A radio frequency power amplifier

Abstract

The present invention provides a radio frequency power amplifier, which relates to the field of communication technology. The radio frequency power amplifier includes a dual-channel packaged power amplifier tube, an input matching circuit, an input bias circuit, an output matching circuit, and an output bias circuit. The input matching circuit is connected to the input end of the dual-channel packaged power amplifier tube, the output matching circuit is connected to the output end of the dual-channel packaged power amplifier tube, and the input bias circuit is connected to the input matching circuit. The output bias circuit includes a first output bias circuit and a second output bias circuit, both of which are connected to the output matching circuit. The first output bias circuit is a dual bias circuit, and the second output bias circuit is a single bias circuit. Compared with the prior art, the radio frequency power amplifier provided by the present invention can not only broaden the video bandwidth of the power amplifier, but also meet the structural dimensions of the dual-channel packaged power amplifier tube and reduce the occupied area on the circuit board.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a radio frequency power amplifier. Background Art

[0002] With the development of communication technology, communication systems are gradually developing towards high efficiency and miniaturization. The modulation methods of communication systems are becoming more and more complex, and the signal bandwidths they process are becoming wider and wider.

[0003] The power amplifier module in the communication system is usually a Doherty architecture combined with a digital pre-distortion algorithm. In order to reduce the layout area of the Doherty power amplifier circuit on the circuit board, a dual-channel package type power amplifier tube is usually used. At present, the signal bandwidth processed by the digital pre-distortion system is getting wider and wider. The broadband digital pre-distortion system requires the Doherty power amplifier to have a sufficiently wide video bandwidth, which is usually more than 3 times the bandwidth of the digital pre-distortion signal. In the existing technology for the circuit board design of the Doherty power amplifier circuit PCB, when using a dual-channel package type power amplifier tube for board-level power amplifier design, a single bias power supply form is usually adopted. In this way, its video bandwidth will be greatly limited, which is very unfriendly to the broadband correction ability of the digital pre-distortion.

[0004] It can be seen from this that how to maximize the video bandwidth of dual-channel packaged power amplifier tubes during circuit design is an urgent problem that needs to be solved. Summary of the Invention

[0005] The object of the present invention is to provide a radio frequency power amplifier, which can not only broaden the video bandwidth of the power amplifier, but also meet the structural dimensions of a dual-channel packaged power amplifier tube and reduce the occupied area on a circuit board.

[0006] The present invention is achieved by adopting the following technical solutions.

[0007] A radio frequency power amplifier includes a dual-channel packaged power amplifier tube, an input matching circuit, an input bias circuit, an output matching circuit, and an output bias circuit. The input matching circuit is connected to the input end of the dual-channel packaged power amplifier tube, the output matching circuit is connected to the output end of the dual-channel packaged power amplifier tube, and the input bias circuit is connected to the input matching circuit. The output bias circuit includes a first output bias circuit and a second output bias circuit. Both the first output bias circuit and the second output bias circuit are connected to the output matching circuit. The first output bias circuit is a dual bias circuit, and the second output bias circuit is a single bias circuit.

[0008] Furthermore, the output matching circuit includes a first output matching circuit and a second output matching circuit, both of which are connected to the output end of the dual-channel packaged power amplifier tube, the first output bias circuit is connected to the first output matching circuit, and the second output bias circuit is connected to the second output matching circuit.

[0009] Furthermore, the first output bias circuit includes two first output bias lines and two first capacitors, one end of the two first output bias lines is respectively connected to the first output matching circuit, and the other end of the two first output bias lines is grounded through a first capacitor.

[0010] Furthermore, the second output bias circuit includes a second output bias line and a second capacitor, one end of the second output bias line is connected to the second output matching circuit, and the other end of the second output bias line is grounded through the second capacitor.

[0011] Furthermore, the output end of the single bias circuit and one of the output ends of the dual bias circuit are respectively located on both sides of the pins of the dual packaged power amplifier tube, and the other output end of the dual bias circuit is located between the two output ends.

[0012] Furthermore, the input matching circuit includes a first input matching circuit and a second input matching circuit, both of which are connected to the input end of the dual-channel packaged power amplifier tube, and the input bias circuit is respectively connected to the first input matching circuit and the second input matching circuit.

[0013] Furthermore, the input bias circuit includes a first input bias circuit and a second input bias circuit, the first input bias circuit is connected to the first input matching circuit, the second input bias circuit is connected to the second input matching circuit, and the first input bias circuit is a dual bias circuit, and the second input bias circuit is a single bias circuit.

[0014] Furthermore, the first input bias circuit includes two first input bias lines, two first resistors and two third capacitors, one end of the two first input bias lines is connected to the first input matching circuit through a first resistor respectively, and the other end of the two first input bias lines is grounded through a third capacitor respectively.

[0015] Furthermore, the second input bias circuit includes a second input bias line, a second resistor and a fourth capacitor. One end of the second input bias line is connected to the second input matching circuit through the second resistor, and the other end of the second input bias line is grounded through the fourth capacitor.

[0016] Furthermore, the dual-channel packaged power amplifier tube includes two amplification channels and a tube shell, and two input pins are provided on one side of the tube shell, the two input pins are connected to the input matching circuit, and two output pins are provided on the other side of the tube shell, the two output pins are connected to the output matching circuit.

[0017] A radio frequency power amplifier includes a power splitter module, a dual-channel packaged power amplifier tube, a circuit board, an input matching circuit, an input bias circuit, an output matching circuit, and an output bias circuit. The dual-channel packaged power amplifier tube, the input matching circuit, the input bias circuit, the output matching circuit, and the output bias circuit are all arranged on the circuit board. The input matching circuit is connected to the input end of the dual-channel packaged power amplifier tube, the power splitter module is connected to the input matching circuit, the output matching circuit is connected to the output end of the dual-channel packaged power amplifier tube, and the input bias circuit is connected to the input matching circuit. The output bias circuit includes a first output bias circuit and a second output bias circuit. Both the first output bias circuit and the second output bias circuit are connected to the output matching circuit. The first output bias circuit is a dual bias circuit, and the second output bias circuit is a single bias circuit.

[0018] The present invention has the following beneficial effects:

[0019] The present invention provides a radio frequency power amplifier, wherein an input matching circuit is connected to the input end of a dual-channel packaged power amplifier tube, an output matching circuit is connected to the output end of the dual-channel packaged power amplifier tube, and an input bias circuit is connected to the input matching circuit. Simultaneously, a first output bias circuit and a second output bias circuit are both connected to the output matching circuit, with the first output bias circuit being a dual bias circuit and the second output bias circuit being a single bias circuit. The first output bias circuit and the second output bias circuit are respectively placed in the upper and lower paths of the dual-channel packaged power amplifier tube. Typically, the first output bias circuit is placed in the path of the dual-channel packaged power amplifier tube that has the greatest impact on linearity. Due to the use of dual biasing, the equivalent inductance of its bias network is reduced by half, thereby increasing the video bandwidth of the dual-channel packaged power amplifier tube by 1.414 times. Due to the limited size of the dual-channel packaged power amplifier tube, the other output bias circuit cannot simultaneously use a dual bias circuit. At the same time, to reduce the area occupied by the bias circuit on the circuit board, the second output bias circuit uses a single bias circuit. Compared with the prior art, the present invention provides a radio frequency power amplifier that can not only broaden the video bandwidth of the power amplifier, but also meet the structural dimensions of a dual-channel packaged power amplifier tube and reduce the occupied area on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 A circuit block diagram of a radio frequency power amplifier provided in accordance with the first embodiment of the present invention;

[0022] Figure 2 A schematic structural diagram of a radio frequency power amplifier provided in the first embodiment of the present invention;

[0023] Figure 3 for Figure 2 Schematic diagram of the structure of the dual-channel packaged power amplifier tube;

[0024] Figure 4 This is a structural diagram of a radio frequency power amplifier provided in the second embodiment of the present invention.

[0025] Icons: 100-RF power amplifier; 110-dual-channel packaged power amplifier tube; 111-input pin; 113-output pin; 130-circuit board; 150-input matching circuit; 151-first input matching circuit; 153-second input matching circuit; 170-input bias circuit; 171-first input bias circuit; 173-second input bias circuit; 180-output matching circuit; 181-first output matching circuit; 183-second output matching circuit; 190-output bias circuit; 191-first output bias circuit; 193-second output bias circuit. DETAILED DESCRIPTION

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0028] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0029] In the description of the present invention, it should be noted that the terms "center," "upper," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is typically placed when in use. These terms are intended solely to facilitate and simplify the description of the present invention and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," etc., etc., are used solely for distinction and should not be construed as indicating or implying relative importance.

[0030] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "connected," "installed," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0031] The following describes some embodiments of the present invention in detail with reference to the accompanying drawings. In the absence of conflict, the features of the following embodiments can be combined with each other.

[0032] First embodiment

[0033] See also Figures 1 to 3 This embodiment provides a radio frequency power amplifier 100, which can not only broaden the video bandwidth of the power amplifier, but also meet the structural size of the dual-channel packaged power amplifier tube 110 and reduce the occupied area on the circuit board 130.

[0034] The video power amplifier includes a dual-channel packaged power amplifier tube 110, a circuit board 130, an input matching circuit 150, an input bias circuit 170, an output matching circuit 180 and an output bias circuit 190. The dual-channel packaged power amplifier tube 110, the input matching circuit 150, the input bias circuit 170, the output matching circuit 180 and the output bias circuit 190 are all arranged on the circuit board 130. The input matching circuit 150 is connected to the input end of the dual-channel packaged power amplifier tube 110, the output matching circuit 180 is connected to the output end of the dual-channel packaged power amplifier tube 110, and the input bias circuit 170 is connected to the input matching circuit 150.

[0035] In this embodiment, a dual-packaged power amplifier tube 110 includes a tube die and a tube case. The die is encapsulated within the tube case, and each dual-packaged power amplifier tube 110 has two amplification channels. Two input pins 111 are provided on one side of the tube case, and two output pins 113 are provided on the other side of the tube case. The distance between the two input pins 111 and the two output pins 113 is relatively small and fixed, typically less than 6 mm. Of course, not all dual-packaged power amplifier tubes 110 have this spacing; this is provided here for dimensional illustration only, and thus has a certain limiting effect on the configuration of the bias network.

[0036] In this embodiment, the input matching circuit 150 and the output matching circuit 180 are respectively arranged on both sides of the dual-channel packaged power amplifier tube 110, and are both implemented on the circuit board 130 and are matched by pure microstrip. Of course, the input matching circuit 150 and the output matching circuit 180 here can also have microstrip plus capacitor or microstrip plus inductor matching, which is not specifically limited here.

[0037] The input matching circuit 150 includes a first input matching circuit 151 and a second input matching circuit 153. Both the first input matching circuit 151 and the second input matching circuit 153 are connected to the input terminals of the dual-channel packaged power amplifier tube 110. The first input matching circuit 151 forms a first input matching section on the circuit board 130, and the second input matching circuit 153 forms a second input matching section on the circuit board 130. The first input matching section and the second input matching section are connected to the input terminals of the dual-channel packaged power amplifier tube 110.

[0038] Specifically, the first input matching circuit 151 and the second input matching circuit 153 are connected to the two input pins 111 respectively, that is, the first input matching circuit 151 and the second input matching circuit 153 are connected to the input ends of the two amplification channels respectively.

[0039] The output matching circuit 180 includes a first output matching circuit 181 and a second output matching circuit 183. Both the first output matching circuit 181 and the second output matching circuit 183 are connected to the output terminals of the dual-channel packaged power amplifier tube 110. The first output matching circuit 181 forms a first output matching section on the circuit board 130, and the second output matching circuit 183 forms a second output matching section on the circuit board 130. The first output matching section and the second output matching section are connected to the output terminals of the dual-channel packaged power amplifier tube 110.

[0040] Specifically, the first output matching circuit 181 and the second output matching circuit 183 are connected to the two output pins 113 respectively, that is, the first output matching circuit 181 and the second output matching circuit 183 are connected to the output ends of the two amplification channels respectively.

[0041] The output bias circuit 190 includes a first output bias circuit 191 and a second output bias circuit 193, located above and below each other. Both the first output bias circuit 191 and the second output bias circuit 193 are connected to the output matching circuit 180. Specifically, the first output bias circuit 191 is connected to the first output matching circuit 181, and the second output bias circuit 193 is connected to the second output matching circuit 183. The first output bias circuit 191 is a dual-bias circuit, while the second output bias circuit 193 is a single-bias circuit. This effectively increases the video bandwidth of the RF power amplifier 100 while minimizing the size of the dual-packaged power amplifier 110 and the footprint on the circuit board 130. Specifically, on the circuit board 130, the output of the single-bias circuit and one of the outputs of the dual-bias circuit are located above and below the pins of the dual-packaged power amplifier 110, respectively. The other output of the dual-bias circuit is located between the two outputs, preferably within the body of the dual-packaged power amplifier 110.

[0042] The so-called video bandwidth of a power amplifier directly reflects its ability to process broadband signals. The video bandwidth is usually determined by the parallel resonant frequency fr of the output capacitance of the power amplifier tube and the equivalent inductance of the bias line. The higher the resonant frequency, the wider the video bandwidth. The relevant formula is as follows:

[0043]

[0044] It can be seen that the equivalent inductance of this dual bias is reduced by half compared to the single bias, and the resonant frequency increases by 1.414 times.

[0045] The first output bias circuit 191 includes two first output bias lines and two first capacitors. One end of the two first output bias lines is connected to the output matching circuit 180, one end of the two first output bias lines is connected to the first output matching circuit 181, and the other end of the two first output bias lines is grounded through the two first capacitors.

[0046] In this embodiment, the first capacitor is formed by connecting two sub-capacitors in parallel to meet the filtering function of radio frequency and power supply. The capacitance value thereof needs to be determined according to the specific frequency band.

[0047] Second output bias circuit 193 includes a second output bias line and a second capacitor. One end of the second output bias line is connected to output matching circuit 180. Specifically, one end of the second output bias line is connected to first output matching circuit 181, and the other end of the second output bias line is grounded via a second capacitor. The second capacitor is also formed by two sub-capacitors connected in parallel, which will not be described in detail here.

[0048] In this embodiment, on the circuit board 130, one of the first output bias line and the second output bias line is respectively located on the upper and lower sides of the output pins of the dual-channel packaged power amplifier tube 110 and is respectively connected to the two output pins 113. Another first output bias line is set on the right side of the pins of the dual-channel packaged power amplifier tube 110 and is located between the first output bias line and the second output bias line set on the upper side. Preferably, the first output bias line set on the right side is located within the tube body of the dual-channel packaged power amplifier tube 110, and the two first output bias lines are both connected to the same output pin 113.

[0049] The input bias circuit 170 includes a first input bias circuit 171 and a second input bias circuit 171, which are arranged in an upper and lower arrangement. Both the first input bias circuit 171 and the second input bias circuit 171 are connected to the input matching circuit 150. Specifically, the first input bias circuit 171 is connected to the first input matching circuit 151, and the second input bias circuit 171 is connected to the second input matching circuit 153. The input end has a smaller impact on the dual-channel packaged power amplifier tube 110 than the output end. In this embodiment, the first input bias circuit 171 is a dual bias circuit, and the second input bias circuit 171 is a single bias circuit.

[0050] First input bias circuit 171 includes two first input bias lines, two first resistors, and two third capacitors. One end of each of the two first input bias lines is connected to input matching circuit 150 via the two first resistors. Specifically, one end of each of the two first input bias lines is connected to first input matching circuit 151, and the other end of each of the two first input bias lines is grounded via the two third capacitors. The third capacitors are also formed by connecting two sub-capacitors in parallel, which will not be described in detail here.

[0051] Second input bias circuit 171 includes a second input bias line, a second resistor, and a fourth capacitor. One end of the second input bias line is connected to input matching circuit 150 via the second resistor. Specifically, one end of the second input bias line is connected to second input matching circuit 153. The other end of the second input bias line is grounded via the fourth capacitor. The fourth capacitor is also formed by connecting two sub-capacitors in parallel and is not described in detail here.

[0052] In this embodiment, on the circuit board 130, one of the first input bias line and the second input bias line is respectively located on the upper and lower sides of the input pins of the dual-channel packaged power amplifier tube 110 and is respectively connected to the two input pins 111. Another first input bias line is arranged on the left side of the input pins of the dual-channel packaged power amplifier tube 110 and is located between the first input bias line and the second input bias line arranged on the upper side. Preferably, the first input bias line arranged on the left side is located within the tube body of the dual-channel packaged power amplifier tube 110, and the two first input bias lines are both connected to the same input pin 111.

[0053] In this embodiment, the first output bias circuit 191 and the second output bias circuit 193 have a greater influence on the linearity of the RF power amplifier 100 and need to withstand a relatively large current relative to the first input bias circuit 171 and the second input bias circuit 171. Therefore, the line width of the first output bias circuit 191 and the second output bias circuit 193 is greater than the line width of the first input bias circuit 171 and the second input bias circuit 171.

[0054] In summary, the present invention provides an RF power amplifier 100, the video bandwidth performance of which is mainly determined by the output network. Therefore, the first output bias circuit 191 adopts a dual bias circuit, and the second output bias circuit 193 adopts a single bias circuit. Usually, the first output bias circuit 191 is connected to the one of the dual-channel packaged power amplifier tube 110 that has a greater impact on linearity. Since a dual bias circuit is adopted, the equivalent inductance of its bias network will be reduced by half, and the video bandwidth of the dual-channel packaged power amplifier tube 110 will increase by 1.414 times. The second output bias circuit 193 adopts a single bias circuit, which can meet the size limit between the two output pins 113 of the dual-channel packaged power amplifier tube 110, while also avoiding expanding its occupied area. Furthermore, the first input bias circuit 171 is a dual bias circuit. Typically, the first input bias circuit 171 is connected to the input pin of the dual-channel packaged power amplifier tube 110, which has a greater impact on linearity. This further improves the video bandwidth of the dual-channel packaged power amplifier tube. The second input bias circuit 171 is a single bias circuit, which meets the size restrictions between the two input pins 111 of the dual-channel packaged power amplifier tube 110 while also avoiding an increase in its occupied area. Compared to the prior art, the RF power amplifier 100 provided by the present invention can improve the video bandwidth, meet the size requirements of the dual-channel packaged power amplifier tube, and reduce the occupied area on the circuit board 130.

[0055] Second embodiment

[0056] This embodiment provides a radio frequency power amplifier 100, whose basic structure, principle and technical effects are the same as those of the first embodiment. For the sake of brief description, for parts not mentioned in this embodiment, reference may be made to the corresponding contents in the first embodiment.

[0057] See also Figure 4The RF power amplifier 100 provided in this embodiment includes a dual-channel packaged power amplifier tube 110, a circuit board 130, an input matching circuit 150, an input bias circuit 170, an output matching circuit 180, and an output bias circuit 190. The dual-channel packaged power amplifier tube 110, the input matching circuit 150, the input bias circuit 170, the output matching circuit 180, and the output bias circuit 190 are all arranged on the circuit board 130. The input matching circuit 150 is connected to the input end of the dual-channel packaged power amplifier tube 110, the output matching circuit 180 is connected to the output end of the dual-channel packaged power amplifier tube 110, and the input bias circuit 170 is connected to the input matching circuit 150.

[0058] The input bias circuit 170 includes a first input bias circuit 171 and a second input bias circuit 171, which are arranged in an upper and lower manner. Both the first input bias circuit 171 and the second input bias circuit 171 are connected to the input matching circuit 150. The input end has a smaller impact on the dual-channel packaged power amplifier tube 110 than the output end. In this embodiment, the first input bias circuit 171 and the second input bias circuit 171 are both single bias circuits.

[0059] The first input bias circuit 171 and the second input bias circuit 171 each have only one bias line, one end of which is connected to the input matching circuit 150 via a resistor, and the other end of which is grounded via a capacitor.

[0060] Third embodiment

[0061] This embodiment provides a radio frequency power amplifier 100, whose basic structure, principle and technical effects are the same as those of the first embodiment. For the sake of brief description, for parts not mentioned in this embodiment, reference may be made to the corresponding contents in the first embodiment.

[0062] The RF power provided in this embodiment includes a power splitter module, a dual-channel packaged power amplifier tube 110, a circuit board 130, an input matching circuit 150, an input bias circuit 170, an output matching circuit 180, and an output bias circuit 190. The dual-channel packaged power amplifier tube 110, the input matching circuit 150, the input bias circuit 170, the output matching circuit 180, and the output bias circuit 190 are all arranged on the circuit board 130. The input matching circuit 150 is connected to the input end of the dual-channel packaged power amplifier tube 110, the power splitter module is connected to the input matching circuit 150, the output matching circuit 180 is connected to the output end of the dual-channel packaged power amplifier tube 110, and the input bias circuit 170 is connected to the input matching circuit 150. The output bias circuit 190 includes a first output bias circuit 191 and a second output bias circuit 193. Both the first output bias circuit 191 and the second output bias circuit 193 are connected to the output matching circuit 180. The first output bias circuit 191 is a dual bias circuit, and the second output bias circuit 193 is a single bias circuit.

[0063] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A radio frequency power amplifier, characterized in that: The device comprises a dual-channel packaged power amplifier tube, an input matching circuit, an input bias circuit, an output matching circuit, and an output bias circuit, wherein the input matching circuit is connected to the input end of the dual-channel packaged power amplifier tube, the output matching circuit is connected to the output end of the dual-channel packaged power amplifier tube, and the input bias circuit is connected to the input matching circuit; The output bias circuit includes a first output bias circuit and a second output bias circuit, wherein the first output bias circuit and the second output bias circuit are both connected to the output matching circuit, and the first output bias circuit is a dual bias circuit, and the second output bias circuit is a single bias circuit; The output end of the single bias circuit and one of the output ends of the dual bias circuit are respectively located at the upper and lower sides of the pins of the dual-channel packaged power amplifier tube, and the other output end of the dual bias circuit is located between the two output ends.

2. The radio frequency power amplifier according to claim 1, wherein: The output matching circuit includes a first output matching circuit and a second output matching circuit. The first output matching circuit and the second output matching circuit are both connected to the output end of the dual-channel packaged power amplifier tube. The first output bias circuit is connected to the first output matching circuit, and the second output bias circuit is connected to the second output matching circuit.

3. The radio frequency power amplifier according to claim 2, wherein: The first output bias circuit includes two first output bias lines and two first capacitors. One end of the two first output bias lines is respectively connected to the first output matching circuit, and the other end of the two first output bias lines is grounded through one first capacitor.

4. The radio frequency power amplifier according to claim 2 or 3, characterized in that: The second output bias circuit includes a second output bias line and a second capacitor. One end of the second output bias line is connected to the second output matching circuit, and the other end of the second output bias line is grounded through the second capacitor.

5. The radio frequency power amplifier according to claim 1, wherein: The output end of the single bias circuit and one of the output ends of the dual bias circuit are respectively located on both sides of the pins of the dual-channel packaged power amplifier tube, and the other output end of the dual bias circuit is located between the two output ends.

6. The radio frequency power amplifier according to claim 1, wherein: The input matching circuit includes a first input matching circuit and a second input matching circuit. The first input matching circuit and the second input matching circuit are both connected to the input end of the dual-channel packaged power amplifier tube. The input bias circuit is respectively connected to the first input matching circuit and the second input matching circuit.

7. The radio frequency power amplifier according to claim 6, wherein: The input bias circuit includes a first input bias circuit and a second input bias circuit. The first input bias circuit is connected to the first input matching circuit, and the second input bias circuit is connected to the second input matching circuit. The first input bias circuit is a dual bias circuit, and the second input bias circuit is a single bias circuit.

8. The radio frequency power amplifier according to claim 6, wherein: The second input bias circuit includes a second input bias line, a second resistor and a fourth capacitor. One end of the second input bias line is connected to the second input matching circuit through the second resistor, and the other end of the second input bias line is grounded through the fourth capacitor.

9. The radio frequency power amplifier according to claim 1, wherein: The dual-channel packaged power amplifier tube includes two amplification channels, and two input pins are provided on one side of the tube shell of the dual-channel packaged power amplifier tube, and the two input pins are connected to the input matching circuit; two output pins are provided on the other side of the tube shell, and the two output pins are connected to the output matching circuit.

10. A radio frequency power amplifier, characterized in that: The device comprises a power splitter module, a dual-channel packaged power amplifier tube, a circuit board, an input matching circuit, an input bias circuit, an output matching circuit, and an output bias circuit. The dual-channel packaged power amplifier tube, the input matching circuit, the input bias circuit, the output matching circuit, and the output bias circuit are all arranged on the circuit board. The input matching circuit is connected to the input end of the dual-channel packaged power amplifier tube, the power splitter module is connected to the input matching circuit, the output matching circuit is connected to the output end of the dual-channel packaged power amplifier tube, and the input bias circuit is connected to the input matching circuit. The output bias circuit includes a first output bias circuit and a second output bias circuit, wherein the first output bias circuit and the second output bias circuit are both connected to the output matching circuit, and the first output bias circuit is a dual bias circuit, and the second output bias circuit is a single bias circuit; The output end of the single bias circuit and one of the output ends of the dual bias circuit are respectively located at the upper and lower sides of the pins of the dual-channel packaged power amplifier tube, and the other output end of the dual bias circuit is located between the two output ends.

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