Sealed chassis heat dissipation device and sealed chassis

Abstract

The present invention relates to the field of heat dissipation technology, and discloses a sealed chassis heat dissipation device and a sealed chassis for dissipating heat from heat-generating electronic components installed in the chassis, including: an internal heat transfer system, which is located in the sealed chassis and abuts against the heat-generating electronic components, and the heat generated by the heat-generating electronic components can be transferred to the internal heat transfer system; an external heat transfer system, including a blowing part and a heat dissipation cover plate, multiple heat dissipation cover plates are all made of a heat spreader, the blowing part is arranged on the inner side of the heat dissipation cover plate, and the external heat transfer system is used to transfer heat outside the sealed area to the outside air; multiple heat dissipation cover plates are connected to each other, multiple heat dissipation cover plates can transfer heat to each other, and multiple heat dissipation cover plates are used to transfer heat to the outside air. The sealed chassis heat dissipation device of the present invention has high heat dissipation efficiency, can effectively reduce the internal temperature of the sealed chassis, improves the performance of the sealed chassis and increases the selectivity of electronic components in the chassis.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and in particular to a sealed chassis heat dissipation device and a sealed chassis. Background Art

[0002] At present, most of the chassis of existing electronic equipment use fans for forced convection to dissipate heat. The cooling fan is installed in the chassis, and the outside air is blown to the heat-generating electronic components through forced convection to achieve heat exchange between the heat-generating electronic components and the outside air. Since this technology requires the cooling fan to rotate at high speed and the heat-generating electronic components are directly connected to the outside air, the chassis noise is relatively large, the chassis of the equipment is not sealed, and it cannot be dust-proof and moisture-proof, which seriously affects the performance and life of the electronic components in the chassis.

[0003] The heat dissipation of the chassis of existing sealed electronic equipment is mostly achieved by increasing the heat dissipation area and surface area of ​​the chassis, which increases the size of the chassis, making the chassis large in size, heavy in weight, and high in cost, resulting in unnecessary waste. In addition, the heat dissipation efficiency of the chassis of existing sealed electronic equipment is low, and the internal temperature of the chassis is high, which seriously restricts the improvement of the performance of the corresponding equipment and the selection of electronic components in the chassis. Summary of the invention

[0004] An object of the present invention is to provide a sealed chassis heat dissipation device, which has high heat dissipation efficiency and can effectively reduce the internal temperature of the chassis.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] A sealed chassis heat dissipation device, used for dissipating heat from heat-generating electronic components installed in the sealed chassis, comprising:

[0007] An internal heat transfer system is located in the sealed chassis and abuts against the heat-generating electronic components, and the heat generated by the heat-generating electronic components can be transferred to the internal heat transfer system;

[0008] The external heat transfer system comprises a blowing part and a plurality of heat dissipation cover plates, wherein the plurality of heat dissipation cover plates are all made of a heat spreader, the blowing part is arranged on the inner side of the heat dissipation cover plates, and the external heat transfer system is used to transfer the heat of the internal heat transfer system to the outside air;

[0009] The plurality of heat dissipation cover plates are connected to each other, heat can be transferred to each other, and the plurality of heat dissipation cover plates are used to transfer heat to the outside air.

[0010] Preferably, the internal heat transfer system comprises a heat conducting structure made of a vapor chamber and a heat sink, one side of the heat conducting structure abuts against the heat generating electronic component, and the other side of the heat conducting structure abuts against the heat sink.

[0011] Preferably, the blowing part comprises a fan and an air cavity, the air cavity is composed of the radiator, a heat dissipation cover plate and an air cavity baffle, the air cavity baffle is connected between the radiator and a heat dissipation cover plate, and the fan is located in the air cavity.

[0012] Preferably, the heat dissipation cover plate comprises a first heat dissipation cover plate, and the first heat dissipation cover plate is disposed on the wind cavity and connected to the wind cavity baffle.

[0013] Preferably, an air inlet and an air outlet are provided on the first heat dissipation cover plate, the air inlet and the air outlet are connected through the air cavity, and the air cavity baffle at the air outlet is inclined to facilitate the outflow of air in the air cavity.

[0014] Preferably, the heat dissipation cover plate further includes a second heat dissipation cover plate and a third heat dissipation cover plate, and the second heat dissipation cover plate and the third heat dissipation cover plate are connected to opposite ends of the first heat dissipation cover plate.

[0015] Preferably, heat dissipation fins are provided on both the outer surface and the inner surface of the first heat dissipation cover plate, and the heat dissipation fins on the inner surface of the first heat dissipation cover plate are all located in the wind cavity, so as to increase the heat dissipation area of ​​the first heat dissipation cover plate.

[0016] Preferably, the radiator is provided with cooling fins for transferring the heat of the radiator to the air cavity.

[0017] Preferably, the wind direction in the wind cavity is parallel to the extension direction of the air guide grooves on the heat dissipation fins on the inner surface of the first heat dissipation cover plate and the extension direction of the air guide grooves on the heat dissipation fins of the radiator.

[0018] Another object of the present invention is to provide a sealed chassis, which has high heat dissipation efficiency, small size, light weight, is dustproof and moisture-proof, and has strong adaptability to harsh environments.

[0019] To achieve this object, the present invention adopts the following technical solutions:

[0020] A sealed chassis comprises the sealed chassis heat dissipation device described in any one of the above schemes.

[0021] Beneficial effects of the present invention:

[0022] The present invention provides a sealed chassis heat dissipation device and a sealed chassis. The sealed chassis heat dissipation device is used to dissipate heat for heat-generating electronic components installed in the sealed chassis. By setting an internal heat transfer system and an external heat transfer system in the sealed chassis, the heat of the heat-generating electronic components in the sealed chassis is first transferred to the internal heat transfer system, then to the external heat transfer system, and finally to the outside air. The heat dissipation cover plate of the sealed chassis adopts a heat spreader, which improves the heat transfer speed, so that the internal temperature of the chassis is rapidly reduced. The setting of the heat dissipation cover plate increases the heat dissipation surface area of ​​the chassis, so that the surface temperature of the chassis is more uniform, and the heat dissipation capacity of the chassis with the same surface area is improved, thereby improving the heat dissipation capacity of the chassis and effectively reducing the volume of the chassis; at the same time, the sealed chassis heat dissipation device can quickly conduct the heat generated by the heat-generating electronic components to the surface of the chassis, thereby reducing the requirements for the performance of the electronic components, increasing the selectivity of the electronic components, ensuring the working reliability of the electronic components, and improving the functions and performance of the chassis with the same volume. In addition, the heat-generating electronic components of the sealed chassis are located inside the sealed chassis, which can effectively prevent sand, dust, flying catkins and salt spray, thereby improving the chassis' adaptability to harsh environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the exploded structure of the sealed chassis heat dissipation device provided in a specific embodiment of the present invention;

[0024] Figure 2 It is a front view of a sealed chassis heat dissipation device provided in a specific embodiment of the present invention;

[0025] Figure 3 is a top view of a sealed chassis heat dissipation device provided in a specific embodiment of the present invention;

[0026] Figure 4 is a cross-sectional view of a sealed chassis heat dissipation device provided in a specific embodiment of the present invention;

[0027] Figure 5 It is a heat dissipation principle diagram of a sealed chassis heat dissipation device provided in a specific embodiment of the present invention.

[0028] In the figure:

[0029] 1. Internal heat transfer system; 11. Heat conduction structure; 12. Radiator;

[0030] 2. External heat transfer system; 21. Blowing unit; 211. Fan; 212. Air cavity; 2121. Air cavity baffle; 22. Heat dissipation cover; 221. First heat dissipation cover; 2211. Air inlet; 2212. Air outlet; 222. Second heat dissipation cover; 223. Third heat dissipation cover;

[0031] 100. Heat-generating electronic components;

[0032] 200. Sealed chassis. DETAILED DESCRIPTION

[0033] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0034] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0036] This embodiment provides a sealed chassis 200, in which a sealed chassis heat dissipation device is provided. Figure 1 The sealed chassis heat dissipation device is used to dissipate heat from heat-generating electronic components 100 installed in a sealed chassis 200, and includes an internal heat transfer system 1 and an external heat transfer system 2 for heat exchange with the internal heat transfer system 1.

[0037] Specifically, the internal heat transfer system 1 is located inside the sealed chassis 200 and is in contact with the heat-generating electronic components 100. The heat generated by the heat-generating electronic components 100 can be transferred to the internal heat transfer system 1; the external heat transfer system 2 is adjacent to the internal heat transfer system 1, and the external heat transfer system 2 is used to transfer the heat of the internal heat transfer system 1 to the outside air.

[0038] In this embodiment, the sealed chassis heat dissipation device works together through the internal heat transfer system 1 and the external heat transfer system 2. The heat of the heat-generating electronic components 100 in the sealed chassis is first transferred to the internal heat transfer system 1, then transferred to the external heat transfer system 2, and finally transferred to the outside air. Specifically, the external heat transfer system 2 includes a blowing part 21 and a plurality of heat dissipation cover plates 22. The blowing part 21 is arranged between the internal heat transfer system 1 and the heat dissipation cover plates 22. The blowing part 21 can transfer the heat of the internal heat transfer system 1 to the outside of the chassis by blowing air. The heat of the internal heat transfer system 1 can also be transferred to the heat dissipation cover plates 22 in the form of thermal radiation, and then transferred to the outside of the chassis. The multiple interconnected heat dissipation cover plates 22 can transfer heat to each other, which not only improves the uniformity of the temperature of the heat dissipation cover plates 22, but also increases the heat dissipation area of ​​the chassis. The heat dissipation cover plates 22 are all made of a heat spreader, which is a plate body with a fine vacuum cavity structure on the inner wall. It has a high thermal convection coefficient and a high heat transfer efficiency, which is conducive to achieving rapid heat dissipation of the heat dissipation cover plates 22 .

[0039] The sealed chassis heat dissipation device improves the heat transfer speed and the heat dissipation capacity of the chassis surface, the heat dissipation surface area of ​​the chassis is increased, the surface temperature of the chassis is more uniform, the internal temperature of the chassis can be rapidly reduced, and the heat dissipation capacity of chassis with the same surface area is improved, thereby improving the heat dissipation capacity of the chassis, and can be adapted to chassis with higher heat generation, and can also make the same chassis volume smaller, effectively reducing the volume and weight of the chassis, reducing the chassis cost, and avoiding waste; the sealed chassis heat dissipation device can effectively reduce the internal operating temperature of the chassis, thereby reducing the requirements for the performance of electronic components, thereby increasing the selectivity of electronic components, and can be adapted to chassis with higher power, and make it work reliably, and improve the function and performance of chassis with the same volume.

[0040] In this embodiment, if Figure 1-Figure 5 As shown, the internal heat transfer system 1 includes a heat conducting structure 11 and a heat sink 12. Preferably, the heat conducting structure 11 and the heat sink 12 are both made of a heat spreader, which is a plate having a fine vacuum cavity structure on the inner wall, preferably made of copper, and has a high heat convection coefficient and a high heat transfer efficiency, and can achieve rapid heat transfer between the heat conducting structure 11 and the heat sink 12. Specifically, as Figure 1As shown, the heat-conducting structure 11 includes a heat-conducting structure cavity 111 and a heat-conducting structure plate 112, and the heat sink 12 includes a heat sink cavity 121 and a heat sink plate 122. Since the lower surface of the heat-conducting structure 11 abuts against the heat-generating electronic component 100, and the upper surface of the heat-conducting structure 11 abuts against the heat sink 12, the heat generated by the heat-generating electronic component 100 can be quickly transferred to the heat-conducting structure 11 first, and the heat-conducting structure 11 can also quickly transfer the heat to the heat sink 12, and the upper surface of the heat sink 12 further transfers the heat to the external heat transfer system 2. Preferably, the external heat transfer system 2 includes a blowing part 21 and a heat dissipation cover plate 22. Furthermore, the heat dissipation cover plate 22 is made of a heat spreader, which is a plate body with a fine vacuum cavity structure on the inner wall, preferably made of copper. The heat spreader has a high thermal convection coefficient and a high heat transfer efficiency, and can achieve rapid heat transfer of the heat dissipation cover plate 22. The blowing part 21 is arranged between the radiator 12 and the heat dissipation cover plate 22. The blowing part 21 of the external heat transfer system 2 transfers the heat of the radiator 12 to the outside air by blowing. The heat conduction structure 11 is arranged below the radiator 12. The blowing part 21 is arranged above the radiator 12, so that the heat-generating electronic components do not directly communicate with the outside air for heat exchange, and dust and water vapor in the outside air can be prevented from contacting the heat-generating electronic components, thereby improving the performance and life of the electronic components in the chassis.

[0041] The internal heat transfer system 1 and the heat dissipation cover plate 22 are both made of a heat spreader, which has a high thermal convection coefficient, high heat transfer efficiency, low expansion thermal resistance, uniform heat flux, fast heat transfer speed, and light weight. The heat generated by the heat-generating electronic components 100 can be quickly conducted to the surface of the chassis, thereby effectively reducing the internal temperature of the chassis and improving the working efficiency of the chassis temperature control system. Preferably, the chassis thickness of the sealed chassis 200 in this embodiment is not less than 7 mm, which is convenient for the built-in heat spreader.

[0042] In this embodiment, the blowing part 21 includes a fan 211 and an air cavity 212. The air cavity 212 is composed of a radiator 12, a heat dissipation cover plate 22 and an air cavity baffle 2121. The air cavity baffle 2121 is connected between the radiator 12 and a heat dissipation cover plate 22. The fan 211 is located in the air cavity 212 to provide power for the flow of air in the air cavity 212. The air cavity baffle 2121 is not only used to form the air cavity 212, but the baffle 2121 and the radiator 12 can also isolate the air cavity 212 from the sealed chassis to prevent dust in the air flow blowing through the air cavity 212 from entering the sealed chassis. Specifically, the air cavity baffle 2121 can be connected to the radiator 12 and a heat dissipation cover plate 22 by screws, welding, etc. Further, the air cavity 212 is formed between the upper surface of the radiator 12 and the lower surface of the heat dissipation cover plate 22. The heat dissipation cover plate 22 is not connected to the internal heat transfer system 1, which is convenient for disassembly, assembly, maintenance and replacement of the heat dissipation cover plate 22 and the internal heat generating electronic components 100. Preferably, the heat sink 12 is provided with heat dissipation fins on the surface of one side of the air cavity 212, and the heat dissipation fins are located in the air cavity 212. The heat dissipation fins can increase the heat dissipation area of ​​the heat sink 12, which is conducive to the heat sink 12 to quickly transfer heat to the surface of the heat sink 12, and at the same time strengthen the heat exchange between the heat sink 12 and the air flow in the air cavity 212. Preferably, the fan 211 is located at one end of the air cavity 212, which can increase the length of the ventilation duct in the air cavity 212, so that the flow path of the outside air in the air cavity 212 is longer, which is conducive to the outside air taking away more heat from the heat dissipation fins.

[0043] The effective heat dissipation surface of the sealed case 200 includes the upper cover, the left and right side covers, and the front and rear side covers. Since the front cover is generally designed with operation buttons, indicator lights and maintenance windows, etc., and the rear cover is generally designed with multiple plugs, therefore, refer to Figure 3 and Figure 4 In this embodiment, only the upper cover plate and the left and right side cover plates are replaced with heat spreaders, that is, the heat dissipation cover plate 22 includes a first heat dissipation cover plate 221, a second heat dissipation cover plate 222 and a third heat dissipation cover plate 223. Specifically, as Figure 1 As shown, the first heat dissipation cover plate 221 includes a first heat dissipation cover plate cavity and a first heat dissipation cover plate body, the second heat dissipation cover plate 222 includes a second heat dissipation cover plate cavity 2221 and a second heat dissipation cover plate body 2222, and the third heat dissipation cover plate 223 includes a third heat dissipation cover plate cavity 2231 and a third heat dissipation cover plate body 2232. The first heat dissipation cover plate 221 is covered on the air cavity 212, and the second heat dissipation cover plate 222 and the third heat dissipation cover plate 223 are respectively connected to the opposite sides of the first heat dissipation cover plate 221, so that the heat dissipation cover plate 22 is a U-shaped structure as a whole, which increases the effective heat dissipation area of ​​the chassis, makes the surface temperature of the chassis more uniform, and the temperature inside the chassis can be quickly reduced. Of course, in another embodiment, the upper cover plate, the lower cover plate, the left and right side cover plates, and the front and rear side cover plates of the chassis can also be replaced with heat spreaders.

[0044] Preferably, the first heat dissipation cover plate 221 is provided with heat dissipation fins on both the outer surface and the inner surface. The outer surface of the first heat dissipation cover plate 221 is outside the chassis, and the inner surface of the first heat dissipation cover plate 221 is inside the chassis. The heat dissipation fins on the inner surface of the first heat dissipation cover plate 221 are located in the wind cavity 212. The heat dissipation fins can increase the heat dissipation area of ​​the first heat dissipation cover plate 221, which is not only conducive to the heat transfer from the wind cavity 212 to the first heat dissipation cover plate 221, but also conducive to increasing the contact area between the first heat dissipation cover plate 221 and the outside air, thereby improving the heat conduction efficiency of the first heat dissipation cover plate 221. More preferably, a surface blowing system is provided on the outside of the chassis to force the outside air to form convection. The air convection flows through the air guide grooves of the heat dissipation fins on the outer surface of the first heat dissipation cover plate 221, taking away the heat of the heat dissipation fins, which is conducive to making the surface temperature of the chassis more uniform.

[0045] In this embodiment, the extension direction of the air guide grooves of the heat dissipation fins on the inner surface of the first heat dissipation cover plate 221 and the extension direction of the air guide grooves of the heat dissipation fins on the radiator 12 are parallel to the air flow direction in the air cavity 212, so that the air in the air cavity 212 can circulate smoothly, which is conducive to the air flow entering the air cavity 212 to take away the heat on the heat dissipation fins of the radiator 12 along the air guide grooves of the heat dissipation fins on the inner surface of the first heat dissipation cover plate 221 and the air guide grooves of the heat dissipation fins on the radiator 12, and smoothly discharge it into the outside air. Preferably, the fan 211 includes four silent ultra-thin axial fans, so that the flow direction of the air inside the air cavity 212 is parallel to the extension direction of the air guide grooves of the heat dissipation fins on the inner surface of the first heat dissipation cover plate 221, so as to achieve the best auxiliary heat dissipation effect, improve the working efficiency of the temperature control system, reduce the chassis noise, and improve the human-machine environment. Under the action of the fan 211, the outside air is forced to be sucked into the air cavity 212, flows through the air guide grooves of the heat sink fins in the air cavity 212, takes away the heat on the heat sink fins, makes the surface temperature of the chassis more uniform, and quickly reduces the temperature inside the chassis.

[0046] Preferably, refer to Figure 5The first heat dissipation cover plate 221 is provided with an air inlet 2211 and an air outlet 2212, and the air inlet 2211 and the air outlet 2212 are connected through the air cavity 212. Preferably, the air inlet 2211 is provided at one end of the first heat dissipation cover plate 221, and is arranged directly opposite to the fan 211, which is conducive to the fan 211 being able to suck more external air into the air cavity 212, and the air flow brings the heat on the heat dissipation fins in the air cavity 212 out to the external air through the air outlet 2212, thereby achieving the heat dissipation of the sealed chassis heat dissipation device. Preferably, the air cavity baffle 2121 at the air outlet 2212 is arranged obliquely, so that the air in the air cavity 212 can be smoothly squeezed out by the air flow blown by the fan 211 along the slope of the air cavity baffle 2121, so that the air in the air cavity 212 can flow out smoothly, thereby improving the fluidity of the air in the air cavity 212. In this embodiment, the air cavity 212 of the external heat transfer system 2 is independent of the inside of the sealed chassis, which can effectively prevent impurities such as sand and dust from entering the inside of the chassis, and does not affect the sealing and electromagnetic shielding effect of the chassis. The air cavity 212 adopts an embedded structure and an invisible air duct design, which can reduce the difficulty of processing, effectively prevent sand and dust, salt mist and flying catkins from entering the air cavity 212, and avoid blockage of the air cavity 212, so that the air in the air cavity 212 can circulate smoothly.

[0047] In this embodiment, most of the heat of the radiator 12 is taken away by the outside air entering the air cavity 212; a small part of the heat is transferred to the first heat dissipation cover plate 221 by radiation and convection, and the heat of the first heat dissipation cover plate 221 is quickly transferred to the outer surface of the first heat dissipation cover plate 221, the second heat dissipation cover plate 222 and the third heat dissipation cover plate 223. The heat transferred to the outer surface of the first heat dissipation cover plate 221 is transferred to the outside air by radiation and natural convection through the heat dissipation fins on the outer surface of the first heat dissipation cover plate 221; the heat transferred to the second heat dissipation cover plate 222 and the third heat dissipation cover plate 223 is transferred to the outside air by radiation and natural convection. Preferably, heat dissipation fins are provided on the outer surfaces of the second heat dissipation cover plate 222 and the third heat dissipation cover plate 223, which can increase the contact area between the second heat dissipation cover plate 222 and the third heat dissipation cover plate 223 and the outside air, thereby accelerating the heat dissipation speed.

[0048] The sealed chassis 200 provided in this embodiment can not only prevent dust, flying catkins and salt spray, making the chassis dustproof and moisture-proof, but also extend the service life of electronic components in the chassis and improve the chassis' adaptability to harsh environments such as high temperature, low temperature and dust.

[0049] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A sealed chassis heat dissipation device for dissipating heat from a heat-generating electronic component (100) installed in a sealed chassis, characterized in that: include: An internal heat transfer system (1) is located in the sealed chassis and is in contact with the heat-generating electronic component (100), and the heat generated by the heat-generating electronic component (100) can be transferred to the internal heat transfer system (1); The external heat transfer system (2) comprises a blowing part (21) and a plurality of heat dissipation cover plates (22), wherein the plurality of heat dissipation cover plates (22) are all made of a heat spreader, the blowing part (21) is arranged between the internal heat transfer system (1) and the heat dissipation cover plates (22), and the external heat transfer system (2) is used to transfer the heat of the internal heat transfer system (1) to the outside air; The plurality of heat dissipation cover plates (22) are connected to each other, the plurality of heat dissipation cover plates (22) can transfer heat to each other, and the plurality of heat dissipation cover plates (22) are used to transfer heat to the outside air; The internal heat transfer system (1) comprises a heat conducting structure (11) made of a heat spreader and a heat sink (12); one side of the heat conducting structure (11) abuts against the heat generating electronic component (100), and the other side abuts against the heat sink (12); The blowing portion (21) comprises a fan (211) and an air cavity (212); the fan (211) is located in the air cavity (212); the air cavity (212) is composed of the radiator (12), a heat dissipation cover plate (22) and an air cavity baffle plate (2121); the air cavity baffle plate (2121) is connected between the radiator (12) and a heat dissipation cover plate (22) and is used to isolate the air cavity (212) from the sealed chassis; The heat-conducting structure (11) comprises a heat-conducting structure cavity (111) and a heat-conducting structure plate body (112), and the heat sink (12) comprises a heat sink cavity body (121) and a heat sink plate body (122).

2. The sealed chassis heat dissipation device according to claim 1, characterized in that: The heat dissipation cover plate (22) comprises a first heat dissipation cover plate (221), wherein the first heat dissipation cover plate (221) is disposed on the wind cavity (212) and is connected to the wind cavity baffle plate (2121).

3. The sealed chassis heat dissipation device according to claim 2, characterized in that: An air inlet hole (2211) and an air outlet hole (2212) are provided on the first heat dissipation cover plate (221); the air inlet hole (2211) and the air outlet hole (2212) are connected via the air cavity (212); the air cavity baffle (2121) at the air outlet hole (2212) is arranged at an angle to facilitate the outflow of air in the air cavity (212).

4. The sealed chassis heat dissipation device according to claim 2, characterized in that: The heat dissipation cover plate (22) further comprises a second heat dissipation cover plate (222) and a third heat dissipation cover plate (223), wherein the second heat dissipation cover plate (222) and the third heat dissipation cover plate (223) are connected to opposite ends of the first heat dissipation cover plate (221).

5. The sealed chassis heat dissipation device according to claim 2, characterized in that: The outer surface and the inner surface of the first heat dissipation cover plate (221) are both provided with heat dissipation fins, and the heat dissipation fins on the inner surface of the first heat dissipation cover plate (221) are all located in the wind cavity (212) to increase the heat dissipation area of ​​the first heat dissipation cover plate (221).

6. The sealed chassis heat dissipation device according to claim 5, characterized in that: The radiator (12) is provided with cooling fins for transferring the heat of the radiator (12) to the air cavity (212).

7. The sealed chassis heat dissipation device according to claim 6, characterized in that: The wind direction in the wind cavity (212) is parallel to the extension direction of the wind guide grooves on the heat dissipation fins on the inner surface of the first heat dissipation cover plate (221) and the extension direction of the wind guide grooves on the heat dissipation fins of the radiator (12).

8. A sealed chassis, characterized in that: It comprises a sealed box body and a sealed chassis heat dissipation device as described in any one of claims 1-7.

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