Dust-proof structure, microphone packaging structure, and electronic device

Abstract

The present invention discloses a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises a carrier and a grid portion; the carrier is a hollow structure, the carrier comprises a plurality of supporting layers arranged along a height direction, the grid portion comprises a grid structure and a fixing portion arranged around the grid structure, the fixing portion is connected to the carrier, the grid structure is opposite to the hollow structure, and the thermal expansion coefficient of at least one of the supporting layers is different from the thermal expansion coefficient of other supporting layers other than the supporting layer.

Description

Technical Field

[0001] The present invention relates to the technical field of electro-acoustic conversion, and more specifically, to a dustproof structure, a microphone packaging structure and an electronic device. Background Art

[0002] With the rapid development of electroacoustic technology, various electroacoustic products emerge in an endless stream. Microphone, as a transducer that converts sound into electrical signals, is one of the most important devices in electroacoustic products. Nowadays, microphones have been widely used in many different types of electronic products such as mobile phones, tablets, laptops, VR devices, AR devices, smart watches, and smart wearables. In recent years, for microphone packaging structures, the design of their structures has become the focus and hotspot of research for technicians in this field.

[0003] The existing microphone packaging structure is usually composed of a housing with a housing cavity, in which components such as chip components (for example, MEMS chips and ASIC chips) are fixed; and a sound pickup hole is also provided on the housing. However, it is found in long-term applications that dust, impurities and other particles and foreign objects are easily introduced into the microphone's housing cavity through the sound pickup hole, and these particles and foreign objects will cause certain damage to components such as chip components in the housing cavity, which will eventually affect the acoustic performance and service life of the microphone.

[0004] In view of the above problems, the current solution is usually to set a corresponding isolation component on the pickup hole of the microphone packaging structure to prevent the entry of external particles, foreign objects, etc. Figure 1 As shown, it includes a carrier a2 and a screen a1. When the isolation component is used, the isolation component is mounted on the pickup hole. However, the carrier a2 and the screen a1 are usually manufactured on a flat substrate. The purpose is to maintain the flatness to prevent the screen a1 from being damaged. After the manufacturing is completed, the isolation component is transferred to another substrate and / or a flexible board. After the manufacturing is completed, the isolation component is separated from the wafer and assembled into a part of the microphone a4.

[0005] For example, a chip bonding process is used, and the adhesive a3 is cured at high temperature. When the isolation component is heated, the expansion of the screen a1 and the carrier a2 will be different according to the CTE (coefficient of thermal expansion) of each material, which usually causes warping and / or deformation of the carrier. Before the temperature returns to room temperature, the adhesive a3 has cured and prevents the isolation component from returning to its original size, so the warping and / or deformation still exists. The residual warping and / or deformation will cause wrinkles in the screen a1, and even cause the screen a1 to fail or break. Summary of the invention

[0006] An object of the present invention is to provide a new technical solution for a dustproof structure, a microphone packaging structure and an electronic device.

[0007] According to a first aspect of the present invention, a dustproof structure is provided. The dustproof structure comprises a carrier and a grid portion; the carrier is a hollow structure, the carrier comprises a plurality of support layers arranged along a height direction, the grid portion comprises a grid structure and a fixing portion arranged around the grid structure, the fixing portion is connected to the carrier, the grid structure is opposite to the hollow structure, and the thermal expansion coefficient of at least one of the support layers is different from the thermal expansion coefficient of other support layers other than the support layer.

[0008] Optionally, the support layer connected to the fixing portion is defined as the first support layer, and the Nth support layer is defined from the first support layer outward, wherein N is greater than or equal to 2, and the thermal expansion coefficient of the Nth support layer is greater than the thermal expansion coefficient of the N-1th support layer.

[0009] Optionally, there are three supporting layers.

[0010] Optionally, the material of the carrier is an organic material, and the material of the grid portion is metal.

[0011] Optionally, the grid portion further includes a stress buffer zone connected between the fixing portion and the grid structure, and the stress buffer zone is suspended.

[0012] Optionally, an elastic structure is formed in the stress buffer zone by hollowing out.

[0013] Optionally, at least one of the support layers is made of dry film resist.

[0014] According to a second aspect of the present disclosure, a microphone packaging structure is provided, which includes a housing having a receiving cavity, and a sound pickup hole is arranged on the housing; and further includes the above-mentioned dustproof structure, and the dustproof structure is arranged on the sound pickup hole.

[0015] Optionally, the dustproof structure is located outside the housing.

[0016] Optionally, the housing comprises a substrate and a packaging cover, and the substrate and the packaging cover enclose the accommodating cavity;

[0017] The dustproof structure is accommodated in the accommodating cavity.

[0018] Optionally, the sound pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the packaging cover.

[0019] Optionally, the sound pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to a position on the substrate corresponding to the sound pickup hole.

[0020] Optionally, the sound pickup hole is located on the substrate, and the dustproof structure is fixedly arranged at a position on the substrate corresponding to the sound pickup hole.

[0021] Optionally, the sound pickup hole is located on the substrate, the dustproof structure is fixedly arranged at a position on the substrate corresponding to the sound pickup hole, and the MEMS chip is arranged on the dustproof structure.

[0022] According to a third aspect of the present disclosure, an electronic device is provided, which includes the microphone packaging structure described above.

[0023] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0025] Figure 1 is a side view of an existing isolation assembly.

[0026] Figure 2 is a cross-sectional view of a dustproof structure according to an embodiment of the present disclosure.

[0027] Figure 3 is a cross-sectional view of a second dustproof structure according to an embodiment of the present disclosure.

[0028] Figure 4 is a cross-sectional view of a third dustproof structure according to an embodiment of the present disclosure.

[0029] Figure 5 is a schematic diagram of a microphone packaging structure according to an embodiment of the present disclosure.

[0030] Figure 6 is a schematic diagram of a second microphone packaging structure according to an embodiment of the present disclosure.

[0031] Figure 7 It is a schematic diagram of a third microphone packaging structure according to an embodiment of the present disclosure.

[0032] Figure 8 is a top view of a support layer according to an embodiment of the present disclosure.

[0033] Fig. 9 is a partial view of a stress buffer according to an embodiment of the present disclosure.

[0034] Fig.10 It is a schematic diagram of a fourth microphone packaging structure according to an embodiment of the present disclosure.

[0035] Fig.11 It is a schematic diagram of a fifth microphone packaging structure according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0036] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0037] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0038] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0039] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0040] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0041] According to an embodiment of the present disclosure, a dustproof structure is provided. The dustproof structure can be applied to, for example, a microphone packaging structure. The dustproof structure can effectively prevent external particles and foreign objects from entering the interior of the microphone packaging structure through the sound pickup hole on the microphone packaging structure, thereby effectively protecting the components inside the microphone to avoid affecting the acoustic performance and service life of the MEMS microphone chip.

[0042] like Figure 2-3 As shown, the dustproof structure includes a carrier 1 and a mesh portion 2 .

[0043] The carrier 11 is a hollow structure 104, and an airflow channel is formed inside the hollow structure 104 for vibrating airflow to pass through. The carrier 1 includes a plurality of support layers stacked in layers. For example, a first support layer 101, a second support layer 102, and a third support layer 103. Of course, the number of support layers is not limited here, and those skilled in the art can set it according to actual needs.

[0044] For example, the support layer is in an annular shape, such as a circular ring, a rectangular ring, a racetrack shape or an annular structure of other shapes. A plurality of support layers are connected together to form a stacked structure.

[0045] For example, the cross sections of the plurality of support layers are the same to form a carrier 1 with a uniform wall thickness.

[0046] For example, multiple support layers may have different cross-sections as long as they can be stacked together to form the hollow structure 104 .

[0047] At least one of the support layers forms a stress relief portion, and the stress relief portion has a material different from other support layers other than the support layer where it is located. Different materials, for example, the support layer has a different thermal expansion coefficient from other support layers. The thermal expansion coefficient refers to the change in the length value of the support layer caused by a unit temperature change. Different thermal expansion coefficients result in that during the heating and cooling process of the carrier, the support layer with a higher thermal expansion coefficient can absorb more deformation, thereby reducing the stress of the carrier 1.

[0048] In the embodiment of the present disclosure, by providing the stress relief portion, the warping and / or deformation of the carrier 1 can be effectively absorbed, thereby reducing or even avoiding the generation of wrinkles or damage to the mesh portion 2 .

[0049] The material of the support layer may be, but is not limited to, organic materials, inorganic non-metallic materials or metallic materials. For example, organic materials include plastics, etc. Inorganic non-metallic materials include silicon, silicon oxide, silicon nitride, etc. Metallic materials include stainless steel, copper alloy, aluminum alloy, gold, silver, etc.

[0050] Of course, the material of the carrier 1 is not limited to the above embodiments, and those skilled in the art can set it according to actual needs.

[0051] The cross section of the carrier 1 is rectangular, circular, elliptical, hexagonal, etc. For example, in this example, the cross section of the carrier 1 is a square with a side length of 800 μm-1500 μm. The sides of the square are equal and the deformation is small.

[0052] The cross section of the hollow structure 104 is circular, elliptical, triangular, rectangular, hexagonal, racetrack-shaped, etc. For example, the cross section of the hollow structure 104 is circular, and its diameter is 500 μm-1200 μm.

[0053] The mesh portion 2 is arranged at one end of the carrier 1 and covers the hollow structure 104. The mesh portion 2 includes a mesh structure and an edge portion 110 arranged around the mesh structure. The mesh structure 21 is opposite to the hollow structure 104. The mesh structure is formed with a screen. The screen has a set mesh number, so that external impurities, dust, particles, etc. can be filtered out. Those skilled in the art can set the mesh number of the screen according to actual needs.

[0054] The edge portion 110 is connected to the carrier 1. For example, the fixing portion 22 is connected to the edge portion 110 of the carrier 1 by adhesive or bonding.

[0055] In one example, the support layer connected to the fixing portion is defined as the first support layer 101, and the Nth support layer is sequentially arranged from the first support layer 101 outward, where N is greater than or equal to 2, and the thermal expansion coefficient of the Nth support layer is greater than the thermal expansion coefficient of the N-1th support layer.

[0056] For example, Figure 3 As shown, in this example, three support layers stacked together are provided. The first support layer 101 is connected to the fixing portion. The third support layer 103 is used to connect to an external device. For example, the third support layer 103 is bonded to the PCB of the external device by an adhesive. The thermal expansion coefficient of the second support layer 102 is greater than the thermal expansion coefficient of the first support layer 101. The thermal expansion coefficient of the third support layer 103 is greater than the thermal expansion coefficient of the second support layer 102.

[0057] In this example, the thermal expansion coefficient of the support layer (eg, the first support layer 101 ) connected to the mesh portion 2 is the smallest. In this way, it can be ensured that the area where the mesh portion 2 is located has the smallest deformation when the external temperature changes.

[0058] In addition, the support layer (eg, the third support layer 103 ) connected to the external device has the largest thermal expansion coefficient, which can make the support layer more capable of absorbing deformation, thereby reducing the stress of the carrier.

[0059] In addition, the thermal expansion coefficients from the first supporting layer 101 to the Nth supporting layer gradually increase, which can make the contraction and expansion of different supporting layers more adaptable, and the carrier will not undergo plastic deformation or even fracture.

[0060] In one example, the material of the carrier 1 is an organic material, and the material of the mesh part is a metal. For example, each support layer is made of plastics with different thermal expansion coefficients. The mesh part is made of a metal material. The mesh part has a strong elastic deformation ability and is not easy to form wrinkles. The organic material has high elasticity and is conducive to absorbing deformation.

[0061] In an example, Figure 2 As shown, the support layer is two layers, for example, a first support layer 101 and a second support layer 102. The two support layers 101 and 102 are connected together. The structure of the carrier 1 is simple. A stress relief portion is provided in one of the support layers (for example, the second support layer 102); and the other support layer (for example, the first support layer 101) is a solid structure.

[0062] For example, at least one of the support layers is made of dry film resist. For example, a set pattern is formed by dry film resist, and then the redundant parts are etched away to form the hollow structure 104, etc., and finally the support layer is formed. Dry film resist has the characteristic of high molding precision.

[0063] In an example, Figure 3 As shown, at least one of the support layers has a groove 102a extending in the height direction, and at least one of the support layers is a solid structure. The arrangement of the groove 102a can effectively absorb the deformation of the carrier 1 and prevent the mesh part 2 from wrinkling.

[0064] The cross-sectional shape of the groove 102a is circular, rectangular, arc-shaped, elliptical, triangular or other shapes. The above grooves 102a can absorb deformation.

[0065] For example, the support layer (e.g., the first support layer 101) connected to the grid portion 2 is a solid structure, and the support layer (e.g., the second support layer 102) located below the support layer (e.g., the first support layer 101) has the groove 102a. In this example, the second support layer 102 can effectively absorb the deformation of the carrier 1.

[0066] In addition, the first support layer 101 can cooperate with the dustproof structure to be taken and placed. For example, the dustproof structure is transferred by grasping or vacuum suction. The clamping claw or suction nozzle of the transfer device applies force to the first support layer 101. Since the first support layer 101 is a solid structure, it has a higher structural strength. Compared with the second support layer 102, the first support layer 101 is less likely to be damaged by the clamping claw or suction nozzle, so that the dustproof structure can be kept intact during the process of taking and placing.

[0067] Of course, in other examples, the positions of the first supporting layer 101 and the second supporting layer 102 are interchanged, and the dustproof structure can be taken and placed by vacuum suction.

[0068] In an example, Figure 8 As shown, there are multiple grooves 102a, and they are evenly distributed on the support layer where the stress relief portion is located. For example, multiple grooves 102a are formed on the second support layer 102. Multiple grooves 102a are distributed at different locations on the end surface of the second support layer 102. In this way, the multiple grooves 102a can absorb deformation of the carrier 1 from different directions.

[0069] For example, the plurality of grooves 102a are evenly distributed around the hollow structure 104. In this way, the ability of the carrier 1 to absorb deformation is stronger.

[0070] In an example, Figure 8 As shown, the through hole includes a plurality of arcuate grooves 102a arranged concentrically. A connecting portion 112 is formed between adjacent arcuate grooves 102a. For example, the cross section of the hollow structure 104 is circular. The plurality of arcuate grooves 102a are arranged around the hollow structure 104. The arcuate grooves 102a are arranged concentrically relative to the center of the hollow structure 104. The arcuate grooves 102a can effectively absorb the deformation of the edge portion 110.

[0071] For example, Figure 8 As shown, there are four arc-shaped grooves 102a, which respectively cover the four corners of the square carrier 1 and are symmetrical with respect to the diagonal line, or cover four sides and are symmetrical with respect to the mid-perpendicular line of the sides. This arrangement makes the elastic structure more balanced in its ability to absorb deformation.

[0072] In an example, Figure 8 As shown, multiple layers of arc-shaped grooves 102a are arranged in the radial direction of the carrier 1. For example, multiple layers of arc-shaped grooves 102a are arranged in the radial direction. Each layer is provided with multiple arc-shaped grooves 102a. Multiple layers of arc-shaped grooves 102a can more effectively absorb the deformation of the carrier 1 and reduce stress concentration.

[0073] In addition, the connecting parts 112 between the multiple layers and each layer together form a skeleton structure, which has a greater elastic restoring force, so that the carrier 1 has a stronger ability to recover and deform.

[0074] For example, the number of layers of the arc-shaped grooves 102a is less than 5. This makes the structural strength and deformation resistance of the carrier 1 stronger. Figure 8 The arc-shaped grooves 102a are two layers, so that the structure of the carrier 1 becomes simple.

[0075] In an example, Figure 8 As shown, the connecting parts 112 of two adjacent layers are staggered. That is, the two connecting parts 112 are not located in the same diameter direction. In this way, the connecting parts 112 and the parts of each layer can form a grid connection. In this way, as long as the carrier 1 is partially deformed, the deformation will spread to other parts through the grid connection, and the deformation will be dispersed in various parts of the grid connection. This makes the elastic structure more balanced in its ability to absorb deformation in all directions relative to the hollow structure 104.

[0076] Alternatively, the connecting parts 112 of multiple layers are connected together to form a radial shape. In this example, the arc-shaped grooves 102a of the multiple layers corresponding to each other are distributed in the same fan-shaped structure. The radial connection structure makes the elastic structure stronger.

[0077] In one example, a closed annular wall portion is formed inside the buffer portion, and the annular wall portion can form a barrier for the elastic structure, thereby improving the durability of the elastic structure.

[0078] In an example, Figure 4As shown, the mesh portion 2 includes a mesh structure 21, a stress buffer zone 23 arranged around the mesh structure, and a fixed portion 22 arranged around the stress buffer zone 23. The mesh structure 21 and the stress buffer zone 23 are suspended. The fixed portion 22 can be used to connect the mesh portion 2 to the carrier 1, for example, the fixed portion 22 is connected to the edge portion, so that the mesh portion 2 can be stably covered on the carrier 1. The stress buffer zone 23 is a reserved area where no mesh is set and is not connected to the edge portion. The stress buffer zone 23 can further reduce the influence of the deformation of the carrier on the mesh structure.

[0079] In an example, Figure 4 As shown, a portion of the first supporting layer 101 corresponding to the stress buffer zone 23 is removed to form a step structure 101 a , so that the stress buffer zone 23 is suspended.

[0080] The stress buffer 23 is an annular structure with a predetermined width α. It should be noted that the stress buffer 23 can be, for example, a circular annular structure with a predetermined width α, or a square ring structure with a predetermined width α, or other annular structures with a predetermined width α. Those skilled in the art can flexibly adjust according to specific circumstances, and the present disclosure does not limit this.

[0081] In an example, Fig. 9 As shown, the stress buffer 23 is hollowed out to form an elastic structure. For example, the stress buffer 23 is hollowed out to form an elastic telescopic structure 23a. An annular band 23b is formed between the hollowed-out hole and the grid structure to ensure that the grid structure 21 has sufficient strength. The elastic telescopic structure 23a can be elastically deformed to absorb the deformation of the carrier 1. This prevents the deformation of the carrier 1 from being transmitted to the grid structure 21. Fig. 9 A represents the contracted state, and B represents the extended state.

[0082] Figure 3 1 is a cross-sectional view of a dustproof structure according to another embodiment of the present disclosure. In this example, the carrier further includes a third support layer 103. The third support layer 103 is a solid structure and is connected to the lower end surface of the second support layer 102. In this example, the third support layer 103 plays a role in reinforcing the structure and can prevent the groove 102a from being exposed, which makes the structural strength of the carrier higher.

[0083] In other examples, the groove 102a is provided on at least one of the first supporting layer 101 and the third supporting layer 103. This arrangement can also play a role in absorbing the deformation of the carrier.

[0084] According to another embodiment of the present disclosure, a microphone packaging structure is provided, which can be applied to various types of electronic products such as mobile phones, laptops, tablet computers, game consoles, intercoms, VR devices, and smart wearable devices.

[0085] The microphone packaging structure can effectively prevent internal chip components and other components from being damaged by external particles and foreign objects such as dust and impurities, extend the service life of the MEMS microphone chip, and enable the MEMS microphone chip to maintain excellent acoustic performance.

[0086] The specific structure of the microphone packaging structure provided in the embodiment of the present disclosure is further described below.

[0087] like Figure 5-7 As shown in 10-11, the microphone packaging structure provided by the embodiment of the present disclosure includes a shell 3 with a accommodating cavity, and a sound pickup hole 4 is arranged on the shell 3. The microphone packaging structure provided by the present disclosure also includes the dustproof structure as described above, and the dustproof structure is fixedly mounted on the sound pickup hole 2. The dustproof structure can effectively protect the components inside the microphone packaging structure.

[0088] In one example, the shape of the sound pickup hole can be, for example, circular, square, triangular, elliptical, etc. The sound pickup hole can be set to one or more as needed. The specific setting position of the sound pickup hole can also be flexibly adjusted according to the specific situation of the microphone packaging structure, and the present disclosure does not limit this.

[0089] In an example, Figure 5 As shown, the dustproof structure can be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside. In this example, the dustproof structure is installed outside the microphone packaging structure and does not occupy the space inside the microphone packaging structure. When installing the dustproof structure, the position of the dustproof structure can be reasonably installed according to the position of the sound pickup hole 4, so that the dustproof structure can be aligned with the sound pickup hole 4, thereby preventing external particles and foreign matter from being introduced into the microphone packaging structure through the sound pickup hole 4.

[0090] Of course, the present disclosure is not limited to setting the dustproof structure outside the housing 3, and the dustproof structure may also be set in the accommodating cavity of the housing 3. Those skilled in the art may flexibly adjust the setting position of the dustproof structure according to specific needs.

[0091] In one example, the microphone packaging structure has a shell 3 that includes a substrate 32 and a packaging cover 31 , and the substrate 32 and the packaging cover 31 together enclose the accommodating cavity. The dustproof structure is accommodated in the accommodating cavity of the shell 3 .

[0092] In an example, Figure 6 As shown, the pickup hole is located on the packaging cover 31, and the dustproof structure is fixedly connected to the packaging cover. The position of the dustproof structure corresponds to the pickup hole 4, which can prevent external particles and foreign objects from being introduced into the microphone packaging structure through the pickup hole 4.

[0093] In an example, Figure 7 As shown, the sound pickup hole is located on the packaging cover 31, and the dustproof structure is fixedly connected to the position of the substrate 32 corresponding to the sound pickup hole 4. At this time, the dustproof structure can effectively protect the chip in the microphone packaging structure.

[0094] In the present invention, the sound pickup hole 4 is not limited to being opened on the packaging cover 31 of the housing 3, but can also be opened on the substrate 32. Fig.10 As shown, the sound pickup hole 4 is located on the substrate 32, and the dustproof structure is fixedly arranged on the substrate 32 at a position corresponding to the sound pickup hole 4. Fig.11 As shown, the sound pickup hole 4 is located on the substrate 32, the dustproof structure is fixedly arranged at a position corresponding to the sound pickup hole 4 on the substrate 32, and the MEMS chip 5 is arranged on the dustproof structure. It should be noted that when the sound pickup hole 4 is opened on the substrate 32, those skilled in the art can adjust the installation position of the dustproof structure according to specific circumstances, as long as it can prevent external particles and foreign objects from entering or can protect the internal chip, and there is no limitation on this.

[0095] The packaging cover 31 is a dish-shaped structure with an open end. The material of the packaging cover 31 can be, for example, a metal material, a plastic material, or a PCB board. The shape of the packaging cover 31 can be, for example, a cylindrical shape, a rectangular parallelepiped shape, etc. Those skilled in the art can flexibly adjust according to actual needs, and there is no limitation on this.

[0096] The substrate 32 may be a circuit board known in the art, such as a PCB, etc., without limitation. The packaging cover 31 and the substrate 32 may be fixed together, for example, by bonding with an adhesive or soldering with solder paste, and those skilled in the art may flexibly select the desired one, without limitation.

[0097] The microphone packaging structure provided by the present invention has a microphone device fixedly accommodated in the accommodating cavity of the housing 3. Specifically, Figure 5-7 As shown in 10 - 11 , the microphone device may include a MEMS chip 5 and a signal amplifier 6 , for example.

[0098] Wherein, the MEMS chip 5 includes a substrate and a sensing film. The substrate is also a hollow structure. The sensing film is, for example, a piezoelectric element, a capacitor element, a piezoresistive element, etc. The sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate. The hollow structure forms a back cavity. When the MEMS chip 5 is fixed in the receiving cavity, the MEMS chip 5 can be mounted on the substrate 32. Of course, the MEMS chip 5 can also be mounted on the packaging cover 31, for example, a special adhesive can be used to bond the MEMS chip 5 to the packaging cover 31. The MEMS chip 5 can also be turned on by the circuit layout in the substrate 32 in a flip-chip manner, which is common knowledge of those skilled in the art and will not be described in detail in the present invention.

[0099] The signal amplifier 6 can be mounted on the package cover 31, and can also be mounted on the substrate 32. The signal amplifier 6 can be, for example, an ASIC chip. The ASIC chip is connected to the MEMS chip 5. The electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, and processed and output by the ASIC chip. The MEMS chip 5 and the ASIC chip 6 can be electrically connected through metal wires (bonding wires) to achieve mutual conduction between the two.

[0100] In addition, the MEMS chip 5 and / or the signal amplifier 6 may also be buried in the substrate 32, or half buried in the substrate 32. For example, a conductor is provided in the substrate 32, and a pad is provided on the substrate 32. The conductor is, for example, a metallized through hole provided in the substrate 32. The pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 through the conductor. The design of burying the MEMS chip 5 and the signal amplifier 6 in the substrate 32 helps to achieve miniaturization of the microphone.

[0101] It should be noted that when the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32, at least one metal layer is required to be provided above and below the MEMS chip 5 and the signal amplifier 6. The metal layer is grounded as a shield. A plurality of metal conductors are arranged in the area around the MEMS chip 5 and the signal amplifier 6 to form a shielding structure together with the above-mentioned metal layer. The design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 makes it unnecessary to coat the surface of the signal amplifier 6 with protective glue, which can simplify the process and improve the product's resistance to optical noise.

[0102] The embodiment of the present disclosure also provides an electronic device, wherein the electronic device comprises the microphone packaging structure as described above.

[0103] The electronic device may be a mobile phone, a laptop computer, a tablet computer, a VR device, a smart wearable device, etc., and the present disclosure does not limit this.

[0104] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A dustproof structure, characterized in that: including a carrier and a mesh portion; The carrier is a hollow structure, and includes a plurality of support layers arranged along the height direction. The grid portion includes a grid structure and a fixing portion arranged around the grid structure, the fixing portion is connected to the carrier, the grid structure is opposite to the hollow structure, and the thermal expansion coefficient of at least one of the support layers is different from the thermal expansion coefficients of other support layers other than the support layer; At least one of the supporting layers has a groove extending in the height direction, the supporting layer connected to the grid portion is a solid structure, and the supporting layer located below the supporting layer has the groove.

2. The dustproof structure according to claim 1, characterized in that: The support layer connected to the fixing portion is defined as the first support layer, and the Nth support layer is defined as the Nth support layer outward, wherein N is greater than or equal to 2, and the thermal expansion coefficient of the Nth support layer is greater than the thermal expansion coefficient of the N-1th support layer.

3. The dustproof structure according to claim 2, characterized in that: The number of the supporting layers is three.

4. The dustproof structure according to claim 1, characterized in that: The material of the carrier is an organic material, and the material of the mesh part is metal.

5. The dustproof structure according to claim 1, characterized in that: The grid portion further includes a stress buffer zone connected between the fixing portion and the grid structure, and the stress buffer zone is suspended.

6. The dustproof structure according to claim 5, characterized in that: An elastic structure is formed in the stress buffer zone by hollowing out.

7. The dustproof structure according to claim 1, characterized in that: At least one of the support layers is made of dry film resist.

8. A microphone packaging structure, characterized in that: It comprises a shell having a receiving cavity, and a sound pickup hole is arranged on the shell; It also includes a dustproof structure as described in any one of claims 1 to 7, wherein the dustproof structure is arranged on the sound pickup hole.

9. The microphone packaging structure according to claim 8, characterized in that: The dustproof structure is located outside the housing.

10. The microphone packaging structure according to claim 8, characterized in that: The housing comprises a substrate and a packaging cover, wherein the substrate and the packaging cover enclose the accommodating cavity; The dustproof structure is accommodated in the accommodating cavity.

11. The microphone packaging structure according to claim 10, characterized in that: The sound pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the packaging cover.

12. The microphone packaging structure according to claim 10, characterized in that: The sound pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to a position on the base plate corresponding to the sound pickup hole.

13. The microphone packaging structure according to claim 10, characterized in that: The sound pickup hole is located on the substrate, and the dustproof structure is fixedly arranged at a position on the substrate corresponding to the sound pickup hole.

14. The microphone packaging structure according to claim 10, characterized in that: The sound pickup hole is located on the substrate, the dustproof structure is fixedly arranged on the substrate at a position corresponding to the sound pickup hole, and the MEMS chip is arranged on the dustproof structure.

15. An electronic device, characterized in that: Comprising a microphone packaging structure as described in any one of claims 8-14.

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