Encapsulation mold, encapsulation mold assembly, and coil structure encapsulation system

Abstract

The present invention discloses a packaging mold, a packaging mold assembly and a coil structure packaging system. Among them, the packaging mold includes: a mandrel, which is rod-shaped for extending into the central hole of the coil structure; a flange, which extends outward from the outer periphery of the mandrel, and at least one notch structure is provided on the flange, and the notch structure extends from the outer periphery of the flange towards the mandrel. The present invention solves the technical problem of poor exhaust performance during the packaging of the coil structure in the prior art.

Description

Technical Field

[0001] The present invention relates to the technical field of encapsulation equipment, and more particularly, to an encapsulation mold, an encapsulation mold assembly, and a coil structure encapsulation system. Background Art

[0002] In the prior art, gas is generated during the encapsulation of a coil structure. If the gas cannot be discharged in time, it will affect the performance and quality of the coil structure. Currently, most of the exhaust methods are to set a waterproof ring with exhaust holes at at least one end of the skeleton. This method has poor exhaust effect and is not conducive to adjusting the encapsulation thickness of the coil structure.

[0003] In view of the above problems, no effective solution has been proposed yet. Summary of the Invention

[0004] Embodiments of the present invention provide an encapsulation mold, an encapsulation mold assembly, and a coil structure encapsulation system to at least solve the technical problem of poor exhaust performance during the encapsulation of a coil structure in the prior art.

[0005] To achieve the above object, according to one aspect of the present invention, there is provided an encapsulation mold for a coil structure, including: a mandrel, which is rod-shaped for extending into the central hole of the coil structure; a flange, which extends outward from the outer periphery of the mandrel, and at least one notch structure is provided on the flange, and the notch structure extends from the outer periphery of the flange towards the mandrel.

[0006] Further, the flange is annular.

[0007] Further, there are a plurality of notch structures, and the plurality of notch structures are arranged at equal intervals along the circumferential direction of the flange.

[0008] Further, the encapsulation mold further includes a positioning substrate, the mandrel is arranged on the positioning substrate, and at least a part of the flange protrudes from one side surface of the positioning substrate.

[0009] Further, along the extending direction of the mandrel, the first side surface of the flange is attached to one side surface of the positioning substrate, and the second side surface of the flange protrudes from one side surface of the positioning substrate and is parallel to each other.

[0010] Further, the encapsulation mold further includes an ejection mechanism, and the ejection mechanism is telescopically arranged on the positioning substrate.

[0011] Further, the flange is located at the end of the mandrel and is flush with the end face of the end.

[0012] Further, the flange is made of H13 material and its surface is chrome-plated, and the mandrel is made of H13 material and its surface is coated with a titanium nitride coating.

[0013] Further, the depth of the notch structure is greater than or equal to 0.02 mm and less than or equal to 2 mm.

[0014] Further, the flange is detachably connected to the mandrel, there are multiple flanges, and the thicknesses of different flanges are different to selectively connect to the mandrel.

[0015] According to another aspect of the present invention, there is provided a packaging mold assembly for a coil structure, including the above-mentioned packaging mold, and the thicknesses of the flanges of different packaging molds are different.

[0016] According to another aspect of the present invention, there is provided a coil structure packaging system, including: a coil structure; a packaging mold, and the packaging mold is the above-mentioned packaging mold.

[0017] Further, the coil structure includes a skeleton, and the skeleton has a central hole.

[0018] Further, waterproof ring structures are provided on the upper and lower end faces of the skeleton.

[0019] Further, the waterproof ring structure extends circumferentially around the central hole.

[0020] Further, the waterproof ring structure forms a boss structure, and the boss structure is correspondingly arranged with the flange.

[0021] Applying the technical solution of the present invention, the packaging mold includes a mandrel and a flange. The mandrel is rod-shaped for extending into the central hole of the coil structure; the flange extends outward from the outer periphery of the mandrel, and at least one notch structure is provided on the flange, and the notch structure extends from the outer periphery of the flange towards the mandrel. The packaging mold is used for packaging the coil structure. When packaging, the central hole of the coil structure is sleeved on the mandrel, and the flange abuts against one end of the coil structure. Since the notch structure is provided on the flange, the gas generated during packaging will flow along the notch structure into the gap between the inner wall of the central hole of the coil structure and the outer wall of the mandrel, and finally be discharged along the gap. In this way, it can effectively avoid the influence of gas on the packaging of the coil structure, which is beneficial to improving the quality of the coil structure; in addition, the packaging thickness of the coil structure can be changed by adjusting the thickness of the flange. This method is convenient to operate, has strong reliability, and low cost. Description of the Drawings

[0022] The drawings described herein are used to provide a further understanding of the present invention, form a part of this application, and the schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0023] Figure 1 Shows a schematic structural diagram of the packaging mold of the embodiment of the present invention;

[0024] Figure 2 Shows Figure 1Schematic structural diagram of the mandrel and flange in;

[0025] Figure 3 Schematic structural diagram after the coil structure of the present invention is encapsulated;

[0026] Figure 4 Shows Figure 3 Schematic structural diagram of the skeleton in.

[0027] Wherein, the above-mentioned drawings include the following reference numerals:

[0028] 10. Mandrel; 20. Flange; 30. Notch structure; 40. Positioning substrate; 50. Ejection mechanism; 60. Skeleton; 61. Central hole; 70. Waterproof ring structure. Detailed implementation manners

[0029] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the drawings and in combination with the embodiments.

[0030] It should be pointed out that, unless otherwise specified, all technical and scientific terms used in the present application have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs.

[0031] In the present invention, unless otherwise stated, the orientation words such as "upper, lower, top, bottom" are generally in the direction shown in the drawings, or in the vertical, perpendicular or gravitational direction of the component itself; similarly, for the convenience of understanding and description, "inner, outer" refer to the inner and outer of the contour of each component itself, but the above orientation words are not used to limit the present invention.

[0032] In order to solve the problem of poor exhaust during the encapsulation of the coil structure in the prior art, the present invention provides a packaging mold, a packaging mold assembly and a coil structure packaging system. Among them, the packaging mold assembly has the following packaging mold, and the coil structure packaging system has the following packaging mold.

[0033] Embodiment 1

[0034] Such as Figure 1 、 Figure 2As shown, the encapsulation mold includes a mandrel 10 and a flange 20. The mandrel 10 is rod-shaped and is used to extend into the central hole 61 of the coil structure. The flange 20 extends outward from the outer periphery of the mandrel 10, and at least one notch structure 30 is provided on the flange 20. The notch structure 30 extends from the outer periphery of the flange 20 towards the mandrel 10. The encapsulation mold is used to encapsulate the coil structure. When encapsulating, the central hole 61 of the coil structure is sleeved on the mandrel 10, and the flange 20 abuts against one end of the coil structure. Since the notch structure 30 is provided on the flange 20, the gas generated during encapsulation will flow into the gap between the inner wall of the central hole 61 of the coil structure and the outer wall of the mandrel 10 along the notch structure 30 and finally be discharged along the gap. This can effectively avoid the influence of gas on the encapsulation of the coil structure and is beneficial to improving the quality of the coil structure. In addition, the thickness of the flange 20 can be adjusted to change the encapsulation thickness of the coil structure. This method is convenient to operate, has strong reliability, and low cost.

[0035] As Figure 1 , Figure 2 shown, the flange 20 is annular. The flange 20 is annular to better cooperate with the central hole 61 of the coil structure. While realizing the exhaust function, it can also ensure the encapsulation effect of the coil structure and avoid affecting the quality of the coil structure.

[0036] As Figure 1 , Figure 2 shown, there are multiple notch structures 30, and the multiple notch structures 30 are arranged at equal intervals along the circumferential direction of the flange 20. Since there are multiple notch structures 30, the exhaust capacity can be improved to achieve a better exhaust effect. In addition, the multiple notch structures 30 being arranged at equal intervals along the circumferential direction of the flange 20 can ensure that the air pressure received by each part of the coil structure during exhaust is relatively balanced and will not affect the encapsulation effect, which is beneficial to improving the quality of the coil structure.

[0037] As Figure 1 , Figure 2 shown, the encapsulation mold further includes a positioning substrate 40. The mandrel 10 is arranged on the positioning substrate 40, and at least a part of the flange 20 protrudes from one side surface of the positioning substrate 40. When using the encapsulation mold with the above structure, the coil structure is fixed above the positioning substrate 40 through the mandrel 10, and the coil structure is placed on the positioning substrate 40 and contacts the flange 20. Since at least a part of the flange 20 protrudes from one side surface of the positioning substrate 40, an encapsulation space is formed between the coil structure and the positioning substrate 40 for encapsulating one end face of the coil structure.

[0038] As Figure 1 , Figure 2As shown, along the extending direction of the mandrel 10, the first side surface of the flange 20 is attached to one side surface of the positioning substrate 40, and the second side surface of the flange 20 protrudes from one side surface of the positioning substrate 40 and is parallel to each other. The flange 20 is mounted on the positioning substrate 40 and protrudes therefrom for carrying the coil structure, capable of forming a packaging space between the coil structure and the positioning substrate 40. Additionally, the second side surface of the flange 20 is parallel to the surface of the positioning substrate 40 to achieve a better packaging effect, which is beneficial to improving the packaging quality.

[0039] As Figure 1 、 Figure 2 shown, the encapsulation mold further includes an ejection mechanism 50, which is telescopically arranged on the positioning substrate 40. Due to the presence of the ejection mechanism 50, after the encapsulation is completed, the encapsulated coil structure can be automatically ejected, reducing the labor intensity of the staff, making the operation more convenient, faster, and with higher work efficiency.

[0040] As Figure 1 、 Figure 2 shown, the flange 20 is located at the end of the mandrel 10 and is flush with the end face.

[0041] In this embodiment, the flange 20 is made of H13 material and its surface is chrome-plated, and the mandrel 10 is made of H13 material and its surface is coated with a titanium nitride coating. The H13 material has good hardenability and toughness, good wear resistance, high strength, high temperature resistance, and small deformation during heat treatment. Chromium has high corrosion resistance, is not easily oxidized, and has extremely high hardness. The titanium nitride coating has a high melting point, high hardness, high-temperature chemical stability, and excellent thermal conductivity. As the material of the encapsulation mold, it can well meet the encapsulation requirements, ensuring the reliability of the encapsulation and the quality of the coil structure.

[0042] Optionally, the positioning substrate 40 is made of H13 material. The H13 material has good hardenability and toughness, good wear resistance, high strength, high temperature resistance, and small deformation during heat treatment. As the material of the encapsulation mold, it can well meet the encapsulation requirements, ensuring the reliability of the encapsulation and the quality of the coil structure.

[0043] As Figure 1 、 Figure 2 shown, the depth of the notch structure 30 is greater than or equal to 0.02 mm and less than or equal to 2 mm. In this way, the function of exhausting air can be realized, and the influence on the encapsulation effect due to an overly large notch structure 30 can be avoided, which is beneficial to improving the quality of the coil structure.

[0044] As Figure 1 、 Figure 2As shown, the flange 20 is detachably connected to the mandrel 10. There are multiple flanges 20, and the thicknesses of different flanges 20 are different to selectively connect with the mandrel 10. Since the flange 20 is detachably connected to the mandrel 10, different thickness flanges 20 can be replaced according to the encapsulation requirements, which is beneficial to cost saving and is convenient and fast in operation.

[0045] In another embodiment, the encapsulation mold assembly includes an encapsulation mold, and the thicknesses of the flanges 20 of different encapsulation molds are different. In this way, different thickness flanges 20 can be selected according to the encapsulation requirements, which is beneficial to cost saving and is convenient and fast in operation.

[0046] The coil structure encapsulation system includes a coil structure and an encapsulation mold. When encapsulating the coil structure, the coil structure is installed on the encapsulation mold to achieve rapid encapsulation of the coil structure.

[0047] As Figure 3 、 Figure 4 shown, the coil structure includes a bobbin 60, and the bobbin 60 has a central hole 61. During encapsulation, the mandrel 10 is inserted into the central hole 61 to fix the coil structure. In addition, the end face on one side of the bobbin 60 contacts the flange 20, and the gas generated during the encapsulation process enters the gap between the inner wall of the central hole 61 and the outer wall of the mandrel 10 through the notch structure 30 and finally discharges along the gap, effectively avoiding the influence of the gas on the encapsulation effect.

[0048] Embodiment 2

[0049] The difference from Embodiment 1 is that a waterproof ring structure 70 is provided on the bobbin 60.

[0050] In this embodiment, waterproof ring structures 70 are provided on the upper and lower end faces of the bobbin 60. During encapsulation, the bobbin 60 abuts against the flange 20 through the waterproof ring structure 70 to form an encapsulation space between the bobbin 60 and the flange 20, and then the coil structure is encapsulated; moreover, the bobbin 60 and the flange 20 are in contact through the waterproof ring structure 70, increasing the reliability of the encapsulation and avoiding the direct contact between the flange 20 and the end face of the bobbin 60 from affecting the encapsulation effect.

[0051] As Figure 3 、 Figure 4 shown, the waterproof ring structure 70 extends circumferentially around the central hole 61. The waterproof ring structure 70 is cooperatively arranged with the flange 20 to ensure that the bobbin 60 and the flange 20 are in contact through the waterproof ring structure 70, better ensuring the reliability of the encapsulation.

[0052] In this embodiment, the waterproof ring structure 70 forms a boss structure, and the boss structure is correspondingly arranged with the flange 20.

[0053] As can be seen from the above description, the above embodiments of the present invention achieve the following technical effects:

[0054] 1. A notch structure is provided on the flange of the encapsulation mold. During encapsulation, gas is discharged through the notch structure, improving the encapsulation quality of the coil structure;

[0055] 2. By adjusting the thickness of the flange, the change of the encapsulation thickness of the coil structure can be realized. This method is convenient to operate, has strong reliability and low cost;

[0056] 3. The skeleton and the flange are in contact through a waterproof ring structure, increasing the reliability of the encapsulation and avoiding the influence on the encapsulation effect caused by the direct contact between the end faces of the flange and the skeleton.

[0057] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0058] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless otherwise clearly specified in the context, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0059] It should be noted that the terms "first", "second", etc. in the description, claims and drawings of the present application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order different from those illustrated or described herein.

[0060] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An encapsulation mold for a coil structure, characterized in that Comprising: A mandrel (10), the mandrel (10) being rod-shaped for extending into the central hole (61) of a coil structure; A flange (20), the flange (20) protruding outward from the outer periphery of the mandrel (10), at least one notch structure (30) being provided on the flange (20), the notch structure (30) extending from the outer periphery of the flange (20) towards the mandrel (10); A positioning substrate (40), the mandrel (10) being provided on the positioning substrate (40), and at least a part of the flange (20) protruding from one side surface of the positioning substrate (40); An ejection mechanism (50), the ejection mechanism (50) being telescopically provided on the positioning substrate (40); The flange (20) is detachably connected to the mandrel (10); There are a plurality of the flanges (20), and the thicknesses of different flanges (20) are different to selectively connect with the mandrel (10); Along the extending direction of the mandrel (10), the first side surface of the flange (20) is in contact with the one side surface of the positioning substrate (40), and the second side surface of the flange (20) protrudes from the one side surface of the positioning substrate (40) and is parallel to each other; The flange (20) is used to abut against a waterproof ring structure (70) on a skeleton (60) of the coil structure, so as to form a packaging space between the skeleton (60) of the coil structure and the flange (20).

2. The encapsulation mold according to claim 1, wherein The flange (20) is annular.

3. The encapsulation mold according to claim 2, wherein There are a plurality of the notch structures (30), and the plurality of notch structures (30) are equidistantly arranged along the circumferential direction of the flange (20).

4. The encapsulation mold according to any one of claims 1 to 3, characterized in that The flange (20) is located at the end of the mandrel (10) and is flush with the end face of the end.

5. The encapsulation mold according to any one of claims 1 to 3, characterized in that, The flange (20) is made of H13 material and its surface is chrome-plated, and the mandrel (10) is made of H13 material and its surface is coated with a titanium nitride coating.

6. The encapsulation mold according to any one of claims 1 to 3, characterized in that, The depth of the notch structure (30) is greater than or equal to 0.02 mm and less than or equal to 2 mm.

7. A packaging mold assembly for a coil structure, characterized in that, Including the packaging mold according to any one of claims 1 to 6, and the thicknesses of the flanges (20) of different packaging molds are different.

8. A coil structure encapsulation system, characterized in that, Comprising: A coil structure; A packaging mold, the packaging mold being the packaging mold according to any one of claims 1 to 6.

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