Water-guided laser processing device and processing system

Abstract

The present invention discloses a water-conducting laser processing device and processing system, the device includes a beam adjusting device, a focusing lens and a coupling water cavity; the beam adjusting device is used to adjust the position and angle of the laser; the focusing lens is used to focus the laser adjusted by the beam adjusting device and then inject it into the coupling water cavity; the coupling water cavity is used to transmit the focused laser along the outgoing water column at the water outlet of the coupling water cavity, so as to use the laser in the outgoing water column to process the workpiece; the focus of the laser in the outgoing water column deviates from the axis of the outgoing water column. The present invention also discloses a water-conducting laser processing system including the above device. The present invention uses the beam adjusting device to realize that the focus position of the laser in the outgoing water column deviates from the axis of the outgoing water column and is fixedly set or moves in a circle along the edge of the outgoing water column, so that the power distribution of the laser in the outgoing water column is uniform, the taper effect when the water-conducting laser cuts the workpiece is improved, and the deep processing capability is expanded.

Description

Technical Field

[0001] The present application relates to a water-conducting laser processing device and a processing system, belonging to the technical field of laser processing. Background Art

[0002] With the rapid development of the medical, aviation, aerospace, and semiconductor fields, the performance requirements for key components are getting higher and higher, which has promoted the improvement and improvement of parts processing methods and equipment. In the field of parts cutting and processing, traditional cutting processing methods are mainly mechanical cutting and high-pressure water cutting. However, the above processing methods have the problems of low processing efficiency and low processing accuracy. In order to solve the above problems, technicians in this field have developed laser cutting processing devices, which are superior to traditional cutting processing methods in terms of processing efficiency, processing accuracy and environmental protection. However, laser cutting processing will cause a certain degree of thermal damage to the material. In order to solve the problem of thermal damage to the material, water-guided laser processing devices came into being.

[0003] The water-guided laser processing device is a composite processing technology that uses a water jet to guide the laser beam to cut the workpiece. Due to the different refractive indices of water and air, when the laser beam irradiates the interface between water and air at a certain angle, if the incident angle is less than the critical angle of total reflection, the laser will be totally reflected and will not be transmitted out, which makes the laser energy always confined in the water beam so that the laser propagates along the direction of the water beam.

[0004] The water-guided laser processing device in the prior art can achieve high-quality cutting of thin plates within 5mm, but as the processing depth increases, the water-guided laser also has a certain processing taper effect. The main reason is that the distribution of light in the radial section of the water column conforms to the Gaussian distribution law, that is, the power density of light is larger near the axis of the water column, and the power density is smaller near the surface of the water column. This makes the material removal energy stronger near the axis of the water column, while the material removal energy is very weak near the surface of the water column, thereby limiting the thickness of the workpiece cut by the water-guided laser. Summary of the invention

[0005] The purpose of the present application is to provide a water-conducting laser processing device and a processing system to solve the technical problem of uneven distribution of laser power density in a water column in the prior art.

[0006] The water-guided laser processing device of the present invention comprises a beam adjustment device, a focusing lens and a coupling water cavity;

[0007] The beam adjustment device is used to adjust the position and angle of the laser;

[0008] The focusing lens is used to focus the laser light adjusted by the beam adjusting device and then inject it into the coupling water cavity;

[0009] The coupling water cavity is used to transmit the focused laser along the outgoing water column at the water outlet of the coupling water cavity, so as to use the laser in the outgoing water column to process the workpiece; the focus of the laser in the outgoing water column deviates from the axis of the outgoing water column.

[0010] Preferably, the light beam adjustment device comprises a first rotation adjustment device;

[0011] The first rotation adjustment device includes a first rotation device and a first adjustment plate;

[0012] The rotating shaft of the first rotating device is connected to the first adjusting plate;

[0013] The first adjustment plate is used to allow the received laser to be incident on the focusing lens at different positions and angles, and the laser emitted from the focusing lens is transmitted along the outgoing water column at the water outlet of the coupling water cavity; the focus of the laser in the outgoing water column is fixedly set away from the axis of the outgoing water column or moves in a circular motion along the edge of the outgoing water column.

[0014] Preferably, the light beam adjustment device further comprises a second rotation adjustment device;

[0015] The second rotation adjustment device includes a second rotation device and a second adjustment plate;

[0016] The rotation axis of the second rotating device is connected to the second adjusting plate, and the rotation axis of the second rotating device is perpendicular to the rotation axis of the first rotating device;

[0017] The second adjustment plate is used to receive the laser emitted from the first adjustment plate and reflect the received laser. The laser emitted through the second adjustment plate is incident on the focusing lens at different positions and angles. The laser emitted from the focusing lens is transmitted along the outlet water column at the outlet of the coupling water cavity. The focus of the laser in the outlet water column is fixedly set away from the axis of the outlet water column or moves in a circular motion along the edge of the outlet water column.

[0018] Preferably, it further comprises a focusing lens adjustment frame; the focusing lens is arranged on the focusing lens adjustment frame to achieve three-dimensional spatial fine adjustment of the focusing lens.

[0019] Preferably, the coupling water cavity comprises a window lens and a cavity;

[0020] The window lens is arranged on the outer wall of the cavity, and is used to receive the laser emitted by the focusing lens;

[0021] A coupling water cavity outlet is also provided on the outer wall of the cavity, and the coupling water cavity outlet is coaxially arranged with the window lens.

[0022] Preferably, the laser receiving surface of the window lens is a plane, and the laser emitting surface of the window lens is a convex surface.

[0023] Preferably, it also includes a gas chamber;

[0024] The gas chamber is provided with a water gas outlet, and the water gas outlet is coaxially arranged with the water outlet of the coupling water chamber.

[0025] Preferably, the water vapor outlet extends outward along the outer wall of the gas chamber, and the water vapor outlet is connected to the outer wall of the gas chamber in an arc.

[0026] The present invention also discloses a water-conducting laser processing system, comprising a control device, a laser generator, a fluid supply device and the water-conducting laser processing device;

[0027] The control device is used to control the opening and closing of the laser generator and the fluid supply device;

[0028] The laser generator is used to generate laser light, and the generated laser light is input into the water-conducting laser processing device;

[0029] The fluid supply device is used to generate high-pressure fluid, and the generated high-pressure fluid is input into the water-conducting laser processing device;

[0030] The water-conducting laser processing device uses the laser generated by the laser generator to cut the workpiece.

[0031] Preferably, it further comprises a gas supply device, wherein the gas supply device is used to generate high-pressure gas, and the generated high-pressure gas is input into the water-conducting laser processing device;

[0032] Preferably, it also includes a moving device and a feedback sensor;

[0033] The moving device is used to adjust the position of the workpiece according to the control information of the control device to achieve precise cutting;

[0034] The feedback sensor is used to transmit the collected real-time position information of the workpiece to the control device, and the control device sends control information to the mobile device according to the received real-time position information of the workpiece.

[0035] Compared with the prior art, the water-conducting laser processing device and processing system of the present invention have the following beneficial effects:

[0036] The water-guided laser processing device of the present invention utilizes a beam adjustment device to achieve a focus position of the laser in the outgoing water column that deviates from the axis of the outgoing water column and is fixedly set or moves in a circle along the edge of the outgoing water column, thereby making the power distribution of the laser in the outgoing water column more uniform, improving the taper effect when the water-guided laser cuts the workpiece, expanding the deep processing capability, and having important significance for high-precision processing of materials in the aerospace and civil fields.

[0037] In the present application, if the laser energy in the water column is to be adjusted, a first rotating adjustment device may be used. The first rotating device in the first rotating adjustment device may drive the first adjustment plate to move on the frame of the water-conducting laser processing device, and simultaneously rotate the first adjustment plate itself, so that the first adjustment plate can receive the laser light and inject it into the focusing lens at different positions and angles, so that the focal position of the laser light injected into the coupling water cavity via the focusing lens deviates from the fixed setting of the axis of the outgoing water column or moves in a circle along the edge of the outgoing water column.

[0038] The present application may also adopt a combined structure of a first rotation adjustment device and a second rotation adjustment device to achieve the adjustment of laser energy in the water column. To ensure that the laser is incident on the focusing lens at different positions and angles, it is necessary to set the rotation axes in the first rotation adjustment device and the second rotation adjustment device to be perpendicular to each other.

[0039] The present application also provides a focusing lens adjustment frame, so that the focusing lens can be fine-tuned in three-dimensional space according to usage conditions to ensure that the focus of the focusing lens is located at the water outlet of the coupling water chamber.

[0040] In the present application, the laser emission surface of the window lens in the coupling water cavity is set to a convex surface, and the convex surface can be an arc convex surface, an inverted frustum-shaped convex surface, or a prism-shaped convex surface, etc., in order to prevent microbubbles in the coupling water cavity from adhering to or staying at the laser emission surface of the window lens, thereby affecting laser transmission.

[0041] In order to avoid the impact of sputtering on the water column during the cutting process, the present application also sets up a gas chamber to achieve the stability and maintenance of the water flow under the protection and compression effect of the gas. The present application improves the laminar flow quality through gas assistance.

[0042] In order to increase the stability of the airflow, the present application sets a water vapor outlet extending outward along the outer wall of the gas chamber, and at the same time sets the water vapor outlet to be connected to the outer wall of the cavity of the gas chamber in an arc.

[0043] The water-guided laser processing system of the present application utilizes the above-mentioned water-guided laser processing device, which can reduce the processing taper, achieve deep cutting, effectively reduce the heat accumulation effect, and thus improve the processing efficiency. It has the advantages of simple operation, low cost, high efficiency and reliability.

[0044] The water-guided laser processing system of the present application is provided with a feedback sensor, which can collect the position information of the workpiece in real time, thereby determining the cutting accuracy and ensuring precise cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 It is a schematic diagram of the structure of the water-conducting laser processing device in the present invention;

[0046] Figure 2 for Figure 1 The enlarged view of point A in the middle. Figure 2 A schematic diagram showing the focal position of the laser at the outlet of the coupling water cavity;

[0047] Figure 3 Schematic diagram of the conduction of laser in the outgoing water column;

[0048] Figure 4 To simulate the laser density distribution in the water column emitted by the existing water-guided laser processing device using ZEMAX optical simulation software;

[0049] Figure 5 A laser density distribution diagram in a water column emitted by a water-guided laser processing device of the present application is simulated by using ZEMAX optical simulation software;

[0050] Figure 6 Another method of simulating the laser density distribution in the water column emitted by the water-guided laser processing device of the present application using ZEMAX optical simulation software;

[0051] Figure 7 It is a schematic diagram of the structure of the water-conducting laser processing system in the present invention.

[0052] List of parts and reference numerals:

[0053] 1. Laser; 2. Focusing lens; 3. Frame; 4. Focusing lens adjustment frame; 5. Window lens; 6. Water inlet; 7. Coupled water cavity; 8. Gas chamber; 9. Air inlet; 10. Workpiece; 11. Outgoing water column; 12. Control device; 13. Laser; 14. Optical element; 15. Fluid supply device; 16. Gas supply device; 17. Water-guided laser processing device; 18. Feedback sensor; 19. Moving device; 20. First rotation adjustment device; 21. Second rotation adjustment device; 22. Cavity; 23. Coupled water cavity outlet; 24. Water gas outlet. DETAILED DESCRIPTION

[0054] The present invention is described in detail below in conjunction with embodiments, but the present invention is not limited to these embodiments.

[0055] The water-conducting laser processing device of the present invention comprises a beam adjustment device, a focusing lens 2 and a coupling water cavity 7; the beam adjustment device is used to adjust the position and angle of the laser; the focusing lens 2 is used to focus the laser adjusted by the beam adjustment device and then inject it into the coupling water cavity 7; the coupling water cavity 7 is used to transmit the focused laser along the outgoing water column 11 at the water outlet 23 of the coupling water cavity, so as to use the laser in the outgoing water column 11 to process the workpiece; the focus of the laser in the outgoing water column 11 is fixedly set away from the axis of the outgoing water column 11 or moves in a circular motion along the edge of the outgoing water column 11. Specifically: the beam adjustment device is used to adjust the position and angle of the laser 1 injected into the focusing lens 2 in real time, so that the focus position of the laser injected into the coupling water cavity 7 through the focusing lens 2 moves in a circular motion along the edge of the water outlet of the coupling water cavity; the focus position of the laser in the coupling water cavity 7 is characterized by an eccentricity H and an angle θ. The eccentricity H is the distance between the laser beam and the axis of the water outlet of the coupling water cavity, and the angle θ is the angle between the laser beam and the axis of the water outlet of the coupling water cavity. The focusing lens 2 is used to focus the laser adjusted by the beam adjustment device and inject it into the coupling water cavity 7; the coupling water cavity 7 is used to guide the laser in the coupling water cavity 7 to be transmitted along the outgoing water column 11 at the water outlet of the coupling water cavity, and use the laser in the outgoing water column 11 to cut the workpiece 10. The present application uses the beam adjustment device to achieve that the focus position of the laser emitted from the coupling water cavity 7 deviates from the axis of the outgoing water column and is fixed or moves in a circle along the edge of the outgoing water column, so that the power distribution of the laser in the outgoing water column 11 at the water outlet of the coupling water cavity is more uniform, which improves the taper effect when the water-guided laser cuts the workpiece, expands the deep processing capability, and is of great significance to the high-precision processing of materials in the aerospace and civil fields.

[0056] In order to ensure the stability of the structure of the water-guided laser processing device of the present application, the present application also sets a frame 3; the beam adjustment device, the focusing lens 2 and the coupling water cavity 7 are all arranged in the frame 3, and the focusing lens 2 and the coupling water cavity 7 are coaxially arranged along the transmission direction of the laser 1. Among them, the focusing lens 2 and the frame 3 can be connected through the focusing lens adjustment frame 4, or can be directly fixedly connected to the frame 3. The focusing lens adjustment frame 4 used in the present application can use an existing model, as long as it is ensured that the focusing lens 2 can be adjusted in three dimensions (the axial direction is the Z direction, and the radial direction is vertically provided with the X and Y directions), so as to realize the three-dimensional small amount movement of the focusing lens 2.

[0057] In order to realize the function of the beam adjustment device to adjust the position and angle of the laser incident on the focusing lens 2 in real time, the beam adjustment device of the present application includes a first rotating adjustment device 20; the first rotating adjustment device 20 includes a first rotating device and a first adjustment plate; the rotating shaft of the first rotating device is connected to the first adjustment plate; the first adjustment plate is used to make the received laser 1 incident on the focusing lens 2 at different positions and angles, and the laser emitted from the focusing lens is transmitted along the outgoing water column at the outlet of the coupling water cavity; the focus of the laser in the outgoing water column is fixedly set away from the axis of the outgoing water column or moves in a circular motion along the edge of the outgoing water column. If only the first rotating adjustment device 20 is used to realize the focal position of the laser in the coupling water cavity 7 to move in a circular motion along the edge of the outlet of the coupling water cavity, it is necessary to ensure that the first adjustment plate moves on the frame 3 and the first adjustment plate itself rotates at the same time. The first adjustment plate used in the present application is preferably a total reflection mirror.

[0058] In order to realize the function of the beam adjustment device to adjust the position and angle of the laser incident on the focusing lens 2 in real time, the beam adjustment device of the present application can also adopt another structure, which includes a first rotation adjustment device 20 and a second rotation adjustment device 21, and the two rotation adjustment devices cooperate with each other. The structure of the first rotation adjustment device 20 is as above, and the second rotation adjustment device 21 includes a second rotation device and a second adjustment plate; the first adjustment plate and the second adjustment plate used in the present application are preferably total reflection mirrors. The rotation axis of the second rotation device is connected to the second adjustment plate, and the rotation axis of the second rotation device is perpendicular to the rotation axis of the first rotation device; the second adjustment plate is used to receive the laser emitted from the first adjustment plate and reflect the received laser. The laser emitted through the second adjustment plate is incident on the focusing lens 2 at different positions and angles, and the laser emitted from the focusing lens 2 is transmitted along the outgoing water column at the outlet of the coupling water chamber; the focus of the laser in the outgoing water column is fixedly set away from the axis of the outgoing water column or moves in a circular motion along the edge of the outgoing water column. The specific structural schematic diagram is shown in Figure 1 to Figure 3 . Figure 1 In the figure, the two light beams in the outgoing water column 11 represent the outermost light beams, which depict the instantaneous laser position and transmission conditions at a certain moment.

[0059] The coupling water cavity 7 in the present application includes a window lens 5 and a cavity 22; the window lens 5 is arranged on the outer wall of the cavity 22, and is used to receive the laser emitted by the focusing lens, so that the laser can enter the cavity 22 through the window lens 5; a coupling water cavity outlet 23 is also opened on the outer wall of the cavity 22, and the coupling water cavity outlet 23 is coaxially arranged with the window lens 5.

[0060] The coupling water chamber 7 in the present application further includes a water inlet 6 disposed on the side wall of the chamber 22, and high-pressure water is provided into the coupling water chamber 7 through the water inlet 6. The high-pressure water can be ordinary drinking water or ultrapure water.

[0061] To prevent the microbubbles in the coupling water cavity 7 from adhering to or staying at the laser emitting surface of the window lens 5 to affect the laser transmission, the laser receiving surface of the window lens 5 is set as a plane, and the laser emitting surface of the window lens 5 is set as a convex surface; the convex surface can be an arc convex surface or a truncated cone convex surface.

[0062] In order to avoid the influence of sputtering on the emergent water column 11 during the cutting process, the present application further provides a gas chamber 8, and the gas chamber 8 is provided with a water vapor outlet 24, and the water vapor outlet 24 is coaxially arranged with the coupled water cavity outlet 23, so that the emergent water column 11 flowing out of the coupled water cavity outlet 23 flows out directly from the water vapor outlet 24, and will not change the transmission direction of the emergent water column 11. An air inlet 9 is also provided on the side wall of the gas chamber 8, and high-pressure gas is provided into the gas chamber 8 through the air inlet 9. The gas in the gas chamber 8 of the present application is helium, nitrogen or argon. Under the protection and compression effect of the gas, the stability and maintenance of the water flow in the emergent water column 11 are achieved, and the present application improves the laminar flow quality by means of gas assistance.

[0063] In order to increase the stability of the air flow, the present application sets a water vapor outlet 24 extending outward along the outer wall of the gas chamber 8, and the water vapor outlet 24 is connected to the outer wall of the gas chamber 8 in an arc. The diameter of the water vapor outlet 24 is greater than or equal to the diameter of the coupled water cavity outlet 23. Preferably, the diameter of the water vapor outlet 24 is greater than the diameter of the coupled water cavity outlet 23.

[0064] In order to verify that the distribution of laser density in the water column 11 emitted by the water-conducting laser processing device of the present application is more uniform than that in the water column emitted by the water-conducting laser processing device in the prior art, the present application uses ZEMAX optical simulation software to construct a simulation analysis model, wherein Figure 4 This is the laser density distribution diagram in the water column emitted by the existing water-guided laser processing device. Figure 5 This is a laser density distribution diagram in the outgoing water column 11 when the angle θ is 20° and the eccentricity H is represented by the XY horizontal plane as X: 0.2 mm, Y: 0.2 mm in the water-guided laser processing device of the present application. Figure 6 This is a laser density distribution diagram in the outgoing water column 11 when the angle θ in the water-guided laser processing device of the present application is 20° and the eccentricity H is represented by the XY horizontal plane as X: 0.3 mm, Y: 0.3 mm. Figures 4 to 6 The simulation results show that compared with the device of the prior art, the energy distribution of the emergent water column 11 of the device of the present application is more uniform, and the laser energy is mainly concentrated at the edge of the emergent water column, thereby improving the Gaussian distribution characteristics of the laser beam and the taper effect when the water-guided laser cuts the workpiece, expanding the deep processing capability, and having important significance for the high-precision processing of materials in the aerospace and civil fields.

[0065] Figure 7It is a schematic structural diagram of the water-conducting laser processing system of the present invention.

[0066] The present invention discloses a water-conducting laser processing system, comprising a control device 12, a laser generator, a fluid supply device 15 and the water-conducting laser processing device 17. The control device 12 is used to control the opening and closing of the laser generator and the fluid supply device 15; the laser generator is used to generate laser 1, and the generated laser 1 is input into the water-conducting laser processing device 17; the laser generator is composed of a laser 13 and an optical element 14, the laser 13 generates laser 1, and the optical element 14 conducts the laser 1 generated by the laser 13 to the water-conducting laser processing device 17; the fluid supply device 15 is used to generate high-pressure fluid, and the generated high-pressure fluid is input into the water-conducting laser processing device 17; the water-conducting laser processing device 17 is used to cut the workpiece 10 using the laser generated by the laser generator. The water-conducting laser processing system of the present application utilizes the above-mentioned water-conducting laser processing device, which can achieve deep cutting, and at the same time, the technical cost is low and the technical difficulty is relatively small.

[0067] In order to avoid the influence of sputtering on the emerging water column 11 during the cutting process, the system is also provided with a gas supply device 16, which is used to generate high-pressure gas, and the generated high-pressure gas is input into the water-conducting laser processing device 17; thereby achieving the stability and maintenance of the water flow in the emerging water column 11, and avoiding the influence of sputtering on the emerging water column 11 during the cutting process.

[0068] To ensure accurate cutting, the processing system of the present application further includes a moving device 19 and a feedback sensor 18; wherein the moving device 19 is used to adjust the position of the workpiece 10 according to the control information of the control device 12 to achieve accurate cutting; the feedback sensor 18 is used to transmit the collected real-time position information of the workpiece 10 to the control device 12, and the control device 12 sends control information to the moving device 19 according to the received real-time position information of the workpiece 10. The water-guided laser processing system of the present application is provided with a feedback sensor 18, which can collect the position information of the workpiece 10 in real time, thereby determining the cutting accuracy and ensuring accurate cutting.

[0069] The working process of the water-guided laser processing system of this application is as follows:

[0070] Step 1, the control device 12 controls the laser generator to start, generates laser light 1, and the laser light 1 is incident on the water-conducting laser processing device 17; wherein the laser generator includes a laser 13 and an optical element 14, the laser 13 generates the laser light 1, and the optical element 14 realizes the conduction of the laser beam and conducts it to the water-conducting laser processing device 17;

[0071] Step 2: After the laser enters the water-conducting laser processing device 17, the beam adjustment device in the water-conducting laser processing device 17 performs real-time adjustment to achieve rotation and vibration of the laser in different shapes, so that the position and angle of the laser entering the focusing lens 2 change;

[0072] Step 3, the laser after focusing adjustment enters the cavity 22 through the window lens 5 on the coupling water cavity 7, the focus of the laser is located at the water outlet 23 of the coupling water cavity, and there is an eccentricity H and an angle θ between the laser axis and the axis of the water outlet 23 of the coupling water cavity;

[0073] Step 4, the control device 12 controls the fluid supply device 15 to open, and introduces the water source into the cavity 22 through the water inlet 6; at the same time, the control device 12 controls the gas supply device 16 to open, and introduces the gas into the gas chamber 8;

[0074] Step 5, the outgoing water column 11 flows out through the water outlet at the lower end of the coupling water chamber 7, and is discharged from the water gas outlet 24 at the lower end of the gas chamber 8 under the protection and compression effect of the gas in the gas chamber 8, wherein the focal position of the laser moves in a circle along the edge of the water outlet 23 of the coupling water chamber;

[0075] Step 6: The laser is transmitted through total reflection of the outgoing water column 11 to reach the surface of the workpiece 10, completing the cutting process of the material;

[0076] Step 7, the feedback sensor 18 collects the real-time position information of the workpiece 10 and transmits it to the control device 12. The control device 12 determines the cutting state and cutting position of the workpiece 10 based on the received real-time position information of the workpiece 10. If the workpiece 10 deviates from the preset position, the control device 12 sends control information to the mobile device 19. The mobile device 19 adjusts the position of the workpiece 10 according to the received information to achieve precise cutting.

[0077] The water-guided laser processing system of the present application utilizes the above-mentioned water-guided laser processing device, which can reduce the processing taper, achieve deep cutting, effectively reduce the heat accumulation effect, and thus improve the processing efficiency, and has the advantages of simple operation, low cost, high efficiency and reliability. At the same time, the present application is provided with a feedback sensor, which can collect the position information of the workpiece in real time, thereby determining the cutting accuracy and ensuring precise cutting.

[0078] The above are only a few embodiments of the present application and do not constitute any form of limitation to the present application. Although the present application is disclosed as above with preferred embodiments, it is not intended to limit the present application. Any technician familiar with the profession, without departing from the scope of the technical solution of the present application, using the technical content disclosed above to make slight changes or modifications are equivalent to equivalent implementation cases and fall within the scope of the technical solution.

Claims

1. A water-conducting laser processing device, characterized in that: It includes a beam adjustment device, a focusing lens and a coupling water cavity; The beam adjustment device is used to adjust the position and angle of the laser; The focusing lens is used to focus the laser light adjusted by the beam adjusting device and then inject it into the coupling water cavity; The coupling water cavity is used to transmit the focused laser along the outgoing water column at the water outlet of the coupling water cavity, so as to use the laser in the outgoing water column to process the workpiece; the focus of the laser in the outgoing water column deviates from the axis of the outgoing water column; wherein, The beam adjustment device includes a first rotation adjustment device; The first rotation adjustment device includes a first rotation device and a first adjustment plate; The rotating shaft of the first rotating device is connected to the first adjusting plate; The first adjustment plate is used to allow the received laser to be incident on the focusing lens at different positions and angles, and the laser emitted from the focusing lens is transmitted along the outgoing water column at the water outlet of the coupling water cavity; the focus of the laser in the outgoing water column is fixedly set away from the axis of the outgoing water column or moves in a circular motion along the edge of the outgoing water column; or The beam adjustment device comprises a first rotation adjustment device and a second rotation adjustment device; The first rotation adjustment device includes a first rotation device and a first adjustment plate; The rotating shaft of the first rotating device is connected to the first adjusting plate; The second rotation adjustment device includes a second rotation device and a second adjustment plate; The rotation axis of the second rotating device is connected to the second adjusting plate, and the rotation axis of the second rotating device is perpendicular to the rotation axis of the first rotating device; The second adjustment plate is used to receive the laser emitted from the first adjustment plate and reflect the received laser. The laser emitted through the second adjustment plate is incident on the focusing lens at different positions and angles. The laser emitted from the focusing lens is transmitted along the outlet water column at the outlet of the coupling water cavity. The focus of the laser in the outlet water column is fixedly set away from the axis of the outlet water column or moves in a circular motion along the edge of the outlet water column.

2. The water-conducting laser processing device according to claim 1, characterized in that: The coupling water cavity comprises a window lens and a cavity; The window lens is arranged on the outer wall of the cavity, and is used to receive the laser emitted by the focusing lens; A coupling water cavity outlet is also provided on the outer wall of the cavity, and the coupling water cavity outlet is coaxially arranged with the window lens.

3. The water-conducting laser processing device according to claim 2, characterized in that: The laser receiving surface of the window lens is a plane, and the laser emitting surface of the window lens is a convex surface.

4. The water-conducting laser processing device according to claim 2, characterized in that: Also included is a gas chamber; The gas chamber is provided with a water gas outlet, and the water gas outlet is coaxially arranged with the water outlet of the coupling water chamber.

5. The water-conducting laser processing device according to claim 4, characterized in that: The water vapor outlet extends outward along the outer wall of the gas chamber, and the water vapor outlet is connected to the outer wall of the gas chamber in an arc shape.

6. A water-guided laser processing system, characterized in that: It comprises a control device, a laser generator, a fluid supply device and a water-conducting laser processing device as claimed in any one of claims 1 to 5; The control device is used to control the opening and closing of the laser generator and the fluid supply device; The laser generator is used to generate laser light, and the generated laser light is input into the water-conducting laser processing device; The fluid supply device is used to generate high-pressure fluid, and the generated high-pressure fluid is input into the water-conducting laser processing device; The water-conducting laser processing device is used to cut workpieces using laser light generated by a laser generator.

7. The water-conducting laser processing system according to claim 6, characterized in that: Also included is a gas supply device; The gas supply device is used to generate high-pressure gas, and the generated high-pressure gas is input into the water-conducting laser processing device.

8. The water-conducting laser processing system according to claim 6 or 7, characterized in that: Also included are movement devices and feedback sensors; The moving device is used to adjust the position of the workpiece according to the control information of the control device to achieve precise cutting; The feedback sensor is used to transmit the collected real-time position information of the workpiece to the control device, and the control device sends control information to the mobile device according to the received real-time position information of the workpiece.

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