Transmission system for DVI signals over long distances using optical fiber

Abstract

The present invention discloses a transmission system for transmitting DVI signals over long distances via optical fiber, comprising a first DVI interface, a first ESD module, a first photoelectric signal conversion chip, an optical fiber line, a second photoelectric signal conversion chip, a second ESD module and a second DVI interface, wherein the first DVI interface is connected to the first photoelectric signal conversion chip via the first ESD module, the first photoelectric signal conversion chip is connected to the second photoelectric signal conversion chip via the optical fiber line, and the second photoelectric signal conversion chip is connected to the second DVI interface via the second ESD module. The present invention realizes long-distance transmission of DVI signals and can support 200-meter transmission.

Description

Technical Field

[0001] The invention belongs to the technical field of signal transmission structures, and in particular relates to a transmission system for transmitting DVI signals over long distances using optical fibers. Background Art

[0002] At present, the rapid development of high-definition digital multimedia interface technology has brought about diversified demands for multimedia video transmission. More and more application scenarios, such as large medical imaging systems, high-definition computer monitors, high-definition projectors and other equipment, need to be connected to the remote display interface over a long distance through the DVI interface. DVI (Digital Visual Interface) is based on TMDS (Transition Minimized Differential Signaling) technology to transmit digital signals. TMDS uses advanced coding algorithms to convert 8-bit data (each primary color signal in R, G, and B) into 10-bit data (including line field synchronization information, clock information, data DE, error correction, etc.) through minimum conversion. After DC balancing, it uses differential signals to transmit data. Compared with LVDS and TTL, it has better electromagnetic compatibility.

[0003] Currently, DVI interface cables are suitable for transmitting high-speed video and display EDID information within a short distance. However, as the cable length increases, the signal is susceptible to environmental interference, data loss, signal attenuation, image distortion and other problems when transmitted over long distances. Long distance generally refers to more than 100 meters.

[0004] Therefore, the prior art needs to be improved. Summary of the invention

[0005] The main purpose of the present invention is to provide a transmission system for transmitting DVI signals over long distances via optical fiber, so as to solve the technical problems mentioned in the background technology and realize long-distance transmission via optical fiber.

[0006] The invention discloses a transmission system for transmitting DVI signals over long distances using optical fibers, comprising a first DVI interface, a first ESD module, a first photoelectric signal conversion chip, an optical fiber line, a second photoelectric signal conversion chip, a second ESD module and a second DVI interface, wherein the first DVI interface is connected to the first photoelectric signal conversion chip via the first ESD module, the first photoelectric signal conversion chip is connected to the second photoelectric signal conversion chip via the optical fiber line, and the second photoelectric signal conversion chip is connected to the second DVI interface via the second ESD module.

[0007] Preferably, the first ESD module includes a first ESD chip and a second ESD chip, the tenth pin of the first ESD chip is connected to the second pin of the first photoelectric signal conversion chip through a third capacitor, the ninth pin of the first ESD chip is connected to the third pin of the first photoelectric signal conversion chip through a fourth capacitor, the seventh pin of the first ESD chip is connected to the fourth pin of the first photoelectric signal conversion chip through a fifth capacitor, the sixth pin of the first ESD chip is connected to the fifth pin of the first photoelectric signal conversion chip through a sixth capacitor, the tenth pin of the second ESD chip is connected to the sixth pin of the first photoelectric signal conversion chip through a seventh capacitor, the ninth pin of the second ESD chip is connected to the seventh pin of the first photoelectric signal conversion chip through an eighth capacitor, the seventh pin of the second ESD chip is connected to the eighth pin of the first photoelectric signal conversion chip through a ninth capacitor, and the sixth pin of the second ESD chip is connected to the ninth pin of the first photoelectric signal conversion chip through a tenth capacitor.

[0008] Preferably, the second ESD module includes a third ESD chip and a fourth ESD chip, the tenth pin on the third ESD chip is connected to the second pin of the second photoelectric signal conversion chip through a thirty-ninth capacitor, the ninth pin on the third ESD chip is connected to the third pin of the second photoelectric signal conversion chip through a forty-first capacitor, the seventh pin on the third ESD chip is connected to the sixth pin of the second photoelectric signal conversion chip through a forty-first capacitor, the sixth pin on the third ESD chip is connected to the seventh pin of the second photoelectric signal conversion chip through a forty-second capacitor, the tenth pin of the fourth ESD chip is connected to the eighth pin of the second photoelectric signal conversion chip through a forty-third capacitor, the ninth pin of the fourth ESD chip is connected to the ninth pin of the second photoelectric signal conversion chip through a forty-fourth capacitor, the seventh pin of the fourth ESD chip is connected to the tenth pin of the second photoelectric signal conversion chip through a forty-fifth capacitor, and the sixth pin of the fourth ESD chip is connected to the eleventh pin of the second photoelectric signal conversion chip through a forty-sixth capacitor.

[0009] Preferably, it also includes a first I2C module connected to the first photoelectric signal conversion chip.

[0010] Preferably, it also includes a first pigtail, a first MPO adapter, a second MPO adapter and a second pigtail, the first DVI interface is connected to one end of the first MPO adapter through the first pigtail, the second DVI interface is connected to one end of the second MPO adapter through the second pigtail, and the other end of the first MPO adapter is connected to the other end of the second MPO adapter through an optical fiber.

[0011] Preferably, it also includes a first DC circuit connected to the first photoelectric signal conversion chip.

[0012] Preferably, it also includes a second DC circuit connected to the second photoelectric signal conversion chip.

[0013] Preferably, it also includes a second I2C module connected to the second electrical signal conversion chip.

[0014] The optical fiber long-distance transmission system of the present invention realizes the long-distance transmission of TMDS signals, EDID and HPD signals of DVI signals, and the transmission process has no attenuation, no interference, no loss, low power consumption, high reliability, and the maximum transmission distance is 200 meters. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 The principle block diagram of the transmission system for transmitting DVI signals over long distances using optical fibers;

[0017] Figure 2 A schematic diagram of the physical structure of a transmission system for transmitting DVI signals over long distances using optical fibers;

[0018] Figure 3 A schematic diagram of the circuit connection of a first photoelectric signal conversion chip, a first ESD module, and a first I2C module in a transmission system for transmitting DVI signals over long distances using optical fibers;

[0019] Figure 4 The present invention is a circuit connection diagram of a second photoelectric signal conversion chip, a second ESD module, and a second I2C module in a transmission system for transmitting DVI signals over long distances using optical fibers.

[0020] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0022] It should be noted that related terms such as "first", "second", etc. can be used to describe various components, but these terms do not limit the components. These terms are only used to distinguish one component from another component. For example, without departing from the scope of the present invention, a first component can be referred to as a second component, and the second component can also be referred to as a first component similarly. The term "and / or" refers to any one or more combinations of related items and description items.

[0023] like Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, Figure 1 The principle block diagram of the transmission system for transmitting DVI signals over long distances using optical fibers; Figure 2 A schematic diagram of the physical structure of a transmission system for transmitting DVI signals over long distances using optical fibers; Figure 3 A schematic diagram of the circuit connection of a first photoelectric signal conversion chip, a first ESD module, and a first I2C module in a transmission system for transmitting DVI signals over long distances using optical fibers; Figure 4 The present invention is a circuit connection diagram of a second photoelectric signal conversion chip, a second ESD module, and a second I2C module in a transmission system for transmitting DVI signals over long distances via optical fiber. The present invention provides a transmission system for transmitting DVI signals over long distances via optical fiber, comprising a first DVI interface 10, a first ESD module, a first photoelectric signal conversion chip U2, an optical fiber line 30, a second photoelectric signal conversion chip U30, a second ESD module, and a second DVI interface 20. The first DVI interface is connected to the first photoelectric signal conversion chip via the first ESD module, the first photoelectric signal conversion chip is connected to the second photoelectric signal conversion chip via the optical fiber line 30, and the second photoelectric signal conversion chip is connected to the second DVI interface via the second ESD module. The first DVI interface is used to receive DVI signals; the first photoelectric signal conversion chip U2 is used to convert DVI signals into optical signals, and the optical signals are transmitted to the second photoelectric signal conversion chip U30 through the optical fiber line 30 to be converted into DVI signal output; the optical fiber long-distance transmission system of the DVI signal of the present invention realizes the long-distance transmission of TMDS signals, EDID and HPD signals of DVI signals, and the transmission process has no attenuation, interference, loss, low power consumption, high reliability, and the maximum transmission distance is 200 meters.

[0024] like Figure 3As shown, preferably, the first ESD module includes a first ESD chip U3 and a second ESD chip U15, the tenth pin OUTPUT1 of the first ESD chip is connected to the second pin Data Channel2+ of the first photoelectric signal conversion chip through the third capacitor C3, the ninth pin OUTPUT2 of the first ESD chip is connected to the third pin Data Channel2- of the first photoelectric signal conversion chip through the fourth capacitor C4, the seventh pin OUTPUT3 of the first ESD chip is connected to the fourth pin Data Channel1+ of the first photoelectric signal conversion chip through the fifth capacitor C5, the sixth pin OUTPUT4 of the first ESD chip is connected to the fifth pin Data Channel1- of the first photoelectric signal conversion chip through the sixth capacitor C6, the tenth pin OUTPUT1 of the second ESD chip is connected to the sixth pin Data Channel0+ of the first photoelectric signal conversion chip through the seventh capacitor C7, and the ninth pin OUTPUT2 of the second ESD chip is connected to the seventh pin Data Channel0 of the first photoelectric signal conversion chip through the eighth capacitor C8. Channel0- is connected, the seventh pin OUTPUT3 of the second ESD chip is connected to the eighth pin Clock+ of the first photoelectric signal conversion chip through the ninth capacitor C9, and the sixth pin OUTPUT4 of the second ESD chip is connected to the ninth pin Clock- of the first photoelectric signal conversion chip through the tenth capacitor C10. This preferred embodiment defines the specific circuit for the first ESD module; transmits the DVI signal received from the first DVI interface to the first photoelectric signal conversion chip, and plays a role in protecting the data. The model of the first ESD chip U3 and the model of the second ESD chip U15 are both RClamp0524P; the model of the first photoelectric signal conversion chip is TX06.

[0025] like Figure 4As shown, preferably, the second ESD module includes a third ESD chip U9 and a fourth ESD chip U16, the tenth pin OUTPUT1 on the third ESD chip is connected to the second pin Data Channel2+ of the second photoelectric signal conversion chip U30 through the thirty-ninth capacitor C39, the ninth pin OUTPUT2 on the third ESD chip is connected to the third pin Data Channel2- of the second photoelectric signal conversion chip through the forty-first capacitor C40, the seventh pin OUTPUT3 on the third ESD chip is connected to the sixth pin Data Channel1+ of the second photoelectric signal conversion chip through the forty-first capacitor C41, the sixth pin OUTPUT4 on the third ESD chip is connected to the seventh pin Data Channel1- of the second photoelectric signal conversion chip through the forty-second capacitor C42, the tenth pin OUTPUT1 of the fourth ESD chip is connected to the eighth pin Data Channel0+ of the second photoelectric signal conversion chip through the forty-third capacitor, and the ninth pin OUTPUT2 of the fourth ESD chip is connected to the ninth pin Data Channel0 of the second photoelectric signal conversion chip through the forty-fourth capacitor. Channel0- is connected, the seventh pin OUTPUT3 of the fourth ESD chip is connected to the tenth pin Clock+ of the second photoelectric signal conversion chip through the forty-fifth capacitor C45, and the sixth pin OUTPUT4 of the fourth ESD chip is connected to the eleventh pin Clock- of the second photoelectric signal conversion chip through the forty-sixth capacitor C46. This preferred embodiment defines the specific circuit for the first ESD module; the second photoelectric signal conversion chip converts the optical signal transmitted through the optical fiber line into a DVI signal and transmits it to the third ESD chip and the fourth ESD chip to output to the second DVI interface; the third ESD chip and the fourth ESD chip protect the data; the third ESD chip U9 model and the fourth ESD chip U16 model are both RClamp0524P; the second photoelectric signal conversion chip model is RX06.

[0026] like Figure 3 As shown, preferably, it also includes a first I2C module connected to the first photoelectric signal conversion chip; the first I2C module includes a first I2C chip U1, model P82B96; the first pin SCL2 of the first I2C chip U1 is connected to the tenth pin SCL of the first photoelectric signal conversion chip; the second pin SDA2 of the first I2C chip U1 is connected to the eleventh pin SDA of the first photoelectric signal conversion chip; realize: I2C data transparent transmission function, support DDC communication function.

[0027] like Figure 4As shown, preferably, it also includes a second I2C module connected to the second photoelectric signal conversion chip, the second I2C module includes a second I2C chip U7; the first pin SCL2 of the second I2C chip U7 is connected to the fourth pin SCL of the second photoelectric signal conversion chip; the second pin SDA2 of the second I2C chip U7 is connected to the fifth pin SDA of the second photoelectric signal conversion chip; the I2C data transparent transmission function is realized and the DDC communication function is supported.

[0028] like Figure 2 As shown, preferably, it also includes a first pigtail 51, a first MPO adapter 52, a second MPO adapter 53 and a second pigtail 54. The first DVI interface is connected to one end of the first MPO adapter through the first pigtail, the second DVI interface is connected to one end of the second MPO adapter through the second pigtail, and the other end of the first MPO adapter is connected to the other end of the second MPO adapter through the optical fiber line 30. This preferred embodiment specifically defines the optical fiber line, the second photoelectric signal conversion chip and the first photoelectric signal conversion chip in terms of physical structure, so that the DVI signal is first converted into an optical signal and then converted into a DVI signal.

[0029] like Figure 3 As shown, preferably, it also includes a first DC circuit connected to the first photoelectric signal conversion chip, the first DC circuit includes a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, a ninth resistor R9 and a tenth resistor R10; the first DC circuit is connected to the power supply end to provide a stable voltage; as shown Figure 4 As shown, preferably, it also includes a second DC circuit connected to the second photoelectric signal conversion chip, the second DC circuit includes a second inductor L2, a third inductor L3, a fourth inductor L4, a fifth inductor L5, a sixth inductor L6, a seventh inductor L7, an eighth inductor L8 and a ninth inductor L9, and the second DC circuit is connected to the power supply end to provide a stable voltage to the second photoelectric signal conversion chip.

[0030] Among them, Figure 1 , Figure 3 , Figure 4As shown; the number of optical fiber lines is six, the twelfth pin avss1 of the first photoelectric signal conversion chip is connected to the thirteenth pin VCSEL2 of the first photoelectric signal conversion chip through the sixteenth vertical cavity surface emitting laser D16; the twelfth pin PD of the second photoelectric signal conversion chip <2> Through the twenty-second photodiode D22 and the thirteenth pin FIT of the second photoelectric signal conversion chip <2> connection; the above preferred embodiment is implemented, the sixteenth vertical cavity surface emitting laser D16 transmits the optical signal to the twenty-second photodiode D22 through an optical fiber line; similarly, the fourteenth pin avss2 of the first photoelectric signal conversion chip is connected to the fifteenth pin VCSEL1 of the first photoelectric signal conversion chip through the seventeenth vertical cavity surface emitting laser D17; the fourteenth pin PD of the second photoelectric signal conversion chip <1> Through the twenty-third photodiode D23 and the fifteenth pin FIT of the second photoelectric signal conversion chip <1> The sixteenth pin avss3 of the first photoelectric signal conversion chip is connected to the seventeenth pin VCSEL0 of the first photoelectric signal conversion chip through the eighteenth vertical cavity surface emitting laser D18; the sixteenth pin PD of the second photoelectric signal conversion chip <0> Through the twenty-fourth photodiode D24 and the seventeenth pin FIT of the second photoelectric signal conversion chip <0> The eighteenth pin avss4 of the first photoelectric signal conversion chip is connected to the nineteenth pin VCSEL of the first photoelectric signal conversion chip through the nineteenth vertical cavity surface emitting laser D19 <clk>The eighteenth pin PD_clk of the second photoelectric signal conversion chip is connected to the nineteenth pin FIT_clk of the second photoelectric signal conversion chip through the twenty-fifth photodiode D25; the twentieth pin avss5 of the first photoelectric signal conversion chip is connected to the twenty-first pin VCSEL of the first photoelectric signal conversion chip through the twentieth vertical cavity surface emitting laser D20 <scl sda>The 20th pin PD_SCL / SDA of the second photoelectric signal conversion chip is connected to the 21st pin av33 of the second photoelectric signal conversion chip through the 26th photodiode D26; the 22nd pin avss6 of the first photoelectric signal conversion chip is connected to the 23rd pin PD of the first photoelectric signal conversion chip through the 21st photodiode D21 <scl sda hpd>The 22nd pin VCSEL_SCL / SDA / HPD of the second photoelectric signal conversion chip is connected to the 23rd pin avss of the second photoelectric signal conversion chip through the 27th vertical cavity surface emitting laser D27. The above preferred embodiment realizes the optical signal transmission between the first photoelectric signal conversion chip and the second photoelectric signal conversion chip through 6 optical fiber lines.

[0031] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.< / scl> < / scl> < / clk>

Claims

1. A transmission system for transmitting DVI signals over long distances via optical fiber, characterized in that: It includes a first DVI interface, a first ESD module, a first photoelectric signal conversion chip, an optical fiber line, a second photoelectric signal conversion chip, a second ESD module and a second DVI interface. The first DVI interface is connected to the first photoelectric signal conversion chip through the first ESD module, the first photoelectric signal conversion chip is connected to the second photoelectric signal conversion chip through the optical fiber line, and the second photoelectric signal conversion chip is connected to the second DVI interface through the second ESD module. The first ESD module includes a first ESD chip and a second ESD chip, the tenth pin of the first ESD chip is connected to the second pin of the first photoelectric signal conversion chip through a third capacitor, the ninth pin of the first ESD chip is connected to the third pin of the first photoelectric signal conversion chip through a fourth capacitor, the seventh pin of the first ESD chip is connected to the fourth pin of the first photoelectric signal conversion chip through a fifth capacitor, the sixth pin of the first ESD chip is connected to the fifth pin of the first photoelectric signal conversion chip through a sixth capacitor, the tenth pin of the second ESD chip is connected to the sixth pin of the first photoelectric signal conversion chip through a seventh capacitor, the ninth pin of the second ESD chip is connected to the seventh pin of the first photoelectric signal conversion chip through an eighth capacitor, the seventh pin of the second ESD chip is connected to the eighth pin of the first photoelectric signal conversion chip through a ninth capacitor, and the sixth pin of the second ESD chip is connected to the ninth pin of the first photoelectric signal conversion chip through a tenth capacitor. The second ESD module includes a third ESD chip and a fourth ESD chip. The tenth pin on the third ESD chip is connected to the second pin of the second photoelectric signal conversion chip through a thirty-ninth capacitor, the ninth pin on the third ESD chip is connected to the third pin of the second photoelectric signal conversion chip through a forty-first capacitor, the seventh pin on the third ESD chip is connected to the sixth pin of the second photoelectric signal conversion chip through a forty-first capacitor, the sixth pin on the third ESD chip is connected to the seventh pin of the second photoelectric signal conversion chip through a forty-second capacitor, the tenth pin of the fourth ESD chip is connected to the eighth pin of the second photoelectric signal conversion chip through a forty-third capacitor, the ninth pin of the fourth ESD chip is connected to the ninth pin of the second photoelectric signal conversion chip through a forty-fourth capacitor, the seventh pin of the fourth ESD chip is connected to the tenth pin of the second photoelectric signal conversion chip through a forty-fifth capacitor, and the sixth pin of the fourth ESD chip is connected to the eleventh pin of the second photoelectric signal conversion chip through a forty-sixth capacitor.

2. The optical fiber long-distance transmission system of DVI signals as claimed in claim 1, characterized in that: It also includes a first I2C module connected to the first photoelectric signal conversion chip.

3. The optical fiber long-distance transmission system of DVI signals as claimed in claim 1, characterized in that: The first DVI interface is connected to the first MPO adapter through the first pigtail, and the second MPO adapter is connected to the first MPO adapter through the first pigtail. The second DVI interface is connected to one end of the second MPO adapter through the second pigtail, and the other end of the first MPO adapter is connected to the other end of the second MPO adapter through the optical fiber line.

4. The optical fiber long-distance transmission system of DVI signals as claimed in claim 1, characterized in that: It also includes a first DC circuit connected to the first photoelectric signal conversion chip.

5. The optical fiber long-distance transmission system of DVI signals as claimed in claim 1, characterized in that: It also includes a second DC circuit connected to the second photoelectric signal conversion chip.

6. The optical fiber long-distance transmission system of DVI signals as claimed in claim 1, characterized in that: It also includes a second I2C module connected to the second electrical signal conversion chip.

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