Atomization component and electronic atomization device
By setting a heat conductor in the electronic atomization device to conduct heat evenly, the problem of uneven smoke concentration on the atomized surface is solved, the uniformity of smoke concentration and particle size is achieved, and the user's suction experience is improved.
Patent Information
- Application Number
- CN201910665778.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-07-23
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2039-07-23
AI Technical Summary
In the electronic atomization device, the oil near the heating component on the atomization surface will atomize to obtain smoke with a higher concentration, while the oil away from the heating component will atomize to obtain smoke with a lower concentration, resulting in uneven smoke concentration and affecting the user's Sucking taste.
Atomization component is designed, wherein the heating element is directly or indirectly arranged on the atomization surface, and its projected area is smaller than the atomization surface, and is divided into a heating area and a blank area, and the heat conductor is at least partially arranged in the blank area and connected to the heating element, The heat in the heating zone is transmitted to the blank area through the thermal conductor, so that the temperature of the entire atomization surface is uniform.
Through the heat conduction of the thermal conductor, the temperatures of the entire atomization surface are ensured to be equal, the uniformity of smoke concentration and particle size is achieved, and the user's suction taste is enhanced.
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Figure CN110447959B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electronic atomization, and in particular to an atomization component and an electronic atomization device comprising the atomization component. Background Art
[0002] Electronic atomization devices have a similar appearance and taste to ordinary cigarettes, but usually do not contain tar, suspended particles and other harmful components in cigarettes. Therefore, electronic atomization devices are widely used as substitutes for cigarettes. Generally, the atomization component of the electronic atomization device usually includes a substrate and a heating component. The heating component is attached to the atomization surface of the substrate or hidden in the substrate near the atomization surface. However, the oil on the atomization surface close to the heating component can be fully atomized to obtain a higher concentration of smoke, while the oil on the atomization surface far from the heating component is atomized to obtain a lower concentration of smoke, resulting in uneven smoke concentration and affecting the user's smoking taste. Summary of the invention
[0003] A technical problem solved by the present invention is how to enable the atomization component to atomize liquid into smoke with uniform concentration.
[0004] An atomizing assembly, comprising:
[0005] A substrate including an atomizing surface for atomizing a liquid to form a mist;
[0006] A heating element, used to be connected to a power source to heat the atomizing surface, the heating element is directly or indirectly disposed on the atomizing surface, and the projection area of the heating element on the atomizing surface is smaller than the area of the atomizing surface, thereby dividing the atomizing surface into a heating area occupied by the projection of the heating element and a blank area surrounding the heating area; and
[0007] The heat conductor is at least partially arranged in the blank area of the atomizing surface and connected to the heating element.
[0008] In one embodiment, both the heating element and the heat conductor are directly attached to the atomizing surface.
[0009] In one of the embodiments, the heat conductor includes a plurality of discretely arranged heat conducting units, one end of each of the heat conducting units is connected to the heating element, and the other ends of each of the heat conducting units are free ends and located in a blank area of the atomizing surface.
[0010] In one embodiment, the heat conducting unit is in a straight line, a folded line or an arc shape.
[0011] In one embodiment, the heating body is an integrally formed open-loop structure, and the heating body includes a plurality of first heating units and a second heating unit, wherein the plurality of first heating units extend along a first direction and are spaced apart from each other, and the plurality of second heating units extend along a second direction at a set angle to the first direction and are spaced apart from each other, and the two ends of the first heating unit are respectively connected to the ends of two adjacent second heating units.
[0012] In one embodiment, the width of the second heating unit located at the end of the heating element is the largest, and the first direction and the second direction are perpendicular to each other.
[0013] In one embodiment, the heat conductor includes a plurality of discretely arranged heat conducting units, and at least some of the heat conducting units are connected to the intersection of the first heat generating unit and the second heat generating unit.
[0014] In one of the embodiments, the heat conductor is attached to the heating area and the blank area of the atomized surface, the heating element is attached to the surface of the heat conductor or embedded in the inside of the heat conductor; the projection area of the heat conductor on the atomized surface is less than or equal to the area of the atomized surface.
[0015] In one embodiment, the distance from the heating element to the atomizing surface is equal everywhere.
[0016] In one embodiment, the heating element is a metal heating film; the heat conductor is a porous ceramic film, porous carbon or porous metal film.
[0017] In one of the embodiments, the porosity of the heat conductor is 30% to 70%; the thickness of the heat conductor is 20 μm to 150 μm.
[0018] In one of the embodiments, the thermal conductivity of the heat conductor is 30 w / mk to 400 w / mk.
[0019] An electronic atomization device comprises the atomization assembly described in any one of the above items.
[0020] In one embodiment, the electronic atomization device is provided with a liquid storage cavity for storing liquid, and the base body further includes a liquid absorption surface, which transfers the liquid absorbed from the liquid storage cavity to the atomization surface through the interior of the base body.
[0021] A technical effect of an embodiment of the present invention is that at the moment the heating element starts to work, the temperature of the heating area is higher than the temperature of the blank area. The heating element is connected to the heating element by a heat conductor, and at least part of the heat conductor is arranged in the blank area. The heat conductor can transfer more heat from the heating area to the blank area to make up for the lack of heat in the blank area, so that the temperature of the blank area is raised to the same level as the temperature of the heating area, ensuring that the temperature of the entire atomization surface is equal to achieve thermal balance, that is, the heat distribution on the atomization surface is uniform, and then the concentration of the smoke formed after the liquid is atomized at various places on the atomization surface is equal. At the same time, the particle size of the smoke formed after the liquid is atomized at various places on the atomization surface is equal, and finally the user's smoking taste is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 A schematic top view of the structure of a first exemplary atomization assembly provided in the first embodiment;
[0023] Figure 2 for Figure 1 AA cross-sectional structural diagram;
[0024] Figure 3 A schematic top view of the structure of a second exemplary atomization assembly provided in the first embodiment;
[0025] Figure 4 for Figure 3 BB cross-sectional structure diagram;
[0026] Figure 5 A schematic top view of the structure of a first exemplary atomization assembly provided for the second embodiment;
[0027] Figure 6 for Figure 5 A schematic cross-sectional structure diagram of ;
[0028] Figure 7 A schematic cross-sectional structural diagram of a second exemplary atomization assembly provided for the second embodiment;
[0029] Figure 8 A schematic cross-sectional view of a third exemplary atomizing assembly provided for the second embodiment;
[0030] Fig. 9 A schematic structural diagram of a heat conductor of an atomization assembly provided in one embodiment. DETAILED DESCRIPTION
[0031] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.
[0032] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "inside", "outside", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.
[0033] See also Figure 1 An embodiment of the present invention provides an atomization assembly 10, which is used to atomize a liquid represented by an aerosol-generating matrix to form smoke for a user to inhale. The atomization assembly 10 includes a base 100, a heating element 200 and a heat conductor 300.
[0034] See also Figures 1 to 4 The substrate 100 can be made of porous ceramic material. The substrate 100 contains a large number of micropores and has a certain porosity. The porosity can be defined as the percentage of the volume of the pores in the object to the total volume of the material in the natural state. For example, the porosity of the substrate 100 can be 30% to 60%, and the cross-sectional size of the micropores can be 20μm to 70μm. Since the substrate 100 has a certain porosity, the substrate 100 can form a capillary effect. The substrate 100 has a liquid absorption surface 120 and an atomization surface 110. The liquid absorption surface 120 and the atomization surface 110 can be arranged in parallel. When the liquid absorption surface 120 of the substrate 100 contacts the liquid, the liquid will be adsorbed on the liquid absorption surface 120. At the same time, the liquid on the liquid absorption surface 120 will be continuously transferred to the atomization surface 110 through the inside of the substrate 100 under the capillary action. The heating element 200 is used to connect to a power source to generate heat so as to atomize the liquid on the atomization surface 110 to form smoke. When the porosity increases, the liquid transfer speed of the substrate 100 to the liquid can be increased, so that the liquid on the liquid absorption surface 120 can be transferred to the atomization surface 110 in a shorter time; when the porosity decreases, the substrate 100 can have a stronger liquid locking function for the liquid that penetrates therein, preventing the liquid in the substrate 100 from leaking from the surface of the substrate 100. Therefore, in order to balance the liquid transfer speed and liquid locking function of the substrate 100, a suitable specific value should be selected within the above porosity value range. The extension direction of the micropores can be perpendicular to the liquid absorption surface 120 and the atomization surface 110, so that the liquid can reach the atomization surface 110 from the liquid absorption surface 120 via the shortest distance, thereby increasing the liquid conduction speed of the substrate 100 to the liquid.
[0035] The heating element 200 may be a metal heating film, and the projection area of the heating element 200 on the atomizing surface 110 is smaller than the area of the atomizing surface 110, that is, the projection of the heating element 200 on the atomizing surface 110 does not cover the entire atomizing surface 110. On the one hand, it can ensure that smoke overflows from other parts of the atomizing surface 110 that are not blocked by the heating element 200. On the other hand, the atomizing surface 110 can be divided into a heating area 111 and a blank area 112 by using the heating element 200 as a reference, that is, the area of the atomizing surface 110 occupied by the projection of the heating element 200 is the heating area 111, and the area surrounding the heating area 111 is the blank area 112. Therefore, when the heating element 200 starts to work, the temperature of the heating area 111 is significantly higher than the temperature of the blank area 112.
[0036] For the traditional atomizer assembly 10, the thermal conductivity of the base 100 is poor, so the heat distribution in the heating area 111 is relatively large, so relatively more liquid is atomized in the same time, and the concentration of the smoke formed by atomization is relatively high; at the same time, there is enough heat to destroy the interaction between the liquid molecules, so that the particle size of the smoke formed by atomization is smaller. On the contrary, since the heat distribution in the blank area 112 is small, the concentration of the smoke formed after atomization is low and the particle size is high. Therefore, since the smoke concentration and particle size at various locations on the atomization surface 110 are inconsistent, the user's smoking taste is ultimately affected.
[0037] However, in the present embodiment, the heat conductor 300 is connected to the heating element 200 and is at least partially located in the blank area 112 of the atomizing surface 110, so that the heat conductor 300 can conduct the heat of the heating area 111 to the blank area 112. The heat conductor 300 can be a membrane structure such as a porous ceramic film, a porous carbon or a porous metal film, and the thickness of the heat conductor 300 is 20μm to 150μm. For example, the thickness of the heat conductor 300 can be 20μm, 40μm, 50μm or 150μm. The thermal conductivity of the heat conductor 300 is 30w / mk to 400w / mk. According to the actual needs, the value of the thermal conductivity can be 30w / mk, 50w / mk, 100w / mk or 400w / mk. The heat conductor 300 has a high thermal conductivity and good thermal conductivity. Since the heat conductor 300 can transfer more heat from the heating area 111 to the blank area 112 to make up for the lack of heat in the blank area 112, the temperature of the blank area 112 is increased to be equal to the temperature of the heating area 111, ensuring that the temperature of the entire atomization surface 110 is equal to achieve thermal balance, that is, the heat distribution on the atomization surface 110 is uniform, so that the concentration of the smoke formed by the atomization of the liquid at various locations on the atomization surface 110 is equal. At the same time, the particle size of the smoke formed by the atomization of the liquid at various locations on the atomization surface 110 is equal, and finally the user's smoking taste is guaranteed. Furthermore, the heat conductor 300 also has a porous structure and a certain porosity. The porosity of the heat conductor 300 is 30% to 70%. For example, the porosity can be 30%, 40% or 70%. Since the heat conductor 300 has porosity, the heat conductor 300 and the substrate 100 will also produce capillary action. Through the common capillary action of the two, the liquid on the liquid absorption surface 120 can be transferred to the atomization surface 110 at a faster speed, thereby improving the liquid conduction capacity of the entire atomization component 10, ensuring that there is always sufficient liquid on the atomization surface 110 for atomization, and avoiding dry burning caused by insufficient liquid on the atomization surface 110.
[0038] See also Figure 1 and Figure 3In some embodiments, the heating element 200 is an integrally formed open-loop structure, and the heating element 200 includes a plurality of first heating units 210 and a second heating unit 220, both of which are straight strips, and the plurality of first heating units 210 extend along the first direction and are arranged at intervals from each other, for example, three first heating units 210 are arranged to extend in the transverse direction. The plurality of second heating units 220 extend along the second direction and are arranged at intervals from each other, for example, four second heating units 220 are arranged to extend in the longitudinal direction, that is, the first direction and the second direction are arranged vertically at an angle of ninety degrees. At this time, the first heating unit 210 and the second heating unit 220 are connected end to end in sequence to form a folded-line heating element 200, which can simplify the manufacturing process of the heating element 200 and reduce its manufacturing cost. In this embodiment, two of the four second heating units 220 are located on both sides and aligned at both ends, and the length and width of the other two are relatively small and are arranged between the two; the other two are connected through a first heating unit 210 and one end is aligned with two of the second heating units 220.
[0039] Both ends of the heating element 200 are formed by the second heating units 220, and both ends of the first heating unit 210 are respectively connected to the ends of two adjacent second heating units 220, so that the first heating unit 210 is located between two adjacent second heating units 220. Since the first heating units 210 and the second heating units 220 in the middle of the heating element 200 are densely distributed, and the first heating units 210 and the second heating units 220 in the ends of the heating element 200 are sparsely distributed, the middle of the heating element 200 generates more heat and has a higher temperature. In order to ensure that the temperature at the ends of the heating element 200 is consistent with the temperature in the middle, the width L of the second heating unit 220 located at the ends of the heating element 200 can be maximized (see Figure 3 ), so that the second heating unit 220 with a larger width L can also generate more heat to compensate for the insufficient heat at the end of the heating element 200 due to the sparse distribution of the heating units, and finally make the temperature of the entire heating element 200 roughly equal.
[0040] In other embodiments, the heating element 200 may be an open-loop structure such as a spiral, a Z-shape, or a plurality of parallel long strips. Of course, the heating element 200 may also be a closed-loop structure such as a circular ring, or a combination of an open-loop structure and a closed-loop structure. The heating element 200 may also be a non-integrated connection structure consisting of a plurality of discrete heating units.
[0041] See also Figures 1 to 4In some embodiments, the bottom surface of the heating element 200 can be directly attached to the atomized surface 110 of the substrate 100 by printing, and the bottom surface of the heat conductor 300 can also be directly attached to the atomized surface 110 of the substrate 100 by printing. The thickness of the heating element 200 and the thickness of the heat conductor 300 can be exactly equal, so that the upper surface of the heating element 200 and the upper surface of the heat conductor 300 are flush with each other. At this time, the heat conductor 300 includes a plurality of discretely arranged heat conducting units 310, and each heat conducting unit 310 can be arranged in a matrix on the atomized surface 110. One end (fixed end) of the heat conducting unit 310 is connected to the heating element 200, and the other end of the heat conducting unit 310 is a free end, which is located in the blank area 112 of the atomizing surface 110. When the heating element 200 is working, the heat of the heating area 111 can be transferred to the blank area 112 through the conduction of the heat conducting body 300 until the temperatures of the two areas are equal and the heat is evenly distributed, ensuring that the smoke concentration and particle size are uniform everywhere on the atomizing surface 110, thereby improving the taste of the user's inhalation. At the same time, by directly attaching the heat conducting body 300 and the heating element 200 to the atomizing surface 110, the size of the entire atomizing assembly 10 in the thickness direction can be reduced, making the overall structure of the atomizing assembly 10 more compact. At the same time, the heating element 200 is directly connected to the atomizing surface 110, and the heat can be quickly transferred to the atomizing surface 110 in a short time, thereby improving the heat transfer efficiency and the reaction sensitivity to heating of the atomizing assembly 10.
[0042] Each heat transfer unit 310 may be in a straight line (see Figure 3 ), or in the form of a broken line (see Figure 1 ), or in the form of a sine curve or a circular arc (see Fig. 9 ) etc. In the embodiment where the heating element 200 is an integrally formed open-loop structure, since the intersection 201 of the first heating unit 210 and the second heating unit 220 generates more heat, the atomizing surface 110 gathers more heat at this position and the temperature is higher. By connecting at least part of the heat-conducting unit 310 with the intersection 201 of the first heating unit 210 and the second heating unit 220, the heat of the heating area 111 is quickly transferred to the blank area 112. Of course, the fixed end of the other part of the heat-conducting element 300 can be connected to the first heating unit 210 or the second heating unit 220 separately.
[0043] See also Figures 5 to 8 In some embodiments, the heat conductor 300 is directly attached to the atomized surface 110, and the heating element 200 is directly attached to the heat conductor 300, that is, the heating element 200 does not form a directly attached connection relationship with the atomized surface 110. For example, see Figure 6, the heat conductor 300 is directly attached to the atomized surface 110, and the heating element 200 is attached to the surface of the heat conductor 300 away from the atomized surface 110, that is, the heating element 200, the heat conductor 300 and the substrate 100 form a stacked relationship from top to bottom. At this time, the heat conductor 300 can be an integrally formed layered structure, and the projection area of the heat conductor 300 on the atomized surface 110 is less than or equal to the area of the atomized surface 110. The heating element 200 is located within the coverage range of the heat conductor 300, so that the heat conductor 300 forms a good bearing effect on the heating element 200, ensuring the stable and reliable installation of the heating element 200, and also facilitating the heat generated by the heating element 200 to be transferred downward through the heat conductor 300 and evenly distributed on the atomized surface 110. For another example, refer to Figure 7 The heat conductor 300 is also directly attached to the atomizing surface 110, and the heating element 200 is completely embedded in the heat conductor 300. Since the heat conductor 300 covers the heating element 200, the heat conductor 300 can provide good protection for the heating element 200, thereby preventing the heating element 200 from contacting with oxygen and generating an oxidation reaction. Figure 8 There are two heat conductors 300, one of which is directly attached to the atomizing surface 110, the heating element 200 is directly attached to the heat conductor 300, and the other heat conductor 300 is attached to the surface of the heating element 200. Obviously, the heating element 200 is sandwiched between the two heat conductors 300. At this time, the heating element 200 and the two heat conductors 300 form a mutually stacked relationship and have equal areas, so that the side of the heating element 200 is just flush with the side of the heat conductor 300, and the heat conductor 300 cannot form a covering effect on the heating element 200. Similarly, the uppermost heat conductor 300 can also form a protective effect on the heating element 200.
[0044] See also Figures 6 to 8 , the distance from the heating element 200 to the atomizing surface 110 is equal everywhere. In layman's terms, the plane where the heating element 200 is located is exactly parallel to the atomizing surface 110, which facilitates the processing and installation of the heating element 200 and the heat conductor 300, and also enables the heat on the heating element 200 to be transmitted to the atomizing surface 110 at the same speed. The thickness of the heat conductor 300 is 20μm to 150μm, for example, the thickness of the heat conductor 300 can be 20μm, 40μm, 50μm or 150μm, etc. When the heating element 200 is attached to a heat conductor 300 or the heating element 200 is sandwiched between two heat conductors 300, the thickness of the heat conductor 300 can be equal to the thickness of the heating element 200; when the heating element 200 is completely wrapped between the heat conductors 300, the thickness of the heat conductor 300 can be greater than the thickness of the heating element 200.
[0045] The present invention also provides an electronic atomization device, which includes the above-mentioned atomization component 10. A storage chamber is arranged in the electronic atomization device, and the storage chamber is used to store a liquid represented by an aerosol generating matrix. The liquid absorption surface 120 of the substrate 100 can directly contact the liquid in the storage chamber. Under the capillary action, the liquid absorption surface 120 of the substrate 100 transfers the liquid absorbed from the liquid storage chamber through the interior of the substrate 100 to the atomization surface 110, and then through the joint action of the heating element and the heat conductive element, smoke with uniform concentration and particle size is formed everywhere on the atomization surface 110.
[0046] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0047] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.
Claims
1. An atomizing assembly, characterized in that: include: A substrate, comprising an atomizing surface for atomizing liquid to form mist, wherein the substrate transfers the liquid to the atomizing surface; A heating element, used to be connected to a power source to heat the atomizing surface, the heating element is directly or indirectly arranged on the atomizing surface, and the projection area of the heating element on the atomizing surface is smaller than the area of the atomizing surface, so that the atomizing surface is divided into a heating area occupied by the projection of the heating element and a blank area surrounding the heating area; and A heat conductor, at least partially disposed in the blank area of the atomizing surface and connected to the heating element; Both the heating element and the heat conductor are directly attached to the atomizing surface; the heat conductor includes a plurality of discretely arranged heat conducting units, one end of each heat conducting unit is connected to the heating element, and the other end of each heat conducting unit is a free end and is located in a blank area of the atomizing surface; the substrate is made of a porous ceramic material.
2. The atomizer assembly according to claim 1, characterized in that: The heat conduction unit is in a straight line shape.
3. The atomizer assembly according to claim 1, characterized in that: The porosity of the matrix is 30% to 60%. The atomizer assembly according to claim 1 , wherein the heat conduction unit is in a zigzag shape or an arc shape.
5. The atomizer assembly according to claim 1, characterized in that: The heating body is an integrally formed open-loop structure, and includes a plurality of first heating units and a second heating unit. The plurality of first heating units extend along a first direction and are spaced apart from each other, and the plurality of second heating units extend along a second direction that forms a set angle with the first direction and are spaced apart from each other. The two ends of the first heating unit are respectively connected to the ends of two adjacent second heating units.
6. The atomizer assembly according to claim 5, characterized in that: The second heating unit located at the end of the heating element has the largest width, and the first direction and the second direction are perpendicular to each other.
7. The atomizer assembly according to claim 5, characterized in that: The heat conductor includes a plurality of discretely arranged heat conducting units, and at least some of the heat conducting units are connected to the intersection of the first heat generating unit and the second heat generating unit.
8. The atomizer assembly according to claim 1, characterized in that: The heat conductor is attached to the heating area and the blank area of the atomized surface, the heating element is attached to the surface of the heat conductor or is embedded in the interior of the heat conductor; the projection area of the heat conductor on the atomized surface is less than or equal to the area of the atomized surface.
9. The atomizer assembly according to claim 8, characterized in that: The distance from the heating element to the atomizing surface is equal everywhere.
10. The atomizer assembly according to claim 1, characterized in that: The heating element is a metal heating film; the heat conductor is a porous ceramic film, porous carbon or porous metal film.
11. The atomizer assembly according to claim 1, characterized in that: The porosity of the heat conductor is 30% to 70%; the thickness of the heat conductor is 20 μm to 150 μm.
12. The atomizer assembly according to claim 1, characterized in that: The thermal conductivity of the heat conductor is 30 w / mk to 400 w / mk.
13. An electronic atomization device, characterized in that: The invention comprises the atomization assembly according to any one of claims 1 to 12.
14. The electronic atomization device according to claim 13, characterized in that: The electronic atomization device is provided with a liquid storage cavity for storing liquid, and the base body also includes a liquid absorption surface, which transfers the liquid absorbed from the liquid storage cavity to the atomization surface through the interior of the base body.
Citation Information
Patent Citations
Aerosol delivery device with microfluidic delivery component
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Atomization assembly and electronic atomization device
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