Nitrogen oxygen sensor chip clamping equipment and side coating equipment

Abstract

The present invention relates to a clamping device and a side coating device for a nitrogen oxygen sensor chip, comprising: a plurality of first workpieces, a plurality of second workpieces and a third workpiece, wherein the first workpieces and the second workpieces are arranged in an alternating manner and the height of the second workpieces is less than the height of the first workpieces to form a clamping gap between two adjacent first workpieces, and the third workpiece is used to fix the first workpiece and the second workpiece. The clamping device and the side coating device for the nitrogen oxygen sensor chip can accommodate the nitrogen oxygen sensor in the clamping gap to achieve clamping of the nitrogen oxygen sensor, and the number of the first workpiece and the second workpiece can be set according to the number of nitrogen oxygen sensors that need to be clamped at the same time, so that it is easy to perform a side coating process on multiple nitrogen oxygen sensors, realize mass production of nitrogen oxygen sensors, and improve production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of sensor equipment, and in particular to a clamping device for a nitrogen oxygen sensor chip and a side coating device for a nitrogen oxygen sensor chip. Background Art

[0002] In recent years, the application of nitrogen oxide sensors has become more and more extensive, so the professional production equipment of nitrogen oxide sensors has become more and more important. Due to the complexity of the circuit of the nitrogen oxide sensor, it is difficult to achieve the full lead-out of the electrodes simply by conducting through the holes. Part of the circuit needs to go on the side of the nitrogen oxide sensor chip, and the traditional nitrogen oxide sensor equipment cannot effectively clamp multiple nitrogen oxide sensor chips to coat the sides of these nitrogen oxide sensor chips, making it impossible to mass-produce nitrogen oxide sensor chips. Summary of the invention

[0003] Based on this, it is necessary to provide a clamping device for a nitrogen oxide sensor chip and a side coating device for a nitrogen oxide sensor chip to address the above problems.

[0004] A clamping device for a nitrogen oxygen sensor chip comprises: a plurality of first workpieces, a plurality of second workpieces and a third workpiece, wherein the first workpieces and the second workpieces are arranged alternately and the height of the second workpieces is smaller than the height of the first workpieces to form a clamping gap between two adjacent first workpieces, and the third workpiece is used to fix the first workpieces and the second workpieces.

[0005] In one embodiment, the distance between two adjacent first workpieces is equal to the thickness of the second workpiece.

[0006] In one embodiment, the first workpiece and / or the second workpiece is a cuboid.

[0007] In one embodiment, the corners of the cuboid are chamfered.

[0008] In one embodiment, the chamfer has a size of 0.5*45°.

[0009] In one embodiment, the bottom end surface of the first workpiece and the bottom end surface of the second workpiece are coplanar.

[0010] In one embodiment, two end surfaces of the first workpiece that are perpendicular to the bottom end surface are coplanar with two end surfaces of the second workpiece that are perpendicular to the bottom end surface, respectively.

[0011] In one embodiment, the difference between the first workpiece height and the second workpiece height is greater than half of the height of the nitrogen oxide sensor chip.

[0012] In one embodiment, the first workpiece and the second workpiece are provided with oppositely located through holes, and the third workpiece includes nuts and bolts, and the nuts and bolts are used to fix the first workpiece and the second workpiece through the through holes.

[0013] A side coating device for a nitrogen oxide sensor chip comprises any one of the above-mentioned clamping devices and a silicone pad printing head, wherein the silicone pad printing head is used for coating the side of the nitrogen oxide sensor chip clamped by the clamping device.

[0014] The above-mentioned clamping device and the side coating device of the nitrogen oxide sensor chip include a plurality of first workpieces, a plurality of second workpieces and a third workpiece. The third workpiece is used to fix the staggered first workpieces and the second workpieces. Since the height of the second workpiece is less than the height of the first workpiece to form a clamping gap between two adjacent first workpieces, the nitrogen oxide sensor is accommodated in the clamping gap to achieve the clamping of the nitrogen oxide sensor. The number of the first workpiece and the second workpiece can be set according to the number of nitrogen oxide sensors that need to be clamped at the same time, so that the side coating process of multiple nitrogen oxide sensors is easy to perform, and the batch production of nitrogen oxide sensors is realized, and the production efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional diagram of a clamping device in an embodiment clamping a nitrogen oxygen sensor chip;

[0016] Figure 2 for Figure 1 Front view in the embodiment;

[0017] Figure 3 for Figure 1 Left view in the embodiment;

[0018] Figure 4 for Figure 1 A top view of the embodiment;

[0019] Figure 5 is a three-dimensional diagram of a clamping device in one embodiment;

[0020] Figure 6 for Figure 5 Front view in the embodiment;

[0021] Figure 7 for Figure 5 Left view in the embodiment;

[0022] Figure 8 for Figure 5 A top view of the embodiment;

[0023] Fig. 9 is a front view of a first workpiece in one embodiment;

[0024] Fig.10 is a left side view of a first workpiece in one embodiment;

[0025] Fig.11 is a front view of a second workpiece in one embodiment;

[0026] Fig.12 It is a left side view of the second workpiece in one embodiment. DETAILED DESCRIPTION

[0027] The specific implementation modes of the invention will be further described below in conjunction with the accompanying drawings.

[0028] See also Figures 1 to 12 The present application provides a nitrogen oxygen sensor chip clamping device (hereinafter referred to as the clamping device) for clamping multiple nitrogen oxygen sensor chips at the same time to coat their sides, so that the nitrogen oxygen sensor chips can be mass-produced and the production efficiency can be improved.

[0029] See also Figures 1 to 8 The clamping device 100 includes a plurality of first workpieces 110, a plurality of second workpieces 120, and a third workpiece (not shown in the figure). The first workpieces 110 and the second workpieces 120 are arranged alternately and the height of the second workpieces 120 is smaller than the height of the first workpieces 110 to form a clamping gap 130 between two adjacent first workpieces 110, and the third workpiece is used to fix the first workpieces 110 and the second workpieces 120.

[0030] Exemplarily, when the first workpiece 110 and the second workpiece 120 are arranged in an interlaced manner, the adjacent surfaces of the first workpiece 110 and the second workpiece 120 are arranged close to each other, so that the distance between the two adjacent first workpieces 110 is equal to the thickness of the second workpiece 120. Since the height of the second workpiece 120 is less than the height of the first workpiece 110, a clamping gap 130 is formed between the two adjacent first workpieces 110. In this embodiment, the thickness of the clamping gap 130 is at least greater than the thickness of the nitrogen oxygen sensor chip 200, that is, the thickness of the second workpiece 120 is greater than the thickness of the nitrogen oxygen sensor chip 200, so that the clamping gap 130 can accommodate the nitrogen oxygen sensor chip 200. For example, when the thickness of the nitrogen oxygen sensor chip 200 is 1.75 mm, the thickness of the second workpiece 120 can be set to 1.8 mm, so that the clamping gap 130 has a certain margin to easily place the nitrogen oxygen sensor chip 200, but can clamp the nitrogen oxygen sensor chip 200. The number of the first workpiece 110 and the second workpiece 120 can be set according to the number of nitrogen oxygen sensor chips 200 that need to be clamped.

[0031] In one embodiment, see Figures 9 to 12The first workpiece 110 and / or the second workpiece 120 is a cuboid, which simplifies the process of producing the first workpiece 110 and the second workpiece 120. Furthermore, the corners of the cuboid are chamfered, for example, the size of each chamfer is 0.5*45°, so that the corners of the clamping device are more rounded, and it is not easy to scratch the nitrogen oxygen sensor chip 200 during the production and processing of the nitrogen oxygen sensor chip 200.

[0032] In one embodiment, the bottom end surface of the first workpiece 110 is coplanar with the bottom end surface of the second workpiece 120. Further, the two end surfaces of the first workpiece 110 perpendicular to the bottom end surface are coplanar with the two end surfaces of the second workpiece 120 perpendicular to the bottom end surface, respectively. In this embodiment, the second workpiece 120 and the first workpiece 110 are assembled more tightly to form a more stable structure.

[0033] Furthermore, the difference between the height of the first workpiece 110 and the height of the second workpiece 120 is greater than half of the height of the nitrogen oxide sensor chip 200, that is, the height of the clamping gap 130 can be at least greater than half of the height of the nitrogen oxide sensor chip 200, and it is not easy to cause the nitrogen oxide sensor chip 200 to fall off during the clamping process. For example, the height of the nitrogen oxide sensor chip 200 is 5.40 mm, the height of the first workpiece 110 is 15 mm, and the height of the second workpiece 120 is 10 mm. The height of the nitrogen oxide sensor chip 200 is higher than 0.40 mm of the height of the clamping gap 130.

[0034] In one embodiment, the first workpiece 110 and the second workpiece 120 are provided with opposite through holes 140. The third workpiece includes nuts and bolts, which are used to fix the first workpiece 110 and the second workpiece 120 through the through holes 140 to tighten the clamping gap 130 between two adjacent first workpieces 110.

[0035] The present application also provides a side coating device for a nitrogen oxygen sensor chip. The side coating device for the nitrogen oxygen sensor chip includes a clamping device 100 and a silicone pad printing head as described in any of the above embodiments. The silicone pad printing head is used to perform side coating on the nitrogen oxygen sensor chip 200 clamped by the clamping device, thereby achieving the simultaneous side coating of multiple nitrogen oxygen sensor chips 200 to achieve batch production of nitrogen oxygen sensor chips 200. Specifically, during the side coating process, the silicone pad printing head is used to transfer platinum paste to the side of the nitrogen oxygen sensor chip 200 to achieve the conduction of the internal leads of the nitrogen oxygen sensor chip 200. After the transfer is completed, the clamping device 100 and the nitrogen oxygen sensor chip 200 clamped by it are sent to the oven for drying. After drying, the reverse side of the nitrogen oxygen sensor chip 200 is transferred.

[0036] The above-mentioned clamping device 100 and the side coating device of the nitrogen oxygen sensor chip include a plurality of first workpieces 110, a plurality of second workpieces 120 and a third workpiece. The third workpiece is used to fix the staggered first workpieces 110 and the second workpieces 120. Since the height of the second workpiece 120 is less than the height of the first workpiece 110 to form a clamping gap 130 between two adjacent first workpieces 110, the nitrogen oxygen sensor is accommodated in the clamping gap 130 to achieve clamping of the nitrogen oxygen sensor. The number of the first workpiece 110 and the second workpiece 120 can be set according to the number of nitrogen oxygen sensors that need to be clamped at the same time, so that the side coating process of multiple nitrogen oxygen sensors is easy to perform, and the batch production of nitrogen oxygen sensors is realized, and the production efficiency is improved.

Claims

1. A clamping device for a nitrogen and oxygen sensor chip, It is characterized in that include: A plurality of first workpieces, a plurality of second workpieces and a third workpiece, wherein the first workpieces and the second workpieces are arranged alternately and the height of the second workpieces is smaller than the height of the first workpieces to form a clamping gap between two adjacent first workpieces, and the third workpiece is used to fix the first workpieces and the second workpieces; The distance between two adjacent first workpieces is equal to the thickness of the second workpiece; the first workpiece and the second workpiece are rectangular parallelepipeds; the corners of the rectangular parallelepipeds are chamfered; the bottom end surface of the first workpiece and the bottom end surface of the second workpiece are coplanar; The difference between the height of the first workpiece and the height of the second workpiece is greater than half the height of the nitrogen oxygen sensor chip; The first workpiece and the second workpiece are provided with through holes which are opposite to each other, and the third workpiece includes nuts and bolts, and the nuts and bolts are used to fix the first workpiece and the second workpiece through the through holes; When the first workpiece and the second workpiece are arranged alternately, the adjacent surfaces of the first workpiece and the second workpiece are arranged close to each other, so that the distance between the two adjacent first workpieces is equal to the thickness of the second workpiece, and because the height of the second workpiece is less than the height of the first workpiece, the thickness of the clamping gap formed between the two adjacent first workpieces is at least greater than the thickness of the nitrogen oxygen sensor chip, and the thickness of the second workpiece is greater than the thickness of the nitrogen oxygen sensor chip, so that the clamping gap can accommodate the nitrogen oxygen sensor chip; The thickness of the nitrogen oxide sensor chip is 1.75 mm, and the thickness of the second workpiece is set to 1.8 mm, so that the clamping gap has a margin for placing the nitrogen oxide sensor chip, but can clamp the nitrogen oxide sensor chip; the number of the first workpiece and the second workpiece is set according to the number of nitrogen oxide sensor chips that need to be clamped; The height of the nitrogen oxide sensor chip is 5.40 mm, the height of the first workpiece is 15 mm, the height of the second workpiece is 10 mm, and the height of the nitrogen oxide sensor chip is 0.40 mm higher than the clamping gap height.

2. A side coating device for nitrogen and oxygen sensor chips, It is characterized in that It comprises the clamping device as claimed in claim 1 and a silicone pad printing head, wherein the silicone pad printing head is used to coat the side of the nitrogen oxygen sensor chip clamped by the clamping device.

Images