NOx sensor chip

Abstract

The present invention relates to a nitrogen oxygen sensor chip, comprising: a first pad, a second pad, a third pad, and a fourth pad, a fifth pad, and a sixth pad, respectively arranged on two opposite surfaces of the nitrogen oxygen sensor chip; the nitrogen oxygen sensor chip also comprises: an outer electrode connected to the fifth pad; a first inner electrode connected to the first pad; a second inner electrode connected to the second pad; a third inner electrode connected to the third pad; a reference electrode connected to the fourth pad; and a heating electrode connected to the fifth pad and the sixth pad; wherein the fifth pad is connected to a ground terminal. Compared with a conventional 8-wire nitrogen oxygen sensor chip, the above-mentioned nitrogen oxygen sensor chip has a simpler structure and lower cost.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and in particular to a chip of a nitrogen oxygen sensor. Background Art

[0002] Traditional nitrogen oxide sensor chips all have 8 lines and a relatively complex structure, so their preparation difficulty and material cost are high. Summary of the invention

[0003] Based on this, it is necessary to provide a nitrogen oxygen sensor chip to address the above problems.

[0004] A nitrogen oxide sensor chip, comprising: a first pad, a second pad, a third pad, a fourth pad, a fifth pad, and a sixth pad, respectively arranged on two opposite surfaces of the nitrogen oxide sensor chip;

[0005] The chip of the nitrogen oxygen sensor also includes:

[0006] an external electrode connected to the fifth pad;

[0007] a first inner electrode connected to the first pad;

[0008] a second inner electrode connected to the second pad;

[0009] a third inner electrode connected to the third pad;

[0010] a reference electrode connected to the fourth pad; and

[0011] A heating electrode connected to the fifth pad and the sixth pad;

[0012] Wherein, the fifth pad is connected to the ground terminal.

[0013] In one embodiment, it further includes a substrate, wherein the substrate includes a first substrate, a second substrate, a third substrate, a fourth substrate, a fifth substrate, a sixth substrate, a seventh substrate, and an eighth substrate;

[0014] The first substrate, the outer electrode, the second substrate, the third substrate, the first inner electrode, the fourth substrate, the third inner electrode, the fifth substrate, the reference electrode, the sixth substrate, the heating electrode, the seventh substrate and the eighth substrate are arranged in sequence;

[0015] The first internal electrode and the second internal electrode are both disposed on the fifth substrate.

[0016] In one embodiment, the areas of the first substrate and the eighth substrate are smaller than the areas of the second substrate, the third substrate, the fourth substrate, the fifth substrate, the sixth substrate and the seventh substrate to expose the first pad, the second pad, the third pad, the fourth pad, the fifth pad and the sixth pad.

[0017] In one embodiment, the substrate is made of YSZ ceramic sheet material.

[0018] In one embodiment, the thickness of the first substrate, the second substrate, the third substrate, the fourth substrate, the fifth substrate, the sixth substrate, the seventh substrate and the eighth substrate are all in the range of 150-180 μm.

[0019] In one embodiment, four adjacent cavities are formed on the fourth substrate, which serve as an air inlet chamber, a buffer chamber, a first working chamber, and a second working chamber, respectively.

[0020] In one embodiment, the outer electrode is connected to an outer electrode lead, the first inner electrode is connected to a first inner electrode lead, the second inner electrode is connected to a second inner electrode lead, the third inner electrode is connected to a third inner electrode lead, and the reference electrode is connected to a reference electrode lead;

[0021] An insulating layer is disposed around the outer electrode lead, the first inner electrode lead, the second inner electrode lead, the third inner electrode lead, the reference electrode lead and the heating electrode.

[0022] In one embodiment, the first pad, the second pad, the third pad, the fourth pad, the fifth pad and the sixth pad are correspondingly provided with insulating pads.

[0023] In one embodiment, the insulating layer between the heating electrode and the seventh substrate, the seventh insulating layer and the eighth insulating layer are all provided with relative conductive holes, and the heating electrode is connected to the fifth pad and the sixth pad through the conductive holes.

[0024] In one embodiment, the external electrode is connected to the fifth pad through a side opening of the chip of the nitrogen oxygen sensor;

[0025] The first inner electrode is connected to the first pad through a side opening of the chip of the nitrogen oxygen sensor;

[0026] The second inner electrode is connected to the second pad by coating the electrode paste on the side of the chip of the nitrogen oxygen sensor;

[0027] The third inner electrode is connected to the third pad by coating the electrode paste on the side of the chip of the nitrogen oxygen sensor;

[0028] The reference electrode is connected to the fourth pad by coating the electrode paste on the side of the chip of the nitrogen oxygen sensor.

[0029] The heating electrode and the external electrode in the above-mentioned nitrogen oxygen sensor chip share a ground wire, and the leads of the six electrodes are respectively led out through six pads to form a 6-wire structure nitrogen oxygen sensor chip. Compared with the traditional 8-wire nitrogen oxygen sensor chip, the structure is simpler and the cost is lower. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 FIG. 4 is an exploded view of a chip of a nitrogen oxide sensor in an embodiment. DETAILED DESCRIPTION

[0031] The specific implementation modes of the present invention will be further described below in conjunction with the accompanying drawings.

[0032] See also Figure 1 The present application provides a nitrogen oxide sensor chip, which has a 6-wire structure, making it simpler in structure than a traditional 8-wire nitrogen oxide sensor chip, thereby reducing the difficulty of preparation and lowering the cost.

[0033] The chip 100 of the nitrogen oxygen sensor includes a first pad 111, a second pad 112, a third pad 113, and a fourth pad 114, a fifth pad 115, and a sixth pad 116, which are respectively arranged on two opposite surfaces of the chip 100 of the nitrogen oxygen sensor. The chip 100 of the nitrogen oxygen sensor also includes an external electrode 121, a first internal electrode 122, a second internal electrode 123, a third internal electrode 124, a reference electrode 125, and a heating electrode 126. Among them, the external electrode 121 is connected to the fifth pad 115. The first internal electrode 122 is connected to the first pad 111. The second internal electrode 122 is connected to the second pad 112. The third internal electrode 124 is connected to the third pad 113. The reference electrode 125 is connected to the fourth pad 114. The heating electrode 126 is connected to the fifth pad 115 and the sixth pad 116. The fifth pad 115 is connected to the ground terminal, that is, the heating electrode 126 and the external electrode 121 share the ground terminal, so that the leads of the six electrodes are led out through the six pads, thereby forming a six-wire nitrogen oxygen sensor chip 100.

[0034] In one embodiment, the chip 100 of the nitrogen oxygen sensor selectively includes a substrate and an insulating layer 140. The substrate may be made of YSZ (yttria-stabilized zirconia) ceramic sheet material. The thickness of each substrate may be set to 150 to 180 μm. The insulating layer 140 may be arranged around the outer electrode 121, the first inner electrode 122, the second inner electrode 123, the third inner electrode 124, the reference electrode 125, and the heating electrode 126.

[0035] Specifically, the substrate includes a first substrate 131, a second substrate 132, a third substrate 133, a fourth substrate 134, a fifth substrate 135, a sixth substrate 136, a seventh substrate 137 and an eighth substrate 138. The first substrate 131, the outer electrode 121, the second substrate 132, the third substrate 133, the first inner electrode 122, the fourth substrate 134, the third inner electrode 124, the fifth substrate 135, the reference electrode 125, the sixth substrate 136, the heating electrode 126, the seventh substrate 137 and the eighth substrate 138 are stacked in sequence. Among them, the first inner electrode 122 and the second inner electrode 123 are both arranged on the fifth substrate 135. Four adjacent cavities are opened on the fourth substrate 134, which are the air inlet chamber 151, the buffer chamber 152, the first working chamber 153 and the second working chamber 154.

[0036] In this embodiment, since the first pads 111, the second pads 112, and the third pads 113 on the upper surface need to be exposed, the area of ​​the first substrate 131 located on the upper surface of the first pads 111, the second pads 112, and the third pads 113 needs to be smaller than the area of ​​other substrate layers. The other substrate layers refer to the second substrate 132, the third substrate 133, the fourth substrate 134, the fifth substrate 135, the sixth substrate 136, the seventh substrate 137, and the eighth substrate 128.

[0037] Exemplarily, the outer electrode 121 is connected to the fifth pad 115 by coating the electrode paste through the side of the nitrogen oxygen sensor chip 100 using the outer electrode lead 161; the first inner electrode 122 is connected to the first pad 111 by coating the electrode paste through the side opening of the nitrogen oxygen sensor chip 100 using the first inner electrode lead 162; the second inner electrode 123 is connected to the second pad 112 by coating the electrode paste through the side of the nitrogen oxygen sensor chip 100 using the second inner electrode lead 163; the third inner electrode 124 is connected to the third pad 113 by coating the electrode paste through the side of the nitrogen oxygen sensor chip using the third inner electrode lead 164; the reference electrode 125 is connected to the fourth pad 114 by coating the electrode paste through the side of the nitrogen oxygen sensor chip using the reference electrode lead 165. Relative conductive holes are provided on the insulating layer 140 between the heating electrode 126 and the seventh substrate 137 , the seventh substrate 137 and the eighth substrate 128 , so that two leads of the heating electrode 126 are connected to the fifth pad 115 and the sixth pad 116 respectively through the conductive holes.

[0038] The upper and lower layers of the outer electrode lead 161, the first inner electrode lead 162, the second inner electrode lead 163, the third inner electrode lead 164, the reference electrode lead 165 and the heating electrode 126 are all provided with an insulating layer 140, so that the insulating layer 140 can be wrapped around each electrode lead to achieve a better insulation effect. The shape of each insulating layer 140 can be set according to the shape of the corresponding electrode lead. It should be noted that since the distance between the two leads of the heating electrode 126 is small, the insulating layer 140 of the upper and lower layers of the heating electrode 126 is usually directly set to a plate-like structure, and two layers of insulating layers 140 can be set on the upper and lower layers of the heating electrode to achieve a better insulation effect. In addition, the insulating layer 140 on the upper layer of the outer electrode 121 cannot hinder the lead-out of the first pad 111, the second pad 112 and the third pad 113.

[0039] Among them, the first internal electrode 122 and the second internal electrode 123 are also partially located on the fifth substrate 135. The first internal electrode 122 located on the fifth substrate 135 and the first internal electrode 122 located on the fourth substrate 134 can be connected as a whole through the side coating of the first working chamber 153. The second internal electrode 123 located on the fifth substrate 135 and the second internal electrode 123 located on the fourth substrate 134 can be connected as a whole through the side coating of the second working chamber 154.

[0040] Furthermore, the first pad 111 , the second pad 112 , the third pad 113 , the fourth pad 114 , the fifth pad 115 and the sixth pad 116 are correspondingly provided with insulating pads 142 , and the shape of the insulating pads 142 can be set according to the shape of each pad.

[0041] The heating electrode 126 and the external electrode 121 in the above-mentioned nitrogen oxygen sensor chip 100 share a ground wire, and the leads of the six electrodes are respectively led out through six pads to form a six-wire structure of the nitrogen oxygen sensor chip 100. Compared with the traditional eight-wire nitrogen oxygen sensor chip, the structure is simpler and the cost is lower.

Claims

1. A chip of a nitrogen oxygen sensor, characterized in that: include: A first pad, a second pad, a third pad, a fourth pad, a fifth pad, and a sixth pad are respectively arranged on two opposite surfaces of the chip of the nitrogen oxide sensor; The chip of the nitrogen oxygen sensor also includes: an external electrode connected to the fifth pad; a first inner electrode connected to the first pad; a second inner electrode connected to the second pad; a third inner electrode connected to the third pad; a reference electrode connected to the fourth pad; and A heating electrode connected to the fifth pad and the sixth pad; Wherein, the fifth pad is connected to the ground terminal; The nitrogen oxygen sensor chip further includes a substrate, and the substrate includes a first substrate, a second substrate, a third substrate, a fourth substrate, a fifth substrate, a sixth substrate, a seventh substrate, and an eighth substrate; The first substrate, the outer electrode, the second substrate, the third substrate, the first inner electrode, the fourth substrate, the third inner electrode, the fifth substrate, the reference electrode, the sixth substrate, the heating electrode, the seventh substrate and the eighth substrate are stacked in sequence; wherein the first internal electrode and the second internal electrode are both disposed on the fifth substrate; The fourth substrate is provided with four adjacent cavities, which serve as an air inlet chamber, a buffer chamber, a first working chamber, and a second working chamber respectively; The outer electrode is connected to an outer electrode lead, the first inner electrode is connected to a first inner electrode lead, the second inner electrode is connected to a second inner electrode lead, the third inner electrode is connected to a third inner electrode lead, and the reference electrode is connected to a reference electrode lead; The outer electrode lead, the first inner electrode lead, the second inner electrode lead, the third inner electrode lead, the reference electrode lead and the heating electrode are all provided with an insulating layer around them; The insulating layer between the heating electrode and the seventh substrate, the seventh substrate and the eighth substrate are all provided with opposite conductive holes, and the heating electrode is connected to the fifth pad and the sixth pad through the conductive holes; The outer electrode is coated with electrode paste on the side of the chip of the nitrogen oxygen sensor to be connected with the fifth pad; The first inner electrode is connected to the first pad by coating the electrode paste on the side of the chip of the nitrogen oxygen sensor; The second inner electrode is connected to the second pad by coating the electrode paste on the side of the chip of the nitrogen oxygen sensor; The third inner electrode is connected to the third pad by coating the electrode paste on the side of the chip of the nitrogen oxygen sensor; The reference electrode is connected to the fourth pad by coating the electrode paste on the side of the chip of the nitrogen oxygen sensor.

2. The nitrogen oxygen sensor chip according to claim 1, characterized in that: The areas of the first substrate and the eighth substrate are smaller than those of the second substrate, the third substrate, the fourth substrate, the fifth substrate, the sixth substrate and the seventh substrate to expose the first pad, the second pad, the third pad, the fourth pad, the fifth pad and the sixth pad.

3. The nitrogen oxygen sensor chip according to claim 2, characterized in that: The substrate is made of YSZ ceramic sheet material.

4. The nitrogen oxygen sensor chip according to claim 3, characterized in that: The thickness of the first substrate, the second substrate, the third substrate, the fourth substrate, the fifth substrate, the sixth substrate, the seventh substrate and the eighth substrate all range from 150 to 180 μm.

5. The nitrogen oxygen sensor chip according to claim 4, characterized in that: The first pad, the second pad, the third pad, the fourth pad, the fifth pad and the sixth pad are correspondingly provided with insulating pads.

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