Circuit board components, optoelectronic modules, depth cameras and electronic devices

Abstract

The present invention discloses a circuit board assembly. The circuit board assembly includes a heat dissipation substrate, a heating element, and a reinforcement plate. The heat dissipation substrate includes a bearing surface and a connecting surface opposite to the bearing surface, a first conductive element is formed on the bearing surface, and a second conductive element is formed on the connecting surface. The heating element is arranged on the bearing surface and is electrically connected to the first conductive element. The circuit board is arranged on the connecting surface and is electrically connected to the second conductive element, and the circuit board has at least one via. The reinforcement plate is arranged on the surface of the circuit board opposite to the connecting surface, the reinforcement plate includes a reinforcement body and a boss extending from the reinforcement body, the boss is penetrated by a via and contacts the heat dissipation substrate. The circuit board assembly of the embodiment of the present invention conducts and evacuates the heat of the heating element through the heat dissipation substrate and the heat-conducting reinforcement plate through the reinforcement plate that is in direct contact with the heat dissipation substrate and penetrates the circuit board, and the heat dissipation effect is good. The present invention also discloses an optoelectronic module, a depth camera and an electronic device.

Description

Technical Field

[0001] The present invention relates to the field of consumer electronics, and more specifically, to a circuit board assembly, an optoelectronic module, a depth camera and an electronic device. Background Art

[0002] Since the current / luminous power of the light emitting diode (LED) lamp and the laser emitter of the face recognition sensor is large, the heat generated is large, especially in digital devices such as mobile phones. Excessive heat generation will cause problems such as high operating temperature of the whole machine and infrared laser band offset, which directly affects product performance. The laser emitter of the LED lamp and face recognition sensor of the related technology is bonded to the flexible printed circuit (FPC) through silver paste die bonding, but the FPC contains stacking materials such as polyimide, adhesive, solder mask ink, conductive film and copper foil, and the average thermal conductivity is only ≤0.38 watts / (meter·K) (W / (m·K)), and the heat dissipation effect is poor. Summary of the invention

[0003] Embodiments of the present invention provide a circuit board assembly, an optoelectronic module, a depth camera, and an electronic device.

[0004] The circuit board assembly of the embodiment of the present invention includes a heat dissipation substrate, a heating element, a circuit board and a heat-conducting reinforcement plate. The heat dissipation substrate includes a bearing surface and a connecting surface opposite to the bearing surface, a first conductive element is formed on the bearing surface, and a second conductive element is formed on the connecting surface. The heating element is arranged on the bearing surface and electrically connected to the first conductive element. The circuit board is arranged on the connecting surface and electrically connected to the second conductive element, and a via is provided on the circuit board. The reinforcement plate is arranged on the surface of the circuit board opposite to the connecting surface, and the reinforcement plate includes a reinforcement body and a boss extending from the reinforcement body, and the boss passes through the via and contacts the heat dissipation substrate.

[0005] The circuit board assembly of the embodiment of the present invention arranges the heating element on the bearing surface of the heat dissipation substrate, arranges the circuit board on the connecting surface of the heat dissipation substrate and opens a via hole on the circuit board so that the boss of the reinforcement plate passes through the via hole and contacts the heat dissipation substrate, thereby conducting and dissipating the heat of the heating element through the heat dissipation substrate and the heat-conductive reinforcement plate, and the heat dissipation effect is good.

[0006] In some embodiments, the first conductive element includes a pad, and the heating element is disposed on the pad of the first conductive element.

[0007] The pad has a relatively large area compared to conventional conductive circuits, so the pad of the first conductive element is connected to the heating element, which is convenient to weld and the connection is relatively firm; moreover, the contact area between the pad and the heating element is large, which can more quickly dissipate and absorb the heat generated by the heating element, thereby improving the heat dissipation effect.

[0008] In some embodiments, the heating element is mounted on the pad of the first conductive element by means of conductive silver paste.

[0009] Compared with the thermal conductivity of conventional flexible circuit boards (<=0.38W / (m·K)), the thermal conductivity of conductive silver paste is higher and the heat dissipation effect is better.

[0010] In some embodiments, the circuit board assembly further includes a non-emitting source electrical device, and the non-emitting source electrical device is disposed on the first conductive element by solder paste.

[0011] Compared with the thermal conductivity of conventional flexible circuit boards (<=0.38W / (m·K)), solder paste has a higher thermal conductivity, better heat dissipation effect, and the connection is more stable when connected through solder paste.

[0012] In some embodiments, the second conductive element includes a pad, the boss is disposed on the pad of the second conductive element, and the boss corresponds to the heating element.

[0013] The pad has a relatively large area compared to conventional conductive circuits, so the boss is set on the pad of the second conductive element, which is convenient for welding and the connection is relatively firm; moreover, the contact area between the pad and the boss is large, which can conduct and dissipate the heat generated by the heating element more quickly, thereby improving the heat dissipation effect.

[0014] In some embodiments, the boss is disposed on the pad of the second conductive element by solder paste.

[0015] Compared with the thermal conductivity of conventional flexible circuit boards (<=0.38W / (m·K)), solder paste has a higher thermal conductivity, better heat dissipation effect, and the connection is more stable when connected through solder paste.

[0016] In some embodiments, the circuit board is disposed on the second conductive element by solder paste.

[0017] Compared with the thermal conductivity of conventional flexible circuit boards (<=0.38W / (m·K)), solder paste has a higher thermal conductivity, better heat dissipation effect, and the connection is more stable when connected through solder paste.

[0018] In some embodiments, the heat dissipation substrate includes a ceramic substrate or a metal substrate.

[0019] Compared with the thermal conductivity of conventional flexible circuit boards (<=0.38 W / (m·K)), ceramic substrates and metal substrates have higher thermal conductivity and better heat dissipation effects.

[0020] In some embodiments, the thermal conductivity of the heat dissipation substrate is greater than or equal to 2.5 W / m·K.

[0021] Compared with the thermal conductivity of conventional flexible circuit boards (<=0.38W / (m·K)), the thermal conductivity of the heat dissipation substrate is greater than or equal to 2.5W / (m·K), which has a higher thermal conductivity and a better heat dissipation effect.

[0022] In some embodiments, the heat dissipation substrate is provided with a plurality of conductive through holes, the inner walls of the conductive through holes are provided with a metal layer, the first conductive element is electrically connected to the second conductive element through the metal layer, and one end of the circuit board is provided on the connecting surface and electrically connected to the second conductive element.

[0023] The first conductive element and the second conductive element are electrically connected via a metal layer disposed on the inner wall of the conductive through hole, which can not only realize electrical connection between the first conductive element and the second conductive element, thereby ensuring signal transmission between the circuit board and the heating element, but also realize heat conduction, wherein the heat conducted from the heating element to the first conductive element is conducted to the second conductive element via the metal layer, thereby realizing the evacuation of heat generated by the heating element.

[0024] In some embodiments, the reinforcing plate is further provided with a plurality of heat dissipation through holes, and the heat dissipation through holes are located in an area outside an area where the through holes of the reinforcing plate are located.

[0025] The reinforcing plate is provided with a plurality of heat dissipation holes which are located outside the perforated area, so as to reduce the weight of the circuit board assembly while ensuring the strength of the connection area between the circuit board and the heat dissipation substrate, and to dissipate heat through the heat dissipation holes.

[0026] In some embodiments, the reinforcing plate is connected to the circuit board by adhesive.

[0027] The reinforcing plate is connected to the circuit board through connecting glue, and the connection is relatively stable.

[0028] The optoelectronic module of the present invention comprises the circuit board assembly of any one of the above embodiments and an optical assembly arranged on the circuit board assembly. The optical assembly corresponds to the circuit board assembly.

[0029] The optoelectronic module of the embodiment of the present invention arranges the heating element on the bearing surface of the heat dissipation substrate, arranges the circuit board on the connecting surface of the heat dissipation substrate and opens a via hole on the circuit board so that the boss of the reinforcement plate passes through the via hole and contacts the heat dissipation substrate, thereby conducting and dissipating the heat of the heating element through the heat dissipation substrate and the heat-conductive reinforcement plate, and the heat dissipation effect is good.

[0030] The depth camera of the present invention includes the optoelectronic module, image collector, and processor described in any of the above embodiments. The heating element is a light source and is used to emit laser, and the optical component includes a beam generator arranged on the circuit board assembly, and the beam generator corresponds to the light source at intervals and is used to convert the laser into a laser pattern. The image collector is used to collect the laser pattern projected by the optoelectronic module. The processor is connected to the optoelectronic module and the image collector respectively, and the processor is used to process the laser pattern to obtain a depth image.

[0031] The depth camera of the embodiment of the present invention arranges the heating element on the bearing surface of the heat dissipation substrate, arranges the circuit board on the connecting surface of the heat dissipation substrate and opens a via hole on the circuit board so that the boss of the reinforcement plate passes through the via hole and contacts the heat dissipation substrate, thereby conducting and dissipating the heat of the heating element through the heat dissipation substrate and the heat-conductive reinforcement plate, and the heat dissipation effect is good.

[0032] An electronic device according to an embodiment of the present invention includes a housing and the depth camera described in any one of the above embodiments, wherein the depth camera is disposed in the housing and exposed from the housing to acquire a depth image.

[0033] The electronic device of the embodiment of the present invention arranges the heating element on the bearing surface of the heat dissipation substrate, arranges the circuit board on the connecting surface of the heat dissipation substrate and opens a via hole on the circuit board so that the boss of the reinforcement plate passes through the via hole and contacts the heat dissipation substrate, thereby conducting and dissipating the heat of the heating element through the heat dissipation substrate and the heat-conductive reinforcement plate, and the heat dissipation effect is good.

[0034] Additional aspects and advantages of embodiments of the present invention will be given in part in the following description and in part will be obvious from the following description or learned through practice of embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0036] Figure 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

[0037] Figure 2 is a schematic structural diagram of a depth camera according to an embodiment of the present invention;

[0038] Figure 3 A schematic diagram of the structure of an optoelectronic module according to an embodiment of the present invention;

[0039] Figure 4 for Figure 3 A three-dimensional schematic diagram of a circuit board assembly;

[0040] Figure 5 yes Figure 4 A partial cross-sectional schematic diagram of the circuit board assembly along line VV;

[0041] Figure 6 Embodiment of the present invention Figure 4 A plan view of the circuit board assembly from another perspective;

[0042] Figure 7 is a partial cross-sectional schematic diagram of a circuit board assembly along line VV of another embodiment;

[0043] Figure 8 is a partial cross-sectional schematic diagram of a circuit board assembly along line VV according to yet another embodiment; and

[0044] Fig. 9 It is a schematic structural diagram of a photovoltaic module according to another embodiment of the present invention. DETAILED DESCRIPTION

[0045] The embodiments of the present invention are further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the accompanying drawings represent the same or similar elements or elements with the same or similar functions.

[0046] In addition, the embodiments of the present invention described below in conjunction with the drawings are exemplary and are only used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0047] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0048] See also Figure 1, the electronic device 1000 of the embodiment of the present invention includes a housing 200 and a depth camera 100. The electronic device 1000 may be a mobile phone, a tablet computer, a laptop, a game console, a head-mounted display device, an access control system, an ATM, etc. The embodiment of the present invention is described by taking the electronic device 1000 as a mobile phone as an example. It can be understood that the specific form of the electronic device 1000 may be other, which is not limited here. The depth camera 100 is disposed in the housing 200 and exposed from the housing 200 to obtain a depth image. The housing 200 can provide the depth camera 100 with dustproof, waterproof, and drop-proof protection. A hole corresponding to the depth camera 100 is opened on the housing 200 to allow light to pass through the hole or pass through the housing 200.

[0049] See also Figure 2 , the depth camera 100 includes an optoelectronic module 10 (in this case, the optoelectronic module 10 is a structured light projection module), an image collector 20 and a processor 30. A projection window 40 corresponding to the optoelectronic module 10 and a collection window 50 corresponding to the image collector 20 may be formed on the depth camera 100. The optoelectronic module 10 is used to project a laser pattern to the target space through the projection window 40. The laser pattern is a coded structured light (a coded pattern composed of a finite set of unique sub-patterns), for example, a two-dimensional coded structured light pattern, and the laser pattern is called a reference pattern, and each unique pattern window in the reference pattern is unique. The image collector 20 is used to collect the laser pattern modulated by the target object, that is, the imaging pattern, through the collection window 50. In one example, the laser projected by the optoelectronic module 10 is infrared light, and the image collector 20 is an infrared camera. The processor 30 is connected to both the optoelectronic module 10 and the image collector 20, and the processor 30 is used to process the imaging pattern to obtain a depth image. Specifically, the processor 30 decodes the encoded imaging pattern to find out the correspondence between each pixel in the imaging pattern and each corresponding pixel in the reference pattern, and then further obtains the depth image of the laser pattern according to the correspondence.

[0050] The above-mentioned optoelectronic module 10 can be a 3D depth of field camera module, such as a structured light projection module 10, a time of flight (TOF) imaging module, etc.; of course, the optoelectronic module 10 can also be other imaging modules, such as a face recognition sensor module, specifically a camera module; the optoelectronic module 10 can also be a pure light source emitter, such as an LED, a car lamp, etc. It can be understood that the specific form of the optoelectronic module 10 can also be other devices, such as any component with high heat generation, which is not limited here.

[0051] See also Figure 3In one example, the optoelectronic module 10 is a structured light projection module 10. The structured light projection module 10 is used to project a laser pattern to a target space, and the laser pattern may be a speckle pattern or a coded pattern. By collecting and processing the laser pattern modulated by the target object, a depth image of the target object in the target space can be obtained.

[0052] The optoelectronic module 10 includes a circuit board assembly 11 , a lens barrel 12 , and an optical assembly 13 .

[0053] See also Figures 4 to 6 The circuit board assembly 11 includes a heat dissipation substrate 111 , a heating element 112 , a circuit board 113 , a reinforcement board 114 , a connector 115 and a non-emitting source electrical device 116 .

[0054] Specifically, the heat dissipation substrate 111 includes a bearing surface 1111, a connection surface 1112 opposite to the bearing surface 1111, a first conductive element 1113 formed on the bearing surface 1111, a second conductive element 1114 formed on the connection surface 1112, a metal layer 1115, and a plurality of conductive through holes 1116 penetrating the bearing surface 1111 to the connection surface 1112. The heating element 112 is disposed on the bearing surface 1111. The bearing surface 1111 of the heat dissipation substrate 111 is used to bear the lens barrel 12 ( Figure 3 1114 and the first conductive element 1113 are electrically connected to each other through the metal layer 1115. The metal layer 1115 can realize the electrical connection between the first conductive element 1113 and the second conductive element 1114, and can also conduct heat. The heat emitted by the heating element 112 and conducted to the first conductive element 1113 is conducted to the second conductive element 1114 through the metal layer 1115, thereby realizing the evacuation of the heat of the heating element 112. Among them, the number of the conductive through holes 1116 is determined according to the heat dissipation requirements and functional requirements. The location of the conductive through hole 1116 is determined according to the installation position of the components on the heat dissipation substrate 111, and can be located in the area where the heating element 112 is located, or in the area outside the area where the heating element 112 is located. The metal layer 1115 is a material that is both thermally conductive and electrically conductive, such as at least one or more of metal iron, copper and silver.

[0055] The heat dissipation substrate 111 can be a ceramic substrate or a metal substrate. The ceramic substrate is made of ceramic materials, and the ceramic materials include any one of aluminum nitride (AlN) single-layer board, aluminum nitride (AlN) multi-layer co-fired circuit board, aluminum oxide (Al2O3) single-layer board, aluminum oxide (Al2O3) multi-layer co-fired circuit board, and low-temperature co-fired ceramic multi-layer circuit board. Among them, the thermal conductivity of aluminum nitride (AlN) single-layer board is as high as 170W / (m·K). Compared with the thermal conductivity of traditional flexible circuit boards (<=0.38W / (m·K)), the thermal conductivity of aluminum nitride (AlN) single-layer board is higher. The high thermal conductivity makes the heat dissipation efficiency high, and the single-layer circuit board process is simple and the cost is low; the thermal conductivity of aluminum nitride (AlN) multi-layer co-fired circuit board is as high as 170W / (m·K). The high thermal conductivity makes the heat dissipation efficiency high, and it can be multi-layered, with more wiring. ; The thermal conductivity of alumina (Al2O3) single-layer board is relatively high, reaching 24W / (m·K). The high thermal conductivity makes the heat dissipation efficiency high, and the process of single-layer circuit board is simple and the cost is low; The thermal conductivity of alumina (Al2O3) multi-layer co-fired circuit board is relatively high, reaching 24W / (m·K). The high thermal conductivity makes the heat dissipation efficiency high, and it can take multi-layer lines and have many lines; The thermal conductivity of low-temperature co-fired ceramic multi-layer circuit board is good, reaching 2.5W / (m·K), the process is simple and the cost is low, and the heat dissipation efficiency is high. The metal substrate is made of metal materials, and the metal materials include any one of copper alloy metal substrate, aluminum alloy metal substrate, and stainless steel alloy metal substrate. Among them, the thermal conductivity of copper alloy metal substrate is as high as 385W / (m·K). Compared with the thermal conductivity of traditional flexible circuit board (<=0.38W / (m·K)), the thermal conductivity of copper alloy metal substrate is relatively high, and the high thermal conductivity makes the heat dissipation efficiency high, and it can take single-layer lines and the process is simple. The thermal conductivity of the aluminum alloy metal substrate is as high as 201W / (m·K) and can be used for multi-layer circuits. The high thermal conductivity makes the heat dissipation efficiency high; the thermal conductivity of the stainless steel alloy metal substrate is relatively high, reaching 17W / (m·K), and can be used for single-layer circuits. It has low cost and simple process, and has high heat dissipation efficiency. When a ceramic substrate is used, a first conductive element 1113 can be formed by etching the bearing surface 1111 of the heat dissipation substrate 111, and the heating element 112 is attached to the first conductive element 1113 through conductive silver paste. The heat generated by the heating element 112 is evacuated and absorbed through the first conductive element 1113 and the ceramic substrate; when a metal substrate is used, the heat dissipation substrate 111 is treated with nickel-palladium-gold or chemical nickel-gold to obtain the first conductive element 1113, and the heating element 112 is attached to the first conductive element 1113. The heat generated by the heating element 112 is evacuated and absorbed through the first conductive element 1113 and the metal substrate. Of course, in addition to the above ceramic materials and metal materials, the heat dissipation substrate 111 may also be made of other suitable materials as long as the heat dissipation requirements are met, for example, the thermal conductivity is greater than or equal to 2.5 W / (m·K).The material of the heat dissipation substrate 111 according to the embodiment of the present invention is an aluminum nitride (AlN) single-layer plate.

[0056] The heating element 112 may be a light source 112, which may be a laser emitter, which may be a vertical cavity surface emitting laser (VCSEL), or a LED lamp. In this embodiment, the heating element 112 is a VCSEL. The VCSEL includes a semiconductor substrate and a light emitting element disposed on the substrate. The substrate may be provided with a single light emitting element or an array laser composed of a plurality of light emitting elements. Specifically, the plurality of light emitting elements may be arranged on the substrate in a regular or irregular two-dimensional pattern. Of course, the heating element 112 may also be other electronic components, such as a light detector, a temperature sensor, etc.

[0057] The first conductive element 1113 includes at least one pad 1117, and the light source 112 is disposed on the pad 1117 of the first conductive element 1113 through conductive silver paste. The second conductive element 1114 includes at least one pad 1118, and the circuit board 113 is provided with a via 1132. The reinforcement plate 114 includes a reinforcement body 1142 and a boss 1144 extending from the reinforcement body 1142, and the boss 1144 passes through the via 1132 to contact the heat dissipation substrate 111, wherein the contact includes direct contact and indirect contact, and the boss 1144 of the embodiment of the present invention is in indirect contact with the heat dissipation substrate 111. Specifically, the via 1132 corresponds to the area where the light source 112 is located, for example, the via 1132 can be located in the projection area of ​​the light source 112 on the circuit board 113, and the size of the via 1132 matches the size of the boss 1144 to ensure that the boss 1144 passes through the via 1132 smoothly. The boss 1144 is provided with a via 1132 and connected to the pad 1118 of the second conductive element 1114 through the high-temperature solder paste, so that the boss 1144 is indirectly in contact with the second conductive element 1114 through the solder paste. The high-temperature solder paste has a high thermal conductivity, and can quickly conduct the heat of the heat dissipation substrate 111 to the boss 1144 so that it can be evacuated through the reinforcement plate 114, and the heat dissipation effect is good. The high-temperature solder paste is also resistant to high temperatures, and is not easily affected by the high-temperature environment after connection, and has good bonding stability. In addition, compared with conventional conductive circuits, the areas of the soldering pad 1117 of the first conductive element 1113 and the soldering pad 1118 of the second conductive element 1114 are larger, which is convenient for welding and the connection is relatively firm. The contact area between the soldering pad 1117 of the first conductive element 1113 and the light source 112 is larger, and the contact area between the soldering pad 1118 of the second conductive element 1114 and the boss 1144 is larger. The first conductive element 1113, the heat dissipation substrate 111, the second conductive element 1114 and the reinforcement plate 114 cooperate to quickly dissipate and absorb the heat generated by the light source 112, thereby improving the heat dissipation effect.

[0058] One end of the circuit board 113 is arranged on the connection surface 1112 and covers the area of ​​the second conductive element 1114 outside the area where the boss 1144 is located, and the area can be a solder pad 1118. The circuit board 113 is arranged on the second conductive element 1114 through high-temperature solder paste. The bonding area between the circuit board 113 and the second conductive element 1114 is large, which can ensure the bonding strength, and the high-temperature solder paste is resistant to high temperature and has good bonding stability. The non-emitting source electrical device 116 is arranged on the first conductive element 1113 through high-temperature solder paste. Of course, the connection between the light source 112 and the heat dissipation substrate 111, the connection between the circuit board 113 and the heat dissipation substrate 111, the connection between the boss 1144 and the heat dissipation substrate 111, and the connection between the non-emitting source electrical device 116 and the heat dissipation substrate 111 can all be connected through conductive silver paste, or can all be connected through high-temperature solder paste. Conductive silver paste has good electrical and thermal conductivity, and high-temperature solder paste has low cost. Whether to use conductive silver paste or high-temperature solder paste can be determined based on the heat dissipation requirements, electrical conductivity requirements and costs of different connection positions, thereby saving costs while taking into account both heat dissipation and electrical conductivity. Among them, solder paste is divided into high-temperature solder paste and low-temperature solder paste. High-temperature solder paste has better high-temperature resistance than low-temperature solder paste. Since the heat generated in the connection area between the non-emitting source electrical device 116 and the heat dissipation substrate 111 and the connection area between the circuit board 113 and the heat dissipation substrate 111 is less than the heat generated by the light source 112, the heat dissipation requirement is lower, so low-temperature solder paste can be used for connection. The heat dissipation substrate 111 and the light source 112 of the embodiment of the present invention are connected by conductive silver paste, and the heat dissipation substrate 111 and the circuit board 113, the non-emitting source electrical device 116, and the boss 1144 are connected by high-temperature solder paste, thereby achieving better electrical conductivity, heat dissipation effect and connection stability. A connector 115 is provided at the other end of the circuit board 113, and the connector 115 can connect the structured light projection module 10 to Figure 1 The motherboard of the electronic device 1000 in the embodiment. The circuit board 113 is mounted on the pad 1118 by surface mount technology (SMT), which has low processing difficulty, high bonding yield and easy automation. The circuit board 113 is electrically connected to the second conductive element 1114, so that the circuit board 113 and the light source 112 can be electrically connected through the cooperation of the second conductive element 1114, the metal layer 1115 and the first conductive element 1113 to realize the control of the light source 112. The circuit board 113 can be any one of a printed circuit board, a flexible circuit board, and a hard-soft board.

[0059] The reinforcing body 1142 of the reinforcing plate 114 is provided with a plurality of heat dissipation through holes 1146, that is, the heat dissipation through holes 1146 are located in an area outside the area where the boss 1144 is located. The reinforcing plate 114 is arranged on the surface of the circuit board 113 opposite to the connection surface 1112, that is, the circuit board 113 is located between the connection surface 1112 and the reinforcing plate 114, and the reinforcing plate 114 can strengthen the strength of the connection area between the circuit board 113 and the heat dissipation substrate 111. The heat dissipation through holes 1146 correspond to the circuit board 113 and the light source 112, which can be: the heat dissipation through holes 1146 only correspond to the area on the circuit board 113 that is directly opposite to the light source 112, or it can be: the heat dissipation through holes 1146 correspond to the entire area where the circuit board 113 is connected to the heat dissipation substrate 111, so as to quickly conduct and evacuate the heat generated by the light source 112. The number of heat dissipation through holes 1146 is determined according to the strength requirements, weight reduction requirements and heat dissipation requirements of the circuit board assembly 11. The reinforcing plate 114 can be made of metal, such as copper, iron, or copper alloy, etc., which is easy to process and has good thermal conductivity. Of course, the reinforcing plate 114 can also be made of other materials, as long as it meets the strength requirements and heat dissipation requirements. The reinforcing plate 114 in the embodiment of the present invention is a copper alloy reinforcing plate. The boss 1144 is formed by etching or laser engraving on the surface of the reinforcing plate 114 opposite to the circuit board 113, and the process is simple. The boss 1144 can also be formed by other processes, for example, the boss 1144 is formed by a stamping and forging process ( Figure 7 ), high strength, boss 1144 is formed by stamping process ( Figure 8 It has high processing precision, high strength and light weight.

[0060] See also Figure 2 , Figure 4 , Figure 5 and Figure 6 The non-emitting source electrical device 116 may be a thermistor 116, which is disposed on the bearing surface 1111 and electrically connected to the first conductive element 1113, the first conductive element 1113 is electrically connected to the second conductive element 1114, and the circuit board 113 is electrically connected to the second conductive element 1114, so that the thermistor 116 is electrically connected to the circuit board 113. When the light source 112 generates heat during operation, the thermistor 116 detects the temperature of the heat dissipation substrate 111 in real time, and the processor 30 controls the working power of the light source 112 according to the temperature. For example, when the temperature is too high, the power of the light source 112 is reduced to prevent the circuit board assembly 11 from being damaged by the excessive temperature.

[0061] When the circuit board assembly 11 is working, the light source 112 generates heat, which is conducted to the heat dissipation substrate 111 through the first conductive element 1113, and then to the second conductive element 1114 through the metal layer 1115 and the heat dissipation substrate 111. Then, the second conductive element 1114 conducts the heat to the boss 1144, so that the heat is quickly dissipated through the reinforcing plate 114. Since the first conductive element 1113, the heat dissipation substrate 111, the metal layer 1115, the second conductive element 1114 and the reinforcing plate 114 all have good thermal conductivity, the heat conduction effect is good, so that the heat of the light source 112 is quickly dissipated, and the heat dissipation efficiency is high.

[0062] Please refer again Figure 3 The lens barrel 12 is carried on the circuit board assembly 11 and forms a receiving cavity 121 together with the circuit board assembly 11. One end of the circuit board 113 is arranged on the bearing surface 1111 of the heat dissipation substrate 111 and is located outside the lens barrel 12. The other end of the circuit board 113 is connected to the connector 115. The connector 115 can connect the structured light projection module 10 to the Figure 1 On the main board of the electronic device 1000 in the embodiment. The material of the lens barrel 12 can be plastic, and the light source 112 and the optical component 13 are both contained in the containing cavity 121. The light source 112 is used to emit laser. The optical component 13 is used to diffract the laser to form a laser pattern. The optical component 13 may include a collimating element 131 and a diffractive element 132 (Diffractive Optical Elements, DOE). The collimating element 131 is used to converge or collimate the laser emitted by the light source 112, and a diffraction structure capable of diffracting the laser after passing through the collimating element 131 is formed on the diffraction element 132. When the structured light projection module 10 is working, the laser emitted by the VCSEL passes through the collimating element 131 and the diffraction element 132 in sequence, and then projects a laser pattern outward.

[0063] In summary, the circuit board assembly 11 of the embodiment of the present invention arranges the heating element 112 on the bearing surface 1111 of the heat dissipation substrate 111, arranges the circuit board 113 on the connecting surface 1112 of the heat dissipation substrate 111 and opens a via hole 1132 on the circuit board 113 so that the boss 1144 passes through the via hole 1132 and is connected to the connecting surface 1112, thereby conducting and dissipating the heat of the heating element 112 through the heat dissipation substrate 111 and the reinforcement plate 114, and the heat dissipation effect is good.

[0064] In some embodiments, heat-conducting materials such as heat-conducting adhesive may be disposed inside the conductive through holes 1116 and the heat-dissipating through holes 1146. In this way, the heat dissipation speed may be accelerated and the heat dissipation effect may be improved.

[0065] See also Fig. 9In other embodiments, the optoelectronic module 10 may be a camera module. The camera module may be a visible light camera module or an infrared camera module. The camera module includes a circuit board assembly 11, a lens barrel 12, and an optical assembly 13. At this time, the heating element 112 may be a complementary metal oxide semiconductor (CMOS) image sensor chip or a charge coupled device (CCD) image sensor chip, and the lens barrel 12 is carried on the circuit board assembly 11 and forms a receiving cavity 121 together with the circuit board assembly 11. The connection method between the lens barrel 12 and the circuit board assembly 11 includes gluing and snapping. The image sensor chip 112 and the optical assembly 13 are both accommodated in the lens barrel 12. The optical assembly 13 includes a lens 133, and the image sensor chip 112 is arranged on the image side of the lens 133. Specifically, the optical axis of the optical assembly 13 coincides with the center normal of the image sensor chip 112. When the optoelectronic module 10 is working, the light reflected by the target object passes through the optical component 13 and forms an image on the image sensor chip 112. In this embodiment, the lens 133 can be a single lens, which is a convex lens or a concave lens; or multiple lenses, which can all be convex lenses or concave lenses, or some can be convex lenses and some can be concave lenses.

[0066] Please continue reading Fig. 9 , further, the optical assembly 13 also includes a filter 134, such as an infrared cut-off filter (in this case, the optoelectronic module 10 is a visible light camera module), the filter 134 is used to adjust the wavelength range of the imaging light, specifically to filter out the infrared light in the natural light so that it cannot enter the circuit board assembly 11, thereby preventing the infrared light from affecting the image color and clarity formed by the visible light imaging. Of course, the filter 134 can also be an infrared pass filter (in this case, the optoelectronic module 10 is an infrared camera module), the filter 134 is used to adjust the wavelength range of the imaging light, specifically to allow only infrared light to enter the circuit board assembly 11 (prevent visible light from entering the circuit board assembly 11), so as to ensure the image color and clarity formed by the infrared light imaging. The filter 134 is accommodated in the accommodating cavity 121 and is arranged between the circuit board assembly 11 and the optical assembly 13. When the optoelectronic module 10 is working, the light reflected by the target object enters the optoelectronic module 10, passes through the lens 133 and the filter 134 in sequence, and forms an image on the image sensor chip 112.

[0067] See also Figure 1 The present invention further provides an electronic device 1000, which may include Fig. 9In other words, the optoelectronic module 10 of the camera module can also be applied to the electronic device 1000. At this time, the optoelectronic module 10 can be used to obtain visible light images or infrared light images, etc.

[0068] Similarly, the electronic device 1000, optoelectronic module 10, and circuit board assembly 11 of the embodiment of the present invention are configured such that the heat of the heating element 112 is disposed on the bearing surface 1111 of the heat dissipation substrate 111, the circuit board 113 is disposed on the connecting surface 1112 of the heat dissipation substrate 111, and a via hole 1132 is provided on the circuit board 113 so that the boss 1144 passes through the via hole 1132 and is connected to the connecting surface 1112, thereby conducting and dissipating the heat of the heating element 112 through the heat dissipation substrate 111 and the reinforcement plate 114, thereby achieving a good heat dissipation effect.

[0069] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0070] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, unless otherwise clearly and specifically defined.

[0071] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that: The circuit board assembly comprises: A heat dissipation substrate, the heat dissipation substrate comprising a bearing surface and a connection surface opposite to the bearing surface, a first conductive element is formed on the bearing surface, a second conductive element is formed on the connection surface, and the heat dissipation substrate is a circuit board; a heating element, the heating element being disposed on the bearing surface and electrically connected to the first conductive element; A circuit board, the circuit board is arranged on the connection surface and is electrically connected to the second conductive element, the circuit board is provided with a via hole, and the via hole is opposite to the heating element; and a heat-conducting reinforcing plate, the reinforcing plate being arranged on a surface of the circuit board opposite to the connecting surface, the reinforcing plate comprising a reinforcing body and a boss extending from the reinforcing body, the boss passing through the via hole and contacting the heat dissipation substrate, The heat dissipation substrate is provided with a plurality of conductive through holes, the inner walls of the conductive through holes are provided with a metal layer, the first conductive element is electrically connected to the second conductive element through the metal layer, one end of the circuit board is provided on the connection surface and is electrically connected to the second conductive element, The boss is arranged corresponding to the conductive through hole of the heat dissipation substrate, The reinforcing plate is connected to the circuit board by adhesive; When the second conductive element is connected between the heat dissipation substrate and the circuit board, it is also used to separate the heat dissipation substrate and the circuit board.

2. The circuit board assembly according to claim 1, characterized in that: The first conductive element includes a pad, and the heating element is arranged on the pad of the first conductive element.

3. The circuit board assembly according to claim 2, characterized in that: The heating element is mounted on the pad of the first conductive element through conductive silver paste.

4. The circuit board assembly according to claim 2, characterized in that: The circuit board assembly further includes a non-emitting source electrical component, and the non-emitting source electrical component is disposed on the first conductive element by solder paste.

5. The circuit board assembly according to claim 1, characterized in that: The second conductive element includes a pad, the boss is arranged on the pad of the second conductive element, and the boss corresponds to the heating element.

6. The circuit board assembly according to claim 5, characterized in that: The boss is arranged on the pad of the second conductive element through solder paste.

7. The circuit board assembly according to claim 1, characterized in that: The circuit board is arranged on the second conductive element through solder paste.

8. The circuit board assembly according to claim 1, wherein: The heat dissipation substrate includes a ceramic substrate or a metal substrate.

9. The circuit board assembly according to claim 1, characterized in that: The thermal conductivity of the heat dissipation substrate is greater than or equal to 2.5 W / m·K.

10. The circuit board assembly according to claim 1, characterized in that: The reinforcing plate is further provided with a plurality of heat dissipation through holes, and the heat dissipation through holes are located in an area outside the area where the boss is located.

11. A photoelectric module, characterized in that: include: The circuit board assembly according to any one of claims 1 to 10; and An optical component is disposed on the circuit board assembly, and the optical component corresponds to the circuit board assembly.

12. A depth camera, characterized in that: include: The optoelectronic module of claim 11, wherein the heating element is a light source and is used to emit laser light, and the optical assembly includes a beam generator disposed on the circuit board assembly, the beam generator corresponds to the light source at intervals and is used to convert the laser light into a laser pattern; An image collector, the image collector is used to collect the laser pattern projected by the optoelectronic module; and A processor is connected to the optoelectronic module and the image collector respectively, and is used to process the laser pattern to obtain a depth image.

13. An electronic device, characterized in that: include: case; and The depth camera of claim 12, wherein the depth camera is disposed within the housing and exposed from the housing to acquire a depth image.

Images