Liquid crystal panel stopper and processing method thereof

Abstract

The present invention relates to a liquid crystal panel block and a processing method thereof. The block body is made of EPP, and has a plurality of mounting surfaces abutting against a packaging box and a plurality of buffer surfaces abutting against a liquid crystal panel, wherein a raised buffer surface is located inside the block body, and its surface is plasticized and formed; and a silicone pad, which is bonded to the raised buffer surface and abuts against the corner of the liquid crystal panel. Since the raised buffer surface of the block is plasticized and then bonded with the silicone pad, the hardness of the raised buffer surface of the block is firstly improved, so that the corner of the liquid crystal panel abutting against the raised buffer surface during transportation plays a supporting role, and the raised buffer surface is not easy to deform and break. By bonding the silicone pad, a buffer zone is formed between the liquid crystal panel and the plasticized surface. The silicone has adhesion, which can ensure the fixation with the liquid crystal panel and prevent it from falling off, thereby ensuring the safety of the liquid crystal panel transportation. At the same time, the setting of the silicone material effectively isolates the moisture infiltrated from the package, thereby ensuring the safety of the liquid crystal panel PCBA board.

Description

Technical Field

[0001] The present invention relates to the technical field of display box packaging, and more particularly to a liquid crystal panel stopper and a processing method thereof. Background Art

[0002] The liquid crystal panel is the material that determines the brightness, contrast, color, and viewing angle of the liquid crystal display. The price trend of the liquid crystal panel directly affects the price of the liquid crystal display. The quality and technology of the liquid crystal panel are related to the overall performance of the liquid crystal display. At present, the distance between the PCBA side of the liquid crystal panel and the edge of the glass is getting smaller and smaller. In the prior art, EPP supports are generally used to play a buffering role. However, there is a narrow plane on the support corresponding to the side of the liquid crystal panel. The narrow plane is easily deformed and broken during transportation, causing it to fall off the liquid crystal panel and fail to play a buffering role, which can easily cause damage to the liquid crystal panel. Therefore, how to provide an EPP block with reliable buffering performance is a problem that technicians in this field urgently need to solve. Summary of the invention

[0003] The present invention aims to solve one of the above-mentioned technical problems in the prior art at least to a certain extent.

[0004] To this end, one purpose of the present invention is to propose a liquid crystal panel block, which solves the technical problem in the prior art that the narrow plane of the block is easily deformed during transportation and broken, causing it to fall off the liquid crystal panel and fail to play a buffering role, which in turn easily causes damage to the liquid crystal panel.

[0005] The present invention provides a liquid crystal panel block, comprising:

[0006] The block body is made of EPP and has a plurality of mounting surfaces abutting against the packaging box and a plurality of buffer surfaces abutting against the liquid crystal panel, wherein the raised buffer surface is located inside the block body and its surface is plasticized;

[0007] and a silicone pad, which is bonded to the raised buffer surface and abuts against the corner of the liquid crystal panel.

[0008] It can be known from the above technical scheme that compared with the prior art, the present invention discloses a liquid crystal panel block. Since the raised buffer surface of the block is plasticized and then bonded with a silicone pad, the hardness of the raised buffer surface of the block is firstly improved, so that the corner of the liquid crystal panel abuts against the raised buffer surface during transportation, which plays a support role. The raised buffer surface is not easy to deform and break. By bonding the silicone pad, a buffer zone is formed between the liquid crystal panel and the plasticized surface. The silicone has adhesion and can ensure fixation with the liquid crystal panel to prevent it from falling off, thereby ensuring the safety of transportation of the liquid crystal panel. At the same time, the setting of the silicone material effectively isolates the moisture infiltrated from the packaging, thereby ensuring the safety of the liquid crystal panel PCBA board.

[0009] Preferably, the block body is made of antistatic EPP, and its foaming rate is greater than or equal to 13.5.

[0010] Preferably, the resistivity of the block body is 10 6 -10 11 Ω / m2.

[0011] Preferably, the plasticized thickness of the raised buffer surface 11 is 0.025-0.05 mm, ensuring that the raised buffer surface has a certain hardness and supports the liquid crystal panel like plastic.

[0012] Preferably, the thickness of the silicone pad is 0.8-1.2 mm, which plays a buffering role.

[0013] The present invention also provides a method for processing a liquid crystal panel stopper, comprising the following steps:

[0014] S1: Select EPP raw materials and put them into a pre-pressing tank for pre-pressing to fully expand the inside of the EPP particles;

[0015] S2: Set the pressure of mold steam, the steam pressure preheats the mold convex mold, then preheats the mold concave mold, and finally heats the concave mold and the convex mold at the same time;

[0016] S3: Inject EPP particles into the mold for injection molding, and close the concave mold and the convex mold preheated in S2;

[0017] S4: performing a first heating, a second heating, and double-side heating of the concave mold and the convex mold on the EPP particles in the mold closed in S3;

[0018] S5: sequentially water cooling and vacuum cooling the mold in S4;

[0019] S6: reheating the crusted side of the EPP particles in the mold (i.e., the raised buffer surface), and the heating temperature is 160-170°, and the heating time is 25-40s;

[0020] S7: performing secondary water cooling and vacuum cooling on the mold surface heated in S6;

[0021] S8: demoulding, taking out the stopper formed in the mold;

[0022] S9: Bond a silicone pad to the raised buffer surface of the stopper.

[0023] The block formed by the method of the present invention is fixed on the four corners of the package, corresponding to the four angles of the liquid crystal panel, and the raised buffer surface is mainly in contact with four reinforcing ribs or heat dissipation strips corresponding to the four corners of the liquid crystal panel, thereby solving the technical problem in the prior art that the narrow plane of the block is easily deformed and broken during transportation, causing it to fall off the liquid crystal panel and fail to play a buffering role, which in turn easily causes damage to the liquid crystal panel.

[0024] Preferably, the EPP particles in S1 are fully expanded by air heating pre-pressing, and the pre-pressing period is 8h-24h.

[0025] Preferably, in S2, the male mold is preheated for 15-25 seconds with a steam pressure of 4-5 kg; the female mold is preheated for 15-25 seconds with a steam pressure of 3-4 kg, and then the heating time is 10-15 seconds.

[0026] Preferably, in S4, the first heating time is 10-15 s, the second heating time is 15-20 s, and the double-sided heating time is 20-25 s.

[0027] Preferably, the water cooling time in S5 is 25 s, and the vacuum cooling time is 50 s; the secondary water cooling time in S7 is 50-60 s, and the vacuum cooling time is 100-120 s. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0029] Figure 1 The accompanying drawing is a schematic structural diagram of a liquid crystal panel block provided by the present invention. DETAILED DESCRIPTION

[0030] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0031] In the description of the present invention, it is necessary to understand that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0033] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0035] The embodiment of the present invention discloses a liquid crystal panel stopper, which solves the technical problem in the prior art that the narrow plane of the stopper is easily deformed and broken during transportation, causing it to fall off the liquid crystal panel and fail to play a buffering role, which in turn easily causes damage to the liquid crystal panel.

[0036] See attached Figure 1 The present invention provides a liquid crystal panel block, comprising:

[0037] The block body 1 is made of EPP and has a plurality of mounting surfaces abutting against the packaging box and a plurality of buffer surfaces abutting against the liquid crystal panel, wherein the raised buffer surface 11 is located inside the block body and its surface is plasticized;

[0038] And a silicone pad 2, the silicone pad 2 is bonded to the raised buffer surface 11 and abuts against the corner of the liquid crystal panel.

[0039] The present invention discloses a liquid crystal panel block. Since a raised buffer surface of the block is plasticized and then bonded with a silicone pad, the hardness of the raised buffer surface of the block is firstly improved, so that the corner of the liquid crystal panel abuts against the raised buffer surface during transportation, which plays a support role, and the raised buffer surface is not easy to deform and break. By bonding the silicone pad, a buffer zone is formed between the liquid crystal panel and the plasticized surface. The silicone has adhesion and can ensure fixation with the liquid crystal panel to prevent it from falling off, thereby ensuring the safety of transportation of the liquid crystal panel. At the same time, the setting of the silicone material effectively isolates moisture infiltrated from the package, thereby ensuring the safety of the liquid crystal panel PCBA board.

[0040] The block body 1 is made of antistatic EPP, and its foaming rate is greater than or equal to 13.5. The resistivity of the block body 1 is 10 6 -10 11 Ω / m2.

[0041] Advantageously, the plasticized thickness of the raised buffer surface 11 is 0.025-0.05 mm, and the thickness of the silicone pad 2 is 0.8-1.2 mm, so as to ensure that the pad body has a certain hardness and a certain buffering performance.

[0042] The present invention also provides a method for processing a liquid crystal panel stopper, comprising the following steps:

[0043] S1: Select EPP raw materials and put them into a pre-pressing tank for pre-pressing to fully expand the inside of the EPP particles;

[0044] S2: Set the pressure of mold steam, the steam pressure preheats the mold convex mold, then preheats the mold concave mold, and finally heats the concave mold and the convex mold at the same time;

[0045] S3: Inject EPP particles into the mold for injection molding, and close the concave mold and the convex mold preheated in S2;

[0046] S4: performing a first heating, a second heating, and double-side heating of the concave mold and the convex mold on the EPP particles in the mold closed in S3;

[0047] S5: sequentially water cooling and vacuum cooling the mold in S4;

[0048] S6: reheating the crusted side of the EPP particles in the mold (the raised buffer surface), and the heating temperature is 160-170°, and the heating time is 25-40s;

[0049] S7: performing secondary water cooling and vacuum cooling on the mold surface heated in S6;

[0050] S8: demoulding, taking out the stopper formed in the mold;

[0051] S9: Bond a silicone pad to the raised buffer surface of the stopper.

[0052] The block formed by the method of the present invention is fixed on the four corners of the package, corresponding to the four angles of the liquid crystal panel, and the raised buffer surface is mainly in contact with four reinforcing ribs or heat dissipation strips corresponding to the four corners of the liquid crystal panel, thereby solving the technical problem in the prior art that the narrow plane of the block is easily deformed and broken during transportation, causing it to fall off the liquid crystal panel and fail to play a buffering role, which in turn easily causes damage to the liquid crystal panel.

[0053] Among them, the EPP particles in S1 are fully expanded by air heating pre-pressing, and the pre-pressing cycle is 8h-24h.

[0054] In S2, the punch is preheated for 15-25s with a steam pressure of 4-5kg; the die is preheated for 15-25s with a steam pressure of 3-4kg, and then the heating time is 10-15s.

[0055] In S4, the first heating time is 10-15s, the second heating time is 15-20s, and the double-sided heating time is 20-25s.

[0056] The water cooling time in S5 is 25s, and the vacuum cooling time is 50s; the secondary water cooling time in S7 is 50-60s, and the vacuum cooling time is 100-120s.

[0057] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0058] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and deform the above embodiments within the scope of the present invention.

Claims

1. A method for processing a liquid crystal panel block, characterized in that: The liquid crystal panel block comprises: A block body (1), the block body (1) being made of EPP and having a plurality of mounting surfaces abutting against a packaging box and a plurality of buffer surfaces abutting against a liquid crystal panel, wherein the raised buffer surface (11) is located inside the block body (1), and its surface is plasticized and formed; and a silicone pad (2), wherein the silicone pad (2) is bonded to the raised buffer surface (11) and abuts against a corner of the liquid crystal panel; The processing method of the liquid crystal panel block comprises the following steps: S1: Select EPP raw materials and put them into a pre-pressing tank for pre-pressing to fully expand the inside of the EPP particles; S2: Set the pressure of mold steam, the steam pressure preheats the mold convex mold, then preheats the mold concave mold, and finally heats the concave mold and the convex mold at the same time; S3: Inject EPP particles into the mold for injection molding, and close the concave mold and the convex mold preheated in S2; S4: performing a first heating, a second heating, and double-side heating of the concave mold and the convex mold on the EPP particles in the mold closed in S3; S5: sequentially water cooling and vacuum cooling the mold in S4; S6: reheating the crusted side of the EPP particles in the mold at a temperature of 160-170° for 25-40 seconds; S7: performing secondary water cooling and vacuum cooling on the mold surface heated in S6; S8: demoulding, taking out the stopper formed in the mold; S9: bonding a silicone pad to the raised buffer surface of the stopper; In S2, the punch is preheated for 15-25s, the steam pressure is 4-5kg; the die is preheated for 15-25s, the steam pressure is 3-4kg, and then the heating time is 10-15s; In S4, the first heating time is 10-15s, the second heating time is 15-20s, and the double-sided heating time is 20-25s; The water cooling time in S5 is 25s, and the vacuum cooling time is 50s; the secondary water cooling time in S7 is 50-60s, and the vacuum cooling time is 100-120s.

2. A method for processing a liquid crystal panel block according to claim 1, characterized in that: The block body (1) is made of antistatic EPP, and its foaming rate is greater than or equal to 13.

5.

3. The method for processing a liquid crystal panel block according to claim 1, characterized in that: The resistivity of the block body (1) is 10 6 -10 11 Ω / m 2 .

4. The method for processing a liquid crystal panel block according to claim 1, characterized in that: The plasticized thickness of the raised buffer surface (11) is 0.025-0.05 mm.

5. The method for processing a liquid crystal panel block according to claim 1, characterized in that: The thickness of the silica gel pad (2) is 0.8-1.2 mm.

6. The method for processing a liquid crystal panel block according to claim 1, characterized in that: The EPP particles in S1 are fully expanded by air heating pre-pressing, and the pre-pressing cycle is 8h-24h.

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