A packaging jig and a packaging method for a laser bar

Abstract

The application provides a packaging jig and a packaging method for a laser bar. The packaging jig comprises a jig body and an avoiding part. The jig body has two opposite installation surfaces. The avoiding part is arranged on one of the installation surfaces. The other installation surface is suitable for placing a bar to be packaged. A light emitting cavity surface of the bar to be packaged locally abuts against the avoiding part. A light emitting area on the light emitting cavity surface is at least partially exposed. The light emitting cavity surface of the bar and the avoiding part are not in complete contact. The contact can be a local surface contact, a line contact or a multi-point contact. The contact area is effectively reduced, the probability of contamination and damage of the light emitting cavity surface is effectively reduced, and the yield of packaging is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor lasers, and particularly relates to a packaging jig and a packaging method for a laser bar. BACKGROUND

[0002] With the development of semiconductor laser technology, the epitaxial and chip technology of edge-emitting high-power has been quite mature, and the industrialization degree is also quite high. However, the packaging technology corresponding to the high-power chip has been relatively lagging behind, and the industrialization degree is relatively low. Different from the epitaxial and chip technology, the packaging needs to operate the laser bar (i.e. chip) multiple times, which is easy to cause various defects of the bar, and the yield is low, among which the proportion of the light-emitting cavity surface defect is the highest.

[0003] The light-emitting cavity surface of the laser bar is provided with a complex multilayer optical film, and the quality of the optical film determines the performance of the entire laser, and pollution and damage will directly lead to the failure of the entire laser.

[0004] The heat sink welding packaging is a basic packaging form of the laser bar. In the packaging process, in order to ensure good heat dissipation effect, it is necessary to ensure that the heat-emitting surface of the laser bar is completely attached to the heat sink. At the same time, the collimation of the semiconductor laser is relatively poor, and the laser has a certain divergence angle after being emitted from the light-emitting cavity surface. In order to avoid the blocking of the heat sink to the laser, the light-emitting cavity surface must be flush with the front end surface of the heat sink, or slightly exceed the front end surface of the heat sink.

[0005] Chinese patent document CN 208336807 U discloses a large-power micro-channel structure bar laser sintering clamp, which comprises a positioning base, a heat sink pressing block and a bar pressing block. The positioning base comprises a first surface and a second surface, and the first surface and the second surface are both provided with slopes facing the interior of the positioning base, and the slopes of the first surface and the second surface are perpendicular to each other. The heat sink is placed on the first surface, and the heat sink is pressed by the heat sink pressing block. The heat-emitting surface of the bar is tightly attached to the solder layer of the heat sink. The bar is adjusted to be in the middle position of the heat sink. The light-emitting cavity surface of the bar is in close contact with the surface of the wide limiting groove of the bar pressing block. The bar pressing block is placed on the second surface and is applied to the bar by gravity to realize the positioning of the bar.

[0006] The close contact between the light-emitting cavity surface of the bar and the surface of the wide limiting groove of the bar pressing block is easy to cause pollution and damage of the light-emitting cavity surface of the bar, greatly increase the light absorption rate of the light-emitting cavity surface, convert the absorbed light of the bar into heat energy, cause the temperature of the light-emitting cavity surface to rise, and cause the bar to be burned, thereby causing the failure of the laser. SUMMARY

[0007] Therefore, the technical problem to be solved by the present application is that the existing packaging jig is easy to cause pollution and damage of the light-emitting cavity surface of the bar, and affects the yield and reliability of the bar packaging.

[0008] To this end, the application provides a packaging jig for a laser bar, comprising

[0009] a jig body having two opposite mounting surfaces;

[0010] an avoiding portion arranged on one of the mounting surfaces;

[0011] the other mounting surface is adapted to place a bar to be packaged; the light-emitting cavity surface of the bar to be packaged locally abuts on the avoiding portion; and a light-emitting area on the light-emitting cavity surface is at least partially exposed.

[0012] Preferably, the packaging jig for the laser bar,

[0013] the avoiding portion has an avoiding surface;

[0014] the edge of the end where the light-emitting cavity surface of the bar is located is adapted to abut on the avoiding surface.

[0015] Preferably, the packaging jig for the laser bar, the avoiding surface is an avoiding plane; the avoiding plane is arranged at an acute angle with the light-emitting cavity surface.

[0016] Preferably, the packaging jig for the laser bar, the avoiding portion is an avoiding groove arranged on one of the mounting surfaces; the inner surface of the avoiding groove is an avoiding plane.

[0017] Preferably, the packaging jig for the laser bar, both of the mounting surfaces are planes; and the mounting surfaces are arranged in a V shape; the groove bottom plane of the avoiding groove is parallel to the mounting surface on the same side.

[0018] Preferably, the packaging jig for the laser bar further comprises an alignment sheet;

[0019] the alignment sheet is arranged on the mounting surface on the side opposite to the bar;

[0020] the avoiding groove is arranged on the alignment sheet.

[0021] Preferably, the packaging jig for the laser bar, the alignment sheet is a silicon sheet, a quartz glass sheet or a sapphire sheet.

[0022] The application provides a packaging method for a laser bar, which adopts the packaging jig for the laser bar described above; comprising

[0023] S1: placing the heat sink with the solder layer I side upward on one of the mounting surfaces of the packaging jig, so that the lower end abuts on the other mounting surface opposite to it;

[0024] S2: placing the bar on the solder layer I, and locally abutting the end where the light-emitting cavity surface is located on the avoiding portion of the other mounting surface;

[0025] S3: placing the bar-pressing block above the bar to make the bar adhere to the heat sink;

[0026] S4: putting the assembled heat sink, bar and bar-pressing block together with the jig into a reflow furnace to perform reflow soldering.

[0027] Preferably, the packaging method of the laser bar,

[0028] Between steps S2 and S3, further comprising

[0029] S20: placing the insulating sheet with the upper and lower surfaces respectively provided with metal layers on the heat sink on the same side as the bar;

[0030] S21: covering the negative plate with the solder layer II side on the bar and the insulating sheet at the same time;

[0031] S22: placing the pressing plate on the negative plate to make the negative plate, the insulating sheet and the heat sink adhere to each other;

[0032] Corresponding S3 step becomes: placing the bar-pressing block on the negative plate above the bar to make the negative plate, the bar and the heat sink adhere to each other;

[0033] Corresponding S4 step becomes: putting the assembled heat sink, bar, insulating sheet, negative plate, bar-pressing block and pressing plate together with the jig into a reflow furnace to perform reflow soldering.

[0034] Preferably, in the packaging method of the laser bar, the pressing plate in step S22 is an L-shaped plate; the vertical part of the L-shaped pressing plate is buckled on the upper surface of the negative plate to make the negative plate, the insulating sheet and the heat sink adhere to each other; and the horizontal part of the L-shaped pressing plate is hung on the upper end of the heat sink, the insulating sheet and the negative plate to avoid the pressing plate from sliding towards the bar.

[0035] The technical scheme of the present application has the following advantages:

[0036] 1. The packaging jig of the laser bar provided by the present application comprises a jig body and an avoiding part. The jig body has two opposite installation surfaces, and the avoiding part is arranged on one of the installation surfaces. The other installation surface is suitable for placing a bar to be packaged, and the light-out cavity surface of the bar to be packaged is partially exposed and suitable for locally abutting on the avoiding part. The light-out cavity surface of the bar and the avoiding part are not in complete contact, i.e., they can be in partial surface contact, linear contact or multi-point contact. By reducing the contact area, the probability of pollution and damage of the light-out cavity surface is effectively reduced, and the yield of the packaged products is improved.

[0037] 2. The packaging jig for the laser bar provided by the present application has an avoiding plane on the avoiding part, the edge of one end of the light emitting cavity surface of the bar abuts on the avoiding plane, and the light emitting cavity surface is arranged at an acute angle with the avoiding plane, only the edge of the light emitting cavity surface is in linear contact with the avoiding plane, so that the light emitting cavity surface is basically in a completely exposed state during the packaging process, the contact between the light emitting cavity surface and the surface of the jig is further reduced, the pollution and damage of the light emitting cavity surface are avoided, and the yield of the packaging and the reliability of the bar are improved.

[0038] 3. The packaging jig for the laser bar provided by the present application further has an alignment piece, the alignment piece is fixed on one side of the mounting surface of the packaging jig, the avoiding groove is arranged on the alignment piece, the processing is more convenient, and the alignment piece is convenient to take down and check the avoiding groove; the alignment piece is made of a silicon piece, a quartz glass piece or a sapphire piece, the flatness of the surface is high after polishing, the alignment piece is not easy to be deformed and damaged, and the service life is high. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the specific embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0040] Figure 1 FIG. 1 is a structural schematic diagram of the packaging jig for the laser bar of the present application;

[0041] Figure 2 FIG. 2 is a partial enlarged structural schematic diagram in FIG. 1; Figure 1

[0042] Figure 3 FIG. 3 is a structural schematic diagram of the packaging of the bar in the present application;

[0043] Figure 4 FIG. 4 is a structural schematic diagram of the light emitting cavity surface of the bar in the present application.

[0044] Legend of the drawings:

[0045] 1 - jig body; 2 - alignment piece; 20 - avoiding groove; 3 - heat sink; 30 - solder layer I; 31 - side wall surface A; 32 - side wall surface B; 33 - side wall surface C; 4 - bar; 40 - light emitting cavity surface; 400 - light emitting area; 5 - insulating piece; 6 - negative electrode piece; 60 - solder layer II; 7 - pressing plate; 8 - bar pressing block; 9 - counterweight. DETAILED DESCRIPTION

[0046] ​The technical solutions of the present application will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of them. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0047] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0048] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0049] Embodiment 1

[0050] The present embodiment provides a packaging jig for laser bars, as shown in Figure 1 The material of the jig body 1 in the present embodiment is aluminum, copper or stainless steel with surface passivation treatment, and the jig body 1 has two opposite mounting surfaces, both of which are flat surfaces in the present embodiment, and the two mounting surfaces are arranged in a V shape, and the angle between any mounting surface and the horizontal plane is an acute angle, and the included angle of the V shape is also an acute angle. In the present embodiment, the heat sink 3 and the alignment piece 2 are both cuboid structures identical to the overall structure of the bar 4, and the alignment piece 2 can be made of silicon, quartz glass or sapphire, etc. In the present embodiment, the alignment piece 2 is made of silicon.

[0051] As shown in Figure 1 The alignment piece 2 is tightly attached to the left mounting surface of the jig body 1 and located at the bottom of the mounting surface, and the alignment piece 2 forms an angle α with the opposite right mounting surface, and the angle α in the present embodiment is 45°-85°. The wall surface of the alignment piece 2 facing the opposite right mounting surface is provided with a relief, and the light emitting cavity surface 40 of the bar 4 partially abuts on the relief, as shown in Figure 4As shown, the light-emitting cavity surface 40 of the bar bar 4 has a light-emitting area 400 near the positive electrode surface. The avoidance part can completely or partially avoid the light-emitting area 400. The avoidance part has a certain supporting force on the light-emitting cavity surface 40 of the bar bar 4. The avoidance part has an avoidance surface. In this embodiment, the avoidance surface is an avoidance plane. The avoidance part is an avoidance groove 20 with a cross-section of C. The avoidance groove 20 is formed on the alignment sheet 2 by wet etching or plasma dry etching. The inner surface of the avoidance groove 20 serves as the avoidance plane. The avoidance plane is polished and has a very high surface flatness.

[0052] like Figure 1 As shown, the opposing sidewall surfaces A31 and B32 of the heat sink 3 are parallel to each other. The thickness of the heat sink 3, i.e., the conventional distance d1 between sidewall surfaces A31 and B32, is 1-3 mm. Sidewall surface A31 is tightly attached to the right mounting surface of the fixture body 1. The heat sink 3 is located at the bottom of this mounting surface, and its adjacent sidewall surface C33, which is adjacent to sidewall surfaces A31 and B32 respectively, abuts against the lower groove edge of the clearance groove 20. In this embodiment, as shown... Figure 2 As shown, the side wall surface C33 partially extends into the inner cavity of the clearance groove 20, and the extended end is a certain distance away from the inner surface of the clearance groove 20.

[0053] A solder layer I30 is uniformly disposed on the sidewall surface B32 of the heat sink 3. The conventional thickness d2 of the solder layer I30 is 3-10 μm. The heating surface of the bar 4, i.e., the positive electrode surface, also known as the P surface, is in close contact with the solder layer I30. The negative electrode surface, also known as the N surface, is opposite to the P surface on the bar 4. The distance between the P surface and the N surface, i.e., the thickness d3 of the bar 4, is 50-200 μm. This thickness is the conventional thickness, but other thicknesses can also be used, depending on the specific requirements. Figure 2As shown, the bar 4 is slid under its own gravity and one end extends beyond the bottom of the side wall surface B32 where the solder layer I 30 is located, i.e. the light emitting cavity surface 40 extends beyond the side wall surface C33 by a certain distance, in this embodiment, the optimal length of the distance d4 is 5-20 μm, of course, when the side wall surface C33 extends into the inner cavity of the avoiding slot 20 by a certain length, the length of d4 can be less than 5 μm, when the length of d4 is zero, at this time, the light emitting cavity surface 40 and the side wall surface C33 are located in the same plane, the light emitting cavity surface 40 extends by a certain distance to avoid the problem that the solder climbs to the light emitting cavity surface 40 to cause the light emitting cavity surface 40 to be blocked during the process of putting the bar 4 into the oven for reflow, at the same time, the problem that the solder climbs to the light emitting cavity surface 40 due to electromigration to cause the light emitting cavity surface 40 to be blocked during the long-term working process of the laser device is also avoided, which greatly improves the yield of packaging and the reliability of the product. The lower edge of the light emitting cavity surface 40 is suspended in the inner cavity of the avoiding slot 20, and the upper edge abuts against the slot bottom plane of the avoiding slot 20, the light emitting cavity surface 40 is in line contact with the slot bottom plane, and an acute angle is formed between the two planes, which reduces the contact between the light emitting cavity surface 40 and the alignment piece 2, avoids the pollution and damage of the light emitting cavity surface 40, and improves the yield of packaging and the reliability of the bar 4.

[0054] As shown in the figure, Figure 2 In this embodiment, the width L2 of the avoiding slot 20, the distance L1 between the lower slot wall of the avoiding slot 20 and the side wall surface of the alignment piece 2 close to it, and the depth L3 of the avoiding slot 20 satisfy the formula:

[0055] L1 < d1 / sinα;

[0056] L2 > (d1+d2+d3) / sinα-L1;

[0057] L3 = (d1+d2+d3-L1Sinα-d4Cotα)Cosα+d4 / Sinα.

[0058] As a first alternative embodiment of embodiment 1, the two mounting surfaces of the jig body 1 can not be flat, as long as the side wall surface A31 of the heat sink 3 can be fixed on the corresponding mounting surface, and when the heat sink 3 is placed on the mounting surface, the included angle formed between the plane where the side wall surface B32 is located and the avoiding plane of the avoiding part is an acute angle.

[0059] As a second alternative embodiment of embodiment 1, the avoiding slot 20 can not be provided, the surface of the alignment piece 2 serves as the avoiding plane, the upper edge of the light emitting cavity surface 40 of the bar 4 abuts against the surface of the alignment piece 2, and an acute angle is formed between the light emitting cavity surface 40 and the surface of the alignment piece 2; further, the alignment piece 2 can not be provided, the jig body 1 is made of silicon or quartz glass, and the avoiding plane is directly provided on one side of the mounting surface of the jig body 1.

[0060] As a third alternative embodiment of the embodiment 1, the avoiding surface can be an avoiding curved surface, as long as it has local supporting force to the light emitting cavity surface and can completely avoid or partially avoid the light emitting area.

[0061] Embodiment 2

[0062] The embodiment provides a packaging jig for a laser bar, compared with the structure of the packaging jig for the laser bar provided in the embodiment 1, the difference lies in that the avoiding part is at least two protrusions on one mounting surface of the packaging jig or on the alignment piece 2, the vertexes of the protrusions are in point contact with the light emitting cavity surface 40 and abut on the light emitting cavity surface 40, the light emitting cavity surface 40 is supported by at least two points, and the plane where the vertexes of the protrusions supporting the light emitting cavity surface 40 are located is parallel to the light emitting cavity surface 40, and the remaining surface of the light emitting cavity surface 40 is exposed.

[0063] Embodiment 3

[0064] The embodiment provides a packaging method for a laser bar, the packaging jig for the laser bar provided in the embodiment 1 or the embodiment 2 is used, and the packaging steps are as follows.

[0065] S1: placing the heat sink 3 with the solder layer I 30 on one side upwards on one mounting surface of the packaging jig, so that the lower end abuts on the other mounting surface in opposite;

[0066] S2: placing the bar 4 on the solder layer I 30, and locally abutting one end of the light emitting cavity surface 40 on the avoiding part of the other mounting surface;

[0067] S20: placing the insulating piece 5 with metal layers arranged on the upper and lower surfaces on the heat sink 3 on the same side of the bar 4;

[0068] S21: covering the negative piece 6 with the solder layer II 60 on the bar 4 and the insulating piece 5 on the same side;

[0069] S22: placing the pressing plate 7 on the negative piece 6, so that the negative piece 6, the insulating piece 5 and the heat sink 3 are tightly attached.

[0070] S3: placing the bar pressing block 8 on the negative piece 6 above the bar 4, so that the negative piece 6, the bar 4 and the heat sink 3 are tightly attached;

[0071] S4: placing the assembled heat sink 3, bar 4, insulating piece 5, negative piece 6, bar pressing block 8 and pressing plate 7 together with the jig into a reflow furnace, and performing reflow soldering.

[0072] When the packaging jig in the embodiment 1 is used, the corresponding step S2 is: placing the bar 4 on the solder layer I 30, and abutting the upper edge of one end of the light emitting cavity surface 40 on the groove bottom plane of the avoiding groove 20;

[0073] When the packaging fixture in Example 2 is used, the corresponding step S2 is: placing the bar 4 on the solder layer I 30, and a portion of the light-emitting cavity surface 40 abutting against the top surface of the boss;

[0074] When the packaging fixture in Example 3 is used, the corresponding step S2 is: placing the bar 4 on the solder layer I 30, and the light-emitting cavity surface 40 abutting against the apex of the protrusion;

[0075] like Figure 3 As shown, in this embodiment, the pressure plate 7 is an L-shaped plate. The vertical part of the L-shape of the pressure plate 7 is pressed against the upper surface of the negative electrode sheet 6, so that the negative electrode sheet 6, the insulating sheet 5 and the heat sink 3 are tightly attached. The horizontal part of the L-shape of the pressure plate 7 is hung on the upper surface of the heat sink 3, the insulating sheet 5 and the negative electrode sheet 6 to prevent the pressure plate 7 from sliding towards the bar 4.

[0076] In this embodiment, the negative electrode sheet 6 is usually made of gold-plated copper foil with a thickness of 0.05 to 0.2 mm; the bar pressing block 8 and the pressing plate 7 can be made of materials such as glass, ceramic, sapphire, or metal, depending on the specific needs.

[0077] In the above steps, a counterweight 9 can also be set on the bar strip pressing block 8. The counterweight 9 abuts against the mounting surface of the packaging fixture on the same side as the clearance part. Its front end is provided with a rib. The rib presses against the middle position of the bar strip pressing block 8, so that the bar strip 4 is fixed more firmly.

[0078] As a first alternative implementation of Example 4, when the clearance portion is provided on the alignment piece 2, step S0 needs to be added before step S1: place the clearance portion of the alignment piece 2 facing outward on one of the mounting surfaces of the packaging fixture; the corresponding step S1 is: place the heat sink 3 with the solder layer I30 side facing upward on the other mounting surface of the packaging fixture, so that its lower end abuts against the alignment piece 2.

[0079] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A packaging jig for a laser bar, characterized by, The utility model relates to a packaging jig for laser bar, comprising: a jig body (1) having two opposite installation surfaces; an avoiding part provided on one of the installation surfaces, the avoiding part having an avoiding surface, the avoiding part being an avoiding groove (20); the other installation surface being adapted to place a bar to be packaged; a light emitting cavity surface (40) of the bar to be packaged locally abutting on the avoiding part; and a light emitting area (400) on the light emitting cavity surface (40) being at least partially exposed; an edge of one end of the light emitting cavity surface (40) of the bar to be packaged being adapted to abut on the avoiding surface; the avoiding surface being an avoiding plane; and the avoiding plane being arranged at an acute angle with the light emitting cavity surface (40); an alignment piece (2) provided on the installation surface opposite to the bar to be packaged, the avoiding groove (20) being formed on the alignment piece (2); the bar to be packaged comprising a heat sink (3) and a bar (4), the bar (4) being fixed to the heat sink (3) through a solder layer I (30), the heat sink (3) having opposite parallel side wall surfaces A (31) and side avoiding surfaces B (32), a general distance d1 between the side wall surface A (31) and the side wall surface B (32), a general thickness d2 of the solder layer I (30), a distance d4 of the light emitting cavity surface (40) beyond a side wall surface C (33), and a thickness d3 of the bar (4); the alignment piece (2) being provided on the installation surface opposite to the bar to be packaged, and a clamping angle alpha being formed between the alignment piece (2) and the right installation surface opposite thereto; a width L2 of the avoiding groove (20), a distance L1 between a groove wall below the avoiding groove (20) and a side wall surface of the alignment piece (2) close thereto, and a depth L3 of the avoiding groove (20) satisfying the formulae: L1 < d1 / sin alpha; L2 > (d1+d2+d3) / sin alpha-L1; L3 = (d1+d2+d3-L1Sin alpha-d4Cot alpha)Cos alpha+d4 / Sin alpha.

2. The packaging jig of the laser bar according to claim 1, wherein, Both of the installation surfaces are planes, and the installation surfaces are arranged in a V shape; and a groove bottom plane of the avoiding groove (20) is parallel to the installation surface on the same side.

3. The packaging jig of the laser bar according to claim 2, wherein, A cross section of the avoiding groove (20) is in the shape of a Chinese character "fang".

4. The packaging jig of the laser bars according to claim 3, wherein, The avoiding groove (20) is formed by wet etching or plasma dry etching.

5. The packaging jig of the laser bars according to claim 4, wherein, The alignment piece (2) is made of a silicon wafer, a quartz glass wafer or a sapphire wafer.

6. A method of packaging a laser bar, characterized by The utility model relates to a packaging jig for laser bar, comprising: S1: placing the heat sink (3) with the solder layer I (30) on one side upward on one installation surface of the packaging jig, and making the lower end abut on the other installation surface opposite thereto; S2: placing the bar (4) on the solder layer I (30), and making one end of the light emitting cavity surface (40) locally abut on the avoiding part of the other installation surface; S3: placing a bar pressing block (8) above the bar (4), and making the bar (4) and the heat sink (3) adhere to each other; S4: putting the assembled heat sink (3), bar (4) and bar pressing block (8) together with the packaging jig into a reflow furnace, and performing reflow soldering. The utility model relates to a packaging jig for laser bar, comprising:

7. The method of packaging a laser bar according to claim 6, wherein, S1: placing the heat sink (3) with the solder layer I (30) on one side upward on one installation surface of the packaging jig, and making the lower end abut on the other installation surface opposite thereto; S2: placing the bar (4) on the solder layer I (30), and making one end of the light emitting cavity surface (40) locally abut on the avoiding part of the other installation surface; S3: placing a bar pressing block (8) above the bar (4), and making the bar (4) and the heat sink (3) adhere to each other; S4: putting the assembled heat sink (3), bar (4) and bar pressing block (8) together with the packaging jig into a reflow furnace, and performing reflow soldering. between steps S2 and S3. S20: the insulation sheet (5) with metal layer on upper and lower surfaces is placed on the heat sink (3) on the same side as the bus bar (4); S21: the negative plate (6) with the solder layer II (60) is covered on the bus bar (4) and the insulation sheet (5) at the same time; S22: the pressing plate (7) is placed on the negative plate (6), so that the negative plate (6), the insulation sheet (5) and the heat sink (3) are attached together; The corresponding S3 step becomes: the bus bar pressing block (8) is placed on the negative plate (6) above the bus bar (4), so that the negative plate (6), the bus bar (4) and the heat sink (3) are attached together; The corresponding S4 step becomes: the assembled heat sink (3), bus bar (4), insulation sheet (5), negative plate (6), bus bar pressing block (8) and pressing plate (7) are put into the reflow furnace together with the packaging jig for reflow soldering.

8. The method of packaging a laser bar according to claim 7, wherein, The pressing plate (7) in the step S22 is an L-shaped plate; the vertical part of the L-shaped plate is buckled on the upper surface of the negative plate (6), so that the negative plate (6), the insulation sheet (5) and the heat sink (3) are attached together; the horizontal part of the L-shaped plate is hung on the upper end surface of the heat sink (3), the insulation sheet (5) and the negative plate (6), so as to avoid the pressing plate (7) from sliding towards the bus bar (4).

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