Photosensitive Component, Camera Module and Manufacturing Method Thereof

Abstract

The present invention provides a photosensitive component, comprising: a photosensitive chip having a photosensitive area and a non-photosensitive area surrounding the photosensitive area, wherein the non-photosensitive area is provided with a plurality of chip electrodes; an extension layer, which is located on the side of the photosensitive chip and in contact with the photosensitive chip, and has a surface flush with the front of the photosensitive chip; and a redistribution layer, which is formed on the front of the extension layer and the photosensitive chip; the redistribution layer has a plurality of redistribution layer electrodes, and the plurality of redistribution layer electrodes are connected to the plurality of chip electrodes in a one-to-one correspondence through redistribution layer wiring. The present invention also provides a corresponding manufacturing method and camera module. The present invention can achieve high-density packaging of the photosensitive chip of the camera module; it can achieve the camera module using a conventional printed circuit board to implement a flip-chip process to achieve packaging with a high I / O count.

Description

Technical Field

[0001] The present invention relates to the field of optical technology, and in particular to a photosensitive component, a camera module and a manufacturing method thereof. Background Art

[0002] With the rapid development of smart phones and other electronic devices, as mobile phone screens are becoming more and more full-screen and thinner, the demand for miniaturization of camera modules is becoming increasingly strong.

[0003] A camera module typically includes an optical lens assembly and a photosensitive assembly. The photosensitive assembly typically includes a circuit board and a photosensitive chip 103 mounted on the circuit board. In existing camera modules, the photosensitive chip 103 is typically connected to the circuit layer through a "wire bond" (wire bonding) process or a flip chip (flip chip) process.

[0004] Traditional printed circuit boards (PCBs) are limited by current requirements, circuit heating caused by the PCB material, and PCB manufacturing process capabilities. Consequently, typical PCB line widths and spacings are around 70μm. Under extreme process capabilities, 30μm is possible, but this is very costly. Consequently, due to the limitations of traditional PCB line widths and spacing, chip conduction also requires consideration of the PCB's layout, preventing further reductions in pad pitch. This is contrary to the trend of continuous chip miniaturization. Furthermore, as chip pads become increasingly dense, the spacing is approaching its limit. In the wire bond process, this high density of gold wires can easily lead to interference between gold wires, causing circuit failures. Furthermore, the wire bond process is followed by a series of subsequent steps in the manufacturing process, such as molding and mounting, which can affect the reliability of the gold wire connections. Furthermore, gold wires have a certain arc height, so additional height is often added to the module to accommodate them. Consequently, the presence of gold wires can hinder module miniaturization.

[0005] Currently, some manufacturers are using the flip chip process to address a number of issues associated with gold wires. For example, in the flip chip process, the chip is directly attached to the underside of the circuit board, and then the connection between the chip and the circuit board is achieved through gold bumps. This process significantly shortens the conductive path between the circuit board and the photosensitive chip, reducing latency and effectively improving electrical performance. However, the flip chip process has high requirements for conductive accuracy and flatness, requiring the use of a high-strength, non-bending ceramic substrate for the circuit board (i.e., circuit board), which is very expensive. Furthermore, this process requires the circuit board's pad size and density to be consistent or nearly consistent with those of the photosensitive chip. Generally speaking, due to process limitations, the minimum size of the circuit board's pads is limited, and the gold ball bump line width is relatively large, such as around 100 μm. To accommodate the flip chip process, the size of the photosensitive chip's pads is difficult to further reduce to match the circuit board's pad size. This reduces the number of pads that can be placed on the photosensitive chip, or increasing the number of pads will increase the size of the photosensitive chip, which is not conducive to reducing the size of the camera module. This is because the higher the pixel count of the photosensitive chip, the greater the amount of image data required to be output, which requires more I / O ports to output data. Fewer pads means fewer I / O ports for outputting data. Therefore, the existing flip chip process is not conducive to increasing the number of pixels in the photosensitive chip. Summary of the Invention

[0006] The present invention aims to provide a solution that overcomes at least one of the drawbacks of the prior art.

[0007] According to one aspect of the present invention, a photosensitive component is provided, comprising: a photosensitive chip having a photosensitive area and a non-photosensitive area surrounding the photosensitive area, wherein the non-photosensitive area is provided with a plurality of chip electrodes; an extension layer, which is located on the side of the photosensitive chip and in contact with the photosensitive chip, and has a surface flush with the front of the photosensitive chip; and a redistribution layer, which is formed on the extension layer and the front of the photosensitive chip; the redistribution layer has a plurality of redistribution layer electrodes, and the plurality of redistribution layer electrodes are connected one-to-one with the plurality of chip electrodes through redistribution layer routing.

[0008] The method further includes a circuit board having a plurality of circuit board electrodes, and the plurality of redistribution layer electrodes are attached to and connected to the plurality of circuit board electrodes in a one-to-one correspondence.

[0009] Wherein, the circuit board is a rigid-flex board.

[0010] There is a through hole in the center of the circuit board and the redistribution layer, and the chip electrode is closer to the through hole than the redistribution layer electrode.

[0011] There is filling material around the attachment position of the circuit board and the redistribution layer.

[0012] The area of the chip electrode is smaller than the area of the redistribution layer electrode.

[0013] The density of the plurality of chip electrodes is higher than that of the plurality of redistribution layer electrodes; and the width of the redistribution layer wiring is smaller than the width of the wiring of the circuit board.

[0014] The expansion layer surrounds the photosensitive chip, or is located on one side, two sides or three sides of the photosensitive chip.

[0015] The back side of the circuit board has a groove, and the photosensitive chip is located in the groove.

[0016] Wherein, the photosensitive component further includes a metal sheet, which is attached to the circuit board and covers the groove.

[0017] Wherein, the photosensitive component also includes a metal sheet, which is attached to the circuit board and covers the back of the photosensitive chip, and the metal sheet has a groove and the photosensitive chip is located in the groove.

[0018] Wherein, a gap is left between the metal sheet and the photosensitive chip.

[0019] Wherein, the photosensitive component also includes a molding layer, and the molding layer covers the back of the circuit board and the photosensitive chip.

[0020] Among them, when viewed from a top-down angle, the photosensitive chip has a row of chip electrodes located on the top side or bottom side, and the row of chip electrodes is connected to the redistribution layer electrodes located on the left or right side of the photosensitive chip through the redistribution layer wiring.

[0021] Wherein, the surface of the photosensitive area of the photosensitive chip has a protective layer; the protective layer is a color filter or a transparent cover.

[0022] According to another aspect of the present invention, a camera module is provided, comprising: any one of the aforementioned photosensitive components; and an optical lens component installed on the photosensitive component.

[0023] According to another aspect of the present invention, a method for manufacturing a photosensitive component is also provided, comprising: placing a photosensitive chip on a substrate surface; forming an extension layer extending from a side surface of the photosensitive chip on the substrate surface, and making the surface of the extension layer flush with the surface of the photosensitive chip; and forming a rewiring layer on the flush surface of the extension layer and the photosensitive chip, connecting a plurality of photosensitive electrodes of the photosensitive chip to a plurality of rewiring layer electrodes located in the rewiring layer through rewiring layer wiring, and the size and layout of the plurality of rewiring layer electrodes are suitable for one-to-one attachment of a plurality of circuit board electrodes.

[0024] In which, in the step of placing the photosensitive chip on the surface of the substrate, the photosensitive surface of the photosensitive chip faces the substrate; and in the step of making an extension layer extending from the side of the photosensitive chip on the surface of the substrate, the contact surface between the extension layer and the substrate and the surface of the photosensitive chip located on the photosensitive surface side constitute the flush surface for making the rewiring layer.

[0025] In the step of making an extension layer extending from the side of the photosensitive chip on the surface of the substrate, molding is performed from the back side of the photosensitive chip to form a molding part surrounding the photosensitive chip, and the molding part is used as the extension layer.

[0026] Among them, the step of making an extension layer extending from the side of the photosensitive chip on the surface of the substrate also includes: grinding the extension layer to thin the photosensitive component.

[0027] Among them, the step of making an extension layer extending from the side of the photosensitive chip on the surface of the substrate also includes: grinding the extension layer and the back of the photosensitive chip to thin the photosensitive component.

[0028] The step of making a rewiring layer on the flush surface of the expansion layer and the photosensitive chip further includes: removing the rewiring layer covering the photosensitive surface of the photosensitive chip to expose the photosensitive surface.

[0029] The photosensitive component manufacturing method further includes: forming a protective layer on the photosensitive surface of the photosensitive chip before executing the step of manufacturing a rewiring layer on the flush surface of the expansion layer and the photosensitive chip.

[0030] Among them, in the step of placing the photosensitive chip on the surface of the substrate, the protective layer is a sacrificial layer; the photosensitive component manufacturing method also includes: after the step of manufacturing a rewiring layer on the flush surface of the expansion layer and the photosensitive chip is completed, the sacrificial layer is removed.

[0031] Among them, in the step of placing the photosensitive chip on the surface of the substrate, the protective layer is a color filter.

[0032] Among them, the photosensitive component manufacturing method also includes: after the step of manufacturing a rewiring layer on the flush surface of the expansion layer and the photosensitive chip is completed, the circuit board is attached to the rewiring layer, and the multiple rewiring layer electrodes are in one-to-one contact with and conductive with the multiple circuit board electrodes of the circuit board.

[0033] The photosensitive component manufacturing method further includes: after attaching the circuit board to the rewiring layer, attaching a metal sheet to the back of the circuit board so that the metal sheet covers the back of the photosensitive chip.

[0034] Among them, the method for manufacturing the photosensitive component also includes: after attaching the circuit board to the rewiring layer, arranging filling material around the attachment position of the circuit board and the rewiring layer; and covering the back of the circuit board and the photosensitive chip with a molding layer through a molding process.

[0035] Among them, in the step of placing the photosensitive chip on the surface of the substrate, multiple photosensitive chips are arranged at intervals on the surface of the same substrate to form a photosensitive chip array; in the step of making an extension layer surrounding the photosensitive chip on the surface of the substrate, an integrally formed extension layer is made on the substrate, and the extension layer surrounds each photosensitive chip to form a photosensitive chip component array; in the step of making a rewiring layer on the flush surface of the extension layer and the photosensitive chip, the rewiring layer is made on the surface of the photosensitive chip component array; and after performing the step of making the rewiring layer on the flush surface of the extension layer and the photosensitive chip, the photosensitive chip component array is cut to obtain a single photosensitive component.

[0036] Wherein, in the step of cutting the photosensitive chip component array, the photosensitive chip component array is cut from the back.

[0037] Compared with the prior art, the present invention has at least one of the following technical effects:

[0038] 1. The present invention can connect the circuit board pads / circuits with larger line widths to the photosensitive chip with smaller contacts, thereby achieving high-density packaging of the photosensitive chip of the camera module.

[0039] 2. The present invention can achieve conduction from the circuit board pads relatively close to the outside of the light window to the chip pads closer to the light window.

[0040] 3. The present invention can realize the camera module using a conventional printed circuit board to implement a flip-chip process to achieve a high I / O number package. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Exemplary embodiments are shown in the referenced drawings.The embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.

[0042] Figure 1A cross-sectional schematic diagram of a photosensitive component according to an embodiment of the present invention is shown;

[0043] Figure 2 Shown Figure 1 A schematic top view of the photosensitive component shown;

[0044] Figure 3 A schematic top view of a photosensitive component according to another embodiment of the present invention is shown;

[0045] Figure 4 A schematic diagram showing the placement of the photosensitive chip 103 on the substrate 105a is shown;

[0046] Figure 5 The figure shows the arrangement of the photosensitive chip array adapted to the wafer level process;

[0047] Figure 6 The figure shows the arrangement of the photosensitive chip array that is compatible with the panel level process.

[0048] Figure 7 A schematic diagram showing molding on the substrate surface and the back of the photosensitive chip;

[0049] Figure 8 The assembly of the molded portion 109 and the photosensitive chip 103 after grinding is shown;

[0050] Figure 9 A schematic diagram showing the formation of a redistribution layer on the front surface of the photosensitive chip 103 and the surface of the molding portion 109 around it;

[0051] Figure 10 shows a schematic diagram of forming the light window 106;

[0052] Figure 11 A schematic diagram of cutting a photosensitive chip assembly array is shown;

[0053] Figure 12 A schematic diagram showing attaching a photosensitive chip assembly to a circuit board 101 is shown;

[0054] Figure 13 A schematic diagram showing a metal sheet 104 attached to a surface (usually the back) of a circuit board 101 to cover the back of a photosensitive chip 103 is shown;

[0055] Figure 14 A schematic diagram showing molding on the back side of the circuit board 101 and the photosensitive chip assembly is shown;

[0056] Figure 15 A schematic diagram showing a photosensitive component according to another embodiment of the present invention is shown;

[0057] Figure 16FIG. 1 shows a photosensitive chip array after molding with a protective layer 110 in one embodiment of the present invention;

[0058] Figure 17 Schematic diagram showing the formation of the redistribution layer 102 on the front surface of the photosensitive chip 103 and the surface of the molding portion 109 around it in step S400 ′;

[0059] Figure 18 The photosensitive chip assembly array is shown after the protective layer 110 is removed;

[0060] Figure 19 A schematic diagram showing cutting of a photosensitive chip assembly array with a protective layer retained is shown;

[0061] Figure 20 A schematic diagram showing a photosensitive chip assembly with a protective layer retained is attached to a circuit board 101;

[0062] Figure 21 A schematic diagram showing a photosensitive assembly with a metal sheet 104 attached and retaining a protective layer;

[0063] Figure 22 A schematic diagram showing molding on the back side of the circuit board 101 and the photosensitive chip assembly with the photosensitive protective layer retained;

[0064] Figure 23 A schematic diagram showing a photosensitive component retaining a photosensitive protective layer according to another embodiment of the present invention;

[0065] Figure 24 A schematic exploded perspective view of a camera module according to an embodiment of the present invention is shown;

[0066] Figure 25 A three-dimensional exploded schematic diagram of the photosensitive chip assembly 113 is shown. DETAILED DESCRIPTION

[0067] For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are merely descriptions of exemplary embodiments of the present application and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0068] It should be noted that in this specification, the expressions of first, second, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the features. Therefore, without departing from the teaching of this application, the first subject discussed below can also be referred to as the second subject.

[0069] In the accompanying drawings, the thickness, size and shape of objects have been slightly exaggerated for ease of explanation. The accompanying drawings are only examples and are not drawn strictly to scale.

[0070] It should also be understood that the terms "comprises," "including," "having," "includes," and / or "comprising," when used in this specification, indicate the presence of the stated features, integers, steps, operations, elements, and / or parts, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, and / or combinations thereof. In addition, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire listed features rather than modifying the individual elements in the list. In addition, when describing embodiments of the present application, "may" is used to mean "one or more embodiments of the present application." And, the term "exemplary" is intended to refer to an example or illustration.

[0071] As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not degree, and are intended to account for the inherent variations in measurements or calculations that would be recognized by those having ordinary skill in the art.

[0072] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which this application belongs. It should also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and will not be interpreted in an idealized or overly formal sense unless expressly defined as such herein.

[0073] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0074] Figure 1 FIG2 shows a cross-sectional schematic diagram of a photosensitive component according to an embodiment of the present invention. Figure 1In this embodiment, the photosensitive component includes a photosensitive chip 103, a molding part 109, a rewiring layer 102 and a circuit board 101. The lower surface of the circuit board 101 has a plurality of circuit board electrodes 1014 (i.e., first electrodes). The photosensitive chip 103 has a photosensitive area 1031 and a non-photosensitive area 1032 surrounding the photosensitive area 1031. The chip electrode 1033 is arranged in the non-photosensitive area 1032. The molding part 109 is formed around the photosensitive chip 103, and the upper surface of the molding part 109 is flush with the upper surface of the photosensitive chip 103, forming an overall flat surface. The rewiring layer 102 is formed on the flat surface. The upper surface of the rewiring layer 102 has a plurality of rewiring layer electrodes 1022 (i.e., second electrodes) corresponding one-to-one to the plurality of circuit board electrodes 1014, and each rewiring layer electrode 1022 of the rewiring layer 102 is connected to the corresponding chip electrode 1033. There is a through hole 1013 in the center of the circuit board as a light hole. In this embodiment, the circuit board 101 can be a hard-flex board. The hard-flex board includes a hard board area 1011 and a soft board area 1012, and the hard board area 1011 has a through hole 1013 in the center. Herein, the hard board area can be understood as an area in the hard-flex board that is rigid as a whole (inflexible at room temperature), and the soft board area can be understood as an area in the hard-flex board that is flexible as a whole (i.e., bendable). It should be noted that the hard board area can be an area that is rigid as a whole formed by laminating multiple hard boards and soft boards, and is not necessarily composed of only hard boards.

[0075] Further, Figure 2 Shown Figure 1 The diagram is a top view of the photosensitive component. This diagram is a perspective view, omitting the circuit board, and shows the redistribution layer electrode 1022, the chip electrode 1033 and the redistribution layer wiring 1023. Figure 2 As shown, the redistribution layer trace 1023 connects the redistribution layer electrode 1022 and the chip electrode 1033. The area of the redistribution layer electrode 1022 can be larger than the area of the chip electrode 1033. The area of the redistribution layer electrode 1022 is adapted to (e.g., equal or substantially equal to) the area of the circuit board electrode 1014. In this embodiment, the redistribution layer electrode 1022 is located outside the chip electrode 1033 (i.e., the chip electrode 1033 is closer to the physical center of the through-hole 1013 than the redistribution layer electrode 1022). In this embodiment, the electrodes can all be metal electrodes.

[0076] In the prior art, the pad size of the soft-rigid board ranges from 60 to 80 μm, while the pad size of the chip can be 10 to 20 μm. Therefore, in the above embodiment, by forming an extension layer (such as the molding portion 109) around the photosensitive chip 103, and then forming a rewiring layer 102 on the flat surface jointly formed by the photosensitive chip 103 and the extension layer, a fan-out package is realized, so that the photosensitive chip assembly composed of the photosensitive chip 103, the extension layer and the rewiring layer 102 can have pads suitable for flip-flop assembly with the circuit board. The size and layout of these pads can be adapted to the circuit board electrodes (i.e., circuit board pads) in a one-to-one correspondence. At the same time, in the above-mentioned photosensitive chip assembly, the chip electrodes of the photosensitive chip still have the characteristics of small area and dense arrangement, which helps to increase the number of pixels of the photosensitive component of the filpchip process solution, while avoiding the various defects brought about by the existing wirebond process. On the other hand, a rigid-flex board is a flexible circuit board (soft board) and a rigid circuit board (hard board), which are combined together through processes such as pressing and other processes according to relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. At present, the manufacturing process of the rigid-flex board is relatively mature, and has a greater cost advantage over circuit boards made of other processes such as ceramic substrates. Furthermore, the connecting tape of the photosensitive component of the above embodiment is made using the manufacturing process of the rigid-flex board, which can avoid attaching the photosensitive chip and then attaching the connecting tape through processes such as ACF that require high temperature hot pressing. The connecting tape can electrically connect the hard board area to the connector so as to be electrically connected to the motherboard of the terminal device (such as a mobile phone). The soft board of the rigid-flex board can be directly used as the connecting tape of the photosensitive component. In the rigid-flex board, the soft board area extends to the hard board area through the side of the hard board area. Based on the ACF process, the connecting tape is connected to the hard board through the surface of the hard board (usually the edge area of the hard board surface).

[0077] On the other hand, in the existing design, the photosensitive component includes a photosensitive chip and a circuit board, and the circuit board has a through hole, which corresponds to the photosensitive area of the photosensitive chip. The optical axis of the photosensitive chip overlaps with the physical center line of the through hole or has only a small deviation. Generally speaking, due to process limitations, the first pad on the lower surface of the circuit board is far away from the physical center of the through hole. When the chip is flip-chip assembled, in order to attach the chip pad to the first pad of the circuit board in a one-to-one correspondence, the chip pad has to be set at a position far away from the through hole. This will result in an increase in the area of the photosensitive chip. In the above embodiment of the present invention, other processes are used to achieve the attachment and conduction of the photosensitive chip 103 and the circuit board 101 without increasing the distance from the chip electrode 1033 (the chip electrode can be the chip pad) to the physical center of the through hole 1013.

[0078] In another embodiment of the present invention, the photosensitive component includes a photosensitive chip component, a circuit board 101, and a redistribution layer 102. The photosensitive chip component includes a photosensitive chip 103 and an expansion layer extending on both sides of the photosensitive chip 103. The photosensitive chip 103 has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, wherein the non-photosensitive area is provided with a plurality of chip electrodes 1033. The expansion layer extends from the non-photosensitive area toward the periphery, thereby expanding the length and width of the photosensitive chip component relative to the size of the photosensitive chip 103. The expansion layer is formed, for example but not limited to, by a photolithography process, a molding process, or the like. When the circuit board electrode 1014 is projected (orthogonally projected) onto the upper surface of the photosensitive chip assembly along the optical axis of the photosensitive chip 103 (or in a direction perpendicular to the photosensitive surface of the photosensitive chip 103), the circuit board electrode 1014 is projected outside the chip electrode 1033, or the orthogonal projection of the circuit board electrode 1014 along the optical axis of the photosensitive chip 103 is located on the extension layer. It should be noted that in the present invention, the extension layer is not limited to extending from the non-photosensitive area to the circumferential side. For example, in other embodiments, it can also extend from the non-photosensitive area to three sides, two sides, or even one side.

[0079] Further, Figure 3 FIG1 shows a top view of a photosensitive component according to another embodiment of the present invention. This figure is a perspective view, omitting the circuit board, and shows the redistribution layer electrode 1022 and the chip electrode 1033. Figure 3 The rewiring layer wiring 1023 is not shown in FIG. It is easy to understand that in this embodiment, the rewiring layer wiring 1023 connects the rewiring layer electrode 1022 and the chip electrode 1033. Figure 3 In this embodiment, the area of the rewiring layer electrode 1022 can be larger than the area of the chip electrode 1033. The area of the rewiring layer electrode 1022 is adapted to the area of the circuit board electrode 1014 (for example, equal or substantially equal). In this embodiment, the rewiring layer electrode 1022 is located on the outside of the chip electrode 1033 (that is, the chip electrode 1033 is closer to the physical center of the through hole 1013 than the rewiring layer electrode 1022). In this embodiment, the electrodes can all be metal electrodes. In particular, in this embodiment, the chip electrode 1033 arranged on the top side of the photosensitive chip 103 can be led to the left and right sides, so as not to increase the size in the Y direction too much. Figure 3In the figure, the direction from bottom to top is the Y direction, and the direction from right to left is the X direction. However, if the size in the Y direction is not greatly increased, it is beneficial to improve the screen ratio of the mobile phone (for example, it is beneficial to place the photosensitive component or camera module closer to the top frame of the mobile phone shell, thereby allowing the top edge of the mobile phone screen to be closer to the top frame of the mobile phone shell). In addition, in a modified embodiment, the chip pads and the redistribution layer pads can partially overlap. For clarity, Figure 3 No overlap is shown.

[0080] Further, still refer to Figure 3 In one embodiment, the redistribution layer electrodes 1022 on each side may have multiple rows so that more electrodes can be arranged on the same side (e.g., the left or right side) of the photosensitive chip. The chip 1033 electrodes on the top side of the photosensitive chip are led to the left and right sides by the redistribution layer wiring to connect the redistribution layer electrodes 1022 on the left and right sides. This allows the redistribution layer electrodes to be omitted from the top side of the photosensitive chip, thereby making the redistribution layer Y direction (i.e., Figure 3 Note that for clarity, Figure 3 The redistribution layer traces are not drawn.

[0081] Further, still refer to Figure 1 In one embodiment, the photosensitive component may further include a metal sheet 104. The metal sheet 104 has a groove 104a, and the photosensitive chip is accommodated in the groove 104a. After the metal sheet is attached, a complete photosensitive component can be obtained. The metal sheet 104 is attached to the back of the redistribution layer 102, which can isolate the photosensitive chip 103 from the external environment and prevent the photosensitive chip 103 from being damaged by external force. A reserved gap can be maintained between the metal sheet 104 and the photosensitive chip 103 to prevent the metal sheet 104 from colliding with the photosensitive chip 103 and causing damage to the photosensitive chip 103 or failure of the electrical connection. The gap can be filled with materials such as air, glue, molding, and insulating layer to better protect the chip.

[0082] Figure 4-13 The photosensitive component manufacturing process of an embodiment of the present invention is shown. In this embodiment, the photosensitive component manufacturing method includes the following steps.

[0083] S100, placing the photosensitive chip 103 on the substrate 105a (or called a carrier), wherein the photosensitive surface of the photosensitive chip 103 faces downward, that is, the photosensitive chip 103 is upside down on the substrate 105a. Figure 4 FIG1 shows a schematic diagram of placing the photosensitive chip 103 on the substrate 105a. In this embodiment, multiple photosensitive chips 103 can be arranged on the substrate 105a at a certain distance. The layout can be as follows: Figure 5 shown. Figure 5The arrangement of the photosensitive chip array is shown to be compatible with wafer-level technology. In another embodiment, the arrangement of the photosensitive chip array can also be compatible with panel-level technology. Figure 6 The figure shows the arrangement of the photosensitive chip array that is compatible with the panel level process.

[0084] S200 , forming a molding part 109 on the surface of the substrate and the back of the photosensitive chip to cover the photosensitive chip, thereby combining the photosensitive chip 103 , the molding part 109 and the substrate 105 a together. Figure 7 Schematic diagram showing molding on the substrate surface and the back of the photosensitive chip.

[0085] S300 , grinding the molding part 109 and the photosensitive chip 103 to reduce the thickness of the molding part 109 and the photosensitive chip 103 . Figure 8 The assembly of the molded part 109 and the photosensitive chip 103 after grinding is shown. In the prior art, in order to reduce the size of the camera module, the photosensitive chip 103 used is usually ground (the thickness before grinding is more than 0.3 mm, and after grinding is 0.15 mm). In this embodiment, if a chip with a thickness of 0.15 mm is directly used for wafer / panel level molding, warping may occur. When the number of photosensitive chips 103 molded at one time is large, the warping will be very large, so it is preferred to use unthinned photosensitive chips 103 for molding, and then grind to reduce the overall thickness of the assembly of the molded part 109 and the photosensitive chip 103. The grinding process of this step can be performed directly after the molding (i.e., step S200) is completed, or it can be performed after the redistribution layer preparation is completed. It should be noted that step S300 is an optional step, and in some embodiments of the present invention, step S300 can be omitted.

[0086] S400 , forming a redistribution layer on the front surface of the photosensitive chip and the surface of the molding portion 109 around it. Figure 9 A schematic diagram shows the formation of a rewiring layer on the front surface of the photosensitive chip 103 and the surrounding surface of the molding portion 109. In this step, the substrate 105a of the molded photosensitive chip array (i.e., the substrate in step S100) can be peeled off first, and then the molded photosensitive chip array is placed face-up on another substrate 105b. The rewiring layer is then formed on the front surface of the photosensitive chip 103 and the surrounding surface of the molding portion 109.

[0087] In this step, the surface of the formed redistribution layer 102 has a redistribution layer electrode 1022, and the redistribution layer electrode 1022 is connected to the chip electrode 1033 through the redistribution layer trace 1023. The size of the redistribution layer electrode 1022 can be larger than the size of the chip electrode 1033, and the position of the redistribution layer electrode 1022 can be located on the outside of the chip electrode 1033 (i.e., farther away from the photosensitive center). In this embodiment, the redistribution layer electrode 1022 is located as a whole above the molding part 109. In a modified embodiment, a portion of the redistribution layer electrode can be located above the molding part 109, and another portion can be located above the photosensitive chip 103, and the redistribution layer electrode 1022 can even partially overlap with the chip electrode 1033 (i.e., a portion of the redistribution layer electrode 1022 can be located above the chip electrode 1033).

[0088] The redistribution layer 102 can be fabricated on the front surface of the assembly of the molding portion 109 and the photosensitive chip 103 by spin-coating photoresist, exposure, development, and electroplating. The redistribution layer can include a dielectric layer. The redistribution layer traces 1023 are embedded in the dielectric layer.

[0089] S500 , removing the redistribution layer 102 above the photosensitive area of the photosensitive chip 103 to form a light window. Figure 10 A schematic diagram of forming the light window 106 is shown. In step S400, no rewiring layer traces 1023 are provided above the photosensitive region 1031 of the photosensitive chip 103. Therefore, the rewiring layer 102 above the photosensitive region 1031 is actually a dielectric layer. Removing the dielectric layer above the photosensitive region 1031 yields a photosensitive chip assembly with a light window. This photosensitive chip assembly comprises the photosensitive chip 103, a molding portion 109, and a rewiring layer 102. Note that when molding multiple photosensitive chips 103 simultaneously, this step yields a photosensitive chip assembly array.

[0090] S600, cutting the photosensitive chip component array obtained in the cutting step S500 to obtain single photosensitive chip components. Figure 11 A schematic diagram showing the cutting of the photosensitive chip assembly array is shown. Figure 11 Preferably, cutting is performed from the back side 111. This prevents the chip from being contaminated and facilitates subsequent picking up and attaching the chip assembly to the circuit board. In this step, the substrate on the back side of the photosensitive chip assembly array can be peeled off first, and then the photosensitive chip assembly array can be placed face down on another substrate, and then cutting can be performed from the back side of the photosensitive chip assembly array.

[0091] S700: Attach the photosensitive chip assembly to the circuit board. In this embodiment, the circuit board 101 is a rigid-flex board. Figure 12FIG1 shows a schematic diagram of attaching a photosensitive chip assembly to a circuit board 101. The attachment is based on a flip chip process. Figure 12 As shown, the redistribution layer electrode 1022 of the photosensitive chip assembly and the circuit board electrode 1014 are in one-to-one contact and conduction.

[0092] S800 , attaching a metal sheet 104 to the back of the circuit board 101 to cover the back of the photosensitive chip assembly. Figure 13 Schematic diagram showing a metal sheet 104 attached to the surface (usually the back) of the circuit board 101 to cover the back of the photosensitive chip 103. Figure 13 , the metal sheet 104 has a groove 104a, and the photosensitive chip 103 is accommodated in the groove 104a. After attaching the metal sheet 104, a complete photosensitive component can be obtained. The metal sheet 104 is attached to the back of the redistribution layer 102, which can isolate the photosensitive chip 103 from the external environment and prevent the photosensitive chip 103 from being damaged by external force. A reserved gap can be maintained between the metal sheet 104 and the photosensitive chip 103 to prevent the metal sheet 104 and the photosensitive chip 103 from colliding and causing damage to the photosensitive chip 103 or failure of the electrical connection. The gap can be filled with materials such as air, glue, molding, and insulating layer to better protect the chip.

[0093] Figure 14 Schematic diagram showing molding on the back of the circuit board 101 and the photosensitive chip assembly. Figure 14 As shown, in another embodiment, in step S800, the metal sheet 104 may be replaced by a mold layer 107. For example, the mold layer 107 may be formed on the back side of the redistribution layer 102 and the back side of the photosensitive chip 103 through a molding process. Preferably, to prevent the molding material from penetrating into the photosensitive area, the gap between the redistribution layer 102 and the circuit board 103 (mainly the area around the connection point between the redistribution layer electrode 1022 and the circuit board electrode 1014) may be filled to form a filling layer 108 based on an underfill process, and then the mold layer 107 may be formed based on a molding process.

[0094] Figure 15A schematic diagram of a photosensitive component according to another embodiment of the present invention is shown. In this embodiment, a groove 101b is provided around the through hole 1013 of the circuit board 101. The photosensitive chip component is accommodated in the groove 101b. In other words, a step surrounding the through hole 1013 is formed on the back of the circuit board 101, thereby forming the groove 101b, and the photosensitive chip 103 is placed on the step and is in contact and conduction with the circuit board 101 at the step (for example, the bottom surface 101c of the step). In this embodiment, the metal sheet 104 can be in the form of a flat plate, which is attached to the back of the circuit board 101 and covers the back of the photosensitive chip component. There is a gap between the metal sheet 104 and the back of the photosensitive chip component (that is, the two are not in direct contact). The metal sheet 104 isolates the photosensitive chip 103 from the external environment, preventing the photosensitive chip 103 from being damaged by external force impact. A reserved gap can be maintained between the metal sheet 104 and the photosensitive chip 103 to prevent collision between the metal sheet 104 and the photosensitive chip 103, which could damage the photosensitive chip 103 or cause electrical connection failure. The gap can be filled with air, glue, molding, an insulating layer, or other materials to better protect the chip. In this embodiment, the metal sheet 104 can be a steel sheet. It should be noted that in this application, the metal sheet 104 can be replaced by other metal sheets besides steel.

[0095] Furthermore, according to another embodiment of the present invention, another method for manufacturing a photosensitive component is provided. Figure 4-13 The difference of the embodiment shown is that the photosensitive chip assembly array is formed by molding from the front. Specifically, this embodiment includes the following steps.

[0096] At step S100', a photosensitive chip is placed on a substrate (also known as a carrier), with the photosensitive surface of the photosensitive chip facing downward. At step S200', a molding portion 109 is formed on the substrate surface and the back of the photosensitive chip to cover the photosensitive chip, thereby combining the photosensitive chip 103, the molding portion 109, and the substrate 105a. When multiple photosensitive chips 103 are molded at once, a molded photosensitive chip array is obtained.

[0097] S300′: Grind the molded portion 109 and the back of the photosensitive chip 103 to reduce their thickness. Note that in another embodiment, only the molded portion 109 may be ground to reduce its thickness, leaving the back of the photosensitive chip 103 exposed or not. In another alternative embodiment, this step may be omitted.

[0098] S400 ′, forming a protective layer on the photosensitive surface (ie, the surface of the photosensitive area), and forming a redistribution layer 102 on the front surface of the photosensitive chip and the surface of the molding portion 109 around it. Figure 16FIG. 1 shows a photosensitive chip array after molding with a protective layer 110 in one embodiment of the present invention. The protective layer may be a sacrificial layer (the sacrificial layer material mainly includes silicon oxide, polysilicon or photoresist). Figure 17 A schematic diagram illustrates the formation of a redistribution layer 102 on the front surface of the photosensitive chip 103 and the surrounding surface of the molded portion 109 in step S400'. Due to the presence of the protective layer 110, the redistribution layer 102 in this embodiment does not cover the photosensitive area 1031. Otherwise, the location and structure of the redistribution layer in this embodiment are consistent with those in step S400 above and will not be further described here. After this step is completed, an array of photosensitive chips 1031 with protective layers 104 is obtained.

[0099] S500 ′, removing the protective layer 110 . Figure 18 The photosensitive chip assembly array is shown after the protective layer 110 is removed.

[0100] S600'-S800', cutting the photosensitive chip 1031 component array, attaching the circuit board 101 and the metal sheet 104. Steps S600'-S800' can be completely consistent with the steps S600-S800 in the previous text, and will not be repeated here.

[0101] Furthermore, another embodiment of the present invention provides another method for manufacturing a photosensitive component. This method can retain a protective layer covering the surface of the photosensitive area. The protective layer can be a filter (e.g., an infrared filter or a visible light filter) or a glass cover (purely for protection). Compared to the previous embodiment, step S500' is omitted in this embodiment, while steps S100'-S400' and steps S600'-S800' are consistent with the previous embodiment. Figure 19 A schematic diagram showing cutting of a photosensitive chip assembly array with a protective layer retained is shown. Figure 20 A schematic diagram showing a photosensitive chip assembly with a protective layer retained is attached to a circuit board 101 . Figure 21 A schematic diagram of a photosensitive assembly with a metal sheet 104 attached and retaining a protective layer is shown.

[0102] Furthermore, Figure 22 Schematic diagram showing molding on the back of the circuit board 101 and the photosensitive chip assembly with the photosensitive protective layer retained. Figure 22In another embodiment of the present invention, the metal sheet 104 in step S800' can be replaced by a mold layer 107. For example, the mold layer 107 can be formed on the back of the redistribution layer 102 and the photosensitive chip 103 through a molding process. Preferably, to prevent the molding material from penetrating into the photosensitive area, the gap between the redistribution layer 102 and the circuit board 103 (mainly the area around the connection point between the redistribution layer electrode 1022 and the circuit board electrode 1014) can be filled to form a filling layer 108 based on an underfill process, and then the mold layer 107 can be formed based on a molding process.

[0103] Further, Figure 23 A schematic diagram of a photosensitive component retaining a photosensitive protective layer according to another embodiment of the present invention is shown. In this embodiment, a groove 101a is provided around the through hole 1013 of the circuit board 101. The photosensitive chip component retaining the photosensitive protective layer is accommodated in the groove 101b. In other words, a step surrounding the through hole 1013 is formed on the back of the circuit board 101, thereby forming the groove 101b, and the photosensitive chip 103 is placed on the step and is in contact and conduction with the circuit board 101 at the step (for example, the bottom surface 101c of the step). In this embodiment, the metal sheet can be in the form of a flat plate, which is attached to the back of the circuit board and covers the back of the photosensitive chip component. There is a gap between the metal sheet and the back of the photosensitive chip component (that is, the two are not in direct contact). The metal sheet 104 isolates the photosensitive chip 103 from the external environment, preventing the photosensitive chip 103 from being damaged by external force impact. A reserved gap can be maintained between the metal sheet 104 and the photosensitive chip 103 to prevent collision between the metal sheet 104 and the photosensitive chip 103, which could damage the photosensitive chip 103 or cause electrical connection failure. The gap can be filled with air, glue, molding, an insulating layer, or other materials to better protect the chip. In this embodiment, the metal sheet can be a steel sheet. It should be noted that the metal sheet in this application can be replaced by other metal sheets besides steel sheets.

[0104] Furthermore, in one embodiment of the present invention, the circuit board can be implemented as a molded circuit board with embedded circuits. The molded circuit board is manufactured through processes such as copper planting, molding, and grinding. The molded circuit board has high structural strength and flatness, and a smaller line width, such as 30μm. Its high flatness is suitable for subsequent rewiring and copper planting processes. In addition, a series of electronic components of the camera module, such as resistors and capacitors, can be embedded in the molded circuit board, thereby playing the role of electromagnetic shielding and protecting electronic components, and at the same time, it can also reduce the length and width of the camera module to a certain extent.

[0105] Furthermore, according to an embodiment of the present invention, a camera module is provided, which includes a lens assembly 112 and a photosensitive assembly, wherein the photosensitive assembly can be the photosensitive assembly of any of the above embodiments. Figure 24 FIG1 shows a three-dimensional exploded schematic diagram of a camera module according to an embodiment of the present invention. Figure 24 As shown, the lens assembly is mounted on the front of the circuit board 101, and the photosensitive chip assembly is mounted on the back of the circuit board 101. The light window of the photosensitive chip assembly 113 corresponds to the light hole of the circuit board 101. Figure 25 FIG1 shows a perspective exploded view of the photosensitive chip assembly 113. Figure 24 and Figure 25 The photosensitive chip assembly 113 includes a photosensitive chip 103, a molding portion 109 formed around the photosensitive chip 103 (the molding portion 109 can also be replaced by an expansion layer in other forms), and a rewiring layer 102 formed on the surface (front) of the photosensitive chip 103 and the molding portion 109. The rewiring layer 102 has a rewiring layer electrode 1022 and a rewiring layer trace 1023. The rewiring layer trace 1023 connects the rewiring layer electrode 1022 and the chip electrode 1033 in a one-to-one correspondence. The size and layout of the rewiring layer electrode are adapted to the circuit board electrode, so that the rewiring layer electrode 1022 and the circuit board electrode are in one-to-one contact and conduction. The contact here can be achieved, for example, by welding.

[0106] In this article, the photosensitive chip component can sometimes also be regarded as a photosensitive component.

[0107] The above description is merely a preferred embodiment of the present application and an illustration of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to the technical solutions formed by the specific combination of the above-mentioned technical features, but also encompasses other technical solutions formed by any combination of the above-mentioned technical features or their equivalents without departing from the inventive concept. For example, a technical solution formed by replacing the above-mentioned features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A photosensitive component, characterized in that: include: A photosensitive chip having a photosensitive area and a non-photosensitive area surrounding the photosensitive area, wherein the non-photosensitive area is provided with a plurality of chip electrodes; an expansion layer, which is located on a side of the photosensitive chip and contacts the photosensitive chip, and has a surface flush with the front surface of the photosensitive chip; as well as A redistribution layer is formed on the front of the expansion layer and the photosensitive chip; the redistribution layer has a plurality of redistribution layer electrodes, and the plurality of redistribution layer electrodes are connected to the plurality of chip electrodes in a one-to-one correspondence through redistribution layer wiring; The invention further comprises a circuit board, wherein the circuit board and the redistribution layer have through holes in the center thereof, and the chip electrodes are closer to the through holes than the redistribution layer electrodes.

2. The photosensitive component according to claim 1, characterized in that The wiring board has a plurality of wiring board electrodes, and the plurality of redistribution layer electrodes are attached to and electrically connected to the plurality of wiring board electrodes in a one-to-one correspondence.

3. The photosensitive component according to claim 2, characterized in that The circuit board is a rigid-flex board.

4. The photosensitive component according to claim 2, characterized in that There is a filling material around the attachment location of the wiring board and the redistribution layer.

5. The photosensitive component according to claim 1, characterized in that The area of the chip electrode is smaller than the area of the redistribution layer electrode.

6. The photosensitive component according to claim 1, characterized in that The density of the plurality of chip electrodes is higher than that of the plurality of redistribution layer electrodes; and the width of the redistribution layer wiring is smaller than the width of the wiring of the circuit board.

7. The photosensitive component according to claim 1, characterized in that The expansion layer surrounds the photosensitive chip, or is located on one side, two sides, or three sides of the photosensitive chip.

8. The photosensitive component according to claim 4, characterized in that The back side of the circuit board is provided with a groove, and the photosensitive chip is located in the groove.

9. The photosensitive component according to claim 8, characterized in that The photosensitive component also includes a metal sheet, which is attached to the circuit board and covers the groove.

10. The photosensitive component according to claim 4, characterized in that The photosensitive component also includes a metal sheet, which is attached to the circuit board and covers the back of the photosensitive chip. The metal sheet has a groove and the photosensitive chip is located in the groove.

11. The photosensitive component according to claim 9 or 10, characterized in that: A gap is left between the metal sheet and the photosensitive chip.

12. The photosensitive component according to claim 4, characterized in that The photosensitive component also includes a molding layer, which covers the back of the circuit board and the photosensitive chip.

13. The photosensitive component according to claim 1, wherein: When viewed from above, the photosensitive chip has a row of chip electrodes located on the top side or bottom side, and the row of chip electrodes is connected to the redistribution layer electrodes located on the left side or right side of the photosensitive chip through the redistribution layer wiring.

14. The photosensitive component according to any one of claims 1 to 10, characterized in that: The surface of the photosensitive area of the photosensitive chip is provided with a protective layer; the protective layer is a color filter or a transparent cover.

15. A camera module, characterized in that: include: The photosensitive component according to any one of claims 1 to 14; as well as An optical lens assembly is installed on the photosensitive assembly.

16. A method for manufacturing a photosensitive component, characterized in that: include: Placing the photosensitive chip on the substrate surface; Fabricating an extension layer extending from the side of the photosensitive chip on the surface of the substrate, and making the surface of the extension layer flush with the surface of the photosensitive chip; and A rewiring layer is fabricated on a flush surface between the extension layer and the photosensitive chip, and a plurality of chip electrodes of the photosensitive chip are connected to a plurality of rewiring layer electrodes located on the rewiring layer through rewiring layer wiring, and the size and layout of the plurality of rewiring layer electrodes are suitable for attaching a plurality of circuit board electrodes in a one-to-one correspondence, wherein a through hole is provided in the center of the circuit board and the rewiring layer, and the chip electrode is closer to the through hole than the rewiring layer electrode.

17. The method for manufacturing a photosensitive component according to claim 16, wherein: In the step of placing the photosensitive chip on the surface of the substrate, the photosensitive surface of the photosensitive chip faces the substrate; and In the step of making an extension layer extending from the side of the photosensitive chip on the substrate surface, the contact surface of the extension layer with the substrate and the surface of the photosensitive chip located on the photosensitive surface side constitute the flush surface for making the rewiring layer.

18. The method for manufacturing a photosensitive component according to claim 17, wherein: In the step of making an extension layer extending from the side of the photosensitive chip on the surface of the substrate, molding is performed from the back side of the photosensitive chip to form a molding part surrounding the photosensitive chip, and the molding part is used as the extension layer.

19. The method for manufacturing a photosensitive component according to claim 17, wherein: The step of forming an extension layer extending from the side of the photosensitive chip on the substrate surface also includes: The expansion layer is ground to thin the photosensitive component.

20. The method for manufacturing a photosensitive component according to claim 19, wherein: The step of forming an extension layer extending from the side of the photosensitive chip on the substrate surface also includes: The back side of the expansion layer and the photosensitive chip is ground to thin the photosensitive component.

21. The method for manufacturing a photosensitive component according to claim 16, wherein: The step of making a rewiring layer on the flush surface of the expansion layer and the photosensitive chip further includes: The redistribution layer covering the photosensitive surface of the photosensitive chip is removed to expose the photosensitive surface.

22. The method for manufacturing a photosensitive component according to claim 16, wherein: Also includes: Before the step of manufacturing a rewiring layer on the flush surface of the expansion layer and the photosensitive chip is performed, a protective layer is formed on the photosensitive surface of the photosensitive chip.

23. The method for manufacturing a photosensitive component according to claim 22, wherein: In the step of placing the photosensitive chip on the surface of the substrate, the protective layer is a sacrificial layer; The photosensitive component manufacturing method further includes: after the step of manufacturing a rewiring layer on the flush surface of the expansion layer and the photosensitive chip is completed, removing the sacrificial layer.

24. The method for manufacturing a photosensitive component according to claim 22, wherein: In the step of placing the photosensitive chip on the surface of the substrate, the protective layer is a color filter.

25. The method for manufacturing a photosensitive component according to any one of claims 16 to 24, wherein: Also includes: After the step of making a rewiring layer on the flush surface of the expansion layer and the photosensitive chip is completed, the circuit board is attached to the rewiring layer, and the multiple rewiring layer electrodes are in contact and conduction with the multiple circuit board electrodes of the circuit board one by one.

26. The method for manufacturing a photosensitive component according to claim 25, wherein: Also includes: After the circuit board is attached to the rewiring layer, a metal sheet is attached to the back of the circuit board so that the metal sheet covers the back of the photosensitive chip.

27. The method for manufacturing a photosensitive component according to claim 25, wherein: Also includes: After attaching the circuit board to the rewiring layer, disposing a filling material around the attachment location of the circuit board and the rewiring layer; as well as A molding layer is covered on the back side of the circuit board and the photosensitive chip through a molding process.

28. The method for manufacturing a photosensitive component according to any one of claims 16 to 24, wherein: In the step of placing the photosensitive chips on the surface of the substrate, a plurality of the photosensitive chips are arranged at intervals on the surface of the same substrate to form a photosensitive chip array; In the step of forming an extension layer surrounding the photosensitive chip on the surface of the substrate, an integrally formed extension layer is formed on the substrate, and the extension layer surrounds each photosensitive chip to form a photosensitive chip assembly array; In the step of manufacturing a rewiring layer on the flush surface of the expansion layer and the photosensitive chip, the rewiring layer is manufactured on the surface of the photosensitive chip component array; as well as After executing the step of making a rewiring layer on the flush surface of the expansion layer and the photosensitive chip, the photosensitive chip component array is cut to obtain a single photosensitive component.

29. The method for manufacturing a photosensitive component according to claim 28, wherein: In the step of cutting the photosensitive chip component array, the photosensitive chip component array is cut from the back.

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