A stress relief method and apparatus for a flexible electronic patch

Abstract

The application relates to a stress relieving method and device of a flexible electronic patch. The method comprises the following steps: acquiring characteristic parameters of a flexible electronic patch and a curved surface substrate, establishing a three-dimensional model of the flexible electronic patch and the curved surface substrate according to the characteristic parameters; simulating stress distribution characteristics of a flexible substrate of the flexible electronic patch according to the three-dimensional model; acquiring first stress position points of the stress distribution characteristics according to the stress distribution characteristics, wherein stress values of the first stress position points are greater than a preset first stress threshold value; determining a first target stress position of the flexible substrate according to the first stress position points; and controlling laser scanning of the flexible substrate according to the first target stress position, so as to selectively relieve the bending stress inside the flexible electronic patch, prevent the flexible electronic patch from being easily separated from the surface of the curved surface substrate, and facilitate long-term conformal coating of the flexible electronic patch and the curved surface substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of flexible electronics, in particular to a stress elimination method and device for a flexible electronic patch. BACKGROUND

[0002] With the development of flexible electronics, the application of flexible electronic patches is becoming more and more widespread. Various flexible electronic patches integrated with multifunctional electronic devices are emerging, which are attached to the surfaces of curved substrates of different materials, curvatures and shapes to realize various smart interaction application experiences and bring many conveniences to life. However, when the flexible electronic patch is attached to the curved substrate, internal stress of the flexible electronic patch is generated, which can cause the flexible electronic patch to fall off the surface of the curved substrate after long-term use.

[0003] In the related art, the flexible electronic patch is usually placed in a thermal aging furnace for heat treatment to eliminate the internal stress of the flexible electronic patch. However, for the flexible electronic patch attached to a surface of different curvature, the internal stress changes due to deformation, and the thermal aging treatment cannot eliminate the internal stress in a targeted manner.

[0004] In view of the problem that the flexible electronic patch is prone to falling off the surface of the curved substrate in the related art, no effective solution has been proposed so far. SUMMARY

[0005] In view of the problem that the flexible electronic patch is prone to falling off the surface of the curved substrate in the related art, the present application provides a stress elimination method and device for a flexible electronic patch to at least solve the above problem.

[0006] According to one aspect of the present application, a stress elimination method for a flexible electronic patch is provided, comprising the following steps:

[0007] Obtaining characteristic parameters of the flexible electronic patch and the curved substrate, and establishing a three-dimensional model of the flexible electronic patch attached to the curved substrate according to the characteristic parameters;

[0008] Simulating stress distribution characteristics of a flexible substrate of the flexible electronic patch according to the three-dimensional model;

[0009] According to the stress distribution characteristics, obtaining a first stress position point where a stress value of the stress distribution characteristics is greater than a preset first stress threshold, and determining a first target stress position of the flexible substrate according to the first stress position point;

[0010] Controlling laser scanning of the flexible substrate according to the first target stress position.

[0011] In one embodiment, the three-dimensional model of the flexible electronic patch attached to the curved substrate according to the characteristic parameters comprises:

[0012] attribute setting is performed on the characteristic parameters of each component in the flexible electronic patch, and a three-dimensional model of the flexible electronic patch and the curved substrate is established.

[0013] In one embodiment, the three-dimensional model of the flexible electronic patch and the curved substrate is established according to the characteristic parameters, and includes:

[0014] A 1:1 scale three-dimensional model of the flexible electronic patch and the curved substrate is established according to the characteristic parameters.

[0015] In one embodiment, the stress distribution characteristics of the flexible substrate of the flexible electronic patch are simulated according to the three-dimensional model, and include:

[0016] The three-dimensional model is divided into a flexible electronic patch model corresponding to the flexible electronic patch and a curved substrate model corresponding to the curved substrate.

[0017] The flexible electronic patch model is meshed to establish a finite element analysis model.

[0018] The stress distribution characteristics of the flexible substrate of the flexible electronic patch are simulated according to the finite element analysis model.

[0019] In one embodiment, the laser scanning of the flexible substrate is controlled according to the first target stress position, and includes:

[0020] A second stress position point is obtained, where the stress value of the stress distribution characteristics is greater than a preset second stress threshold and less than the first stress threshold, a second target stress position of the flexible substrate is determined according to the second stress position point, and the second stress threshold is less than the first stress threshold.

[0021] The laser scanning parameters are set to second laser scanning parameters, the laser scanning of the flexible substrate is controlled according to the second target stress position, the laser scanning parameters are set to first laser scanning parameters, the laser scanning of the flexible substrate is controlled according to the first target stress position, and the heat effect generated by the laser scanning controlled according to the second laser scanning parameters is less than the heat effect generated by the laser scanning controlled according to the first laser scanning parameters.

[0022] In one embodiment, the laser scanning parameters are set to second laser scanning parameters, the laser scanning of the flexible substrate is controlled according to the second target stress position, and the laser scanning parameters are set to first laser scanning parameters, the laser scanning of the flexible substrate is controlled according to the first target stress position, and the heat effect generated by the laser scanning controlled according to the second laser scanning parameters is less than the heat effect generated by the laser scanning controlled according to the first laser scanning parameters.

[0023] The first laser scanning parameter is determined according to the first stress threshold value, and the second laser scanning parameter is determined according to the second stress threshold value; the first laser scanning parameter and the second laser scanning parameter each include at least one of a laser wavelength, a laser average power, a defocusing amount, a laser scanning number, and a laser scanning parameter.

[0024] In one of the embodiments, the shape of the curved substrate includes one of a conical surface, a cylindrical surface, a conical frustum, a cylindrical frustum, a helical surface, a hyperbolic paraboloid, a torus, or an irregular curved surface.

[0025] According to another aspect of the present application, there is also provided a stress relieving device for a flexible electronic patch, the device comprising:

[0026] a modeling module configured to establish a three-dimensional model of the flexible electronic patch attached to the curved substrate according to characteristic parameters of the flexible electronic patch and the curved substrate;

[0027] a data simulation module configured to simulate stress distribution characteristics of a flexible substrate of the flexible electronic patch according to the three-dimensional model;

[0028] a data processing module configured to obtain a first stress position point at which a stress value of the stress distribution characteristics is greater than a preset first stress threshold value according to the stress distribution characteristics, and determine a first target stress position of the flexible substrate according to the first stress position point;

[0029] a laser scanning module configured to control laser scanning of the flexible substrate according to the first target stress position.

[0030] In one of the embodiments, the device further comprises:

[0031] a measurement module connected to the modeling module and configured to obtain the characteristic parameters of the flexible electronic patch and the curved substrate.

[0032] In one of the embodiments, the data simulation module comprises:

[0033] a model segmentation unit configured to segment the three-dimensional model into a flexible electronic patch model and a curved substrate model, the flexible electronic patch model corresponding to the flexible electronic patch, and the curved substrate model corresponding to the curved substrate;

[0034] a finite element modeling unit configured to perform meshing on the flexible electronic patch model to establish a finite element analysis model;

[0035] a data simulation unit configured to simulate stress distribution characteristics of the flexible electronic patch according to the finite element analysis model.

[0036] The stress relieving method and device of the flexible electronic patch, by establishing a three-dimensional model of the flexible electronic patch and the curved surface substrate, simulates the stress distribution characteristics of the flexible electronic patch, obtains the position with greater stress inside the flexible electronic patch according to the stress distribution characteristics, and utilizes the characteristics of high energy concentration of laser energy to quickly radiate and scan the position with greater stress, so as to repeatedly and quickly heat and cool, selectively relieve the bending stress inside the flexible electronic patch, and prevent the flexible electronic patch from falling off from the surface of the curved surface substrate, which is conducive to the long-term conformal coating of the flexible electronic patch and the curved surface substrate. The method utilizes the laser processing characteristics, is fast and convenient to operate, and can realize efficient stress relief without damaging the flexible electronic patch. BRIEF DESCRIPTION OF DRAWINGS

[0037] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:

[0038] Figure 1 is a flowchart of the stress relieving method of the flexible electronic patch according to an embodiment of the application Figure One ;

[0039] Figure 2 is a flowchart of the stress relieving method of the flexible electronic patch according to an embodiment of the application Figure Two ;

[0040] Figure 3 is a flowchart of the stress relieving method of the flexible electronic patch according to an embodiment of the application Figure Three ;

[0041] Figure 4 is a structural block of the stress relieving device of the flexible electronic patch according to an embodiment of the application Figure One ;

[0042] Figure 5 is a structural block of the stress relieving device of the flexible electronic patch according to an embodiment of the application Figure Two ;

[0043] Figure 6 is a structural block of the stress relieving device of the flexible electronic patch according to an embodiment of the application Figure Three ; DETAILED DESCRIPTION

[0044] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application is further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0045] It should be noted that the terms "first", "second", "third" involved in the embodiments of the present application are only to distinguish similar objects, and do not represent a specific order of the objects. The "first", "second", "third" can be interchanged in a specific order or sequence as allowed. It can be understood that the objects distinguished by "first", "second", "third" can be interchanged under appropriate circumstances, so that the embodiments of the application described herein can be implemented in an order other than those illustrated or described herein.

[0046] The stress relief method of the flexible electronic patch provided by the present application can be applied to the manufacture of various integrated multifunctional electronic devices, such as integrated multifunctional electronic devices in biomedical, precision industry and robots.

[0047] In one embodiment, Figure 1 is a flow of the stress relief method of the flexible electronic patch according to the embodiments of the present application Figure One As shown in Figure 1 , a stress relief method of a flexible electronic patch is provided, comprising the following steps:

[0048] Step S110, obtaining characteristic parameters of the flexible electronic patch and the curved substrate, and establishing a three-dimensional model of the flexible electronic patch and the curved substrate according to the characteristic parameters;

[0049] It should be further explained that the material of the flexible electronic patch includes at least one of the following: polyimide (Polyimide, PI for short), polyethylene terephthalate (Polyethylene Terephthalate, PET for short), polydimethylsiloxane (Polydimethylsiloxane, PDMS for short), polyvinylidene fluoride (Polyvinylidene Fluoride, PVDF for short), biaxially-oriented polyester film (Biaxially-oriented Polyester Film, BOPET for short) and liquid crystal polymer film (Liquid Crystal Polymer, LCP for short).

[0050] It should be further explained that the characteristic parameters of the flexible electronic patch and the curved substrate include the material, modulus and size parameters of the flexible electronic patch and the curved substrate. During the creation of the three-dimensional model, the proportion of the flexible electronic patch and the curved substrate will affect the stress distribution characteristics of the flexible electronic patch, and the stress distribution characteristics generated by different proportions will also be different.

[0051] Step S120, simulating the stress distribution characteristics of the flexible substrate of the flexible electronic patch according to the three-dimensional model;

[0052] The stress distribution characteristics of the flexible substrate of the flexible electronic patch include stress values of each position point in the flexible substrate of the flexible electronic patch, and it should be noted that the stress distribution characteristics are in a three-dimensional model.

[0053] In step S130, according to the stress distribution characteristics, a first stress position point with a stress value greater than a preset first stress threshold value is obtained from the stress distribution characteristics, and a first target stress position of the flexible substrate is determined according to the first stress position point.

[0054] It should be further noted that the first stress threshold value is set in advance, and the first stress threshold value can be selected as one-half of the maximum stress value obtained from the stress distribution characteristics, or other stress values can be selected as the first stress threshold value according to actual application scenarios; the first stress position point with a stress value greater than the preset first stress threshold value is obtained from the stress distribution characteristics, and the first stress position point is located in the three-dimensional model; the first target stress position corresponding to the first stress position point in the flexible substrate is determined according to the first stress position point, and the first target stress position is located on the flexible substrate.

[0055] In step S140, the flexible substrate is controlled to be scanned by laser according to the first target stress position.

[0056] It should be further noted that different first laser scanning parameters are set in advance for different regions of the first target stress position of the flexible substrate, and the flexible substrate is controlled to be scanned by laser according to the first target stress position, and the first laser scanning parameters include at least one of the following: laser wavelength, laser average power, defocusing amount, laser scanning times and laser scanning parameters; the position needing defocusing can be determined by observing with a focusing microscope or assisted by a position measuring instrument, and the first target stress position of the flexible substrate is controlled to be moved to the laser exit point in real time under the control of a computer to control the first target stress position of the flexible substrate to be scanned by laser.

[0057] In actual application, the above step S140 needs to be performed multiple times to ensure the desired laser scanning effect.

[0058] Through the above stress elimination method of the flexible electronic patch, the three-dimensional model of the flexible electronic patch and the curved substrate is established, the stress distribution characteristics of the flexible substrate of the flexible electronic patch are simulated, the positions with greater stress inside the flexible electronic patch are obtained according to the stress distribution characteristics, and the positions with greater stress are quickly radiated and scanned by using the characteristic of high concentration of laser energy, so as to repeatedly and quickly heat and cool, thereby selectively eliminating the bending stress inside the flexible electronic patch, preventing it from falling off from the surface of the curved substrate, and facilitating long-term conformal coating of the flexible electronic patch and the curved substrate.

[0059] In one embodiment, a stress elimination method of a flexible electronic patch is provided, and step S110 includes step S210:

[0060] Step S210, attribute setting is performed on the characteristic parameters of each component in the flexible electronic patch, and a three-dimensional model of the flexible electronic patch and the curved substrate is established.

[0061] The characteristic parameters of each component in the flexible electronic patch include material, modulus, and size parameters of each component in the flexible electronic patch. The flexible electronic patch can include only a flexible substrate, or can include a flexible substrate and a wire, and can include a flexible substrate, a chip, and a wire. The wire includes at least one of a laid wire and a drawn wire, and the chip and the laid wire are arranged on the surface of the flexible substrate, and the drawn wire is drawn on the flexible substrate.

[0062] It should be further explained that the stress distribution characteristics of the flexible substrate of the flexible electronic patch include the stress values of each position point of the flexible electronic patch, wherein the flexible electronic patch can include only a flexible substrate, or can include a flexible substrate and a wire, and can include a flexible substrate, a chip, and a wire. The wire includes at least one of a laid wire and a drawn wire, and the chip and the laid wire are arranged on the surface of the flexible substrate, and the drawn wire is drawn on the flexible substrate; the stress distribution characteristics are in the three-dimensional model.

[0063] It should be further explained that the stress distribution characteristics of the laid wire can be simulated according to the three-dimensional model, and the stress of the laid wire can be eliminated.

[0064] Through the above stress elimination method of the flexible electronic patch, the attribute setting is performed on the characteristic parameters of each component in the flexible electronic patch, the three-dimensional model of the flexible electronic patch and the curved substrate is established, the stress distribution characteristics of the laid wire can be simulated according to the three-dimensional model, the stress of the laid wire can be eliminated, and the laid wire is not easy to fall off from the flexible substrate of the flexible electronic patch, which is beneficial to prolong the service life of the flexible electronic patch.

[0065] In one embodiment, a stress elimination method of a flexible electronic patch is provided, and step S110 includes step S310:

[0066] Step S310, the characteristic parameters of the flexible electronic patch and the curved substrate are obtained, and a 1:1 scale three-dimensional model of the flexible electronic patch and the curved substrate is established according to the characteristic parameters.

[0067] The three-dimensional modeling software such as Catia, Solidworks, Pro / E, and UG can be used to establish the three-dimensional model.

[0068] By the stress relieving method of the flexible electronic patch, a 1:1 scale three-dimensional model of the flexible electronic patch and the curved substrate is established, and stress distribution characteristics of the flexible electronic patch can be simulated more accurately.

[0069] In one embodiment, Figure 2 is a flow of the stress relieving method of the flexible electronic patch according to an embodiment of the application Figure Two As shown in Figure 2 , a stress relieving method of a flexible electronic patch is provided, and step S120 includes:

[0070] Step S420, the three-dimensional model is divided into a flexible electronic patch model and a curved substrate model, the flexible electronic patch model corresponds to the flexible electronic patch, and the curved substrate model corresponds to the curved substrate;

[0071] Step S421, the flexible electronic patch model is meshed to establish a finite element analysis model;

[0072] Step S422, according to the finite element analysis model, stress distribution characteristics of the flexible substrate of the flexible electronic patch are simulated.

[0073] Specifically, according to the characteristic parameters of the flexible electronic patch and the curved substrate, a 1:1 scale three-dimensional model of the flexible electronic patch and the curved substrate is established by using a three-dimensional modeling software, and the three-dimensional model is imported into a finite element analysis software to simulate stress distribution characteristics of the flexible electronic patch when the flexible electronic patch is attached to the curved substrate by a finite element analysis method. The three-dimensional modeling software can include one of Catia, Solidworks, Pro / E, and UG three-dimensional modeling software. The finite element analysis software can include one of Ansys, Abaqus, and Magma. The stress distribution characteristics of the flexible substrate of the flexible electronic patch include stress values of each position point in the flexible substrate of the flexible electronic patch.

[0074] By the stress relieving method of the flexible electronic patch, the three-dimensional model is divided into a flexible electronic patch model and a curved substrate model, the flexible electronic patch model is meshed to establish a finite element analysis model, and stress distribution characteristics of the flexible electronic patch can be simulated more accurately, which improves simulation efficiency and simulation effect and lays a good foundation for further relieving internal stress of the flexible electronic patch.

[0075] In this embodiment, Figure 3 is a flow of the stress relieving method of the flexible electronic patch according to an embodiment of the application Figure Three As shown in Figure 3 , a stress relieving method of a flexible electronic patch is provided, and step S140 includes:

[0076] In step S530, a second stress position point is obtained, where the stress value of the stress distribution feature is greater than a preset second stress threshold value and less than a first stress threshold value, and a second target stress position of the flexible substrate is determined according to the second stress position point, and the second stress threshold value is less than the first stress threshold value.

[0077] It should be further explained that the second stress threshold value is preset, and the second stress threshold value can be selected as a stress value of one fifth of the maximum stress value obtained according to the stress distribution feature, or other stress values can be selected as the second stress threshold value according to actual application scenarios. The second stress position point is located in the three-dimensional model according to the stress value of the stress distribution feature greater than the preset second stress threshold value and less than the first stress threshold value. The second target stress position corresponding to the second stress position in the flexible substrate is determined according to the second stress position point, and the second target stress position is located on the flexible substrate.

[0078] In step S540, the laser scanning parameter is set as a second laser scanning parameter, and the laser scanning of the flexible substrate is controlled according to the second target stress position. The laser scanning parameter is set as a first laser scanning parameter, and the laser scanning of the flexible substrate is controlled according to the first target stress position. The heat effect generated by the laser scanning according to the second laser scanning parameter is less than the heat effect generated by the laser scanning according to the first laser scanning parameter.

[0079] Specifically, different second laser scanning parameters are preset for different regions of the second target stress position of the flexible substrate. The laser scanning of the flexible substrate is controlled according to the second target stress position, and the second laser scanning parameter includes at least one of the following: laser wavelength, laser average power, defocusing amount, laser scanning times, and laser scanning parameter. The position needing defocusing can be determined by observing with a focusing microscope or assisted by a position measuring instrument, and the second target stress position of the flexible substrate is controlled to move to the laser exit point in real time under the control of a computer to control the laser scanning of the second target stress position of the flexible substrate.

[0080] By the above stress elimination method of the flexible electronic patch, different lasers are used for laser scanning to eliminate the internal stress of the flexible electronic patch for the first stress position and the second stress position. After the stress of the first stress position with greater stress is eliminated, the stress of the second stress position with smaller stress is eliminated. The cost is saved, and the surface of the flexible electronic patch is not damaged by excessive laser energy. The problem that the flexible electronic patch is easy to fall off from the curved substrate surface is solved. The internal stress of the flexible electronic patch is eliminated without damaging the surface of the flexible electronic patch. Finally, the flexible electronic patch can be conformally attached to the curved substrate surface for a long time and is not easy to fall off from the curved substrate surface.

[0081] In this embodiment, Figure 3is a flow of a stress elimination method of a flexible electronic patch according to an embodiment of the present application Figure Three As shown in Figure 3 A stress elimination method of a flexible electronic patch is provided, and the method further comprises a step S640 between the step S530 and the step S540:

[0082] In the step S640, a first laser scanning parameter is determined according to a first stress threshold, and a second laser scanning parameter is determined according to a second stress threshold; the first laser scanning parameter and the second laser scanning parameter each comprise at least one of a laser wavelength, a laser average power, a defocusing amount, a laser scanning times, and a laser scanning parameter;

[0083] It should be noted that the laser wavelength is 400nm-1100nm, when the laser wavelength is less than 400nm, the heat effect generated by the absorption of the flexible electronic patch is small, and the stress cannot be effectively eliminated; the laser average power is 10mW-10W, when the laser power is less than 10mW, the laser energy is too low, the heat effect accumulates too slowly, and the efficiency is affected; when the laser power is greater than 10W, the laser energy is easy to damage the surface of the flexible electronic patch; the laser radiates the flexible electronic patch in a defocusing manner, and the defocusing amount is 0.5mm-2mm, when the defocusing amount is less than 0.5mm, the radiation spot is small, the energy density is too large, and the flexible electronic patch is easy to be damaged; when the defocusing amount is greater than 2mm, the radiation spot is large, the energy density is too small, and effective heat effect cannot be generated.

[0084] Through the above stress elimination method of the flexible electronic patch, the internal stress of the flexible electronic patch is eliminated by using different laser scanning parameters of the laser for laser scanning at the first stress position and the second stress position, the stress at the second stress position with smaller stress is eliminated after the stress at the first stress position with larger stress is eliminated, the cost is saved, the surface of the flexible electronic patch is prevented from being damaged by excessive laser energy, the laser scanning parameters are set according to actual needs, the stress at different stress positions is eliminated by controlling the laser scanning, and a cost-saving, flexible and efficient stress elimination method of the flexible electronic patch is provided.

[0085] In actual application, in the above embodiment, the shape of the curved surface substrate comprises one of a conical surface, a cylindrical surface, a conical surface, a cylindrical surface, a spiral surface, a hyperbolic parabolic surface, a torus, or an irregular curved surface.

[0086] The present application also provides the following three specific embodiments for further detailed description of the stress elimination method of the flexible electronic patch, including embodiment 1, embodiment 2 and embodiment 3:

[0087] In embodiment 1, the above stress elimination method of the flexible electronic patch comprises the following steps:

[0088] Step S710, providing a PI film and a cylindrical substrate, the PI film being provided with a serpentine conductive circuit, and the PI film being attached to the cylindrical substrate;

[0089] Step S720, setting attributes of materials, modulus and size parameters of the PI film, the cylindrical substrate and the serpentine conductive circuit, using Catia to establish a 1:1 proportional three-dimensional model of the PI film attached to the cylindrical substrate according to characteristic parameters of the PI film and the cylindrical substrate, using Abaqus finite element analysis method to simulate stress distribution characteristics on the PI film and the serpentine conductive circuit, obtaining a first stress position point with a stress value greater than a first stress threshold according to the stress distribution characteristics, and determining a first target stress position of the PI film and the serpentine conductive circuit according to the first stress position point.

[0090] Step S730, scanning the first target stress position with laser having a wavelength of 532 nm, determining the first target stress position through a focusing microscope, moving the first target stress position to a laser exit point under computer control, controlling laser output power to be 10 mW, defocusing amount to be 0.5 mm, and scanning speed to be 10 mm / s, and scanning the PI film and the serpentine conductive circuit with laser to repeatedly and rapidly heat and cool the first target stress position, so as to eliminate internal stress of the PI film and the serpentine conductive circuit without damaging the surface of the PI film, to ensure long-term conformal attachment of the PI film to the cylindrical substrate, and to prevent the serpentine conductive circuit from falling off from the surface of the PI film.

[0091] In the embodiment 2, the stress elimination method of the flexible electronic patch includes the following steps:

[0092] Step S810, providing a PDMS film and a spherical substrate, and attaching the PDMS film to the spherical substrate;

[0093] Step S820, obtaining characteristic parameters of the PDMS film and the spherical substrate, using Solidworks three-dimensional modeling software to establish a 1:1 proportional three-dimensional model of the PDMS film attached to the spherical substrate according to the characteristic parameters, using Ansys finite element analysis method to simulate stress distribution characteristics on the PDMS film, obtaining a second stress position point with a stress value greater than a second stress threshold according to the stress distribution characteristics, and determining a second target stress position of the PDMS film according to the second stress position point.

[0094] Step S830, scanning the second target stress position with laser whose wavelength is 680nm, determining the second target stress position through a focusing microscope, moving the second target stress position to the laser exit point under the control of a computer, controlling the laser output power to be 100mW, the defocus amount to be 1mm, and the scanning speed to be 100mm / s; scanning the PDMS film with the laser, repeatedly and rapidly heating and cooling the second target stress position, realizing the elimination of the internal stress of the PDMS film without damaging the surface of the PDMS film, and ensuring the long-term conformal coating of the PDMS film and the PI film on the spherical substrate.

[0095] In the embodiment 3, the stress elimination method of the flexible electronic patch described above comprises the following steps:

[0096] Step S910, providing a PVDF film and a spherical substrate, and coating the PVDF film on the spherical substrate;

[0097] Step S920, according to the characteristic parameters of the PVDF film and the spherical substrate, using UG to establish a 1:1 proportional three-dimensional model of the PVDF film coated on the spherical substrate, simulating the stress distribution characteristics on the PVDF film by using the Ansys finite element analysis method, according to the stress distribution characteristics, obtaining a first stress position point whose stress value of the stress distribution characteristics is greater than a first stress threshold value, determining a first target stress position of the PVDF film according to the first stress position point; obtaining a second stress position point whose stress value of the stress distribution characteristics is greater than a preset second stress threshold value and less than the first stress threshold value, determining a second target stress position of the PVDF film according to the second stress position point, the second stress threshold value being less than the first stress threshold value;

[0098] Step S930, scanning the first target stress position and the second target stress position with laser whose wavelength is 850nm, determining the first target stress position and the second target stress position through a focusing microscope, moving the first target stress position and the second target stress position to the laser exit point under the control of a computer; setting the laser scanning parameters as first laser scanning parameters and second laser scanning parameters respectively, according to the second laser scanning parameters, the heat effect generated by the laser scanning is less than the heat effect generated by the laser scanning according to the first laser scanning parameters. Scanning the PVDF film with the laser, repeatedly and rapidly heating and cooling the first target stress position and the second target stress position, realizing the elimination of the internal stress of the PVDF film without damaging the surface of the PVDF film, and ensuring the long-term conformal coating of the PVDF film and the spherical substrate.

[0099] It should be understood that, although Figures 1 to 3The steps in the flowchart of FIG. 1 are displayed in sequence according to the arrows, but the steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, the steps are not strictly limited in sequence, and the steps can be executed in other sequences. Moreover, Figures 1 to 3 At least a part of the steps in the flowchart of FIG. 1 can include a plurality of sub-steps or a plurality of stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution sequence of the sub-steps or stages is not necessarily sequential, but can be executed alternately or alternately with at least a part of other steps or sub-steps or stages of other steps.

[0100] Corresponding to the stress relief method of the flexible electronic patch described above, in the present embodiment, a stress relief device for a flexible electronic patch is also provided, which is used to implement the above-mentioned embodiments and preferred embodiments, and the description of which has been described above. As used below, the term "module" can be a combination of software and / or hardware that implements a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, hardware, or a combination of software and hardware, implementation is also possible and is contemplated.

[0101] According to another aspect of the present application, a stress relief device for a flexible electronic patch is also provided, Figure 4 is a structural block of the stress relief device for a flexible electronic patch according to the embodiment of the present application Figure One As shown in the above-mentioned stress relief method of the flexible electronic patch, Figure 4 The device comprises:

[0102] The modeling module 101 is configured to establish a three-dimensional model of the flexible electronic patch and the curved substrate according to the characteristic parameters of the flexible electronic patch and the curved substrate.

[0103] The data simulation module 102 is configured to simulate the stress distribution characteristics of the flexible substrate of the flexible electronic patch according to the three-dimensional model.

[0104] The data processing module 103 is configured to obtain a first stress position point at which the stress value of the stress distribution characteristics is greater than a preset first stress threshold value according to the stress distribution characteristics, and determine a first target stress position of the flexible substrate according to the first stress position point.

[0105] The laser scanning module 106 is configured to control the laser to scan the flexible substrate according to the first target stress position.

[0106] In the stress relieving device for the flexible electronic patch, the modeling module 101 is connected with the data simulation module 102, the data simulation module 102 accurately simulates the stress distribution characteristics of the flexible electronic patch according to the three-dimensional model generated by the modeling module 101, the data processing module 103 is connected with the data simulation module 102 and the laser scanning module 106 respectively, the data simulation module 102 transmits the data of the stress distribution characteristics to the data processing module 103, the data processing module 103 generates the first target stress position according to the stress distribution characteristics, and the laser scanning module 106 accurately positions and scans the first target stress position by laser, and selectively scans the flexible substrate by laser, so that the problem that the flexible electronic patch is easy to fall off from the surface of the curved substrate is solved, the internal stress of the flexible electronic patch is relieved without damaging the surface of the flexible electronic patch, and finally the flexible electronic patch can be long-term conformal attached to the surface of the curved substrate and is not easy to fall off from the surface of the curved substrate.

[0107] In one embodiment, Figure 5 is a structure block of the stress relieving device for the flexible electronic patch according to the embodiment of the present application Figure Two As shown in Figure 5 , the device further comprises:

[0108] The measurement module 110 is connected with the modeling module 101, and is used to obtain the characteristic parameters of the flexible electronic patch and the curved substrate.

[0109] In one embodiment, Figure 6 is a structure block of the stress relieving device for the flexible electronic patch according to the embodiment of the present application Figure Three As shown in Figure 6 , the data simulation module 102 comprises the following units:

[0110] The model segmentation unit 1221 is used to segment the three-dimensional model into a flexible electronic patch model and a curved substrate model, the flexible electronic patch model corresponds to the flexible electronic patch, and the curved substrate model corresponds to the curved substrate;

[0111] The finite element modeling unit 1222 is used to divide the flexible electronic patch model into a grid and establish a finite element analysis model;

[0112] The data simulation unit 1223 is used to simulate the stress distribution characteristics of the flexible electronic patch according to the finite element analysis model.

[0113] In the stress relieving device of the flexible electronic patch, the data simulation module 102 comprises a model segmentation unit 1221, a finite element modeling unit 1222 and a data simulation unit 1223 connected in series, according to the method of segmenting a three-dimensional model into a flexible electronic patch model and a curved surface substrate model and performing meshing on the flexible electronic patch model to establish a finite element analysis model, the stress distribution characteristics of the flexible electronic patch are simulated more accurately, the simulation efficiency and effect are improved, and a good foundation is laid for further relieving the internal stress of the flexible electronic patch.

[0114] The technical features of the above embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above embodiments are described, but as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present disclosure.

[0115] The above embodiments only express several implementation manners of the present application, and the description is specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, some modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A stress relief method for a flexible electronic patch, characterized by, The method comprises: obtaining characteristic parameters of a flexible electronic patch and a curved substrate, and establishing a three-dimensional model of the flexible electronic patch and the curved substrate according to the characteristic parameters; simulating stress distribution characteristics of a flexible substrate of the flexible electronic patch according to the three-dimensional model; obtaining a first stress position point of the stress distribution characteristics, wherein a stress value of the first stress position point is greater than a preset first stress threshold, and determining a first target stress position of the flexible substrate according to the first stress position point, wherein the first stress position point is located in the three-dimensional model, and the first target stress position is located on the flexible substrate; obtaining a second stress position point of the stress distribution characteristics, wherein a stress value of the second stress position point is greater than a preset second stress threshold and less than the first stress threshold, and determining a second target stress position of the flexible substrate according to the second stress position point, wherein the second stress threshold is less than the first stress threshold; setting a laser scanning parameter as a second laser scanning parameter, and controlling laser scanning of the flexible substrate according to the second target stress position; setting the laser scanning parameter as a first laser scanning parameter, and controlling laser scanning of the flexible substrate according to the first target stress position, wherein a heat effect generated by laser scanning according to the second laser scanning parameter is less than a heat effect generated by laser scanning according to the first laser scanning parameter.

2. The stress relief method of a flexible electronic patch according to claim 1, wherein, The three-dimensional model of the flexible electronic patch and the curved substrate according to the characteristic parameters comprises: performing attribute setting on the characteristic parameters of each component in the flexible electronic patch, and establishing the three-dimensional model of the flexible electronic patch and the curved substrate.

3. The stress relief method of a flexible electronic patch according to claim 1, wherein, The three-dimensional model of the flexible electronic patch and the curved substrate according to the characteristic parameters comprises: establishing a 1:1 scale three-dimensional model of the flexible electronic patch and the curved substrate according to the characteristic parameters.

4. The stress relief method of a flexible electronic patch according to claim 1, wherein, The stress distribution characteristics of the flexible substrate of the flexible electronic patch simulated according to the three-dimensional model comprises: dividing the three-dimensional model into a flexible electronic patch model and a curved substrate model, wherein the flexible electronic patch model corresponds to the flexible electronic patch, and the curved substrate model corresponds to the curved substrate; performing mesh division on the flexible electronic patch model to establish a finite element analysis model; simulating the stress distribution characteristics of the flexible substrate of the flexible electronic patch according to the finite element analysis model.

5. The stress relief method of a flexible electronic patch according to claim 1, wherein, The setting of the laser scanning parameter as the second laser scanning parameter and the controlling of laser scanning of the flexible substrate according to the second target stress position; and the setting of the laser scanning parameter as the first laser scanning parameter and the controlling of laser scanning of the flexible substrate according to the first target stress position, further comprise: determining the first laser scanning parameter according to the first stress threshold; and determining the second laser scanning parameter according to the second stress threshold; wherein the first laser scanning parameter and the second laser scanning parameter each comprise at least one of the following: laser wavelength, laser average power, defocusing amount, laser scanning times, and laser scanning parameter.

6. The stress relief method of a flexible electronic patch according to claim 1, wherein, The shape of the curved surface base includes one of the following: a cone, a cylinder, a cone-shaped surface, a cylindrical surface, a spiral surface, a hyperbolic paraboloid, a torus or an irregular curved surface.

7. A stress relief device for a flexible electronic patch, characterized by The device comprises: A modeling module, configured to establish a three-dimensional model of the flexible electronic patch and the curved substrate according to characteristic parameters of the flexible electronic patch and the curved substrate; a data simulation module, configured to simulate stress distribution characteristics of the flexible substrate of the flexible electronic patch according to the three-dimensional model; a data processing module, configured to obtain, based on the stress distribution feature, a first stress location point at which a stress value of the stress distribution feature is greater than a preset first stress threshold, and determine, based on the first stress location point, a first target stress location of the flexible substrate, wherein the first stress location point is located in the three-dimensional model and the first target stress location is located on the flexible substrate; The laser scanning module is configured to obtain a second stress position point at which a stress value of the stress distribution characteristic is greater than a preset second stress threshold and less than the first stress threshold, determine a second target stress position of the flexible substrate based on the second stress position point, and the second stress threshold is less than the first stress threshold; set a laser scanning parameter to a second laser scanning parameter, and control the laser scanning of the flexible substrate based on the second target stress position; set a laser scanning parameter to the first laser scanning parameter, and control the laser scanning of the flexible substrate based on the first target stress position, wherein a thermal effect generated by controlling the laser scanning based on the second laser scanning parameter is less than a thermal effect generated by controlling the laser scanning based on the first laser scanning parameter.

8. The apparatus of claim 7, wherein, The device further comprises: A measurement module is connected to the modeling module and is used to obtain characteristic parameters of the flexible electronic patch and the curved substrate.

9. The apparatus of claim 7, wherein, The data simulation module includes: a model segmentation unit, configured to segment the three-dimensional model into a flexible electronic patch model and a curved substrate model, wherein the flexible electronic patch model corresponds to the flexible electronic patch, and the curved substrate model corresponds to the curved substrate; A finite element modeling unit, used for meshing the flexible electronic patch model and establishing a finite element analysis model; A data simulation unit is used to simulate the stress distribution characteristics of the flexible electronic patch according to the finite element analysis model.

Images