A highly integrated silicon photonic component based on elliptical spherical mirror and its coupling method
By using an elliptical spherical mirror design in the silicon optical assembly, the laser, silicon optical chip and optical fiber are fixed on the same substrate, and the optical characteristics of the elliptical lens are coupled, the silicon optical components in the prior art are easily affected by the environment. The problem is that more stable coupling effect and higher integration are achieved.
Patent Information
- Application Number
- CN201911238403.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-12-06
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2039-12-06
AI Technical Summary
The existing coupling methods of silicon optical modules are susceptible to temperature, humidity and vibration, resulting in changes in coupling efficiency, and are difficult to package and costly, making it impossible to achieve high-efficiency, low-cost and high-reliability integration.
The highly integrated silicon optical component design based on the elliptic spherical mirror is adopted to directly fix the laser, silicon optical chip and optical fiber on the same substrate, and the optical characteristics of the elliptic lens are used to couple to reduce the difficulty of coupling components and process and reduce costs.
It improves the temperature and humidity performance stability of silicon optical components, enhances the stability of coupling effect, reduces the space occupation and cost of the package, and achieves higher integration and reliability.
Smart Images
Figure CN110888207B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a silicon photonic component and a coupling method thereof, and in particular to a highly integrated silicon photonic component based on an elliptical spherical mirror and a coupling method thereof. Background Art
[0002] In recent years, silicon photonic chips have gradually entered various fields, especially in the field of communications, and the low cost and excellent optical performance of silicon photonics have also begun to emerge. However, as the biggest obstacle to large-scale application, the difficulty and cost of packaging are problems that the industry needs to solve urgently. In the field of communications and data communications, optical fiber is the main medium for signal transmission, and lasers are the main devices for generating optical signals. Therefore, as one of the core issues of packaging, how to achieve high efficiency, low cost, and high reliability to couple them has become the focus of widespread attention.
[0003] There are two common coupling methods at this stage. One is double-lens coupling, which is usually used for laser coupling. The first convex lens is used to collimate the laser, and then the second lens is used to focus the laser onto the silicon photonic chip. This method can achieve higher coupling efficiency and higher adjustment tolerance. Another method is direct coupling, which is usually used for fiber coupling. Ordinary single-mode optical fiber or lens optical fiber is directly aligned with the silicon photonic port, and then bonded with adhesive after alignment.
[0004] As the first solution, the dual-lens coupling solution has more materials, higher costs, many parameters to adjust the optical path, and high time costs. In addition, the size of the fixture needs to be considered during coupling, so it is usually impossible to achieve high integration and occupies a large space.
[0005] The second solution is direct coupling. Although this method is simple, since the optical fiber and silicon photonic chip are placed on different media, they are prone to deformation when the temperature changes, resulting in changes in coupling efficiency.
[0006] In the above two solutions, since the coupling objects are usually placed separately, the coupling efficiency may change due to the influence of air temperature, humidity, or vibration. Summary of the invention
[0007] The purpose of the present invention is to provide a highly integrated silicon photonic component based on an ellipsoidal mirror, which utilizes the inherent optical properties of the ellipsoidal sphere to directly fix the silicon photonic chip, laser, and optical fiber on the same substrate, thereby solving the problem that the silicon photonic component is easily deformed by temperature, humidity or vibration after coupling. The temperature and humidity resistance of the silicon photonic component can be improved, and the coupling effect is more stable.
[0008] The present invention provides a highly integrated silicon photonic component based on an ellipsoidal mirror, comprising a laser 5, a silicon photonic chip 6, a substrate 7, and an ellipsoidal lens 1, wherein an anti-reflection film is coated on the ellipsoidal spherical surface 101 of the ellipsoidal lens 1, the light output end of the laser 5 is aligned with the focus 104 of the ellipsoidal lens 1, the light input end of the silicon photonic chip 6 is aligned with the focus 2 103 of the ellipsoidal lens 1, the silicon photonic chip 6 is fixed on the substrate 7, the laser 5 is fixed on the silicon photonic chip 6, and the ellipsoidal lens 1 is fixed on one side of the substrate 7.
[0009] Furthermore, the optical output end of the silicon photonic chip 6 is also aligned with the focus 1 204 of the ellipsoid lens 2, and the focus 203 of the ellipsoid lens 2 is aligned with the optical fiber 8, and the optical fiber 8 is fixed on the silicon photonic chip 6. The coupling components can be further reduced, the process difficulty can be reduced, and the manufacturing cost can be reduced.
[0010] Furthermore, the line connecting the focus 1 104 and the focus 2 103 of the ellipsoid lens 1 is perpendicular to the plane where the silicon photonic chip 6 is located, and the focus 1 104 and the focus 2 103 are both within the body of the ellipsoid lens 1 .
[0011] Furthermore, the focus 203 of the ellipsoid lens 2 is not in the body of the ellipsoid lens 2. It can still maintain its inherent optical properties, and at the same time reduce the size of the ellipsoid lens 2, which can further improve the integration of components.
[0012] Preferably, the ellipsoid lens 1 and the ellipsoid lens 2 are made of silicon dioxide, silicon, or a high molecular polymer.
[0013] Preferably, the substrate 7 is made of one of a silicon wafer, a metal sheet, a circuit board and a ceramic board.
[0014] The present invention also provides a highly integrated silicon optical coupling method based on an elliptical spherical mirror, comprising the following steps:
[0015] The first step is to fix the silicon photonic chip 6 on the substrate 7.
[0016] The second step is to fix the ellipsoid lens 1 to one side of the substrate 7 and adjust its position so that the light input end of the silicon photonic chip 6 is aligned with the focus 104 of the ellipsoid lens 1.
[0017] In the third step, the laser 5 is fixed on the silicon photonic chip 6, and the position of the laser 5 is adjusted so that the light output end of the laser 5 is aligned with the focus 2 103 of the ellipsoidal lens 1 1. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 Schematic diagram of the side and front view of the ellipsoid lens in Example 1
[0019] Figure 2 Schematic diagram of the two side and front views of the ellipsoid lens in Example 2
[0020] Figure 3 Schematic diagram of the divergence of two rays of light from the ellipsoid lens in Example 2
[0021] Figure 4 A side view of a silicon photonic component in Example 1
[0022] Figure 5 A schematic diagram of the side view of the silicon photonic component in the second embodiment
[0023] Figure 6 Schematic diagram of a top view of the silicon photonic component in the second embodiment. DETAILED DESCRIPTION
[0024] The specific implementation of the present invention will be further described below through specific examples in conjunction with the accompanying drawings.
[0025] Embodiment 1:
[0026] like Figure 4 As shown, this embodiment provides a highly integrated silicon photonic component coupling method based on an ellipsoidal lens. The silicon photonic chip 6 is glued or directly welded on the substrate 7, and the ellipsoidal lens 1 is fixed to one side edge of the substrate 7. Its position is adjusted during installation so that the light input end of the silicon photonic chip 6 is aligned with the focus 104 of the ellipsoidal lens 1.
[0027] The laser 5 is flip-chip soldered on the upper part of the silicon photonic chip 6. First, the light output end of the laser 5 is aligned with the focus 2 103 of the ellipsoidal lens 1, and then soldered and fixed.
[0028] The substrate 7 can be made of materials such as silicon wafers and circuit boards. The ellipsoidal lens 1 is generally made of silicon dioxide, but silicon or high molecular polymer materials can also be selected.
[0029] The silicon photonic chip 6, the laser 5, and the ellipsoidal lens 1 are directly fixed on the same substrate 7, which has good mechanical stability, is not easily affected by external vibrations, and has a relatively stable coupling effect.
[0030] Figure 1 The figure shows the side and front views of the ellipsoid lens 1. The ellipsoidal surface 101 is coated with an anti-reflection film, which can achieve as much reflection as possible of the target wavelength of light and increase the light convergence effect of the ellipsoid lens 1. The focus 104 and the focus 2 103 are on the cross section 102 of the ellipsoid lens 1.
[0031] After the coupling and assembly of the silicon photonic component, the emission port of the laser 5 is located at a focus 104 of the ellipsoidal lens 1, and the light it emits is reflected by the ellipsoidal surface 101 of the ellipsoidal lens 1. The light is reflected and converged on another focus 103 of the ellipsoidal lens, and finally coupled into the waveguide of the silicon photonic chip 6 through the light input end of the silicon photonic chip 6.
[0032] Embodiment 2:
[0033] like Figure 5 and Figure 6 As shown, this embodiment provides a highly integrated silicon photonic component based on an ellipsoidal lens, which uses an ellipsoidal lens to couple a silicon photonic chip 6, a laser 5, and an optical fiber 8. The silicon photonic chip 6 is fixed on a substrate 7, which can be fixed by gluing. Then, an ellipsoidal lens 1 is fixed to the side edge of the substrate 7, and its position is adjusted so that its focus 104 is aligned with the light input end of the silicon photonic chip 6.
[0034] The laser 5 is flip-chip soldered on the upper part of the silicon photonic chip 6. Before soldering, its position is adjusted so that the light output end of the laser 5 is aligned with the focus 2 103 of the ellipsoidal lens 1.
[0035] The ellipsoid lens 2 is fixed to the side edge of the substrate 7, and its position is adjusted so that its focus 204 is aligned with the light output end of the silicon photonic chip 6. The optical fiber 8 is fixed on the silicon photonic chip 6, and it is aligned with the focus 203 of the ellipsoid lens 2. The optical fiber 8 can be fixed on the silicon photonic chip 6 by means of a metal sleeve or glue curing.
[0036] Figure 2 The side and front views of the ellipsoid lens 201 are schematic diagrams. The ellipsoidal surface 201 can be coated with an anti-reflection film to increase the light reflection efficiency. The focus 1 204 is on its cross section 202, and the focus 2 203 is not in the solid geometric space of the ellipsoidal lens 202. However, since the divergence angle of the coupling object (such as a laser or optical fiber) is not large and the divergence distance is short, the light emitted from one focus of the ellipsoid can still be reflected to another focus, such as Figure 3 shown.
[0037] After the coupling and assembly of the silicon photonic component, the emission port of the laser 5 is at a focus of the ellipsoid lens 1, and the light emitted is reflected by the ellipsoidal surface 101 of the ellipsoid lens 1. After reflection, the light converges at another focus of the ellipsoid lens 1, that is, the light entrance position of the silicon photonic chip, and is finally coupled into the waveguide of the silicon photonic chip. At the light exit end of the silicon photonic chip, the light exit position of the silicon photonic chip is also located at a focus of the ellipsoid lens 2. The light is emitted from the silicon photonic waveguide, reflected by the reflection surface of the ellipsoid lens, and finally converges at another focus of the ellipsoid lens 2, that is, the end face center of the optical fiber core, and is finally coupled into the optical fiber.
[0038] From the description of the above embodiments, it can be known that the ellipsoid lens 1 and the ellipsoid lens 2 have the same function, and are both used to converge light waves. It can be understood that the ellipsoid lens 1 and the ellipsoid lens 2 are different manifestations of the same technical means, and can be used interchangeably in coupling application scenarios, that is, the laser 5 and the silicon photonic chip 6 can also be coupled by the ellipsoid lens 2 2, and the optical fiber 8 and the silicon photonic chip 6 can also be coupled by the ellipsoid lens 1. Of course, without departing from the overall concept of the present invention, other forms of the ellipsoid lens should also be understood as the protection content of the present invention, such as changing the cutting size of the ellipsoid lens, the focus setting position, etc.
[0039] The above embodiments only list preferred specific technical solutions and technical means, and do not exclude that within the scope of the claims of the present invention, there are other alternative forms of equivalent technical means that can solve the technical problem, which should also be understood as the content required to be protected by the present invention.
Claims
1. A highly integrated silicon photonic component based on an elliptical spherical mirror, characterized in that: The invention comprises a laser (5), a silicon photonic chip (6), a substrate (7), an ellipsoid lens 1 (1), an ellipsoid lens 2 (2) and an optical fiber (8), wherein: The ellipsoid lens 1 (1) and the ellipsoid lens 2 (2) are respectively fixed on the two side edges of the substrate (7); the line connecting the focus 1 (104) and the focus 2 (103) of the ellipsoid lens 1 (1) is perpendicular to the plane where the silicon photonic chip (6) is located, and the focus 1 (104) and the focus 2 (103) are both within the body of the ellipsoid lens 1 (1); the focus 2 (203) of the ellipsoid lens 2 (2) is not within the body of the ellipsoid lens 2 (2); the ellipsoidal surface (101) of the ellipsoidal lens 1 (1) is coated with an anti-reflection film; the ellipsoidal surface (201) of the ellipsoidal lens 2 (2) is coated with an anti-reflection film; The silicon photonic chip (6) is fixed on the substrate (7), the laser (5) is fixed on the silicon photonic chip (6), and the optical fiber (8) is fixed on the silicon photonic chip (6); The optical output end of the laser (5) is aligned with the focus 1 (104) of the ellipsoid lens 1 (1), and the optical input end of the silicon photonic chip (6) is aligned with the focus 2 (103) of the ellipsoid lens 1 (1); the optical output end of the silicon photonic chip (6) is also aligned with the focus 1 (204) of the ellipsoid lens 2 (2), and the focus 2 (203) of the ellipsoid lens 2 (2) is aligned with the optical fiber (8), so that after the coupling assembly is completed, the light emitted by the laser (5) is reflected by the ellipsoidal surface (101) of the ellipsoid lens 1 (1), and the light is reflected by the ellipsoidal surface (101) of the ellipsoid lens 1 (1). The light is focused on another focus of the ellipsoid lens one (1), passes through the optical input end of the silicon photonic chip (6), and is coupled into the waveguide of the silicon photonic chip (6). The light is emitted from the waveguide of the silicon photonic chip (6), and the optical output end of the silicon photonic chip (6) is located at the focus one (204) of the ellipsoid lens two (2). The light is reflected by the reflection surface of the ellipsoid lens two (2), converges at the focus two (203) of the ellipsoid lens two (2), enters the end face center of the core of the optical fiber (8), and is coupled into the optical fiber (8).
2. The highly integrated silicon photonic component based on the elliptical spherical mirror according to claim 1, characterized in that: The ellipsoid lens 1 (1) and the ellipsoid lens 2 (2) are made of silicon dioxide, silicon, or a high molecular polymer.
3. The highly integrated silicon photonic component based on the elliptical spherical mirror according to claim 1, characterized in that: The substrate (7) is one of a silicon wafer, a metal sheet, a circuit board and a ceramic plate.
4. A highly integrated silicon optical coupling method based on an elliptical spherical mirror, characterized in that: The following steps are included: The first step is to fix the silicon photonic chip (6) on the substrate (7). In the second step, the ellipsoid lens 1 (1) is fixed on one side of the substrate (7), and its position is adjusted so that the light input end of the silicon photonic chip (6) is aligned with the focus 1 (104) of the ellipsoid lens 1 (1); the ellipsoid lens 2 (2) is fixed on the other side of the substrate (7), and its position is adjusted so that the light output end of the silicon photonic chip (6) is located on a focus (204) of the ellipsoid lens 2 (2); an anti-reflection film is coated on the ellipsoidal surface (101) of the ellipsoidal lens 1 (1); and an anti-reflection film is coated on the ellipsoidal surface (201) of the ellipsoidal lens 2 (2); In the third step, the laser (5) is fixed on the silicon photonic chip (6), the optical fiber (8) is fixed on the silicon photonic chip (6), and the position of the laser (5) is adjusted so that the light output end of the laser (5) is aligned with the second focus (103) of the first ellipsoid lens (1), and the second focus (203) of the second ellipsoid lens (2) is aligned with the optical fiber (8); After the coupling assembly is completed, the light emitted by the laser (5) is reflected by the ellipsoidal surface (101) of the ellipsoidal lens one (1), and the light is reflected and converged on another focus of the ellipsoidal lens one (1). The light passes through the optical input end of the silicon photonic chip (6) and is coupled into the waveguide of the silicon photonic chip (6). The light is emitted from the waveguide of the silicon photonic chip (6), and the optical output end of the silicon photonic chip (6) is located at a focus (204) of the ellipsoidal lens two (2). The light is reflected by the reflection surface of the ellipsoidal lens two (2), converged at another focus (203) of the ellipsoidal lens two (2), and enters the end face center of the core of the optical fiber (8), and the light is coupled into the optical fiber (8).