A relay with high fault current resistance

By setting magnetic parts in the spring component of the relay, the magnetic induction intensity between the current is enhanced, and the problem of the existing relay when facing the large fault current. Fault current capacity and low copper consumption effect.

CN110867349BActive Publication Date: 2025-01-28XIAMEN HONGFA ELECTRIC POWER CONTROLS CO LTD
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Patent Information

Application Number
CN201910910924.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-09-25
Publication Date
2025-01-28
Estimated Expiration
2039-09-25

AI Technical Summary

Technical Problem

When existing relays face large fault currents, the repulsion between the contacts becomes larger, causing the contact to bounce and fail. It is difficult to enhance the ampere force by increasing the length of the current-carrying conductor under space limitations, resulting in increased copper consumption and product Increase in volume.

Method used

Set magnetic parts on the thickness direction of the spring component to reduce the magnetic resistance of the magnetic circuit to generate magnetic circuits, enhance the magnetic induction intensity between the same or reverse current, thereby increasing the ampel power and improving the ability to resist the fault current.

Benefits of technology

In the case of not adjusting the pitch of the current or increasing the length of the load conductor, improve the resistance of the retirement of relay, reduce the copper consumption of the conductive circuit, and reduce the volume of the product.

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Abstract

The present invention relates to a relay with high fault current resistance. By placing a magnetic conductive part in the magnetic circuit generated by the fault current on the anti-short circuit structure, the magnetic resistance of the magnetic circuit generated by the current is reduced, the magnetic induction intensity of the interaction between the same-direction current or the reverse current is enhanced, and the mutual Ampere force is increased. Furthermore, without adjusting the spacing between the same-direction current or the reverse current and without increasing the length of the current-carrying conductor, the Ampere force of the same-direction current or the reverse current can be increased to improve the ability to resist fault current, reduce the copper loss of the conductive circuit, and reduce the volume of the product. The magnetic conductive part can be implemented in the form of a variety of different structures, and can be in contact with or non-contact with the dynamic spring assembly. Among them, it can be implemented as a layer of sub-spring of a dynamic spring with a multi-layer structure. As a part of the dynamic spring, it directly participates in the conduction while realizing magnetic conduction. The magnetic conductive part of the present invention has a simple structure and is easy to install. It will not increase the production cost and will not affect the production efficiency.
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Description

Technical Field

[0001] The present invention relates to the technical field of relays, and more particularly to a relay with high fault current resistance. Background Art

[0002] Relays are generally composed of a magnetic circuit system, a contact system, a driving part and a base. The magnetic circuit system is generally composed of two basically symmetrical magnetic circuits, including a stationary magnetic conductive part, a movable magnetic conductive part and a coil. The contact system includes a movable spring assembly and a static spring part. The driving part is generally played by a driving card. When a positive pulse voltage is passed through the relay coil, the magnetic circuit system works, and the driving card pushes the movable spring part to make the contacts contact and the relay operates. When a reverse pulse voltage is passed through the coil, the magnetic circuit system works, and the driving card pushes the movable spring part to disconnect the contacts and reset the relay. Figure 1 , Figure 2 As shown, in the design of traditional contact systems, the purpose of resisting fault current is achieved by utilizing the principle that opposite currents repel each other and currents in the same direction attract each other between the moving spring sheet and the moving spring lead-out sheet in the moving spring assembly, or between the moving spring sheets of different moving spring assemblies, that is, an anti-short-circuit structure is provided in the moving spring assembly or between the moving spring assemblies.

[0003] But when the fault current is large, such as Figure 3 As shown, the contact repulsion between contacts due to the contraction current becomes larger. According to the prior art, if one wants to overcome the defect of the increased contact repulsion due to the contraction current, the only way is to reduce the spacing between the same-direction current or the reverse current, or increase the length of the relative current-carrying conductor to increase the Ampere force, thereby offsetting the problem of contact pop-up failure caused by the contact repulsion.

[0004] In reality, the spacing between current-carrying conductors of the same or opposite current is very limited due to the restrictions of contact gap and space, and the space available for adjustment is very limited; and increasing the length of the relative current-carrying conductor will increase the copper loss and body resistance of the circuit, which is not conducive to the miniaturization of the product.

[0005] This solution can increase the Ampere force of the same or reverse current without increasing the length of the current-carrying conductor, thereby reducing the copper loss of the conductive circuit and reducing the volume of the product under extreme fault current conditions. Summary of the invention

[0006] The object of the present invention is to overcome the deficiencies of the prior art and provide a relay with high fault current resistance, which can increase the Ampere force of the same direction current or the reverse current without adjusting the spacing between the same direction current or the reverse current and without increasing the length of the current-carrying conductor, so as to improve the ability to resist fault current, reduce the copper loss of the conductive circuit, and reduce the volume of the product.

[0007] The technical solution of the present invention is as follows:

[0008] A relay with high fault current resistance comprises a magnetic circuit system, a driving component and a contact system. The contact system comprises a dynamic spring component and a static spring component. The dynamic spring component and the static spring component serve as current carriers and form an anti-short circuit structure. A magnetic circuit is formed in the dynamic spring component or between the dynamic spring components. Magnetic conductive parts are arranged on the two outward sides of the dynamic spring component in the thickness direction or on the two outer sides of the dynamic spring components that are opposite to each other in the thickness direction, so as to reduce the magnetic resistance of the magnetic circuit generated by the current, enhance the magnetic induction intensity of the interaction between the same-direction current or the reverse current loaded on the current carrier, and enhance the Ampere force between the current carriers.

[0009] Preferably, when a magnetic circuit is formed in the dynamic spring assembly, the dynamic spring assembly is provided with current carriers arranged side by side for loading reverse current, and the magnetic conductive parts are respectively arranged on the opposite sides of the two current carriers.

[0010] Preferably, the movable spring assembly includes a first movable spring piece, a first movable contact, and a first movable spring lead-out piece, and the static spring assembly includes a static spring piece and a first static contact; the first movable spring piece and the static spring piece are respectively arranged at matching positions, one end of the first movable spring piece is connected to one end of the first movable spring lead-out piece, and the first movable contact is arranged at the other end of the first movable spring piece, located on a side away from the first movable spring lead-out piece; the first static contact corresponds to the first movable contact and is arranged on the static spring piece;

[0011] A magnetic circuit is formed in the movable spring assembly, and the magnetic conductive parts are respectively arranged on the same side of the first movable spring piece and the first movable contact point, and on the side of the first movable spring lead-out piece away from the first movable spring piece.

[0012] Preferably, the first movable spring piece and / or the first movable spring lead-out piece provided with the magnetic conductive member are slotted to form multiple parallel conductive loops, wherein several conductive loops or each conductive loop is provided with the magnetic conductive member.

[0013] Preferably, when a magnetic circuit is formed between the dynamic spring assemblies, the dynamic spring assemblies include current carriers arranged side by side for carrying current in the same direction, and the magnetic conductive parts are respectively arranged on opposite sides of the two current carriers.

[0014] Preferably, a movable spring assembly 1 and a movable spring assembly 2 are provided, wherein the movable spring assembly 1 includes a second movable spring lead-out piece, a second movable spring piece, and a second movable contact, the movable spring assembly 2 includes a third movable spring lead-out piece, a third movable spring piece, and a third movable contact, and the static spring assembly includes a second static contact and a third static contact; one end of the second movable spring piece is connected to one end of the second movable spring lead-out piece, and a second static contact is provided, and the second movable contact is provided at the other end of the second movable spring piece; the third movable contact is provided at one end of the third movable spring piece, corresponding to the second static contact, and the other end of the third movable spring piece is connected to one end of the third movable spring lead-out piece, and a third static contact is provided, corresponding to the second movable contact;

[0015] A magnetic circuit is formed between the first moving contact assembly and the second moving contact assembly. The magnetic conductive members are respectively arranged on the sides of the second moving contact piece and the third moving contact piece facing away from each other, and on the sides of the third moving contact piece and the second moving contact piece facing away from each other.

[0016] Preferably, the second moving contact piece and / or the third moving contact piece provided with the magnetic conductive member form a multi-path parallel conductive circuit through slotted openings, and a magnetic conductive member is correspondingly arranged for several of the conductive circuits or each conductive circuit.

[0017] Preferably, the magnetic conductive member is a magnetic conductive cover with a "C"-shaped cross-section, which is covered on the current carrier in a three-sided covering manner.

[0018] Preferably, the magnetic conductive member is a sheet-like reed structure, which is arranged on the moving contact piece.

[0019] Preferably, the first moving contact piece, the second moving contact piece or the third moving contact piece includes several sub-reed pieces, and the magnetic conductive member is used as one layer of the sub-reed pieces and is arranged integrally with the remaining sub-reed pieces.

[0020] The beneficial effects of the present invention are as follows:

[0021] For the relay with high fault current resistance described in the present invention, by placing the magnetic conductive member into the magnetic circuit generated by the fault current on the short-circuit resistance structure, the magnetic resistance of the magnetic circuit generated by the current is reduced, the magnetic induction intensity of the interaction between the co-directional currents or the reverse currents is enhanced, and the Ampere force between them is increased. Furthermore, without adjusting the distance between the co-directional currents or the reverse currents and without increasing the length of the current-carrying conductor, the Ampere force of the co-directional currents or the reverse currents can be increased, so as to improve the ability to resist fault current, reduce the copper loss of the conductive circuit, and reduce the volume of the product.

[0022] The magnetic conductive member can be implemented in various different structural forms, and can be in contact or non-contact setting with the moving contact assembly. Among them, it can be implemented as a magnetic conductive cover, which is covered on the current carrier in a three-sided covering manner; it can be implemented as a sheet-like reed structure, which is arranged on the moving contact piece; it can be implemented as one layer of sub-reed pieces of the multi-layer structure of the moving contact piece, and as a part of the moving contact piece, it directly participates in conduction while realizing magnetic conduction. In the present invention, the structure of the magnetic conductive member is simple, the installation is convenient, it will not cause an increase in production cost, and it does not affect the production efficiency. Description of the Drawings

[0023] Figure 1 is a schematic structural diagram of the prior art for forming a magnetic circuit of co-directional currents;

[0024] Figure 2 is a schematic structural diagram of the prior art for forming a magnetic circuit of reverse currents;

[0025] Figure 3 is a schematic diagram showing that the contact repulsive force becomes larger due to the shrinking current;

[0026] Figure 4 is a structural schematic diagram of embodiment 1;

[0027] Figure 5 It is a structural schematic diagram of the magnetic shield;

[0028] Figure 6 yes Figure 4 A cross-sectional view at the location of the magnetic conductive element (showing the direction of the current and the direction of the magnetic field);

[0029] Figure 7 1 is a schematic diagram of the structure of the dynamic spring assembly of the first embodiment (the first dynamic spring piece and the first dynamic spring lead-out piece are both grooved);

[0030] Figure 8 It is a structural schematic diagram of the movable spring assembly of the first embodiment from another perspective (the first movable spring piece and the first movable spring lead-out piece are both grooved);

[0031] Fig. 9 is a structural diagram of Embodiment 2;

[0032] Fig.10 yes Fig. 9 A cross-sectional view at the location of the magnetic conductive element (showing the direction of the current and the direction of the magnetic field);

[0033] In the figure: 11 is the first moving reed, 12 is the second moving reed, 13 is the third moving reed, 21 is the first moving contact, 22 is the second moving contact, 23 is the third moving contact, 31 is the first moving spring lead-out piece, 32 is the second moving spring lead-out piece, 33 is the third moving spring lead-out piece, 41 is the static reed, 51 is the first static contact, 52 is the second static contact, 53 is the third static contact, 60 is the magnetic conductive part, 70 is the magnetic circuit system, and 80 is the driving component. DETAILED DESCRIPTION

[0034] The present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0035] A high fault current relay, such as Figure 4 , Fig. 9 As shown, it includes a magnetic circuit system 70, a pushing assembly 80, and a contact system. The contact system includes a dynamic spring assembly and a static spring assembly. The dynamic spring assembly and the static spring assembly serve as current carriers and form an anti-short circuit structure. A magnetic circuit is formed in the dynamic spring assembly or between the dynamic spring assembly and the static spring assembly. The principle of the anti-short circuit structure is as follows: through the structural design of the dynamic spring assembly and the static spring assembly, the current flowing through the dynamic spring assembly (between the dynamic spring lead-out piece of the same dynamic spring assembly) or between the dynamic spring assemblies (between the dynamic spring leaves of different dynamic spring assemblies) is opposite or the same in direction, so that the cooperation between the dynamic spring lead-out piece and the dynamic spring leaf and / or the cooperation between the dynamic spring leaf and the dynamic spring leaf can be used to form the Ampere force generated by the short-circuit current on the dynamic spring leaf to jointly resist the electromotive repulsion generated by the short-circuit current between the dynamic and static contacts.

[0036] In the present invention, magnetic conduction members 60 (made of magnetically conductive soft magnetic materials) are provided on the two outer sides of the moving contact assembly facing outward in the thickness direction or on the two outer sides of the moving contact assemblies facing away from each other in the thickness direction, for reducing the magnetic resistance of the magnetic circuit generated by the current, enhancing the magnetic induction intensity of the interaction between the同向 currents or反向 currents applied to the current carriers, and enhancing the Ampere force between the current carriers; furthermore, the repulsive force of the contacts can be enhanced, and the problem of contact bounce (connection failure) caused by the repulsive force of the contacts can be improved.

[0037] For the same requirement of canceling the repulsive force of the contacts, different short-circuit prevention structures correspond to different current direction requirements. However, theoretically, within the short-circuit prevention structure, the current directions formed on the opposite current-carrying conductors, whether they are同向 currents or反向 currents, can correspondingly cancel the repulsive force of the contacts. That is, whether it is同向 current or反向 current, within their respective short-circuit prevention structures, they can cancel the repulsive force of the contacts generated by the short-circuit current.

[0038] Embodiment 1

[0039] When a magnetic circuit is formed within the moving contact assembly, the moving contact assembly is provided with current carriers arranged side by side for loading反向 currents, and the magnetic conduction members 60 are respectively arranged on one side of the two current carriers facing away from each other.

[0040] Specifically, as Figure 4 shown, the moving contact assembly includes a first moving contact piece 11, a first moving contact 21, and a first moving contact lead piece 31, and the static contact assembly includes a static contact piece 41 and a first static contact 51; the first moving contact piece 11 and the static contact piece 41 are respectively arranged at adapted positions, one end of the first moving contact piece 11 is connected to one end of the first moving contact lead piece 31, and the first moving contact 21 is arranged at the other end of the first moving contact piece 11, on the side facing away from the first moving contact lead piece 31; the first static contact 51 corresponds to the first moving contact 21 and is arranged on the static contact piece 41. When the current flows in from the first moving contact lead piece 31, the current directions on the first moving contact piece 11 and the first moving contact lead piece 31 are相反, so according to the principle that反向 currents attract each other, the movement tendency of the mutual contact between the first moving contact 21 and the first static contact 51 is enhanced, and the repulsive force of the contacts can be canceled.

[0041] In the structure described above, a magnetic circuit is formed within the moving contact assembly. As Figure 4 shown, the magnetic conduction members 60 are respectively arranged on one side of the first moving contact piece 11 and the first moving contact 21 on the same side, that is, on the side close to the first static contact 51; and on the side of the first moving contact lead piece 31 facing away from the first moving contact piece 11, that is, on the side away from the first static contact 51.

[0042] In this embodiment, as Figure 5 shown, the magnetic conduction member 60 is a magnetic conduction cover with a "匚"-shaped cross section, which covers the current carriers in a three-sided covering manner. As Figure 6 As shown, after the current carrier is energized, the generated magnetic field propagates along the "C"-shaped magnetic conduction cover, which can reduce the magnetic resistance of the magnetic circuit generated by the current, enhance the magnetic induction intensity of the interaction between the reverse currents applied to the current carrier, and enhance the Ampere force between the current carriers.

[0043] In this embodiment, it is set that the first moving reed 11 and / or the first moving reed lead-out piece 31 of the magnetic conduction member 60 form a multi-path parallel conductive circuit through slotted openings, and a magnetic conduction member 60 is correspondingly arranged for several paths of the conductive circuit or each path of the conductive circuit. As Figure 7 、 Figure 8 shown, as an implementation manner, the first moving reed 11 forms two associated conductive circuits through one slotted opening, and then a magnetic conduction cover is arranged before and after the arc surface of each path of the conductive circuit of the first moving reed 11; at the same time, the first moving reed lead-out piece 31 forms two associated conductive circuits through one slotted opening, and then a magnetic conduction cover is arranged for both paths of the conductive circuits.

[0044] As another implementation manner, the magnetic conduction member 60 can be implemented as a sheet-shaped reed structure and is arranged on the first moving reed 11.

[0045] As still another implementation manner, the first moving reed 11 includes several sub-reeds, and the magnetic conduction member 60 serves as one layer of the sub-reeds, is arranged integrally with the remaining sub-reeds, and serves as a part of the first moving reed 11. While realizing magnetic conduction, it can directly participate in conduction or not participate in conduction.

[0046] Embodiment 2

[0047] The difference between this embodiment and Embodiment 1 lies in the different structures for forming the magnetic circuit, and correspondingly, the anti-short-circuit routes are also different. In this embodiment, when a magnetic circuit is formed between the moving reed assemblies, the moving reed assemblies include current carriers arranged side by side for loading同向 currents, and the magnetic conduction members 60 are respectively arranged on the opposite sides of the two current carriers.

[0048] Specifically, as Fig. 9As shown in the figure, a first moving contact spring assembly and a second moving contact spring assembly are provided. The first moving contact spring assembly includes a second moving contact spring lead piece 32, a second moving contact spring piece 12, and a second moving contact 22. The second moving contact spring assembly includes a third moving contact spring lead piece 33, a third moving contact spring piece 13, and a third moving contact 23. The static contact spring assembly includes a second static contact 52 and a third static contact 53. One end of the second moving contact spring piece 12 is connected to one end of the second moving contact spring lead piece 32, and the second static contact 52 is provided. The second moving contact 22 is provided at the other end of the second moving contact spring piece 12. The third moving contact 23 is provided at one end of the third moving contact spring piece 13, corresponding to the second static contact 52. The other end of the third moving contact spring piece 13 is connected to one end of the third moving contact spring lead piece 33, and the third static contact 53 is provided, corresponding to the second moving contact 22. When current flows in from the second moving contact spring lead piece 32, the current directions on the second moving contact spring piece 12 and the third moving contact spring piece 13 are the same. Then, according to the principle that like currents attract each other, the movement tendency of the mutual contact between the second moving contact 22 and the second static contact 52, and between the third moving contact 23 and the third static contact 53 is enhanced, and the contact repulsive force can be offset.

[0049] In the described structure, a magnetic circuit is formed between the first moving contact spring assembly and the second moving contact spring assembly. As Fig. 9 shown, the magnetic conductive members 60 are respectively provided on the sides of the second moving contact spring piece 12 and the third moving contact spring piece 13 facing away from each other, and on the sides of the third moving contact spring piece 13 and the second moving contact spring piece 12 facing away from each other.

[0050] In this embodiment, as Fig.10 shown, after the current carrier is energized, the generated magnetic field propagates along the "C"-shaped magnetic conductive cover, which can reduce the magnetic resistance of the magnetic circuit generated by the current, enhance the magnetic induction intensity of the interaction between the like currents applied to the current carrier, and enhance the Ampere force between the current carriers.

[0051] In this embodiment, the second moving contact spring piece 12 or the third moving contact spring piece 13 provided with the magnetic conductive member 60 forms a multi-path parallel conductive circuit by slotting, and a magnetic conductive member 60 is correspondingly provided for several paths of the conductive circuits or each path of the conductive circuits.

[0052] As another implementation manner, the magnetic conductive member 60 can be implemented as a sheet-shaped spring structure and is provided on the second moving contact spring piece 12 or the third moving contact spring piece 13.

[0053] As still another implementation manner, the second moving contact spring piece 12 or the third moving contact spring piece 13 includes several sub-spring pieces. The magnetic conductive member 60 serves as one layer of the sub-spring pieces, is provided integrally with the remaining sub-spring pieces, and serves as a part of the second moving contact spring piece 12 or the third moving contact spring piece 13. While realizing magnetic conduction, it can directly participate in conduction or not participate in conduction.

[0054] The other parts are the same as those in the first embodiment.

[0055] The above embodiments are only used to illustrate the present invention, and are not used to limit the present invention. As long as they are based on the technical essence of the present invention, changes and modifications to the above embodiments will fall within the scope of the claims of the present invention.

Claims

1. A relay with high fault current resistance, comprising a magnetic circuit system, a driving assembly, and a contact system, wherein the contact system comprises a dynamic spring assembly and a static spring assembly, the dynamic spring assembly and the static spring assembly serve as current carriers and form an anti-short circuit structure, and a magnetic circuit is formed in the dynamic spring assembly or between the dynamic spring assemblies; characterized in that: A magnetic conduction member is provided on both outer sides of the moving contact assembly facing outward in the thickness direction or on two outer sides of the moving contact assemblies facing away from each other in the thickness direction, which is used to reduce the magnetic resistance of the magnetic circuit generated by the current, enhance the magnetic induction intensity of the interaction between the同向 current or reverse current applied to the current carrier, and enhance the Ampere force between the current carriers.

2. The high fault current resistant relay according to claim 1, characterized in that: When a magnetic circuit is formed in the moving contact assembly, the moving contact assembly is provided with current carriers arranged side by side for loading reverse current, and the magnetic conduction members are respectively arranged on one side of the two current carriers facing away from each other.

3. The high fault current resistant relay according to claim 2, characterized in that: The moving contact assembly includes a first moving contact spring piece, a first moving contact, and a first moving contact spring lead-out piece, and the static contact assembly includes a static contact spring piece and a first static contact; the first moving contact spring piece and the static contact spring piece are respectively arranged at adapted positions, one end of the first moving contact spring piece is connected to one end of the first moving contact spring lead-out piece, and the first moving contact is arranged at the other end of the first moving contact spring piece, on the side facing away from the first moving contact spring lead-out piece; the first static contact corresponds to the first moving contact and is arranged on the static contact spring piece; A magnetic circuit is formed in the moving contact assembly, and the magnetic conduction members are respectively arranged on one side of the first moving contact spring piece and the first moving contact on the same side, and on the side of the first moving contact spring lead-out piece facing away from the first moving contact spring piece.

4. The high fault current resistant relay according to claim 3, characterized in that: The first moving contact spring piece and / or the first moving contact spring lead-out piece provided with the magnetic conduction member form a multi-path parallel conductive circuit through slotted holes, and a magnetic conduction member is correspondingly arranged for several paths of the conductive circuits or each path of the conductive circuits.

5. The high fault current resistant relay according to claim 1, characterized in that: When a magnetic circuit is formed between the moving contact assemblies, the moving contact assemblies include current carriers arranged side by side for loading同向 current, and the magnetic conduction members are respectively arranged on one side of the two current carriers facing away from each other.

6. The high fault current resistance relay according to claim 5, characterized in that: A first moving contact assembly and a second moving contact assembly are provided. The first moving contact assembly includes a second moving contact spring lead-out piece, a second moving contact spring piece, and a second moving contact. The second moving contact assembly includes a third moving contact spring lead-out piece, a third moving contact spring piece, and a third moving contact. The static contact assembly includes a second static contact and a third static contact; one end of the second moving contact spring piece is connected to one end of the second moving contact spring lead-out piece, and a second static contact is provided. The second moving contact is arranged at the other end of the second moving contact spring piece; the third moving contact is arranged at one end of the third moving contact spring piece, corresponding to the second static contact. The other end of the third moving contact spring piece is connected to one end of the third moving contact spring lead-out piece, and a third static contact is provided, corresponding to the second moving contact; A magnetic circuit is formed between the first moving contact assembly and the second moving contact assembly, and the magnetic conduction members are respectively arranged on the side of the second moving contact spring piece and the third moving contact spring piece facing away from each other, and on the side of the third moving contact spring piece and the second moving contact spring piece facing away from each other.

7. The high fault current resistance relay according to claim 6, characterized in that: The second moving contact spring piece and / or the third moving contact spring piece provided with the magnetic conduction member form a multi-path parallel conductive circuit through slotted holes, and a magnetic conduction member is correspondingly arranged for several paths of the conductive circuits or each path of the conductive circuits.

8. The high fault current resistance relay according to any one of claims 1 to 7, characterized in that: The magnetic conduction member is a magnetic conduction cover with a "匚"-shaped cross section, which covers the current carrier on three sides.

9. The high fault current resistance relay according to any one of claims 1 to 7, characterized in that: The magnetic conduction member is a sheet-like spring structure and is arranged on the moving contact spring piece.

10. The high fault current resistance relay according to any one of claims 1 to 7, characterized in that: The first moving contact spring piece, the second moving contact spring piece, or the third moving contact spring piece includes several sub-spring pieces, and the magnetic conduction member is used as one layer of the sub-spring pieces and is arranged integrally with the remaining sub-spring pieces.

Citation Information

Patent Citations

  • Relay with high fault current resistance

    CN210692441U