and the chip connector 2113. That is to say, in this variant embodiment of the present invention, the inner periphery 2120 of the isolation rubber layer 212 and the outer periphery 2110 of the photosensitive area 2111 are adjacent to each other, so that the length of the isolation rubber layer 212 extending outward can be expanded accordingly, that is, the thickness of the isolation rubber layer 212 can be increased accordingly. It should be understood that when the thickness of the isolation glue layer 212 increases, the load-bearing capacity of the isolation glue layer 212 is also improved accordingly, so that in the process of executing the molding process, the probability of deformation of the isolation glue layer 212 is also reduced accordingly to ensure the final molding quality. Those skilled in the art should know that this technical solution cannot be implemented for traditional dispensing technology. The reason is that when the glue layer is arranged adjacent to or bordering the photosensitive area 2111 of the photosensitive element 211, it is inevitable that the dispensing material forming the glue layer will flow to the photosensitive area 2111 so that the photosensitive element 211 is contaminated and ineffective. In other words, the technical solution of forming the isolation glue layer 212 using photolithography molding technology greatly expands the possibility of the implementation of the isolation glue layer 212 to more widely adapt to the actual needs of different camera modules.

[0120] like Fig.10The above is another variant implementation of the first embodiment of the present invention, wherein in this variant implementation, the isolation rubber layer 212 is integrally formed on the non-photosensitive area 2112 of the photosensitive element 211 through a photolithography molding process to surround at least the photosensitive area 2111 of the photosensitive element 211. In particular, in this variant implementation of the present invention, the inner periphery 2120 of the isolation rubber layer 212 partially overlaps with the outer periphery 2110 of the photosensitive element 211, for example, one pair of sides of the isolation rubber layer 212 overlaps with the outer periphery 2110 of the photosensitive area 2111, and the other pair of sides is spaced from the outer periphery 2110 of the photosensitive area 2111. Preferably, the isolation rubber layer 212 on the opposite side overlapping with the outer periphery 2110 of the photosensitive area 2111 has a greater thickness to enhance the overall strength of the isolation rubber layer 212. At the same time, the isolation rubber layer 212 on the opposite side spaced apart from the photosensitive area 2111 maintains a certain distance from the photosensitive area 2111, so that there is a certain interval between the photosensitive area 2111 of the photosensitive element 211 and the subsequently formed molding base 23, thereby providing a certain installable space for the subsequent installation of electronic equipment, especially the installation of the filter element 25.

[0121] Those skilled in the art should know that the characteristics of the photoresist material forming the isolation glue layer 212 are relatively stable, so that the flatness of the top surface 2121 of the isolation glue layer 212 can be effectively guaranteed. It should be understood that when the molding mold is fitted with the isolation glue layer 212, the top surface 2121 of the isolation glue layer 212 overlaps with the molding surface of the molding mold to establish a sealed isolation environment for at least the photosensitive area 2111 of the photosensitive element 211. Therefore, the quality of the isolation environment depends on the matching accuracy between the molding surface of the molding mold and the top surface 2121 of the isolation glue layer 212. Accordingly, since the isolation glue layer 212 provided by the present invention is prepared by photoresist through a photolithography process, its structure is stable, thereby effectively ensuring that the isolation glue layer 212 after molding has a relatively high flatness, so as to ensure the matching accuracy between the isolation glue layer 212 and the molding surface of the molding mold.

[0122] More specifically, if Figure 7As shown, in this preferred embodiment of the present invention, the top surface 2121 of the isolation glue layer 212 after molding is a flat rectangular annular surface, so that, on the one hand, compared with the glue layer formed by the existing dispensing technology, the degree of close fit between the isolation glue layer 212 and the molding mold is correspondingly improved to reduce the molding error of the molding process; on the other hand, the structure of the isolation glue layer 212 is stable to effectively resist the pressure applied by the molding surface of the molding mold, and prevent the glue layer from collapsing due to pressure, causing glue to enter the photosensitive area 2111 of the photosensitive element 211, which causes the photosensitive element 211 to fail, similar to the prior art.

[0123] It is worth mentioning that, since the isolation adhesive layer is made of photoresist material, its structure is stable and can maintain certain geometric features, so that when the isolation adhesive layer is in close contact with the molding surface of the molding mold, the shape characteristics of the compressed isolation adhesive layer are maintained, that is, the ratio of the height to the width of the isolation adhesive layer is maintained stable, so as to effectively avoid secondary contamination of the photosensitive element due to the deformation of the isolation adhesive layer during the close contact process. Generally, the ratio of the height to the width of the isolation adhesive layer can exceed 2. Furthermore, after the molding process is completed, the molding base 23 is integrally formed with the circuit board 22 and the photosensitive component 21 to form the molded photosensitive component 20.

[0124] like Figure 4 As shown, in this preferred embodiment of the present invention, the mold base 23 includes an annular body 231 and a light opening 232 formed by the annular body 231, wherein the annular body 231 integrally covers the photosensitive element 211, the isolation rubber layer 212 and at least a portion of the circuit board 22, so that the molded photosensitive component 20 has a compact and small structure, and the light opening 232 corresponds to the photosensitive area 2111 of the photosensitive element 211, so as to allow the light collected by the optical lens 10 to pass through the light opening 232 and reach the photosensitive element 211 and perform imaging reaction. It is worth mentioning that, in order to facilitate demolding, a demolding slope is provided on the inner side of the mold base to facilitate the mold base to be separated from the molding mold.

[0125] In order to make the imaging effect of the camera module closer to the effect observed by the human eye, the camera module is also provided with a filter element 25, wherein the filter element 25 is correspondingly installed in the photosensitive path of the photosensitive element 211 to filter the light collected by the optical lens 10. The filter element 25 includes but is not limited to blue glass, infrared cut-off filter, etc. Those skilled in the art should know that the filter element 25 is also a fragile, sensitive and expensive electronic component. Therefore, during the installation of the filter element 25, the filter element 25 should be prevented from breaking due to the large stress.

[0126] Accordingly, if Figure 4 As shown, in this preferred embodiment of the present invention, the filter element 25 is correspondingly mounted on the top surface of the mold base 23, in particular, mounted on the top surface 2121 of the isolation adhesive layer 212. Therefore, compared with the traditional technical solution of directly mounting the filter element 25 on the top surface of the mold base 23 with relatively low flatness and high hardness, the stress load borne by the filter element 25 can be relatively reduced, thereby effectively reducing the probability of damage of the filter element 25 during the installation process.

[0127] like Fig.11 The figure shows a variant implementation of the present invention, wherein the mold base 23 has a step portion 2310, and the step portion 2310 is formed on the inner side of the top surface of the mold base 23. At this time, the filter element 25 is correspondingly mounted on the step portion 2310 of the mold base 23, so that the installation position of the filter element 25 can be lowered, thereby effectively avoiding unnecessary contact between the filter element 25 and the optical lens at the bottom of the optical lens 10. More specifically, in this variant embodiment of the present invention, the top surface 2121 of the isolation glue layer 212 extends integrally to the step portion 2310 of the mold base 23 and has the same height as the step portion 2310, wherein the filter element 25 is correspondingly mounted on the top surface 2121 of the isolation glue layer 212, and in this way, the load borne by the filter element 25 during the installation process is relatively reduced.

[0128] It is worth mentioning that in another embodiment of the present invention, the camera module further includes a filter element bracket 26, wherein the filter element bracket 26 is mounted on the top surface of the molded base 23, and the filter element 25 is mounted on the filter element bracket 26, so as to optimize the installation environment of the filter element 25 through the filter element bracket 26. Fig.12 shown.

[0129] Those skilled in the art should know that, in the process of performing the molding process to form the molding base 23, the top surface 2121 of the isolation glue layer 212 is partially covered by the molding material due to process errors, so that the flatness of the isolation glue layer 212 is destroyed. On the other hand, in the molding process, the molding material is a thermosetting material, which needs to be thermoset at a relatively high temperature. Therefore, in the molding process, the isolation glue layer 212 accumulates relatively large stress due to the drastic temperature difference. Therefore, compared with the traditional technical solution of directly mounting the filter element 25 on the top surface of the molding base 23, the installation yield of the filter element 25 is improved, but it still falls at a relatively low level.

[0130] Accordingly, in this preferred embodiment of the present invention, Fig.13 As shown, a buffer rubber layer 251 is also provided at the peripheral portion 250 of the filter element 25, so as to further reduce the stress load borne by the filter element 25 during installation through the buffer rubber layer 251, thereby further improving the installation yield of the filter element 25. It should be understood that in this preferred embodiment of the present invention, the buffer rubber layer 251 is also integrally formed on the peripheral portion 250 of the filter element 25 using a photolithography molding process to improve the preparation accuracy and preparation efficiency of the buffer rubber layer 251. It should be understood that in the specific installation process of the filter element 25, the buffer rubber layer 251 is preferably aligned with the isolation rubber layer 212 to maximize the reduction of the load borne by the filter element 25.

[0131] like Fig.14 The figure shows a variant embodiment of the first preferred embodiment of the present invention, wherein in this variant embodiment, the isolation rubber layer 212 is formed in the non-photosensitive area 2112 of the photosensitive element 211 and is spaced from the photosensitive area 2111 of the photosensitive element 211, so that there is a certain distance between the photosensitive area 2111 of the photosensitive element 211 and the molded base 23 formed subsequently. Accordingly, in this variant implementation of the present invention, the filter element 25 is directly installed in the space between the isolation rubber layer 212 and the photosensitive area 2111 of the photosensitive element 211 through the buffer rubber layer 251, so that the filter element 25 and the photosensitive element 211 are arranged adjacent to each other, so that the infrared light filtering effect of the filter element 25 is maximized. It should be understood that at this time, the buffer rubber layer 251 should be further blackened to prevent external stray light from passing through the buffer rubber layer 251 and entering the photosensitive area 2111.

[0132] like Fig.15The figure shows a camera module according to a second preferred embodiment of the present invention, wherein the second preferred embodiment is a variant embodiment of the first preferred embodiment, and the camera module structure is basically the same as the camera module structure in the first preferred embodiment, except for the packaging position of the molding base. More specifically, in the first preferred embodiment of the present invention, the molding base 23 adopts the packaging method of MOC (Molding On Chip), that is, the molding base 23 is molded on the circuit board 22 and the photosensitive element 211, and covers at least a part of the circuit board 22 and the photosensitive element 211, so that the camera module has an integrated compact structure. Accordingly, in the second preferred embodiment of the present invention, the molding base 23 adopts MOB (Molding On Board), that is, the molding base 23 is molded on the circuit board 22 to integrally cover at least a part of the circuit board 22. That is to say, in this preferred embodiment of the present invention, the operation of mounting and electrically connecting the photosensitive element 211 to the circuit board 22 is performed after the molding process. Therefore, during the molding process, there is no need to worry about the photosensitive element 211 being contaminated by the fluid molding material.

[0133] Furthermore, if Fig.15 As shown, in the present invention, the isolation glue layer 212 is formed in the non-photosensitive area 2112 of the photosensitive element 211 to keep the filter element 25 in the photosensitive path of the photosensitive element 211. That is to say, in this preferred embodiment of the present invention, the isolation glue layer 212 serves as a supporting element for installing the filter element 25, and no longer has any effect on the molding process. It should be understood that the filter element 25 is installed above the photosensitive element 211 through the isolation glue layer 212, so that the distance between the filter element 25 and the photosensitive element 211 is effectively reduced, thereby facilitating the improvement of the filtering effect.

[0134] like Fig.16 As Fig. 20 What is shown is a schematic diagram of the platemaking preparation process of the photosensitive component 21, wherein during the platemaking preparation process, the isolation glue layer 212 is integrally formed in batches on a photosensitive element plate 100, and a plurality of the photosensitive components 21 are obtained at one time through a cutting process. In this way, the preparation efficiency of the isolation glue layer 212 is effectively improved, which is conducive to industrial production.

[0135] More specifically, if Fig.16As shown, a photoresist layer 110 is formed on a photosensitive element plate 100, wherein the photosensitive element plate 100 includes at least two spaced photosensitive regions 2111 and at least one non-photosensitive region 2112 disposed between the photosensitive regions 2111. Those skilled in the art should know that in a specific implementation process, an operator can evenly apply photoresist to the photosensitive element plate 100 through a spin coating process to form the photoresist layer 110.

[0136] like Fig.17 As shown, further, a photolithography process is performed to form an isolation glue layer 212 with a preset shape in the corresponding area of ​​the photosensitive element imposition 100. More specifically, in the process of performing the photolithography process, a mask plate 120 with a preset pattern is first overlapped and arranged on the photoresist layer 110. Those skilled in the art should know that the function of the mask plate is to photolithograph the pattern on the mask plate 120 to the photoresist layer 110 to obtain the isolation glue layer 212 with a preset shape. After the mask plate is superimposed on the photoresist layer 110, a laser of a preset wavelength, such as ultraviolet light, is radiated to the photoresist layer 110 so that the area of ​​the photoresist layer 110 not covered by the mask plate 120 is exposed to produce a chemical change. Further, through the development technology, the corresponding area of ​​the optical glue layer is removed to form the isolation glue layer 212, wherein the isolation glue layer 212 has a graphic feature consistent with the mask plate 120.

[0137] It is worth mentioning that in the process of removing the corresponding area of ​​the optical adhesive layer by the development technology to form the isolation adhesive layer 212, the area where the chemical change occurs in the exposed area of ​​the photoresist layer 110 can be selectively removed to form the isolation adhesive layer 212, such as Fig.17 Alternatively, the unexposed area of ​​the photoresist layer 110 is removed to form the isolation glue layer 212, as shown in FIG. Fig.18 As shown. Both technical solutions can obtain corresponding technical effects, and the difference lies in the difference in the selected developer. That is to say, in the present invention, the developing technology used in the platemaking preparation of the photosensitive component 21 is not limited to the present invention.

[0138] like Fig.19 As shown, further, the photosensitive element panel 100 is segmented to obtain the photosensitive component 21 monomer, wherein each of the photosensitive components 21 monomers includes a photosensitive element 211 and the isolation adhesive layer 212 integrally formed thereon. It is worth mentioning that in this preferred embodiment of the present invention, in order to facilitate the execution of the segmentation process, the mask plate 120 is provided with at least one cutting line 121 to form at least one cutting guide 1210 at the corresponding position of the isolation adhesive layer 212, which is conducive to the execution of the segmentation step.

[0139] It is worth mentioning that those skilled in the art should easily think that it is also feasible that the isolation glue layer 212 can be formed at the corresponding position of the photosensitive element 211 after the photosensitive element 211 is mounted and electrically connected to the circuit board 22. That is to say, in the present invention, the isolation glue layer 212 can be prepared simultaneously when the photosensitive element 211 is prepared, or can be selected to be performed in sequence after the photosensitive element 211 is mounted, and this aspect is not limited by the present invention.

[0140] like Fig.21 As Fig.25 The figure shows a schematic diagram of the preparation process of the filter element 25, wherein during the preparation process of the filter element plate 200, the buffer glue layer 251 is integrally formed in batches on a filter element plate 200, and a plurality of filter element components are obtained at one time through a cutting process. In this way, the preparation efficiency of the buffer glue layer 251 is effectively improved, which is conducive to industrial production.

[0141] Similarly, a photoresist layer 110 is first formed on a filter element template 200, wherein the filter element template 200 is a large-sized filter element. Those skilled in the art should know that in a specific implementation process, the operator can evenly apply the photoresist to the filter element template 200 through a spin coating process to form the photoresist layer 110.

[0142] like Fig.21 As shown, further, a photolithography process is performed to form a buffer glue layer 251 with a preset shape in the corresponding area of ​​the filter element imposition 200. More specifically, in the process of performing the photolithography process, a mask plate 120 with a preset pattern is first overlapped and arranged on the photoresist layer 110. Those skilled in the art should know that the function of the mask plate is to photolithograph the pattern on the mask plate 120 on the photoresist layer 110 to obtain the isolation glue layer 212 with a preset shape. After the mask plate is superimposed on the photoresist layer 110, a laser with a preset wavelength, such as ultraviolet light, is radiated to the photoresist layer 110, so that the area of ​​the photoresist layer 110 not covered by the mask plate 120 is exposed to produce a chemical change. Further, through the development technology, the corresponding area of ​​the optical glue layer is removed to form the buffer glue layer 251, wherein the buffer glue layer 251 has a pattern feature consistent with the mask plate 120.

[0143] It is worth mentioning that in the process of removing the corresponding area of ​​the optical adhesive layer by the development technology to form the buffer adhesive layer 251, the area where the chemical change occurs in the exposed area of ​​the photoresist layer 110 can be selectively removed to form the buffer adhesive layer 251. Fig. 22Alternatively, the unexposed area of ​​the photoresist layer 110 is removed to form the buffer layer, as shown in FIG. Fig.23 As shown. Both technical solutions can obtain corresponding technical effects, and the difference lies in the difference in the selected developer. That is to say, in the present invention, the developing technology used in the preparation of the filter element imposition 200 is not limited to the present invention.

[0144] like Fig.24 As shown, further, the photosensitive element panel 100 is segmented to obtain the photosensitive component 21 monomer, wherein each of the photosensitive component 21 monomers includes a filter element 25 and the buffer glue layer 251 integrally formed thereon. It is worth mentioning that in this preferred embodiment of the present invention, in order to facilitate the execution of the segmentation process, the mask plate 120 is provided with at least one cutting line 121, so as to form at least one cutting guide line 2510 at the corresponding position of the isolation glue layer 212, which is conducive to the execution of the segmentation step.

[0145] like Fig.26 As shown, the present invention also provides an electronic device 80, wherein the electronic device 80 includes an electronic device body 81 and a camera module 1, wherein the camera module 1 is assembled at a corresponding position of the electronic device body 81 and is communicatively connected to the electronic device body 81 so as to collect external image information for the electronic device body 81 through the camera module 1.

[0146] It can be seen from this that the purpose of the present invention can be fully and effectively accomplished. The embodiments used to explain the function and structural principle of the present invention have been fully illustrated and described, and the present invention is not limited by changes based on the principles of these embodiments. Therefore, the present invention includes all modifications within the scope and spirit of the appended claims.

Claims

1. A photosensitive component, characterized in that: include: A photosensitive element, the photosensitive element having a photosensitive area, a non-photosensitive area integrally surrounding the photosensitive area, and a chip connector, wherein the chip connector is disposed in the non-photosensitive area of ​​the photosensitive element; and An isolation rubber layer, wherein the isolation rubber layer is integrally formed in a preset area of ​​the photosensitive element through a photolithography process to at least surround the photosensitive area of ​​the photosensitive element, wherein the inner periphery of the isolation rubber layer partially overlaps with the outer periphery of the photosensitive area, wherein a pair of sides of the isolation rubber layer overlap with the outer periphery of the photosensitive area, and the other pair of sides are spaced from the outer periphery of the photosensitive area.

2. A molded photosensitive component, characterized in that: include: A photosensitive component, wherein the photosensitive component includes a photosensitive element and an isolation rubber layer, the photosensitive element has a photosensitive area and a non-photosensitive area and includes a chip connector, the non-photosensitive area extends integrally from the photosensitive area, and the chip connector is formed in the non-photosensitive area; a circuit board; and A molded base, wherein the isolation rubber layer is integrally formed at a preset position of the photosensitive element by a photolithography process to at least surround the photosensitive area of ​​the photosensitive element, wherein the inner periphery of the isolation rubber layer partially overlaps with the outer periphery of the photosensitive area, wherein a pair of sides of the isolation rubber layer overlap with the outer periphery of the photosensitive area, and the other pair of sides are spaced from the outer periphery of the photosensitive area, and the photosensitive element is electrically connected to the circuit board, wherein the molded base integrally combines the circuit board, the photosensitive element and the isolation rubber layer, and forms a light window between the photosensitive element, the molded base and the isolation rubber layer to provide a light path for the photosensitive element.

3. A molded photosensitive component as described in claim 2, wherein the molded photosensitive component also includes a group of leads, wherein each of the leads has a chip connection end and a circuit board connection end, wherein the chip connection end is connected to a chip connector of the photosensitive element, and the circuit board connection end is connected to a circuit board connector of the circuit board, so as to conduct electricity between the photosensitive element and the circuit board through the leads.

4. The molded photosensitive component as described in claim 3, wherein the isolation glue layer has a height slightly higher than the upward protrusion of the lead.

5. The molded photosensitive component as described in claim 2, wherein the top surface of the isolation glue layer is a plane.

6. The molded photosensitive component as claimed in claim 3, wherein the top surface of the isolation glue layer is a plane.

7. The molded photosensitive component as described in claim 3, wherein the molded photosensitive component further comprises a filter element, wherein the filter element is correspondingly installed in the photosensitive path of the photosensitive element.

8. The molded photosensitive component as described in claim 7, wherein the filter element is assembled on the top surface of the isolation glue layer.

9. The molded photosensitive component as described in claim 8, wherein a buffer rubber layer is formed on the periphery of the filter element, wherein when the filter element is assembled on the molded base, the buffer rubber layer corresponds to the isolation rubber layer.

10. A molded photosensitive component as described in claim 2, wherein the molded photosensitive component further comprises a filter element, a buffer rubber layer is formed on the periphery of the filter element, wherein the buffer rubber layer is arranged in the space between the isolation rubber layer and the photosensitive area of ​​the photosensitive element to support the filter element in the photosensitive path of the photosensitive element.

11. A molded photosensitive component, characterized in that include: A photosensitive component, wherein the photosensitive component includes a photosensitive element and an isolation rubber layer, the photosensitive element has a photosensitive area and a non-photosensitive area and includes a chip connector, the non-photosensitive area extends integrally from the photosensitive area, and the chip connector is formed in the non-photosensitive area; a circuit board; A molded base, wherein the isolation glue layer is integrally formed in a preset area of ​​the photosensitive element by a photolithography process to at least surround the photosensitive area of ​​the photosensitive element, wherein the inner periphery of the isolation glue layer partially overlaps with the outer periphery of the photosensitive area, wherein a pair of sides of the isolation glue layer overlap with the outer periphery of the photosensitive area, and the other pair of sides are spaced from the outer periphery of the photosensitive area, and the photosensitive element is electrically connected to the circuit board, wherein the molded base is integrally combined with the circuit board, the photosensitive element and the isolation glue layer, and a light window is formed between the photosensitive element, the molded base and the isolation glue layer to provide a light path for the photosensitive element; and A filter element, wherein the filter element is assembled on the top surface of the isolation glue layer to maintain the filter element in the light sensing path of the light sensing element.

12. A camera module, characterized in that: include: A photosensitive component, wherein the photosensitive component includes a photosensitive element and an isolation rubber layer, the photosensitive element has a photosensitive area and a non-photosensitive area and includes a chip connector, the non-photosensitive area extends integrally from the photosensitive area, and the chip connector is formed in the non-photosensitive area; a circuit board; A molded base, wherein the isolation glue layer is integrally formed in a preset area of ​​the photosensitive element by a photolithography process to at least surround the photosensitive area of ​​the photosensitive element, wherein the inner periphery of the isolation glue layer partially overlaps with the outer periphery of the photosensitive area, wherein a pair of sides of the isolation glue layer overlap with the outer periphery of the photosensitive area, and the other pair of sides are spaced from the outer periphery of the photosensitive area, and the photosensitive element is electrically connected to the circuit board, wherein the molded base is integrally combined with the circuit board, the photosensitive element and the isolation glue layer, and a light window is formed between the photosensitive element, the molded base and the isolation glue layer to provide a light path for the photosensitive element; a filter element, wherein the filter element is assembled on the top surface of the isolation glue layer to maintain the filter element in the light sensing path of the light sensing element; and An optical lens, wherein the optical lens is assembled on the top surface of the molded base and is held in the light-sensing path of the light-sensing element.

13. A camera module as described in claim 12, wherein the optical lens is assembled on the top surface of the molded base via a lens supporting element.

14. The camera module as claimed in claim 13, wherein the lens supporting element is a supporting lens barrel.

15. The camera module as claimed in claim 13, wherein the lens supporting element is a driving element.

16. An electronic device, characterized in that: Includes one or more camera modules as described in any one of claims 12-15.

17. A method for preparing a photosensitive component by plate imposition, characterized in that: The method for preparing a photosensitive component by plate imposition comprises the steps of: Forming a photoresist layer on a photosensitive element panel, wherein the photosensitive element panel includes at least two spaced photosensitive regions and at least one non-photosensitive region disposed between the photosensitive regions; Forming an isolation glue layer on the corresponding area of ​​the photosensitive element imposition by photolithography, wherein the inner periphery of the isolation glue layer partially overlaps with the outer periphery of the corresponding photosensitive area, wherein one pair of sides of the isolation glue layer overlaps with the outer periphery of the photosensitive area, and the other pair of sides is spaced from the outer periphery of the photosensitive area; and The photosensitive element panel is divided to obtain the photosensitive component monomer.

18. The method for preparing a photosensitive component by plate imposition according to claim 17, wherein the step of forming the isolation glue layer by photolithography further comprises: Disposing a mask having a preset pattern on the photoresist layer in an overlapping manner; irradiating the photoresist layer so that the area of ​​the photoresist layer not covered by the mask is exposed to light and chemically changed; and The corresponding area of ​​the photoresist layer is removed by developing technology to form the isolation glue layer, wherein the isolation glue layer has a pattern feature consistent with that of the mask plate.

19. The method for preparing a photosensitive component by plate imposition according to claim 18, wherein the step of removing the corresponding area of ​​the photoresist layer by developing technology to form the isolation glue layer further comprises the steps of: The area where the chemical change occurs in the exposed area of ​​the photoresist layer is removed to form the isolation glue layer, wherein the isolation glue layer has a graphic feature consistent with the mask plate.

20. The method for preparing a photosensitive component by plate imposition according to claim 18, wherein the step of removing the corresponding area of ​​the photoresist layer by developing technology to form the isolation glue layer further comprises the steps of: The unexposed area of ​​the photoresist layer is removed to form the isolation glue layer, wherein the isolation glue layer has a pattern feature consistent with that of the mask.

21. The method for preparing a photosensitive component by platemaking as claimed in claim 17, wherein the step of forming an isolation glue layer on the corresponding area of ​​the photosensitive element platemaking by photolithography process further comprises the steps of: At least one cutting guide is formed at a corresponding position of the isolation adhesive layer.

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