Optical transmit / receive circuit

Abstract

Embodiments of the present disclosure relate to optical transmission / reception circuits. A device includes a substrate and an optoelectronic chip embedded in the substrate. The substrate may include an opening above a first optical conversion region of a first optoelectronic chip and above a second optical conversion region of a second optoelectronic chip.

Description

Technical Field

[0001] The present disclosure relates generally to electronic circuits and, more particularly, to optical switching circuits. Background Art

[0002] Some electronic circuits include an electronic chip housed in a package. Such a package typically includes a substrate to which the chip is attached and a cover covering the chip and the substrate.

[0003] When such a device is an optical signal conversion circuit (e.g. a time-of-flight measurement proximity sensor), the electronic chip comprises one or more optical signal conversion regions. The package then comprises a transparent element adapted to the wavelength of the optical signal (e.g. infrared radiation). The transparent element is placed opposite the transmission / reception region and is made of glass, for example. Summary of the invention

[0004] One embodiment overcomes all or part of the disadvantages of known optical conversion devices.

[0005] One embodiment provides a device including a substrate and an optoelectronic chip embedded in the substrate.

[0006] According to one embodiment, the substrate comprises an opening above the first optical conversion region of the chip, the opening preferably being filled with a transparent material.

[0007] According to one embodiment, the opening continues over the second optical conversion area.

[0008] According to one embodiment, the second region is a region of an additional chip buried in the substrate.

[0009] According to one embodiment, the cover covers the substrate.

[0010] According to one embodiment, the cover comprises an element, which is preferably transparent, passing through the cover over the first area.

[0011] According to one embodiment, the through-element continues over the second region.

[0012] According to one embodiment, the shield is located on the through-element above the second region.

[0013] According to one embodiment, the cover has a planar surface which is mechanically coupled to the substrate, the planar surface being preferably bonded to the substrate or in direct bonding contact with the substrate.

[0014] According to one embodiment, the cover and the substrate are made of the same material.

[0015] Another embodiment provides a method for manufacturing the above device.

[0016] According to one embodiment, a method comprises the step of overmolding a cover on a substrate.

[0017] According to one embodiment, the overmolding is film-assisted.

[0018] According to one embodiment, the method comprises the step of removing a protection located on the chip.

[0019] According to one embodiment, the protection is flush with the surface of the substrate.

[0020] The foregoing and other features and advantages will be discussed in detail in the following non-limiting description of specific embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a simplified cross-sectional view illustrating one embodiment of an optical conversion device.

[0022] FIG. 2A to FIG. 2C It is a graphic Figure 1 A simplified cross-sectional view of an alternative embodiment of a device of;

[0023] Figures 3A to 3G It is a graphic manufacturing Figure 1 Simplified cross-sectional views of steps of a method of device.

[0024] FIG. 4A to FIG. 4C is a simplified cross-sectional view illustrating another embodiment of an optical conversion device; and

[0025] FIG. 5A to FIG. 5C It is a graphic manufacturing Figure 4A Simplified cross-sectional views of steps of a method of device. DETAILED DESCRIPTION

[0026] In the various drawings, the same elements are designated with the same reference numerals, and the various drawings are not drawn to scale. For clarity, only those steps and elements useful for understanding the described embodiments are shown and described in detail. In particular, the chips are not described in detail, and the described embodiments and variants are compatible with most current chips.

[0027] In the following description, when referring to terms defining absolute positions (such as terms "front", "rear", "top", "bottom", "left", "right", etc.), or terms defining relative positions (such as terms "above", "below", "upper", "lower", etc.), or terms defining directions (such as terms "horizontal", "vertical", etc.), it refers to the orientation of the relevant elements in the relevant drawings, and it should be understood that in practice, the described devices may be oriented differently. The terms "approximately", "substantially" and "about" are used herein to specify plus or minus 10%, preferably plus or minus 5%, of the value in question, or, with respect to orientation, plus or minus 10 degrees, preferably plus or minus 5 degrees.

[0028] Figure 1 1 is a simplified cross-sectional view illustrating one embodiment of an optical conversion device 100 for transmitting and / or receiving optical signals. More specifically, Figure 1 An example of a time-of-flight measurement proximity sensor is shown.

[0029] The device 100 includes a substrate 110. The substrate 110 is, for example, a component of glass fiber, resin and a conductive layer. The substrate 110 preferably has a plate shape, for example, having two opposite surfaces 112 (upper surface) and 114 (lower surface). As an example, the lower surface 114 is planar.

[0030] The device includes a chip 120A. The chip 120A preferably includes a portion of a semiconductor wafer (e.g., made of silicon). The chip 120A is buried in the substrate, that is, it is buried in the substrate and at least partially covered by a portion of the substrate. The chip 120A is completely included between the levels of the surfaces 112 and 114 of the substrate 110. As an example, the chip 120A has a surface 122A (preferably planar) that faces the side of the surface 112 of the substrate 110. The electronic circuitry, not shown, is located in the chip 120A on one side of the surface 122A. Preferably, the chip 120A is an optoelectronic chip. As an example, the chip 120A includes an optical conversion region 124A, preferably an optical transmission region, on one side of the surface 122A. The chip 120A may include a plurality of optical conversion regions.

[0031] As an example, the device 100 further comprises an additional chip 120B buried in the substrate 110. Preferably, the chip 120B comprises a semiconductor wafer portion, for example, made of silicon. The chips 120A and 120B have, for example, the same thickness. Preferably, the chips 120A and 120B have their respective upper surfaces 122A and 122B located in the same plane, which is parallel to the surface 112 of the substrate 110. Preferably, the chip 120B is an optoelectronic chip, which comprises both electronic circuits and one or more optical conversion regions on one side of the surface 122B. In the illustrated example, the chip 120B comprises two optical receiving regions 124B and 124C. The region 124C is preferably located between the optical region 124B of the chip 120B and the optical region 124A of the chip 120A.

[0032] As an example, substrate 110 includes an opening 116A above region 124A. Opening 116A extends from the level of surface 112 of substrate 110 to the level of surface 122A. Opening 116A is, for example, empty or can be filled with a gas such as air. Preferably, opening 116A is filled with a transparent material. "Transparent" here refers to a material that allows all or part of the optical signals sent or received by the optical conversion region of the optoelectronic chip. The transparent material can be an optical resin. For these optical signals, the material of substrate 110 is preferably opaque.

[0033] In the illustrated example, the substrate further comprises an opening 116B located above the region 124B. Preferably, the openings 116A and 116B are separated by an opaque wall 118. The opening 116B may be filled with a transparent material. Preferably, the opening 116A extends above the region 124C. Then, the regions 124A and 124C are located below the same opening 116A.

[0034] As a variant, chips 124A and 124B are replaced by a single chip comprising the three regions 124A, 124B and 124C. In another variant, the device comprises more than two chips.

[0035] As an example, the device 100 also includes a metallization 130 located on the lower surface 114 of the substrate 110. The metallization 130 enables the device 100 to be electrically coupled to an external circuit (not shown), such as a PCB ("printed circuit board"). Electrical connectors 132 couple the metallization 130 to the chip 120A and the optional chip 120B. The electrical connectors are located inside the substrate 110. Preferably, the electrical connectors are in contact with the chip 120A on one side of its surface 122A, and are in contact with the optional chip 120B on one side of its surface 122B. The electrical connections 132 couple the metallization 130 to the circuits of the chip 120A and / or the optional chip 120B.

[0036] Preferably, the cover 140 covers the substrate 110 on one side of the surface 112 of the substrate 110. The cover 140 is preferably made of a polymer material, for example a thermosetting polymer such as an epoxy resin. The material of the cover 140 is preferably opaque. The cover 140 preferably has the shape of a plate. The cover 140 has a flat surface 142 that is mechanically connected to the upper surface 112 of the substrate 110. The mechanical coupling between the cover 140 and the substrate 110 can be performed with the aid of a glue 144. As a variant, the mechanical coupling between the cover 140 and the substrate 110 is achieved by direct adhesive contact with the substrate, for example, the direct adhesive contact is obtained by overmolding the cover 140 on the substrate 110. The cover 140 also includes a through opening 146C located above the optical conversion region 124A. The transparent element 150A is accommodated in the through opening 146A. The transparent element 150A is preferably made of glass. The transparent element 150A forms an optical lens or a filter, for example. In the illustrated example, the cover further includes a through opening 146B and a transparent element 150B. The through opening 146B is located above the region 124B, and the transparent element 150B is received in the opening 146B.

[0037] Due to the fact that the optoelectronic chip is buried in the substrate 110, the device 100 has a particularly small total thickness between the lower surface 114 of the substrate 110 and the upper surface of the cover 140, which is less than the total thickness of a typical device. A total thickness of less than 500 μm can usually be obtained. This makes it possible to solve various integration problems, for example, in the case where the device must be integrated in a compact component such as a cellular phone. Preferably, the thickness of the substrate 110 between the surfaces 112 and 114 is less than 300 μm, for example, in the range from 150 μm to 250 μm. Preferably, the thickness of the cover 140 is less than 300 μm, for example, about 250 μm. In the illustrated example, when the time-of-flight measurement distance sensor is in operation, the transmission area 124A transmits an optical signal through the opening 116A and the transparent element 150A. Due to the fact that the areas 124A and 124C are located below the same opening 116A, the receiving area 124C receives a portion of the optical signal. Opaque wall 118 prevents part of the optical signal from reaching receiving region 124B without exiting the device. Part of the optical signal reaches receiving region 124B after having been reflected and passed through transparent element 150B and opening 116B. The flight time corresponds to the difference between the reception times by regions 124C and 124B.

[0038] FIG. 2A to FIG. 2C It is a graphic Figure 1 A simplified cross-sectional view of an alternative embodiment of a device.

[0039] Figure 2AThe device includes a substrate 210, chips 120A and 120B embedded in the substrate 210, and a cover 240A covering the substrate 210. The substrate 210 corresponds to Figure 1 The substrate 110 of the device is provided with a cover 240A, wherein the opening 116A does not extend over the region 124C, and the substrate includes an opening 116C above the region 124C that is separated from the opening 116A. As a variant, the chips 120A and 120B are replaced by a single chip including the three regions 124A, 124B and 124C, or by more than two chips. Figure 1 The cover 140 of FIG. 1 is different in that it includes a cavity 246A above the region 124A. The cavity 246A is located on the side of the cover facing the chip. Preferably, the cavity 246A extends above the region 124C. As an example, the thickness of the transparent element 150A is less than the total thickness of the cover.

[0040] Cavity 246A is preferably filled with a transparent material. The transparent material is, for example, an optical resin. In operation, Figure 2A Cavity 246A of the device transmits a portion of the optical signal emitted by region 124A toward region 124C.

[0041] Figure 2B The device includes a substrate 210 and chips 120A and 120B, which are connected to Figure 2A The devices are the same or similar to those of the substrate 210 and are arranged in the same or similar manner. The substrate 210 is covered with a cover 240B. The cover 240B is Figure 2A The cover 240A of the device of FIG. 1 is different in that it also includes a cavity 246B above the region 124B. The cavity 246B extends from above the opening 116B around the opening 116B on the surface 112 of the substrate 210. Therefore, the lateral dimension of the cavity 246B is greater than the lateral dimension of the opening 116B. The cavity 246B is located on the side of the cover that faces the chip 124B. As an example, the thickness of the transparent element 150B is less than the total thickness of the cover 240B.

[0042] Preferably, transparent elements 150A and 150B have the same thickness. The portion 248 of the cover body located between and around openings 246A and 246B thus forms feet of the same height. Due to the fact that the transverse dimensions of cavities 246A and 246B are greater than the transverse dimensions of the corresponding openings 116A and 116B, the problem of glue overflowing in openings 116A and 116B is avoided.

[0043] Figure 2C The device includes a substrate 210 and chips 120A and 120B, which are connected to Figure 2AThe devices are the same or similar to those of the substrate 210 and are arranged in the same or similar manner. The substrate 210 is covered with a cover 240C. The cover 240C and Figure 1 The cover of FIG. 124A differs in that the opening 146A and the transparent through-element 150A continue over the region 124C. An opaque shield 260 (eg, a layer of opaque material) covers the transparent element 150A over the region 124C. In operation, the opaque shield 260 prevents the region 124C from receiving reflected optical signals.

[0044] Figures 3A to 3G is a diagram illustrating an example of a device including two chips 120A and 120B. Figure 1 Simplified cross-sectional views of steps of an embodiment of a device.

[0045] As an example, multiple devices arranged in an array are fabricated simultaneously.

[0046] exist Figure 3A In a step of providing a first layer 110 - 1 of material of the future substrate 110 , which comprises openings 300 at the locations of the chips 120A and 120B. The layer 110 - 1 preferably has the same thickness as the chips 120A and 120B. The openings 300 may be through openings.

[0047] Layer 110-1 is positioned on a flat surface of an adhesive support, such as adhesive film 310. As an example, adhesive film 310 is a polymer film, preferably with a thickness in the range of 10 μm to 400 μm. The polymer film is covered with a layer of adhesive, allowing a temporary mechanical connection.

[0048] exist Figure 3B In the step of , the chips 120A and 120B are placed in the opening 3000. The chips 120A and 120B are attached to the adhesive film 310. Preferably, the size of the opening 300 is the same as the size of the chips 120A and 120B within the functional gap.

[0049] Chip 120A and layer 110-1 are partially covered with elements 320A and 320B (e.g., portions of layers) at corresponding locations of future openings 116A and 116B. Preferably, elements 320A and 320B are made of a polymer material that is selectively etchable relative to the material of future substrate 110. Protective elements 320A and 320B are, for example, portions of a resin film, an opaque film, a dry film, or a polymer film.

[0050] exist Figure 3CIn the step of , layer 110-1 and chips 120A and 120B are covered by layer 110-2. Preferably, the material of layer 110-2 is the same as that of layer 110-1. Layer 110-2 preferably has a flat upper surface 112. The thickness of layer 110-2 corresponds to the height of future openings 116A and 116B, i.e., to the distance separating the upper surfaces of chips 120A and 120B from the surface 112 of future substrate 110.

[0051] Preferably, the thickness of elements 320A and 320B is less than the thickness of layer 110-2. Elements 320A and 320B protect the upper surface of chips 120A and 120B and layer 110-1 at the locations of the openings, preventing direct contact with layer 110-2.

[0052] exist Figure 3D In the step of , adhesive film 310 is removed. Chips 120A and 120B are in direct bonding contact with layer 110-2. The portion of layer 110-2 located above protection elements 320A and 320B is etched at the location of future openings 116A and 116B. Then, preferably, protection elements 320A and 320B are removed by selective etching. Thus, openings 116A and 116B are obtained.

[0053] As a variant, the protection elements 320A and 320B have the same thickness as the layer 110 - 2 .The step of etching the portion of the layer 110 - 2 located above the protection elements 320A and 320B is then omitted.

[0054] exist Figure 3E In the step of, the lower surface of layer 110-1 and chips 120A and 120B is covered with layer 110-3, and connectors 132 and metallization 130 are formed. The material of layer 110-3 is preferably the same as that of layers 110-1 and 110-2. The lower surface of layer 110-3 forms the lower surface 114 of substrate 110.

[0055] exist Figure 3F In step 31, openings 116A and 116B are filled with transparent material 330. Transparent elements 150A and 150B are then arranged at their respective positions over regions 124A and 124B.

[0056] exist Figure 3GIn the step of, the cover 140 is formed by film-assisted molding. For this reason, elements 150A and 150B are covered with film 340. Film 340 bears against the upper surface of elements 150A and 150B. For example, film 340 is parallel to the plane of the layer. Then, the entire obtained structure is placed in a mold not shown. Layer 140-1 (for example, with constant thickness) is formed by molding. During molding, film 340 bears against the inner surface of the mold. Layer 140-1 is made of thermosetting material, for example. The material of layer 140-1 can be the same as the material of substrate 110. Then, elements 150A and 150B cross layer 140-1 across its entire thickness. Then film 340 is removed. Film 340 makes the release of the mold easy and avoids a part of the material of layer 140-1 covering elements 150A and 150B. Although the above-mentioned molding is assisted by film 340, film 340 can be omitted, and non-film-assisted molding can be performed.

[0057] Thereafter, the device is separated into individual devices by cutting along cutting lines 350 .

[0058] In each of the obtained devices, the substrate 110 is formed of the layers 110-3, 110-1 and 110-2, and the cover 140 is formed of the layer 140-1. The cover 140, which has been overmolded on the substrate, is mechanically coupled to the layer 110-2 by direct bonding.

[0059] As a variant, steps 3E and 3F may be replaced by steps independent of Figure 3D The step of manufacturing the cover 140 by the structure obtained at the step of Figure 3D The structure obtained at step .

[0060] The above method and FIG. 2A to FIG. 2C The invention is compatible with alternative embodiments of the present invention and is compatible with any number of chips, such as optoelectronic chips.

[0061] FIG. 4A to FIG. 4C is a simplified cross-sectional view illustrating an example of another embodiment of an optical conversion device 400. More specifically, FIG. 4A to FIG. 4C An example of a time-of-flight measurement proximity sensor is shown.

[0062] exist FIG. 4A to FIG. 4C In the example of , the device 400 includes a substrate 410. The substrate 410 is, for example, a component of glass fiber, resin, and a conductive layer. The substrate 410 is preferably made of an opaque material. The substrate 410 is, for example, in the shape of a plate, for example, having two opposite surfaces 412 (upper surface) and 414 (lower surface). As an example, the surface 412 is planar.

[0063] Device 400 includes chip 120A and optional chip 120B, and Figure 1 4. The chip 120A has a surface 122A (preferably planar) that is flush with the surface 412 of the substrate 410. The optional chip 120B has a surface 122B (preferably planar) that is flush with the surface 412 of the substrate 410. As a variant, the chips 120A and 120B are replaced by a single chip including three optical transmission / reception areas 124A, 124B and 124C. As a variant, the device 400 includes more than two chips.

[0064] The device 400 may also include a metallization 130 on the surface 414 that is Figure 1 The metallization 130 of the device is the same or similar. The electrical connection 432 passes completely through the substrate from the metallization 130 to the surface 412, preferably vertically.

[0065] exist FIG. 4A to FIG. 4C In each example, the substrate 410 is covered with a different example of a cover. Due to the fact that the chip 120A and the optional chip 120B are flush with the upper surface of the substrate, the device has a total thickness from the lower surface of the substrate to the upper surface of the cover, and in particular, the total thickness is reduced in each of these examples.

[0066] exist Figure 4A In the example of FIG. 4 , the device 400 includes a cover 440A covering the substrate 410 on one side of the surface 412. The cover 440A includes Figure 2A The same or similar elements of the cover 240A are arranged in the same or similar manner. Therefore, the cover 440A includes a cavity 246A on one side of the substrate 410. The regions 124A and 124C are located below the same cavity 246A. The cover 440A also includes through elements 150A and 150B, which are preferably transparent. The through elements 150A and 150B are located above the regions 124A and 124B, respectively. The cavity 246A is preferably filled with a transparent material.

[0067] Cover 440A also includes electrical connectors. Connectors 434 couple top 432 of connectors to upper surfaces of chip 120A and optional chip 120B. Some connectors 434 may be included in the material of cover 440A. Some connectors 434 may be included in the transparent material of cavity 246A. Some connectors 434 may be partially included in the material of cover 440A and partially included in the material of cavity 246A.

[0068] exist Figure 4B In the example of FIG. 4 , the device 400 further includes a cover 440B covering the substrate 410 on one side of the surface 412. The cover 440B includes Figure 3BThe cover 440B may be formed by cavities 246A and 246B, which are identical or similar to the elements of the cover 140B. In particular, in addition to cavity 246A, the cover also includes cavity 246B. Cavities 246A and 246B may be empty or filled with air. The cover 440B may then be formed independently of the substrate 410 and the elements located therein and then bonded to the surface 412. To achieve this, the connector 434 is arranged to be completely located in the cavities 246A and 246B. In addition, due to the fact that the portions of the cover located between and around the cavities 246A and 246B form feet 248 of the same height, the arrangement of the cover 440B on the substrate 410 makes it possible to easily obtain an opaque wall in contact with the upper surface of the chip 120B between the openings 246A and 246B, the upper surface of the chip being flush with the upper surface of the substrate 410.

[0069] exist Figure 4C In the example of FIG. 4 , the device 400 further includes a cover 440C covering the substrate 410 on one side of the surface 412. The cover 440C includes Figure 2C The opaque shield 260 covers the transparent element 150A of the cover 440C above the region 124C. The connector 434 is preferably included in the material of the cover 440C.

[0070] FIG. 5A to FIG. 5C The example of a device including two chips 120A and 120B is shown in FIG. Figure 4A A simplified cross-sectional view of an example of a step in a method of a device.

[0071] As an example, multiple devices arranged in an array are fabricated simultaneously.

[0072] exist Figure 5A In the step of providing a layer including a plurality of substrates 410 arranged in an array. Figures 5A to 5C 4 shows a single substrate 410. The substrate 410 includes a housing 500A for the chip 120A on one side of its upper surface 412. The depth of the housing 500A corresponds to the thickness of the chip 120A. The substrate 410 includes a housing 500B for the chip 120B on one side of its upper surface 412. The depth of the housing 500B corresponds to the thickness of the chip 120B. The substrate also includes a metallization 130 and a connector 432.

[0073] The chips 120A and 120B are then arranged in their respective housings 500A and 500B. The chips are flush with the upper surface 412 of the substrate 410. Connectors 434 are formed, each coupling the top of connector 432 to the upper surface of one of the chips.

[0074] exist Figure 5BIn the step of, a portion 510 of a transparent material layer is formed at the location of the future cavity 246A. The portion 510 of the layer covers the area 124A and the area 124C. The portion 510 of the layer may partially or completely cover some of the connectors 434. Then, the elements 150A and 150B are arranged on the corresponding areas 124A and 124B. As an example, the element 150B may be bonded to the area 124B by means of a transparent glue 520.

[0075] exist Figure 5C In the steps of Figure 3G As described, molding is performed, preferably film-assisted molding. Elements 150A and 150B are covered with film 540. Film 540 bears against the upper surfaces of elements 150A and 150B. Layer 440-1 is then formed by molding, film 540 bearing against the inner wall of the mold.

[0076] The device is then separated into individual devices by cutting along lines 550 .

[0077] The above method and Figure 4B and Figure 4C Examples are compatible with , and are compatible with any number of chips (eg, optoelectronic chips).

[0078] Having described particular embodiments, various alterations, modifications, and improvements will readily occur to those skilled in the art.

[0079] Various embodiments with different variations have been described above. It should be noted that those skilled in the art can combine various elements of these various embodiments and variations without showing any inventive step.

[0080] Finally, based on the functional indications given above, the actual implementation of the described embodiments is within the capabilities of a person skilled in the art.

[0081] These changes, modifications, and improvements are intended to be part of this disclosure, and are intended to be within the spirit and scope of the invention.Therefore, the foregoing description is intended to be illustrative only and not limiting.

[0082] The various embodiments described above can be combined to provide further embodiments. These and other changes can be made to the embodiments in light of the above detailed description. Generally, in the following claims, the terms used should not be interpreted as limiting the claims to the specific embodiments disclosed in this specification and claims, but should be interpreted as including all possible embodiments and the full range of equivalents given by these claims. Therefore, the claims are not limited by this disclosure.

Claims

1. An electronic device comprising: a substrate having a first surface; a first optoelectronic chip embedded in the substrate and comprising a first optical conversion region; as well as a second optoelectronic chip, buried in the substrate and comprising a second optical conversion region and a third optical conversion region, The substrate comprises: a first opening extending from the first surface into the substrate, the first opening extending over a first optical conversion region and a second optical conversion region, and A second opening extends from the first surface into the substrate, the second opening extending over the third optical conversion region. 2 . The electronic device according to claim 1 , further comprising a cover body, the cover body covering the substrate. 3 . The electronic device according to claim 2 , wherein the cover comprises a transparent element, the transparent element being above the first optical conversion region. The electronic device of claim 3 , wherein the transparent element continues over the second optical conversion region. 5 . The electronic device according to claim 4 , further comprising a shielding member located on the transparent element and above the second optical conversion region. The electronic device of claim 2 , wherein the cover has a planar surface that is mechanically coupled to the substrate. The electronic device of claim 6 , wherein the planar surface is bonded to the substrate. The electronic device according to claim 2 , wherein the cover and the substrate are made of the same material.

9. A method for manufacturing an electronic device, the method comprising: embedding a first optoelectronic chip having a first optical conversion region in a substrate having a first surface; embedding a second optoelectronic chip having a second optical conversion region and a third optical conversion region in the substrate; forming a first opening extending from the first surface into the substrate, the first opening extending over a first optical conversion region and a second optical conversion region, and A second opening is formed extending from the first surface into the substrate, the second opening extending over a third optical conversion region.

10. The method of claim 9, comprising overmolding a cover over the substrate. The method of claim 10 , wherein the overmolding comprises film-assisted overmolding of the cover onto the substrate.

12. The method according to claim 9, comprising: forming a protective layer on the first optical conversion region of the first optoelectronic chip; forming the first opening in the substrate directly above the protective layer; as well as The protection layer is removed after the first opening is formed. The method of claim 12 , wherein the protective layer is flush with the first surface.

14. The method of claim 12, further comprising forming the substrate, wherein forming the substrate comprises: forming a first substrate layer including the first opening and the second opening; as well as After positioning the first optoelectronic chip in the first opening in the first substrate layer, a second substrate layer is formed, which at least partially covers the first optoelectronic chip.

15. An electronic device comprising: a substrate comprising a first internal cavity and a second internal cavity laterally spaced from the first internal cavity; as well as a first optoelectronic chip positioned in the first internal cavity and at least partially covered on each of four sides by a respective portion of the substrate, the first optoelectronic chip comprising a first optical conversion region; a second optoelectronic chip, positioned in the second inner cavity and at least partially covered on each of four sides by a respective portion of the substrate, the second optoelectronic chip comprising a second optical conversion region and a third optical conversion region, The substrate at least partially covers the upper surfaces of the first optoelectronic chip and the second optoelectronic chip, and the substrate comprises: a first opening extending from an upper surface of the substrate into the substrate, the first opening extending over a first optical conversion region and a second optical conversion region, and A second opening extends from the upper surface into the substrate, the second opening extending above the third optical conversion region. 16 . The electronic device according to claim 15 , further comprising a cover covering the substrate, the cover comprising a first transparent element, the first transparent element being above the first optical conversion region of the first optoelectronic chip.

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