An encapsulation substrate, an LED encapsulation device and a manufacturing method thereof

Abstract

The present invention discloses a packaging substrate, an LED packaging device and a manufacturing method thereof. The packaging substrate includes a first electrode, a second electrode and an insulating partition area. The cross-section of the first electrode is Z-shaped, and a step is formed at the end of the second electrode. A chip die bonding area and a Zener diode die bonding area are formed on the second electrode. The LED packaging device includes an EMC bracket, an LED chip, a Zener diode and a light-transmitting encapsulation body. The EMC bracket includes a reflecting cup and this packaging substrate. The method includes manufacturing electrodes, forming a bracket, dispensing and mounting chips and Zener diodes, wire bonding and encapsulation. The packaging substrate, the LED packaging device and the manufacturing method thereof according to the present invention can improve the strength of the bracket, are not prone to glue leakage, can also shorten the lead length, and improve the brightness after LED packaging.

Description

Technical Field

[0001] The present invention belongs to the technical field of LEDs, and particularly relates to a packaging substrate, an LED packaging device and a manufacturing method thereof. Background Art

[0002] Light-emitting diodes (LEDs) have gradually entered the mainstream lighting market with advantages such as high luminous efficiency, long lifespan, and non-toxic green, and have been increasingly applied in fields such as plant lighting, stage colored lighting, and vehicle lighting. In order to improve the service life and long-term reliability of LED products, currently, most LED brackets are encapsulated with high-temperature-resistant materials such as epoxy resin and silicone resin.

[0003] Existing EMC packaging brackets, such as Figure 1 and Figure 2 shown, include a positive electrode metal sheet 100, a negative electrode metal sheet 200, and an insulating partition area 300 between the positive and negative electrodes. The insulating partition area 300 is parallel to the positive and negative electrode metal sheets. When such an LED bracket is applied to LED chip packaging, the LED chip 400 is fixed on the negative electrode metal sheet in the die-bonding area and then the positive and negative electrode metal sheets are connected by wire bonding. However, this method still has the following deficiencies:

[0004] 1. The strength of the bracket is relatively weak, and the insulating layer between the two electrodes is easily broken;

[0005] 2. As Figure 2 shown, the path from the die-bonding area to the bottom of the bracket is short, a straight line, which is the thickness L of the bracket. The airtightness is poor, and it is easy to leak glue at the bottom of the back pad during the dispensing process.

[0006] Therefore, a new technology is needed to solve the above problems in the prior art. Summary of the Invention

[0007] To solve the above problems in the prior art, the present invention provides a packaging substrate, an LED packaging device and a manufacturing method thereof, which can improve the strength of the bracket and is not easy to leak glue.

[0008] The present invention adopts the following technical solutions:

[0009] A packaging substrate includes a first electrode, a second electrode, and an insulating partition area, and the insulating partition area is disposed between the first electrode and the second electrode;

[0010] The cross-section of the first electrode is Z-shaped, including a first bottom layer portion and a first top layer portion, and the lower end surface of one end of the first top layer portion overlaps with the upper end surface of one end of the first bottom layer portion;

[0011] The second electrode includes a second bottom portion and a second top portion. The second top portion protrudes from the upper end surface of the second bottom portion, and a step is formed between the end of the second top portion and the end of the second bottom portion. The upper end surface of the second top portion has a chip die bonding area. A convex portion protrudes outward from the side of the second top portion close to the first electrode, and the upper end surface of the convex portion is a Zener die bonding area connected to the chip die bonding area.

[0012] As a further improvement of the technical solution of the present invention, one end of the first top portion not connected to the first bottom portion is close to the second electrode.

[0013] As a further improvement of the technical solution of the present invention, the thickness of the first bottom portion is equal to the thickness of the second bottom portion, and the thickness of the first top portion is equal to the thickness of the second top portion.

[0014] The present invention also provides an LED packaging device, which includes an EMC bracket, an LED chip, a Zener diode, and a light-transmitting encapsulation body.

[0015] The EMC bracket includes a reflecting cup and the above-mentioned packaging substrate. The reflecting cup is disposed around the outer edge of the packaging substrate, and the inner surface of the reflecting cup is funnel-shaped.

[0016] The LED chip is fixed in the chip die bonding area; the Zener diode is fixed in the Zener die bonding area.

[0017] The LED chip is respectively connected to the chip die bonding area and the upper end surface of the first top portion through leads.

[0018] The Zener diode is connected to the upper end surface of the first top portion through a lead.

[0019] The light-transmitting encapsulation body is filled in the reflecting cup and covers the LED chip, the Zener diode, and each of the leads.

[0020] As a further improvement of the technical solution of the present invention, the area of the chip die bonding area is greater than or equal to the installation required area of the LED chip.

[0021] As a further improvement of the technical solution of the present invention, the area of the Zener die bonding area is greater than or equal to the installation required area of the Zener diode.

[0022] As a further improvement of the technical solution of the present invention, the upper end surface of the light-transmitting encapsulation body is flush with the upper end surface of the reflecting cup.

[0023] As a further improvement of the technical solution of the present invention, the LED chip is fixed to the chip die bonding area through die bonding glue; the Zener diode is fixed to the Zener die bonding area through die bonding glue.

[0024] As a further improvement of the technical solution of the present invention, the light-transmitting encapsulation body includes one or more combinations of TiO2, SiO2, BaSO4, and ZnO filling particles.

[0025] The present invention also provides a method for manufacturing the above-mentioned LED packaging device, including the following steps:

[0026] Manufacture a metal plate into a first electrode and a second electrode, and the first electrode and the second electrode are separated from each other;

[0027] Inject plastic between the first electrode and the second electrode to form the insulating partition area, and inject plastic around the first electrode and the second electrode to form the reflecting cup;

[0028] Fix the LED chip and the Zener diode on the Zener die bonding area and the Zener die bonding area respectively;

[0029] Connect the LED chip to the Zener die bonding area and the upper end surface of the first electrode respectively with leads; connect the Zener diode to the upper end surface of the first electrode with a lead;

[0030] Fill the light-transmitting encapsulation body in the cup body of the reflecting cup and cure it.

[0031] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0032] 1. In the present invention, both the first electrode and the second electrode are set to two layers, and a step is formed between the layers of each electrode, increasing the contact area with the insulating partition area and effectively improving the strength of the bracket;

[0033] 2. Since a step is formed between the layers of the first electrode and the second electrode of the present invention, the path from the die bonding area to the bottom of the bracket increases by the length of a step, extending the path, having better airtightness and being not easily leaking glue;

[0034] 3. Since the reflecting cup is arranged around the periphery of the encapsulation substrate and the inner surface of the reflecting cup is funnel-shaped, it can improve the brightness of the LED packaging;

[0035] 4. The convex outer convex part can further enhance the strength of the bracket, and can also be used for installing the Zener diode. At the same time, since the convex direction is close to the first electrode, it is beneficial to shorten the length of the lead connecting the Zener diode and the first electrode. Description of the Drawings

[0036] The following further details the technology of the present invention in conjunction with the drawings and specific embodiments:

[0037] Figure 1It is a structural diagram of the side of an existing LED packaging device;

[0038] Figure 2 It is a structural diagram of the front of an existing LED packaging device;

[0039] Figure 3 It is a structural diagram of the side of the LED packaging device of the present invention;

[0040] Figure 4 It is a cross-sectional view of the first electrode of the present invention;

[0041] Figure 5 It is a cross-sectional view of the second electrode of the present invention;

[0042] Figure 6 It is a structural diagram of the front of the LED packaging device of the present invention;

[0043] Figure 7 It is a schematic diagram of the manufacturing method of the LED packaging device of the present invention.

[0044] Reference numerals:

[0045] 1 - Packaging substrate; 11 - First electrode; 111 - First bottom layer; 112 - First top layer; 12 - Second electrode; 121 - Second bottom layer; 122 - Second top layer; 1221 - Chip die bonding area; 123 - Outer convex part; 1231 - Zener die bonding area; 13 - Insulating partition area;

[0046] 2 - LED packaging device; 21 - EMC bracket; 211 - Reflector cup; 22 - LED chip; 23 - Zener diode; 24 - Translucent packaging member; 25 - Lead;

[0047] 100 - Positive metal sheet; 200 - Negative metal sheet; 300 - Insulating partition area; 400 - LED chip. Detailed implementation manners

[0048] The concept, specific structure and technical effects generated by the present invention will be clearly and completely described below in conjunction with the embodiments and the drawings, so as to fully understand the purpose, solution and effects of the present invention. It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The same reference numerals used throughout the drawings indicate the same or similar parts.

[0049] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or indirectly fixed or connected to the other feature. In addition, the descriptions such as up, down, left, and right used in the present invention are only relative to the mutual positional relationship of the components of the present invention in the drawings.

[0050] Embodiment 1:

[0051] Referring to Figures 3 to 6 , an encapsulation substrate 1 includes a first electrode 11, a second electrode 12, and an insulating partition area 13, and the insulating partition area 13 is disposed between the first electrode 11 and the second electrode 12.

[0052] Wherein, as Figure 3 and Figure 4 shown, the cross-section of the first electrode 11 is Z-shaped, including a first bottom layer portion 111 and a first top layer portion 112, and the lower end surface of one end of the first top layer portion 112 overlaps with the upper end surface of one end of the first bottom layer portion 111;

[0053] As Figure 3 , Figure 5 and Figure 6 shown, the second electrode 12 includes a second bottom layer portion 121 and a second top layer portion 122, the second top layer portion 122 protrudes from the upper end surface of the second bottom layer portion 121, and a step is formed between the end of the second top layer portion 122 and the end of the second bottom layer portion 121; a chip die bonding area 1221 is provided on the upper end surface of the second top layer portion 122, and an outer convex portion 123 protrudes outward from the side surface of the second top layer portion 122 close to the first electrode 11, and the upper end surface of the outer convex portion 123 is a Zener die bonding area 1231 connected to the chip die bonding area 1221.

[0054] Based on the above structure, steps are formed between the layers of the first electrode 11 and the second electrode 12, increasing the contact area with the insulating partition area 13, effectively improving the strength of the encapsulation substrate 1, making it not easy to break, and being beneficial to improving the strength after being made into an EMC bracket 21; since steps are formed between the layers of the first electrode 11 and the second electrode 12, the path from the die bonding area to the bottom of the bracket increases by the length d of one step, changing from the original L to L + d, as Figure 3 shown, extending the path, having better airtightness and not being easy to leak glue; the protruding outer convex portion 123 can further enhance the strength of the bracket, and can also be used for subsequent installation of a Zener diode 23. At the same time, since its protruding direction is close to the first electrode 11, it is beneficial to shorten the length of the lead 25 connecting the Zener diode 23 and the first electrode 11.

[0055] Specifically, as Figure 3 andFigure 6 As shown, one end of the first top layer portion 112 that is not connected to the first bottom layer portion 111 is close to the second electrode 12, such that the distance between the upper end surface of the first electrode 11 and the chip die bonding area 1221 and the zener die bonding area 1231 is closer, and the length of the lead 25 can be shortened when connecting the lead 25 subsequently.

[0056] Among them, as Figure 3 shown, the thickness of the first bottom layer portion 111 is equal to the thickness of the second bottom layer portion 121, and the thickness of the first top layer portion 112 is equal to the thickness of the second top layer portion 122, which is convenient for production and manufacturing, and the top layer portion and the bottom layer portion with the same thickness can be obtained by etching.

[0057] Embodiment 2:

[0058] Referring to Figures 3 to 6 , this embodiment also provides an LED packaging device 2, including an EMC bracket 21, an LED chip 22, a zener diode 23, and a light-transmitting encapsulation body.

[0059] Among them, as Figure 3 shown, the EMC bracket 21 includes a reflective cup 211 and the packaging substrate 1 in Embodiment 1, the reflective cup 211 is disposed around the outer edge of the packaging substrate 1, and the inner surface of the reflective cup 211 is in a funnel shape, smaller at the bottom and larger at the top, which is beneficial to enhancing the brightness.

[0060] As Figure 3 and Figure 6 shown, the LED chip 22 is bonded and fixed to the chip die bonding area 1221 by die bonding glue; the zener diode 23 is also bonded and fixed to the zener die bonding area 1231 by die bonding glue.

[0061] As Figure 3 and Figure 6 shown, the LED chip 22 is respectively connected to the chip die bonding area 1221 and the upper end surface of the first top layer portion 112 through the lead 25 to shorten the length of the lead 25.

[0062] As Figure 6 shown, the zener diode 23 is connected to the upper end surface of the first top layer portion through the lead 25 to shorten the length of the lead 25.

[0063] As Figure 3 shown, the light-transmitting encapsulation body is filled in the reflective cup 211 and covers the LED chip 22, the zener diode 23, and each of the leads 25.

[0064] Among them, each of the leads 25 is usually a gold wire.

[0065] Based on the above structure, the reflecting cup 211 is arranged around the LED chip 22. The inner surface of the reflecting cup 211 is funnel-shaped, which plays a role in concentrating and reflecting light, and can improve the brightness after LED packaging, with the brightness increased by 3 - 5%. The settings of the Zener die bonding area 1231 and the chip die bonding area 1221 facilitate the installation of the LED chip 22 and the Zener diode 23, and also effectively shorten the length of the lead 25 used, which is beneficial to cost reduction.

[0066] Among them, as Figure 6 shown, in order to more conveniently connect the LED chip 22 and the second electrode 12 through the lead 25, the area of the chip die bonding area 1221 is greater than or equal to the area required for the installation of the LED chip 22. Similarly, the area of the Zener die bonding area 1231 is greater than or equal to the area required for the installation of the Zener diode 23.

[0067] The upper end surface of the light-transmitting encapsulation body is flush with the upper end surface of the reflecting cup 211.

[0068] As a further improvement of the technical solution of the present invention, the LED chip 22 is fixed to the chip die bonding area 1221 through die bonding glue; the Zener diode 23 is fixed to the Zener die bonding area 1231 through die bonding glue.

[0069] Specifically, the light-transmitting encapsulation body includes one or more combinations of TiO2, SiO2, BaSO4, and ZnO filler particles.

[0070] Example 3:

[0071] Referring to Figures 3 to 7 , this embodiment provides a manufacturing method of the LED packaging device 2 in Example 2, including the following steps:

[0072] S1. Etch a metal plate (usually a copper plate) to etch out the steps of the first electrode 11 and the second electrode 12, that is, the reserved areas on the metal plate that are not etched are the first top layer part 112 and the second top layer part 122, and the thickness of the etched area becomes thinner to form the first bottom layer part 111 and the second bottom layer part 121. As shown in a of Figure 7 , the shaded filled part represents the etched area, and the blank part represents the reserved area, and finally the first electrode 11 and the second electrode 12 are made. The first electrode 11 and the second electrode 12 are separated from each other. In actual production, one first electrode 11 and one second electrode 12 are set as a group of electrodes, and multiple groups of electrodes can be etched out at one time. Adjacent two groups of electrodes are connected together by a connecting edge, which is convenient for mass production, and then they can be cut and separated later.

[0073] S2. Inject plastic between the first electrode 11 and the second electrode 12 to form the insulating partition area 13, thereby forming the encapsulation substrate 1. Inject plastic around the first electrode 11 and the second electrode 12 to form the reflecting cup 211. That is, the above-mentioned etched metal plate is cured and formed into the EMC bracket 21, as shown in Figure 7 shown in b of. Similarly, in actual production, multiple groups of electrodes are also injected with plastic simultaneously to form multiple EMC brackets 21 and reflecting cups 211.

[0074] S3. Fix by dispensing glue. Fix the LED chip 22 and the Zener diode 23 to the Zener die bonding area 1231 and the Zener die bonding area 1231 respectively through die bonding glue. Similarly, in actual production, glue is dispensed inside multiple EMC brackets 21.

[0075] S4. Wire bonding. Connect the LED chip 22 to the Zener die bonding area 1231 and the upper end surface of the first electrode 11 respectively with the lead 25; connect the Zener diode 23 to the upper end surface of the first electrode 11 with the lead 25, as shown in Figure 7 shown in c of;

[0076] S5. Fill the cup body of the reflecting cup with the light-transmitting encapsulant and cure it, and the production is completed. In actual mass production, after multiple LED packaging devices 2 are produced, each LED packaging device 2 is separated by cutting.

[0077] For other contents of the encapsulation substrate, LED packaging device and its manufacturing method of the present invention, refer to the prior art and will not be elaborated here.

[0078] The above are only the preferred embodiments of the present invention, and do not impose any form of limitation on the present invention. Therefore, any modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. An encapsulation substrate, characterized in that: It includes a first electrode, a second electrode and an insulating partition area, and the insulating partition area is arranged between the first electrode and the second electrode; The cross-section of the first electrode is Z-shaped and includes a first bottom layer part and a first top layer part. The lower end surface of one end of the first top layer part is overlapped with the upper end surface of one end of the first bottom layer part; The second electrode includes a second bottom layer part and a second top layer part. The second top layer part protrudes from the upper end surface of the second bottom layer part. A step is formed between the end of the second top layer part and the end of the second bottom layer part; The upper end surface of the second top layer part has a chip die bonding area. A convex part protrudes outward from the side surface of the second top layer part close to the first electrode, and the upper end surface of the convex part is a Zener die bonding area connected to the chip die bonding area; One end of the first top layer part that is not connected to the first bottom layer part is close to the second electrode; The thickness of the first bottom layer part is equal to the thickness of the second bottom layer part, and the thickness of the first top layer part is equal to the thickness of the second top layer part.

2. An LED packaging device, characterized in that: It includes an EMC bracket, an LED chip, a Zener diode and a light-transmitting encapsulation body; The EMC bracket includes a reflective cup and the encapsulation substrate as described in claim 1. The reflective cup is arranged around the outer edge of the encapsulation substrate, and the inner surface of the reflective cup is funnel-shaped; The LED chip is fixed in the chip die bonding area; the Zener diode is fixed in the Zener die bonding area; The LED chip is connected to the chip die bonding area and the upper end surface of the first top layer part respectively through leads; The Zener diode is connected to the upper end surface of the first top layer part through a lead; The light-transmitting encapsulation body is filled in the reflective cup and covers the LED chip, the Zener diode and each of the leads.

3. The LED packaging device according to claim 2, wherein: The area of the chip die bonding area is greater than or equal to the area required for the installation of the LED chip.

4. The LED packaging device according to claim 2, wherein: The area of the Zener die bonding area is greater than or equal to the area required for the installation of the Zener diode.

5. The LED packaging device according to claim 2, wherein: The upper end surface of the light-transmitting encapsulation body is flush with the upper end surface of the reflective cup.

6. The LED packaging device according to any one of claims 2-5, characterized in that: The LED chip is fixed to the chip die bonding area through die bonding glue; the Zener diode is fixed to the Zener die bonding area through die bonding glue.

7. The LED packaging device according to any one of claims 2-5, characterized in that: The light-transmitting encapsulation body includes one or a combination of TiO2, SiO2, BaSO4 and ZnO filling particles.

8. The manufacturing method of the LED packaging device according to any one of claims 2-7, characterized in that, It includes the following steps: Manufacture the first electrode and the second electrode from a metal plate, and the first electrode and the second electrode are separated from each other; Inject plastic between the first electrode and the second electrode to form the insulating partition area, and inject plastic around the first electrode and the second electrode to form the reflective cup; Fix the LED chip and the Zener diode to the Zener die bonding area and the Zener die bonding area respectively; Connect the LED chip to the Zener die bonding area and the upper end surface of the first electrode respectively through leads; connect the Zener diode to the upper end surface of the first electrode through a lead; Fill the cup body of the reflective cup with the light-transmitting encapsulation body and cure it.

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