Substrate processing apparatus, method of setting the same, and computer storage medium

Abstract

A substrate processing apparatus, a method of installing the same, and a computer storage medium are provided. The height of the substrate processing apparatus during transportation is suppressed, and the substrate processing apparatus after transportation is easily installed. A substrate processing apparatus for processing a wafer includes an apparatus main body (2) that performs a predetermined process on the wafer; a housing (400) that houses predetermined components and is freely attached to and detached from a top surface (2a) of the apparatus main body (2); a plug portion (410) that is provided to the housing (400) and is connected to the predetermined components; a socket portion (310) that is provided to the top surface (2a) and is fitted to the plug portion (410); a guide portion (300) that is provided to the top surface (2a) and is used to move the housing (400) in a positive X direction; and a connection assisting mechanism that moves the housing (400) in the positive X direction while fitting the plug portion (410) to the socket portion (310).

Description

Technical Field

[0001] The present invention relates to a substrate processing device for processing a substrate, a method for installing the substrate processing device by installing a shell containing predetermined components on the upper part of a device body of the substrate processing device, and a computer storage medium. Background Art

[0002] In the photolithography process of semiconductor device manufacturing, for example, a coating process is performed by supplying a coating liquid onto the surface of a semiconductor wafer (hereinafter referred to as a "wafer"), serving as a substrate, to form an antireflective film and a resist film. This process is followed by an exposure process to expose the resist film to a predetermined pattern. A development process is performed to develop the exposed resist film. Finally, a heat treatment process is performed to heat the wafer, thereby forming a predetermined resist pattern on the wafer. This series of processes is performed by a coating and developing apparatus, which serves as a substrate processing apparatus.

[0003] The substrate processing apparatus comprises an apparatus body consisting of various processing units for processing wafers, for example, and a transport area for transporting wafers to the processing units. Furthermore, the apparatus body is equipped with, for example, an electrical box housing various electrical equipment and a fan filter unit for supplying clean air to the apparatus body.

[0004] However, in order to reduce the space occupied by substrate processing equipment, multiple processing units are stacked. In addition, to further reduce the space occupied, the electrical installation box and fan filter unit are also stacked on top of the device body. In this case, the height of the substrate processing equipment becomes quite high, sometimes exceeding the height limit for transportation. Moreover, if the height exceeds the height that can be loaded on aircraft, trucks, and other transportation means, the substrate processing equipment cannot be transported directly.

[0005] Therefore, for example, Patent Document 1 proposes a substrate processing device, which includes a device main body and accessories such as an electrical installation box and a fan filter unit. In this substrate processing device, the accessories are rotated and shifted around a rotation axis as a fulcrum on the peripheral edge of the upper surface of the device main body to a use position arranged above the device main body and a transport position arranged on the side of the device main body.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Laid-Open No. 2006-332542 Summary of the Invention

[0009] Problems to be solved by the invention

[0010] However, in the substrate processing apparatus described in Patent Document 1, when the accessory is rotated and displaced, a significant load is applied to the rotating shaft, potentially damaging it. One possible solution is to increase the strength of the rotating shaft to withstand the load, but this would increase manufacturing costs. Furthermore, if the accessory is positioned to the side of the apparatus during transport, it may become longer along the width of the apparatus, deteriorating the overall balance of the apparatus and hindering transport.

[0011] Another option is to remove the electrical box and fan filter unit from the main body of the substrate processing apparatus during transport. However, in this case, wiring the electrical equipment in the electrical box to the main body of the apparatus would need to be performed at a high altitude during assembly and installation. Furthermore, wiring would require multiple locations, requiring significant effort and time. Furthermore, there is the potential for problems caused by wiring errors.

[0012] The present invention has been made in view of the above-mentioned situation, and an object of the present invention is to reduce the height of a substrate processing apparatus during transportation and to facilitate installation of the substrate processing apparatus after transportation.

[0013] Solutions for solving problems

[0014] The present invention for solving the above-mentioned problem is a substrate processing device for processing a substrate, and is characterized in that the substrate processing device comprises: a device body, which performs predetermined processing on the substrate; a shell, which accommodates predetermined components and is freely detachable relative to the upper part of the device body; a shell side connection part, which is arranged on the shell and connected to the predetermined components; a main body side connection part, which is arranged on the upper part of the device body and is engaged with the shell side connection part; a guide part, which is arranged on the upper part of the device body and is used to move the shell in one direction; and a connection auxiliary mechanism, which moves the shell in the one direction and engages the shell side connection part with the main body side connection part.

[0015] According to the present invention, the housing is detachable from the apparatus body. Therefore, the housing can be removed from the apparatus body during transport, thereby reducing the height of the substrate processing apparatus. Furthermore, the load applied to the apparatus body is not affected by the load in the substrate processing apparatus described in Patent Document 1. Consequently, the substrate processing apparatus can be properly transported.

[0016] Furthermore, when the housing is installed on the device body after transport, after the housing is moved in one direction using the guide portion, the housing is further moved in one direction using the connection auxiliary mechanism, and the housing side connection portion and the body side connection portion are engaged. In this way, the operator can install the housing on the upper portion of the device body simply by moving the housing in one direction. Furthermore, the wiring operation between the predetermined components in the housing and the device body can be performed by engaging the housing side connection portion and the body side connection portion using the connection auxiliary mechanism. Thus, the housing installation operation can be performed by an operator at a high position from the side, making it easy to install the substrate processing device.

[0017] The substrate processing apparatus may further include a determination unit that determines a connection state between the housing-side connection unit and the main body-side connection unit.

[0018] The determination unit may mechanically determine the connection state between the housing-side connection unit and the main body-side connection unit.

[0019] The determination unit may electrically determine the connection state between the housing-side connection unit and the main body-side connection unit.

[0020] The substrate processing apparatus may further include a display unit that displays a determination result of the determination unit.

[0021] The guide portion may include a guide rail extending in the one direction and a friction reducing member that reduces friction between a bottom surface of the housing and an upper portion of the device body.

[0022] The friction reducing member may be a film formed on at least the bottom surface of the housing or the upper portion of the device body.

[0023] The friction reducing member may be a roller provided on at least the bottom surface of the housing or the upper portion of the device body.

[0024] Alternatively, the connection auxiliary mechanism includes: a fulcrum portion, which is inserted into a fulcrum hole provided in the guide portion; an action point portion, which is inserted into an action point hole provided in the shell; and a force point portion, which applies force to the action point portion to move the shell in the one direction.

[0025] Alternatively, the action point portion may have an elliptical shape in a plan view, wherein the major diameter of the action point portion is longer than the width of the action point hole in the one direction, and the minor diameter of the action point portion is shorter than the width of the action point hole in the one direction.

[0026] The housing-side connection portion and the main body-side connection portion are provided in a plurality of pairs, and the connection auxiliary mechanism fits the plurality of pairs of the housing-side connection portion and the main body-side connection portion together.

[0027] The apparatus main body may have a structure in which a plurality of processing units are arranged to face each other with a conveyance region for conveying substrates to the processing units interposed therebetween.

[0028] The predetermined component may be an electrical device, the housing may be a housing of an electrical equipment box, and the housing may be detachable from an upper portion of the processing unit.

[0029] The housing may be a housing of a fan filter unit that supplies clean air to the device body, and the housing may be detachable from an upper portion of the conveying area.

[0030] Another aspect of the present invention is a method for setting up a substrate processing device, which is a method for setting up a substrate processing device in which a shell containing predetermined components is installed relative to the upper part of a device body of the substrate processing device that processes substrates. The method is characterized in that the method for setting up the substrate processing device includes a first process and a second process. In the first process, the shell is moved in one direction using a guide portion provided on the upper part of the device body. Thereafter, in the second process, a connection auxiliary mechanism is used to further move the shell in the one direction, and at the same time, a shell-side connection portion provided on the shell and connected to the predetermined components is engaged with a main body-side connection portion provided on the upper part of the device body.

[0031] In the second step, a connection state between the housing-side connection portion and the main body-side connection portion may be determined.

[0032] The case-side connection portion and the main body-side connection portion may be provided in a plurality of pairs, and in the second step, the plurality of pairs of the case-side connection portion and the main body-side connection portion may be fitted together.

[0033] Alternatively, before the first step, the shell mounted on the device body is moved in another direction opposite to the one direction using the connection auxiliary mechanism, and after the shell side connection portion and the body side connection portion are disengaged, the shell is further moved in the other direction, the shell is removed from the upper part of the device body, and the device body and the shell are transported separately.

[0034] In addition, according to another aspect of the present invention, a computer storage medium is provided, which is a readable computer storage medium that stores a program that runs on a computer of a control unit that controls the substrate processing device, so that the substrate processing device executes the setting method of the substrate processing device.

[0035] Effects of the Invention

[0036] According to the present invention, the height of the substrate processing apparatus during transportation can be suppressed and the substrate processing apparatus can be properly transported. In addition, after transportation, the housing at a high position can be installed on one side, making it easy to install the substrate processing apparatus. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a perspective view schematically showing the outline of the structure of the substrate processing apparatus according to this embodiment.

[0038] Figure 2 It is a plan view schematically showing the structure of the substrate processing apparatus according to this embodiment.

[0039] Figure 3 It is a front view schematically showing the structure of the substrate processing apparatus according to this embodiment.

[0040] Figure 4 It is a rear view schematically showing the structure of the substrate processing apparatus according to this embodiment.

[0041] Figure 5 It is a perspective view schematically showing the structure of the top surface of the device body.

[0042] Figure 6 (a) and Figure 6 (b) is a perspective view schematically showing the structure of the electrical equipment box.

[0043] Figure 7 It is a perspective view schematically showing the structure of the plug portion and the socket portion.

[0044] Figure 8 This is an explanatory diagram showing a state where an electrical equipment box is mounted on the top surface of the device body.

[0045] Figure 9 It is a perspective view schematically showing the structure of the connection auxiliary jig.

[0046] Figure 10 (a) Figure 10 (b) and Figure 10 (c) is an explanatory diagram showing a state where the plug portion and the socket portion are fitted together using a connection auxiliary jig.

[0047] Figure 11 (a) Figure 11 (b) Figure 11 (c) and Figure 11 (d) is an explanatory diagram showing a state where the electrical installation box is mounted on the device main body.

[0048] Figure 12 (a) Figure 12(b) and Figure 12 (c) is an explanatory diagram showing a state where the electrical component box is removed from the device body.

[0049] Figure 13 (a) Figure 13 (b) and Figure 13 (c) is an explanatory diagram showing a state in which bolts and through holes are provided on the top surfaces of the electrical equipment box and the device body, respectively, in another embodiment.

[0050] Figure 14 This is an explanatory diagram showing a state in which an electrical component box is attached to the top surface of the device body in another embodiment.

[0051] Figure 15 It is a perspective view schematically showing the structure of a connection auxiliary jig according to another embodiment.

[0052] Description of Reference Numerals

[0053] 1. Substrate processing device; 2. Device body; 3. Electrical installation box; 4. Fan filter unit; 200. Control unit; 300. Guide unit; 301. Guide rail; 302. Friction reducing film; 303. Fulcrum hole; 310. Socket unit; 400. Housing; 403. Action point hole; 410. Plug unit; 500. Connection auxiliary fixture; 510. Fulcrum unit; 511. Action point unit; 512. Force point unit; D~F, Wafer conveying area; G1~G4, Module; W, Wafer. DETAILED DESCRIPTION

[0054] Below, with reference to the attached Figure 1 In addition, in this specification and the drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

[0055] <Structure of Substrate Processing Apparatus>

[0056] First, the structure of the substrate processing apparatus according to this embodiment will be described. Figure 1 It is a perspective view schematically showing the outline of the structure of the substrate processing apparatus 1 . Figure 2 It is a plan view schematically showing the structure of the substrate processing apparatus 1 . Figure 3 and Figure 4 They are respectively a front view and a rear view schematically showing the internal structure of the substrate processing apparatus 1. In the substrate processing apparatus 1, a predetermined process is performed on a wafer W serving as a substrate.

[0057] The substrate processing apparatus 1 comprises: an apparatus body 2, which is as follows Figure 1As shown, the apparatus includes a plurality of processing units for performing predetermined processing on wafers W, an electrical box 3, and a fan filter unit 4 (FFU), each of which is removable from the top surface of the apparatus main body 2. The electrical box 3 houses electrical equipment such as the processing units. The electrical box 3 is primarily located above the first module G1 and the second module G2, discussed later. The fan filter unit 4 supplies clean air to the apparatus main body 2. The fan filter unit 4 is primarily located above the wafer conveying areas D to F, discussed later.

[0058] The device body 2 is as follows Figure 1 and Figure 2 As shown, the structure has the following components connected as a whole: a box station 10, which is used for input and output of a box C that accommodates multiple wafers W; a processing station 11, which has multiple various processing units that perform predetermined processing on the wafers W; and a transfer station 13, which transfers the wafers W between the exposure devices 12 adjacent to the processing station 11.

[0059] A cassette mounting table 20 is provided at the cassette station 10 . A plurality of cassette mounting plates 21 are provided at the cassette mounting table 20 . The cassette mounting plates 21 are used to mount the cassettes C when the cassettes C are loaded into or out of the substrate processing apparatus 1 .

[0060] In the cassette station 10, a wafer conveying area D is formed adjacent to the cassette mounting table 20. In the wafer conveying area D, as shown in FIG. Figure 2 As shown, a wafer transport unit 23 is provided that is movable along a transport path 22 extending in the X direction. The wafer transport unit 23 is also movable in the vertical direction and about a vertical axis (θ direction), and is capable of transporting wafers W between the cassettes C on each cassette mounting plate 21 and a delivery unit of the third module G3 of the processing station 11, which will be discussed later.

[0061] Above the wafer conveying area D, Figure 3 and Figure 4 As shown, a fan filter unit 4 is provided. The fan filter unit 4 forms a downward flow of clean air inside the wafer conveying area D. In addition, an electrical installation box may be further provided above the wafer conveying area D.

[0062] At processing station 11, Figure 2 As shown, a plurality of modules, for example, 4 modules, namely, the first module G1 to the fourth module G4, each having various units are provided. Figure 2 The first module G1 is provided on the back side of the processing station 11 ( Figure 2 A second module G2 is provided on the positive X-direction side of the processing station 11 (the upper side of the drawing). Figure 2The third module G3 mentioned above is provided on the negative Y direction side of the processing station 11, and the transfer station 13 side ( Figure 2 The fourth module G4 is provided on the positive Y direction side.

[0063] In the first module G1, if Figure 3 As shown, multiple liquid processing units are arranged in sequence from the bottom, for example, a development processing unit 30 that performs development processing on the wafer W, a lower anti-reflection film forming unit 31 that forms an anti-reflection film (hereinafter referred to as the "lower anti-reflection film") on the lower layer of the resist film of the wafer W, a resist coating unit 32 that applies resist liquid to the wafer W to form a resist film, and an upper anti-reflection film forming unit 33 that forms an anti-reflection film (hereinafter referred to as the "upper anti-reflection film") on the upper layer of the resist film of the wafer W.

[0064] Three development processing units 30, three lower anti-reflection film forming units 31, three resist coating units 32, and three upper anti-reflection film forming units 33 are arranged in a horizontal direction. The number and arrangement of these development processing units 30, three lower anti-reflection film forming units 31, three resist coating units 32, and three upper anti-reflection film forming units 33 can be arbitrarily selected.

[0065] An electrical installation box 3 is detachably installed above the first module G1. In addition, a fan filter unit may be further installed above the first module G1.

[0066] In the second module G2, as Figure 4 As shown, a heat treatment unit 40 for performing heat treatments such as heating and cooling the wafer W, a hydrophobic treatment unit 41 for performing hydrophobic treatment to improve adhesion between the resist liquid and the wafer W, and a peripheral exposure unit 42 for exposing the outer periphery of the wafer W are arranged in the vertical and horizontal directions. The number and arrangement of these heat treatment units 40, hydrophobic treatment unit 41, and peripheral exposure unit 42 can also be arbitrarily selected.

[0067] An electrical installation box 3 is detachably provided above the second module G2. A fan filter unit may also be provided above the second module G2.

[0068] The third module G3 is provided with a plurality of transfer units 50, 51, 52, 53, 54, 55, and 56 in order from the bottom. The fourth module G4 is provided with a plurality of transfer units 60, 61, and 62 in order from the bottom.

[0069] like Figure 2As shown, a wafer conveyance area E is formed in the area surrounded by the first to fourth modules G1 to G4. Multiple wafer conveyance units 70 are arranged in the wafer conveyance area E. Each wafer conveyance unit 70 has a conveyance arm 70a that is movable in, for example, the Y, X, and θ directions, as well as in the vertical direction. The wafer conveyance units 70 move within the wafer conveyance area E and can convey wafers W to predetermined units within the surrounding first, second, third, and fourth modules G1, G2, G3, and G4.

[0070] Above the wafer conveying area E, Figure 1 As shown, a fan filter unit 4 is provided. The fan filter unit 4 forms a downward flow of clean air inside the wafer conveying area E. In addition, an electrical installation box may be further provided above the wafer conveying area E.

[0071] In addition, if Figure 4 As shown, a shuttle transport unit 80 is provided in the wafer transport area E for linearly transporting the wafer W between the third module G3 and the fourth module G4 .

[0072] The shuttle unit 80 moves along, for example Figure 4 The shuttle unit 80 moves linearly in the Y direction while supporting the wafer W, and can transport the wafer W between the delivery unit 52 of the third module G3 and the delivery unit 62 of the fourth module G4.

[0073] like Figure 2 As shown, a wafer transfer unit 90 is provided adjacent to the third module G3 on the positive X-direction side. The wafer transfer unit 90 includes a transfer arm 90a that is movable in, for example, the X-direction, the θ-direction, and the vertical direction. The wafer transfer unit 90 can move vertically while supporting the wafer W and transfer the wafer W to each transfer unit within the third module G3.

[0074] The transfer station 13 is provided with a wafer transfer unit 100 and a delivery unit 101. The wafer transfer unit 100 includes a transfer arm 100a that is movable in, for example, the Y direction, the θ direction, and the vertical direction within the wafer transfer area F. The wafer transfer unit 100 supports the wafer W on, for example, the transfer arm 100a and can transfer the wafer W between the delivery units, the delivery unit 101, and the exposure device 12 within the fourth module G4.

[0075] Above the wafer conveying area F, Figure 3 and Figure 4 As shown, a fan filter unit 4 is provided. The fan filter unit 4 forms a downward flow of clean air inside the wafer conveying area F. In addition, an electrical installation box may be further provided above the wafer conveying area F.

[0076] In the above substrate processing apparatus 1 as Figure 2 As shown, a control unit 200 is provided. The control unit 200 is, for example, a computer, and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of the wafer W in the substrate processing device 1. In addition, the program storage unit also stores a program for controlling the operation of the drive system of the various processing units, conveying units, etc. mentioned above to realize the development processing discussed later in the substrate processing device 1. In addition, the program can be recorded on a computer-readable storage medium such as a hard disk (HD), a floppy disk (FD), a compact disk (CD), a magnetic disk (MO), a memory card, etc., and can also be installed from the storage medium to the control unit 200.

[0077] <Operation of Substrate Processing Apparatus>

[0078] Next, wafer processing performed using the substrate processing apparatus 1 configured as described above will be described.

[0079] First, a cassette C containing a plurality of wafers W is loaded into the cassette station 10 of the substrate processing apparatus 1 and placed on the cassette mounting plate 21. The wafers W in the cassette C are then sequentially removed by the wafer transfer unit 23 and transferred to the delivery unit 53 of the third module G3 of the processing station 11.

[0080] Next, the wafer W is transported to the thermal treatment unit 40 of the second module G2 by the wafer transport unit 70 and subjected to temperature adjustment. The wafer W is then transported to, for example, the lower anti-reflection film forming unit 31 of the first module G1 by the wafer transport unit 70 to form a lower anti-reflection film on the wafer W. The wafer W is then transported to the thermal treatment unit 40 of the second module G2 and subjected to heating. The wafer W is then returned to the delivery unit 53 of the third module G3.

[0081] Next, the wafer W is conveyed to the delivery unit 54 of the third module G3 by the wafer conveying unit 90. Thereafter, the wafer W is conveyed to the hydrophobic treatment unit 41 of the second module G2 by the wafer conveying unit 70 for hydrophobic treatment.

[0082] The wafer W is then transported to the resist coating unit 32 by the wafer transport unit 70, where a resist film is formed on the wafer W. The wafer W is then transported to the thermal treatment unit 40 by the wafer transport unit 70 for pre-bake processing. The wafer W is then transported to the delivery unit 55 of the third module G3 by the wafer transport unit 70.

[0083] Next, the wafer W is conveyed to the upper anti-reflection film forming unit 33 by the wafer conveying unit 70, where an upper anti-reflection film is formed on the wafer W. Thereafter, the wafer W is conveyed to the thermal treatment unit 40 by the wafer conveying unit 70, where it is heated and temperature-controlled. Thereafter, the wafer W is conveyed to the periphery exposure unit 42 for periphery exposure processing.

[0084] Thereafter, the wafer W is transported to the delivery unit 56 of the third module G3 by the wafer transport unit 70 .

[0085] Next, the wafer W is transported to the delivery unit 52 by the wafer transport unit 90 and to the delivery unit 62 of the fourth module G4 by the shuttle transport unit 80. Thereafter, the wafer W is transported to the exposure device 12 by the wafer transport unit 100 of the transfer station 13 and exposed in a predetermined pattern.

[0086] Next, the wafer W is transported to the delivery unit 60 of the fourth module G4 by the wafer transport unit 100. Thereafter, the wafer is transported to the thermal processing unit 40 by the wafer transport unit 70 and subjected to a post-exposure bake process.

[0087] Next, the wafer W is transported to the developing unit 30 by the wafer transport unit 70 for development. After development is completed, the wafer W is transported to the thermal processing unit 40 by the wafer transport unit 90 for post-bake processing.

[0088] Thereafter, the wafer W is transferred to the delivery unit 50 of the third module G3 by the wafer transfer unit 70 and then transferred to the predetermined cassette C on the cassette mounting plate 21 by the wafer transfer unit 23 of the cassette station 10. Thus, a series of photolithography steps are completed.

[0089] <Structure of the top surface of the device body and the electrical installation box>

[0090] Next, the structures of the top surface of the device main body 2 and the electrical equipment box 3 will be described. Figure 5 It is a perspective view schematically showing the structure of the top surface 2 a of the device main body 2 . Figure 6 (a) and Figure 6 (b) is a perspective view schematically showing the structure of the electrical equipment box 3 . Figure 7 This is an explanatory diagram showing a case where the electrical box 3 is installed on the top surface 2a. As described above, the electrical box 3 is installed above the first module G1 and the second module G2. The following describes a case where the electrical box 3 is installed above the first module G1.

[0091] (Structure of the top surface of the device body)

[0092] On the top surface 2a of the device body 2, Figure 5As shown, a guide portion 300 for attaching and detaching the electrical equipment box 3 to and from the top surface 2 a and a socket portion 310 as a main body side connection portion are provided.

[0093] The guide portion 300 provided on the top surface 2a is used to move the electrical equipment box 3 in the X direction and to attach and detach the electrical equipment box 3 to the top surface 2a. A plurality of guide portions 300 are arranged along the Y direction on the top surface 2a, and the plurality of electrical equipment boxes 3 can be attached and detached along the guide portions 300 on the top surface 2a.

[0094] The guide portion 300 includes a guide rail 301 and a friction-reducing film 302 serving as a friction-reducing member. The guide rail 301 is provided on the top surface 2a, extending in the X direction. Furthermore, the guide rail 301 has a hollow structure, allowing cables and other components to be positioned within. As will be discussed later, the electrical box 3 moves in the X direction between adjacent guide rails 301.

[0095] Furthermore, a fulcrum hole 303 for inserting a fulcrum portion 510 of a connection auxiliary jig 500 described later is formed at the end portion of the guide portion 300 on the negative side in the X direction relative to the guide rail 301. The fulcrum hole 303 has a circular shape in a plan view.

[0096] A friction-reducing film 302 is formed on the top surface 2a between adjacent guide rails 301. The friction-reducing film 302 reduces friction between the top surface 2a and the bottom surface of the electrical box 3. Furthermore, as will be discussed later, when the electrical box 3 moves between the adjacent guide rails 301, 301, the friction-reducing film 302 facilitates smooth movement. The type of friction-reducing film 302 is not particularly limited as long as it reduces friction; for example, a fluororesin film can be used.

[0097] The socket portion 310 is provided in plurality, for example, three, between adjacent guide rails 301, 301 at the end portion of the top surface 2a that is closer to the positive direction side of the X direction than the guide portion 300. Figure 8 As shown, the connector is a multi-pole connector that connects to electrical equipment such as processing units 30-33, 40-42, and transport units 23, 70, 80, 90, and 100 and includes a plurality of sockets 311. Each socket 310 is mated with a plug 410 of the electrical box 3, which will be described later.

[0098] (Structure of electrical installation box)

[0099] Electrical installation box 3 Figure 6 (a) and Figure 6As shown in FIG. 1 (b), a housing 400 is provided in a substantially rectangular shape. Electrical equipment is housed within the housing 400. The electrical equipment includes, for example, a control device, an amplifier, a power supply, a driver, a contactor, and a circuit breaker.

[0100] A groove 401 extending in the X direction is formed on the lower surface of the housing 400 on the negative side in the Y direction. Figure 7 As shown in the figure, it is mounted on the guide rail 301 by utilizing the groove 401 and is movable in the X direction along the guide rail 301. Figure 7 In the figure, for ease of explanation, the upper portion of the housing 400 is represented by a dotted line.

[0101] In addition, if Figure 6 (a) and Figure 6 As shown in FIG. 4( b ), a notch 402 for accommodating the auxiliary connection jig 500, discussed later, is formed on the negative Y-direction side and the negative X-direction side of the housing 400. A point of application hole 403 is formed in this notch 402, into which the point of application portion 511 of the auxiliary connection jig 500 is inserted. The point of application hole 403 has an oblong shape when viewed from above.

[0102] A plug portion 410 serving as a housing side connection portion is provided on one outer side of the housing 400. The plug portion 410 is provided in the same number as the number of the socket portions 310 between the guide rails 301, 301, for example, three. Figure 8 As shown, the connector is a multi-pole connector that connects to an electrical device housed in the housing 400 and includes a plurality of plugs 411. Each plug 411 in the plug portion 410 corresponds to each receptacle 311 in the receptacle portion 310. Furthermore, the plug portion 410 and the receptacle portion 310 are mated.

[0103] <Structure of the connection auxiliary mechanism>

[0104] Next, the structure of the connection assist mechanism will be described. The connection assist mechanism utilizes the principle of a so-called lever to move the housing 400 relative to the guide portion 300 in the X direction, thereby fitting the plug portion 410 and the socket portion 310 together. Figure 9 It is a perspective view schematically showing the structure of a connection assist jig 500 included in the connection assist mechanism. Figure 10 (a) Figure 10 (b) and Figure 10 (c) is an explanatory diagram showing a state where the plug portion 410 and the socket portion 310 are engaged with each other using the connection auxiliary jig 500. Figure 10In (a) to (c), the left figure is a perspective view from an oblique upper side, and the right figure is a top view from a lower side. In addition, the connection auxiliary mechanism includes a connection auxiliary fixture 500, the fulcrum hole 303 of the guide portion 300, and the action point hole 403 of the housing 400.

[0105] Connect the auxiliary fixture 500 as Figure 9 As shown, it has a fulcrum portion 510 , an action point portion 511 , and a force point portion 512 .

[0106] The supporting point portion 510 has a cylindrical shape that is circular in plan view. Figure 10 (a) Figure 10 (b) and Figure 10 As shown in (c), the guide portion 300 is inserted into the supporting hole 303.

[0107] The point of action 511 is as follows Figure 9 As shown in FIG. 5 , the cylindrical shape is elliptical in top view. Figure 10 (a) Figure 10 (b) and Figure 10 As shown in (c) of FIG. 5 , the elliptical shape of the application point portion 511 is inserted into the application point hole 403 of the housing 400. The major diameter A1 of the elliptical shape of the application point portion 511 is longer than the width B of the application point hole 403 in the X direction. The minor diameter A2 of the elliptical shape of the application point portion 511 is shorter than the width B of the application point hole 403 in the X direction.

[0108] The supporting point portion 510 and the action point portion 511 are as follows Figure 9 As shown, the force point portion 512 is connected by a support member 513. The force point portion 512 has a rod shape extending in a direction perpendicular to the support member 513 with the fulcrum portion 510 as a base point. The force point portion 512 applies a force to the application point portion 511.

[0109] Next, a method for fitting the plug portion 410 and the socket portion 310 together using the connection auxiliary jig 500 having the above-described structure will be described.

[0110] First, if Figure 10 As shown in (a), the fulcrum portion 510 of the connection auxiliary jig 500 is inserted into the fulcrum hole 303 , and the action point portion 511 is inserted into the action point hole 403 .

[0111] Afterwards, if Figure 10 As shown in (b) of FIG. , the force point portion 512 is rotated about the fulcrum portion 510. This causes the application point portion 511 to rotate and contact the side surface of the application point hole 403 (the inner surface of the housing 400). Furthermore, as described above, the major diameter A1 of the application point portion 511 is greater than the width B of the application point hole 403, causing the housing 400 to move in the positive X direction.

[0112] Afterwards, if Figure 10 As shown in (c), the force point portion 512 is further rotated around the fulcrum portion 510. In this way, the housing 400 is further moved in the positive direction of the X direction, and the three plug portions 410 and the socket portion 310 are respectively engaged together. Here, a plurality of plugs 411 and a plurality of sockets 311 are respectively provided in the plug portion 410 and the socket portion 310. Therefore, in order to engage the three plug portions 410 and the socket portion 310, a greater force is required. In this regard, the connection auxiliary jig 500 is used and the principle of the lever is utilized. Therefore, by applying a smaller force to the force point portion 512, a larger force can be applied to the action point portion 511, and the three plug portions 410 and the socket portion 310 can be engaged.

[0113] In addition, in the above, use Figure 10 (a) Figure 10 (b) and Figure 10 (c) is used to explain the situation of fitting the plug part 410 and the socket part 310 together. However, in order to separate the plug part 410 and the socket part 310 after fitting, the force point part 512 can be rotated in the opposite direction. Figure 10 (c) Figure 10 (b) Figure 10 (a) is sufficient.

[0114] In the above embodiment, the electrical component box 3 is detachably mounted on the top surface 2 a of the apparatus body 2 . However, the fan filter unit 4 is also detachably mounted on the top surface 2 a .

[0115] That is, the fan filter unit 4 has a housing having the same structure as the housing 400. Inside the housing, a fan for sending air, a filter for removing particles in the air, and a pressure sensor (e.g., a pressure gauge) for measuring the pressure of the air are accommodated as predetermined components.

[0116] Furthermore, a housing-side connection portion for connecting to the aforementioned predetermined components is provided on the outer side of the housing of the fan-filter unit 4. This housing-side connection portion is provided with multiple connectors (e.g., plugs and sockets) for electrical equipment used to operate the predetermined components, as well as connectors for actuators of pressure sensors. Furthermore, a main body-side connection portion is provided on the top surface 2a, which is also provided with multiple connectors and connectors. These housing-side connection portions interlock with the main body-side connection portion.

[0117] In this case, the case-side connection portion and the main body-side connection portion can be fitted together and separated from each other using the same connection auxiliary jig as the connection auxiliary jig 500 .

[0118] <Method for installing a substrate processing apparatus>

[0119] Next, a method for installing the substrate processing apparatus 1 will be described. In this embodiment, the following scenario is described: with the electrical installation box 3 and fan filter unit 4 removed from the apparatus main body 2, the apparatus main body 2, the electrical installation box 3, and the fan filter unit 4 are transported separately, and then the electrical installation box 3 and the fan filter unit 4 are installed on the apparatus main body 2 after delivery on site. Figure 11 (a) Figure 11 (b) Figure 11 (c) and Figure 11 (d) is an explanatory diagram showing a state where the electrical component box 3 is mounted on the device main body 2 (first module G1).

[0120] As described above, the processing units 30 to 33 are stacked in the first module G1 of the apparatus body 2, and the top surface 2a of the apparatus body 2 is, for example, 3 meters or more above the ground. Figure 11 As shown in (a), while the operator is on the workbench, they install the electrical box 3 onto the device body 2. In this embodiment, multiple, for example, six, electrical boxes 3 are installed on the top surface 2a of the device body 2 (first module G1). Each electrical box 3 is designed to be heavy enough for the operator to carry.

[0121] First, if Figure 11 As shown in the left figure of (b), the operator places the electrical installation box 3 on the top surface 2a and moves it in the positive direction of the X direction. At this time, the housing 400 is placed on the guide rail 301 using the groove 401 and moves along the guide rail 301 in the positive direction of the X direction. In addition, a friction-reducing film 302 is formed on the top surface 2a, thereby reducing the friction between the top surface 2a and the bottom surface of the housing 400, allowing the operator to move the housing 400 smoothly. In addition, in this embodiment, the friction-reducing film 302 is formed on the top surface 2a, but it can also be formed on the bottom surface of the housing 400, or it can be formed on both the top surface 2a and the bottom surface of the housing 400.

[0122] And, as Figure 11 As shown in the right figure of (b), the operator moves the housing 400 in the positive direction of the X direction until the plug 411 of the plug part 410 and the socket part 311 of the socket part 310 come into contact with each other.

[0123] Here, the housing 400 is provided with three plug portions 410. When the electrical equipment box 3 is mounted on the top surface 2a, these three plug portions 410 are mated together with the corresponding three socket portions 310. Furthermore, the plug portions 410 and the socket portions 310 are provided with a plurality of plugs 411 and a plurality of sockets 311, respectively. Therefore, a large force is required to mate the three plug portions 410 with the socket portions 310.

[0124] Therefore, if Figure 11 As shown in the left figure of (c), the operator uses the connection auxiliary fixture 500. Specifically, when the fulcrum part 510 of the connection auxiliary fixture 500 is inserted into the fulcrum hole 303 and the action point part 511 is inserted into the action point hole 403, the force point part 512 is rotated in the direction of the arrow in the figure. In this way, even if the force applied to the force point part 512 is small, due to the principle of the lever, a large force is applied to the action point part 511, and the shell 400 moves in the positive direction of the X direction, as shown in FIG. Figure 11 As shown in the right figure of (c), the three plug parts 410 and the socket parts 310 are fitted together.

[0125] Then, the operator Figure 11 The methods shown in (b) and (c) also install the other five electrical installation boxes 3 on the top surface 2a. Figure 11 As shown in (d), six electrical installation boxes 3 are installed on the top surface 2a.

[0126] Furthermore, an electrical equipment box 3 is similarly mounted on the upper top surface 2a of the second module G2. Furthermore, a fan filter unit 4 is similarly mounted on the upper top surface 2a of the wafer transfer areas D to F.

[0127] According to this embodiment, when transporting the substrate processing apparatus 1, the electrical component box 3 and fan filter unit 4 can be removed from the apparatus main body 2, thereby reducing the height of the apparatus during transport. This eliminates height restrictions on transport vehicles such as aircraft and trucks, allowing for proper transport of the substrate processing apparatus 1.

[0128] Furthermore, after delivery to the site, when installing the electrical enclosure box 3 onto the top surface 2a of the device body 2, after the housing 400 is moved in the positive X direction using the guide 300, the housing 400 is further moved in the positive X direction using the connection assist jig 500, simultaneously engaging the three plug portions 410 and the three socket portions 310. In this manner, the housing 400 can be attached to the top surface 2a simply by moving the housing 400 in the positive X direction. Consequently, the electrical enclosure box 3 can be installed by a worker at a height from only one side (the negative X direction). Conventional installation of electrical enclosure boxes requires workers to climb onto the top surface of the device body, which is located at a height, while wearing heavy equipment such as a safety harness to perform wiring operations such as connecting connectors and routing wiring. Therefore, enabling installation of the electrical enclosure box 3 from only one side of the device body 2, as in this embodiment, is beneficial for simplifying the work and improving safety.

[0129] Furthermore, the wiring operation between the electrical equipment within the housing 400 and the device body 2 (processing unit) can be performed by mating the plug portion 410 and the socket portion 310 using the connection auxiliary jig 500. Conventional wiring operations require connecting numerous connectors, which is labor-intensive and time-consuming, and can also lead to wiring errors. In this embodiment, wiring can be performed simply by mating the plug portion 410 and the socket portion 310, thereby simplifying the operation and preventing wiring errors.

[0130] Furthermore, the fan filter unit 4 can be mounted on the ceiling 2a above the wafer transfer areas D to F in the same manner as the electrical equipment box 3. Therefore, the substrate processing apparatus 1 can be easily and efficiently installed.

[0131] Furthermore, in the above embodiment, the electrical installation box 3 and the fan-filter unit 4 are mounted on the top surface 2a of the apparatus main body 2. However, when the substrate processing apparatus 1 is shipped, the electrical installation box 3 and the fan-filter unit 4 need to be removed from the top surface 2a. For example, during the manufacturing phase of the substrate processing apparatus 1, i.e., before shipment, the electrical installation box 3 and the fan-filter unit 4 are temporarily mounted on the top surface 2a to verify the operation of the substrate processing apparatus 1. Therefore, the electrical installation box 3 and the fan-filter unit 4 need to be removed in order to transport the substrate processing apparatus 1.

[0132] Specifically, when removing the electrical installation box 3 from the top surface 2a, the same Figure 11 (a) Figure 11 (b) Figure 11 (c) and Figure 11 (d) The operation is performed in the opposite manner to the case of installing the electrical equipment box 3 described above. Figure 12 (a) Figure 12 (b) and Figure 12 (c) is an explanatory diagram showing a state where the electrical component box 3 is removed from the device main body 2 (first module G1).

[0133] First, in Figure 12 As shown in (a) of FIG, in a state where the electrical installation box 3 is mounted on the top surface 2a, the plug portion 410 and the socket portion 310 that have been fitted are removed using the connection auxiliary jig 500. Specifically, with the fulcrum portion 510 of the connection auxiliary jig 500 inserted into the fulcrum hole 303 and the action point portion 511 inserted into the action point hole 403, the force point portion 512 is moved in the direction of the arrow in the figure (i.e., in the direction of the arrow in the figure). Figure 11 In this way, the housing 400 moves in the negative direction of the X direction, as shown in FIG. Figure 12As shown in the right figure of (a), the three plug parts 410 and the socket part 310 are removed separately. At this time, it takes a lot of force to remove the three plug parts 410 and the socket part 310, but by using the connection auxiliary jig 500 and utilizing the principle of leverage, they can be removed with less force.

[0134] Afterwards, if Figure 12 As shown in (b), the operator moves the housing 400 in the negative X direction along the guide rail 301. At this time, the friction-reducing film 302 is formed on the top surface 2a, so the friction between the top surface 2a and the bottom surface of the housing 400 is reduced, and the operator can move the housing 400 smoothly.

[0135] Furthermore, the operator also removes the other five electrical installation boxes 3 from the top surface 2a in the same way. Figure 12 As shown in (c), the six electrical equipment boxes 3 are removed from the top surface 2a.

[0136] Furthermore, the electrical component box 3 is similarly removed from the upper ceiling surface 2a of the second module G2. Furthermore, the fan filter unit 4 is similarly removed from the upper ceiling surface 2a of the wafer transfer areas D to F.

[0137] As described above, the electrical enclosure 3 (fan filter unit 4) can be disassembled from the top surface 2a from only one side (the negative X-axis side), allowing for simultaneous removal of the three plug units 410 and the three socket units 310. Conventional disassembly of electrical enclosures requires the operator to reach up to the elevated top surface of the device to disconnect numerous wiring connections. Therefore, from the perspectives of simplifying the work and improving safety, the ability to disassemble the electrical enclosure 3 from only one side, as in this embodiment, is significantly more effective.

[0138] <Another embodiment>

[0139] Next, another embodiment of the present invention will be described.

[0140] In the above embodiment, the substrate processing apparatus 1 may be provided with a determination unit (not shown) that determines the connection status between the plug portion 410 and the socket portion 310 when the electrical installation box 3 is mounted on the top surface 2a. The determination unit may determine the connection status between the plug portion 410 and the socket portion 310 as the position of the machine after mating is completed, or it may perform an electrical determination. As a determination unit that determines the connection status as the position of the machine after mating is completed, a limit switch, for example, is used. If, for example, the plug portion 410 and the socket portion 310 are mated, the limit switch is connected and the power cord is connected. Alternatively, in the case of an electrical determination of the connection status, a line of LEDs to be connected to the plug portion 410 side of the housing 400 may be provided inside the socket portion 310, such that the LEDs light up as long as the multiple sockets 311 of the socket portion 310 and the multiple plugs 411 of the plug portion 410 are connected. Furthermore, the LEDs do not light up if the power supply is not connected, and therefore, a battery is required to confirm the connection during debugging. By connecting the limit switch, battery, and LED, the position of the machine (fitting position) can be determined and fixed. Once connected, the battery can be removed and used to connect to another housing 400. The LED does not need to be always on after the connection is completed.

[0141] In addition, the judgment result of the judgment unit can also be displayed on a display unit (not shown). The display method of the judgment result of the display unit and the setting location of the display unit are arbitrary. For example, an LED lamp is set on the outer side of the electrical installation box 3 as a display unit. Moreover, it is also possible that, for example, when the plug part 410 and the socket part 310 are properly fitted, the judgment result from the judgment unit (the result that the fitting is properly performed) is output to the LED lamp, and the LED lamp is lit. In this case, the connection status of the plug part 410 and the socket part 310 can be visually identified. Moreover, during normal operation, by maintaining the LED lamps of all the electrical installation boxes 3 lit, the substrate processing device 1 can be operated properly.

[0142] In addition, such a determination unit and display unit are also used when the fan filter unit 4 is mounted on the top surface 2a.

[0143] In the above embodiment, when the electrical component box 3 is mounted on the top surface 2 a , it is preferable to provide the electrical component box 3 with a number in order to prevent the plug portion 410 and the socket portion 310 from being incorrectly connected.

[0144] In addition, it can also be, for example Figure 13 (a) Figure 13 (b) and Figure 13As shown in (c), the plug portion 410 and the socket portion 310 are properly connected. Bolts 610, 620, and 630 are provided on the outer side of the housing 400 of each electrical equipment box 3, and through holes 611, 621, and 631 are provided on the top surface 2a. These bolts 610, 620, and 630 are respectively provided at different positions of the housing 400, and the through holes 611, 621, and 631 are provided at corresponding positions on the top surface 2a.

[0145] In this case, in Figure 13 When the first plug portion 410a and the first socket portion 310a are connected as shown in (a), the bolt 610 is inserted into the through hole 611. Figure 13 When the second plug portion 410 b and the second socket portion 310 b are connected as shown in FIG. 5 ( b ), the bolt 620 is inserted into the through hole 621 .

[0146] In such Figure 13 When the third plug portion 410 c and the second socket portion 310 c are connected as shown in FIG. 5 ( c ), the bolt 630 is inserted into the through hole 631 .

[0147] On the other hand, even if the first plug portion 410a is mistakenly connected to the second socket portion 310b, the bolt 610 cannot be inserted into the through hole 611, so the first plug portion 410a and the second socket portion 310b are not connected. Therefore, the mistaken connection of the plug portion 410 and the socket portion 310 can be prevented.

[0148] In the above embodiment, one connection auxiliary jig 500 is used to fit the plug portion 410 and the socket portion 310 together, but the number of connection auxiliary jigs 500 is not limited thereto, and two connection auxiliary jigs 500 may also be used. In this case, for example, Figure 14 As shown in FIG, the fulcrum hole 303 and the action point hole 403 are formed at both ends of the guide portion 300 and the housing 400 in the Y direction. Figure 15 As shown, the supporting point portion 510 and the action point portion 511 are provided in pairs symmetrically in the vertical direction for either end portion in the Y direction. By using multiple connection auxiliary jigs 500 in this way, it is also possible to cope with situations where a large force is required to fit the plug portion 410 and the socket portion 310.

[0149] The structure of the connection assist mechanism is not limited to the structure using the connection assist jig 500 as in the above embodiment, and any structure may be adopted. For example, a screw (not shown) may be used to move the housing 400 to engage the plug portion 410 with the socket portion 310.

[0150] In the above embodiment, the friction-reducing film 302 is used as a friction-reducing member for reducing friction between the bottom surface of the housing 400 and the top surface 2a of the device body 2. However, the friction-reducing member is not limited thereto. For example, a roller (not shown) may be provided on the bottom surface of the housing 400 and / or the top surface 2a of the device body 2.

[0151] In the above embodiment, the electrical box 3 and fan filter unit 4 are described as being freely attachable and detachable relative to the top surface 2a of the device body 2. However, these are not limited to the top surface 2a; they can be attached and detached from the upper portion of the device body 2. When attached and detached from the upper portion of the device body 2, the operator's work becomes elevated, significantly improving the benefits of working from a side surface. Furthermore, the freely attachable and detachable components relative to the device body 2 are not limited to the electrical box 3 and fan filter unit 4; they can be attached and detached from any component, such as a housing housing predetermined components such as electrical equipment.

[0152] While the embodiments of the present invention have been described above, the present invention is not limited to these examples. It is obvious that a person skilled in the art would be able to conceive of various variations or modifications within the scope of the technical concept described in the claims, and it is understood that these also fall within the scope of protection of the present invention.

[0153] Industrial applicability

[0154] The present invention is useful when attaching and detaching a housing containing predetermined components to an upper portion of an apparatus body of a substrate processing apparatus for processing a substrate.

Claims

1. A substrate processing device, which is a substrate processing device for processing a substrate, characterized in that: The substrate processing device comprises: an apparatus body that performs a predetermined process on a substrate; a housing that accommodates predetermined components and is detachable relative to the upper portion of the device body; a housing-side connecting portion, which is provided on the housing and connected to the predetermined component; a main body side connection portion, which is provided on the upper portion of the device main body and is engaged with the shell side connection portion; a guide portion disposed on an upper portion of the device body and configured to move the housing in one direction; and The connection auxiliary mechanism moves the housing in the one direction and fits the housing-side connection portion and the main body-side connection portion together.

2. The substrate processing apparatus according to claim 1, wherein: The substrate processing apparatus further includes a determination unit that determines a connection state between the housing-side connection unit and the main body-side connection unit.

3. The substrate processing apparatus according to claim 2, wherein: The determination unit mechanically determines a connection state between the housing-side connection unit and the main body-side connection unit.

4. The substrate processing apparatus according to claim 2, wherein: The determination unit electrically determines a connection state between the housing-side connection unit and the main body-side connection unit.

5. The substrate processing apparatus according to any one of claims 2 to 4, wherein: The substrate processing apparatus further includes a display unit that displays a determination result of the determination unit.

6. The substrate processing apparatus according to any one of claims 1 to 4, wherein: The guide portion includes a guide rail extending in the one direction and a friction reducing member that reduces friction between a bottom surface of the housing and an upper portion of the device body.

7. The substrate processing apparatus according to claim 6, wherein: The friction reducing member is a film formed on at least the bottom surface of the housing or the upper portion of the device body.

8. The substrate processing apparatus according to claim 6, wherein: The friction reducing member is a roller provided on at least the bottom surface of the housing or the upper portion of the device body.

9. The substrate processing apparatus according to any one of claims 1 to 4, wherein: The connection auxiliary mechanism comprises: a fulcrum portion inserted into a fulcrum hole provided in the guide portion; an action point portion, which is inserted into an action point hole provided in the housing; as well as A force point portion applies force to the action point portion to move the shell in the one direction.

10. The substrate processing apparatus according to claim 9, wherein: The action point portion has an elliptical shape when viewed from above, The major diameter of the action point portion is longer than the width of the action point hole in the one direction. The minor diameter of the action point portion is shorter than the width of the action point hole in the one direction.

11. The substrate processing apparatus according to any one of claims 1 to 4, wherein: The shell side connection parts and the main body side connection parts are provided in pairs. The connection auxiliary mechanism fits a plurality of pairs of the housing-side connection parts and the main body-side connection parts together.

12. The substrate processing apparatus according to any one of claims 1 to 4, wherein: The apparatus main body has a structure in which a plurality of processing units are arranged to face each other with a conveyance area for conveying substrates to the processing units interposed therebetween.

13. The substrate processing apparatus according to claim 12, wherein: The predetermined component is an electrical device, The housing is a housing provided by an electrical installation box. The shell is freely detachable relative to the upper portion of the processing unit.

14. The substrate processing apparatus according to claim 12, wherein: The housing is a housing of a fan filter unit that supplies clean air to the device body. The housing is detachable relative to the upper portion of the conveying area.

15. A method for installing a substrate processing apparatus, wherein a housing containing predetermined components is mounted on an upper portion of an apparatus body of the substrate processing apparatus for processing a substrate, wherein: The method for setting up the substrate processing apparatus includes a first step and a second step. In the first step, the housing is moved in one direction by a guide provided on the upper portion of the device body. Thereafter, in the second step, the shell is further moved in the one direction using a connection auxiliary mechanism, and the shell-side connection portion provided on the shell and connected to the predetermined component is engaged with the main body-side connection portion provided on the upper part of the device main body.

16. The method for installing a substrate processing apparatus according to claim 15, wherein: In the second step, the connection state between the housing-side connection portion and the main body-side connection portion is determined.

17. The method for installing a substrate processing apparatus according to claim 15 or 16, wherein: The shell side connection parts and the main body side connection parts are provided in pairs. In the second step, a plurality of pairs of the housing-side connecting portions and the main body-side connecting portions are fitted together.

18. The method for installing a substrate processing apparatus according to claim 15 or 16, wherein: Before the first step, the shell mounted on the device body is moved in another direction opposite to the one direction using the connection auxiliary mechanism, and after the shell side connection portion and the body side connection portion are disengaged, the shell is further moved in the other direction, and the shell is removed from the upper part of the device body, and the device body and the shell are transported separately.

19. A computer storage medium, which is a readable computer storage medium and stores a program that runs on a computer that controls a control unit of a substrate processing apparatus, so as to cause the substrate processing apparatus to execute the substrate processing apparatus installation method according to any one of claims 15 to 18. 20 . A computer program product comprising a program that runs on a computer that controls a control unit of a substrate processing apparatus, so as to cause the substrate processing apparatus to execute the substrate processing apparatus installation method according to claim 15 .

Images