Pressure sensor components and electronic devices

Abstract

The present invention relates to a pressure sensor assembly and an electronic device. The pressure sensor assembly includes a circuit layer, a connector and at least one strain sensing element. The connector includes at least two first bending sections and at least one second bending section, two adjacent first bending sections are connected by the second bending section, the second bending section and the first bending section are protruded in opposite directions and there is a gap between the two adjacent first bending sections. The circuit layer is arranged on the connector and is used to electrically connect a pressure detection device. The strain sensing element is arranged on the circuit layer and is electrically connected to the circuit layer, and the strain sensing element can be deformed and produce a change in resistance when subjected to force. The connector can withstand the deformation of the shell caused by pressing, and the force transmission effect of the connector and the circuit layer can cause the strain sensing element to produce a change in resistance, thereby forming pressure sensing of the shell, avoiding the need to provide physical buttons and mounting grooves on the shell, and simplifying the shell structure.

Description

Technical Field

[0001] The present invention relates to the technical field of pressure sensing devices, and in particular to a pressure sensor assembly and electronic equipment. Background Art

[0002] In electronic devices, such as mobile phones, full screens are the trend, and physical buttons are replaced by virtual buttons. However, in electronic devices, many operations cannot be realized by touch operation in the screen-off state for the time being, so physical buttons are still set in electronic devices, such as screen wake-up buttons, which wake up the screen and then perform touch operations. However, physical buttons usually include a press key located outside the electronic device housing and a pressure sensor located inside the electronic device housing, and the pressure sensor is directly acted on by the press key, thereby triggering pressure sensing. The structure of this physical button requires complex button installation slots to be opened on the electronic device housing, which leads to a complex housing structure. Summary of the invention

[0003] Based on this, it is necessary to provide a pressure sensor assembly and an electronic device to address the problem that the electronic device housing structure is complicated due to the provision of physical buttons in the electronic device.

[0004] In order to solve the above technical problems, the present invention provides a pressure sensor assembly, the pressure sensor assembly comprising: a circuit layer, a connecting member and at least one strain sensing member;

[0005] The connecting member comprises at least two first bending segments and at least one second bending segment, two adjacent first bending segments are connected by the second bending segment, the second bending segment and the first bending segment are protruded in opposite directions and there is a gap between the two adjacent first bending segments;

[0006] The circuit layer is arranged on the connecting member and is used for electrically connecting to the pressure detection device;

[0007] The strain sensing component is arranged on the circuit layer and is electrically connected to the circuit layer, and the strain sensing component can be deformed and produce resistance value changes when subjected to force.

[0008] In the pressure sensor assembly of the present invention, when the pressure sensor assembly is specifically applied to the housing of an electronic device, the connector is arranged in the housing and attached to the inner surface of the housing corresponding to the key area, or abuts against the inner surface of the housing corresponding to the key area. When the key area of ​​the housing is pressed, the key area undergoes elastic deformation, thereby transferring the pressure to the connector. The connector bears the pressure and deforms to drive the strain sensing part to deform and thereby produce a change in resistance. By utilizing the pressure sensor assembly of this embodiment, the housing can transfer the pressure acting on the surface of the housing to the inside of the housing in the absence of a physical button. Therefore, it is possible to avoid providing a physical button and a mounting groove for installing the physical button on the housing, simplifying the housing structure and improving the waterproof and dustproof performance of the electronic device.

[0009] In one embodiment, the circuit layer is connected to at least two of the first bending segments.

[0010] In one embodiment, the strain sensing element is disposed between at least two of the first bending segments.

[0011] In one of the embodiments, at least one of the first bending sections is provided with a first supporting block, and the circuit layer is connected to the first bending section via the first supporting block.

[0012] In one of the embodiments, at least one of the second bending segments is provided with a second support block, and the second support block is used to be connected to an external support.

[0013] In one embodiment, the circuit layer is arranged around the connecting member, and the circuit layer includes a first section and a second section arranged opposite to the first section; the first bending section abuts or is connected to the first section, and the second bending section abuts or is connected to the second section, and the strain sensing member is arranged in at least one of the first section and the second section.

[0014] In one embodiment, the first bending section is provided with a third support block, and the third support block is abutted against or connected to the first section.

[0015] In one embodiment, the second bending section is provided with a fourth support block, and the fourth support block is abutted against or connected to the second section.

[0016] In one embodiment, the strain sensing element is a micro-electromechanical system sensor, and the micro-electromechanical system sensor is electrically connected to the circuit layer;

[0017] Alternatively, the strain sensing element is a piezoresistive sensor, and the piezoresistive sensor is electrically connected to the circuit layer.

[0018] In one embodiment, the connecting member is wavy or W-shaped.

[0019] In order to solve the above technical problems, the present invention also provides an electronic device, which includes a shell and the pressure sensor assembly described in any of the above embodiments, wherein the outer surface of the shell is provided with a key area, and the pressure sensor assembly is arranged on the inner surface of the shell and corresponds to the key area.

[0020] In one of the embodiments, the inner surface of the shell is provided with a receiving groove corresponding to the key area, and the pressure sensor assembly is arranged in the receiving groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of a housing in an electronic device provided by an embodiment of the present invention;

[0022] Figure 2 A schematic diagram of an application of a pressure sensor assembly having four first bending sections provided by an embodiment of the present invention;

[0023] Figure 3 A schematic diagram of an application of a pressure sensor assembly with two first bending sections provided by an embodiment of the present invention;

[0024] Figure 4 A schematic diagram of an application of a pressure sensor assembly with a second support block provided by an embodiment of the present invention;

[0025] Figure 5 A schematic diagram of an application of a pressure sensor assembly having a first support block and a second support block provided in one embodiment of the present invention;

[0026] Figure 6 A schematic diagram of an application of a pressure sensor assembly with a ring-shaped circuit layer provided by an embodiment of the present invention;

[0027] Figure 7 A schematic diagram of an application of a pressure sensor assembly provided by an embodiment of the present invention in which the circuit layer is annular and has a third adhesive layer;

[0028] Figure 8 A schematic diagram of an application of a pressure sensor assembly provided by an embodiment of the present invention, in which the circuit layer is ring-shaped and has a third support block and a fourth support block;

[0029] Fig. 9 A schematic diagram of an application of a pressure sensor assembly with a wavy connector provided by an embodiment of the present invention;

[0030] Fig.10 A schematic diagram of an application of a pressure sensor assembly with a W-shaped connector provided by an embodiment of the present invention.

[0031] 1. Circuit layer; 101. First section; 102. Second section; 2. Connector; 21. First bending section; 211. First connecting surface; 22. Second bending section; 221. Second connecting surface; 3. Strain sensing element; 4. Shell; 41. Key area; 42. Accommodating groove; 5. First support block; 6. First adhesive layer; 7. Second support block; 8. Second adhesive layer; 9. Third support block; 10. Fourth support block; 11. Third adhesive layer. DETAILED DESCRIPTION

[0032] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0034] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "vertical", "horizontal", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the method or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] In the present invention, Figure 1 , Figure 2 as well as Figure 6 As shown, hereinafter, the first side is the direction away from the bottom of the accommodating groove 42, specifically the direction indicated by arrow B; hereinafter, the second side is the direction pointing to the bottom of the accommodating groove 42, specifically the direction indicated by arrow A.

[0036] like Figure 1 , Figure 2 As shown, an embodiment of the present invention provides a pressure sensor assembly, which is applied to a housing 4 of an electronic device. The pressure sensor assembly includes a circuit layer 1, a connector 2 and at least one strain sensing element 3.

[0037] The connecting member 2 includes at least two first bending segments 21 and at least one second bending segment 22. Two adjacent first bending segments 21 are connected by the second bending segment 22. The second bending segment 22 and the first bending segment 21 are protruded in opposite directions, and there is a gap between the two adjacent first bending segments 21. Specifically, refer to Figure 2 , the first bending section 21 protrudes toward the first side of the connector 2, the second bending section 22 protrudes toward the second side of the connector 2, one end of the second bending section 22 is connected to an adjacent first bending section 21, and the other end of the second bending section 22 is connected to another adjacent first bending section 21. The connector 2 is a supporting structure and is used to support the circuit layer 1. The connector 2 is also a pressure-bearing component. Specifically, when the second bending section 22 on the connector 2 is subjected to a pressing force, the second bending section 22 at the corresponding position undergoes elastic deformation, and the bending arc of the second bending section 22 becomes smaller, thereby increasing the distance between the two adjacent first bending sections 21 connected to the two ends of the compressed second bending section 22, and the connector 2 as a whole stretches toward both ends. When the connector 2 is subjected to pressure as a whole, the second bending sections 22 on the connector 2 undergo elastic deformation, thereby increasing the distance between the adjacent first bending sections 21, and the connector 2 as a whole stretches toward both ends. Of course, in some cases, such as when the pressing force is large, the first bending section 21 may be forced to deform, thereby further increasing the stretching range of the connecting member 2 .

[0038] The circuit layer 1 is arranged on the connector 2 and the circuit layer 1 is used to electrically connect the pressure detection device. For example, the circuit layer 1 can be electrically connected to the pressure detection device inside the electronic device. Specifically, the circuit layer 1 can be arranged on at least two first bending sections 21. The circuit layer 1 is affected by the elastic deformation of the connector 2 and is stretched by the connector 2. Specifically, the connector 2 generates elastic deformation after being subjected to force, so that the distance between the two first bending sections 21 corresponding to the pressure-bearing positions increases, thereby driving the circuit layer 1 to generate elastic deformation. Of course, in other embodiments, the circuit layer 1 may also be connected to the second bending section 22, or a portion of the circuit layer 1 may be connected to the first bending section 21 and a portion of the circuit layer 1 may be connected to the second bending section 22.

[0039] The strain sensing element 3 is disposed on the circuit layer 1 and is electrically connected to the circuit layer 1. When subjected to force, the strain sensing element 3 can be deformed and then produce a change in resistance, thereby causing a change in the current or voltage signal in the circuit. The change in the current or voltage signal can be detected by the pressure detection device in the electronic device to determine the pressure value. Figure 2 Furthermore, a strain sensing element 3 is disposed between at least two first bending sections 21. Figure 2In the illustrated embodiment, after the circuit layer 1 is elastically deformed, a tensile force is applied to the strain sensing element 3, so that the resistance of the strain sensing element 3 changes, thereby sensing the user's pressing action. It is understandable that the strain sensing element 3 can be arranged between two adjacent first bending sections 21, or can be arranged across one or more first bending sections 21. Figure 2 The strain sensing element 3 is arranged between the two first bending sections 21. It should be understood that the strain sensing element 3 can be arranged on the side of the circuit layer 1 away from the second bending section 22, or on the side of the circuit layer 1 facing the second bending section 22, or can be arranged flush with the side of the first bending section 21 away from the second bending section 22.

[0040] Combination Figure 2 , the force applied to the connector 2 along the B direction can drive the connector 2 to produce a larger deformation than the force applied to the connector 2 perpendicular to the B direction. Therefore, when the user presses normally and applies a force along the B direction to the connector 2, a relatively large current or voltage signal change can be generated in the circuit; when the user applies a force to the connector 2 along the B direction perpendicular to the B direction, or the direction of the force deviates greatly from the B direction, or the force applied along the B direction is small, the connector 2 may be deformed, but the degree of deformation is small, and the resistance change of the strain sensing component 3 is also small. This situation may be a false touch by the user. Therefore, when the above-mentioned pressure sensor assembly is applied to electronic equipment, the electronic equipment can determine whether the user has touched it by mistake based on the change in the current or voltage signal, that is, the connector 2 with the above-mentioned structure can improve the convenience of use.

[0041] In the specific application of the pressure sensor assembly in this embodiment, the connector 2 is arranged in the shell 4 and attached to the inner surface of the shell 4 corresponding to the key area 41, or abuts the inner surface of the shell 4 corresponding to the key area 41. When the key area 41 of the shell 4 is pressed, the key area 41 produces elastic deformation, thereby transmitting the pressure to the connector 2. The connector 2 bears the pressure and stretches to both ends, thereby driving the circuit layer 1 to produce elastic deformation. After the circuit layer 1 is deformed, it drives the strain sensing component 3 to produce deformation, thereby producing a change in resistance. The connector 2 in the pressure sensor assembly bears the deformation of the shell 4 caused by pressing, and indirectly bears the pressing. The connector 2 realizes the first force transmission, causing the circuit layer 1 to produce elastic deformation, and the circuit layer 1 realizes the second force transmission, thereby causing the strain sensing component 3 to sense the user's pressing action. By using the pressure sensor assembly of this embodiment, the shell 4 transmits the pressure acting on the surface of the shell 4 to the inside of the shell 4 without a physical button. Therefore, it is possible to avoid providing physical buttons and installation grooves for installing the physical buttons on the housing 4 , thereby simplifying the structure of the housing 4 and simplifying the processing technology of the housing 4 .

[0042] In addition, the installation groove of the physical key is usually connected to the inside and outside of the shell 4. The shell 4 does not need to be provided with a key installation groove, which can increase the sealing of the shell 4, prevent dust and moisture from entering the shell 4 through the key installation groove, and increase the dustproof and waterproof effect of the shell 4.

[0043] Another point is that when the electronic device is subjected to twisting, bending or other abnormal pressing forces, the connector 2 will significantly unload the abnormal force, and the force transmitted to the strain sensing component 3 will also be greatly reduced, thereby effectively preventing the occurrence of false touches.

[0044] The strain sensing element 3 generates elastic deformation driven by the circuit layer 1, and generates an induction signal. Specifically, the induction electric signal can be a new electric signal generated from nothing, or a changing electric signal generated by the change of the strength of the electric signal. In order to further shield the false touch signal, the present embodiment can also set a threshold value, such as when the new electric signal is greater than the threshold value, the pressure sensing is triggered. For another example, when the changing electric signal is greater than the threshold value, the pressure sensing is triggered.

[0045] like Figure 2 and Figure 6 As shown, for a specific embodiment of the circuit layer 1, the circuit layer 1 may be a belt-shaped structure or a ring-shaped belt-shaped structure.

[0046] For the circuit layer 1 of the strip structure, such as Figures 2 to 5 As shown, both ends of the circuit layer 1 can be connected to at least two first bending sections 21 on the connector 2, so that the circuit layer 1 is fixed to the connector 2. Specifically, in one embodiment, one end of the circuit layer 1 is connected to one of the first bending sections 21, and the other end of the circuit layer 1 is connected to another first bending section 21. Both ends of the circuit layer 1 are fixedly connected to both ends of the connector 2, so that when the connector 2 stretches toward both ends, it can drive the circuit layer 1 to produce elastic deformation, and drive the circuit layer 1 to stretch in the same direction.

[0047] Regarding the number of strain sensing components 3, when both ends of the circuit layer 1 are fixedly connected to more than two first bending sections 21, a strain sensing component 3 can be provided between two adjacent first bending sections 21, that is, one or more strain sensing components 3 can be provided on the circuit layer 1. In the following embodiments, the circuit layer 1 is connected to each first bending section 21, and a strain sensing component 3 is provided between any two adjacent first bending sections 21.

[0048] Since the circuit layer 1 is connected to each first bending section 21, the connection between the circuit layer 1 and the connector 2 is relatively firm. Since the circuit layer 1 is connected to each first bending section 21, and a strain sensing member 3 is provided between any two adjacent first bending sections 21, the circuit layer 1 forms a deformation section between two adjacent first bending sections 21. When the connector 2 is partially under pressure, the connector 2 locally undergoes elastic deformation, and correspondingly, the deformation sections corresponding to the local pressure-bearing parts of the circuit layer 1 and the connector 2 undergo elastic deformation, so that the strain sensing member 3 connected to the deformation section undergoes resistance changes, thereby sensing the local pressure. When the connector 2 is under pressure as a whole, all deformation sections on the circuit layer 1 undergo elastic deformation, so that each strain sensing member 3 generates an induction signal.

[0049] In one embodiment, if Figure 5 As shown, the first bending section 21 is provided with a first support block 5. The circuit layer 1 is connected to the first bending section 21 through the first support block 5. Further, the first support block 5 is provided between the first bending section 21 and the circuit layer 1, and the connecting member 2 is connected to the circuit layer 1 through the first support block 5, thereby fixing the circuit layer 1. After the first support block 5 is provided, the fixing area between the first bending section 21 and the circuit layer 1 can be increased, so that the connection between the circuit layer 1 and the first bending section 21 is more firmly established.

[0050] In one embodiment, each first bending section 21 is provided with a first support block 5, and the circuit layer 1 is connected to the first support block 5. Thus, the aforementioned deformation section is formed between two adjacent first support blocks 5 on the circuit layer 1.

[0051] In one embodiment, if Figure 2 , Figure 3 As shown, a first adhesive layer 6 is provided on the side of the second bending section 22 facing away from the first bending section 21. The connecting member 2 is fixed in the housing 4 through the first adhesive layer 6. In this way, the connecting member 2 is attached to the position corresponding to the key area 41 in the housing 4, and when the key area 41 is pressed, the elastic deformation generated by the key area 41 acts on the connecting member 2.

[0052] For other implementations of fixing the connecting member 2 , fasteners such as screws may be provided to fix the connecting member 2 to the housing 4 .

[0053] In one embodiment, if Figure 4 As shown, at least one second bending section 22 is provided with a second support block 7, and a second adhesive layer 8 is provided on the side of the second support block 7 facing away from the first bending section 21. After the second support block 7 is provided on the second bending section 22, the fixing area of ​​the second bending section 22 is increased, and after the second adhesive layer 8 is provided, the adhesive area is increased, so that the connector 2 is fixed more firmly.

[0054] In one embodiment, if Figures 6 to 8As shown, the circuit layer 1 is annular, and the circuit layer 1 surrounds the connector 2. Specifically, the circuit layer 1 surrounds from one end of the connector 2 to the other end of the connector 2, and folds back to the starting end of the connector 2 to form a closed shape, so that the circuit layer 1 is connected end to end and surrounds the connector 2. The section of the circuit layer 1 corresponding to the first bending section 21 is the first section 101, and the section of the circuit layer 1 corresponding to the second bending section 22 is the second section 102. The first bending section 21 is in contact with or connected to the first section 101, and the strain sensing element 3 is arranged on the first section 101. The circuit layer 1 is fixed to the connector 2 in a surrounding manner, avoiding the additional arrangement of a structure for fixing the circuit layer 1, and simplifying the structure of the pressure sensor assembly. It can be understood that the wrapping can be a closed wrapping around all sides (upper, lower, left, and right), that is, the first section 101 and the second section 102 are connected, wherein the left and right correspond to the two ends of the connector 2, and the upper and lower correspond to the side of the first bending section 21 away from the second bending section 22 and the side of the second bending section 22 away from the first bending section 21. The wrapping can also be an intermittent wrapping up and down, that is, the first section 101 and the second section 102 are not connected, and the first section 101 and the second section 102 are independent of each other.

[0055] At least one of the first section 101 and the second section 102 is provided with a strain sensing member 3. Specifically, in the embodiment in which the circuit layer 1 is annular, the first section 101 and the second section 102 are respectively provided with a strain sensing member 3. When the user presses the key area 41 of the housing 4, after the connector 2 is elastically deformed, whether it is a local elastic deformation or an overall elastic deformation, the length of the connector 2 will change, thereby causing the circuit layer 1 to be elastically deformed, so as to drive the strain sensing member 3 connected to the circuit layer 1 to produce a resistance change, thereby generating a sensing signal.

[0056] In one embodiment, if Figure 8 As shown, the first bending section 21 is provided with a third support block 9 , and the third support block 9 abuts against or is connected to the first section 101 of the circuit layer 1 .

[0057] In one embodiment, if Figure 8 As shown, the second bending section 22 is provided with a fourth support block 10 , and the fourth support block 10 is in contact with or connected to the second section 102 of the circuit layer 1 .

[0058] In one embodiment, if Figure 7 As shown, the second section 102 is provided with a third adhesive layer 11. The connecting member 2 is fixed to the housing 4 through the third adhesive layer 11. In this way, the connecting member 2 is attached to the position corresponding to the key area 41 in the housing 4, and when the key area 41 is pressed, the elastic deformation generated by the key area 41 acts on the connecting member 2.

[0059] In one embodiment, the circuit layer 1 is a printed circuit board, which can be a flexible printed circuit board or a non-flexible printed circuit board. The strain sensing element 3 is arranged on the printed circuit board, and the printed circuit board is a fixing structure and a tension applying structure of the strain sensing element 3. A conductive circuit (copper foil) is arranged in the printed circuit board, and the printed circuit board can also be used as an electrical signal transmission structure of the strain sensing element 3, reducing or avoiding the circuit layout.

[0060] In one embodiment, the strain sensing element 3 is a micro-electromechanical system sensor, which is disposed on a flexible circuit board and electrically connected to a conductive circuit on the flexible circuit board. Specifically, the micro-electromechanical system sensor is welded on a flexible circuit board, and the flexible circuit board is connected to a force sensing pin in the micro-electromechanical system sensor. The flexible circuit board produces a slight deformation, which generates a pulling force on the force sensing pin in the micro-electromechanical system sensor, thereby triggering the micro-electromechanical system sensor to generate a sensing signal, thereby sensing the user's pressing action.

[0061] In one embodiment, the strain sensing element 3 is a piezoresistive sensor, and the piezoresistive sensor is electrically connected to the conductive circuit on the flexible circuit board. The piezoresistive sensor is a sensor made by using the piezoresistive effect of single crystal silicon material and integrated circuit technology. When the single crystal silicon material is subjected to force, the resistivity changes, and an electrical signal output proportional to the force change can be obtained by measuring the circuit. When the flexible circuit board produces elastic deformation or slight deformation, the flexible circuit board applies tension to the piezoresistive sensor, causing the piezoresistive sensor to produce elastic deformation, thereby causing the cross-section and length of the resistor to change, the resistance value of the piezoresistive sensor to change, and the current or voltage signal of the piezoresistive sensor to change. The pressure on the connector 2 is sensed by the change in the current or voltage signal of the piezoresistive sensor, and then the user's pressing action is sensed.

[0062] In one embodiment, the circuit layer 1 is in a taut state, or in a stretched state, so that it can more sensitively sense the pressing force on the key area 41 of the housing 4. The deformation produced by the key area 41 of the housing 4 is a small deformation, which can be considered as a micro deformation. When the key area 41 of the housing 4 is slightly deformed, the pressure is transmitted to the connector 2, and the connector 2 produces a micro deformation in response to the micro deformation produced by the key area 41. In this way, the circuit layer 1 in a taut or stretched state can sensitively sense the micro deformation of the connector 2.

[0063] In one embodiment, if Fig. 9 , Fig.10As shown, the first bending section 21 and the second bending section 22 protrude in opposite directions, and the first bending section 21 and the second bending section 22 are arranged at intervals, and at least part of the shape of the first bending section 21 and the second bending section 22 can be specifically U-shaped, V-shaped, or Z-shaped. In this way, from the overall point of view, the specific shape of the connecting member 2 can be wavy or W-shaped.

[0064] In one embodiment, if Figure 2 , Figure 5 as well as Figure 8 As shown, the first bending section 21 has a first connection surface 211 on the side facing away from the second bending section 22. When the first bending section 21 is connected to the corresponding circuit layer 1, first support block 5 or third support block 9, the first connection surface 211 increases the contact surface area of ​​the first bending section 21.

[0065] For the strip-shaped circuit layer 1, such as Figure 2 As shown, the second bending section 22 has a second connection surface 221 on the side facing away from the first bending section 21. When the second bending section 22 is provided with the aforementioned first adhesive layer 6, the first adhesive layer 6 is arranged on the second connection surface 221, so that it is convenient to arrange a larger area of ​​the first adhesive layer 6, thereby increasing the firmness of the bonding. When the second bending section 22 is provided with the aforementioned second support block 7, the second support block 7 is arranged on the second connection surface 221, so that it is convenient for the second support block 7 to have a larger connection area with the second bending section 22, thereby increasing the firmness of the connection between the second support block 7 and the second bending section 22.

[0066] For the ring-shaped circuit layer 1, Figure 8 As shown, the second bending section 22 has a second connection surface 221 on one side facing away from the first bending section 21. When the second bending section 22 is connected to the corresponding circuit layer 1 or the fourth support block 10, the second connection surface 221 increases the contact area of ​​the second bending section 22.

[0067] The present invention also provides an electronic device. In one embodiment, the electronic device is a mobile terminal such as a mobile phone, a tablet computer, a PDA (Personal Digital Assistant), a POS (Point of Sales), etc. Examples of mobile terminals include, but are not limited to, satellite or cellular phones. A personal communication system (PCS) terminal that can combine a cellular phone with data processing, fax, and data communication capabilities. A PDA that can include a radio telephone, a pager, Internet / intranet access, a web browser, a notepad, a calendar, and / or a global positioning system (GPS) receiver. And conventional laptop and / or palmtop receivers or other electronic devices including a radio telephone transceiver.

[0068] In other embodiments, the electronic device may also be any electronic device such as a wearable device, an electronic scale, a headset, a household appliance, etc.

[0069] In one embodiment, if Figure 1 As shown, the electronic device includes a housing assembly, which includes a housing 4 and the aforementioned pressure sensor assembly. The outer surface of the housing 4 is provided with a key area 41, and the inner surface of the housing 4 is provided with a receiving groove 42 corresponding to the key area 41. The pressure sensor assembly is arranged in the receiving groove 42. Specifically, Figure 2 In the illustrated embodiment, the second bent section 22 of the connector 2 is closer to the bottom of the accommodating groove 42 than the first bent section 21. In this embodiment, the aforementioned pressure sensor assembly is applied to the housing 4 of the electronic device, specifically, the pressure sensor assembly is applied to the accommodating groove 42 in the housing 4. The inner surface of the housing 4 is provided with an accommodating groove 42 corresponding to the key area 41, which provides space for the fixed installation of the pressure sensor assembly. At the same time, after the accommodating groove 42 is provided, the thickness of the key area 41 of the housing 4 is reduced, and the key area 41 is more likely to produce elastic deformation, so that the pressure can be more sensitively transmitted to the connector 2.

[0070] The depth of the accommodating groove 42 is less than 2 mm, and the pressure sensor assembly matches the depth of the accommodating groove 42. The depth of the accommodating groove 42 can be set to 1.8 mm, 1.6 mm, 1.5 mm, 1.4 mm, 1.2 mm, 1 mm, or even less than 1 mm according to the size of the pressure sensor assembly.

[0071] When the electronic device is in use, the key area 41 is pressed to deform the key area 41, and the pressure is first transmitted to the connector 2 to deform the connector 2. The connector 2 stretches to both ends and transmits the force to the circuit layer 1. The circuit layer 1 produces elastic deformation, which drives the strain sensing component 3 to deform. The strain sensing component 3 generates a sensing signal, and the sensing signal of the strain sensing component 3 is transmitted to the processor of the electronic device. When the pressure sensor component is applied to the key area related to the power function, when the processor of the electronic device receives the sensing signal transmitted by the strain sensing component 3, the processing can control the electronic device to perform actions such as turning on the screen, turning off the screen, turning on and off the power. When the electronic device is in the screen-off state, the processor controls the electronic device to turn on the screen; of course, when the electronic device is in the screen-on state, the processor controls the electronic device to turn off the screen; when the electronic device is in the screen-on state, the processor controls the electronic device to turn off the screen.

[0072] When the pressure sensor assembly is applied to a key area related to volume control, when the processor of the electronic device receives the sensing signal transmitted by the strain sensing element 3, the processing can control the electronic device to perform actions such as turning up or turning down the volume.

[0073] Optionally, the pressure sensor assembly can also be applied to other areas besides the key area to achieve non-key control of the electronic device, for example, control of specific functions such as application control or mode switching of the electronic device.

[0074] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0075] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A pressure sensor assembly, characterized in that: The pressure sensor assembly includes a circuit layer, a connector and at least one strain sensing element; The connecting member comprises at least two first bending segments and at least one second bending segment, two adjacent first bending segments are connected by the second bending segment, the second bending segment and the first bending segment are protruded in opposite directions and there is a gap between two adjacent first bending segments, when the second bending segment is subjected to a pressing force, the distance between the two first bending segments connected to the two ends of the pressed second bending segment increases, and the connecting member as a whole extends to both ends; The circuit layer is arranged on the connecting member and is used for electrically connecting to the pressure detection device; The strain sensing component is arranged on the circuit layer and is electrically connected to the circuit layer, and the strain sensing component can be deformed and produce resistance value changes when subjected to force.

2. The pressure sensor assembly according to claim 1, characterized in that The circuit layer is connected to at least two of the first bending sections.

3. The pressure sensor assembly according to claim 2, characterized in that: The strain sensing component is disposed between at least two of the first bending sections.

4. The pressure sensor assembly according to claim 2, characterized in that: At least one of the first bending sections is provided with a first supporting block, and the circuit layer is connected to the first bending section through the first supporting block.

5. The pressure sensor assembly according to any one of claims 1 to 4, characterized in that: At least one of the second bending sections is provided with a second support block, and the second support block is used to be connected to an external support.

6. The pressure sensor assembly according to claim 1, characterized in that: The circuit layer is arranged around the connecting member, and the circuit layer includes a first section and a second section arranged opposite to the first section; the first bending section abuts or is connected to the first section, and the second bending section abuts or is connected to the second section, and the strain sensing member is arranged in at least one of the first section and the second section.

7. The pressure sensor assembly according to claim 6, characterized in that: The first bending section is provided with a third support block, and the third support block is abutted against or connected to the first section.

8. The pressure sensor assembly according to claim 6, characterized in that: The second bending section is provided with a fourth support block, and the fourth support block is abutted against or connected to the second section.

9. The pressure sensor assembly according to claim 1, characterized in that: The strain sensing element is a micro-electromechanical system sensor, and the micro-electromechanical system sensor is electrically connected to the circuit layer; Alternatively, the strain sensing element is a piezoresistive sensor, and the piezoresistive sensor is electrically connected to the circuit layer.

10. The pressure sensor assembly according to claim 1, characterized in that The connecting piece is in a wave shape or a W shape.

11. An electronic device, characterized in that: The electronic device comprises a housing and the pressure sensor assembly according to any one of claims 1 to 10, wherein a key area is provided on an outer surface of the housing, and the pressure sensor assembly is arranged on an inner surface of the housing and corresponds to the key area.

12. The electronic device according to claim 11, characterized in that: The inner surface of the shell is provided with a receiving groove corresponding to the key area, and the pressure sensor assembly is arranged in the receiving groove.

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