A light emitting device, a manufacturing method thereof, a lead frame, a bracket, and a light emitting apparatus

Abstract

The application provides a light-emitting device, a manufacturing method thereof, a lead frame, a support and a light-emitting device. The lead frame comprises at least one hollow support area for forming a base body support forming area. The support forming area has a support part and a lead part extending from the lead frame body. The support part comprises a first / second support part oppositely arranged. The support part is embedded in the base body from the intersection of the first side and the second side of the base body and the third side adjacent to the two sides. When the third side receives a force perpendicular to the third side, the support part is separated from the base body to form a bayonet on the base body. The support part of the lead frame fixes the five degrees of freedom of the LED product, so that the support part is separated from the remaining one degree of freedom of the LED product in the blanking process. The LED product can be prevented from being damaged due to stress in the blanking process, and the yield of the LED product is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED (Light Emitting Diode), and particularly relates to a light emitting device, a manufacturing method thereof, a lead frame, a support and a light emitting device. BACKGROUND

[0002] In recent years, LED has been playing an important role in the display field of mobile terminals due to its unique advantages of low price, low consumption, high brightness and long service life, and will have considerable development space in a long period of time in the future. In the existing LED production process, the forming of the LED support and the packaging of the LED light emitting device are performed on the lead frame. The lead frame provides leads for the LED product and provides support during the forming and packaging process. The existing lead frame supports the LED product by forming the two support portions on the lead frame in the two opposite sides of the LED product, and the LED light emitting device is discharged by separating the support portions from the clamping openings on the two opposite sides of the LED light emitting device. In this case, the support portions need to be deformed, and the support portions will exert force on the LED product, so that the LED light emitting device is easily damaged during the discharging process. SUMMARY

[0003] The light emitting device, the manufacturing method thereof, the lead frame, the support and the light emitting device provided by the embodiments of the present application mainly solve the problem that the existing lead frame is separated from the clamping openings on the two opposite sides of the LED light emitting device to discharge the LED light emitting device, and the LED light emitting device is easily damaged during the discharging process due to the force.

[0004] To solve the above technical problems, the embodiment of the present application provides a lead frame, comprising at least one hollow support forming area, the support forming area has a support part and a lead part extending from the lead frame body, the support part comprises a first support part and a second support part arranged oppositely, the support forming area is used for forming a base body on the support forming area by unsaturated polyester resin, the support part is used for embedding into the base body from the intersection of the first outer side and the third outer side of the formed base body and the intersection of the second outer side and the third outer side respectively; the first outer side and the second outer side are arranged oppositely, and the first outer side and the second outer side are both adjacent to the third outer side; when the third outer side receives a force in a direction perpendicular to the third outer side, the support part is separated from the inside of the base body to form a bayonet on the base body, the bayonet comprises a first bayonet and a second bayonet, the first bayonet opens to the first outer side and the third outer side from the inside of the base body, and the second bayonet opens to the second outer side and the third outer side from the inside of the base body.

[0005] Preferably, the surface of the lead part is covered with a reflective layer.

[0006] Preferably, the lead part and the support part are located on the same plane.

[0007] Preferably, the thickness of the lead part is equal to the thickness of the support part.

[0008] To solve the above technical problems, the embodiment of the present application also provides an LED support, comprising the lead part of the lead frame and the base body formed on the support forming area of the lead frame by unsaturated polyester resin, the base body has a bayonet and a groove for packaging an LED chip, the bayonet comprises a first bayonet and a second bayonet, the first bayonet opens to the first outer side and the third outer side from the inside of the base body, and the second bayonet opens to the second outer side and the third outer side from the inside of the base body, the first outer side and the second outer side are arranged oppositely, and the first outer side and the second outer side are both adjacent to the third outer side, and the bayonet is formed by the support part extending from the lead frame body in the support forming area and being separated from the inside of the base body when the third outer side receives a force in a direction perpendicular to the third outer side.

[0009] Preferably, fillers and / or titanium oxide are added to the unsaturated polyester resin, and the fillers comprise glass fibers and silicon dioxide.

[0010] Preferably, when the filler and the titanium oxide are added into the unsaturated polyester resin, preset additives are also added into the unsaturated polyester resin; the component ratio of the unsaturated polyester resin, the glass fiber, the silicon dioxide, the titanium oxide and the preset additives is A, B, C, D and E respectively, wherein 15% < A < 25%, 5% < B < 20%, 20% < C < 30%, 30% < D < 40%, 1% < E < 3%, and A + B + C + D + E = 100%.

[0011] Preferably, the socket further opens on a fourth outer side surface of the base body, and the fourth outer side surface is oppositely arranged with the third outer side surface.

[0012] To solve the above technical problems, the embodiment of the present application further provides an LED light emitting device, comprising the above LED support and at least one LED chip encapsulated in the base body of the LED support.

[0013] To solve the above technical problems, the embodiment of the present application further provides a light emitting device, comprising the above light emitting device, and the light emitting device is a lighting device, a light signal indicating device, a light supplementing device or a backlight device.

[0014] To solve the above technical problems, the embodiment of the present application further provides an LED light emitting device manufacturing method, comprising:

[0015] Preparation of a lead frame; the prepared lead frame has at least one hollow support forming area, the support forming area has a support part and a lead part extending from the lead frame body, and the support part comprises oppositely arranged first and second support parts;

[0016] Molding of a base body in the support forming area by unsaturated polyester resin; the base body has a groove for encapsulating an LED chip, and the support parts are respectively embedded in the base body from the intersection of the first outer side surface and the third outer side surface and the intersection of the second outer side surface and the third outer side surface of the molded base body; the first and second outer side surfaces are oppositely arranged, and both the first and second outer side surfaces are adjacent to the third outer side surface;

[0017] After the LED chip is encapsulated, a force perpendicular to the third outer side surface is applied to the third outer side surface of the base body, so that the support part is separated from the base body after the LED chip is encapsulated, and a socket is formed on the base body after the separation, the socket comprises a first socket and a second socket, the first socket opens from the inside of the base body to the first outer side surface and the third outer side surface at the same time, and the second socket opens from the inside of the base body to the second outer side surface and the third outer side surface at the same time.

[0018] Preferably, after the base body is formed in the bracket forming area by the unsaturated polyester resin, the method further comprises:

[0019] Separating the lead part from the lead frame body.

[0020] Preferably, after the lead part is separated from the lead frame body, the method further comprises:

[0021] Bending the part of the lead part protruding outward in the vertical direction of the third outer side surface to adhere to the surface of the base body.

[0022] Preferably, the lead part and the bayonet are located in the same plane.

[0023] Preferably, the thickness of the lead part is equal to the width of the bayonet.

[0024] Preferably, the forming of the base body in the bracket forming area by the unsaturated polyester resin comprises:

[0025] The base body is formed in the bracket forming area by the unsaturated polyester resin added with fillers and / or titanium oxide, the fillers including glass fibers and silicon dioxide.

[0026] Preferably, when the base body is formed in the bracket forming area by the unsaturated polyester resin added with fillers and / or titanium oxide, a preset additive is further added in the unsaturated polyester resin.

[0027] The component ratio of the unsaturated polyester resin, the glass fibers, the silicon dioxide, the titanium oxide and the preset additive is A, B, C, D and E respectively, wherein 15% < A < 25%, 5% < B < 20%, 20% < C < 30%, 30% < D < 40%, 1% < E < 3%, and A + B + C + D + E = 100%.

[0028] Preferably, the first bayonet and the second bayonet are further respectively opened on a fourth outer side surface of the base body, the fourth outer side surface is arranged opposite to the third outer side surface.

[0029] The beneficial effects of the present application are:

[0030] The application provides a light-emitting device, a manufacturing method thereof, a lead frame, a support and a light-emitting device. The lead frame comprises at least one hollow support forming area, the support forming area has a support part and a lead part extending from the lead frame body, the support part comprises a first support part and a second support part arranged oppositely, the support forming area is used for forming a base body on the support forming area by unsaturated polyester resin, the support parts are respectively embedded in the base body from the intersection of the first outer side and the third outer side of the formed base body and the intersection of the second outer side and the third outer side; the first outer side and the second outer side are arranged oppositely, and both of them are adjacent to the third outer side; when the third outer side receives a force in a direction perpendicular to the third outer side, the support part is separated from the inside of the base body to form a bayonet on the base body, the bayonet comprises a first bayonet and a second bayonet, the first bayonet opens to the first outer side and the third outer side from the inside of the base body, and the second bayonet opens to the second outer side and the third outer side from the inside of the base body. The support part on the lead frame of the application fixes five degrees of freedom of the LED product, so that the support part is separated from the remaining one degree of freedom of the LED product in the blanking process without the deformation of the support part caused by the force, which can effectively avoid the damage of the LED product caused by the force in the blanking process and improve the yield of the LED product.

[0031] Further, the LED support in the application is formed by unsaturated polyester resin, which can effectively inhibit burr generation, has high deterioration resistance, has low requirements for forming temperature and pressure, and can effectively ensure product quality and production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 A forming diagram of the LED support provided in the first embodiment of the application;

[0033] Figure 2 A structure diagram of the lead frame provided in the first embodiment of the application;

[0034] Figure 3 A side view diagram of the LED support provided in the first embodiment of the application;

[0035] Figure 4 A side view diagram of another LED support provided in the first embodiment of the application;

[0036] Figure 5 A structure diagram of the LED light-emitting device provided in the first embodiment of the application;

[0037] Figure 6 A flow chart of the manufacturing method of the LED light-emitting device provided in the second embodiment of the application;

[0038] Figure 7a A schematic view of the lead portion before being punched and separated according to the second embodiment of the present application is provided;

[0039] Figure 7b A schematic view of the lead portion after being punched and separated according to the second embodiment of the present application is provided;

[0040] Figure 8a A schematic view of the lead portion protruding outwardly and vertically from the side of the base body according to the second embodiment of the present application is provided;

[0041] Figure 8b A schematic view of the lead portion being bent and attached to the surface of the base body according to the second embodiment of the present application is provided;

[0042] Figure 9a A schematic view of the LED light emitting device being fixed on the support portion according to the second embodiment of the present application is provided;

[0043] Figure 9b A schematic view of the LED light emitting device being removed under force according to the second embodiment of the present application is provided. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solutions and advantages of the present application more clear, the following will make further detailed description to the embodiments of the present application by specific implementation mode combined with the drawings. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0045] Embodiment one:

[0046] In view of the problem that the LED light emitting device is easily damaged due to force in the discharging process caused by the support portion of the lead frame being separated from the LED light emitting device in the opening of the two opposite sides of the socket according to the prior art, the present application provides a lead frame 10, please refer to Figure 1The lead frame 10 comprises at least one hollow support forming area 11, the support forming area 11 has a support part 12 and a lead part 13 extending from the main body of the lead frame 10, the support part 12 comprises a first support part and a second support part arranged oppositely, the support forming area 11 is used to form a base body 20 by unsaturated polyester resin, the support part 12 is used to be embedded in the base body from the intersection of the first outer side 21 and the third outer side 23 and the intersection of the second outer side 22 and the third outer side 23 of the formed base body 20 respectively; the first outer side 21 and the second outer side 22 are arranged oppositely, and both of them are adjacent to the third outer side 23; when the support part 12 receives a force in a direction perpendicular to the third outer side 23, the support part 12 is separated from the inside of the support part 12 to form a bayonet 24 on the base body 20, the bayonet 24 comprises a first bayonet and a second bayonet, the first bayonet opens from the inside of the base body 20 to the first outer side 21 and the third outer side 23 at the same time, and the second bayonet opens from the inside of the base body 20 to the second outer side 22 and the third outer side 23 at the same time.

[0047] In the embodiment, referring to Figure 2 , the lead frame 10 can be formed by stamping or etching processing on a flat conductive substrate, so that at least one hollow support forming area 11 is formed on the lead frame 10, and the remaining part of the lead frame 10 after removing the material of the hollow area forms the lead part 13 and the support part 12, and the support part 12 and the lead part 13 extend from the main body of the lead frame 10 to the hollow area; in other embodiments, the support part and the lead part can also extend from the main body of the lead frame to the hollow area as a whole, that is, the lead part is connected to the main body of the lead frame through the support part. The lead part 13 has a die bonding area for placing an LED chip, which is used to conduct the LED chip installed later, and the support part 12 is used to form a support in the LED product during the support forming of the LED on the lead frame 10 and the packaging of the LED light emitting device. The support part 12 in the embodiment is arranged oppositely, and it should be pointed out that the first support part and the second support part can be a single support part, or can be a whole composed of a plurality of single support parts respectively.

[0048] It should be understood that the lead frame in the embodiment can be formed by substrates of various conductive materials, such as substrates of various metals or metal alloys, including but not limited to copper substrates, aluminum substrates, iron substrates, silver substrates, and of course, substrates of mixed materials containing conductive materials, such as conductive rubber, etc. In the embodiment, copper alloy is preferably used to make the lead frame, which can ensure good conductivity and heat dissipation. In addition, the lead frame in the embodiment can be in the form of a thin plate, which is easy to bend and process later, and can be easily shaped into a specified shape. Moreover, the lead frame is not limited to a single-layer structure, and in some embodiments, it can also be a composite layer structure composed of multiple layers of conductive materials.

[0049] In addition, in the embodiment, in order to improve the reflectivity of the light emitted by the LED chip, the surface of the lead part can also be coated with a reflective layer, which can be silver, aluminum, copper, gold, etc. The reflective layer can be coated by electroplating. It should be noted that the reflective layer coating process can be performed on the entire lead frame before the LED support is shaped, or only on the lead part where the die bonding area for placing the LED chip is located after the LED support is shaped. In order to further improve the reflectivity of the surface of the lead part, the lead part is preferably formed with a smooth surface.

[0050] It should be noted that please refer to Figure 2 As a preferred implementation, the lead part 13 in the embodiment extends from the body of the lead frame 10 to the hollow area and is formed in the space between the support parts 12. The positive lead part and the negative lead part of the lead part 13 are disconnected to form an insulating isolation area. The oppositely arranged support parts 12 each have an open end, and the open end is separated from the lead part 13. The open end refers to an end that is not connected to other components. Of course, in other embodiments, the support part can also not have an open end, that is, the support part extends from the body of the lead frame and is connected to the lead part. In this case, it is necessary to ensure that the lead part is separated from the support part in actual production.

[0051] Preferably, the lead part 13 and the support part 12 in the embodiment are located on the same plane, and further, the thickness of the lead part 13 is equal to that of the support part 12, so that the process in actual production is easier to implement and the controllability of the process is improved.

[0052] In order to ensure that the support part in the embodiment can be withdrawn from the LED light emitting device when the LED light emitting device is discharged, please refer to Figure 1 and Figure 3The LED support in the embodiment includes the lead part 13 of the lead frame 10 and the base body 20 formed on the support forming area 11 of the lead frame 10 by unsaturated polyester resin, the base body 20 has the bayonet 24 and the recess for packaging the LED chip, the bayonet 24 includes the first bayonet and the second bayonet, the first bayonet opens from the inside of the base body 20 to the first outer side 21 and the third outer side 23 at the same time, the second bayonet opens from the inside of the base body 20 to the second outer side 22 and the third outer side 23 at the same time, the first outer side 21 and the second outer side 22 are oppositely arranged, the first outer side 21 and the second outer side 22 are both adjacent to the third outer side 23, the bayonet 24 is formed by the support part 12 extending from the main body of the lead frame 10 in the support forming area 11, and the bayonet 24 is separated from the inside of the base body 20 and formed when the force in the direction perpendicular to the third outer side 23 is received by the third outer side 23.

[0053] In the embodiment, the LED support is injection molded on the support forming area of the lead frame by clamping the lead frame in the mold, the base body of the molded LED support has the recess as the packaging area of the LED chip, and the lead part of the lead frame at least partially exposes the bottom surface of the recess as the placement area of the LED chip. In practical application, the LED chip can be placed on the anode lead part, and then the LED chip is electrically connected to the anode lead part through the metal wire, and then the LED chip is connected to the cathode lead part through the metal wire. Of course, in practical application, if the LED chip is inverted, the metal wire for connecting the LED chip to the lead part is not needed. The recess opens to the top of the base body, so that the packaging material can be packaged in the recess from the opening.

[0054] Specifically, please refer to Figure 3 The bayonet 24 opening to the side surface is formed in the base body 20, and each bayonet 24 opens to two sides in the embodiment, and one side of the opening of each bayonet 24 is on a common side, for example, one opening of the two bayonets 24 is respectively on the oppositely arranged first outer side 21 and the second outer side 22, and the other opening of the two bayonets 24 is on the third outer side 23 adjacent to the first outer side 21 and the second outer side 22. It should be noted that the opening is only formed in a part of the side surface, not the whole side surface.

[0055] As an optional embodiment, the bayonet 24 also opens on the fourth outer side 25 of the base body 20, and the fourth outer side 25 is oppositely arranged with the third outer side 23, that is, each bayonet 24 opens to three sides in the embodiment. For example, Figure 4As shown, the openings of each of the sockets 24 in the embodiment are distributed on three adjacent sides, wherein the opening of each socket 24 on one of the sides extends through the entire side and opens on the other two opposite sides. For example, one of the openings of the two sockets 24 respectively extends through the first outer side 21 and the second outer side 22, and the other openings of the two sockets 24 are both located on the third outer side 23 adjacent to the first outer side 21 and the second outer side 22, and one of the openings is located on the fourth outer side 25 opposite to the third outer side 23, and the openings on the third outer side 23 and the fourth outer side 25 are only located on a part of the two sides, rather than extending through the entire two sides.

[0056] It should be noted that, referring again to Figure 1 In order to ensure that the support portion 12 on the lead frame 10 has the freedom to exit from the base body 20 after the LED support is formed, the width of the support portion 12 in the embodiment is greater than or equal to the width of the socket 24, that is, the support portion 12 extends out of the socket 24 in the width direction, and the width direction herein refers to the direction perpendicular to the direction in which the support portion 12 extends from the body of the lead frame 10 in the plane of the lead frame 10, so as to avoid that the support portion is completely formed inside the base body during the forming process, thereby fixing the base body from six degrees of freedom and having no freedom to exit.

[0057] The resin used in the embodiment is an unsaturated polyester resin. As a thermosetting resin, the unsaturated polyester resin has excellent reflectivity and degradation resistance to ultraviolet light and the like, so that the degradation of the reflector plate or the resin can be effectively inhibited and high reflectivity and light efficiency can be maintained in the case that the LED light emitting device emits light for a long time. In addition, the unsaturated polyester resin does not have a reactive functional group such as a hydroxyl group (-OH group) and does not form a chemical bond with a metal, so that it is difficult to generate resin burrs during the forming process, and even if resin burrs are generated, they can be easily peeled off. Furthermore, the melting point of the unsaturated polyester resin is about 50-90°C, so that when the unsaturated polyester is injection molded, the organic matter added to the resin can be inhibited from being carbonized, and the forming defects can be effectively inhibited. In addition, the flowability of the unsaturated polyester resin is higher than that of the thermoplastic resin, so that when the resin is injected, the resin can be injected at a lower injection pressure, and the possibility of deformation of the lead frame is reduced, and during the injection molding process, the lead frame does not need to be held, and the mold can be simplified.

[0058] In actual applications, a filler composed of long glass fibers and spherical silica can be further added to the unsaturated polyester resin to improve the strength of the resin.

[0059] Of course, titanium oxide can also be added to the unsaturated polyester to improve the reflectivity of the resin to light.

[0060] In the filler or titanium oxide or both, the following substances can also be added in appropriate combination: maleic anhydride, fumaric acid, styrene, filler, reinforcing agent, curing agent, release agent, pigment and other additives.

[0061] In a preferred embodiment, when the filler, titanium oxide and additives are added to the unsaturated polyester resin, the component ratio of the unsaturated polyester resin, glass fiber, silicon dioxide, titanium oxide and additives is A, B, C, D and E respectively, wherein 15% < A < 25%, 5% < B < 20%, 20% < C < 30%, 30% < D < 40%, 1% < E < 3%, A + B + C + D + E = 100%, using the material ratio in this embodiment, the cracking and discoloration of the unsaturated polyester resin can be effectively inhibited.

[0062] As shown in Figure 5 The embodiment also provides an LED light emitting device 100 made of the LED support, which includes the LED support and at least one LED chip 30 encapsulated in the base body 20 of the LED support.

[0063] The color of the light emitted by the LED light emitting device and presented to the user can be flexibly set according to actual needs and application scenarios. The color of the light emitted by the LED light emitting device and presented to the user can be flexibly controlled by, but not limited to, the following factors: the color of the light emitted by the LED chip itself, whether the LED light emitting device is provided with a light conversion layer, and the type of the light conversion layer when the LED light emitting device is provided with a light conversion layer.

[0064] In an example of the embodiment, the LED light emitting device can further include a lens glue layer or a diffusion glue layer arranged above the LED chip (or arranged above the light conversion glue layer when the light conversion glue layer is arranged above the LED chip); of course, in some examples, a transparent glue layer can also be arranged above the LED chip.

[0065] It should be understood that, in an example, the light conversion glue layer can be a fluorescent glue layer containing fluorescent powder, or a colloidal material containing quantum dot photoactive materials, or other light conversion glue or film that can realize light conversion, and can also include diffusion powder or silicon powder, etc. according to needs; the way of forming the light conversion glue layer, the lens glue layer or the diffusion glue layer on the LED chip in the embodiment includes, but is not limited to, dispensing, molding, spraying, pasting, etc.

[0066] For example, the light-emitting conversion glue layer can include a fluorescent powder glue layer, a fluorescent film, or a quantum dot (QD) film; the fluorescent powder glue layer and the fluorescent film can be made of inorganic fluorescent powder, which can be inorganic fluorescent powder doped with rare earth elements, and the inorganic fluorescent powder includes but is not limited to at least one of silicate, aluminate, phosphate, nitride, and fluoride fluorescent powder.

[0067] For another example, the quantum dot (QD) film can be made of quantum dot fluorescent powder, and the quantum dot fluorescent powder includes but is not limited to at least one of BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, GaAs, GaN, GaS, GaSe, InGaAs, MgSe, MgS, MgTe, PbS, PbSe, PbTe, Cd(SxSe1-x), BaTiO3, PbZrO3, CsPbCl3, CsPbBr3, and CsPbI3.

[0068] In the embodiment, the type of light emitted by the LED chip itself can be visible light visible to the naked eye, or ultraviolet light or infrared light invisible to the naked eye; when the type of light emitted by the LED chip itself is ultraviolet light or infrared light invisible to the naked eye, a light-emitting conversion layer can be arranged on the LED chip to convert the light invisible to the naked eye into light visible to the naked eye, so that the light emitted by the LED light-emitting device is light visible to the user. For example, when the light emitted by the LED chip itself is ultraviolet light, if the LED light-emitting device is required to present white light visible to the user, the light-emitting conversion layer can be made by mixing red, green, and blue fluorescent powders.

[0069] The support part on the lead frame provided in the embodiment fixes five degrees of freedom of the LED product, so that the support part is separated from the remaining one degree of freedom of the LED light-emitting device in the blanking process without the need to make the support part deform under stress to be separated from the LED light-emitting device, which can effectively avoid damage of the LED light-emitting device due to stress in the blanking process and improve the yield of the LED light-emitting device. Further, the LED light-emitting device in the embodiment is formed by unsaturated polyester resin, which can effectively inhibit burr generation during forming, has high deterioration resistance, has low requirements for forming temperature and pressure, and can effectively ensure product quality and production efficiency.

[0070] Embodiment two:

[0071] In order to facilitate comprehensive understanding of the present application, the manufacturing process of the LED light-emitting device provided in the present application is exemplarily described in the embodiment.

[0072] Please refer to Figure 6 , Figure 6The flow chart of the LED light emitting device manufacturing method provided in the embodiment, when manufacturing the LED light emitting device, the specific implementation steps include:

[0073] S601, preparing a lead frame; the prepared lead frame has at least one hollow support forming area, the support forming area has a support part and a lead part extending from the lead frame body, and the support part includes oppositely arranged first and second support parts.

[0074] In the embodiment, the lead frame is formed by selectively removing the material of the preset area of the conductive substrate through stamping or etching processing, and the lead frame formed has a support forming area, which is an area for injection molding in a mold to form the base body of the LED support. The support parts on the lead frame are oppositely arranged, so that the LED support formed thereon can be stably supported. It should be noted that in the preferred embodiment, the support part and the lead part extend from the lead frame body to the hollow area respectively, and after the lead part and the support part extend from the lead frame body, the ends of the lead part and the support part away from the lead frame body are both open ends and do not form a connection with other components. Of course, in other embodiments, the support part and the lead part can also extend from the lead frame body to the hollow area as a whole, that is, the lead part is connected to the lead frame body through the support part.

[0075] S602, forming a base body in the support forming area by unsaturated polyester resin; the base body has a groove for packaging an LED chip, and the support parts are respectively embedded in the base body from the intersection of the first outer side and the third outer side and the intersection of the second outer side and the third outer side of the formed base body; the first outer side and the second outer side are oppositely arranged and both are adjacent to the third outer side.

[0076] In this step, the base body is formed by injection molding of unsaturated polyester resin with fillers and / or titanium oxide in the support forming area. The fillers include glass fibers and silicon dioxide. The addition of fillers can improve the strength of the resin, and the addition of titanium oxide can improve the reflectivity of the resin to light. In addition, in the fillers or titanium oxide or both, the following substances can also be appropriately combined and added: maleic anhydride, fumaric acid, styrene, filler material, reinforcing agent, curing agent, release agent, pigment and other additives.

[0077] In a preferred embodiment, when the fillers, titanium oxide and additives are added into the unsaturated polyester resin, the component ratio of the unsaturated polyester resin, glass fiber, silicon dioxide, titanium oxide and additives is A, B, C, D and E respectively, wherein 15% < A < 25%, 5% < B < 20%, 20% < C < 30%, 30% < D < 40%, 1% < E < 3%, A + B + C + D + E = 100%, the material ratio in the embodiment can effectively inhibit the cracking and discoloration of the unsaturated polyester resin.

[0078] When the injection molding is completed, the mold is heated for a specified time to harden the resin, at this time, the support portions and the lead portions of the lead frame are embedded into the base body, wherein the support portions are embedded into the base body from the opposite two sides of the base body respectively, and the support portions also protrude out of the same side adjacent to the two sides, that is, the side of the support portion exposed can be flush with the side, or can extend beyond the plane of the side.

[0079] In the embodiment, after the base body is formed in the support forming area by the unsaturated polyester resin, the lead portions are separated from the lead frame body.

[0080] Specifically, in the embodiment in which the lead portions 13 and the support portions 12 extend from the lead frame body 10 to the hollowed area of the support forming area 11 respectively, after the lead portions 13 are formed in the base body 20, the lead portions 13 need to be separated from the lead frame body 10, so as to ensure that the LED product can be separated from the lead frame 10 in the later stage, and the lead portions 13 can be kept in the LED product after the separation. As Figure 7a shows a schematic view before the lead portions are punched and separated, and as Figure 7b shows a schematic view after the lead portions are punched and separated.

[0081] Further, in the embodiment, after the lead portions are separated from the lead frame body, the part of the lead portions protruding outward along the vertical direction of the third outer side is bent to be attached to the surface of the base body.

[0082] Specifically, in some embodiments, as Figure 8a shows, after the base body 20 is formed on the lead frame 10 by injection molding, one part of the lead portions 13 is formed inside the base body 20 as the internal lead portions 131 of the functional area of the LED chip (not shown in Figure 8a ), and the other part is the external lead portions 131 protruding outward perpendicularly from the side of the base body 20, the external lead portions 131 are used for electrical connection with the outside, for example, welded on the PCB, therefore, in order to facilitate the electrical connection with the outside, as Figure 8bAs shown, in this embodiment, a force is applied to the outer lead portion 131 separated from the main body of the lead frame 10 so as to adhere to the surface of the base body 20 .

[0083] S603, apply a force perpendicular to the third outer side surface on the third outer side surface of the base body after the LED chip is packaged, so that the support part is detached from the base body after the LED chip is packaged, and form a bayonet on the detached base body, the bayonet includes a first bayonet and a second bayonet, the first bayonet opens from the inside of the base body to the first outer side surface and the third outer side surface at the same time, and the second bayonet opens from the inside of the base body to the second outer side surface and the third outer side surface at the same time.

[0084] Preferably, the lead portion and the bayonet in this embodiment are located on the same plane, and further, the thickness of the lead portion is equal to the width of the bayonet, thereby making the process in actual production easier to implement and improving the controllability of the process.

[0085] like Figure 9a As shown in FIG, it is a schematic diagram of an LED light emitting device being fixed on a supporting portion, as shown in FIG. Figure 9b The figure shows the LED light-emitting device after removal. During the removal step, a force is applied to the third outer side surface 23 in a direction perpendicular to the third outer side surface 23, causing the LED light-emitting device to move in a direction extending from the third outer side surface 23 toward the opposite side thereof, until the support portion 12 is completely withdrawn from the opening of the third outer side surface 23 of the LED light-emitting device, thereby separating the LED light-emitting device from the lead frame 10 and completing the blanking. In this embodiment, the support portion 12 withdraws from a side surface of the base body 20. Therefore, during the resin molding process, the support portion 12 should be exposed outside the side surface to ensure that the side surface does not enclose the corresponding side of the support portion 12, thereby enabling the support portion 12 to withdraw from the side surface. Correspondingly, after the support portion 12 is detached from the base body 20, the space vacated by the support portion 12 on the base body 20 forms a bayonet 24. Since the support portion 12 is embedded from one side surface of the base body 20 and also leaks out from another adjacent side surface, each bayonet 24 formed is opened on two adjacent side surfaces. That is, after the bayonet 24 is formed behind the first outer side surface 21 and the second outer side surface 22, the bayonet 24 extends toward the third outer side surface 23 and opens through the third outer side surface 23, thereby forming a first bayonet 241 opening on the first outer side surface 21 and the third outer side surface 23, and a second bayonet 242 opening on the second outer side surface 22 and the third outer side surface 23. It should be noted that the openings here are only formed in a portion of the side surface, rather than penetrating the entire side surface.

[0086] It should be noted that in the preferred embodiment, the first and second clamping holes are also respectively opened on a fourth outer side surface of the base body, and the fourth outer side surface is arranged opposite to the third outer side surface. That is, the opening of each clamping hole is distributed on three adjacent side surfaces, and the opening of each clamping hole on one of the side surfaces penetrates through the entire side surface and extends to the openings on the other two opposite side surfaces. In this embodiment, the support part fixes the four degrees of freedom of the LED light emitting device, and in the removal step of the LED light emitting device, the removal direction of the LED light emitting device can be selected in two opposite directions.

[0087] The LED light emitting device manufacturing method provided by the embodiment of the present application forms the base body on the support forming area of the lead frame by unsaturated polyester resin, and fixes the five degrees of freedom of the LED light emitting device by the first support part and the second support part arranged opposite to each other on the lead frame. In the blanking process, the support part is separated from the remaining one degree of freedom of the LED light emitting device, and the clamping hole is formed at the corresponding position of the LED light emitting device without deforming the support part under stress to separate the support part from the LED light emitting device, which can effectively avoid damage to the LED light emitting device due to stress in the blanking process, and improve the yield of the LED light emitting device. Further, the LED light emitting device in the present application is formed by unsaturated polyester resin, which can effectively inhibit burr generation, has high deterioration resistance, has low requirements for forming temperature and pressure, and can effectively ensure product quality and production efficiency.

[0088] Embodiment three:

[0089] The embodiment provides a light emitting device, which comprises the LED light emitting device exemplified in the embodiment one or the embodiment two. The light emitting device in the embodiment can be a lighting device, a light signal indicating device, a light supplementing device, a backlight device, etc. When the light emitting device is a lighting device, it can be a lighting device applied in various fields, such as a table lamp, a fluorescent lamp, a ceiling lamp, a down lamp, a street lamp, a projection lamp, etc. in daily life, a high beam, a low beam, an atmosphere lamp, etc. in a car, a surgical lamp, a low electromagnetic lighting lamp, a lighting lamp of various medical instruments, etc. in a medical field, various colored lamps, landscape lighting lamps, advertising lamps, etc. in a decoration field; when the light emitting device is a light signal indicating device, it can be a signal indicating lamp in a traffic field, a signal state indicating lamp on a communication device in a communication field; when the light emitting device is a light supplementing device, it can be a light supplementing lamp in a photography field, such as a flash lamp, a light supplementing lamp, a plant light supplementing lamp for plants in an agricultural field, etc.; when the light emitting device is a backlight device, it can be a backlight module applied in various backlight fields, such as a display, a television, a mobile terminal, such as a mobile phone, an advertising machine, etc.

[0090] It should be understood that the above applications are only a few applications exemplified by the present embodiment, and it should be understood that the applications of the LED light emitting device are not limited to the above-mentioned several fields.

[0091] The above is a further detailed description of the embodiments of the present application in combination with specific embodiments, and the specific implementation of the present application should not be limited to these descriptions. For those skilled in the art to which the present application belongs, without departing from the concept of the present application, a number of simple deductions or substitutions can be made, which should be considered as falling within the scope of protection of the present application.

Claims

1. A method for manufacturing an LED light-emitting device, characterized in that: The following steps are involved: Prepare a lead frame; the prepared lead frame has at least one hollow bracket forming area, the bracket forming area has a support portion and a lead portion extending from the lead frame body, the support portion includes a first support portion and a second support portion arranged opposite to each other; forming a base body in the support molding area by using unsaturated polyester resin; The base body has a groove for encapsulating the LED chip, and the support portion is embedded in the base body at the intersection of the first outer side surface and the third outer side surface, and at the intersection of the second outer side surface and the third outer side surface of the molded base body; the first outer side surface and the second outer side surface are arranged opposite to each other, and the first outer side surface and the second outer side surface are both adjacent to the third outer side surface; one part of the lead portion is an internal lead portion located inside the base body, and the other part of the lead portion is an external lead portion that protrudes vertically outward from the fourth outer side surface of the base body to the lead frame body; separating the external lead portion from the lead frame body, wherein the separation surface of the external lead portion is parallel to the fourth outer side surface of the base body; Bending the external lead portion to a surface attached to the base body; Applying a force perpendicular to the third outer side of the base body after the LED chip is packaged, so that the support portion is detached from the base body after the LED chip is packaged, and forming a bayonet on the detached base body, the bayonet comprising a first bayonet and a second bayonet, the first bayonet opening from the interior of the base body simultaneously toward the first outer side and the third outer side, and the second bayonet opening from the interior of the base body simultaneously toward the second outer side and the third outer side; The external lead portion is composed of a wide portion and a narrow portion. The external lead portion is attached to the surface of the base body by bending the narrow portion downward. After bending, the separation surface of the external lead portion is away from the groove. The first bayonet and the second bayonet are also opened on a fourth outer side surface of the base body, respectively. The fourth outer side surface is arranged opposite to the third outer side surface.

2. The method for manufacturing an LED light emitting device according to claim 1, wherein: The lead portion and the bayonet are both located on the same plane.

3. The method for manufacturing an LED light emitting device according to claim 1, wherein: The thickness of the lead portion is equal to the width of the bayonet.

4. The method for manufacturing an LED light emitting device according to claim 1, wherein: The step of molding the base body in the bracket molding area by using unsaturated polyester resin comprises: The base body is formed in the support molding area by unsaturated polyester resin added with fillers and / or titanium oxide, wherein the fillers include glass fiber and silica.

5. The method for manufacturing an LED light emitting device according to claim 4, wherein: When the base body is formed in the bracket forming area by using an unsaturated polyester resin added with fillers and / or titanium oxide, a predetermined additive is further added to the unsaturated polyester resin; The composition ratios of the unsaturated polyester resin, glass fiber, silica, titanium oxide and preset additives are A, B, C, D and E, respectively, wherein 15% < A < 25%, 5% < B < 20%, 20% < C < 30%, 30% < D < 40%, 1% < E < 3%, and A + B + C + D + E = 100%.

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