LED bracket and manufacturing method thereof, LED light-emitting device, and light-emitting device

Abstract

The present invention provides an LED bracket and a manufacturing method thereof, an LED light-emitting device, and a light-emitting device. The LED bracket includes a base body injection-molded by using an unsaturated polyester resin, the base body has a groove for encapsulating an LED chip, the base body has an upper surface, a lower surface, and multiple outer side surfaces, and a first outer side surface and a second outer side surface of the multiple outer side surfaces are respectively formed with a resin injection gate mark and a resin release gate mark. The LED bracket of the present invention is injection-molded by an injection molding passage composed of a resin injection port and a resin release port provided on different sides of the mold, so that the gas generated inside is released from the resin release port to the outside, so that there is no gap inside the molded LED bracket, and the strength of the LED bracket is relatively high. Furthermore, the LED bracket in the present invention is molded by using an unsaturated polyester resin, has a high degradation resistance, and has low requirements for molding temperature and pressure, which can effectively ensure product quality and production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of LED (Light Emitting Diode), and in particular to an LED bracket and a manufacturing method thereof, an LED light-emitting device, and a light-emitting apparatus. Background Art

[0002] In recent years, LED has been playing an important role in the display field of mobile terminals due to its unique advantages such as low price, low power consumption, high brightness and long life, and there is still considerable room for development in the future. In the existing production process of LED brackets, after the lead frame is clamped in the mold, the resin is injected from two directions through the two injection ports on the side of the mold, and then the resin filled in the mold cavity is hardened to form the LED bracket. For details, please refer to Figure 1 , Figure 1 The openings at A and B are both resin injection ports, and the direction of the arrow is the resin injection direction. In the molding method of the LED bracket, the injection molding is performed by simultaneously using two resin injection ports to perform resin injection in both directions, so that when the resin is joined in the mold cavity, stresses will be generated in two opposite directions at the joint, which makes it easy for the resin to retain gas and generate gaps in the resin when injected, thereby reducing the strength of the molded LED bracket. Summary of the invention

[0003] The LED bracket and its manufacturing method, LED light-emitting device, and light-emitting apparatus provided in the embodiments of the present invention mainly solve the technical problem that in the existing LED bracket production process, resin is injected in both directions from two injection ports of the mold at the same time, which makes it easy for the resin to retain gas during injection and produce gaps in the resin, resulting in a decrease in the strength of the molded LED bracket.

[0004] In order to solve the above technical problems, an embodiment of the present invention provides an LED bracket, including: a base body, the base body is injection molded using unsaturated polyester resin, the base body has a groove for encapsulating an LED chip, the base body has an upper surface, a lower surface and multiple outer side surfaces, and a resin injection gate mark and a resin release gate mark are respectively formed on the first outer side surface and the second outer side surface of the multiple outer side surfaces; the resin injection gate mark and the resin release gate mark are formed by the unsaturated polyester resin at the positions corresponding to the resin injection port and the resin release port of the molding mold on the first outer side surface and the second outer side surface being disconnected after the unsaturated polyester resin is injected into the molding mold and molded.

[0005] Preferably, the first outer side surface and the second outer side surface are two side surfaces arranged opposite to each other.

[0006] Preferably, the orthographic projection points of the center points of the resin injection gate mark and the resin release gate mark on the plane where the bottom surface of the groove is located are symmetrical with respect to the first central axis on the bottom surface of the groove and parallel to the first outer side surface and the second outer side surface.

[0007] Preferably, center points of the resin injection gate mark and the resin release gate mark are at different heights on the first outer side surface and the second outer side surface, respectively.

[0008] Preferably, the center points of the resin injection gate mark and the resin release gate mark are both located on the plane where the bottom surface of the groove is located, and are symmetrical with respect to the first central axis.

[0009] Preferably, the orthographic projection points of the center points of the resin injection gate mark and the resin release gate mark on the plane where the bottom surface of the groove is located are asymmetric relative to a first central axis located on the bottom surface of the groove and parallel to the first outer side surface and the second outer side surface.

[0010] Preferably, the first outer side surface and the second outer side surface are two adjacent side surfaces.

[0011] Preferably, the orthographic projection points of the center points of the resin injection gate mark and the center points of the resin release gate mark on the plane where the bottom surface of the groove is located are respectively located on the opposite side of a first central axis located on the bottom surface of the groove and parallel to the first outer side surface and the second outer side surface, and are respectively located on the opposite side of a second central axis located on the bottom surface of the groove and perpendicular to the first central axis.

[0012] Preferably, fillers and / or titanium oxide are added to the unsaturated polyester resin, and the fillers include glass fiber and silicon dioxide.

[0013] Preferably, when the filler and the titanium oxide are added to the unsaturated polyester resin, a preset additive is also added to the unsaturated polyester resin; the composition ratios of the unsaturated polyester resin, glass fiber, silica, titanium oxide and the preset additive are A, B, C, D and E respectively, wherein 15%<A<25%, 5%<B<20%, ​​20%<C<30%, 30%<D<40%, 1%<E<3%, and A+B+C+D+E=100%.

[0014] In order to solve the above technical problems, an embodiment of the present invention further provides an LED light-emitting device, comprising: the above-mentioned LED bracket and at least one LED chip packaged in a base body of the LED bracket.

[0015] To solve the above technical problems, an embodiment of the present invention further provides a light-emitting device, comprising: the above-mentioned light-emitting device, wherein the light-emitting device is a lighting device, a light signal indicating device, a fill light device or a backlight device.

[0016] In order to solve the above technical problems, an embodiment of the present invention further provides a method for manufacturing an LED bracket, and the method for manufacturing an LED bracket includes:

[0017] The lead frame is clamped by a molding die; the molding die comprises an upper die and a lower die, the molding die has a top surface, a bottom surface and a plurality of side surfaces in a mold-clamped state, and an internal space enclosed by the top surface, the bottom surface and the plurality of side surfaces forms a cavity matching the shape of the base body, and a resin injection port and a resin discharge port for forming an injection passage are respectively arranged on two different side surfaces;

[0018] Injection molding of unsaturated polyester resin is performed through the injection molding passage formed by the resin injection port and the resin discharge port;

[0019] After the unsaturated polyester resin in the cavity is molded, the mold is opened, and the unsaturated polyester resin on the base body molded in the molding mold corresponding to the resin injection port and the resin discharge port is disconnected to form a resin injection gate mark and a resin discharge gate mark.

[0020] Preferably, the two different side surfaces of the molding die are two side surfaces arranged opposite to or adjacent to each other.

[0021] Preferably, the molding die has a plurality of cavities for molding a plurality of the base bodies, and a resin discharge port formed in the nth cavity is connected to a resin injection port of the (n+1)th cavity adjacent to the nth cavity.

[0022] Preferably, the injection molding of unsaturated polyester resin through the injection molding passage formed by the resin injection port and the resin discharge port comprises:

[0023] The unsaturated polyester resin added with fillers and / or titanium oxide is injected through the injection passage formed by the resin injection port and the resin discharge port. The fillers include glass fiber and silicon dioxide.

[0024] Preferably, when the unsaturated polyester resin added with filler and / or titanium oxide is injected through the injection molding passage formed by the resin injection port and the resin discharge port, a preset additive is also added to the unsaturated polyester resin;

[0025] The composition ratios of the unsaturated polyester resin, glass fiber, silicon dioxide, titanium oxide and preset additives are A, B, C, D and E respectively, wherein 15%<A<25%, 5%<B<20%, ​​20%<C<30%, 30%<D<40%, 1%<E<3%, and A+B+C+D+E=100%.

[0026] The beneficial effects of the present invention are:

[0027] According to the LED bracket and its manufacturing method, LED light-emitting device, and light-emitting device provided by the embodiment of the present invention, the LED bracket includes a base body, the base body is injection molded using unsaturated polyester resin, the base body has a groove for encapsulating LED chips, the base body has an upper surface, a lower surface, and multiple outer side surfaces, and the first outer side surface and the second outer side surface of the multiple outer side surfaces are respectively formed with resin injection gate marks and resin release gate marks; the resin injection gate marks and the resin release gate marks are formed by the unsaturated polyester resin on the first outer side surface and the second outer side surface corresponding to the resin injection port and the resin release port of the molding mold being disconnected after the unsaturated polyester resin is injected into the molding mold and molded. The LED bracket of the present invention is injection molded by the injection molding passage composed of the resin injection port and the resin release port set on different sides of the mold, so that the gas generated inside the mold is released from the resin release port to the outside, so that there is no gap inside the LED bracket after molding, and the strength of the LED bracket is high.

[0028] Furthermore, the LED bracket in the present invention is molded by unsaturated polyester resin, which can effectively suppress the generation of burrs during molding, has high degradation resistance, and has low requirements for molding temperature and pressure, which can effectively ensure product quality and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of the injection molding of an LED bracket in the prior art;

[0030] Figure 2 A schematic diagram of the structure of an LED bracket provided in Embodiment 1 of the present invention;

[0031] Figure 3 A schematic diagram of symmetrically formed gate marks provided in the first embodiment of the present invention;

[0032] Figure 4 A schematic diagram of gate marks formed at different heights provided in the first embodiment of the present invention;

[0033] Figure 5 A schematic diagram of an absolutely symmetrical gate mark provided in the first embodiment of the present invention;

[0034] Figure 6 A schematic diagram of asymmetric gate marks provided in the first embodiment of the present invention;

[0035] Figure 7 A schematic diagram of a gate mark formed on adjacent side surfaces of a base body provided in Embodiment 1 of the present invention;

[0036] Figure 8 A schematic diagram of the structure of an LED light emitting device provided in Embodiment 1 of the present invention;

[0037] Fig. 9 A flowchart of a method for manufacturing an LED bracket provided in Embodiment 2 of the present invention;

[0038] Fig.10 A schematic diagram of a mold in a mold-closing state provided in Embodiment 2 of the present invention;

[0039] Fig.11 A schematic diagram of the structure of an LED bracket provided in the second embodiment of the present invention;

[0040] Fig.12 This is a schematic diagram of the injection molding of an LED bracket provided in the second embodiment of the present invention. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the following is a further detailed description of the embodiments of the present invention through specific implementation methods combined with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0042] Embodiment 1:

[0043] In order to solve the problem that in the existing LED bracket production process, the resin is injected bidirectionally from two injection ports of the mold at the same time, so that the resin is easily trapped in gas during injection and voids are generated in the resin, resulting in a decrease in the strength of the molded LED bracket, the present invention provides an LED bracket, see Figure 2 The LED bracket 10 includes: a base body 11, the base body 11 is injection molded using unsaturated polyester resin, the base body 11 has a groove 12 for encapsulating the LED chip, the base body 11 has an upper surface, a lower surface and multiple outer side surfaces, and a resin injection gate mark 15 and a resin release gate mark 16 are respectively formed on the first outer side surface 13 and the second outer side surface 14 of the multiple outer side surfaces; the resin injection gate mark 15 and the resin release gate mark 16 are formed by the unsaturated polyester resin on the first outer side surface 13 and the second outer side surface 14 corresponding to the resin injection port and the resin release port of the molding mold being disconnected after the unsaturated polyester resin is injected into the molding mold and molded.

[0044] In this embodiment, the LED bracket is clamped in a mold by a lead frame and injection molded on the bracket molding area of ​​the lead frame. The lead frame here can be formed by stamping or etching a flat conductive substrate. A groove 12 is formed on the molded LED bracket as the packaging area of ​​the LED chip, wherein at least part of the positive lead 17 and the negative lead 18 provided by the lead frame are exposed at the bottom surface 121 of the groove, thereby serving as the loading area of ​​the LED chip. In practical applications, the LED chip can be placed on the positive lead, and then the LED chip is electrically connected to the positive lead through a metal wire, and then the LED chip is connected to the negative lead through a metal wire. Of course, in practical applications, if the LED chip is flipped, the metal wire connecting the LED chip and the lead may not be required. The groove 12 opens to the top of the base body 11, so that the sealing material can be encapsulated inside the groove 12 from the opening.

[0045] In this embodiment, the base body 11 includes an outer side surface, an upper surface, and a lower surface, and the base body 11 should have at least two outer side surfaces. The preferred base body 11 can be a rectangular parallelepiped with a groove 12, and the resin injection gate mark 15 and the resin discharge gate mark 16 are respectively formed on two of the outer side surfaces. It should be noted that the gate mark is formed by cutting off the gate corresponding to the resin injection port and the resin discharge port of the mold formed on the outer side surface of the base body 11 after the base body 11 is injection molded. In addition, the gate mark here is usually a convex object, and it can also be concave in other embodiments; furthermore, the shape of the gate mark can be arbitrarily set according to the cross-sectional shape of the injection port and the discharge port of the mold. In practical applications, in order to improve the strength of the mass production type and the molded body, the cross-section of the gate mark is preferably rectangular, square, semicircular, elliptical, etc., which is not limited here.

[0046] Please refer again Figure 2 In this embodiment, the first outer side surface 13 formed with the resin injection gate mark 15 and the second outer side surface 14 formed with the resin discharge gate mark 16 are two oppositely disposed side surfaces. Therefore, after the resin is injected from the resin injection port of the mold, the path lengths of the two flow channels for the resin to be diverted are equal and relatively long, so that the resin flows more evenly, and the gas generated inside the mold can be more efficiently discharged from the discharge port to the outside.

[0047] In this embodiment, if Figure 3 As shown, the orthographic projection points of the center points of the resin injection gate mark 15 and the resin discharge gate mark 16 on the plane where the groove bottom surface 121 is located are symmetrical with respect to the first central axis L1 on the groove bottom surface 121 and parallel to the first outer side surface 13 and the second outer side surface 14. The center point here refers to the geometric center point of the gate mark.

[0048] Specifically, Figure 4 As shown, in one case, the center points of the resin injection gate mark 15 and the resin discharge gate mark 16 are respectively at different heights on the first outer side surface 13 and the second outer side surface 14; Figure 5 As shown, in another case, the center points of the resin injection gate mark 15 and the resin discharge gate mark 16 are at the same height on the first outer side surface 13 and the second outer side surface 14, respectively, that is, the two gate marks are absolutely symmetrical. In this case, the joining time after the resin is injected from the resin injection port to the mold diversion can be shortened, and the injection speed can be increased. For further information, please refer again Figure 5 In practical applications, the center points of the resin injection gate mark 15 and the resin release gate mark 16 are both located on the plane where the groove bottom surface 121 is located, and are symmetrical with respect to the first central axis L1. Usually, due to the configuration of the groove 12 on the base body 11, the groove 12 usually gradually narrows internally from the top to the bottom of the base, so that the resin thickness at the top of the base body 11 is thinner, while the resin thickness at the bottom of the groove 12 is relatively thick. In order to avoid a decrease in the strength of the resin package, in this embodiment, the gate mark is preferably formed on the plane corresponding to the groove bottom surface 121.

[0049] In this embodiment, if Figure 6 As shown, the orthographic projection points of the center points of the resin injection gate mark 15 and the resin release gate mark 16 on the plane where the groove bottom surface 121 is located are asymmetric with respect to the first central axis L1 located on the groove bottom surface 121 and parallel to the first outer side surface 13 and the second outer side surface 14. In practical applications, the straight line formed by the orthographic projection points of the center points of the resin injection gate mark 15 and the center points of the resin release gate mark 16 on the plane where the groove bottom surface 121 is located and the center point of the groove bottom surface 121 intersects with the first central axis L1. Preferably, the length of the straight line can be as long as possible so that the gate marks are diagonal. The configuration of the two at the longest possible distance is more conducive to subsequent resin molding. It should be understood that the diagonal shape here means that the center point of the gate mark is closer to the diagonal of the base body 11, and does not mean that the center point of the gate mark is absolutely on the diagonal of the base body 11. In order to avoid the reduction of the strength of the resin package, in this embodiment, it is also preferred to mold the gate mark on the plane corresponding to the groove bottom surface 121.

[0050] In addition, if Figure 7As shown, the first outer side surface 13 formed with the resin injection gate mark 15 and the second outer side surface 14 formed with the resin release gate mark 16 can also be two adjacent side surfaces. And, preferably, the center point of the resin injection gate mark 15 and the center point of the resin release gate mark 16 are respectively located on the opposite side of the first central axis L1 located on the bottom surface 121 of the groove and parallel to the first outer side surface 13 and the second outer side surface 14, and are respectively located on the opposite side of the first central axis L2 located on the bottom surface 121 of the groove 12 and perpendicular to the first central axis L1, that is, the distance between the gate marks is configured as long as possible, so that it is diagonal on the base body 11. Further, the center point of the resin injection gate mark 15 and the center point of the resin release gate mark 16 are preferably configured on the plane where the bottom surface 121 of the groove is located.

[0051] The resin used in this embodiment is an unsaturated polyester resin. As a thermosetting resin, the unsaturated polyester resin has excellent reflectivity and resistance to degradation to ultraviolet rays, etc., so that when the LED light-emitting device emits light for a long time, the degradation of the reflector or the resin can be effectively suppressed, and the high reflectivity and light efficiency can be maintained. In addition, the unsaturated polyester resin does not have reactive functional groups such as hydroxyl groups (-OH groups) and does not form chemical bonds with metals, so it is difficult to produce resin burrs during the molding process, and even if resin burrs are produced, they can be easily peeled off. Furthermore, the melting point of the unsaturated polyester resin is about 50°C-90°C, so when the unsaturated polyester is injection molded, the carbonization of organic matter added to the resin can be suppressed, and molding defects can be effectively suppressed. In addition, the unsaturated polyester resin has a higher fluidity than the thermoplastic resin, so when the resin is injected, the resin can be injected at a lower injection pressure, so that the possibility of deformation of the lead frame is reduced. During the injection molding process, the lead frame does not need to be maintained, and the mold can be simplified.

[0052] In practical applications, fillers consisting of long glass fibers and spherical silica may be further added to the unsaturated polyester resin to increase the strength of the resin.

[0053] Of course, titanium oxide can also be added to unsaturated polyester to increase the light reflectivity of the resin.

[0054] The following substances may be appropriately added in combination to the filler or titanium oxide or both: maleic anhydride, fumaric acid, styrene, fillers, reinforcing agents, curing agents, release agents, pigments and other additives.

[0055] In a preferred embodiment, when fillers, titanium oxide and additives are added to the unsaturated polyester resin, the composition ratios of the unsaturated polyester resin, glass fiber, silica, titanium oxide and additives are A, B, C, D and E, respectively, wherein 15%<A<25%, 5%<B<20%, ​​20%<C<30%, 30%<D<40%, 1%<E<3%, A+B+C+D+E=100%. The material ratio in this embodiment can effectively inhibit cracking, discoloration and the like of the unsaturated polyester resin.

[0056] like Figure 8 As shown, this embodiment further provides an LED light-emitting device 100 made by using the above-mentioned LED bracket 10 , which includes the above-mentioned LED bracket 10 and at least one LED chip 20 packaged in the base body 11 of the LED bracket 10 .

[0057] The bottom surface 121 of the groove on the base body 11 of the LED bracket is provided with a mounting area for the LED chip, and the lead is exposed from this area. The LED chip in this embodiment can be directly mounted on the lead, or it can be mounted on the lead coated with a metal reflective layer. Providing a reflective layer on the surface of the lead can improve the light reflectivity of the LED chip.

[0058] The color of the light emitted by the LED light-emitting device provided in this embodiment and presented to the user can be flexibly set according to actual needs and application scenarios. The color of the light emitted by the LED light-emitting device and presented can be flexibly controlled by, but not limited to, the following factors: the color of the light emitted by the LED chip itself, whether the LED light-emitting device is provided with a light-emitting conversion layer, and the type of the light-emitting conversion layer provided when the LED light-emitting device is provided with a light-emitting conversion layer.

[0059] In one example of this embodiment, the LED light-emitting device may also include a lens adhesive layer or a diffusion adhesive layer arranged on the LED chip (when a luminescence conversion adhesive layer is arranged on the LED chip, it is arranged on the luminescence conversion adhesive layer); of course, in some examples, a transparent adhesive layer may also be arranged on the LED chip.

[0060] It should be understood that, in one example, the luminescence conversion adhesive layer can be a fluorescent adhesive layer containing fluorescent powder, or a colloid containing quantum dot photosensitive material, or other luminescence conversion adhesive or film that can achieve luminescence conversion, and can also include diffusion powder or silicon powder, etc. as needed; in this embodiment, the methods of forming a luminescence conversion adhesive layer, a lens adhesive layer or a diffusion adhesive layer on the LED chip include but are not limited to dispensing, molding, spraying, pasting, etc.

[0061] For example, the luminescent conversion adhesive layer may include a phosphor adhesive layer, a fluorescent film, or a quantum dot QD film; the phosphor adhesive layer and the fluorescent film may be made of inorganic phosphors, which may be inorganic phosphors doped with rare earth elements, wherein the inorganic phosphors include but are not limited to at least one of silicate, aluminate, phosphate, nitride, and fluoride phosphors.

[0062] For another example, the quantum dot QD film can be made of quantum dot phosphors; the quantum dot phosphors include but are not limited to at least one of BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, GaAs, GaN, GaS, GaSe, InGaAs, MgSe, MgS, MgTe, PbS, PbSe, PbTe, Cd(SxSe1-x), BaTiO3, PbZrO3, CsPbCl3, CsPbBr3, and CsPbI3.

[0063] In this embodiment, the type of light emitted by the LED chip itself can be visible light visible to the naked eye, or ultraviolet light or infrared light invisible to the naked eye; when the type of light emitted by the LED chip itself is ultraviolet light or infrared light invisible to the naked eye, a luminescence conversion layer can be set on the LED chip to convert the invisible light to visible light, so that the light emitted by the LED light-emitting device is visible to the user. For example, when the light emitted by the LED chip itself is ultraviolet light, if the LED light-emitting device is to present white light visible to the user, the luminescence conversion layer can be made by mixing red, green, and blue phosphors.

[0064] The LED bracket provided in the embodiment of the present invention is injection molded through an injection molding passage composed of a resin injection port and a resin discharge port arranged on different sides of the mold, so that the gas generated inside the mold is discharged to the outside from the resin discharge port, so that there is no gap inside the LED bracket after molding, and the strength of the LED bracket is relatively high. In addition, the LED bracket in the present invention is molded by unsaturated polyester resin, which can effectively suppress the generation of burrs during molding, has high degradation resistance, and has low requirements for molding temperature and pressure, which can effectively ensure product quality and production efficiency.

[0065] Embodiment 2:

[0066] In order to facilitate a comprehensive understanding of the present invention, this embodiment provides an example of the manufacturing process of the LED bracket provided by the present invention.

[0067] See also Fig. 9 , Fig. 9 The flowchart of the LED bracket manufacturing method provided in this embodiment, when manufacturing the LED bracket, the specific implementation steps include:

[0068] S901, clamping the lead frame by a molding mold; the molding mold includes an upper mold and a lower mold, and the molding mold has a top surface, a bottom surface and multiple side surfaces in a mold-closed state, and the internal space enclosed by the top surface, the bottom surface and the multiple side surfaces forms a cavity matching the shape of the base body, and a resin injection port and a resin discharge port for forming an injection passage are respectively arranged on two different sides.

[0069] Specifically, a protrusion 311 matching the groove 12 of the base body 11 is protruded from the center of the upper mold 31 body, and the protrusion is in the shape of a truncated cone that narrows from top to bottom. In practical applications, the resin injection port 33 and the resin discharge port 34 can be set on the upper mold 31 or on the lower mold 32. It is only necessary to ensure that when the upper mold 31 and the lower mold 32 of the mold clamp the lead frame 40 in the mold-clamping state, the resin injection port 33 and the resin discharge port 34 are provided on different sides of the mold, such as Fig.10 As shown, the resin injection port 33 and the resin discharge port 34 in the preferred embodiment are both provided through the upper mold 31. It should be understood that the lead frame in the present embodiment can be composed of substrates of various conductive materials, for example, various metal substrates, including but not limited to copper substrates, aluminum substrates, iron substrates, and silver substrates; of course, it can also be a mixed material substrate containing conductive materials, such as conductive rubber, etc.

[0070] Please refer again Fig.10 , the resin injection port 33 and the resin discharge port 34 in this embodiment are arranged on two opposite side surfaces. Of course, in another embodiment, the resin injection port 33 and the resin discharge port 34 can also be arranged on two adjacent side surfaces. The positional relationship between the resin injection port 33 and the resin discharge port 34 on the mold corresponds to the formation position of the resin injection gate mark 15 and the resin discharge gate mark 16 on the LED bracket. It should also be noted that the shapes of the resin injection port 33 and the resin discharge port 34 are not particularly limited, and they can specifically be rectangular, circular, elliptical, semicircular, etc., and preferably, the resin injection port 33 and the resin discharge port 34 are both wide outside and narrow inside. That is, it gradually narrows in the direction extending from the outer wall to the inner wall.

[0071] It should be understood that in practical applications, multiple resin injection ports 33 and resin discharge ports 34 may be provided on the side of the mold, and multiple resin injection ports 33 or multiple resin discharge ports 34 may be arranged horizontally or vertically on the same side. In this embodiment, preferably, two resin injection ports 33 and two resin discharge ports 34 may be provided, and both may be arranged horizontally on two opposite side surfaces, such as Fig.11 As shown, two resin injection gate marks 15 and two resin discharge gate marks 16 are respectively formed on two opposite sides of the LED bracket after injection molding.

[0072] S902, performing injection molding of unsaturated polyester resin through an injection molding passage formed by a resin injection port and a resin discharge port.

[0073] like Fig.12 As shown in FIG. 1 , after the resin is injected from the resin injection port 33 of the mold, it hits the protrusion 311 in the mold, so that the resin is split at this location. The split resin flows in different directions along the protrusion 311 respectively, and the split resin flows to the resin outlet 34 to merge. A linear mark, i.e., a suture line, will be generated near the merged location, as shown in FIG. Fig.12 The dotted line is the stitching line. It should be noted that the stitching line will affect the strength of the resin at the point of creation. Therefore, it is preferred that the stitching line should be avoided at the location where the thickness of the base body wall is thinner. Fig.12 , the resin injection port 33 and the resin discharge port 34 are respectively arranged on two opposite side surfaces of the mold, and the center points of the resin injection port 33 and the resin discharge port 34 pass through the center point of the bottom surface at the orthographic projection point of the bottom surface of the mold, and the line connecting the center points is in a diagonal shape. The diagonal shape here means that the center points of the resin injection port 33 and the resin discharge port 34 are closer to the diagonal line of the mold, but does not mean that the center points of the resin injection port 33 and the resin discharge port 34 are absolutely on the diagonal line of the mold. Furthermore, the center points of the resin injection port 33 and the resin discharge port 34 are both located on the plane where the bottom of the protrusion 311 of the upper mold 31 is located, so that the wall thickness of the base body at the position of the suture line is relatively thick, which can improve the strength of the base body after molding.

[0074] In addition, in this embodiment, the injection molding of unsaturated polyester resin with filler and / or titanium oxide is performed through the injection molding passage formed by the resin injection port and the resin discharge port, and the filler includes glass fiber and silicon dioxide. The addition of filler can improve the strength of the resin, while the addition of titanium oxide can improve the reflectivity of the resin to light. In addition, the following substances can be appropriately added in combination to the filler or titanium oxide or both: maleic anhydride, fumaric acid, styrene, filling materials, reinforcing agents, curing agents, release agents, pigments and other additives.

[0075] In a preferred embodiment, when fillers, titanium oxide and additives are added to the unsaturated polyester resin, the composition ratios of the unsaturated polyester resin, glass fiber, silica, titanium oxide and additives are A, B, C, D and E, respectively, wherein 15%<A<25%, 5%<B<20%, ​​20%<C<30%, 30%<D<40%, 1%<E<3%, A+B+C+D+E=100%. The material ratio in this embodiment can effectively inhibit cracking, discoloration and the like of the unsaturated polyester resin.

[0076] S903, after the unsaturated polyester resin in the cavity is molded, the mold is opened, and the unsaturated polyester resin on the base body formed in the molding mold corresponding to the resin injection port and the resin discharge port is disconnected to form a resin injection gate mark and a resin discharge gate mark.

[0077] After the resin injection is completed, the mold is heated for a specified time to harden the resin, and then the mold is opened, and a known cutting device is used to cut off the gates corresponding to the resin injection port and the resin discharge port on the molded base body, thereby forming corresponding gate marks on the base body. In actual applications, the base body can be further formally hardened at this time.

[0078] It should be noted that in order to form multiple LED brackets at the same time, it is preferred that multiple mold cavities for molding the base body of the LED bracket are configured in the above-mentioned mold. For example, multiple mold cavities can be arranged in a straight line, and the resin discharge port of the mold cavity for front injection molding is connected to the resin injection port of the mold cavity for rear injection molding. Taking three mold cavities as an example, resin is injected from the resin injection port of the first mold cavity, and then the resin discharge port of the first mold cavity is connected to the resin injection port of the second mold cavity so that the second mold cavity can be injected with resin, and then the resin discharge port of the second mold cavity is connected to the resin injection port of the third mold cavity. After all mold cavities are injection molded, the resin is finally discharged from the resin discharge port of the third mold cavity. With such a mold, multiple base bodies can be injection molded at one time in a short time, and the runner can be saved. In other embodiments, multiple mold cavities can also be arranged in multiple rows and columns, which can further increase the number of base bodies molded per unit time.

[0079] The LED bracket manufacturing method provided by the embodiment of the present invention performs injection molding of unsaturated polyester resin through the injection molding passage formed by the resin injection port and the resin discharge port respectively arranged on different outer sides of the mold. After the resin is molded, the resin corresponding to the positions of the resin injection port and the resin discharge port on the base body obtained is disconnected to form a resin injection gate mark and a resin discharge gate mark. The gas generated when the resin is injected and split is released to the outside from the resin discharge port, so that there is no gap inside the molded LED bracket, and the strength of the LED bracket is relatively high. In addition, the LED bracket in the present invention is molded by unsaturated polyester resin, which can effectively suppress the generation of burrs during molding, has high degradation resistance, and has low requirements for molding temperature and pressure, which can effectively ensure product quality and production efficiency.

[0080] Embodiment three:

[0081] This embodiment provides a light-emitting device, which includes the LED light-emitting device exemplified in the above-mentioned embodiment 1 or embodiment 2. The light-emitting device in this embodiment can be a lighting device, a light signal indicating device, a fill light device or a backlight device. When it is a lighting device, it can be a lighting device used in various fields, such as table lamps, fluorescent lamps, ceiling lamps, downlights, street lamps, projection lamps, etc. in daily life, and high beams, low beams, atmosphere lamps, etc. in cars, and surgical lamps, low electromagnetic lighting lamps, and lighting lamps for various medical instruments in medicine, and various colored lights, landscape lighting lamps, advertising lamps, etc. in the field of decoration lighting; when it is a light signal indicating device, it can be a light signal indicating device used in various fields, such as signal indicator lights in the field of traffic, and various signal status indicator lights on communication equipment in the field of communication; when it is a fill light device, it can be a fill light in the field of photography, such as a flash light, a fill light, and it can also be a plant fill light for plant fill light in the field of agriculture; when it is a backlight device, it can be a backlight module used in various backlight fields, such as a display, a television, a mobile terminal such as a mobile phone, an advertising machine, and other equipment.

[0082] It should be understood that the above applications are merely several applications exemplified in this embodiment, and it should be understood that the application of LED light-emitting devices is not limited to the several fields exemplified above.

[0083] The above contents are further detailed descriptions of the embodiments of the present invention in combination with specific implementation methods, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. An LED bracket, characterized in that: include: A base body, the base body is injection molded by unsaturated polyester resin, the base body has a groove for encapsulating LED chips, the base body has an upper surface, a lower surface and multiple outer side surfaces, and a resin injection gate mark and a resin release gate mark are respectively formed on the first outer side surface and the second outer side surface of the multiple outer side surfaces; the resin injection gate mark and the resin release gate mark are formed by the disconnection of the unsaturated polyester resin at the positions corresponding to the resin injection port and the resin release port of the molding mold on the first outer side surface and the second outer side surface after the unsaturated polyester resin is injected into the molding mold and molded; the center points of the resin injection gate mark and the resin release gate mark are respectively at different heights on the first outer side surface and the second outer side surface.

2. The LED bracket according to claim 1, characterized in that: The first outer side surface and the second outer side surface are two side surfaces arranged opposite to each other.

3. The LED bracket according to claim 2, characterized in that: The orthographic projection points of the center points of the resin injection gate mark and the resin release gate mark on the plane where the groove bottom surface is located are symmetrical with respect to the first central axis on the groove bottom surface parallel to the first outer side surface and the second outer side surface.

4. The LED bracket according to claim 3, characterized in that: The center points of the resin injection gate mark and the resin release gate mark are both located on the plane where the bottom surface of the groove is located, and are symmetrical with respect to the first central axis.

5. The LED bracket according to claim 2, characterized in that: The orthographic projection points of the center points of the resin injection gate mark and the resin release gate mark on the plane where the groove bottom surface is located are asymmetric relative to the first central axis located on the groove bottom surface and parallel to the first outer side surface and the second outer side surface.

6. The LED bracket according to claim 1, characterized in that: The first outer side surface and the second outer side surface are two adjacent side surfaces.

7. The LED bracket according to claim 6, characterized in that: The orthographic projection points of the center point of the resin injection gate mark and the center point of the resin release gate mark on the plane where the bottom surface of the groove is located are respectively located on the opposite side of a first center axis located on the bottom surface of the groove and parallel to the first outer side surface and the second outer side surface, and are respectively located on the opposite side of a second center axis located on the bottom surface of the groove and perpendicular to the first center axis.

8. The LED bracket according to any one of claims 1 to 7, characterized in that: Fillers and / or titanium oxide are added into the unsaturated polyester resin, and the fillers include glass fibers and silicon dioxide.

9. The LED bracket according to claim 8, characterized in that: When the filler and the titanium oxide are added to the unsaturated polyester resin, a preset additive is also added to the unsaturated polyester resin; the composition ratios of the unsaturated polyester resin, glass fiber, silicon dioxide, titanium oxide and the preset additive are A, B, C, D and E respectively, wherein 15%<A<25%, 5%<B<20%, ​​20%<C<30%, 30%<D<40%, 1%<E<3%, and A+B+C+D+E=100%.

10. An LED light emitting device, characterized in that: The LED bracket comprises the LED bracket according to any one of claims 1 to 9 and at least one LED chip encapsulated in a base body of the LED bracket.

11. A light emitting device, characterized in that: It comprises the LED light-emitting device as claimed in claim 10, wherein the light-emitting device is a lighting device, a light signal indicating device, a fill light device or a backlight device.

12. A method for manufacturing an LED bracket, characterized in that: The following steps are involved: The lead frame is clamped by a molding die; the molding die comprises an upper die and a lower die, the molding die has a top surface, a bottom surface and a plurality of side surfaces in a mold-clamped state, and an internal space enclosed by the top surface, the bottom surface and the plurality of side surfaces forms a cavity matching the shape of the base body, and a resin injection port and a resin discharge port for forming an injection passage are respectively arranged on two different side surfaces among the plurality of side surfaces; the center points of the resin injection port and the resin discharge port are respectively at different heights on the corresponding side surfaces; Injection molding of unsaturated polyester resin is performed through the injection molding passage formed by the resin injection port and the resin discharge port; After the unsaturated polyester resin in the cavity is molded, the mold is opened, and the unsaturated polyester resin on the base body molded in the molding mold corresponding to the resin injection port and the resin discharge port is disconnected to form a resin injection gate mark and a resin discharge gate mark.

13. The method for manufacturing an LED bracket according to claim 12, characterized in that: The two different side surfaces of the molding die are two side surfaces arranged opposite to or adjacent to each other.

14. The method for manufacturing an LED bracket according to claim 12 or 13, characterized in that: The molding die has a plurality of cavities for molding a plurality of the base bodies, and a resin discharge port formed in the nth cavity is connected to a resin injection port of the (n+1)th cavity adjacent to the nth cavity.

15. The method for manufacturing an LED bracket according to claim 12 or 13, characterized in that: The method of performing injection molding of unsaturated polyester resin through the injection molding passage formed by the resin injection port and the resin discharge port comprises: The unsaturated polyester resin added with fillers and / or titanium oxide is injected through the injection passage formed by the resin injection port and the resin discharge port. The fillers include glass fiber and silicon dioxide.

16. The method for manufacturing an LED bracket according to claim 15, characterized in that: When the unsaturated polyester resin added with filler and / or titanium oxide is injected through the injection molding passage formed by the resin injection port and the resin discharge port, a preset additive is also added to the unsaturated polyester resin; The composition ratios of the unsaturated polyester resin, glass fiber, silicon dioxide, titanium oxide and preset additives are A, B, C, D and E respectively, wherein 15%<A<25%, 5%<B<20%, ​​20%<C<30%, 30%<D<40%, 1%<E<3%, and A+B+C+D+E=100%.

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