Method for manufacturing a sealing sheet and electronic component device

Abstract

The present application relates to a sealing sheet and a manufacturing method of an electronic component device. The sealing sheet is used in a manner to form a sealing layer that seals an electronic component mounted in a manner to oppose one face of a thickness direction of a substrate. The sealing layer contacts one face of the thickness direction of the substrate that does not oppose the electronic component when sealing the electronic component. A product (T x E' [N / mm]) of a thickness T [mm] of the sealing sheet and a tensile storage modulus E' [N / mm 2 ] of the sealing layer at 25°C is 3,000 [N / mm] or more and 5,000 [N / mm] or less.

Description

Technical Field

[0001] This invention relates to a sealing sheet and a method for manufacturing an electronic component device, and more specifically, to a method for manufacturing an electronic component device and a sealing sheet for use therein. Background Technology

[0002] Previously, it was known to manufacture an electronic device package by sealing an electronic device mounted on one side of a substrate with an electronic device sealing sheet (for example, see Japanese Patent Application Publication No. 2015-179829).

[0003] In this method, the electronic device is sealed by embedding the electronic device in a manner that contacts one side and the side surface of the electronic device, as well as one side surface around the electronic device on the substrate. Summary of the Invention

[0004] However, there is a need to prevent electronic components from peeling off from the substrate in order to manufacture electronic component packages with high reliability.

[0005] In addition, for electronic device packages, the shape stability of the sealing resin sheet, which is used as a sealing sheet for electronic devices, is required.

[0006] The present invention provides a sealing sheet capable of suppressing the peeling of electronic components from the substrate and forming a sealing layer with excellent shape stability, and a method for manufacturing an electronic component device.

[0007] The present invention (1) includes a sealing sheet used to form a sealing layer for sealing electronic components, the electronic components being mounted with one side facing the thickness direction of a substrate, the sealing layer contacting the thickness direction side of the substrate that is not facing the electronic components when sealing the electronic components, the thickness T [mm] of the sealing sheet being related to the tensile storage modulus E' [N / mm] of the sealing layer at 25°C. 2 The product (T×E'[N / mm]) is above 3,000[N / mm] and below 5,000[N / mm].

[0008] [1] When the product of the above-mentioned factors exceeds 5,000 [N / mm] due to the relatively thick thickness T of the sealing sheet and the high tensile storage modulus E' of the sealing layer at 25°C, and the sealing sheet is used to form a sealing layer by applying pressure to the electronic component, internal stress is generated in the thick sealing sheet, and the internal stress cannot be relaxed in the hardened sealing layer after curing, resulting in residue. Therefore, the electronic component and the sealing layer peel off from the substrate.

[0009] In addition, if the thickness T of the sealing sheet is not as thick as described above [1], but the product of the above exceeds 5,000 [N / mm] due to the excessively high tensile storage modulus E' of the sealing layer at 25°C, or if the tensile storage modulus E' of the sealing layer at 25°C is not as high as described above [1], but the product of the above exceeds 5,000 [N / mm] due to the excessively thick thickness T of the sealing sheet, the electronic components and the sealing layer will peel off from the substrate in the same manner as described above.

[0010] However, in this invention, since the product is 5,000 [N / mm] or less, when the sealing sheet is used to form a sealing layer by applying pressure to the electronic component, even if internal stress is generated in the sealing sheet, the internal stress can be relaxed in the cured sealing layer. Therefore, it is possible to suppress the peeling of the electronic component and the sealing layer from the substrate.

[0011] In addition, [2] when the product of the above is less than 3,000 [N / mm] due to the thinness of the sealing sheet T and the low tensile storage modulus E' of the sealing layer at 25°C, the thin sealing sheet tends to move toward the outside of the electronic component when the sealing sheet is pressed relative to the electronic component and used to form a sealing layer, and the soft sealing layer after curing is difficult to maintain the desired shape.

[0012] On the other hand, if the thickness T of the sealing sheet is not as thin as described above [2], but the product is less than 3,000 [N / mm] due to the low tensile storage modulus E' of the sealing layer at 25°C, or if the tensile storage modulus E' of the sealing layer at 25°C is not as low as described above [2], but the product is less than 3,000 [N / mm] due to the low thickness T of the sealing sheet, then, similarly, the sealing layer is difficult to maintain the desired shape.

[0013] However, in this invention, since the product is 3,000 [N / mm] or more, the sealing layer can maintain the desired shape when the sealing sheet is pressurized relative to an electronic component to form a sealing layer. Therefore, the shape stability of the sealing layer is excellent.

[0014] As a result, the sealing sheet according to the present invention can suppress the peeling of electronic components and sealing layers from the substrate, and can form a sealing layer with excellent shape stability.

[0015] The present invention (2) includes the sealing sheet described in (1), wherein the thickness T of the sealing sheet is 0.25 mm or more and less than 0.50 mm.

[0016] Furthermore, since the thickness T of the sealing sheet is 0.25 mm or more, the product (T×E'N / mm) can be reliably set to the lower limit or above.

[0017] On the other hand, electronic components and devices usually have a specified thickness limit, and if this thickness is exceeded, they sometimes cannot be used as finished products.

[0018] However, since the thickness T of the sealing sheet is less than 0.50 mm, it is possible to suppress the aforementioned limitation of non-use due to excessively thick sealing layers.

[0019] Therefore, it can be used to manufacture electronic components as qualified products that meet thickness limits.

[0020] Furthermore, if the thickness T of the sealing sheet for the electronic component is less than 0.50 mm, the product can be reliably set below the aforementioned upper limit.

[0021] The present invention (3) includes a method for manufacturing an electronic component device, wherein the electronic component is sealed using the sealing sheet described in (1) or (2).

[0022] In this manufacturing method, the aforementioned sealing sheet can reliably seal electronic components mounted on a substrate with a sealing layer. As a result, it is possible to manufacture an electronic component device that includes a substrate, electronic components, and a sealing layer, and exhibits excellent reliability.

[0023] The sealing sheet according to the present invention can suppress the peeling of electronic components and sealing layers from the substrate, and can form a sealing layer with excellent shape stability.

[0024] According to the manufacturing method of the electronic component device of the present invention, it is possible to manufacture an electronic component device with excellent reliability. Attached Figure Description

[0025] Figure 1 A cross-sectional view of an electronic component sealing sheet as one embodiment of the sealing sheet of the present invention is shown.

[0026] Figure 2 Showing the use Figure 1 The process shown is to seal electronic components with sealing sheets and cut the substrate and sealing layer around the electronic components to manufacture electronic component devices.

[0027] Figure 3A and Figure 3B This diagram illustrates the process of manufacturing an electronic component device from an electronic component mounting substrate containing one electronic component. Figure 3A The process of preparing an electronic component mounting substrate with one electronic component is shown. Figure 3BThis illustrates the process of cutting the substrate and sealing layer surrounding the electronic components in an electronic component device.

[0028] Figure 4A and Figure 4B These are cross-sectional views of Comparative Examples 1-4. Figure 4A The process of preparing thin sealing sheets for electronic components is shown. Figure 4B Showing the use Figure 4A The process shown is to seal electronic components with sealing sheets to manufacture electronic component devices.

[0029] Figure 5A and Figure 5B These are cross-sectional views of Comparative Examples 5-8. Figure 5A The process of preparing thick sealing sheets for electronic components is shown. Figure 5B Showing the use Figure 5A The process shown is to seal electronic components with sealing sheets to manufacture electronic component devices.

[0030] Figure 6 This is a graph showing the relationship between the thickness T of the sealing sheet for electronic components and the tensile storage modulus E' of the sealing layer. Detailed Implementation

[0031] Reference Figure 1 and Figure 2 This describes an electronic component sealing sheet as one embodiment of the sealing sheet of the present invention.

[0032] like Figure 1 and Figure 2 As shown, the electronic component sealing sheet 1 is used to manufacture an electronic component assembly (electronic component package) 3. For example... Figure 2 As shown, the electronic component device 3 includes a substrate 2, electronic components 4, and a sealing layer 5, as described below.

[0033] in addition, Figure 1 The sealing sheet 1 shown is not the sealing layer 5 that seals the electronic component 4 (see reference). Figure 2 In other words, it is a precursor sheet (preferably a curable sheet) used to form the sealing layer 5 before sealing the electronic component 4.

[0034] like Figure 1 As shown, the sealing sheet 1 for electronic components has a generally plate-like (film-like) shape extending along a direction orthogonal to the thickness direction (plane direction). The sealing sheet 1 for electronic components has a first sheet surface 6 as one side in the thickness direction and a second sheet surface 7 as the other side in the thickness direction. The first sheet surface 6 and the second sheet surface 7 are planes (flat surfaces) parallel to each other.

[0035] Electronic component 4 is sealed with sealing sheet 1 (see reference). Figure 2When the first sheet surface 6 maintains its flat (planar) shape, it ensures the spacing with the second sheet surface 7 in the thickness direction, thus imparting a specified thickness.

[0036] As described later, when the electronic component sealing sheet 1 seals the electronic component 4, the second sheet surface 7 is a contact surface that contacts at least the first component surface 8 (described later) of the electronic component 4 and the first substrate surface 11 (described later) of the substrate 2 that is not opposite to the electronic component 4.

[0037] Regarding the material of the sealing sheet 1 for electronic components, there are no particular limitations if the thickness T of the sealing sheet 1 and the tensile storage modulus E' of the sealing layer 5 satisfy the range described later. Examples of materials for the sealing sheet 1 for electronic components include sealing compositions.

[0038] The sealing composition is, for example, a cured composition containing thermosetting components.

[0039] Thermosetting components are those that are temporarily softened by heating when sealing electronic components 4, then melt and flow, and are cured by further heating.

[0040] Furthermore, the thermosetting component in the electronic component sealing sheet 1 is in stage B (semi-cured state) rather than stage C (in other words, the state before complete curing). It should be noted that stage B is a state in which the thermosetting component is in a liquid state between stage A and stage C, which is slightly cured and gelled, and the compressive elastic modulus is less than that of stage C.

[0041] Thermosetting components include, for example, a base agent, a curing agent, and a curing accelerator.

[0042] Examples of main agents include epoxy resins, phenolic resins, melamine resins, vinyl ester resins, cyano ester resins, maleimide resins, and silicone resins. From the viewpoint of heat resistance, epoxy resins are preferred as the main agent. If the main agent is epoxy resin, the thermosetting component, together with the curing agent (epoxy-based curing agent) and curing accelerator (epoxy-based curing accelerator) described later, constitutes the epoxy-based thermosetting component.

[0043] Examples of epoxy resins include: difunctional epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, modified bisphenol A type epoxy resin, modified bisphenol F type epoxy resin, and biphenyl type epoxy resin; and multifunctional epoxy resins such as linear phenolic epoxy resin, linear cresol phenolic epoxy resin, trihydroxyphenylmethane type epoxy resin, tetrahydroxyphenylethane type epoxy resin, and dicyclopentadiene type epoxy resin. These epoxy resins can be used alone or in combination of two or more types.

[0044] The use of difunctional epoxy resins alone can be preferred to be listed, and more specifically, the use of bisphenol F type epoxy resin alone can be listed.

[0045] The epoxy equivalent of the epoxy resin is, for example, 10 g / eq. or more, preferably 100 g / eq. or more, and also, for example, 300 g / eq. or less, preferably 250 g / eq. or less.

[0046] The softening point of the main agent (preferably epoxy resin) is, for example, 50°C or higher, preferably 70°C or higher, and also, for example, 110°C or lower, preferably 90°C or lower.

[0047] The proportion of the main agent (preferably epoxy resin) in the sealing composition is, for example, 1% by mass or more, preferably 2% by mass or more, and also, for example, 30% by mass or less, preferably 10% by mass or less. Furthermore, the proportion of the main agent (preferably epoxy resin) in the thermosetting component is, for example, 50% by mass or more, preferably 60% by mass or more, and also, for example, 90% by mass or less, preferably 80% by mass or less.

[0048] The curing agent is a component that cures the main agent by heating (preferably an epoxy resin curing agent). Examples of curing agents include phenolic resins such as linear phenolic resins.

[0049] Regarding the ratio of the curing agent, if the main agent is epoxy resin and the curing agent is phenolic resin, it is adjusted such that the total number of hydroxyl groups in the phenolic resin is equivalent to, for example, 0.7 equivalents or more, preferably 0.9 equivalents or more, for example, 1.5 equivalents or less, and preferably 1.2 equivalents or less, of the epoxy groups in the epoxy resin. Specifically, the proportion of the curing agent relative to 100 parts by weight of the main agent is, for example, 30 parts by weight or more, preferably 50 parts by weight or more, and also, for example, 75 parts by weight or less, preferably 60 parts by weight or less.

[0050] A curing accelerator is a catalyst (thermosetting catalyst) that promotes the curing of the main agent upon heating (preferably an epoxy resin curing accelerator). Examples include organophosphorus compounds and imidazole compounds such as 2-phenyl-4,5-dihydroxymethylimidazolium (2PHZ-PW). Imidazole compounds are preferred. The amount of curing accelerator relative to 100 parts by weight of the main agent is, for example, 0.05 parts by weight or more, and, for example, 5 parts by weight or less.

[0051] It should be noted that the sealing composition may contain inorganic fillers, thermoplastic components, pigments, silane coupling agents, and other additives in addition to the above-mentioned thermosetting components.

[0052] Inorganic fillers are inorganic particles that enhance the strength of the sealing layer 5 (described later) and impart excellent toughness to it. Examples of inorganic filler materials include quartz glass, talc, silica, alumina, aluminum nitride, silicon nitride, and boron nitride. These can be used alone or in combination of two or more. Silica is a preferred example.

[0053] The shape of inorganic fillers is not particularly limited, and examples include approximately spherical, approximately plate-shaped, approximately needle-shaped, and irregular shapes. Approximately spherical shapes are preferred.

[0054] The average length (or average particle size if approximately spherical) M of the inorganic filler is, for example, 50 μm or less, preferably 20 μm or less, more preferably 10 μm or less, and also, for example, 0.1 μm or more, preferably 0.5 μm or more. It should be noted that the average particle size M is, for example, based on the particle size distribution determined by the particle size distribution measurement method in laser scattering, and is calculated in the form of a D50 value (cumulative 50% median particle size).

[0055] In addition, the inorganic packing may include a first packing and a second packing, wherein the second packing has a maximum length average value M2 that is smaller than the maximum length average value M1 of the first packing.

[0056] The average value of the maximum length of the first filler (or the average particle size if it is approximately spherical) M1 is, for example, 1 μm or more, preferably 3 μm or more, and also, for example, 50 μm or less, preferably 30 μm or less.

[0057] The average value of the maximum length of the second filler (or the average particle size if it is approximately spherical) M2 is, for example, less than 1 μm, preferably less than 0.8 μm, and also, for example, more than 0.01 μm, preferably more than 0.1 μm.

[0058] The ratio (M1 / M2) of the average maximum length of the first packing to the average maximum length of the second packing is, for example, 2 or more, preferably 5 or more, and also, for example, 50 or less, preferably 20 or less.

[0059] The materials of the first packing and the second packing can be the same or different.

[0060] In addition, the surface of inorganic fillers can be partially or entirely treated with silane coupling agents, etc.

[0061] When the inorganic filler includes the first filler and the second filler described above, the proportion of the first filler in the sealing composition is, for example, 40% by mass or more, preferably more than 50% by mass, and also, for example, 80% by mass or less, preferably 70% by mass or less, and more preferably 60% by mass or less. The proportion of the second filler relative to 100 parts by mass of the first filler is, for example, 40 parts by mass or more, preferably 50 parts by mass or more, and also, for example, 70 parts by mass or less, preferably 60 parts by mass or less.

[0062] The proportion of inorganic filler in the sealing composition is, for example, 50% by mass or more, preferably 65% ​​by mass or more, more preferably 70% by mass or more, and even more preferably 75% by mass or more. In addition, it is, for example, 95% by mass or less, preferably 90% by mass or less.

[0063] The thermoplastic component is the component that improves the flexibility of the electronic component sealing sheet 1 when sealing electronic component 4. The thermoplastic component is, for example, a thermoplastic resin.

[0064] Examples of thermoplastic resins include: natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resin (6-nylon, 6,6-nylon, etc.), phenoxy resin, acrylic resin, saturated polyester resin (PET, etc.), polyamide-imide resin, fluoropolymers, and styrene-isobutylene-styrene block copolymers. These thermoplastic resins can be used alone or in combination of two or more.

[0065] From the viewpoint of improving dispersibility with the main agent (preferably epoxy resin), acrylic resins are preferred examples of thermoplastic resins.

[0066] Examples of acrylic resins include carboxyl-containing (meth)acrylate copolymers (preferably carboxyl-containing acrylate copolymers) formed by polymerizing monomer components comprising alkyl (meth)acrylates having linear or branched alkyl groups and other monomers (copolymer monomers).

[0067] Examples of alkyl groups include methyl, ethyl, propyl, isopropyl, n-butyl, tert-butyl, isobutyl, pentyl, hexyl, and other alkyl groups having 1 to 6 carbon atoms.

[0068] Other monomers that can be listed include: acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and other monomers containing carboxyl groups.

[0069] The weight-average molecular weight of the thermoplastic component is, for example, 100,000 or more, preferably 300,000 or more, and also, for example, 1,000,000 or less, preferably 900,000 or less. It should be noted that the weight-average molecular weight is determined by gel permeation chromatography (GPC) based on a standard polystyrene conversion value.

[0070] The proportion of the thermoplastic component (solid component proportion) is adjusted in a manner that does not hinder the thermosetting of the sealing composition. Specifically, relative to the sealing composition, it is, for example, 1% by mass or more, preferably 2% by mass or more, and also, for example, 10% by mass or less, preferably 5% by mass or less. It should be noted that the thermoplastic component can be prepared by dilution with a suitable solvent.

[0071] Examples of pigments include black pigments such as carbon black. The average particle size of the pigment is, for example, 0.001 μm or more, or, for example, 1 μm or less. The proportion of the pigment relative to the sealing composition is, for example, 0.1% by mass or more, and, for example, 2% by mass or less.

[0072] Examples of silane coupling agents include, for example, silane coupling agents containing epoxy groups. Examples of silane coupling agents containing epoxy groups include: 3-epoxypropoxypropylmethyldimethoxysilane, 3-epoxypropoxypropylmethyldiethoxysilane, and other 3-epoxypropoxydialkyldialkoxysilanes; and 3-epoxypropoxypropyltrimethoxysilane, 3-epoxypropoxypropyltriethoxysilane, and other 3-epoxypropoxyalkyltrialkoxysilanes. 3-epoxypropoxyalkyltrialkoxysilanes are preferred. The proportion of the silane coupling agent relative to 100 parts by weight of the inorganic filler is, for example, 0.1 parts by weight or more, preferably 1 part by weight or more, and further, for example, 10 parts by weight or less, preferably 5 parts by weight or less.

[0073] The thickness T of the sealing sheet 1 for electronic components is, for example, 0.25 mm or more, preferably 0.27 mm or more. Specifically, the thickness T of the sealing sheet 1 for electronic components is the distance (average length) between the first sheet surface 6 and the second sheet surface 7.

[0074] If the thickness T of the sealing sheet 1 for electronic components exceeds the lower limit mentioned above, the sealing sheet 1 for electronic components can be manufactured into a thick product with excellent sealing performance for electronic components 4.

[0075] On the other hand, the thickness T of the sealing sheet 1 for electronic components is, for example, less than 0.50 mm, preferably less than 0.45 mm, and more preferably less than 0.40 mm.

[0076] Furthermore, if the thickness T of the electronic component sealing sheet 1 exceeds the lower limit but is less than the upper limit, then the thickness T [mm] of the electronic component sealing sheet 1 described later can be compared with the tensile storage modulus E' [N / mm] of the sealing layer 5 at 25°C.2 The product of ] (T×E'[N / mm]) is reliably set to the range described later.

[0077] The shape of the sealing sheet 1 in the orthogonal direction (plane direction) is not particularly limited, and its size is set in such a way that it can embed (seal) multiple electronic components 4 and contact the first substrate surface 11 (the first substrate surface 11 around the electronic components 4) of the substrate 2 exposed from the multiple electronic components 4. Specifically, the length of the sealing sheet 1 in the plane direction (if the sealing sheet 1 is a top-view rectangle, it is the longest of the four sides) is, for example, 1 mm or more, and, for example, 500 mm or less.

[0078] To manufacture the sealing sheet 1 for electronic components, a sealing composition is first prepared. Specifically, the above-mentioned components are combined and mixed to prepare the sealing composition. Preferably, the above-mentioned components are combined and mixed with a solvent (ketone, alcohol, etc.) as needed to prepare a varnish. Subsequently, the varnish is applied to a release sheet (not shown) and allowed to dry to obtain the sealing sheet 1 for electronic components. It should be noted that the sealing sheet 1 for electronic components can also be formed from the sealing composition by compounding and extrusion instead of preparing a varnish.

[0079] Thus, the sealing sheet 1 for electronic components is formed from a sealing composition in the form of a single layer.

[0080] In the case of containing thermosetting components, the sealing sheet 1 for electronic components is, for example, of grade B.

[0081] (Manufacturing method of electronic components and devices)

[0082] Next, a method for manufacturing an electronic component device 3 using an electronic component sealing sheet 1 will be described.

[0083] The manufacturing method includes: preparation steps for preparing the sealing sheet 1 for electronic components and the electronic component 4 (see reference). Figure 1 ); and the sealing process of using an electronic component sealing sheet 1 to seal the electronic component 4, thereby forming a sealing layer 5 (see reference). Figure 2 ).

[0084] (Preparation process)

[0085] like Figure 1 As shown, in the preparation process, the aforementioned electronic component sealing sheet 1 (preferably a B-grade electronic component sealing sheet 1) is prepared. Additionally, as... Figure 1 As shown by the imaginary line, in the preparation process, electronic components 4 are prepared to be mounted on the substrate 2.

[0086] Multiple electronic components 4 are arranged spaced apart from each other on the first substrate surface 11 (described later) of the substrate 2. Each of the multiple electronic components 4 has a generally flat plate shape along the surface direction. Specifically, each of the multiple electronic components 4 has a first component surface 8, a second component surface 9, and a component peripheral surface 10 in succession.

[0087] The first element surface 8 and the second element surface 9 are spaced apart from each other in the thickness direction and are parallel planes.

[0088] The peripheral side surface 10 of the component connects the peripheral edges of the first component surface 8 and the second component surface 9 in the thickness direction. The peripheral side surface 10 extends along the thickness direction, and more specifically, the peripheral side surface 10 is orthogonal to the surface direction.

[0089] The electronic component 4 is not particularly limited and various electronic components can be listed, such as hollow electronic components and semiconductor components. Multiple electronic components 4 are mounted opposite the first substrate surface 11 of the substrate 2. Specifically, the multiple electronic components 4 are flip-chip mounted relative to the substrate 2. In this case, electrodes (not shown) provided on the second component surface 9 of the multiple electronic components 4 are electrically connected to terminals (not shown) provided on the first substrate surface 11 of the substrate 2. Furthermore, the electronic components 4 can be chip-bonded to the substrate 2 via an adhesive layer (such as a chip bonding film, not shown).

[0090] The material used for electronic component 4 is not particularly limited, and examples include hard materials such as silicon.

[0091] The thickness t2 of the electronic component 4 is, for example, 0.05 mm or more, preferably 0.10 mm or more, and also, for example, 0.5 mm or less, preferably 0.4 mm or less, more preferably 0.3 mm or less. The thickness t2 of the electronic component 4 is the distance between the first component surface 8 and the second component surface 9.

[0092] If the thickness t2 of the electronic component 4 is below the aforementioned upper limit, it is possible to prevent the electronic component device 3 from being limited by thickness in advance.

[0093] On the other hand, if the thickness t2 of the electronic component 4 is above the aforementioned lower limit, it can sufficiently ensure the area of ​​the peripheral side 10 of the electronic component 4 in contact with the sealing layer 5, thereby improving the sealing performance provided by the sealing layer 5.

[0094] If the length (and thus the area) of the first substrate surface 11 of the electronic component 4 fixed to the substrate 2 is ensured, the surface length of the electronic component 4 (or the maximum length of the four sides if the electronic component 4 is a top-view rectangle) is not particularly limited, for example, it is 0.01 mm or more, preferably 0.1 mm or more, and for example, 10 mm or less, preferably 1 mm or less.

[0095] Furthermore, as long as the gap is filled by the electronic component sealing sheet 1 and can contact the first substrate surface 11 of the substrate 2, the gap between adjacent electronic components 4 is not particularly limited, for example, it is 0.01 mm or more, preferably 0.1 mm or more, and for example, 10 mm or less, preferably 1 mm or less.

[0096] The electronic component mounting substrate 13 includes both a substrate 2 and electronic components 4. In other words, the electronic component mounting substrate 13 includes a plurality of electronic components 4 and a substrate 2 for mounting the plurality of electronic components 4. Preferably, the electronic component mounting substrate 13 consists only of a plurality of electronic components 4 and a substrate 2.

[0097] The substrate 2 has a generally flat shape extending along the surface direction. Viewed from above, the substrate 2 has a size that surrounds a plurality of electronic components 4. The substrate 2 includes a first substrate surface 11 as one side in the thickness direction and a second substrate surface 12 as the other side in the thickness direction.

[0098] The first substrate surface 11 is exposed to the thickness direction. The first substrate surface 11 is provided with terminals (not shown) for flip-chip mounting with electronic components 4.

[0099] The second substrate surface 12 is a plane parallel to the first substrate surface 11.

[0100] The material of substrate 2 is not particularly limited, and examples include resin, ceramics (alumina, etc.), and metals. From the viewpoint of ensuring a low coefficient of linear expansion, ceramics are preferred.

[0101] The thickness t3 of the substrate 2 is not particularly limited, for example, it is 10 μm or more, for example, 1,000 μm or less, preferably 500 μm or less.

[0102] (Sealing process)

[0103] In the sealing process, such as Figure 1 arrows and Figure 2 As shown, the electronic component 4 is then sealed using the electronic component sealing sheet 1.

[0104] For example, the electronic component sealing sheet 1 is hot-pressed relative to the electronic component mounting substrate 13. The temperature, time, and pressure of the hot pressing are not particularly limited. Through this hot pressing, the electronic component sealing sheet 1 (especially the second sheet surface 7) is deformed.

[0105] Thus, the second sheet surface 7 of the electronic component sealing sheet 1 contacts the first component surface 8 and the component peripheral surface 10 of the electronic component 4, as well as the first substrate surface 11 around the electronic component 4 in the substrate 2, and the electronic component sealing sheet 1 embeds the electronic component 4.

[0106] After the above hot pressing, if the material of the electronic component sealing sheet 1 contains thermosetting components and the electronic component sealing sheet 1 is of grade B, then the electronic component sealing sheet 1 is heated to completely cure it (grade C). Thus, a sealing layer 5 is formed from the electronic component sealing sheet 1.

[0107] like Figure 2 As shown by the rough imaginary lines, subsequently, in the electronic component device 3, the substrate 2 and sealing layer 5 surrounding the electronic component 4 are cut. For example, a cutting tape 14, indicated by imaginary lines, is placed on the second substrate surface 12 of the substrate 2, and then, a cutting saw (not shown) is used to cut the substrate 2 and sealing layer 5 between adjacent electronic components 4 along the surface direction. Furthermore, the substrate 2 and sealing layer 5 on the outer side of the electronic component 4 are cut along the surface direction (in other words, shape processing is performed).

[0108] Thus, an electronic component device 3 is obtained, comprising a substrate 2, an electronic component 4, and a sealing layer 5. The electronic component device 3 preferably consists only of the substrate 2, the electronic component 4, and the sealing layer 5.

[0109] In the electronic component device 3, the communication between the electronic component 4 and the outside is isolated by the substrate 2 and the sealing layer 5. In other words, the electronic component 4 is isolated from the outside. In other words, multiple electronic components 4 are sealed by the sealing layer 5.

[0110] like Figure 2 As shown by (the imaginary line), the sealing layer 5 has a first sealing surface 15, a second sealing surface 16, and a sealing peripheral surface 21.

[0111] The first sealing surface 15 is formed by the first sheet surface 6 of the electronic component sealing sheet 1. The first sealing surface 15 is a plane along the surface direction.

[0112] The second sealing surface 16 is formed from the second sheet surface 7 of the electronic component sealing sheet 1, and in cross-section, it has a generally U-shaped (generally heart-shaped) shape with an opening on the other side in the thickness direction. Specifically, the second sealing surface 16 continuously has a component contact surface 17 that contacts the electronic component 4 and a substrate contact surface 18 that contacts the substrate 2.

[0113] The component contact surface 17 contacts (closes) both the first component surface 8 and the peripheral surface surface 10 of the electronic component 4. In other words, the component contact surface 17 has a shape corresponding to the electronic component 4. Specifically, the component contact surface 17 continuously has a third sealing surface 19 that contacts the first component surface 8 and a fourth sealing surface 20 that contacts the peripheral surface surface 10.

[0114] The third sealing surface 19 has the same shape as the first element surface 8 of the electronic component 4 when viewed from above.

[0115] The fourth sealing surface 20 is an inner surface extending from the peripheral edge of the third sealing surface 19 toward the other side in the thickness direction. When viewed from the side, the fourth sealing surface 20 has the same shape as the peripheral surface 10 of the electronic component 4.

[0116] The substrate contact surface 18 is continuous with the other end edge of the fourth sealing surface 20 in the thickness direction, and has a shape that extends outward in the surface direction from the other end edge of the fourth sealing surface 20 in the thickness direction. The substrate contact surface 18 contacts (closes) the first substrate surface 11 around the electronic component 4 in the substrate 2. Therefore, the substrate contact surface 18 has the same planar shape as the first substrate surface 11 around the electronic component 4 in the substrate 2.

[0117] The sealing peripheral surface 21 is a peripheral surface that connects the peripheral edges of the first sealing surface 15 and the second sealing surface 16 (substrate contact surface 18). The sealing peripheral surface 21 has a shape that extends along the thickness direction. It should be noted that the angle between the sealing peripheral surface 21 and the first sealing surface 15 is, for example, 60 degrees or more, preferably 80 degrees or more, and also, for example, 120 degrees or less, preferably 100 degrees or less, and most preferably 90 degrees (right angle).

[0118] The thickness t1 of the sealing layer 5 is the thickness of the portion that contacts one surface 8 of the electronic component 4 in the thickness direction; in other words, it is the minimum thickness of the sealing layer 5, for example, 0.15 mm or more, preferably 0.17 mm or more, more preferably 0.19 mm or more, and even more preferably 0.20 mm or more. It is also, for example, 0.50 mm or less, preferably 0.40 mm or less, and more preferably 0.35 mm or less. The thickness t1 of the sealing layer 5 is the distance in the thickness direction between the first sealing surface 15 and the third sealing surface 19.

[0119] If the thickness t1 of the sealing layer 5 is above the lower limit mentioned above, the electronic component 4 can be reliably sealed using the sealing layer 5. Specifically, damage or defects in the sealing layer 5 that are in contact with one surface 8 in the thickness direction of the electronic component 4 can be suppressed, thus improving the sealing performance provided by the sealing layer 5.

[0120] If the thickness t1 of the sealing layer 5 is below the aforementioned upper limit, it is possible to prevent the electronic component device 3 from becoming too thick, thus preventing the electronic component device 3 from being limited by its thickness. Furthermore, the peripheral end of the first sealing surface 15 of the sealing layer 5 can be formed into a desired shape.

[0121] It should be noted that the maximum thickness of the sealing layer 5 is the sum of the minimum thickness t1 mentioned above and the thickness t2 of the electronic component 4 (=t1+t2), specifically, it is the distance in the thickness direction between the first sealing surface 15 and the substrate contact surface 18. Furthermore, the maximum thickness of the sealing layer 5 is also the thickness direction length of the sealing peripheral side surface 21. The maximum thickness of the sealing layer 5 is, for example, 0.30 mm or more, preferably 0.35 mm or more, and also, for example, less than 0.50 mm, preferably less than 0.45 mm.

[0122] Furthermore, the ratio of the maximum thickness (t1+t2) of the sealing layer 5 to the minimum thickness t1 of the sealing layer 5 ([t1+t2] / t1) is, for example, 1.4 or more, preferably 1.7 or more, and for example, 2.2 or less, preferably 2.0 or less.

[0123] In addition, the ratio of the maximum thickness (t1+t2) of the sealing layer 5 to the thickness T of the sealing sheet 1 for electronic components ([t1+t2] / T) is, for example, 0.8 or more, preferably 1.0 or more, and, for example, 1.6 or less, preferably 1.4 or less.

[0124] The length L of the substrate contact surface 18 of the sealing layer 5 in the surface direction is, for example, 0.01 mm or more, preferably 0.02 mm or more, and for example, 1.0 mm or less, preferably 0.5 mm or less. It should be noted that the length L of the substrate contact surface 18 is the shortest distance L from the peripheral edge of the second element surface 9 of the electronic component 4 to the other edge of the sealing peripheral surface 21 in the thickness direction. It is also the contact length L when the substrate contact surface 18 contacts the first substrate surface 11 of the substrate 2 as it moves outward from the other edge in the thickness direction of the fourth sealing surface 20. Furthermore, since the sealing layer 5 and the electronic component 4 are both approximately rectangular in plan view, when the four sealing peripheral surfaces 21 of the sealing layer 5 are parallel to the four element peripheral surfaces 10 of the electronic component 4 in plan view, the length L of the substrate contact surface 18 is the shortest distance between adjacent sealing peripheral surfaces 21 and element peripheral surfaces 10.

[0125] The tensile storage modulus E' of the sealing layer 5 at 25°C is, for example, 5,000 N / mm². 2 Above, preferably 9,000 N / mm 2 ]Above, more preferably 10,000 [N / mm 2 The above, and more preferably, is 13,000 [N / mm] 2 The above, and for example, 20,000 [N / mm] 2 The value is preferably 15,000 N / mm. 2 The value is 14,000 N / mm², or more preferably 14,000 N / mm². 2The following should be noted: The tensile storage modulus E' of the sealing layer 5 at 25°C will be described in detail in the embodiments described later.

[0126] and, Figure 1 The thickness T of the sealing sheet 1 for the electronic component shown is related to... Figure 2 The product (T×E'[N / mm]) of the tensile storage modulus E' at 25°C of the sealing layer 5 shown is 3,000[N / mm] or more. Furthermore, the product is preferably 3,300[N / mm] or more, more preferably 3,500[N / mm] or more, further preferably 3,700[N / mm] or more, particularly preferably 3,900[N / mm] or more, most preferably 4,000[N / mm] or more, and even more preferably 4,300[N / mm] or more. If the product does not meet the lower limit mentioned above, as detailed below, the sealing layer 5 cannot maintain the desired shape, and the shape stability of the sealing layer 5 decreases.

[0127] On the other hand, the product is 5,000 [N / mm] or less. Furthermore, the product is preferably 4,850 [N / mm] or less, more preferably 4,500 [N / mm] or less. If the product exceeds the above upper limit, as detailed below, it will be impossible to prevent the electronic component 4 and the sealing layer 5 from peeling off from the substrate 2.

[0128] From the viewpoint of limiting the use of electronic component device 3, the thickness T0 of electronic component device 3 is, for example, 1.0 mm or less. From the viewpoint of manufacturing a thinner electronic component device 3, the thickness T0 of electronic component device 3 is preferably 0.8 mm or less, and more preferably, for example, 0.3 mm or more, and more preferably, for example, 0.5 mm or more. The thickness T0 of electronic component device 3 is the sum of the thickness t1 of sealing layer 5, the thickness t2 of electronic component 4, and the thickness t3 of substrate 2 (=t1+t2+t3). In addition, it is the thickness direction length (distance) between the second substrate surface 12 of substrate 2 and the first sealing surface 15 of sealing layer.

[0129] [1] When the product of the above-mentioned factors exceeds 5,000 [N / mm] due to the relatively thick thickness T of the electronic component sealing sheet 1 and the high tensile storage modulus E' of the sealing layer 5 at 25°C, the electronic component sealing sheet 1 is used to form the sealing layer 5 by applying pressure to the electronic component 4. Internal stress is generated in the thick electronic component sealing sheet 1, and the internal stress cannot be relaxed in the hardened sealing layer 5 after curing, resulting in residue. Therefore, the electronic component 4 and the sealing layer 5 peel off from the substrate 2.

[0130] In addition, if the thickness T of the sealing sheet 1 for electronic components is not as thick as described above [1], but the product of the above-mentioned product exceeds 5,000 [N / mm] due to the excessively high tensile storage modulus E' of the sealing layer 5 at 25°C, or if the tensile storage modulus E' of the sealing layer 5 at 25°C is not as high as described above [1], but the product of the above-mentioned product exceeds 5,000 [N / mm] due to the excessively thick thickness T of the sealing sheet 1 for electronic components, the electronic component 4 and the sealing layer 5 will peel off from the substrate 2 in the same manner as described above.

[0131] However, since the product of the electronic component sealing sheet 1 is less than 5,000 [N / mm], when the electronic component sealing sheet 1 is used to form a sealing layer 5 by applying pressure to the electronic component 4, even if the electronic component sealing sheet 1 generates internal stress, the internal stress will relax in the cured sealing layer 5. Therefore, it is possible to suppress the peeling of the electronic component 4 and the sealing layer 5 from the substrate 2.

[0132] In addition, [2] when the product of the above is less than 3,000 [N / mm] due to the thinness T of the electronic component sealing sheet 1 and the low tensile storage modulus E' of the sealing layer 5 at 25°C, the thin electronic component sealing sheet 1 tends to move towards the outside of the electronic component 4 when the electronic component sealing sheet 1 is pressed relative to the electronic component 4 and used to form the sealing layer 5, the soft sealing layer 5 after curing is difficult to maintain the desired shape.

[0133] On the other hand, if the thickness T of the sealing sheet 1 for electronic components is not as thin as described above [2], but the product of the above is less than 3,000 [N / mm] due to the low tensile storage modulus E' of the sealing layer 5 at 25°C, or if the tensile storage modulus E' of the sealing layer 5 at 25°C is not as low as described above [2], but the product of the above is less than 3,000 [N / mm] due to the low tensile storage modulus E' of the sealing layer 5 at 25°C, then, similarly as described above, the sealing layer 5 is difficult to maintain the desired shape.

[0134] However, since the product of the electronic component sealing sheet 1 is 3,000 [N / mm] or more, when the electronic component sealing sheet 1 is used to form a sealing layer 5 by applying pressure to the electronic component 4, the sealing layer 5 can maintain the desired shape. Therefore, the shape stability of the sealing layer 5 is excellent.

[0135] As a result, the sealing sheet 1 for electronic components can suppress the peeling of electronic components 4 and sealing layer 5 from substrate 2, and can form sealing layer 5 with excellent shape stability.

[0136] Furthermore, if the thickness T of the sealing sheet 1 for the electronic component is 0.25 mm or more, the above product (T×E'N / mm) can be reliably set to the lower limit or above.

[0137] On the other hand, electronic component devices 3 are usually subject to a specified thickness limit, and if this thickness is exceeded, they may sometimes be unusable as products.

[0138] However, since the thickness T of the sealing sheet 1 for the electronic component is less than 0.50 mm, the aforementioned limitation of non-use due to excessive thickness of the sealing layer 5 can be suppressed. Therefore, the electronic component device 3 can be manufactured as a qualified product that meets the thickness limit.

[0139] Furthermore, if the thickness T of the sealing sheet 1 for the electronic component is less than 0.50 mm, the product can be reliably set below the aforementioned upper limit.

[0140] Furthermore, in this manufacturing method, by using the aforementioned electronic component sealing sheet 1, the electronic component mounted on the substrate 2 can be reliably sealed with the sealing layer 5. As a result, an electronic component device 3 with excellent reliability, comprising the substrate 2, the electronic component 4, and the sealing layer 5, can be manufactured.

[0141] Variations

[0142] In the following variations, the same reference numerals are used to mark the same components and processes as in the above-described embodiment, and detailed descriptions are omitted. Furthermore, unless otherwise specified, each variation achieves the same effect as the first embodiment. Additionally, an embodiment and its variations can be appropriately combined.

[0143] In one implementation, such as Figure 1 As shown, the electronic component mounting substrate 13 has a plurality of electronic components 4, but the number of them is not particularly limited, for example, such as Figure 3A As shown, there can be one. In this case, as... Figure 3B As shown by the rough imaginary line, in the electronic component device 3 having one electronic component 4, the substrate 2 and sealing layer 5 around the electronic component 4 are cut, and the size (length in the surface direction) of the electronic component device 3 in top view is adjusted (shape processing).

[0144] Example

[0145] The following examples and comparative examples illustrate the present invention in more detail. It should be noted that the present invention is not limited to the examples and comparative examples. Furthermore, the specific numerical values ​​such as proportions, property values, and parameters used in the following description can be replaced with the upper limit (defined as "below" or "less than") or lower limit (defined as "above" or "more than") of the corresponding proportions, property values, parameters, etc., described in the above "Detailed Embodiments".

[0146] The following shows the components used in the examples and comparative examples.

[0147] Epoxy resin: YSLV-80XY (bisphenol F type epoxy resin, high molecular weight epoxy resin, epoxy equivalent of 200 g / eq., softening point of 80℃) manufactured by Nippon Steel Chemical Co., Ltd.

[0148] Curing agent: LVR-8210DL (linear phenolic resin, epoxy resin curing agent, hydroxyl equivalent: 104 g / eq., softening point: 60℃) manufactured by Chung Yung Chemical Co., Ltd.

[0149] Acrylic resin: HME-2006M manufactured by Negami Kogyo Co., Ltd., a carboxyl-containing acrylate copolymer (acrylic polymer), weight average molecular weight: 600,000, glass transition temperature (Tg): -35℃, 20% by mass methyl ethyl ketone solution.

[0150] Curing accelerator: 2PHZ-PW (2-phenyl-4,5-dihydroxymethylimidazolium) manufactured by Shikoku Chemical Industry Co., Ltd., epoxy resin curing accelerator

[0151] Silane coupling agent: KBM-403 (3-epoxypropoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd.

[0152] Carbon black: #20 manufactured by Mitsubishi Chemical Corporation

[0153] First filler: FB-8SM (spherical fused silica powder (inorganic filler), average particle size 7.0μm)

[0154] The second filler: an inorganic filler obtained by surface treatment of Admatechs SC220G-SMJ (average particle size 0.5 μm) with 3-methacryloyloxypropyltrimethoxysilane (product name: KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.). The product obtained by surface treatment of 100 parts by weight of the inorganic filler with 1 part by weight of silane coupling agent.

[0155] Examples 1 to 6 and Comparative Examples 1 to 8

[0156] Prepare a sealing composition according to the formulation described in Table 1, such as... Figure 1 As shown, an electronic component sealing sheet 1 with the thickness T described in Table 1 is manufactured from this sealing composition.

[0157] Subsequently, as Figure 2 As shown, multiple electronic components 4 are sealed using an electronic component sealing sheet 1 to form a sealing layer 5.

[0158] Specifically, multiple electronic components 4, formed of silicon and having a square diameter of 3 mm and a thickness t2 as described in Table 1, are prepared. These components are then bonded to the first substrate surface 11 of a substrate 2, formed of aluminum oxide and having a square diameter of 50 mm and a thickness t3 of 0.22 mm, using a 20 μm thick chip bonding film (adhesive layer). It should be noted that the spacing between adjacent electronic components 4 is 0.3 mm.

[0159] Therefore, as Figure 1 As shown, an electronic component mounting substrate 13 with multiple electronic components 4 and substrate 2 is prepared.

[0160] Next, the electronic component sealing sheet 1 is placed on one side of the electronic component mounting substrate 13 in the thickness direction. Then, under conditions of 75°C, 60 seconds, and 100 kPa, the electronic component sealing sheet 1 is vacuum-pressurized relative to the electronic component mounting substrate 1 to embed multiple electronic components 4. Subsequently, the electronic component mounting substrate 13 and the electronic component sealing sheet 1 are heated at 150°C for 1 hour to C-step the electronic component sealing sheet 1.

[0161] Subsequently, as Figure 2 As shown by the rough imaginary lines, the sealing layer 5 and the substrate 2 surrounding each of the multiple electronic components 4 are cut. This manufactures an electronic component assembly (electronic component package) 3 comprising the substrate 2, electronic components 4, and sealing layer 5. The length (average length) L of the substrate contact surface 18 is 0.15 mm.

[0162] (evaluate)

[0163] Evaluate the following items. Record the results in Table 1.

[0164] (Tensive storage modulus E' of sealing sheets and sealing layers for electronic components)

[0165] The sealing sheet 1 for electronic components is machined to a length of 0.1 cm and a width of 5 cm, and then allowed to fully cure to obtain a cured sample (equivalent to sealing layer 5). The tensile storage modulus E' of the cured sample at 25°C is then calculated.

[0166] Details of the measuring apparatus and measuring conditions are shown below.

[0167] Measuring apparatus: Solid viscoelasticity measuring apparatus (Model: RSA-G2, manufactured by TA Instruments).

[0168] Mode: Stretch

[0169] Scanning temperature: 0~260℃

[0170] Heating rate: 10℃ / minute

[0171] Frequency: 1Hz

[0172] Strain: 0.05%

[0173] Furthermore, the relationship between the thickness T of the sealing sheet 1 for electronic components and the tensile storage modulus E' of the sealing layer 5 is shown in the figure. Figure 6 .

[0174] It should be noted that, Figure 6 The diagram shows lines with a product (T×E'[N / mm]) of 3,000 [N / mm] and lines with a product (T×E'[N / mm]) of 5,000 [N / mm]. The area enclosed by these two lines represents the range where the product is 3,000 [N / mm] or more and 5,000 [N / mm] or less. Figure 6 In the image, the aforementioned area is represented by a shadow.

[0175] (Evaluation of bond strength) (Observation of peeling)

[0176] The following temperature cycling test was performed on electronic component device 3.

[0177] Temperature: -40℃ to 85℃

[0178] Total transfer time: less than 1 minute

[0179] Total Dwell Time: 10 minutes or more

[0180] Specified time reached in: less than 15 minutes

[0181] Loop: 1000 loops

[0182] Furthermore, using an ultrasonic imaging device [SAT] (manufactured by Hitachi Construction Machinery Fine Tech Co., Ltd., "Fine SAT II"), the interface between the substrate 2 and the electronic component 4, as well as the interface between the substrate 2 and the sealing layer 5, were observed and evaluated according to the following criteria.

[0183] ○: No peeling was observed at the interface between substrate 2 and electronic component 4, nor at the interface between substrate 2 and sealing layer 5.

[0184] △: Delamination was observed at the interface between substrate 2 and electronic component 4. However, no delamination was observed at the interface between substrate 2 and sealing layer 5. (See reference) Figure 4B and Figure 5B It should be noted that, in Figure 4B and Figure 5B In this example, a gap is intentionally depicted between the substrate 2 and the electronic component 4. However, there is actually no gap in this evaluation example. It is simply an example of the fixation (adhesion) (joining) offset (peeling) of the electronic component 4 to the substrate 2. The gap is depicted in order to make the above "peeling" easy to understand and show.

[0185] ×: Delamination was observed at the interface between substrate 2 and electronic component 4. Delamination was also observed at the interface between substrate 2 and sealing layer 5.

[0186] Shape of the sealing layer (shape stability)

[0187] The shape of the peripheral edge of the first sealing surface 15 of the sealing layer 5 in the electronic component device 3 was observed using a laser microscope (Lasertec H300), and the shape stability of the sealing layer was evaluated according to the following criteria.

[0188] ○: The corner of the peripheral edge of the first sealing surface 15 of the sealing layer 5 (one end in the thickness direction) is maintained, and the thickness is the designed thickness.

[0189] ×: The peripheral edge of the first sealing surface 15 of the sealing layer 5 becomes rounded or the thickness becomes thinner than the designed thickness.

[0190]

[0191] It should be noted that the above-described invention is provided as an exemplary embodiment of the present invention, and is merely an illustration, not a limiting interpretation. Variations of the present invention that will be obvious to those skilled in the art are included in the above-described technical solutions.

Claims

1. A sealing sheet, characterized in that, It is used to form a sealing layer that seals electronic components, which are mounted with one side facing the thickness direction of the substrate. When sealing the electronic components, the sealing layer contacts a side of the substrate in the thickness direction that is not facing the electronic components. The minimum thickness t1 of the sealing layer is the thickness of the portion in contact with one side of the electronic component in the thickness direction, and is 0.15 mm or more and 0.50 mm or less. The product of the thickness T of the sealing sheet and the tensile storage modulus E' of the sealing layer at 25°C, T×E', is 3,000 N / mm or more and 5,000 N / mm or less. Wherein, the thickness T is in mm, and the tensile storage modulus E' is in N / mm. 2 The product T×E' is in N / mm.

2. The sealing sheet according to claim 1, characterized in that, The thickness T of the sealing sheet is 0.25 mm or more and less than 0.50 mm.

3. A method for manufacturing an electronic component device, characterized in that, Electronic components are sealed using the sealing sheet as described in claim 1 or 2.

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