Production device and method of conductive interconnection board, conductive interconnection board

Abstract

The present invention provides a production device, a production method, and a conductive interconnection board for a back-contact battery, and relates to the field of solar photovoltaic technology. The conductive interconnection board production device includes: a workbench for carrying a substrate, a support table for carrying a plurality of wire segments, and a wiring unit for sucking the wire segments from the support table and laying the wire segments on the substrate; the wiring unit includes a plurality of adsorption hot-pressing heads for sucking the corresponding wire segments and hot-pressing the corresponding wire segments on the substrate, an adsorption component is provided on the hot-pressing end face of the adsorption hot-pressing head, and a heating component is arranged in the surrounding area of ​​the adsorption component in the adsorption hot-pressing head. The present invention reduces production costs, has high production efficiency, a low bending and fragmentation rate, and is automated and continuous in production with high production efficiency.

Description

Technical Field

[0001] The present invention relates to the field of solar photovoltaic technology, and in particular to a production device, a production method and a conductive interconnection plate of a back contact battery. Background Art

[0002] In the production of back-contact solar cells, it is necessary to make conductive connections between the individual cells.

[0003] At present, there are two main types of conductive interconnections for back-contact solar cells. One is to achieve conductive interconnection through a conductive interconnection board obtained by patterning the copper foil stacked with a substrate, and the other is to use a soldering ribbon to weld the battery cell to achieve conductive interconnection between each battery cell.

[0004] The conductive interconnection technology of the above-mentioned back contact solar cells, the first one, requires patterning of the copper foil laminated with the substrate, which requires the use of a large amount of copper foil and has high costs; the second one is manual welding of the soldering ribbon, which has low component production efficiency. Summary of the invention

[0005] The present invention provides a production device, a production method and a conductive interconnection plate of a back contact battery, aiming to solve the problems of high cost of the conductive interconnection plate and low production efficiency of the back contact battery using the conductive interconnection plate.

[0006] According to a first aspect of the present invention, there is provided a production device for a conductive interconnection plate of a back contact battery, comprising a workbench for carrying a substrate, a support table for carrying a plurality of wire segments, and a wiring unit for sucking the wire segments from the support table and laying the wire segments on the substrate;

[0007] The wiring unit includes a plurality of adsorption heat-pressing heads for absorbing the corresponding wire segments and hot-pressing the corresponding wire segments onto the substrate, an adsorption component is arranged on the hot-pressing end surface of the adsorption heat-pressing head, and a heating component is arranged in the surrounding area of ​​the adsorption component in the adsorption heat-pressing head.

[0008] Optionally, the adsorption hot pressure head includes a first adsorption hot pressure head and a second adsorption hot pressure head; in an extension direction perpendicular to the adsorption hot pressure head, the first adsorption hot pressure head and the second adsorption hot pressure head are alternately arranged at intervals.

[0009] Optionally, the first adsorption hot pressure head and the second adsorption hot pressure head are fixed by a connecting shaft, and along the extension direction of the adsorption hot pressure head, the first adsorption hot pressure head and the second adsorption hot pressure head are staggered and distributed front and back by the connecting shaft.

[0010] Optionally, the adsorption component is a suction cup or an adsorption hole, and the suction cup or the adsorption holes are distributed at intervals or continuously on the hot pressing end surface of the adsorption hot pressing head.

[0011] Optionally, a groove is provided on the hot pressing end surface of the adsorption hot pressing head, and the adsorption component is located in the groove.

[0012] Optionally, the device further comprises: a cutting mechanism for cutting the conductive wire on the support platform to obtain the conductive wire segment.

[0013] Optionally, the material of the adsorption hot pressure head is selected from graphite or stainless steel.

[0014] The second aspect of the present invention also provides a method for producing a conductive interconnection plate of a back contact battery, comprising:

[0015] providing a workbench on which a substrate is placed;

[0016] providing a support table on which the conductor segments are placed;

[0017] The wire segments are adsorbed from the support table by a wiring unit, and the adsorbed wire segments are hot-pressed onto the substrate to form a conductive interconnection plate.

[0018] Optionally, the hot pressing temperature is 50-120° C., and the hot pressing time is 5-30 seconds.

[0019] Optionally, the wire segment includes a conductive body; a surface of the conductive body is coated with a solderability protective coating.

[0020] Optionally, the material of the wire segment includes: at least one of copper, silver, aluminum, nickel, magnesium, iron, titanium, molybdenum, tungsten or their alloys.

[0021] According to a third aspect of the present invention, there is also provided a conductive interconnection plate for a back-contact battery, which is produced by the aforementioned method for producing a conductive interconnection plate for a back-contact battery.

[0022] In the embodiment of the present invention, the production device of the conductive interconnection board does not need patterning during the production of the conductive interconnection board, and the material selection of the conductive wire is more than copper, which can reduce the production cost; the formed conductive interconnection board can be subsequently laminated to achieve conductive interconnection between battery cells, which not only has high production efficiency, but also has less stress on the battery cells and less bending and breaking. At the same time, the production device can organically combine the processes of wire segment absorption and hot pressing, realize automated and continuous production, and improve the production efficiency of the conductive interconnection board of the back contact battery. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0024] Figure 1 A production device for a conductive interconnection plate in an embodiment of the present invention is shown;

[0025] Figure 2 An enlarged schematic diagram of a wiring unit in an embodiment of the present invention is shown;

[0026] Figure 3 A schematic diagram showing a conductive line segment conductively interconnecting a plurality of back-contacted solar cells in an embodiment of the present invention is shown;

[0027] Figure 4 Another production device for a conductive interconnection plate in an embodiment of the present invention is shown;

[0028] Figure 5 A schematic structural diagram of an adsorption thermal pressure head in an embodiment of the present invention is shown;

[0029] Figure 6 A schematic diagram showing heat pressing of a wire segment by a first adsorption heat pressing head and a second adsorption heat pressing head is shown;

[0030] Figure 7 A schematic structural diagram of another adsorption thermal pressure head in an embodiment of the present invention is shown;

[0031] Figure 8 A flow chart showing the steps of a method for producing a conductive interconnect plate of a back contact battery in an embodiment of the present invention is shown.

[0032] Description of the accompanying drawings:

[0033] 1-substrate, 2-workbench, 3-wire segment, 4-support platform, 5-wiring unit, 51-adsorption hot pressing head, 511-hot pressing end surface of the adsorption hot pressing head, 512-first adsorption hot pressing head, 513-second adsorption hot pressing head, 5111-groove, 7-cutting structure, 6-back contact battery cell, 61-negative grid line of the battery cell, 62-positive grid line of the battery cell. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Reference Figure 1 , Figure 1 FIG. 2 shows a production device for a conductive interconnection plate in an embodiment of the present invention. Figure 1 As shown, the production device of the conductive interconnection board may include: a workbench 2 for carrying a substrate 1, a support table 4 for carrying a plurality of wire segments 3, and a wiring unit 5 for sucking the wire segments 3 from the support table 4 and arranging the wire segments 3 on the substrate 1. The number of wire segments is not specifically limited.

[0036] Reference Figure 1 As shown, the wiring unit 5 may include a plurality of adsorption heat-pressing heads 51 for adsorbing the corresponding wire segments 3 and heat-pressing the corresponding wire segments 3 on the substrate 1, and an adsorption component ( Figure 1 The surrounding area of ​​the adsorption component in the adsorption heat pressure head 51 is provided with a heating component ( Figure 1 In the embodiment of the present invention, the number of adsorption thermal pressure heads, the number of adsorption components, and the number of heating components are not specifically limited.

[0037] In the embodiment of the present invention, a heating component is arranged in the surrounding area of ​​the adsorption component in the adsorption hot pressure head 51, thereby limiting the heated area to the surrounding area of ​​the adsorption component. Only the surrounding area of ​​the adsorption component in contact with the substrate will be affected by the heat of the heating component, and the thermal impact on the substrate is small.

[0038] Reference Figure 2 As shown, Figure 2 FIG. 1 is an enlarged schematic diagram of a wiring unit in an embodiment of the present invention. A plurality of adsorption and heat-pressing heads 51 in the wiring unit 5 absorb the corresponding wire segments 3 and heat-press the corresponding wire segments 3 on the substrate 1. The heat-pressing end surface 511 of the adsorption and heat-pressing head 51 is provided with an adsorption component ( Figure 2 The above-mentioned adsorption component can be a vacuum adsorption hole or a suction cup, etc., which is not specifically limited in the embodiment of the present invention. Each adsorption hot pressing head 51 adsorbs at least one wire segment 3, and each heating component heats each adsorbed conductive wire segment. The surrounding area of ​​the adsorption component in the adsorption hot pressing head 51 is provided with a heating component ( Figure 2 not shown).

[0039] Specifically, the adsorption component absorbs the corresponding wire segment to the hot pressing end surface 511 of the hot pressing head 51. The heating component can heat the adsorbed wire segment. After the adsorbed wire segment is heated, the hot pressing end surface 511 of the adsorption hot pressing head 51 hot presses the adsorbed wire segment 3 onto the substrate 1.

[0040] In the embodiment of the present invention, optionally, the hot pressing temperature may be 50-120° C., and the hot pressing time may be 5-30 seconds. Within this temperature range and time range, the reliability of the conductive interconnection board obtained by hot pressing is relatively high.

[0041] A wire segment 3 in the conductive interconnection plate is used to conductively interconnect the positive electrode of one back contact cell and the negative electrode of another adjacent back contact cell, that is, one wire segment conductively interconnects two back contact cells. In the embodiment of the present invention, the back contact cell may be an IBC (Interdigitated Back Contact, interdigitated back contact solar cell), MWT (Metal Wrap Through, metal perforated winding cell), EWT (Emitter Wrap Through, emitter perforated winding cell), etc., and in the embodiment of the present invention, this is not specifically limited.

[0042] In the embodiment of the present invention, refer to Figure 3 As shown, Figure 3 A schematic diagram of a conductive wire segment conductively interconnecting multiple back-contact battery cells in an embodiment of the present invention is shown. 61 can be the negative grid line of the back-contact battery cell 6, 62 can be the positive grid line of the back-contact battery cell 6, and the conductive wire segment 3 conductively interconnects the positive grid line of the first back-contact battery cell and the negative grid line of another back-contact battery cell adjacent to the first back-contact battery cell. Another conductive wire segment 3 conductively interconnects the negative grid line of the second back-contact battery cell and the positive grid line of the third back-contact battery cell adjacent to the second back-contact battery cell, thereby realizing the collection of current between the back-contact battery cells. Figure 3 In the figure, 61 can also be a P-type diffusion region of the back contact cell, 62 can be an N-type diffusion region of the back contact cell, and so on.

[0043] The production device of the conductive interconnection board does not require patterning during the production of the conductive interconnection board, and the material selection of the conductive wire is more than copper, which can reduce the production cost; the formed conductive interconnection board can then be laminated to achieve conductive interconnection between the battery cells, which not only has high production efficiency, but also has less stress on the battery cells and less bending and fragmentation. At the same time, the production device can organically combine the processes of wire segment absorption and hot pressing, realize automated and continuous production, and improve the production efficiency of the conductive interconnection board of the back contact battery.

[0044] Optional, see Figure 4 As shown, Figure 4 Another production device for conductive interconnection plates in an embodiment of the present invention is shown. Figure 1 On the basis of the above, the device may also include a cutting structure 7 for cutting the conductive wire on the support platform 4 to obtain a wire segment. The support platform 4 may be provided with a plurality of conductive wires, and the number of the conductive wires is not specifically limited. The cutting structure 7 cuts the above conductive wires to obtain a plurality of wire segments 3. The production device of the conductive interconnection board can organically combine the processes of cutting, adsorption, hot pressing, etc. of the conductive wire, realize automated and continuous production, and improve the production efficiency of the conductive interconnection board of the back contact battery.

[0045] In the embodiment of the present invention, the material of the wire segment may optionally include: copper, silver, aluminum, nickel, magnesium, iron, titanium, molybdenum, tungsten or at least one of their alloys. For example, the material of the wire segment may be: aluminum or other conductive materials.

[0046] In the embodiment of the present invention, optionally, the wire segment may include a conductive body, the surface of which is coated with a solderability protective coating, thereby facilitating heating and pressing, and the pressing is more reliable.

[0047] In the embodiment of the present invention, optionally, the cross-sectional shape of the guide line segment may be at least one of a circle, a square, an ellipse, a rectangle, a hexagon, an octagon, a trapezoid, and a rhombus.

[0048] In the embodiment of the present invention, optionally, the length of the wire segment may be equal to the sum of the length of the two battery cells and the interval between the two battery cells.

[0049] In the embodiment of the present invention, optionally, refer to Figure 5 As shown, Figure 5 FIG. 5 shows a schematic diagram of the structure of an adsorption heat-pressure head in an embodiment of the present invention. The adsorption heat-pressure head 51 may include a first adsorption heat-pressure head 512 and a second adsorption heat-pressure head 513. Figure 5 The dotted line frame on the left may be the first adsorption hot pressure head 512, and the dotted line frame on the right may be the second adsorption hot pressure head 513. The line segment L1 may indicate the extension direction of the adsorption hot pressure head, and the line segment L2 is perpendicular to L1, and the line segment L2 may indicate the extension direction perpendicular to the adsorption hot pressure head. In the extension direction perpendicular to the adsorption hot pressure head, the first adsorption hot pressure head 512 and the second adsorption hot pressure head 513 are alternately arranged at intervals. The above-mentioned first adsorption hot pressure head 512 can be used to adsorb and hot-press the wire segments of odd rows, and the above-mentioned second adsorption hot pressure head 513 can be used to adsorb and hot-press the wire segments of even rows. The first adsorption hot pressure head 512 and the second adsorption hot pressure head 513 are alternately arranged at intervals, and the wire segments of odd rows and the wire segments of even rows can be adsorbed and hot-pressed at one time, and the production efficiency is high.

[0050] In the embodiment of the present invention, optionally, along the extension direction of the adsorption hot pressure head, the spacing between each first adsorption hot pressure head and the second adsorption hot pressure head can be adjusted, for example, the spacing between the first adsorption hot pressure head and the second adsorption hot pressure head can be adjusted according to actual needs. This is not specifically limited in the embodiment of the present invention.

[0051] In the embodiment of the present invention, all the wire segments hot-pressed by the first adsorption heat-pressing head are parallel and spaced apart along the extension direction of the adsorption heat-pressing head.

[0052] In the embodiment of the present invention, optionally, the first adsorption thermal pressure head and the second adsorption thermal pressure head are fixed by a connecting shaft, and along the extension direction of the adsorption thermal pressure head, the first adsorption thermal pressure head and the second adsorption thermal pressure head are staggered and distributed front and back through the connecting shaft. The distance of the staggered front and back of the first adsorption thermal pressure head and the second adsorption thermal pressure head can be the sum of the length of a battery cell plus the interval between battery cells.

[0053] For example, refer to Figure 6 As shown, Figure 6 The schematic diagram of the hot pressing wire segment by the first adsorption hot pressing head and the second adsorption hot pressing head is shown. The left dotted line frame may be the first adsorption hot pressing head 512, and the right dotted line frame may be the second adsorption hot pressing head 513. Along the extension direction L1 of the adsorption hot pressing head, the first adsorption hot pressing head 512 and the second adsorption hot pressing head 513 are connected by a connecting shaft ( Figure 6 (not shown) are staggered front and back.

[0054] In the embodiment of the present invention, optionally, the material of the substrate may be at least one of polyvinyl butyral (PVB), polyolefin (POE), and ethylene-vinyl acetate copolymer (EVA).

[0055] In the embodiment of the present invention, optionally, on the support table, a plurality of wire segments can be arranged in parallel and spaced apart, and each adsorption and hot-pressing head can be respectively arranged opposite to at least one wire segment. That is to say, before adsorption, the conductive wires are parallel and spaced apart, and each adsorption and hot-pressing head is respectively arranged opposite to at least one wire segment, and then during the adsorption and hot-pressing process, there is no need to adjust the interval between the adsorption and hot-pressing heads, and a plurality of wire segments that are parallel and spaced apart can be conveniently obtained by hot-pressing on the substrate.

[0056] In the embodiment of the present invention, optionally, the number of the first adsorption hot-pressing heads and the number of the second adsorption hot-pressing heads may be equal, or the number of wire segments adsorbed and hot-pressed by each first adsorption hot-pressing head and each second adsorption hot-pressing head at one time may be equal.

[0057] In the embodiment of the present invention, optionally, in the conductive interconnection board, ends of the wire segments in one row correspond to middle positions of the wire segments in an adjacent row.

[0058] In the embodiment of the present invention, optionally, each adsorption heat-pressing head is in the same working state at the same time. Alternatively, each adsorption heat-pressing head is in a different working state at the same time to meet the production needs of different scenarios.

[0059] For example, all the first adsorption heat-pressing heads are in the same working state at the same time, and all the second adsorption heat-pressing heads stop working at this time. After all the first adsorption heat-pressing heads have finished heat-pressing the wire segments, all the second adsorption heat-pressing heads start working, and while all the second adsorption heat-pressing heads are working, all the first adsorption heat-pressing heads stop working.

[0060] For example, the first adsorption heat-pressing head adsorbs and heat-presses the odd-numbered wire segments. After the first adsorption heat-pressing head has finished heat-pressing the wire segments, the second adsorption heat-pressing head starts to heat-press the even-numbered wire segments. Figure 6 As shown, from top to bottom, the first wire segment 3, the third wire segment, the fifth wire segment 31, and the seventh wire segment can all be adsorbed and hot-pressed by the first adsorption and hot-pressing head 512. The first wire segment 3, the third wire segment 3, the fifth wire segment 3, and the seventh wire segment 3, all arranged and pressed by the first adsorption and hot-pressing head 512, are parallel and spaced apart. From top to bottom, the second wire segment 3, the fourth wire segment 3, the sixth wire segment 3, and the eighth wire segment 3 can all be adsorbed and hot-pressed by the second adsorption and hot-pressing head 513.

[0061] In the embodiment of the present invention, the wire segments on the support platform are optionally sorted, and those with odd numbers can be odd-numbered wire segments, and those with even numbers can be even-numbered wire segments. On the support platform, along the extension direction of the adsorption hot pressure head, if the odd-numbered wire segments and the even-numbered wire segments are parallel and evenly distributed, then the first adsorption hot pressure head and the second adsorption hot pressure head can be evenly distributed before the adsorption wire segments, and the first adsorption hot pressure head and the second adsorption hot pressure head are both arranged one by one opposite to the wire segments, and after the adsorption wire segments, before basically hot-pressing the wire segments, the first adsorption hot pressure head and the second adsorption hot pressure head are staggered front and back along the extension direction of the adsorption hot pressure head.

[0062] In an embodiment of the present invention, optionally, on the above-mentioned support table, along the extension direction of the adsorption hot pressure head, if the odd-numbered wire segments and the even-numbered wire segments are parallel and staggered front to back, then the first adsorption hot pressure head and the second adsorption hot pressure head can be parallel and staggered front to back before the adsorption wire segments.

[0063] In the embodiment of the present invention, the adsorption component may be a suction cup or adsorption holes, which are distributed at intervals or continuously on the hot pressing end surface of the adsorption hot pressing head to meet the requirements of different adsorption forces for wire segments of different sizes.

[0064] In the embodiment of the present invention, optionally, if the adsorption component is a suction cup, the position of the suction cup on the hot pressing end surface of the adsorption hot pressing head can be adjusted according to actual needs, which can more flexibly adapt to the requirements of different sizes of wire segments for different adsorption forces.

[0065] In the embodiment of the present invention, optionally, a groove is provided on the hot pressing end surface of the adsorption hot pressing head, and the adsorption component is located in the groove, so that the adsorption component does not occupy excess external space.

[0066] In the embodiment of the present invention, optionally, the length of the groove is greater than or equal to the length of the wire segment, that is, the length of the groove can completely accommodate the wire segment and can relatively firmly adsorb the wire segment.

[0067] For example, refer to Figure 7 , Figure 7 FIG. 5 shows a schematic diagram of the structure of another adsorption hot pressing head in an embodiment of the present invention. A groove 5111 is provided on the hot pressing end surface 511 of the adsorption hot pressing head 51. The length of the groove 5111 is greater than or equal to the length of the wire segment. Figure 7 ) is arranged in groove 5111.

[0068] In the embodiment of the present invention, optionally, the depth of the groove is less than or equal to 2 / 3 of the thickness of the wire segment, so that the wire segment protrudes from the groove, which can not only more firmly and conveniently adsorb the wire segment, but also facilitate the release of the wire segment.

[0069] In an embodiment of the present invention, optionally, the material of the adsorption hot pressing head is selected from graphite or stainless steel, which can conduct the heat generated by the heating component in time, and the adsorption hot pressing head is not easy to deform during the heating process, and at the same time, the cost is low.

[0070] Reference Figure 8 , Figure 8 A flow chart showing the steps of a method for producing a conductive interconnect plate of a back contact battery in an embodiment of the present invention is shown.

[0071] Step 101, providing a workbench with a substrate placed thereon.

[0072] Step 102, providing a support platform on which the wire segments are placed.

[0073] In the embodiment of the present invention, a wiring structure is used to lay a plurality of wire segments on a support platform.

[0074] Step 103: Use a wiring unit to absorb the wire segment from the support platform, and hot-press the absorbed wire segment onto the substrate to form a conductive interconnection board.

[0075] Specifically, the above-mentioned adsorption wiring unit can be used to adsorb the wire segments from the above-mentioned support platform, and each adsorbed wire segment can be hot-pressed on the substrate to form a conductive interconnection board.

[0076] In the embodiment of the present invention, optionally, the material of the substrate may be at least one of polyvinyl butyral (PVB), polyolefin (POE), and ethylene-vinyl acetate copolymer (EVA).

[0077] In the embodiment of the present invention, the material of the wire segment may optionally include: copper, silver, aluminum, nickel, magnesium, iron, titanium, molybdenum, tungsten or at least one of their alloys. For example, the material of the wire segment may be: aluminum or other conductive materials.

[0078] In the embodiment of the present invention, optionally, the wire segment may include a conductive body, the surface of which is coated with a solderability protective coating, thereby facilitating rolling and providing more reliable pressing.

[0079] In the embodiment of the present invention, optionally, the cross-sectional shape of the wire segment may be at least one of a circle, a square, an ellipse, a rectangle, a hexagon, an octagon, a trapezoid, and a rhombus.

[0080] In the embodiment of the present invention, optionally, the hot pressing temperature may be 50-120° C., and the hot pressing time may be 5-30 seconds. Within this temperature range and time range, the reliability of the conductive interconnection board obtained by hot pressing is relatively high.

[0081] It should be noted that, for the method embodiment, reference may also be made to the relevant records of the production device of the interconnection board of the aforementioned back contact battery. In order to avoid repetition, it will not be described again here.

[0082] In the embodiment of the present invention, the production device of the conductive interconnection board does not need patterning during the production of the conductive interconnection board, and the material selection of the conductive wire is more, not limited to copper, which can reduce the production cost; the formed conductive interconnection board can then be laminated to achieve conductive interconnection between battery cells, which not only has high production efficiency, but also has less stress on the battery cells and less bending and breaking. At the same time, the production device can organically combine the processes of wire segment absorption and hot pressing, realize automated and continuous production, and improve the production efficiency of the conductive interconnection board of the back contact battery.

[0083] It should be noted that, for the sake of simplicity, the method embodiments are described as a series of action combinations, but those skilled in the art should be aware that the embodiments of the present invention are not limited by the order of the actions described, because according to the embodiments of the present invention, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by the embodiments of the present invention.

[0084] In an embodiment of the present invention, a conductive interconnection plate of a back contact battery is also provided. The conductive interconnection plate can be produced by the aforementioned production method of the conductive interconnection plate of the back contact battery. The conductive interconnection plate can refer to the aforementioned related records and has the same or similar beneficial effects. In order to avoid repetition, it will not be described here.

[0085] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A production device for a conductive interconnection plate of a back contact battery, characterized in that: It includes a workbench for carrying a substrate, a support table for carrying a plurality of wire segments, and a wiring unit for sucking the wire segments from the support table and laying the wire segments on the substrate; The wiring unit includes a plurality of adsorption heat-pressing heads for absorbing the corresponding wire segments and hot-pressing the corresponding wire segments onto the substrate, an adsorption component is arranged on the hot-pressing end surface of the adsorption heat-pressing head, a heating component is arranged on the surrounding area of ​​the adsorption component in the adsorption heat-pressing head, a groove is arranged on the hot-pressing end surface of the adsorption heat-pressing head, the adsorption component is located in the groove, the length of the groove is greater than or equal to the length of the wire segment, and the depth of the groove is less than or equal to 2 / 3 of the thickness of the wire segment.

2. The device according to claim 1, characterized in that The adsorption thermal pressure head comprises a first adsorption thermal pressure head and a second adsorption thermal pressure head; in an extension direction perpendicular to the adsorption thermal pressure head, the first adsorption thermal pressure head and the second adsorption thermal pressure head are alternately arranged at intervals.

3. The device according to claim 2, characterized in that The first adsorption hot pressure head and the second adsorption hot pressure head are fixed by a connecting shaft, and along the extension direction of the adsorption hot pressure head, the first adsorption hot pressure head and the second adsorption hot pressure head are staggered and distributed front and back by the connecting shaft.

4. The device according to claim 1, characterized in that The adsorption component is a suction cup or an adsorption hole, and the suction cup or the adsorption hole is distributed at intervals or continuously on the hot pressing end surface of the adsorption hot pressing head.

5. The device according to claim 1, characterized in that The device also includes: a cutting mechanism for cutting the conductive wire on the support platform to obtain the conductive wire segment.

6. The device according to claim 1, characterized in that The material of the adsorption hot pressure head is selected from graphite or stainless steel.

7. A method for producing a conductive interconnection plate for a back contact battery, characterized in that: The steps include: providing a workbench on which a substrate is placed; providing a support table on which the conductor segments are placed; The wire segments are adsorbed from the support table by a wiring unit, and the adsorbed wire segments are hot-pressed onto the substrate to form a conductive interconnection board; the wiring unit comprises a plurality of adsorption and hot-pressing heads for adsorbing the corresponding wire segments and hot-pressing the corresponding wire segments onto the substrate, an adsorption component is arranged on the hot-pressing end surface of the adsorption and hot-pressing head, a groove is arranged on the hot-pressing end surface of the adsorption and hot-pressing head, the adsorption component is located in the groove, the length of the groove is greater than or equal to the length of the wire segment, and the depth of the groove is less than or equal to 2 / 3 of the thickness of the wire segment.

8. The method according to claim 7, characterized in that The hot pressing temperature is 50-120° C., and the hot pressing time is 5-30 seconds.

9. The method according to claim 7, characterized in that: The wire segment comprises a conductive body; a surface of the conductive body is coated with a solderability protective coating.

10. The method according to claim 7, characterized in that The material of the conductor segment includes: at least one of copper, silver, aluminum, nickel, magnesium, iron, titanium, molybdenum, tungsten or an alloy thereof.

11. A conductive interconnection plate for a back contact battery, characterized in that: The conductive interconnect plate of the back contact battery is produced by the production method of any one of claims 7 to 10.

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