Gas sensor module and its manufacturing method

Abstract

The present invention provides a gas sensor module that enables easy gas-related detection even when mounted in a mounting space with a shorter length relative to the direction perpendicular to the semiconductor chip on which the gas sensor element is formed. A flat package (30) having a length in a direction parallel to the semiconductor chip (20) (D1) than in a direction perpendicular to the semiconductor chip (20) (D2) includes: a substrate (31) to which the semiconductor chip (20) is electrically connected and fixed; a sidewall (32) fixed to the substrate (31); and a cover (33) fixed to the sidewall (32). The package (30) has a detection space (S1) around which gas flows within the semiconductor chip (20), and a plurality of openings (32a) communicating with the detection space (S1) between the sidewall (32) and / or the cover (33).

Description

Technical Field

[0001] This invention relates to a gas sensor module and its manufacturing method, and more particularly to a gas sensor module having a semiconductor chip integrating a gas sensor element and its manufacturing method. Background Technology

[0002] For the purpose of gas-related detection, a gas sensor module has been proposed, which is an integrated device formed into a three-dimensional shape on a semiconductor substrate through etching processes. For example, Patent Document 1 (Japanese Patent Application Publication No. 2014-81367) discloses a gas sensor module comprising: a gas sensor element formed of a MEMS (Micro Electro Mechanical Systems) structure, wherein the heater and the sensing membrane are formed of a MEMS; and a housing for housing the gas sensor element.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2014-81367

[0006] The gas sensor module described in Patent Document 1 has the following shape: a flat shape in which the length in the direction perpendicular to the semiconductor chip on which the gas sensor element is formed is shorter than the length in the direction parallel to the semiconductor chip. Miniaturized gas sensor modules like those in Patent Document 1 are assembled in small spaces in various devices. When the space of the device in which the gas sensor module is assembled is approximately the same as the height of the gas sensor module, gas cannot easily flow through the opening formed on the upper surface of the gas sensor module. When gas cannot easily flow through the opening, it is difficult to detect it using the gas sensor module. Summary of the Invention

[0007] The objective of this invention is to provide a gas sensor module that can easily perform gas-related detection even when mounted in a short mounting space with a length relative to the direction perpendicular to the semiconductor chip on which the gas sensor element is formed.

[0008] The following sections will explain several methods as means to solve the problem. These methods can be combined arbitrarily as needed.

[0009] One aspect of the present invention relates to a gas sensor module comprising: a semiconductor chip on which a gas sensor element is formed; and a flat package comprising: a substrate on which the semiconductor chip is electrically connected and fixed; a sidewall fixed to the substrate; and a cover fixed to the sidewall. The package has a detection space for gas to flow around the semiconductor chip, the length of the package in a direction parallel to the semiconductor chip is longer than the length in a direction perpendicular to the semiconductor chip, and the package has a plurality of openings communicating with the detection space between the sidewall and / or the sidewall and the cover.

[0010] In one proposed gas sensor module, gas can flow into the detection space from the outside through a portion of several openings communicating with the detection space, and gas can flow out through the remaining openings. Furthermore, these openings will not be blocked by the housing of the gas sensor module, for example, even if the housing of the gas sensor module comes into contact with the upper surface of the gas sensor module. Therefore, the gas sensor module can easily perform gas-related detection even when mounted in a housing space with a relatively short length relative to the semiconductor chip in the vertical direction.

[0011] In the aforementioned gas sensor module, the package can also be configured such that it has multiple openings communicating with the detection space, at least between the sidewall and the cover, and the cover thickness is 0.01 mm to 2 mm. In this configuration, by making the cover thickness 0.01 mm or more, even when the gas sensor module is installed in a narrow mounting space, such as where the frame and the upper surface of the cover are in contact, gas can be guided to the detection space through the multiple openings. Furthermore, by making the cover thickness 2 mm or less, for example, by attaching a cutting strip during packaging cutting, it is possible to prevent foreign objects and cooling water from entering through the openings. As a result, the reliability of gas introduction into the detection space when the gas sensor module is installed in a mounting space with a relatively short length in the direction perpendicular to the semiconductor chip, and the overall quality of the gas sensor module, are improved.

[0012] Another aspect of the present invention relates to a gas sensor module comprising: a semiconductor chip on which a gas sensor element is formed; and a flat package comprising: a substrate on which the semiconductor chip is electrically connected and fixed; a sidewall fixed to the substrate; and a cover fixed to the sidewall. The package has a detection space for gas to flow around the semiconductor chip, and the length of the package in a direction parallel to the semiconductor chip is longer than its length in a direction perpendicular to the semiconductor chip. The cover has: a plurality of openings communicating with the detection space; and protrusions for forming pathways to guide gas to the plurality of openings.

[0013] In other gas sensor modules, gas can flow into the detection space from the outside through a portion of multiple openings communicating with the detection space, and can flow out through the remaining openings. Furthermore, due to the presence of protrusions, these multiple openings will not be blocked by the frame, for example, even if the housing of the gas sensor module contacts the top of the gas sensor module. Therefore, this gas sensor module can easily perform gas-related detection even when installed in a mounting space with a short length relative to the semiconductor chip in the vertical direction.

[0014] In other gas sensor modules, the package can be configured with a protrusion height of 0.01 mm to 2 mm. In such a configuration, by ensuring the protrusion height is 0.01 mm or more, even when the gas sensor module is mounted in a narrow mounting space, such as the upper part of the cover where it contacts the frame, gas can be guided to the detection space through multiple openings. Furthermore, by ensuring the protrusion height is 2 mm or less, for example, by attaching a cutting tape during packaging cutting, foreign objects and cooling water can be prevented from entering through the openings. As a result, the reliability of gas introduction into the detection space and the overall quality of the gas sensor module are improved when mounted in a shorter mounting space perpendicular to the semiconductor chip.

[0015] One aspect of the present invention relates to a method for manufacturing a gas sensor module, wherein a sidewall forming component is formed on a substrate or a cover forming component by injection molding (injection molding, spray molding) in a manner that surrounds multiple chip configuration spaces. The sidewall forming component has multiple recesses corresponding to a chip configuration space. Multiple semiconductor chips on which gas sensor elements are formed are fixed to multiple regions of the substrate corresponding to the multiple chip configuration spaces by chip bonding. The sidewall forming component is electrically connected to the terminals of the substrate by wire bonding. The gas sensor module is assembled by bonding the sidewall forming component to the cover, the cover forming component, or the substrate. At least the sidewall forming component and the substrate are cut to separate the gas sensor module formed on the substrate, so that the multiple recesses become openings communicating with the chip configuration spaces.

[0016] In one method of manufacturing a gas sensor module, since a recess is formed in the sidewall by injection molding, an opening can be easily formed in the sidewall even if the module length in the direction perpendicular to the semiconductor chip is, for example, less than 3 mm.

[0017] Another aspect of the invention relates to a method for manufacturing a gas sensor module, which involves injection molding a sidewall forming component surrounding multiple chip configuration spaces onto a substrate or a cover forming component; fixing multiple semiconductor chips, on which gas sensor elements are formed, to multiple regions of the substrate corresponding to the multiple chip configuration spaces via chip bonding; electrically connecting the sidewall forming component to terminals of the substrate via wire bonding; assembling multiple gas sensor modules by bonding the sidewall forming component to form multiple openings communicating with the chip configuration spaces between the cover and the sidewall forming component corresponding to each chip configuration space; attaching a cutting strip to block the multiple openings; and separating multiple gas sensor modules formed on a substrate by applying coolant to a cutting blade while cutting at least the sidewall forming component and the substrate with the cutting blade.

[0018] In other methods of manufacturing gas sensor modules, since a gap is formed between the sidewall forming component and the cover, an opening can be easily formed between the sidewall and the cover even if the module length in the direction perpendicular to the semiconductor chip is, for example, less than 3 mm. Furthermore, by cutting the strip, coolant can be prevented from entering the chip placement space.

[0019] Invention Effects

[0020] The gas sensor module of the present invention can easily perform gas-related detection even when installed in a short mounting space relative to the length of the semiconductor chip on which the gas sensor element is formed. Furthermore, the manufacturing method of the gas sensor module of the present invention enables the provision of such a gas sensor module. Attached Figure Description

[0021] Figure 1 This is a schematic cross-sectional view of the gas sensor module according to the first embodiment.

[0022] Figure 2 This is a schematic cross-sectional view of a device in which the mounting surface of the gas sensor module of the first embodiment is assembled and the frame is spaced relatively far apart.

[0023] Figure 3 This is a schematic cross-sectional view of a device in which the mounting surface of the gas sensor module of the first embodiment is assembled and the frame is narrowly spaced.

[0024] Figure 4 This is a top view of the semiconductor chip inside the gas sensor module.

[0025] Figure 5 This is a top view of a gas sensor element formed on a semiconductor chip.

[0026] Figure 6 It is along Figure 5 A cross-sectional view of the gas sensor element with the II line cut off.

[0027] Figure 7 It is a schematic three-dimensional diagram showing the cutting of a semiconductor wafer.

[0028] Figure 8 This is a top view of an injection-molded assembly substrate with sidewall-formed components.

[0029] Figure 9 It is along Figure 8 A cross-sectional view of the substrate cut along line II-II.

[0030] Figure 10 It is a schematic cross-sectional view showing the state in which a semiconductor chip is bonded to an assembly substrate.

[0031] Figure 11 This is a schematic top view of a substrate assembly showing wire bonding.

[0032] Figure 12 This is a schematic cross-sectional view of an assembly substrate showing wire bonding.

[0033] Figure 13 This is a top view used to illustrate the assembly process of fixing the cover to the side wall to form the component.

[0034] Figure 14 It is a schematic cross-sectional view used to illustrate the assembly process of fixing the cover to the side wall to form a component.

[0035] Figure 15 It is a schematic 3D diagram representing the packaging and cutting process.

[0036] Figure 16 It is a schematic cross-sectional view used to illustrate the assembly substrate of the packaging and cutting process.

[0037] Figure 17 (a) is a top view showing the state in which a sidewall forming component is formed on the assembly substrate in the manufacturing method involved in Modification 1A; (b) is a view along... Figure 17 (a) is a cross-sectional view of the assembly substrate cut along line III-III; (c) is a top view illustrating the assembly process of fixing the cover to the sidewall to form the component; and (d) is a schematic cross-sectional view illustrating the packaged cutting of the assembly substrate.

[0038] Figure 18 (a) is a top view showing the state in which a sidewall forming component is formed on the assembly substrate in the manufacturing method according to Modification 1B; (b) is a view along... Figure 18(a) is a cross-sectional view of the assembly substrate cut along line IV-IV; (c) is a schematic top view showing the semiconductor chip bonded to the assembly substrate; (d) is a schematic cross-sectional view showing the chip bonded state; (e) is a top view showing the cover fixed to the sidewall forming a component; and (f) is a schematic cross-sectional view illustrating the package cut of the assembly substrate.

[0039] Figure 19 (a) is a top view showing the state in which a sidewall forming component is formed on the assembly substrate in the manufacturing method according to Modified Example 1C; (b) is a view along... Figure 19 (a) is a cross-sectional view of the assembly substrate cut by the VV line, (c) is a top view showing the cover fixed to the sidewall forming the component, and (d) is a schematic cross-sectional view for illustrating the package cutting of the assembly substrate.

[0040] Figure 20 This is a top view of the gas sensor module according to the second embodiment.

[0041] Figure 21 It is along Figure 20 A schematic cross-sectional view of a gas sensor module with the VI-VI line cut off.

[0042] Figure 22 This is a schematic cross-sectional view of a device in which the mounting surface of the gas sensor module of the second embodiment is narrowly spaced from the frame.

[0043] Figure 23 This is a top view showing the state in which the cover is fixed to the side wall to form a component.

[0044] Figure 24 It is a schematic cross-sectional view showing the cover and the cut strip attached to the cover.

[0045] Figure 25 (a) is a top view showing one example of the gas sensor module involved in Modification 2A, (b) is a top view showing another example of the gas sensor module involved in Modification 2A, and (c) is a top view showing yet another example of the gas sensor module involved in Modification 2A.

[0046] Figure 26 This is a top view showing the gas sensor module according to the third embodiment.

[0047] Figure 27 It is along Figure 26 A schematic cross-sectional view of the gas sensor module with the VII-VII line cut off.

[0048] Figure 28 This is a schematic cross-sectional view of a device in which the mounting surface of the gas sensor module of the third embodiment is narrowly spaced from the frame.

[0049] Figure 29 It is a schematic cross-sectional view showing the cover and the cut strip attached to the cover.

[0050] Symbol Explanation

[0051] 10, 10A, 10B Gas Sensor Modules

[0052] 20 Semiconductor chips

[0053] 30, 30A, 30B packages

[0054] 30a Opening

[0055] 31 substrate

[0056] 32, 32A sidewalls

[0057] 32a Opening

[0058] 33, 33A, 33B Cover

[0059] 33a Opening

[0060] 34 terminals

[0061] 40 Gas sensor elements

[0062] Equipment 60 and 65

[0063] 110 Collection base plate

[0064] 120, 125 sidewall forming components

[0065] 121 recess

[0066] 130 chip configuration space

[0067] 140 Cap forming component

[0068] 151 Cutting Strip

[0069] S1 Detection Space Detailed Implementation

[0070] <First Implementation Method>

[0071] use Figures 1 to 19 The gas sensor module according to the first embodiment of the present invention will be described.

[0072] (1) Structure of the gas sensor module

[0073] exist Figure 1The cross-sectional shape of the gas sensor module 10 according to the first embodiment is schematically shown in the diagram. The gas sensor module 10 according to the first embodiment includes a semiconductor chip 20 and a package 30.

[0074] A gas sensor element 40 is formed on the semiconductor chip 20.

[0075] The package 30 includes a substrate 31, sidewalls 32, and a cover 33. The package 30 is, for example, a rectangle with a planar shape of 5mm × 5mm or less and a height of 3mm or less. The sidewalls 32 are fixed to the substrate 31. The sidewalls 32 are fixed to the substrate 31, for example, as described later, by injection molding the sidewalls 32 onto the substrate 31. Alternatively, as another fixing method, for example, the sidewalls 32 can be bonded to the substrate 31 using an adhesive.

[0076] A semiconductor chip 20 is fixed to the substrate 31, for example, by an adhesive. A cover 33 is fixed to the sidewall 32. The cover 33 can be fixed to the sidewall 32, for example, by bonding the cover 33 to the sidewall 32 with an adhesive. Alternatively, as another fixing method, for example, the sidewall 32 can be injection molded onto the cover 33.

[0077] A terminal 34 is provided on the bottom side of the package 30. The package 30 is a non-wire package. The gas sensor module 10 is electrically connected to an external circuit by connecting this terminal 34. The terminal 34 is electrically connected to the semiconductor chip 20, for example, via a connected lead 29.

[0078] The package 30 has a flat shape in which its length in the horizontal direction D1 of the semiconductor chip 20 is longer than its length in the vertical direction D2 of the semiconductor chip 20. The package 30 has a detection space S1 inside it, through which gas flows around the semiconductor chip 20. The package 30 has two openings 32a on its sidewall 32 that communicate with the detection space S1. Furthermore, the package 30 has two openings 33a on its cover 33 that communicate with the detection space S1. The size of the openings 33a is, for example, 0.1 mm to 0.5 mm in length in the horizontal direction D1. The area of ​​each of these openings 32a and 33a is, for example, 0.001 mm². 2 ~0.2mm 2 .

[0079] (2) How to use the gas sensor module

[0080] Figure 1The gas sensor module 10 shown, for example, when equipped with a gas sensor element 40 for detecting a specific type of gas, detects the presence of a specific type of gas in the gas flowing into the detection space S1. Devices equipped with such a gas sensor module 10 include, for example, gas alarms, alcohol detectors, automobiles, medical devices, air conditioners, and various measuring instruments.

[0081] exist Figure 2 The image shows a cross-sectional shape of a device 60 on which a gas sensor module 10 is assembled. The device 60 includes a printed circuit board 61 and a housing 62. The gas sensor module 10 is mounted on the printed circuit board 61 together with small solid-state devices 71 and 72. In other words, the printed circuit board 61 is an example of a mounting location for the gas sensor module 10. Examples of small solid-state devices include chip resistors, chip capacitors, integrated circuits, wireless modules, and MEMS devices. The solid-state devices 71 and 72 and the gas sensor module 10 are mounted to the printed circuit board 61, for example, by soldering.

[0082] Figure 2 The distance IN1 between the mounting surface 63 of the printed wiring board 61 of the device 60 and the frame 62, even after subtracting the height H1 of the gas sensor module 10 from the mounting surface 63, still leaves a sufficient distance IN2 between the upper surface of the cover 33 of the gas sensor module 10 and the frame 62 for gas flow. In this case, a specific type of gas of the target object can be introduced into the detection space S1 through the opening 33a of the cover 33 and the opening 32a of the side wall 32 of the gas sensor module 10. In contrast, in Figure 3 In the device 65 shown, the distance IN3 between the mounting surface 63 of the printed wiring board 61 and the frame 62 is substantially the same as the height H1 of the gas sensor module 10 from the mounting surface 63. Therefore, although the opening 33a of the cover 33 in the device 65 is more likely to be blocked by the frame 62, mounting the gas sensor module 10 in such a device 65 will still allow a specific type of gas to be introduced into the detection space S1 through the opening 32a of the side wall 32.

[0083] (3) Detailed structure of the gas sensor module

[0084] exist Figure 4 The image shows a magnified view of the semiconductor chip 20 containing the gas sensor module 10. (This will be explained later.) Figure 7A semiconductor wafer 100 is shown, forming a plurality of semiconductor chips 20. The semiconductor wafer 100 is, for example, a silicon wafer. One side of each semiconductor chip 20 is rectangular, for example, less than 2 mm. A gas sensor element 40 is formed in the central portion of the semiconductor chip 20. The planar length of the gas sensor element 40 is, for example, less than 0.1 mm. An electrode wiring pattern 28 extends from the gas sensor element 40 toward the end of the semiconductor chip 20. Leads 29 are attached to the electrode wiring pattern 28. The electrode wiring pattern 28 of the semiconductor chip 20 is electrically connected to a terminal 34 via the leads 29.

[0085] exist Figure 5 The portion containing the gas sensor element 40 is shown in magnified view. Figure 6 In the middle, it is shown that Figure 5 The II-line cross-section. A cavity 21a with an opening is formed on the surface of a silicon substrate 21. The cavity 21a is formed, for example, by etching the semiconductor wafer 100. An oxide film 22 is formed on the surface of the substrate 21. When the substrate 21 is made of silicon, the oxide film 22 is a silicon oxide film. An insulating film 23 is formed on the oxide film 22. A heating electrode 24 is formed on the insulating film 23. By energizing the heating electrode 24, the gas sensor 27 can be heated. To heat the gas sensor 27, [the following steps are taken]. Figure 5 A DC voltage is applied to the heating electrodes 24a and 24b. An insulating film 25 is formed on the heating electrode 24. Sensor electrodes 26a and 26b and a gas sensor 27 are formed on the insulating film 25, and the sensor electrodes 26a and 26b are electrically connected through the gas sensor 27. By exposing the gas sensor 27 to a specific type of gas, the resistance value of the gas sensor 27 changes, and the resistance value between the sensor electrodes 26a and 26b changes. Furthermore, the sensor electrodes 26a and 26b are contained within... Figure 6 The sensor electrode 26 shown.

[0086] (4) Manufacturing method of gas sensor module

[0087] Regarding the manufacturing method of the gas sensor module 10 according to the first embodiment, using Figures 7 to 16 Explanation will be provided. In Figure 7 The semiconductor wafer 100 shown has multiple Figure 4 The semiconductor chip 20 is shown. The semiconductor wafer 100 is attached to the dicing tape 101. While attached to the dicing tape 101, the semiconductor wafer 100 is cut with a blade 102 to cut out a plurality of semiconductor chips 20 from the semiconductor wafer 100.

[0088] In addition, while preparing multiple semiconductor chips 20, Figure 8 and Figure 9 The shown assembly substrate 110 forms a sidewall forming component 120. Figure 9 It is along Figure 8 A cross-sectional view of line II-II cut. In the assembly substrate 110, for example, FR4 (Flame Retardant Type 4) obtained by impregnating and curing epoxy resin into glass cloth, or GPY obtained by impregnating and curing polyimide resin or modified polyimide resin into glass cloth, can be used as the main material. The sidewall forming member 120 is integrally formed with the assembly substrate 110, for example, by injection molding. The sidewall forming member 120 can be, for example, an epoxy resin (with filler added), a liquid crystal polymer, a phenolic resin, or a polyester. A plurality of chip placement spaces 130 are formed, surrounded by the sidewall forming member 120. Two recesses 121 are formed in the sidewall forming member 120 relative to each chip placement space 130. Additionally, in this specification, the recess reaching the assembly substrate 110 is also referred to as a recess. Figure 10 As shown, each of the plurality of chip configuration spaces 130 is allocated one or a predetermined number of semiconductor chips 20, and the plurality of semiconductor chips 20 are bonded to the assembly substrate 110. The positions where the semiconductor chips 20 are mounted are, for example, as shown below. Figure 11 The gas sensor 27 shown is positioned on the straight line LN1 connecting the recess 121.

[0089] like Figure 11 and Figure 12 As shown, through wire bonding of the semiconductor chip 20, the lead 29 is connected to the terminal 34 of the assembly substrate 110 and the semiconductor chip 20. Therefore, a portion of the terminal 34 is exposed relative to the chip configuration space 130 of the assembly substrate 110.

[0090] like Figure 13 and Figure 14As shown, a gas sensor module 10 is assembled by bonding multiple covers 33 to a sidewall forming member 120. Multiple chip configuration spaces 130 are covered by the covers 33, forming the detection space S1 of the gas sensor module 10. Each cover 33 has two openings 33a. A gas sensor 27 is positioned below the straight line LN2 connecting the two openings 33a. Adjacent covers 33 are bonded together by an adhesive applied to the upper surface of the sidewall forming member 120, creating a gap between them. When applying the adhesive to the upper surface of the sidewall forming member 120, it is applied in a manner that does not clog the recesses 121. For example, by screen printing, the portion of the recesses 121 is avoided, and the adhesive is applied only to the upper surface of the sidewall forming member 120. In this way, the gas sensor module 10 is assembled by covering each chip configuration space 130 with each cover 33. The covers 33 can be made of, for example, metal, ceramic, or glass. Metals used for the cap 33 include, for example, Kovar alloy (Kovar iron-nickel-cobalt alloy), stainless steel, and nickel.

[0091] After the cover 33 is bonded to the side wall forming component 120, as Figure 15 and Figure 16 As shown, the cover 33 is attached to the cutting strip 151. Then, the gas sensor module 10 formed on a substrate 110 is separated by using the encapsulation cutting of the blade 152. Figure 16 The part indicated by arrow Ar1 is the part that is cut off. At this time, terminal 34 is also cut off by blade 152. Furthermore, the case of cutting terminal 34 using blade 152 has been described here, but a manufacturing method in which terminals 34 are formed separately on each gas sensor module 10 from the beginning without cutting them using blade 152 can also be used. In this package cutting, the sidewall forming member 120 and the assembly substrate 110 are cut together with the cutting strip 151 by the blade 152, so that the recesses 121 at both locations become openings 32a communicating with the chip placement space 130. Blade 152 cuts off the central portion of the sidewall forming member 120 along the direction in which the sidewall forming member 120 extends. Cooling water is attached to blade 152 during cutting. However, since the opening 33a of the cover 33, which becomes the bottom during cutting, is blocked by the cutting strip 151, cooling water does not easily enter the chip placement space 130. After cutting, the gas sensor module 10 is dried.

[0092] (5) Variations

[0093] (5-1) Variation 1A

[0094] In the manufacturing method of the gas sensor module 10 of the first embodiment described above, the recess 121 provided in the sidewall forming member 120 reaches the assembly substrate 110. However, the depth of the recess 121 can also be as follows: Figure 17(a) and Figure 17 It forms shallower, as shown in (b). Figure 17 (b) shows the path along Figure 17 (a) A cross-section of the substrate 110 cut along line III-III. The gas sensor module 10 described in Modified Example 1A, as shown... Figure 17 As shown in (c), after chip bonding and wire bonding, the cover 33 is bonded to the sidewall forming component 120, and then, as... Figure 17 As shown in (d), it is obtained by encapsulation cutting. Since the depth of the recess 121 is relatively shallow, the opening 32a of the sidewall 32 is positioned higher than the substrate 31. In addition, the same symbols are used to mark the same parts as in the first embodiment.

[0095] (5-2) Variation 1B

[0096] In the manufacturing method of the gas sensor module 10 of the first embodiment and Variation 1A described above, the case in which a sidewall forming member 120 is formed on the assembly substrate 110 has been described. However, the sidewall forming member 120 may also be, for example, as Figure 18 (a) and Figure 18 As shown in (b), a sidewall forming member 120 is formed on the cover forming member 140. Figure 18 (b) shows the path along Figure 18 (a) A cross-section of the cap forming member 140 cut along line IV-IV. The sidewall forming member 120 is integrally formed with the cap forming member 140, for example, by an insert mold. In the sidewall forming member 120, two recesses 121 are formed in each chip placement space 130. Additionally, in the cap forming member 140, two openings 33a are formed relative to each chip placement space 130. Figure 18 (c) and Figure 18 As shown in (d), the semiconductor chip 20 is mounted on the assembly substrate 110 via chip bonding and wire bonding. Next, as... Figure 18 (e) and Figure 18 As shown in (f), a semiconductor chip 20 is disposed in the chip placement space 130, and a cover forming member 140 and a sidewall forming member 120 are bonded to the assembly substrate 110. The adhesive is applied in the same manner as in the manufacturing method of the gas sensor module 10 of the first embodiment, ensuring that the adhesive does not enter the recess 121. The case where the cover forming member 140 covers the assembly substrate 110 so that the gas sensor 27 is disposed below the straight line LN2 passing through the opening 33a and the recess 121 is the same as in Modified Example 1A. Figure 18 As shown in (f), in the case of Modified Example 1B, during the packaging cut, in the first embodiment, not only the assembly substrate 110 and the sidewall forming member 120 are cut using the blade 152, but the cover forming member 140 is also cut using the blade 152.

[0097] (5-3) Variation 1C

[0098] As with the gas sensor module 10 of the first embodiment and Modification 1A, the recess 121 may be formed more shallowly than that of the gas sensor module 10 of Modification 1B. Figure 19 (a) and Figure 19 In (b), it is shown that there is a ratio Figure 18 (a) and Figure 18 (b) shows a shallower recess 121. Figure 19 In (b), it is shown that there is along... Figure 19 (a) The cross-section of the cover forming component 140 is cut by the VV line. In the gas sensor module 10 of Modified Example 1C, as... Figure 19 (c) and Figure 19 As shown in (d), it is formed such that the opening 32a of the sidewall 32 reaches the substrate 31 but does not reach the cover 33.

[0099] (5-4) Variation 1D

[0100] In the gas sensor module 10 of the first embodiment, an opening 33a is formed not only in the side wall 32, but also in the cover 33. However, the gas sensor module of the present invention may also adopt a structure in which an opening 32a is formed only in the side wall 32.

[0101] (5-5) Variation 1E

[0102] In the first embodiment described above, a gas sensor module 10 that detects a specific type of gas via gas sensor 27 was described; however, the gas sensor module of the present invention is not limited to detecting a specific type of gas. The present invention can also be applied to, for example, a gas sensor module that detects the flow rate of a gas via gas sensor element 40.

[0103] (5-6) Variation 1F

[0104] In the first embodiment described above, the method of bonding multiple covers 33 to the sidewall forming member 120 has been explained, but for example, a single cover may also be used. Figure 18 (a) or Figure 19 (a) shows a cover forming component 140 of the size of the multiple chip configuration space 130 (a cover forming component 140 without injection molding of sidewall forming component 120) instead of adhesively bonding multiple covers 33.

[0105] (5-7) Variation 1G

[0106] In the first embodiment and various modifications described above, the depth of the recess 121 is made the same. However, the heights of the multiple openings 32a formed on the sidewall 32 of the gas sensor module 10 can be made different by changing the depth of the recess 121. By making the heights of the openings 32a different, the rising airflow generated by the heating of the gas sensor 27 allows gas to be discharged mainly from the higher openings 32a and drawn in mainly from the lower openings 32a, thereby enabling gas replacement.

[0107] <Second Implementation Method>

[0108] use Figures 20 to 25 The gas sensor module according to the second embodiment of the present invention will be described.

[0109] (6) Structure of the gas sensor module

[0110] exist Figure 20 The diagram schematically illustrates the planar shape of the gas sensor module 10A according to the second embodiment. Figure 21 In the middle, it is schematically shown that there is along Figure 20 The shape of the end face obtained by cutting the VI-VI line. The gas sensor module 10A according to the second embodiment includes a semiconductor chip 20 and a package 30A.

[0111] In the second embodiment, the semiconductor chip 20 of the gas sensor module 10A is formed with a gas sensor element 40 in the same way as the gas sensor module 10 in the first embodiment.

[0112] The package 30A includes a substrate 31, a sidewall 32A, and a cover 33A. The sidewall 32A is fixed to the substrate 31. The sidewall 32A in the first embodiment differs from that in the second embodiment in that the sidewall 32A does not have an opening 32a like the sidewall 32. Furthermore, the cover 33A in the second embodiment also does not have the opening 33a formed in the cover 33A of the first embodiment. Recesses 33b are formed in two locations on the cover 33A. The cover 33A forms an opening 30a between itself and the sidewall 32A by having a portion that extends further inward than the sidewall 32A when adhered to it. Figure 20 and Figure 21 In the gas sensor module 10A shown, the portion that enters the inner side is the recessed portion 33b.

[0113] In the second embodiment, the fixing of the sidewall 32A to the substrate 31 and the fixing of the cover 33A to the sidewall 32A are performed in the same manner as in the first embodiment, where the fixing of the sidewall 32 to the substrate 31 and the fixing of the cover 33 to the sidewall 32A are performed. Furthermore, the connection between the semiconductor chip 20 and the terminal 34 is also performed via the connected lead 29.

[0114] The package 30A, like the package 30, has the following shape: a flat shape in which the length of the horizontal direction D1 of the semiconductor chip 20 is longer than the length of the vertical direction D2 of the semiconductor chip 20. Furthermore, in order to introduce gas into the detection space S1 inside the package 30A and into the vicinity of the semiconductor chip 20, the two openings 30a of the gas sensor module 10A are respectively connected to the outside of the package 30A and the detection space S1.

[0115] (7) How to use the gas sensor module

[0116] exist Figure 22 The image shows the cross-sectional shape of a device 65 equipped with a gas sensor module 10A. Figure 22 The distance IN4 between the mounting surface 63 of the printed wiring board 61 and the frame 62 of the device 65 shown is substantially equal to the height H1 of the gas sensor module 10A from the mounting surface 63. However, the height H2 from the mounting surface 63 of the printed wiring board 61 to the upper surface 32u of the side wall 32A is less than the height H1 of the gas sensor module 10A. That is, H1>H2. Through these height differences (H1-H2), a gap G1 is formed between the frame 62 and the upper surface 32u of the side wall 32A, ensuring a gas flow path. Since the gap G1, which serves as a gas path, exists even though the distance IN4 between the mounting surface 63 of the printed wiring board 61 and the frame 62 is substantially the same as the height H1 of the gas sensor module 10A from the mounting surface 63, gas can be introduced from the outside into the detection space S1 through the opening 30a. The size of the opening 30a is such that, for example, the length of one side of the horizontal direction D1 is shorter than the length of one side of the gas sensor module 10A, and the length of the other side is 0.1 mm to 0.4 mm. The area of ​​each of these openings 30a is, for example, 0.01 mm². 2 ~2mm 2 .

[0117] To ensure the clearance G1 for introducing gas from the outside into the detection space S1 through the opening 30a, the upper surface 32u of the sidewall 32A and the upper surface 33u of the cover 33A are preferably (refer to...). Figure 21 The step difference between the sidewall 32A and the cover 33A is large, preferably 0.01 mm or more. Furthermore, to ensure good ventilation, the step difference between the sidewall 32A and the cover 33A is preferably 0.025 mm or more. In the second embodiment, the step difference between the sidewall 32A and the cover 33A is substantially equal to the thickness of the cover 33A.

[0118] (8) Manufacturing method of gas sensor module

[0119] use Figure 23 and Figure 24The manufacturing method of the gas sensor module 10A according to the second embodiment will be described. Since until... Figure 23 The process of bonding the cover 33A to the sidewall forming member 125 is performed in the same way as in the gas sensor module 10 of the first embodiment, so the next packaging and cutting process will be described. In addition, the sidewall forming member 125 can be made of the same material as the sidewall forming member 120, and the cover 33A can be made of the same material as the cover 33.

[0120] In the packaging and cutting process, using blade 152 (see reference) Figure 15 Before cutting, such as Figure 24 As shown, the cutting strip 151 is adhered to the cover 33A and the sidewall forming member 125. To seal the opening 30a with the cutting strip 151, the step difference between the sidewall forming member 125 (sidewall 32A) and the cover 33A is preferably small, for example, preferably less than 2 mm. Furthermore, to seal the opening 30a and prevent easy peeling, the step difference is preferably less than 0.5 mm.

[0121] In this packaging cut, the sidewall forming member 125 and the assembly substrate 110, along with the cutting strip 151, are cut together using a blade 152. The blade 152 cuts off the central portion of the sidewall forming member 125 along the direction in which the sidewall forming member 125 extends. Cooling water is applied to the blade 152 during cutting. However, since the opening 33a of the cover 33A, which becomes the bottom during cutting, is blocked by the cutting strip 151, cooling water is prevented from entering the chip placement space 130. After cutting, the gas sensor module 10A is dried.

[0122] (9) Variation

[0123] (9-1) Variation 2A

[0124] In the second embodiment described above, the case where the opening 30a is formed by the recess 33b was explained, but the opening 30a can also be formed by a shape other than the recess 33b. For example... Figure 25 As shown in (a), for example, the opening 30a can also be formed by making the width W1 of the cover 33A smaller than the width W2 of the chip placement space 130. Additionally, as... Figure 25 As shown in (b), for example, openings 30a can be formed at the four corners of the cover 33A by providing notches 33c at the four corners. Furthermore, as Figure 25 As shown in (c), it can also be done by making Figure 25 (b) shows the cover 33A rotated 45 degrees to overlap with the side wall 32A to form the opening 30a.

[0125] (9-2) Variation 2B

[0126] In the second embodiment and variation 2A described above, no opening is formed in the side wall 32A. However, in the gas sensor module 10A of the second embodiment and variation 2A, a recess may be formed in the side wall forming member 125 and an opening may be formed in the side wall 32A, just as in the first embodiment.

[0127] (9-3) Variation 2C

[0128] In the second embodiment and variations 2A and 2B described above, no opening is formed in the cover 33A. However, for the gas sensor module 10A of the second embodiment and variations 2A and 2B, an opening identical to the opening 33a described in the first embodiment may be further formed in the cover 33A.

[0129] (9-4) Variation 2D

[0130] In the manufacturing method of the gas sensor module 10A of the second embodiment described above, a case is shown in which a plurality of covers 33A are bonded to the sidewall forming member 125. However, in addition to bonding a plurality of covers 33A one by one, the manufacturing method of the gas sensor module 10A of the second embodiment can also be as described in modifications 1B and 1C, by forming a plurality of openings in a cover forming member, arranging the openings in a manner that overlaps with the sidewall forming member 125, and cutting them with a blade to form openings 30a.

[0131] (9-5) Variation 2E

[0132] In the second embodiment described above, a gas sensor module 10A that detects a specific type of gas via gas sensor 27 was described; however, the gas sensor module of the present invention is not limited to detecting a specific type of gas. The present invention can be applied, for example, to a gas sensor module that detects the flow rate of a gas using gas sensor element 40.

[0133] <Third Implementation Method>

[0134] use Figures 26 to 29 The gas sensor module according to the third embodiment of the present invention will be described.

[0135] (10) Structure of the gas sensor module

[0136] exist Figure 26 The diagram schematically illustrates the planar shape of the gas sensor module 10B according to the third embodiment. Figure 27 In the middle, it is schematically shown that there is along Figure 26 The cross-sectional shape of the section cut off from line VII-VII. The gas sensor module 10B according to the third embodiment includes a semiconductor chip 20 and a package 30B.

[0137] In the third embodiment, the semiconductor chip 20 of the gas sensor module 10B is formed with a gas sensor element 40 in the same way as the gas sensor module 10 in the first embodiment.

[0138] The package 30B includes a substrate 31, sidewalls 32A, and a cover 33B. Sidewalls 32A are fixed to the substrate 31. The sidewalls 32A in the third embodiment are the same as those in the second embodiment. The cover 33B in the third embodiment has three openings 33a. Furthermore, a protrusion 33d is formed at each of the four corners of the upper surface of the cover 33B. Additionally, the cover 33B can be made of the same material as the cover 33.

[0139] In the third embodiment, the fixing of the sidewall 32A to the substrate 31 and the fixing of the cover 33B to the sidewall 32A are performed in the same manner as in the first embodiment, where the fixing of the sidewall 32 to the substrate 31 and the fixing of the cover 33 to the sidewall 32 are performed. Furthermore, the connection between the semiconductor chip 20 and the terminal 34 is also performed via the connected lead 29.

[0140] Package 30B, like package 30, has the following shape: a flat shape in which the length of the direction D1 horizontal to the semiconductor chip 20 is longer than the length of the direction D2 vertical to the semiconductor chip 20.

[0141] (11) How to use the gas sensor module

[0142] exist Figure 28 The image shows the cross-sectional shape of a device 65 equipped with a gas sensor module 10B. Figure 28 The distance IN5 between the mounting surface 63 of the printed wiring board 61 of the device 65 and the frame 62 is substantially equal to the height H3 of the gas sensor module 10B from the mounting surface 63. However, the distance from the mounting surface 63 of the printed wiring board 61 to the upper surface 33u of the cover 33B (see reference) is also different. Figure 27 The height H4 of the gas sensor module 10B is less than the height H3 of the gas sensor module 10B. That is, H3 > H4. Through these height differences (H3-H4), on the upper surface 33u of the frame 62 and the side wall 32A (refer to...) Figure 27 A gap G2 is formed between the two, ensuring a passage for gas flow. Since the distance IN5 between the mounting surface 63 of the printed wiring board 61 and the frame 62 is substantially the same as the height H3 of the gas sensor module 10B from the mounting surface 63, a gap G2, serving as a gas passage, exists, allowing gas to be introduced from the outside into the detection space S1 through the opening 33a. The area of ​​each of these openings 33a is, for example, 0.01 mm². 2 ~0.2mm 2 .

[0143] To ensure that the gap G2, which serves as a passage for introducing gas from the outside into the detection space S1 through the opening 33a, is relatively high, for example, preferably 0.01 mm or more. Furthermore, to ensure good ventilation, the height of the protrusion 33d is preferably 0.025 mm or more.

[0144] (12) Manufacturing method of gas sensor module

[0145] use Figure 29 The manufacturing method of the gas sensor module 10B according to the third embodiment will be described. Since until... Figure 29 The process of bonding the cover 33B to the sidewall to form the component 125 is performed in the same way as in the gas sensor module 10 of the first embodiment; therefore, the next packaging and cutting process will be described. In the packaging and cutting, a blade 152 (see reference...) is used... Figure 15 Before cutting, the cutting strip 151 is attached to the cover 33B. In order to block the opening 30a with the cutting strip 151, the protrusion 33d is preferably low, for example, preferably less than 2 mm. Furthermore, in order to block the opening 30a and prevent it from peeling off easily, the height of the protrusion 33d is preferably less than 0.5 mm.

[0146] In this packaging cut, the sidewall forming member 125 and the assembly substrate 110, along with the cutting strip 151, are cut together using a blade 152. The blade 152 cuts off the central portion of the sidewall forming member 125 along the direction in which the sidewall forming member 125 extends. Cooling water is applied to the blade 152 during cutting. However, since the opening 33a of the cover 33B, which becomes the bottom during cutting, is blocked by the cutting strip 151, cooling water is prevented from entering the chip placement space 130. After cutting, the gas sensor module 10B is dried.

[0147] (13) Variations

[0148] (13-1) Variation 3A

[0149] In the third embodiment described above, no opening is formed in the sidewall 32A. However, in the gas sensor module 10B of the third embodiment, a recess may be formed in the sidewall forming member 125, and an opening may be formed in the sidewall of the gas sensor module 10B, just as in the first embodiment.

[0150] Alternatively, instead of forming an opening in the cover 33B, an opening as described in the first embodiment can be formed in the side wall 32A, instead of the opening 33a forming the cover 33B. In the gas sensor module 10B formed in this way, even if it is surrounded by electrical components, gas can be easily guided to the opening in the side wall through the gap G2 formed by the protrusion 33d.

[0151] (13-2) Variation 3B

[0152] In the third embodiment described above, no opening is formed between the side wall 32A and the cover 33B. However, for the gas sensor module 10B of the third embodiment and the modified example 3A, an opening between the side wall 23A and the cover 33B as described in the second embodiment may be further formed.

[0153] Alternatively, instead of forming an opening in the cover 33B, an opening can be formed between the sidewall 32A and the cover 33B as described in the second embodiment, instead of forming an opening 33a in the cover 33B. In this case, since the gas passage is ensured not only by the thickness of the cover 33B but also by the height of the protrusion 33d, it is easier to guide the gas compared to the gas sensor module 10A of the second embodiment.

[0154] (13-3) Variation 3C

[0155] The gas sensor module 10B with protrusion 33d in the third embodiment described above can also be configured as follows: both the opening 32a described in the first embodiment and the opening 30a described in the second embodiment are further formed.

[0156] (13-4) Variation Example 3D

[0157] In the third embodiment described above, a gas sensor module 10B that detects a specific type of gas via gas sensor 27 was described; however, the gas sensor module of the present invention is not limited to detecting a specific type of gas. The present invention can be applied, for example, to a gas sensor module that detects the flow rate of a gas using gas sensor element 40.

[0158] (14) Features

[0159] (14-1)

[0160] The package 30 of the gas sensor module 10 in the first embodiment and the package 30B of the gas sensor module 10B in Modification 3A have multiple openings 32a communicating with the detection space S1 on the sidewall 32. Furthermore, the package 30A of the gas sensor module 10A described in the second embodiment and the package 30B of the gas sensor module 10B described in Modification 3B have multiple openings 30a communicating with the detection space S1 between the sidewall 32A and the cover 33A. Moreover, the package 30A of the gas sensor module 10A described in Modification 2B and the package 30B of the gas sensor module 10B described in Modification 3C have multiple openings 32a and 30a communicating with the detection space S1 on the sidewall 32 and between the sidewall 32A and the cover 33A.

[0161] Gas can flow into the detection space S1 from the outside through a portion of the multiple openings 30a and 32a that communicate with the detection space S1, and gas can flow out through the remaining openings 30a and 32a. Furthermore, even if the frame 62 contacts the upper surface of the gas sensor modules 10, 10A, and 10B, these multiple openings 30a and 32a will not be blocked by the frame 62. Therefore, even when installed in a short mounting space relative to the vertical direction of the semiconductor chip 20, the gas sensor modules 10, 10A, and 10B can easily perform gas-related detection.

[0162] (14-2)

[0163] As described in the second embodiment, modification 2B, modification 3B, and modification 3C, in gas sensor modules 10A and 10B that have multiple openings 30a communicating with the detection space S1 between at least the sidewall 32A and the covers 33A and 33B, the thickness of the covers 33A and 33B is preferably 0.01 mm or more and 2 mm or less. By making the thickness of the covers 33A and 33B 0.01 mm or more, even if the gas sensor modules 10A and 10B are installed in a narrow mounting space where the frame 62 contacts the upper surface of the covers 33A and 33B, gas can be guided to the detection space S1 through the multiple openings 30a. In addition, by making the thickness of the covers 33A and 33B 2 mm or less, the cutting strip 151 can be attached during packaging cutting to prevent foreign objects from entering through the openings 30a along with cooling water. As a result, the gas sensor modules 10A and 10B can achieve improved reliability and quality in introducing gas into the detection space S1 when installed in a shorter vertical mounting space relative to the semiconductor chip 20.

[0164] (14-3)

[0165] The package 30B of the gas sensor module 10B in the third embodiment and the modifications 3A to 3C has a cover 33B with: a plurality of openings 33a communicating with the detection space S1; and a protrusion 33d for forming a passage for guiding gas to the plurality of openings 33a.

[0166] Gas can flow into the detection space S1 from the outside through a portion of the multiple openings 33a communicating with it, and gas can flow out through the remaining openings 33a. Furthermore, due to the presence of the protrusion 33d, these multiple openings 33a will not be blocked by the frame 62 even when it contacts the upper part of the gas sensor module 10B. Therefore, even when installed in a mounting space with a relatively short length relative to the semiconductor chip 20 in the vertical direction, the gas sensor module 10B can easily perform gas-related detection.

[0167] (14-4)

[0168] As described in the third embodiment and variations 3A to 3C, in the gas sensor module 10B, which has multiple openings 33a communicating with the detection space S1 between itself and the cover 33B, the height of the protrusion 33d formed on the upper surface of the cover 33B is preferably 0.01 mm or more and 2 mm or less. By making the height of the protrusion 33d 0.01 mm or more, even if the gas sensor module 10B is installed in a narrow mounting space where the frame 62 contacts the upper part of the cover 33B, gas can be guided to the detection space S1 through the multiple openings 33a. In addition, by making the height of the protrusion 33d 2 mm or less, foreign objects can be prevented from entering through the openings 30a along with cooling water when the cutting tape is attached during packaging cutting. As a result, the reliability and quality of gas introduction into the detection space S1 when the gas sensor modules 10A and 10B are installed in a mounting space with a shorter vertical length relative to the semiconductor chip 20 are improved.

[0169] (14-5)

[0170] In the manufacturing method of the gas sensor module 10 according to the first embodiment, such as using Figure 8 and Figure 9 or Figure 17 (a) and Figure 17 (b) As described, a sidewall forming member 120 is formed by injection molding on a substrate 110 to surround a plurality of chip placement spaces 130. The sidewall forming member 120 has a plurality of recesses 121 corresponding to a chip placement space 130. For example, using... Figure 11 and Figure 12 As explained, multiple semiconductor chips 20, on which gas sensor elements 40 are formed, are fixed to multiple regions of a collection substrate 110 corresponding to multiple chip configuration spaces 130 via chip bonding, and are electrically connected to terminals 34 of the collection substrate 110 via wire bonding using leads 29. For example, using... Figure 13 and Figure 14 or Figure 17 (c) and Figure 17 As described in (d), the gas sensor module 10 is assembled by bonding the cover 33 to the sidewall forming member 120 and covering the multiple chip configuration spaces 130 with the cover 33. Then, the gas sensor module 10 formed on one of the assembly substrates 110 is separated by cutting at least the sidewall forming member 120 and the assembly substrate 110 in such a way that the multiple recesses 121 become openings 32a communicating with the chip configuration spaces 130.

[0171] Alternatively, in the manufacturing method of the gas sensor module 10 according to the variations 1B and 1C of the first embodiment, such as using... Figure 18 (a) and Figure 18 (b) or Figure 19 (a) and Figure 19 (b) As described, a cap forming member 140 is formed by injection molding. This cap forming member 140 is configured such that a plurality of chip placement spaces 130 are surrounded by sidewall forming members 120, each sidewall forming member 120 having a plurality of recesses 121 corresponding to a chip placement space 130. For example, using... Figure 18 (c) and Figure 18 As explained in (d), a plurality of semiconductor chips 20 on which the gas sensor element 40 is formed are fixed by chip bonding to a plurality of regions of a collection substrate 110 corresponding to a plurality of chip configuration spaces 130, and are electrically connected to terminals 34 of the collection substrate 110 by wire bonding using leads 29. Figure 18 (e) and Figure 18 (f) or Figure 19 (c) and Figure 19 As described in (d), the sidewall forming member 120 is bonded to the assembly substrate 110 to assemble multiple gas sensor modules 10. Then, the assembly substrate 110, the sidewall forming member 120, and the cover forming member 140 are cut to separate the gas sensor modules 10 formed on one assembly substrate 110 by making the recesses 121 at multiple locations into openings 32a communicating with the chip placement space 130.

[0172] In addition, liquids other than water can be used as coolants.

[0173] In the manufacturing method of the gas sensor module 10 according to such first embodiment or variation 1B, 1C, since the recess 121 is formed in the sidewall forming member 120 by injection molding, even if the length of the gas sensor module 10 in the direction perpendicular to the semiconductor chip 20 is less than 3 mm, the opening 32a can be easily formed in the sidewall 32.

[0174] (14-6)

[0175] In the manufacturing method of the gas sensor module 10A according to the second embodiment and variations 2B to 2D described above, such as Figure 8 and Figure 9 , Figure 17 (a) and Figure 17 (b) Figure 18 (a) and Figure 18 (b) or Figure 19 (a) and Figure 19(b) As illustrated, the sidewall forming member 120 surrounding the plurality of chip configuration spaces 130 is formed by injection molding onto an assembly substrate 110 or a cap forming member 140. For example, using... Figure 11 and Figure 12 or Figure 18 (c) and Figure 18 As explained in (d), a plurality of semiconductor chips 20 on which the gas sensor element 40 is formed are fixed by chip bonding to a plurality of regions of the assembly substrate 110 corresponding to the plurality of chip configuration spaces 130, and are electrically connected to the terminals 34 of the assembly substrate 110 by wire bonding using leads 29.

[0176] like Figure 23 and Figure 24 As shown, multiple gas sensor modules 10A are assembled by bonding the sidewall forming member 125 with a plurality of openings 30a communicating with the chip configuration space 130 between the cover 33A corresponding to each chip configuration space 130 and the sidewall forming member 125, and by bonding the cutting strip 151 to block the plurality of openings 30a. When the sidewall forming member 125 is formed on the assembly substrate 110, the sidewall forming member 125 and the assembly substrate 110 are cut by applying coolant to the cutting blade 152. When the sidewall forming member 125 is formed on the cover forming member 140, the assembly substrate 110, the sidewall forming member 125 and the cover forming member 140 are cut by applying coolant to the cutting blade 152. This separates the multiple gas sensor modules 10A formed on one assembly substrate 110.

[0177] In addition, liquids other than water can be used as coolants.

[0178] In the manufacturing method of the gas sensor module 10A according to this second embodiment, since a gap is formed between the sidewall forming member 125 and the cover 33A, even if the length of the gas sensor module 10 in the direction perpendicular to the semiconductor chip 20 is less than 3 mm, for example, an opening 30a can be easily formed between the sidewall 32A and the cover 33A.

[0179] In addition, the cutting strip 151 can prevent coolant from entering the chip configuration space 130.

Claims

1. A gas sensor module characterized by comprising: A gas sensor module assembled in an apparatus, comprising: a semiconductor chip on which a gas sensor element is formed; a flat package including a substrate on which the semiconductor chip is electrically connected and fixed, a side wall fixed to the substrate, and a cover fixed to an upper surface of the side wall, the package having a detection space in which gas flows around the semiconductor chip, the package having a length in a direction parallel to the semiconductor chip that is longer than a length in a direction perpendicular to the semiconductor chip, the package having a plurality of opening portions that are open upward and communicate with the detection space between the side wall and the cover, the cover having a plurality of recessed portions that are formed to be more inward than the side wall when the cover is bonded to the side wall, the cover forming the plurality of opening portions between the side wall by having the recessed portions, a gap for gas flow being formed between an upper surface of the side wall of the package and a frame of the apparatus.

2. The gas sensor module according to claim 1, wherein a thickness of the cover of the package is 0.01 mm or more and 2 mm or less. A manufacturing method of a gas sensor module assembled in an apparatus, comprising the steps of:

3. A method of manufacturing a gas sensor module, characterized by, inserting a collective substrate into a mold, thereby integrally forming a side wall forming member that surrounds a plurality of chip arrangement spaces to the collective substrate by injection molding; fixing a plurality of semiconductor chips on which a gas sensor element is formed to a plurality of regions of the collective substrate corresponding to the plurality of chip arrangement spaces by die bonding, and electrically connecting to terminals of the collective substrate by wire bonding; bonding a cover to an upper surface of the side wall forming member to assemble a plurality of gas sensor modules in a manner that a plurality of opening portions that communicate with the chip arrangement spaces are formed between the side wall forming member and the cover, the cover forming the plurality of opening portions between the side wall forming member by having a plurality of recessed portions that are more inward than the side wall forming member when bonded to the upper surface of the side wall forming member; attaching a dicing tape in a manner that the plurality of opening portions that are open upward are plugged; and separating a plurality of the gas sensor modules formed on one of the collective substrates by cutting at least the side wall forming member and the collective substrate using a dicing blade while applying a coolant to the dicing blade. ​

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