Workpiece detection and assembly method, device and storage medium

Abstract

This invention provides a workpiece inspection and assembly method, device, and storage medium. The method includes: acquiring an image of the workpiece to be assembled before it enters the assembly workstation, as a first image; determining whether the workpiece meets the assembly conditions by detecting the stacking of the workpieces in the first image; if not, processing the workpiece using a preset processing method. Therefore, in this solution, workpieces that do not meet the assembly conditions can be detected and processed before entering the assembly workstation. This ensures that only workpieces that meet the assembly conditions are assembled, reducing the assembly error rate.

Description

Technical Field

[0001] The present invention relates to the technical field of production lines, and in particular to a workpiece detection and assembly method, equipment and storage medium. Background Art

[0002] In some production lines, different workpieces need to be matched and aligned, and then assembled. In some cases, assembly errors may occur due to factors such as operating errors and workpiece deviations.

[0003] For example, in some cases, the circuit board and the backplane are punched, and then the holes in the circuit board and the backplane are aligned and locked. In some cases, due to operator error, the tolerance limits are offset in opposite directions, so that the holes do not align. Or, in other cases, due to large deviations of the board itself, the holes do not align. This will cause errors in assembly. Summary of the invention

[0004] In view of this, an object of the present invention is to provide a workpiece detection and assembly method, device and storage medium to reduce the assembly error rate.

[0005] Based on the above purpose, an embodiment of the present invention provides a workpiece detection method, including:

[0006] Acquire an image of the workpiece to be assembled before it enters the assembly workstation as a first image, wherein the workpiece to be assembled includes two or more stacked workpieces;

[0007] By detecting the stacking condition of the workpieces to be assembled in the first image, determining whether the workpieces to be assembled meet the assembly conditions;

[0008] If not, the workpiece to be assembled is processed in a preset processing manner.

[0009] Optionally, the step of acquiring an image of the workpiece to be assembled before it enters the assembly workstation as the first image includes:

[0010] Through the camera arranged above the production line, an image of the workpiece to be assembled before it enters the assembly workstation is collected as the first image.

[0011] Optionally, the determining whether the workpieces to be assembled meet assembly conditions by detecting the stacking conditions of the workpieces to be assembled in the first image includes:

[0012] Detecting the positioning holes in the first image, and determining whether the positioning holes meet the alignment condition;

[0013] If the positioning hole meets the alignment condition, it is determined that the workpiece to be assembled meets the assembly condition.

[0014] Optionally, the processing of the workpiece to be assembled in a preset processing manner includes:

[0015] Detecting a boundary of the workpiece to be assembled in the first image, and determining whether the boundary satisfies a clearance condition;

[0016] If the boundary satisfies the clearance condition, outputting a first alarm message;

[0017] If the boundary does not satisfy the clearance condition, a second alarm message is output.

[0018] Optionally, determining whether the boundary satisfies a clearance condition includes:

[0019] It is determined whether a gap between a boundary of the upper workpiece and a boundary of the lower workpiece satisfies a gap condition.

[0020] Optionally, the determining whether a gap between a boundary of the upper workpiece and a boundary of the lower workpiece satisfies a gap condition includes:

[0021] Determining whether a gap between a boundary of an upper layer workpiece and an inner boundary of a lower layer workpiece is within a first preset range;

[0022] And / or, determining whether a gap between a boundary of the upper workpiece and an outer boundary of the lower workpiece is within a second preset range.

[0023] Optionally, the processing of the workpiece to be assembled in a preset processing manner includes:

[0024] Outputting alarm information for the workpiece to be assembled;

[0025] And / or, the workpiece to be assembled is moved out of the production line.

[0026] Based on the above purpose, an embodiment of the present invention further provides a workpiece assembly method, comprising:

[0027] Acquire an image of the workpiece to be assembled at the assembly workstation as a second image;

[0028] Determining a starting position of the assembly component by detecting the second image;

[0029] Determining an assembly path corresponding to the workpiece to be assembled according to the starting position;

[0030] The assembly components are controlled to move from the starting position to various assembly positions along the assembly path in sequence for assembly, and the end point of the assembly path corresponds to a different assembly position from the starting position.

[0031] Optionally, the determining the starting position of the assembly component by detecting the second image includes:

[0032] Detecting a starting positioning hole in the second image and an adjacent boundary of the starting positioning hole, wherein the starting positioning hole is a positioning hole corresponding to a starting position of an assembly component;

[0033] The starting position of the assembly component is determined according to the positional relationship between the starting positioning hole and its adjacent boundary.

[0034] Optionally, acquiring an image of the workpiece to be assembled at the assembly workstation as the second image includes:

[0035] An image of the workpiece to be assembled at the assembly workstation is collected by a camera linked to the assembly component as a second image, wherein the second image includes the positioning hole and its adjacent boundary below the starting position of the assembly component.

[0036] Optionally, each of the assembly positions corresponds to a positioning hole of the workpiece to be assembled; and the method further comprises:

[0037] During the process of controlling the assembly components to move from the starting position to each assembly position along the assembly path in sequence, for each assembly position, the camera is used to capture a third image, wherein the third image includes a positioning hole corresponding to the assembly position;

[0038] By detecting the third image, it is determined whether the positioning hole corresponding to the assembly position matches the assembly position, and if they do not match, the assembly path is adjusted.

[0039] Optionally, the adjusting the assembly path includes:

[0040] Determine the deviation data between the positioning hole corresponding to the assembly position and the assembly position;

[0041] According to the deviation data, the assembly positions in the remaining assembly paths are adjusted to generate a new assembly path consisting of the adjusted assembly positions.

[0042] Based on the above purpose, an embodiment of the present invention further provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements any of the above workpiece detection methods when executing the program.

[0043] Based on the above purpose, an embodiment of the present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, any of the above workpiece assembly methods is implemented.

[0044] Based on the above purpose, an embodiment of the present invention further provides a non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores computer instructions, and the computer instructions are used to enable the computer to execute any of the above workpiece detection methods.

[0045] Based on the above purpose, an embodiment of the present invention further provides a non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores computer instructions, and the computer instructions are used to enable the computer to execute any of the above workpiece assembly methods.

[0046] By applying the embodiment shown in the present invention, an image of the workpiece to be assembled before it enters the assembly workstation is obtained as the first image; by detecting the stacking situation of the workpiece to be assembled in the first image, it is determined whether the workpiece to be assembled meets the assembly conditions; if not, the workpiece to be assembled is processed in a preset processing method; it can be seen that in this scheme, before the workpiece enters the assembly workstation, the workpiece that does not meet the assembly conditions can be detected and processed, so that only the workpiece that meets the assembly conditions is assembled, thereby reducing the assembly error rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0048] Figure 1 A schematic diagram of a first flow chart of a workpiece detection method provided by an embodiment of the present invention;

[0049] Figure 2 A simplified schematic diagram of a production line provided by an embodiment of the present invention;

[0050] Figure 3 Another simplified production line schematic diagram provided by an embodiment of the present invention;

[0051] Figure 4 A schematic diagram of positioning holes of an upper workpiece and a lower workpiece provided in an embodiment of the present invention;

[0052] Figure 5 A schematic diagram of a boundary between an upper workpiece and a lower workpiece provided in an embodiment of the present invention.

[0053] Figure 6 A second schematic flow chart of the workpiece detection method provided by an embodiment of the present invention;

[0054] Figure 7A schematic flow chart of a workpiece assembly method provided by an embodiment of the present invention;

[0055] Figure 8 A schematic diagram of a workpiece provided by an embodiment of the present invention;

[0056] Fig. 9 A schematic diagram of a positioning hole and its boundary provided in an embodiment of the present invention;

[0057] Fig.10 A schematic diagram of an adjustment assembly path provided by an embodiment of the present invention;

[0058] Fig.11 A schematic diagram of an automatic screw fastening machine provided by an embodiment of the present invention;

[0059] Fig.12 A schematic diagram of a locking path in a related solution;

[0060] Fig.13 A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention;

[0061] Fig.14 A schematic diagram of the structure of another electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0062] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0063] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present invention should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0064] In order to achieve the above-mentioned purpose, the embodiment of the present invention provides a workpiece detection and assembly method, device and storage medium, which can be applied to various electronic devices, such as detection equipment in a production line, or other computers, etc., without specific limitation. The workpiece detection method is first introduced in detail below.

[0065] Figure 1 A first flow chart of a workpiece detection method provided by an embodiment of the present invention includes:

[0066] S101: Acquire an image of a workpiece to be assembled before it enters an assembly workstation, as a first image, where the workpiece to be assembled includes two or more stacked workpieces.

[0067] For example, the workpiece to be assembled may be a workpiece conveyed on a production line. Figure 2 As shown in the figure, it is assumed that the production line includes two workstations. The operator performs some manual operations at workstation ①, such as stacking, aligning or clamping two or more workpieces, etc. Workstation ② is an assembly workstation, and the workpieces are locked or other assembly processes are performed at workstation ②. The operator can place multiple workpieces that need to be assembled together at workstation ①. For the convenience of description, these workpieces are called work to be assembled. For example, assuming that the workpieces to be assembled include circuit boards and backplanes, the operator can place these boards at workstation ①, and then these boards are transferred to workstation ② for assembly. The assembly process can include processes such as locking.

[0068] In one case, S101 may include: using a camera disposed above the production line to collect an image of the workpiece to be assembled before it enters the assembly workstation as the first image.

[0069] like Figure 3 As shown, a camera can be set between workstation ① and workstation ②. The camera is set above the production line. Before the workpiece enters the assembly workstation, the camera captures the image of the workpiece. For example, the camera is set directly above the production line. The camera's acquisition range can be larger than the overall size of the workpiece. The camera's acquisition range can be adjusted by adjusting the camera's height. The camera's acquisition frequency matches the conveying speed of the production line's conveyor belt, so that when the workpiece is conveyed to the bottom of the camera, the camera captures the image of the workpiece. In this way, the captured image includes the complete workpiece. For the convenience of description, this image is called the first image.

[0070] S102: by detecting the stacking condition of the workpieces to be assembled in the first image, determining whether the workpieces to be assembled meet the assembly conditions; if not, executing S103; if so, the workpieces to be assembled can be transferred to the assembly workstation for assembly.

[0071] For example, the stacking of the workpieces to be assembled in the first image can be detected, and the positioning holes and / or boundaries of the workpieces to be assembled can be detected, and whether the workpieces meet the assembly conditions can be determined based on the detection results. In some cases, the assembly may include a locking process, in which case, whether the workpieces meet the locking conditions can be determined based on the detection results.

[0072] In one implementation, S102 may include: detecting a positioning hole in the first image, and determining whether the positioning hole meets an alignment condition; if the positioning hole meets the alignment condition, determining that the workpiece to be assembled meets an assembly condition.

[0073] Still taking the locking of the circuit board and the backplane as an example, positioning holes can be set on each board. Figure 4 As shown, if the operator operates correctly and the board error is small, the positioning holes of each board meet the alignment conditions, such as Figure 4 As shown on the left, Figure 4 O on the left 1 Indicates the positioning hole of the lower board, O 2 Indicates the upper board positioning hole, O 1 The boundary is located at O 2 If the operator makes an error or the board error is large, the positioning holes of each board will not meet the alignment conditions, such as Figure 4 Shown in the middle or right.

[0074] For example, the alignment condition may be that the area below the positioning hole of the upper workpiece that is filled by the lower workpiece entity is smaller than a preset threshold.

[0075] S103: Processing the workpiece to be assembled in a preset processing manner.

[0076] In one implementation, S103 may include: outputting alarm information for the workpiece to be assembled; and / or moving the workpiece to be assembled out of the production line.

[0077] For example, the alarm message may be a voice message of "the current workpiece does not meet the assembly conditions" or other similar voice messages, or may be a ringtone alarm, a light alarm, etc., without specific limitation.

[0078] In one case, relevant personnel can handle the workpieces that do not meet the assembly conditions; in another case, a robot or other device can be set up in the production line to automatically remove the workpieces that do not meet the assembly conditions from the production line so that they cannot enter the assembly workstation.

[0079] In the above implementation, the positioning holes in the first image are detected to determine whether the positioning holes meet the alignment conditions; if the positioning holes meet the alignment conditions, the workpiece to be assembled can be transferred to the assembly workstation for assembly. If the positioning holes do not meet the alignment conditions, in one implementation, an alarm message for the workpiece to be assembled can be output; and / or the workpiece to be assembled can be removed from the production line.

[0080] In another embodiment, if the positioning hole does not meet the alignment condition, the boundary of the workpiece to be assembled in the first image can be detected to determine whether the boundary meets the clearance condition; if the boundary meets the clearance condition, a first alarm message is output; if the boundary does not meet the clearance condition, a second alarm message is output.

[0081] The "gap condition" in this embodiment refers to the gap condition satisfied by the boundary of the workpiece when the workpiece can be successfully assembled. For example, determining whether the boundary satisfies the gap condition may include: determining whether the gap between the boundary of the upper workpiece and the boundary of the lower workpiece satisfies the gap condition.

[0082] Generally speaking, if it is due to an operator's operating error, and the workpiece itself does not have a large deviation, in this case, the positioning holes of the workpiece do not meet the alignment conditions, and the gap between the boundary of the upper workpiece and the boundary of the lower workpiece does not meet the gap conditions. For example, if the operator puts a board upside down, the positioning holes and boundaries of the board are abnormal (do not meet the assembly conditions). In this case, a second alarm message can be output, and the second alarm message can prompt the relevant personnel that the workpiece does not meet the assembly conditions due to an operating error. In this way, the relevant personnel can correct the operating error in time, such as re-placing the upside-down board, and the re-placed workpiece can continue to be transferred to the assembly workstation for assembly. In one case, the production line can continue to work while the relevant personnel correct the operating error, so that the work efficiency of the production line can be improved.

[0083] If the positioning hole of the workpiece does not meet the alignment condition, but the gap between the boundary of the upper workpiece and the boundary of the lower workpiece meets the gap condition, this is usually due to a large deviation of the workpiece itself. In this case, a first alarm message can be output, which can indicate that the workpiece itself has a deviation, so that the relevant personnel can remove the workpiece from the production line, and the workpiece can be discarded or reworked later.

[0084] For example, refer to Figure 5 , Figure 5 The three situations in Figure 4 The three situations in the figure correspond to each other: the left side is the situation where the workpiece to be assembled meets the assembly conditions. In this case, the positioning holes of the upper board are aligned with the positioning holes of the lower board, and the boundary l of the upper board 3 On the inner border of the lower board 1 In the middle, the workpiece to be assembled does not meet the assembly conditions. In this case, the positioning holes of the upper board are not aligned with the positioning holes of the lower board, and the boundary of the upper board is l 3 On the inner border of the lower board 1The right side shows the situation where the workpiece to be assembled does not meet the assembly conditions. In this case, the positioning holes of the upper board are not aligned with the positioning holes of the lower board, and the boundary of the upper board is not aligned with the boundary of the lower board. 3 On the inner border of the lower board 1 Besides.

[0085] refer to Figure 5 As shown, the lower workpiece includes an inner boundary and an outer boundary. In this case, determining whether the gap between the boundary of the upper workpiece and the boundary of the lower workpiece meets the gap condition may include:

[0086] Determine whether the gap between the boundary of the upper workpiece and the inner boundary of the lower workpiece is within a first preset range; and / or determine whether the gap between the boundary of the upper workpiece and the outer boundary of the lower workpiece is within a second preset range.

[0087] Figure 5 In the middle case, when detecting the workpiece boundary in the first image, the boundary of the upper workpiece can be detected. 3 and the outer boundary of the lower layer workpiece l 5 , the inner boundary of the lower layer workpiece cannot be detected 1 In one case, the clearance condition can be: 3 With l 5 The gap between is within the second preset range, or can be: 3 With l 5 The gap between them is within a second preset range, and l 3 With l 1 The gap between them is within a preset first range. Figure 5 If the intermediate situation does not meet the gap condition, a second alarm message can be output to remind the relevant personnel that the workpiece does not meet the assembly condition due to an operational error. In this way, the relevant personnel can correct the operational error in time, such as re-placing the upside-down board. The re-placed workpiece can continue to be transferred to the assembly workstation for assembly.

[0088] Figure 5 In the case on the right side, when detecting the workpiece boundary in the first image, the boundary of the upper workpiece can be detected. 3 , the inner boundary of the lower layer workpiece cannot be detected 1 and the outer boundary l 5 In one case, the clearance condition can be: 3 With l 5 The gap between is within the second preset range, or can be: 3 With l 5 The gap between them is within a second preset range, and l 3 With l 1 The gap between them is within a preset first range. Figure 5If the right side of the workpiece does not meet the clearance condition, a second alarm message can be output to remind the relevant personnel that the workpiece does not meet the assembly conditions due to an operational error. In this way, the relevant personnel can correct the operational error in time, such as re-placing the upside-down board. The re-placed workpiece can continue to be transferred to the assembly workstation for assembly.

[0089] Alternatively, in some other implementations, the boundary of the workpiece to be assembled in the first image may be detected first to determine whether the boundary satisfies the clearance condition; and then the positioning hole in the first image may be detected to determine whether the positioning hole satisfies the alignment condition. If both the positioning hole and the boundary meet the conditions, it means that the workpiece meets the assembly condition. If neither the positioning hole nor the boundary meets the conditions, the second alarm message is output. If the positioning hole does not meet the alignment condition, but the boundary meets the clearance condition, the first alarm message is output.

[0090] Some related schemes, refer to Figure 2 If any one or more situations such as operating errors, workpiece deviations, etc. occur, errors will occur in the assembly workstation, wasting working hours and reducing the production efficiency of the production line.

[0091] By applying the embodiment shown in the present invention, on the one hand, before the workpiece enters the assembly workstation, the workpiece that does not meet the assembly conditions can be detected in time and processed, and only the workpiece that meets the assembly conditions can be assembled, thereby reducing the assembly error rate and improving the production line efficiency. On the other hand, for some situations where the workpiece does not meet the assembly conditions due to operational errors, this solution can remind the relevant personnel to correct the operational errors in time, and the corrected workpiece can continue to be transferred to the assembly workstation for assembly, further improving the production efficiency of the production line.

[0092] Figure 6 A second flow chart of a workpiece detection method provided by an embodiment of the present invention includes:

[0093] S601: Using a camera disposed above the production line, an image of the workpiece to be assembled before entering the assembly workstation is collected as a first image. The workpiece to be assembled includes two or more stacked workpieces.

[0094] For example, if Figure 3As shown in the figure, it is assumed that the production line includes two workstations. The operator performs some manual operations at workstation ①, such as stacking, aligning or clamping two or more workpieces, etc. Workstation ② is an assembly workstation, and the workpieces are locked or other assembly processes are performed at workstation ②. The operator can place multiple workpieces that need to be assembled together at workstation ①. For the convenience of description, these workpieces are called work to be assembled. For example, assuming that the workpieces to be assembled include circuit boards and backplanes, the operator can place these boards at workstation ①, and then these boards are transferred to workstation ② for assembly. The assembly process can include processes such as locking.

[0095] A camera is set between workstation ① and workstation ②. The camera is set above the production line. Before the workpiece enters the assembly workstation, the camera captures the image of the workpiece. For example, the camera is set directly above the production line. The camera's acquisition range can be larger than the overall size of the workpiece. The camera's acquisition range can be adjusted by adjusting the camera's height. The camera's acquisition frequency matches the conveying speed of the production line's conveyor belt, so that when the workpiece is conveyed to the bottom of the camera, the camera captures the image of the workpiece. In this way, the captured image includes the complete workpiece. For the convenience of description, this image is called the first image.

[0096] S602: Detect the positioning hole in the first image and determine whether the positioning hole meets the alignment condition. If not, execute S603; if yes, execute S606.

[0097] Still taking the locking of the circuit board and the backplane as an example, positioning holes can be set on each board. Figure 4 As shown, if the operator operates correctly and the board error is small, the positioning holes of each board meet the alignment conditions, such as Figure 4 As shown on the left, Figure 4 O on the left 1 Indicates the positioning hole of the lower board, O 2 Indicates the upper board positioning hole, O 1 The boundary is located at O 2 If the operator makes an error, or the board error is large, the positioning holes of each board will not meet the alignment conditions, such as Figure 4 Shown in the middle or right.

[0098] For example, the alignment condition may be that the area below the positioning hole of the upper workpiece that is filled by the lower workpiece entity is smaller than a preset threshold.

[0099] S603: Detect the boundary of the workpiece to be assembled in the first image, and determine whether the boundary satisfies the clearance condition; if the boundary satisfies the clearance condition, execute S604; if the boundary does not satisfy the clearance condition, execute S605.

[0100] S604: Output the first alarm information.

[0101] S605: Output the second alarm information.

[0102] The "gap condition" in this embodiment refers to the gap condition satisfied by the boundary of the workpiece when the workpiece can be successfully assembled. For example, determining whether the boundary satisfies the gap condition may include: determining whether the gap between the boundary of the upper workpiece and the boundary of the lower workpiece satisfies the gap condition.

[0103] Generally speaking, if it is due to an operator's operating error, and the workpiece itself does not have a large deviation, in this case, the positioning holes of the workpiece do not meet the alignment conditions, and the gap between the boundary of the upper workpiece and the boundary of the lower workpiece does not meet the gap conditions. For example, if the operator puts a board upside down, the positioning holes and boundaries of the board are abnormal (do not meet the assembly conditions). In this case, a second alarm message can be output, and the second alarm message can prompt the relevant personnel that the workpiece does not meet the assembly conditions due to an operating error. In this way, the relevant personnel can correct the operating error in time, such as re-placing the upside-down board, and the re-placed workpiece can continue to be transferred to the assembly workstation for assembly. In one case, the production line can continue to work while the relevant personnel correct the operating error, so that the work efficiency of the production line can be improved.

[0104] If the positioning hole of the workpiece does not meet the alignment condition, but the gap between the boundary of the upper workpiece and the boundary of the lower workpiece meets the gap condition, this is usually due to a large deviation of the workpiece itself. In this case, a first alarm message can be output, which can indicate that the workpiece itself has a deviation, so that the relevant personnel can remove the workpiece from the production line, and the workpiece can be discarded or reworked later.

[0105] refer to Figure 5 As shown, the lower workpiece includes an inner boundary and an outer boundary. In this case, determining whether the gap between the boundary of the upper workpiece and the boundary of the lower workpiece meets the gap condition may include:

[0106] Determine whether the gap between the boundary of the upper workpiece and the inner boundary of the lower workpiece is within a first preset range; and / or determine whether the gap between the boundary of the upper workpiece and the outer boundary of the lower workpiece is within a second preset range.

[0107] Figure 5 In the middle case, when detecting the workpiece boundary in the first image, the boundary of the upper workpiece can be detected. 3 and the outer boundary of the lower layer workpiece l 5 , the inner boundary of the lower layer workpiece cannot be detected 1In one case, the clearance condition can be: 3 With l 5 The gap between is within the second preset range, or can be: 3 With l 5 The gap between them is within a second preset range, and l 3 With l 1 The gap between them is within a preset first range. Figure 5 If the intermediate situation does not meet the gap condition, a second alarm message can be output to remind the relevant personnel that the workpiece does not meet the assembly condition due to an operational error. In this way, the relevant personnel can correct the operational error in time, such as re-placing the upside-down board. The re-placed workpiece can continue to be transferred to the assembly workstation for assembly.

[0108] Figure 5 In the case on the right side, when detecting the workpiece boundary in the first image, the boundary of the upper workpiece can be detected. 3 , the inner boundary of the lower layer workpiece cannot be detected 1 and the outer boundary l 5 In one case, the clearance condition can be: 3 With l 5 The gap between is within the second preset range, or can be: 3 With l 5 The gap between them is within a second preset range, and l 3 With l 1 The gap between them is within a preset first range. Figure 5 If the right side of the workpiece does not meet the clearance condition, a second alarm message can be output to remind the relevant personnel that the workpiece does not meet the assembly conditions due to an operational error. In this way, the relevant personnel can correct the operational error in time, such as re-placing the upside-down board. The re-placed workpiece can continue to be transferred to the assembly workstation for assembly.

[0109] S606: The workpiece to be assembled is transferred to the assembly workstation for assembly.

[0110] By applying the embodiment shown in the present invention, on the one hand, before the workpiece enters the assembly workstation, the workpiece that does not meet the assembly conditions can be detected in time and processed, and only the workpiece that meets the assembly conditions is assembled, which reduces the assembly error rate and improves the production line efficiency. On the other hand, for some situations where the workpiece does not meet the assembly conditions due to operational errors, this solution can remind the relevant personnel to correct the operational errors in time, and the corrected workpiece can continue to be transferred to the assembly workstation for assembly, further improving the production efficiency of the production line.

[0111] In some related solutions, when assembling components to assemble workpieces, the assembly path is fixed, usually starting from the origin to each assembly position, and then returning to the origin to prepare for the next locking. This solution has a long assembly path and low assembly efficiency.

[0112] The embodiment of the present invention further provides an assembly method. After a workpiece enters an assembly workstation, the assembly workstation assembles the workpiece. Figure 7 A schematic flow chart of a workpiece assembly method provided by an embodiment of the present invention includes:

[0113] S701: Acquire an image of a workpiece to be assembled at an assembly workstation as a second image.

[0114] For example, a camera may be set in an assembly workstation to capture images of the workpiece during the assembly process. For the convenience of description, the image captured during the assembly process is referred to as a second image. The second image may include the entire workpiece to be assembled, or may only include a partial area of ​​the workpiece to be assembled.

[0115] In one embodiment, the camera can be linked with the assembly component, and the camera captures the workpiece area near the assembly component. For example, the camera can be set on the outer wall of the assembly component, and the camera moves with the assembly component. In this embodiment, S701 may include: by using the camera linked with the assembly component, capturing an image of the workpiece to be assembled at the assembly workstation as a second image, wherein the second image includes the positioning hole and its adjacent boundary below the starting position of the assembly component.

[0116] S702: Determine the starting position of the assembly component by detecting the second image.

[0117] In some related schemes, after the assembly components such as the manipulator complete the assembly of the workpiece, they all return to the origin position, so that the starting position of each assembly process of the assembly components is the same. In this embodiment, after the assembly components complete the assembly of the workpiece, they do not need to return to the origin position, so that the starting position of the Nth assembly process of the assembly components is different from the starting position of the N+1th assembly process, where N is a positive integer. In this embodiment, the starting position of the assembly components needs to be determined for each assembly process.

[0118] In one embodiment, S702 may include: detecting a starting positioning hole in the second image and an adjacent boundary of the starting positioning hole, wherein the starting positioning hole is a positioning hole corresponding to a starting position of the assembly component; and determining the starting position of the assembly component based on a positional relationship between the starting positioning hole and its adjacent boundary.

[0119] The “starting position of the assembly component” in S702 may be expressed as “located above which positioning hole” or “corresponding to which positioning hole”.

[0120] For example, suppose the workpiece to be assembled is Figure 8 As shown, the workpiece includes four positioning holes A, B, C, and D. If the camera set in the assembly workstation collects images of the entire workpiece to be assembled, and the second image includes four positioning holes, each positioning hole can be identified in the second image, and then the positioning hole closest to the assembly component is determined as the starting positioning hole. If the second image collected by the camera linked to the assembly component only includes the positioning holes below the starting position of the assembly component, the positioning hole identified in the second image is the starting positioning hole.

[0121] refer to Fig. 9 , if the starting positioning hole is A (that is, the starting position of the assembly component is above A), the adjacent boundary of A is the lower boundary L 0 and the left boundary L 1 , if the starting positioning hole is D (that is, the starting position of the assembly component is above D), the adjacent boundary of D is the lower boundary L 0 and the right boundary L 2 Therefore, the starting position of the assembly component can be determined based on the positional relationship between the starting positioning hole and its adjacent boundaries. If a boundary of the starting positioning hole is located on the left side of the starting positioning hole, it means that the starting position is above the positioning hole A; if a boundary of the starting positioning hole is located on the right side of the starting positioning hole, it means that the starting position is above the positioning hole D.

[0122] The case where the starting positioning hole is B or C is similar and will not be described in detail here.

[0123] S703: Determine an assembly path corresponding to the workpiece to be assembled according to the starting position.

[0124] In one embodiment, the assembly path includes a plurality of assembly positions, and the assembly positions correspond to the positioning holes of the workpieces to be assembled. Figure 8 For example, the workpiece includes four positioning holes A, B, C, and D, and the assembly process may include: moving the assembly components to each positioning hole of the workpiece for locking; in this way, one positioning hole corresponds to one assembly position, and the assembly path includes four assembly positions.

[0125] Assuming that the starting position is determined to be above the positioning hole A in S702, the assembly path can be expressed as A→B→C→D or A→D→C→B. Assuming that the starting position is determined to be above the positioning hole D in S702, the assembly path can be expressed as D→C→B→A or D→A→B→C.

[0126] The assembly path here is only an example and does not constitute a limitation. Alternatively, the starting position of the assembly component can also be the positioning hole B, or above the positioning hole C, which is not specifically limited.

[0127] S704: Controlling the assembly components to move from the starting position to each assembly position in sequence along the assembly path for assembly, wherein the end point of the assembly path corresponds to a different assembly position than the starting position.

[0128] Assuming that the starting position of the assembly component is above the positioning hole A, and the determined assembly path is A→B→C→D, the assembly component can be moved to each assembly position in sequence and locked to the corresponding positioning hole.

[0129] As described above, the assembly path includes multiple assembly positions, and the assembly positions correspond to the positioning holes of the workpieces to be assembled; in one embodiment, the assembly components are controlled to move from the starting position along the assembly path to each assembly position in sequence for assembly. For each assembly position, a third image is captured by the camera, and the third image includes the positioning hole corresponding to the assembly position; by detecting the third image, it is determined whether the positioning hole corresponding to the assembly position matches the assembly position. If they match, the positioning hole corresponding to the assembly position is locked; if they do not match, the assembly path is adjusted, and then the positioning hole corresponding to the adjusted assembly position is locked.

[0130] For example, in one case, the third image can be captured by the camera after the assembly component is controlled to move to the assembly position. Alternatively, in another case, the third image of the next assembly position can be captured by the camera before the assembly component reaches the next assembly position but the camera acquisition range can cover the next assembly position.

[0131] Determine whether the positioning hole corresponding to the assembly position matches the assembly position, that is, determine whether the positioning hole corresponding to the assembly position can be normally locked when the assembly component is located at the assembly position. The matching condition can be set according to the specific situation, for example, the deviation between the assembly position and the actual position of the positioning hole is less than a preset distance threshold, etc., and there is no specific limitation.

[0132] refer to Fig.10 As shown in the figure, assuming that the assembly path is A→B→C→D, the camera moves with the assembly parts, and the camera captures images when it moves to position F. M represents the acquisition range of the camera at this time, or the content of the third image. Fig.10B1 in the figure represents the actual location of the positioning hole, and B represents the ideal location of the positioning hole, or B corresponds to the assembly position in the original assembly path. By detecting the third image, it can be seen that the deviation between B1 and B is large and does not meet the matching condition, that is, the positioning hole corresponding to the assembly position does not match the assembly position.

[0133] In this case, the locking path F→B can be adjusted to F→G→B1, or it can be smoothly moved from position F to above the positioning hole B1, and the specific path between position F and above the positioning hole B1 is not limited.

[0134] For example, the assembly path can be set in advance according to the ideal coordinate value of the locating hole of the workpiece, but due to errors caused by various factors, the assembly path does not match the actual locating hole. In this case, the assembly path can be adjusted so that the assembly parts can be normally locked to the locating hole. In one case, the adjustment of the assembly path mentioned here can be an overall adjustment, that is, the three assembly positions corresponding to B→C→D are adjusted together, and a new assembly path is obtained based on the adjusted three assembly positions. Or, in another case, only the assembly position corresponding to B can be adjusted, and a new assembly path is obtained based on the adjusted assembly position.

[0135] In one embodiment, when it is determined that the positioning hole corresponding to the assembly position does not match the assembly position, the deviation data between the positioning hole corresponding to the assembly position and the assembly position can be determined; based on the deviation data, the assembly positions in the remaining assembly path are adjusted to generate a new assembly path consisting of the adjusted assembly positions.

[0136] continue Fig.10 For example, assuming that B1 is 0.5 cm to the right and 1 cm below B, the deviation data can be (0.5 cm to the right, 1 cm below). The deviation data can also be expressed in the form of XY coordinates, or in the form of angles and distances. The specific expression form is not limited. The remaining assembly path is B→C→D. The assembly positions corresponding to the positioning holes C and D can be further adjusted according to the deviation data. For example, based on the original position, move down 1 cm and right 0.5 cm to obtain the adjusted assembly position. Then, for the adjusted assembly position, continue to capture images through the camera, and detect the image to determine whether the positioning hole matches the adjusted assembly position. If they do not match, continue to adjust the assembly path.

[0137] The boundary line of the workpiece is a straight line parallel to the path, so during the adjustment process or during the process of controlling the movement of the assembly component, the boundary line of the workpiece can be referenced to improve the adjustment or movement accuracy.

[0138] By applying this embodiment, if there is a deviation in the assembly position, the assembly position can be adjusted according to the actual situation, thereby reducing the influence of the deviation and improving the accuracy of assembly.

[0139] Application of the present invention Figure 7 In the embodiment shown, firstly, after the assembly components are assembled to the workpiece, they do not need to return to the origin position, which simplifies the assembly path and improves the assembly efficiency. Secondly, if the assembly position deviates, the assembly position can be adjusted according to the actual situation, which reduces the influence of the deviation and improves the accuracy of the assembly.

[0140] The following is an example of an automatic screw locking machine to introduce a specific implementation method. Fig.11 The screw machine includes a fully automatic manipulator 100 and an automatic screw locking machine unit 200, wherein the automatic screw locking machine unit 200 includes a feeding unit and a locking unit. The feeding unit may include a vibration plate, a distributor, a pipeline, etc. Screws are placed in the vibration plate, the vibration plate sorts the screws, the distributor distributes the sorted screws to the pipeline, and the screws are transmitted to the locking unit through the pipeline. The locking unit locks the screws into the workpiece. The locking path is controlled by the programming of the fully automatic manipulator 100, and the workpiece is automatically locked according to the set coordinates.

[0141] In some related solutions, the path of the fully automatic manipulator 100 is fixed, see Fig.12 The limit mold 4 fixes the workpiece 3 at a specific position, and the locking path is: starting from the origin O, passing through point P to reach the locking positions corresponding to the four positioning holes A, B, C, and D. At each locking position, the automatic screw locking machine unit 200 locks the screw into the positioning hole, and then the fully automatic manipulator 100 drives the automatic screw locking machine unit 200 back to the origin O to prepare for the next locking.

[0142] In this solution, after the automatic screw locking machine unit 200 completes the assembly of the workpiece, the fully automatic manipulator 100 does not need to return to the origin position, so that the locking path of the automatic screw locking machine for the Nth time is different from the locking path for the N+1th time. Fig.12 The locking path is: the fully automatic manipulator 100 reaches the locking positions corresponding to the four positioning holes A, B, C, and D respectively, which can be expressed as A→B→C→D. At each locking position, the automatic screw locking machine unit 200 locks the screw into the positioning hole, and then the fully automatic manipulator 100 stays at the locking position corresponding to the positioning hole D, and there is no need to return to the origin.

[0143] It can be seen that compared with the above-mentioned related solutions, this solution saves the journey of the full-automatic manipulator 100 and the automatic screw locking machine unit 200 returning to the origin after completing the locking, simplifies the locking path, and improves the locking efficiency.

[0144] Alternatively, the locking path in this solution can also be: D→A→B→C, C→D→A→B, B→C→D→A, etc., which will not be listed one by one. Fig.12 For example, the locking paths A→B→C→D and C→D→A→B are shorter than B→C→D→A and D→A→B→C. Adopting the locking paths of A→B→C→D and C→D→A→B can further improve the locking efficiency.

[0145] In addition, in the above-mentioned related schemes, the moving path (locking path) of the fully automatic manipulator 100 is set in advance according to the size of the limit mold 4 and the workpiece 3. However, in the actual production line, on the one hand, during the conveying of the limit mold 4 and the workpiece 3 on the conveyor belt, the origin O itself also fluctuates due to the movement and vibration of the conveyor belt; on the other hand, due to the different assembly tolerances of the gap between the limit mold 4 and the workpiece 3, there is a deviation between the origin O and the locking positions corresponding to A, B, C, and D; on the third hand, there are errors in the manufacturing process of the workpiece 3 itself; the accumulated errors in these aspects make the accuracy of this locking scheme poor.

[0146] In one implementation of the present scheme, the fully automatic manipulator 100 is controlled to move from the starting position to each locking position along the locking path in sequence for locking. For each locking position, a third image is captured by a camera, and the third image includes the positioning hole below the locking position. By detecting the third image, it is determined whether the positioning hole corresponding to the locking position matches the locking position. If they match, the positioning hole below the locking position is locked. If they do not match, the locking path is adjusted, and then the positioning hole below the adjusted locking position is locked. In this way, each time locking is performed, the locking position is adjusted according to the actual situation, which reduces the influence of errors and improves the accuracy of locking.

[0147] Furthermore, in this solution, the locking path is adjusted according to the actual situation, which can save the mold 4 and the process of limiting the workpiece by the mold 4, reduce the locking cost, and improve the locking efficiency.

[0148] It should be noted that the method of the embodiment of the present invention can be performed by a single device, such as a computer or a server. The method of this embodiment can also be applied in a distributed scenario and completed by multiple devices cooperating with each other. In the case of such a distributed scenario, one of the multiple devices can only perform one or more steps in the method of the embodiment of the present invention, and the multiple devices will interact with each other to complete the described method.

[0149] The embodiment of the present invention further provides an electronic device, such as Fig.13As shown, it includes a memory 1302, a processor 1301, and a computer program stored in the memory 1302 and executable on the processor 1301. When the processor 1301 executes the program, any one of the above-mentioned workpiece detection methods is implemented.

[0150] For example, the electronic device may be a detection device in a production line, or other computers, etc., without specific limitation.

[0151] The embodiment of the present invention further provides an electronic device, such as Fig.14 As shown, it includes a memory 1402, a processor 1401, and a computer program stored in the memory 1402 and executable on the processor 1401. When the processor 1401 executes the program, any one of the above-mentioned workpiece assembly methods is implemented.

[0152] For example, the electronic device may be an assembly device in a production line, or other computers, etc., without specific limitation.

[0153] The processor can be implemented as a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0154] The memory can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory can store operating systems and other application programs. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program codes are stored in the memory and called and executed by the processor.

[0155] It should be noted that, although the above device only shows a processor and a memory, in the specific implementation process, the device may also include other components necessary for normal operation. In addition, it can be understood by those skilled in the art that the above device may also only include components necessary for implementing the embodiments of the present specification, and does not necessarily include all the components shown in the figure.

[0156] An embodiment of the present invention further provides a non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores computer instructions, and the computer instructions are used to enable the computer to execute any one of the above-mentioned workpiece detection methods.

[0157] An embodiment of the present invention further provides a non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores computer instructions, and the computer instructions are used to enable the computer to execute any one of the above-mentioned workpiece assembly methods.

[0158] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device.

[0159] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present disclosure (including the claims) is limited to these examples. Within the scope of the present invention, the above embodiments or technical features in different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity.

[0160] In addition, to simplify the description and discussion, and in order not to obscure the present invention, known power / ground connections to integrated circuit (IC) chips and other workpieces may or may not be shown in the provided figures. In addition, the devices may be shown in the form of block diagrams so as to avoid obscuring the present invention, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform on which the present invention will be implemented (i.e., these details should be fully within the scope of understanding of those skilled in the art). Where specific details (e.g., circuits) are set forth to describe exemplary embodiments of the present invention, it will be apparent to those skilled in the art that the present invention may be implemented without these specific details or with variations in these specific details. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0161] Although the invention has been described in conjunction with specific embodiments of the invention, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0162] The embodiments of the present invention are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A workpiece assembly method, characterized in that: include: Acquire an image of the workpiece to be assembled before it enters the assembly workstation as a first image, wherein the workpiece to be assembled includes two or more stacked workpieces; By detecting the stacking condition of the workpieces to be assembled in the first image, determining whether the workpieces to be assembled meet the assembly conditions; If not, the workpiece to be assembled is processed in a preset processing manner; If satisfied, the workpiece to be assembled is transferred to an assembly workstation; Acquire an image of the workpiece to be assembled at the assembly workstation as a second image; Determining a starting position of the assembly component by detecting the second image; Determining an assembly path corresponding to the workpiece to be assembled according to the starting position; Controlling the assembly components to move from the starting position to each assembly position along the assembly path in sequence for assembly; Wherein, the starting position of the Nth assembly process of the assembly component is different from the starting position of the N+1th assembly process, and N is a positive integer; The step of determining whether the workpieces to be assembled meet assembly conditions by detecting the stacking conditions of the workpieces to be assembled in the first image includes: Detecting the positioning holes in the first image, and determining whether the positioning holes meet the alignment condition; If the positioning hole meets the alignment condition, it is determined that the workpiece to be assembled meets the assembly condition; The process of processing the workpiece to be assembled in a preset manner includes: Detecting a boundary of the workpiece to be assembled in the first image, and determining whether the boundary satisfies a clearance condition; If the boundary satisfies the clearance condition, outputting an alarm message indicating that the assembly condition is not satisfied due to the workpiece; If the boundary does not satisfy the clearance condition, an alarm message is outputted indicating that the assembly condition is not satisfied due to an operation error.

2. The method according to claim 1, characterized in that The step of obtaining an image of the workpiece to be assembled before it enters the assembly workstation as a first image includes: Through the camera arranged above the production line, an image of the workpiece to be assembled before it enters the assembly workstation is collected as the first image.

3. The method according to claim 1, characterized in that The determining whether the boundary satisfies the clearance condition includes: It is determined whether a gap between a boundary of the upper workpiece and a boundary of the lower workpiece satisfies a gap condition.

4. The method according to claim 3, characterized in that The step of judging whether a gap between a boundary of an upper workpiece and a boundary of a lower workpiece satisfies a gap condition comprises: Determining whether a gap between a boundary of an upper layer workpiece and an inner boundary of a lower layer workpiece is within a first preset range; And / or, determining whether a gap between a boundary of the upper workpiece and an outer boundary of the lower workpiece is within a second preset range.

5. The method according to claim 1, characterized in that The process of processing the workpiece to be assembled in a preset manner includes: Outputting alarm information for the workpiece to be assembled; And / or, the workpiece to be assembled is moved out of the production line.

6. The method according to claim 1, characterized in that The step of determining a starting position of the assembly component by detecting the second image includes: Detecting a starting positioning hole in the second image and an adjacent boundary of the starting positioning hole, wherein the starting positioning hole is a positioning hole corresponding to a starting position of an assembly component; The starting position of the assembly component is determined according to the positional relationship between the starting positioning hole and its adjacent boundary.

7. The method according to claim 6, characterized in that The step of acquiring an image of the workpiece to be assembled at the assembly workstation as a second image includes: An image of the workpiece to be assembled at the assembly workstation is collected by a camera linked to the assembly component as a second image, wherein the second image includes the positioning hole and its adjacent boundary below the starting position of the assembly component.

8. The method according to claim 6, characterized in that Each of the assembly positions corresponds to a positioning hole of the workpiece to be assembled; the method further comprises: During the process of controlling the assembly component to move from the starting position to each assembly position along the assembly path in sequence, for each assembly position, a third image is captured by a camera, wherein the third image includes a positioning hole corresponding to the assembly position; By detecting the third image, it is determined whether the positioning hole corresponding to the assembly position matches the assembly position, and if they do not match, the assembly path is adjusted.

9. The method according to claim 8, characterized in that The adjusting the assembly path comprises: Determine the deviation data between the positioning hole corresponding to the assembly position and the assembly position; According to the deviation data, the assembly positions in the remaining assembly paths are adjusted to generate a new assembly path consisting of the adjusted assembly positions.

10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the program, the method according to any one of claims 1 to 9 is implemented.

11. A non-transitory computer-readable storage medium, characterized in that: The non-transitory computer-readable storage medium stores computer instructions, and the computer instructions are used to cause the computer to execute any one of claims 1 to 9.

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