Solder ball welding ball distribution mechanism

Abstract

The present invention provides a solder ball welding ball distribution mechanism, including a lower substrate, a ball distribution disc, a rotating shaft, a rotating motor, a first rotating member, a second rotating member and a synchronous member, the lower substrate is provided with a lower laser hole and a ball drop channel for laser to pass through, one end of the ball drop channel forms a ball drop entrance on the upper surface of the lower substrate, and the other end of the ball drop channel is connected with the lower laser hole inside the lower substrate, the ball distribution disc is arranged on the upper surface of the lower substrate, the ball distribution disc is provided with a plurality of ball distribution holes along the circumferential direction, the ball drop entrance is directly opposite to the circumferential line where the ball distribution holes are located, the rotating shaft is coaxially connected with the ball distribution disc, the output shaft of the rotating motor is staggered with the rotating shaft, the output shaft of the rotating motor is connected with the first rotating member, the second rotating member is coaxially sleeved on the rotating shaft, and the synchronous member is wound around the first rotating member and the second rotating member. The present invention reduces the occupation of the space centered on the ball distribution disc, speeds up the ball distribution speed of the solder ball, and improves the efficiency of solder ball laser welding.

Description

Technical Field

[0001] The invention relates to the technical field of solder ball welding, and in particular to a solder ball welding ball separation mechanism. Background Art

[0002] At present, soldering is very popular in industrial production. With the development of technology and the rapid increase in labor costs, automatic solder ball soldering equipment has replaced the traditional manual soldering method of electric soldering irons and become the main direction of soldering technology development.

[0003] like Figure 1 As shown, in the existing solder ball automatic welding equipment 200, the motor 201 is coaxially installed with the ball dividing disc 202, and the motor 201 occupies a large space centered on the ball dividing disc 202, while the laser device 203 needs to avoid the motor 201 and be installed at a position far away from the ball dividing disc 202, resulting in a large distance D1 between the laser hole 204a in the lower substrate 204 for the laser emitted by the laser device 203 to pass through and the central axis of the ball dividing disc 202, and the laser hole 204a and the ball dividing hole 202 of the ball dividing disc 202. The distance D2 of a is large, resulting in a larger ball separation distance for the solder ball to be transported from the ball separation hole 202a to the laser hole 204a, which leads to a slower ball separation speed and affects the efficiency of solder ball laser welding; if the diameter of the ball separation disc 202 is increased to reduce the distance between the laser hole 204a and the ball separation hole 202a of the ball separation disc 202, the friction between the ball separation disc 202 and the lower substrate 204 will increase, reducing the service life of the ball separation disc 202. The ball separation disc 202 needs to be replaced frequently, which increases the use cost of the ball separation disc 202.

[0004] Therefore, there is an urgent need for a solder ball welding ball distribution mechanism that can accelerate the ball distribution speed and increase the service life of the ball distribution disc. Summary of the invention

[0005] The object of the present invention is to provide a solder ball welding ball separation mechanism which can accelerate the ball separation speed and increase the service life of the ball separation disc.

[0006] To achieve the above-mentioned purpose, the present invention provides a tin ball welding ball dividing mechanism, including a lower substrate, a ball dividing disc, a rotating shaft, a rotating motor, a first rotating member, a second rotating member and a synchronous member, the lower substrate is provided with a lower laser hole and a ball falling channel for laser to pass through, one end of the ball falling channel forms a ball falling entrance on the upper surface of the lower substrate, and the other end of the ball falling channel is connected with the lower laser hole inside the lower substrate, the ball dividing disc is arranged on the upper surface of the lower substrate, the ball dividing disc is provided with a plurality of ball dividing holes along the circumferential direction, the ball falling entrance is directly opposite to the circumferential line where the ball dividing holes are located, the rotating shaft is coaxially connected to the ball dividing disc, the output shaft of the rotating motor is staggered with the rotating shaft, the output shaft of the rotating motor is connected to the first rotating member, the second rotating member is coaxially sleeved on the rotating shaft, the synchronous member is wound around the first rotating member and the second rotating member, and the first rotating member and the second rotating member are driven to rotate synchronously by the rotating motor, so that the rotation drives the ball dividing disc to rotate.

[0007] Preferably, the first rotating member and the second rotating member are synchronous wheels, and the synchronous members are synchronous belts or chains.

[0008] Preferably, it further comprises a laser device, wherein the laser device is located above the lower substrate, and the laser emitting end of the laser device faces the lower laser hole.

[0009] Preferably, the upper surface of the lower substrate is provided with a slag discharge groove spaced apart from the ball falling inlet, and the slag discharge groove is directly opposite to the circumference line of the ball dividing hole, so that the solder balls in the ball dividing hole that have not fallen into the ball falling inlet can fall into the slag discharge groove by rotating the ball dividing disc.

[0010] Preferably, a slag discharge channel is provided inside the lower base plate, and one end of the slag discharge channel is communicated with the slag discharge notch.

[0011] Preferably, the other end of the slag discharge channel forms a slag discharge outlet on the side wall of the lower base plate.

[0012] Preferably, a vacuum generating device is further included, wherein the vacuum generating device is arranged at the slag discharge outlet and is used to evacuate the slag discharge channel.

[0013] Preferably, it also includes an upper substrate, the upper substrate, the ball dividing disc and the lower substrate are arranged in sequence along the up and down direction, the upper substrate is provided with upper laser holes and a ball supply channel which are arranged at intervals, the upper laser hole is connected with the lower laser hole, the ball supply channel forms a ball outlet on the lower surface of the upper substrate, and the ball outlet is directly opposite to the circumference line where the ball dividing hole is located.

[0014] Preferably, the upper base plate is provided with an air blowing hole, and the air blowing hole is arranged opposite to the slag discharge notch.

[0015] Preferably, it further comprises an air blowing device, wherein the output end of the air blowing device is connected to the air blowing hole and is used for blowing air into the air blowing hole.

[0016] Compared with the prior art, the solder ball welding ball dividing mechanism of the present invention drives the first rotating part through a rotating motor, and drives the second rotating part to rotate synchronously under the synchronous transmission action of the synchronous part, so that the second rotating part drives the rotating shaft to rotate together with the ball dividing disc. Since the output shaft of the rotating motor and the rotating shaft are staggered, the occupation of the space centered on the ball dividing disc is reduced, so that the laser device can be set at a position close to the ball dividing disc and the distance between the lower laser hole and the ball falling entrance can be reduced, thereby reducing the wire diameter of the solder ball transported from the ball falling entrance to the lower laser hole, accelerating the solder ball dividing speed, and improving the efficiency of solder ball laser welding; at the same time, the diameter size of the ball dividing disc can be reduced to reduce the pressure of the ball dividing disc on the lower substrate, thereby reducing the friction force on the ball dividing disc, and further increasing the service life of the ball dividing disc. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of existing solder ball automatic welding equipment.

[0018] Figure 2 It is a three-dimensional structural schematic diagram of the solder ball welding ball distribution mechanism of the present invention.

[0019] Figure 3 It is a three-dimensional cross-sectional view of the solder ball welding ball distribution mechanism of the present invention.

[0020] Figure 4 yes Figure 3 Enlarged view of point A in the middle.

[0021] Figure 5 It is a schematic diagram of the three-dimensional structure of the solder ball welding ball distribution mechanism of the present invention after removing the upper substrate.

[0022] Figure 6 The present invention is a schematic structural diagram of a ball-distributing disc of a solder ball welding ball-distributing mechanism.

[0023] Figure 7 It is a structural schematic diagram of the lower substrate of the solder ball welding ball distribution mechanism of the present invention.

[0024] Figure 8 It is a three-dimensional cross-sectional view of another cross section of the solder ball welding ball distribution mechanism of the present invention.

[0025] Fig. 9 yes Figure 8 Enlarged view of point B in the middle. DETAILED DESCRIPTION

[0026] In order to explain the technical content and structural features of the present invention in detail, further description will be given below in combination with the implementation modes and the accompanying drawings.

[0027] See also Figures 2 to 5 The solder ball welding ball distribution mechanism 100 of the present invention includes a lower substrate 1, a ball distribution disc 2, a rotating shaft 3, a rotating motor 4, a first rotating member 41, a second rotating member 42 and a synchronous member 43. The lower substrate 1 is provided with a lower laser hole 11 and a ball drop channel 12 for laser to pass through. One end of the ball drop channel 12 forms a ball drop entrance 121 on the upper surface of the lower substrate 1, and the other end of the ball drop channel 12 is connected with the lower laser hole 11 inside the lower substrate 1. Specifically, a mounting member 16 is provided at the bottom of the lower substrate 1, and the lower laser hole 11 and the ball drop channel 12 respectively penetrate the mounting member 16 and the lower substrate 1, but it is not limited to this. For example, only the lower substrate 1 may be provided; the ball distribution disc 2 is provided on the upper surface of the lower substrate 1, and the ball distribution disc 2 is provided along A plurality of ball-distributing holes 21 are provided in the circumferential direction, and the ball-dropping entrance 121 is directly opposite to the circumferential line of the ball-distributing holes 21. The rotating shaft 3 is coaxially connected to the ball-distributing disc 2, and the output shaft of the rotating motor 4 is staggered with the rotating shaft 3. The output shaft of the rotating motor 4 is connected to the first rotating member 41, and the second rotating member 42 is coaxially sleeved on the rotating shaft 3. The synchronous member 43 is wound around the first rotating member 41 and the second rotating member 42. The rotating motor 4 drives the first rotating member 41 and the second rotating member 42 to rotate synchronously, so that the rotation drives the ball-distributing disc 2 to rotate. The rotating motor 4 can be positioned by an existing positioning mechanism (not shown in the figure). Figure 5 In the figure, D3 represents the distance between the lower laser hole 11 and the central axis of the ball dividing disc 2, and D4 represents the distance between the lower laser hole 11 and the ball dividing hole 21 of the ball dividing disc 2. Since the output shaft of the rotating motor 4 is staggered with the rotating shaft 3, the space occupied by the ball dividing disc 2 as the center is reduced, so that the laser device 5 can be arranged at a position close to the ball dividing disc 2, which can reduce the distance D3 between the lower laser hole 11 and the central axis of the ball dividing disc 2, and reduce the distance D4 between the lower laser hole 11 and the ball falling inlet 121, thereby reducing the wire diameter of the solder ball transported from the ball falling inlet 121 to the lower laser hole 11, accelerating the solder ball separation speed, and improving the efficiency of solder ball laser welding.

[0028] See also Figure 3 and Figure 6, the ball-distributing disc 2 is provided with a socket 22, and the rotating shaft 3 is plugged into the socket 22. Specifically, a plug-in block 31 is provided at the bottom of the rotating shaft 3, and the plug-in block 31 is provided with a plug-in pin 32, and the rotating shaft 3 is plugged into the socket 22 through the plug-in pin 32 of the plug-in block 31. The rotating motor 4 drives the first rotating member 41 and the second rotating member 42 to rotate synchronously, so that the rotation drives the ball-distributing disc 2 to rotate. When the ball-distributing hole 21 of the ball-distributing disc 2 rotates to a position corresponding to the ball-dropping inlet 121, the solder ball in the ball-distributing hole 21 of the ball-distributing disc 2 can fall into the ball-dropping inlet 121, and flow into the ball-dropping channel 12 and the lower laser hole 11 in turn, thereby realizing ball supply.

[0029] See also Figure 2 In this embodiment, the first rotating member 41 and the second rotating member 42 are synchronous wheels, and the synchronous member 43 is a synchronous belt. The rotary motor 4 drives the first rotating member 41 to rotate, and the second rotating member 42 is driven to rotate synchronously under the synchronous transmission of the synchronous belt, so that the second rotating member 42 drives the rotating shaft 3 to rotate together with the ball-distributing disc 2. However, this is not limited to this. For example, the first rotating member 41 and the second rotating member 42 can be sprockets, and the synchronous member 43 is a chain. The sprocket and the chain cooperate to realize that the rotation of the first rotating member 41 drives the rotation of the second rotating member 42.

[0030] See also Figures 7 to 9The upper surface of the lower substrate 1 is provided with a slag discharge notch 13 spaced from the ball drop inlet 121. The slag discharge notch 13 is opposite to the circumference of the ball separation hole 21. The ball separation disc 2 rotates so that the solder balls in the ball separation hole 21 that do not fall into the ball drop inlet 121 fall into the slag discharge notch 13. Specifically, the slag discharge notch 13 is an arc-shaped groove, which is also opposite to the circumference of the ball separation hole 21, and fully ensures that the solder balls in the ball separation hole 21 that do not fall into the drop inlet fall into the slag discharge notch 13. When the solder balls in the ball separation hole 21 of the ball separation disc 2 do not effectively fall into the drop inlet and are taken away by the ball separation disc 2, the ball separation disc 2 is driven to rotate so that the solder balls in the ball separation hole 21 that do not fall into the drop inlet fall into the slag discharge notch 13, thereby automatically cleaning the residual solder balls. Further, a slag discharge channel 14 is provided inside the lower substrate 1, and one end of the slag discharge channel 14 is connected to the slag discharge notch 13, so that the solder ball falling into the slag discharge notch 13 can fall into the slag discharge channel 14; the other end of the slag discharge channel 14 forms a slag discharge outlet 15 on the side wall of the lower substrate 1, so that the solder ball located in the slag discharge channel 14 can be discharged from the slag discharge outlet 15. In other embodiments, the slag discharge outlet 15 can also be formed at the bottom of the lower substrate 1. However, this is not limited to this. For example, the lower substrate 1 can only be provided with a slag discharge notch 13, and the depth of the slag discharge notch 13 is greater than the diameter of the solder ball to ensure that the solder ball does not rub against the lower substrate 1. The residual solder ball is stored through the slag discharge notch 13, and the shape of the slag discharge notch 13 can be a long groove. In order to clean the residual solder ball more conveniently and quickly, the solder ball welding ball separation mechanism 100 of the present invention is also provided with a vacuum generating device 7, which is provided at the slag discharge outlet 15 and is used to vacuum the slag discharge channel 14. The slag discharge channel 14 is evacuated by the vacuum generating device 7 , so that the slag discharge channel 14 forms a vacuum and the solder balls in the slag discharge channel 14 are sucked away.

[0031] See also Figure 3 , Figure 4 and Figure 8The solder ball welding ball distribution mechanism 100 of the present invention further includes an upper substrate 8, wherein the upper substrate 8, the ball distribution disc 2 and the lower substrate 1 are arranged in sequence along the up-down direction, and the upper substrate 8 is provided with an upper laser hole 81 and a ball supply channel 82 arranged at intervals, wherein the upper laser hole 81 is connected to the lower laser hole 11, and the ball supply channel 82 forms a ball outlet 821 on the lower surface of the upper substrate 8, and the ball outlet 821 is directly opposite to the circumference line where the ball distribution hole 21 is located; the ball supply channel 82 forms a ball inlet 822 on the upper surface of the upper substrate 8, but it is not limited thereto, in other embodiments, the ball inlet 822 can also be formed on the side wall of the upper substrate 8. Specifically, the solder ball welding ball distribution mechanism 100 of the present invention is further provided with an air blowing device (not shown in the figure) and a ball storage cylinder 84, and the upper substrate 8 is provided with an air blowing hole 83, and the air blowing hole 83 is arranged opposite to the slag discharge notch 13. The output end of the air blowing device (not shown in the figure) is connected to the air blowing hole 83 and is used to blow air to the air blowing hole 83. The blowing device blows air to the blowing hole 83, and the solder balls remaining in the ball-distributing hole 21 of the ball-distributing disc 2 are blown to the slag discharge slot 13 and fall from the slag discharge slot 13 to the slag discharge channel 14, thereby improving the cleaning efficiency of the residual solder balls. The ball storage barrel 84 is installed on the upper base plate 8 and connected to the ball-distributing slot 822, and the ball storage barrel 84 is used to supply the ball-distributing slot 822.

[0032] See also Figure 2 and Figure 3 The solder ball welding ball distribution mechanism 100 of the present invention also includes a laser device 5 and a welding nozzle 6. The laser device 5 is located above the lower substrate 1 and the upper substrate 8. The laser emitting end of the laser device 5 is directly opposite to the lower laser hole 11 and the upper laser hole 81. The welding nozzle 6 is installed below the lower substrate 1. Specifically, the welding nozzle 6 is installed on the mounting member 16 at the bottom of the lower substrate 1. The welding channel 61 of the welding nozzle 6 is connected to the lower laser hole 11, and the welding channel 61 of the welding nozzle 6 is located below the lower laser hole 11. The solder ball can fall into the welding channel 61 from the lower laser hole 11, and then the laser device 5 emits laser in the direction of the upper laser hole 81, thereby realizing laser welding.

[0033] Combination Figures 1 to 9 The specific working principle of the solder ball welding ball distribution mechanism 100 of the present invention is as follows:

[0034] The solder balls in the ball storage cylinder 84 enter the ball supply channel 82 through the ball inlet 822 of the upper substrate 8, and the rotating motor 4 drives the first rotating member 41 and the second rotating member 42 to rotate synchronously, so that the rotation drives the ball distributing disc 2 to rotate, so that the solder balls located in the ball supply channel 82 fall into the ball distributing holes 21 of the ball distributing disc 2 through the ball outlet 821 respectively. When one of the ball distributing holes 21 of the ball distributing disc 2 rotates to correspond to the ball dropping inlet 121 of the lower substrate 1, the solder balls located in the ball distributing holes 21 can fall into the ball dropping inlet 121, and the solder balls fall into the ball dropping inlet 121 in sequence. The channel 12, the lower laser hole 11 and the welding channel 61 emit laser through the laser device 5, thereby realizing solder ball laser welding; when the solder balls in the ball dividing hole 21 of the ball dividing disc 2 do not effectively fall into the blanking entrance and are taken away by the ball dividing disc 2, the ball dividing disc 2 continues to be driven to rotate, so that the solder balls remaining in the ball dividing hole 21 that have not fallen into the blanking entrance fall into the slag discharge groove 13, and fall into the slag discharge channel 14 from the slag discharge groove 13, and the vacuum generating device 7 vacuumizes the slag discharge channel 14, thereby quickly extracting the remaining solder balls to realize the cleaning of the remaining solder balls.

[0035] In summary, the solder ball welding ball dividing mechanism 100 of the present invention drives the first rotating member 41 through the rotating motor 4, and drives the second rotating member 42 to rotate synchronously under the synchronous transmission action of the synchronous member 43, so that the second rotating member 42 drives the rotating shaft 3 to rotate together with the ball dividing disc 2. Since the output shaft of the rotating motor 4 and the rotating shaft 3 are staggered, the occupation of the space centered on the ball dividing disc 2 is reduced, so that the laser device 5 can be set at a position close to the ball dividing disc 2 and the distance between the lower laser hole 11 and the ball falling inlet 121 can be reduced, thereby reducing the wire diameter of the solder ball transported from the ball falling inlet 121 to the lower laser hole 11, accelerating the solder ball dividing speed, and improving the efficiency of solder ball laser welding; at the same time, the diameter size of the ball dividing disc 2 can be reduced to reduce the pressure of the ball dividing disc 2 on the lower substrate 1, thereby reducing the friction force on the ball dividing disc 2, and further increasing the service life of the ball dividing disc 2.

[0036] The above disclosure is only a preferred embodiment of the present invention, which cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention are all within the scope of the present invention.

Claims

1. A solder ball welding ball distribution mechanism, characterized in that: The invention comprises a lower base plate, an upper base plate, a ball dividing disc, a rotating shaft, a rotating motor, a first rotating member, a second rotating member and a synchronous member, wherein the lower base plate is provided with a lower laser hole and a ball falling channel for laser to pass through, one end of the ball falling channel forms a ball falling entrance on the upper surface of the lower base plate, and the other end of the ball falling channel is connected with the lower laser hole inside the lower base plate, the ball dividing disc is arranged on the upper surface of the lower base plate, the ball dividing disc is provided with a plurality of ball dividing holes along the circumferential direction, the ball falling entrance is directly opposite to the circumferential line where the ball dividing holes are located, the rotating shaft is coaxially connected with the ball dividing disc, the output shaft of the rotating motor is staggered with the rotating shaft, the output shaft of the rotating motor is connected with the first rotating member, the second rotating member is coaxially sleeved on the rotating shaft, and the synchronous member is wound around the first rotating member and the second On the rotating part, the rotating motor drives the first rotating part and the second rotating part to rotate synchronously, so that the rotation drives the ball dividing disc to rotate; the first rotating part and the second rotating part are synchronous wheels, and the synchronous part is a synchronous belt or a chain; the upper surface of the lower substrate is provided with a slag discharge groove spaced apart from the ball falling inlet, and the slag discharge groove is opposite to the circumference of the ball dividing hole, and the ball dividing disc is rotated to make the solder balls in the ball dividing hole that have not fallen into the ball falling inlet fall into the slag discharge groove; the upper substrate, the ball dividing disc and the lower substrate are arranged in sequence along the up and down directions, and the upper substrate is provided with upper laser holes and ball supply channels arranged at intervals, the upper laser holes are connected with the lower laser holes, and the ball supply channel forms a ball outlet on the lower surface of the upper substrate, and the ball outlet is opposite to the circumference of the ball dividing hole.

2. The solder ball welding ball distribution mechanism according to claim 1, characterized in that: It also includes a laser device, which is located above the lower substrate, and the laser emitting end of the laser device is facing the lower laser hole.

3. The solder ball welding ball distribution mechanism according to claim 1, characterized in that: A slag discharge channel is provided inside the lower base plate, and one end of the slag discharge channel is communicated with the slag discharge notch.

4. The solder ball welding ball distribution mechanism according to claim 3, characterized in that: The other end of the slag discharge channel forms a slag discharge outlet on the side wall of the lower substrate.

5. The solder ball welding ball distribution mechanism according to claim 4, characterized in that: It also includes a vacuum generating device, which is arranged at the slag discharge outlet and is used to evacuate the slag discharge channel.

6. The solder ball welding ball distribution mechanism according to claim 1, characterized in that: The upper base plate is provided with an air blowing hole, and the air blowing hole is arranged opposite to the slag discharge notch.

7. The solder ball welding ball distribution mechanism according to claim 6, characterized in that: It also includes an air blowing device, the output end of which is connected to the air blowing hole and is used for blowing air into the air blowing hole.

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